JPH07226475A - Semiconductor device, its manufacturing method and lead frame - Google Patents

Abstract

PURPOSE:To enable the package process to be performed without fail in a simple manufacturing steps while cutting down the product cost in relation to the semiconductor device wherein the connecting part connecting to an outer terminal is formed on a package bottom surface and manufacturing method as well as lead frame. CONSTITUTION:In the semiconductor device formed of a resin package 13 where a semiconductor chip 11, lead part 12 connecting to this semiconductor chip 11 are internally installed as well as a connecting part 20 comprising a part of the lead part 12 and the exposed surface 20a respectively exposed to the outer part and outer surface 13a of the resin package 13 to be flush, a protrusion 21 protruding outward from the outer surface 13a is integrally formed with the connecting part 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, a method of manufacturing the same, and a lead frame, and more particularly, to a semiconductor device having a connection portion connected to an external terminal on the bottom surface of a package, a method of manufacturing the same, and a lead frame.

With the recent trend toward miniaturization, higher speed, and higher functionality of electronic equipment, there is a similar demand for semiconductor devices used therein.

In addition to the demands on the semiconductor device itself, it is also desired to improve the mounting efficiency when mounting the semiconductor device on a substrate and to simplify the mounting structure.

Therefore, the surface mount type semiconductor device in which the leads are connected on the surface of the mount board is currently in the mainstream.
Further, there is a demand for a semiconductor device having improved packaging efficiency and a simplified packaging structure.

[0005]

2. Description of the Related Art As electronic devices have become more sophisticated in recent years, the density of semiconductor devices provided in the electronic devices has been increased, and the number of leads provided in the semiconductor devices has tended to increase accordingly. A QFP (Quad Flat Package) type package having a structure in which leads are extended outward from four sides of the package so as to form a gull wing shape is known as a package structure for surface-mounting a semiconductor device having a large number of leads. There is.

However, in the QFP type package structure in which the leads are extended outward from the four side surfaces of the package, an increase in the number of leads inevitably reduces the thickness of the leads, lowers the mechanical strength, and adjoins them. The lead pitch may be narrowed and lead interference may occur.

BGA as a surface mount structure that solves this problem
A (Ball Grid Array) type package structure is known. This BGA type package structure is shown in FIG. In the semiconductor device 1 adopting the BGA type package structure shown in the same drawing, the semiconductor chip 3 is bonded to the upper part of the substrate 2 by the die attaching agent 4, and the electrode portion and the semiconductor chip arranged on the upper surface of the substrate 2 An electrical connection is made between the wire 3 and the wire 3. A resin package 6 (shown in satin) is formed by disposing a mold resin on the substrate 2, and the resin package 6 protects the semiconductor chip 3 from the outside.

A through hole, a via or the like (not shown) is formed in the substrate 2, and the electrode portion connected to the semiconductor chip 3 by the wire 5 is formed on the back surface of the substrate 2 by the through hole, the via or the like. It is electrically drawn to the side, and an external connection electrode (not shown) is formed at the drawn-out portion. Further, a solder ball 7 is provided on the external connection electrode, and the semiconductor device 1 is mounted on the mounting substrate 8 by joining the solder ball 7 to the electrode portion 9 provided on the mounting substrate 8. Was said.

[0009]

However, in the above-described semiconductor device 1 having the conventional structure, the solder balls 7 are formed after the resin package forming step of forming the resin package 6 is performed.
The solder ball arranging step of arranging the solder balls on the substrate 2 must be performed, and the solder ball 7 manufacturing step is required separately from the semiconductor device 1 manufacturing step. There is a problem in that it becomes complicated and the product cost of the semiconductor device 1 increases accordingly.

Further, in order to reliably electrically connect the semiconductor device 1 to the mounting substrate 8, it is necessary to accurately match the diameter dimensions of the numerous solder balls 7 arranged in the semiconductor device 1. This is because if there are variations in the diameter of the solder balls 7, a gap is generated between the solder balls 7 having a small diameter and the electrode portions 9, and the solder balls 7 and the electrode portions 9 have a gap.
This is because there is a possibility that the electrical connection with will not be performed reliably. However, it is difficult to manufacture a large number of solder balls 7 so that their diameters are exactly the same, and therefore, there is a problem that the mounting yield when mounting the semiconductor device 1 on the mounting substrate 8 decreases. It was

The present invention has been made in view of the above points, and provides a semiconductor device, a manufacturing method thereof, and a lead frame capable of performing reliable mounting processing by a simple manufacturing process and reducing product cost. The purpose is to

[0012]

[Means for Solving the Problems] The above problems can be solved by taking the following means.

According to the first aspect of the present invention, the semiconductor chip and the lead portion connected to the semiconductor chip are internally provided in the resin package, and a part of the lead portion is outside the resin package and the exposed surface thereof is the resin. In a semiconductor device, which is exposed so as to be flush with an outer surface of a package and has a connection portion formed therein, a protrusion protruding outward from an outer surface of the resin package is integrally formed with a lead portion at the connection portion. It is characterized by becoming.

Further, the invention of claim 2 is characterized in that the thickness of the projecting portion is formed thinner than the thickness of the lead portion excluding the projecting portion.

Further, the invention of claim 3 is characterized in that the projecting portion is configured to project outwardly by plastically deforming the connecting portion.

In the invention of claim 4, the lead portion constitutes a part of the lead frame.

In the invention of claim 5, the lead portion constitutes a part of a TAB (Tape Automated Bonding) tape.

Further, in the method of the present invention according to claim 6, it is formed by a lead portion forming step of forming a lead portion having a connecting portion connected to the semiconductor chip and connected to an external terminal, and the lead portion forming step. The semiconductor chip mounting step of electrically connecting the lead portion and the mounted semiconductor chip, the lead portion mounted with the semiconductor chip is mounted in a mold, and the mold is filled with a resin. A resin molding step of embedding the semiconductor chip and the lead portion in the resin, and forming a resin package so that the surface of the connection portion formed in a part of the lead portion is exposed so as to be flush with the outer surface of the resin, It is performed at the same time as this resin molding process, and the internal pressure generated by filling the mold with the resin causes the connecting portion to plastically deform and protrude outward. It is characterized in that it has a projecting portion forming step of forming a section.

According to the seventh aspect of the present invention, in the lead portion forming step, half-etching is performed on the connecting portion formed in the lead portion, and the protruding portion is formed in the protruding portion forming step performed later. It is characterized in that the part to be cut is thinner than the other parts.

Further, in the method of the present invention according to claim 8, in the resin molding step, a concave portion corresponding to the shape of the protruding portion is formed at a portion facing a protruding portion forming position of the mold used for molding the resin package. It is characterized by being formed.

Further, in the method of the present invention as claimed in claim 9, in the resin molding step, suction for sucking the connecting portion toward the outside at a portion where a protruding portion of a mold used for molding the resin package is formed. A device is provided, and the projecting portion is projected outward with the suction force generated by the suction device as an auxiliary force.

Further, according to the invention of claim 10, when the semiconductor chip is mounted, the chip mounting portion, the inner lead portion connected to the semiconductor chip, and the outside of the resin package when embedded in the resin package. In a lead frame having an outer lead portion having a connection portion exposed to the outside, a protrusion is formed at the connection portion.

The invention according to claim 11 is characterized in that the thickness of the above-mentioned protruding portion is formed thinner than the thickness of the outer lead portion excluding this protruding portion.

Further, the invention of claim 12 is characterized in that the projecting portion is configured to project outward by plastically deforming the connecting portion.

[0025]

The above-mentioned means operate as follows.

According to the first aspect of the present invention, the connecting portion formed on the lead portion is formed with the protruding portion protruding outward from the outer surface of the resin package, so that this protruding portion is equivalent to a conventional solder ball. Can have the function of. Further, since the projecting portion is formed integrally with the lead portion, it is possible to eliminate the need for solder balls which were required in the semiconductor device having the conventional configuration, thereby reducing the number of parts and simplifying the manufacturing process. Can be planned.

According to the second and eleventh aspects of the present invention, the protrusion is formed by making the thickness of the protrusion thinner than the thickness of the lead portion excluding the protrusion. It can be done easily. Further, it becomes possible to cause the protruding portion to protrude due to the internal pressure generated in the mold when manufacturing the resin package, and the manufacturing process can be simplified.

According to the third and twelfth aspects of the present invention, the projecting portion is projected outward by plastically deforming the connecting portion, so that the plastic ball is soldered as in the conventional plastic working. Since it is possible to perform processing with higher accuracy than manufacturing with high accuracy so that the diameter dimension is uniform, it is possible to easily uniformize the amount of protrusion of a large number of protruding portions.

Further, according to the inventions of claims 4 and 5, the number of parts is increased by forming the lead portion by a lead frame or a TAB tape which is generally used as a member constituting a semiconductor device. It is possible to form the protruding portion without any.

Further, according to the method of the invention as defined in claim 6, the connecting portion is plastically deformed by the internal pressure generated when the resin is filled in the mold, and the connecting portion is protruded outward to form the protruding portion. Since the steps are performed at the same time as the resin molding step, the semiconductor device according to claim 1 is manufactured without changing a manufacturing step or adding a new step that is generally performed in a method for manufacturing a semiconductor device. You can Therefore, the semiconductor device according to claim 1 can be manufactured at low cost.

According to the seventh aspect of the present invention, since the portion where the protruding portion is formed is thinner than the other portion, it is carried out when the connecting portion is protruded to form the protruding portion. The plastic working can be performed with a small working force, and the internal pressure generated when the resin is filled in the mold can surely plastically deform the connecting portion. Further, since half etching is used as a means for thinning the portion where the protruding portion is formed with respect to other portions, the thin portion can be easily formed, and the lead portion is formed in the lead portion forming step. By using etching as a method, the thin portion and the lead portion can be collectively formed in the lead portion forming step.

Further, according to the method of the invention as defined in claim 8, by forming a concave portion corresponding to the shape of the protruding portion in a portion of the mold used for molding the resin package, the portion facing the protruding portion forming position, The projecting portion forming step can be performed at the same time as the resin molding step by only making a small change to the mold structure. In addition, the shape of the protrusion formed is determined by the shape of the recess, so by forming a plurality of recesses formed in the mold with high accuracy, the shape of the protrusion formed by this mold can be changed. It can be made uniform.

Further, according to the method of the present invention, a suction device for sucking the connecting portion toward the outside is provided at a portion of the mold where the protruding portion is formed, and the suction force generated by the suction device is used as an auxiliary force. As the above-mentioned protruding portion is projected outward, the protruding portion is formed by the suction force generated by the suction device in addition to the internal pressure force generated when the resin is filled in the mold, so that The protruding portion can be formed with high processing efficiency.

Further, according to the invention of claim 10, when the semiconductor chip is mounted, the chip mounting portion, the inner lead portion connected to the semiconductor chip, and the resin package when embedded in the resin package. A lead frame having an outer lead portion having a connection portion exposed to the outside, and by forming a protrusion on the connection portion, when the lead frame is mounted in a resin package, the protrusion is Since it projects to the outside of the resin package, it can function as an external connection terminal.

[0035]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a sectional view showing a semiconductor device 10 according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a bottom surface of the semiconductor device 10 according to an embodiment of the present invention. The semiconductor device 10 roughly includes a semiconductor chip 11 and lead portions 12.
And a resin package 13 and the like.

The semiconductor chip 11 is bonded to the upper part of the die pad 14 using a die attaching agent 15. A plurality of chip-side electrodes 16 are formed on the upper surface of the semiconductor chip 11. In addition, a plurality of lead portions 12 are arranged so as to surround the semiconductor chip 11 at laterally opposite positions of the semiconductor chip 11.

The lead portion 12 is, for example, Kovar, 42a.
It is made of a lead frame material such as alloy or copper (Cu) alloy, and is composed of an inner lead portion 17 and an outer lead portion 18. The inner lead portion 17 and the outer lead portion 18 integrally and continuously form one lead. A wire 19 is bridged between the inner lead portion 17 and the chip-side electrode 16 formed on the upper surface of the semiconductor chip 11 by a wire bonding process, so that the chip-side electrode 16 and the inner lead portion 17 are electrically connected to each other. It is configured to be connected to.

The semiconductor chip 11 and the lead portion 12 described above.
Are resin-sealed in the resin package 13. By thus encapsulating the semiconductor chip 11 and the lead portion 12 in the resin package 13, it is possible to prevent generation of oxidation due to the contact of the semiconductor chip 11 and the lead portion 12 with air, and to prevent water, dust, etc. It is possible to prevent them from adhering to 11 and the lead portion 12.

Further, as shown in FIGS. 1 and 2, the outer lead portion 18 constituting the lead portion 12 is configured such that a part thereof is exposed to the outside of the resin package 13. A portion of the lead portion 18 exposed to the outside of the resin package 13 is called a connection portion 20.

Here, paying attention to the connecting portion 20, as shown in FIG.
This will be described below with reference to FIGS. 3 and 4 in addition to FIG. still,
FIG. 3 is an enlarged view showing one of the connecting portions 20 formed in the semiconductor device 10, and FIG.
It is sectional drawing which follows the A line.

The surface 20a of the connecting portion 20 is exposed to the bottom surface 13a of the resin package 13, and the connecting portion 2
The surface 20a of 0 and the bottom surface 13a of the resin package 13 are substantially flush with each other. Further, a hemispherical projecting portion 21 is formed at a substantially central position of the connecting portion 20. The protrusion 21 extends from the surface 20a of the connecting portion 20 (that is, the bottom surface 13a of the resin package 13) to the connecting portion 2
It is formed so as to project outward by performing plastic working on 0. Therefore, the projecting portion 21 is formed integrally with the connecting portion 20, that is, integrally with the lead portion 12.

Further, as shown in FIG.
Is thinner than the thickness dimension (indicated by an arrow H in the figure) of the lead portion 12 excluding the position where the protruding portion 21 is formed. (H <
H). Specifically, for example, the thickness dimension H of the lead portion 12 is set to H
= 70 μm, the thickness h of the protrusion 21 is configured to be about h = 20 μm.

As described above, by setting the thickness dimension h of the protruding portion 21 smaller than the thickness dimension H of the lead portion 12 other than the formation position of the protruding portion 21, the protruding portion 2
1 can be configured to be easily plastically worked. Further, although it is conceivable that the mechanical strength of the protruding portion 21 is reduced by reducing the wall thickness of the protruding portion 21, as shown in FIG. 4, the resin forming the resin package 13 is plastically deformed to form a hemisphere. The resin package 13 functions as a reinforcing member for the protruding portion 21 because the shape of the protruding portion 21 is filled even inside the protruding portion 21, so that the mechanical strength of the protruding portion 21 is maintained.

Next, a method of mounting the semiconductor device 10 having the protrusion 21 formed on the mounting substrate 22 will be described with reference to FIG.

As described above, the surface 20a of the connecting portion 20 and the bottom surface 13a of the resin package 13 are configured to be substantially flush with each other, and the protruding portion 21 is flush with the surface 20a.
Also, since it is configured to project outward from the bottom surface 13a, only the projecting portion 21 is projected downward (downward in FIG. 1) on the bottom surface of the semiconductor device 10. Further, since the protruding portion 21 is formed integrally with the lead portion 12, it is electrically connected to the semiconductor chip 11. Therefore, the protruding portion 21 can function as a terminal for external connection like the conventional solder ball 7 (see FIG. 15).

Specifically, the board-side electrode 23 is formed at a predetermined position of the mounting board 22 so as to correspond to the position where the protruding portion 21 is formed, and preset solder (not shown) is arranged on the board-side electrode 23. Set up. Then, the semiconductor device 10
After aligning the projecting portion 21 with the board-side electrode 23, the board-side electrode 23 and the projecting portion 21 are soldered by facing down to the mounting board 22 and then passing through a reflow furnace.

As described above, in the semiconductor device 10 according to the present embodiment, since the protrusion 21 has the same function as the solder bump, the semiconductor device 10 can be surface-mounted on the mounting substrate 22 and the semiconductor chip can be mounted. Even if 11 has a configuration having a large number of chip-side electrodes 16, the connection with the mounting substrate 22 can be reliably performed.

Further, since the projecting portion 21 is formed integrally with the lead portion 12, the solder ball 7 which is required in the semiconductor device 1 having the conventional structure can be eliminated. As a result, the number of parts can be reduced and the manufacturing process can be simplified as compared with the semiconductor device 1 having the conventional configuration, and the product cost can be reduced. Further, since the work of mounting the semiconductor device 10 on the mounting substrate 22 can be carried out by directly using the face-down bonding technique which has been generally performed conventionally, the work of mounting can be easily performed.

Next, a method of manufacturing the semiconductor device 10 having the above structure will be described.

5 to 8 are views for explaining a method of manufacturing the semiconductor device 10 which is an embodiment of the method of the present invention. In order to manufacture the semiconductor device 10, first, a lead portion forming step for forming the lead frame 25 is performed. Figure 5
Shows the lead frame 25 formed by carrying out the lead portion forming step.

FIG. 5A is a plan view of the lead frame 25. The lead frame 25 is, for example, Kovar, 4
By etching a flat plate-shaped base material made of a lead frame material such as 2 alloy or Cu alloy, the lead portion 12 and the die pad 14 are formed into a predetermined shape shown in FIG. Further, in this state, the lead portion 12 and the die pad 14 are configured integrally with the frame body 26 and are held by the frame body 26. Further, the frame 26 has a positioning hole 27 for positioning. The broken line shown in FIG. 5A shows the outer shape of the resin package 13 when the resin package 13 is provided. Therefore, the position inside the broken line is the portion sealed by the resin package 13.

Half-etched portions 28 are formed at predetermined positions of the lead portions 12 formed on the lead frame 25. This half etching part 28
Are formed at the positions where the protrusions 21 are formed later. 5B is an enlarged perspective view showing the vicinity of the position where the half-etched portion 28 is provided, and FIG.
The sectional view which follows the BB line in (B) is shown. The half-etched portion 28 can be formed at the same time when the lead frame 25 is etched into a predetermined shape. Generally, when the lead frame 25 is etched into a predetermined shape, etching processing is performed from both sides thereof. Specifically, first, masks having a predetermined pattern are provided on both side surfaces of the flat base material so that the lead portion 12 (including the half etching portion 28), the die pad 14, the frame 26, etc. are not etched on the flat base material. Etching is performed for a predetermined time.

At this time, the mask is not provided on both sides at the formation position of the half etching portion 28, but is provided on only one side. As a result, at the stage where the lead frame 25 having the shape shown in FIG. 5A is formed, the half-etched portion 28 having a smaller thickness than the other portions is formed in the lead portion 12. This half etching part 2
The thickness h of No. 8 is, for example, about h = 20 μm when the thickness H of the lead portion 12 is H = 70 μm (see FIGS. 5C and 4). The half-etched portion 28 is simply formed by disposing the mask on one side surface of the flat substrate, and the rest is the same as the ordinary etching process and can be easily formed.

By forming the half-etched portion 28 having a smaller wall thickness than the other portions in this way, when the half-etched portion 28 is subjected to the plastic working, the plastic deformation is generated with a small working force. It becomes possible. Further, since the half-etched portion 28 is formed by the half-etching process, the half-etched portion 28 can be simultaneously formed in the lead portion forming step.

Assuming that a cutting process or the like is used to form the thin portion of the half-etched portion 28, the formation (etching process) of the lead frame 25 and the cutting process of the thin portion to be the half-etched portion 28 will not be performed. It cannot be performed in the same process, and a new cutting process is required only to form the half-etched portion 28. However, by forming the half-etched portion 28 by the half-etching process as described above, it is possible to form the half-etched portion 28 at the same time in the lead portion forming step, and the manufacturing process can be simplified.

In the lead portion forming step described above, the lead frame 25 and the half-etched portion 28 are simultaneously formed by the etching process. However, the lead frame 25 can be formed by press working. It is also possible to form the frame 25 and the thin portion (half-etched portion 28) at the same time.

That is, in forming the lead portion 12 and the die pad 14, the flat base material is cut by using a cutter to form the lead portion 12 and the die pad 14 having a predetermined shape, and the thin portion is formed by a jig such as a punch. A thin portion (half-etched portion 28) is formed by pressing with a pressure. Since a jig such as a cutter and a punch can be simultaneously driven by a pressing device, the lead frame 25 and the thin portion (half-etched portion 28) can be formed at the same time by using pressing. .

After the lead frame 25 is manufactured as described above, a semiconductor chip mounting process is subsequently performed. In the semiconductor chip mounting process, first, the semiconductor chip 11 is mounted and fixed on the die pad 14 formed on the lead frame 25 by using the die attaching agent 15. Then, the semiconductor chip 1
A wire 19 is provided by performing a wire bonding process between the chip-side electrode 16 and the lead portion 12 provided on the upper part of 1. As described above, the chip side electrode 16
When the wire 19 is disposed between the lead portion 12 and the lead portion 12, the lead frame 25 is subjected to a pressing process, so that the lead portion 12 is formed into a predetermined shape.

When the above semiconductor chip mounting process is completed, the lead frame 25 on which the semiconductor chip 11 is mounted is mounted.
Is attached to the mold 29 and a resin molding process is performed.

FIG. 6 shows a state in which the lead frame 25 on which the semiconductor chip 11 is mounted is mounted on the mold 29. The die 29 is composed of an upper die 30 and a lower die 31, and the lead frame 25 is held in the die 29 by being sandwiched between the upper die 30 and the lower die 31.

A plurality of recesses 32 are formed on the lower die 31. The formation position of the recess 32 is formed so as to correspond to the formation position of the half-etched portion 28 formed on the lead portion 12 in the above-described lead portion forming step, and the lead frame 25 is attached to the mold 29. As shown in FIG.
Are configured to face the recess 32. The shape of the concave portion 32 is a concave shape corresponding to the hemispherical shape of the protruding portion 21 described above. The upper mold 30 is provided with a runner 34 for introducing the molding resin forming the resin package 13 into the cavity 33.

When the lead frame 25 is mounted in the mold 29, subsequently, the mold resin 13-1 (shown in satin) is introduced into the cavity 33 from the runner 34, as shown in FIG. By introducing the mold resin 13-1 into the cavity 33, the internal pressure in the cavity 33 rises,
This internal pressure is applied to the entire inner surface of the cavity 33.

Here, paying attention to the half-etched portion 28, since the thickness dimension of the half-etched portion 28 is smaller than that of the other portions of the lead portion 12 as described above, the half-etched portion 28 is configured to be easily plastically deformed. Further, the lower die 31 facing the half-etched portion 28 has a recess 32 formed therein. Therefore, the internal pressure generated in the cavity 33 due to the introduction of the mold resin 13-1 and the moving force of the mold resin 13-1 (hereinafter, the internal pressure and the moving force will be referred to as the internal pressure F) are outside the half etching portion 28. Acting as a force to deform toward the lower mold 31 (toward the lower mold 31), and the internal pressure F plastically deforms the half-etched portion 28 toward the outside, thereby forming the protruding portion 21.

FIG. 7 shows a state in which the cavity 33 is completely filled with the mold resin 13-1 to form the resin package 13. In this way, the resin package 1
In the state in which 3 is formed, all the half-etched portions 28 formed on the plurality of lead portions 12 are plastically deformed outward to form the protruding portions 21. As described above, the formation of the protruding portion 21 is performed only by making a small modification to the structure of the lower die 31 of the die 29, specifically, only forming the recess 32 in the lower die 29, and simultaneously performing the resin molding process. Can be formed.

Further, since the shape of the protrusion 21 formed is determined by the shape of the recess 32, the shape of the plurality of recesses 32 formed in the lower die 31 is formed with high precision, so that the mold 29 is formed. The protrusion amount and shape of the protrusion 21 formed by can be easily made uniform. In this way, the amount of protrusion of the protrusions 21 is made uniform and there is no variation, so that when the semiconductor device 10 described with reference to FIG. 1 is mounted on the mounting substrate 22, the protrusions 21 and the substrate-side electrodes 23 float between the protrusions 21. Does not occur, the bonding (solder bonding) between the protrusion 21 and the board-side electrode 23 can be reliably performed, and the mountability of the semiconductor device 10 on the mounting board 22 can be improved.

Although it is considered that the mechanical strength of the protruding portion 21 is lowered by reducing the wall thickness of the protruding portion 21 as described above, the mold resin 13-1 is protruded as shown in FIG. Since the inside of the portion 21 is filled up and functions as a reinforcing material for the protruding portion 21, the protruding portion 2
The mechanical strength of 1 is maintained.

When the resin package 13 is formed as described above, the lead frame 25 on which the resin package 13 is formed is released from the mold 29, and unnecessary portions such as the frame 26 are removed. The semiconductor device 10 shown in 1 is formed. The manufacturing method of the semiconductor device 10 described above is not much different from the generally used semiconductor manufacturing method, and the semiconductor device 10 can be manufactured by using the existing equipment in the substantially same process as the conventional semiconductor manufacturing process. Therefore, the semiconductor device 10 can be manufactured without increasing the product cost of the semiconductor device 10.

FIG. 9 shows a modification of the mold used in the resin molding process. The mold 35 shown in FIG.
Suction pipes 36 and 37 connected to a suction device 38 (for example, a vacuum pump) are arranged at the position where the recess 32 is formed, and the half etching portion 28 is directed to the outside by a suction force generated by the suction device 38 (to a lower die). It is characterized by being configured so that suction can be performed.

By using the mold 35 configured as described above, the suction force f generated by the suction device 38 in addition to the internal pressure F generated in the cavity 33 is used as the force for plastically deforming the half-etched portion 28. Since it acts as an assisting force for plastic deformation, the half-etched portion 28 is pressed by the recess 32 with a strong force, so that the shape of the protruding portion 21 to be formed can be accurately formed according to the shape of the recess 32. It will be possible. Thereby, the protrusion 2 formed
It is possible to further enhance the uniformity of the protrusion height and the shape of No. 1 and improve the mountability on the mounting substrate 22. Further, since the force required for the plastic deformation is increased, the time required for plastically deforming the protrusion 21 is shortened, and the protrusion 21 can be formed efficiently.

10 to 12 are views showing a modification of the method of forming the protrusion 21 in the resin molding process. In the embodiment described above, the half-etched portion 2
In order to plastically deform 8 to form the protrusion 21, the internal pressure F generated in the cavity 33 by introducing the mold resin 13-1 into the mold 25 was used. This modification is characterized in that the half-etched portion 28 is directly plastically deformed using a jig to form the protruding portion 21. Hereinafter, a specific method of forming the protrusion 21 will be described.

FIG. 10 shows a state in which the lead frame 25 on which the semiconductor chip 11 is mounted is mounted on the mold 39. The mold 39 according to the present embodiment has a structure in which a press rod 41 is arranged on an upper mold 40 thereof. The press rod 41 is configured to be movable in the vertical direction in the figure by an elevator device (not shown).

The lower end of the press rod 41 has a hemispherical shape, and its shape is configured to correspond to the hemispherical shape of the recess 32 (that is, the shape of the protruding portion 21 to be formed). This press rod 41 has a lower mold 31.
It is arranged in the upper mold 40 so as to face the concave portion 32 formed in. When the lead frame 25 is mounted on the mold 39, each press rod 41 is configured to be in the upwardly moved position (hereinafter, this position is referred to as an initial position) as shown in FIG.

When the lead frame 25 is mounted on the mold 39, subsequently, as shown in FIG. 11, the press rod 41 is moved downward by the elevating device to come into contact with the half-etched portion 28, and the press rod 41 is further removed. It moves downward to press the half-etched portion 28 against the recess 32. Due to the pressing force of the press rod 41 pressing the half-etched portion 28 against the recess 32, the half-etched portion 28 is plastically deformed to form the protruding portion 21.

When the protrusion 21 is formed as described above,
The press rod 41 moves up by the lifting device and returns to the initial position again. In this state, the mold resin 13-1 is introduced into the cavity 33 through the runner 34, and the resin package 1
3 is manufactured (see FIG. 12). This mold resin 13
When -1 is introduced, since the press rod 41 has returned to the initial position, the press rod 41 does not interfere with the production of the resin package 13.

Some resin molding apparatuses are provided with a releasing rod for releasing the molded resin product from the mold. This releasing rod is used in this modification. The press rod 41 has a configuration similar to that of the illustrated press rod 41, and when the mold is released, by moving downward, the resin product formed in the mold is pressed and released from the mold.
Therefore, the press rod 41 can be configured to be driven by using an existing lifting device for lifting the existing release rod.

As described above, in the present modification, the press rod 41 presses the half-etched portion 28 toward the recess 32, whereby the half-etched portion 28 is plastically deformed to form the protruding portion 21. There is. Therefore, as compared with the above-described embodiment in which the half-etched portion 28 is plastically deformed using the internal pressure F, the processing force applied to the half-etched portion 28 is stabilized, so that the protruding portion 21 also formed in this embodiment. It is possible to accurately shape the shape according to the shape of the recess 32. Therefore, it is possible to further improve the uniformity of the protruding height and the shape of the formed protruding portion 21, and thus it is possible to improve the mountability on the mounting substrate 22.

Since the plastic working of the protrusion 21 is formed by one elevating operation of the press rod 41, the protrusion 2
The time required for plastically deforming 1 is short, and the protrusion 21 can be formed efficiently.

Further, the press rod 41 has the function of plastically deforming the half-etched portion 28 to form the protruding portion 21 as described above, and after the resin package 13 is formed,
This can also be used as a release rod for releasing from the mold 39, and the press rod 41 can be made multifunctional. In each of the embodiments described above, the lead frame 25 is processed and formed as the lead portion 12, but the semiconductor device according to the present invention may use a TAB (Tape Automated Bonding) tape as the lead portion 12. Is. 13 and 14 show an example in which the TAB tape 42 is used as the lead portion 12.

The TAB tape 42 has a structure in which a lead pattern 44 made of, for example, a copper foil is printed and formed in a predetermined shape on the upper surface of a resin tape 43 made of polyimide or the like. The semiconductor chip 11 is mounted on the TAB tape 42 and is electrically connected to the lead pattern 44 by using the wire 19 or a solder bump (FIGS. 13 and 14 show an example using the wire 19). ). still,
The film thickness of the lead pattern 44 is generally about 30 to 40 μm.

FIG. 13 shows a T on which the semiconductor chip 11 is mounted.
The state where the AB tape 42 is attached to the mold 29 is shown. At the formation position of the protruding portion 21 of the resin tape 43 constituting the TAB tape 42, the resin tape 43 is removed over a predetermined range to form the holes 45. Therefore, the TAB tape 42 is formed in the mold 29. The lead pattern 44 directly faces the recess 32 in the state of being mounted on. Further, as described above, the thickness of the lead pattern 44 is about 30 to 40 μm, and the thickness is such that it can be plastically deformed as it is. Therefore, unlike the case where the lead frame 25 is used, the half etching portion is Not formed.

When the TAB tape 42 is mounted in the mold 29, subsequently, as shown in FIG. 14, the mold resin 13-1 (shown in satin) is introduced into the cavity 33 from the runner 34 to form the resin package 13. To be done. At this time, the internal pressure F generated by introducing the mold resin 13-1 into the cavity 33 is applied to the entire upper surface of the TAB tape 42.

Here, paying attention to the position where the hole 5 of the TAB tape 42 is formed (that is, the position where the protruding portion 21 is formed), the thickness of the lead pattern 44 is about 30 to 4 as described above.
The thickness is 0 μm and the film thickness is plastically deformable, and the lead pattern 44 is exposed by forming the holes 5. Further, a recess 32 is formed in the lower die 31 facing the exposed portion of the lead pattern 44. Therefore, the lead pattern 44 is plastically deformed outward (toward the concave portion 32) by the internal pressure F generated by the introduction of the mold resin 13-1, whereby the protruding portion 21 is formed.

In the semiconductor device formed by the above manufacturing method, only the projecting portion 21 projects from the bottom surface of the semiconductor device. However, in the step of forming the TAB tape 42, the portion where the protrusion 21 is formed is protruded outward by pressing or the like over an area larger than the area where the protrusion 21 is formed, and the bottom surface and the surface of the resin package 13 are formed. This TAB is formed so that it becomes one.
By mounting the tape 42 on the mold 29 and carrying out the above resin molding process, the projecting portion 21 is formed in the connecting portion 20 which is flush with the bottom surface of the resin package 13, and is shown in FIG. It is also possible to manufacture a semiconductor device having a shape equivalent to that of the semiconductor device 10.

As described above, even in the semiconductor device having the TAB tape 42, the same effects as those of the semiconductor device 10 using the lead frame 25 shown in FIG. 1 can be realized, and the number of parts can be reduced and The manufacturing process can be simplified.

In each of the above-described embodiments, the hemispherical shape of the protruding portion 21 has been described as an example, but the shape of the protruding portion 21 is not limited to this and may be, for example, a flat surface. The shape may be an elliptical shape, a rectangular shape, or the like, or the overall shape may be a conical shape, a truncated cone shape, a pyramid shape, or the like. The shape of the protruding portion 21 can be arbitrarily determined by the mounting density, the arrangement pitch of the board-side electrodes 23 arranged on the mounting board 22, and the like.

Further, in the example described with reference to FIGS. 3 to 5, the half-etched portion 28 is provided to facilitate the formation of the protrusion 21. However, the structure is not particularly limited to the half-etched portion 28 as long as the width of the lead portion 12 can be made thin to facilitate the plastic working, and the cutting work, the press work, etc. exemplified in the above description. The thin portion may be formed by.

[0088]

As described above, according to the present invention, the following various effects can be realized.

According to the first aspect of the present invention, the connecting portion formed on the lead portion is formed with the protruding portion protruding outward from the outer surface of the resin package, so that this protruding portion is equivalent to a conventional solder ball. Can have the function of. Further, since the projecting portion is formed integrally with the lead portion, it is possible to eliminate the need for solder balls which were required in the semiconductor device having the conventional configuration, thereby reducing the number of parts and simplifying the manufacturing process. Can be planned.

According to the second and eleventh aspects of the present invention, the protrusion is formed by making the thickness of the protrusion thinner than the thickness of the lead portion excluding the protrusion. It can be done easily. Further, it becomes possible to cause the protruding portion to protrude due to the internal pressure generated in the mold when manufacturing the resin package, and the manufacturing process can be simplified.

Further, according to the inventions of claims 3 and 12, the projecting portion is configured to project outward by plastically deforming the connecting portion, so that the plastic working is performed by using the solder ball as in the conventional case. Since it is possible to perform processing with higher accuracy than manufacturing with high accuracy so that the diameter dimension is uniform, it is possible to easily uniformize the amount of protrusion of a large number of protruding portions.

Further, according to the inventions of claims 4 and 5, the number of parts is increased by forming the lead portion by a lead frame or TAB tape which is generally used as a member constituting a semiconductor device. It is possible to form the protruding portion without any.

Further, according to the method of the sixth aspect of the present invention, the internal pressure generated when the resin is filled in the mold plastically deforms the connecting portion to protrude outward to form a protruding portion. Since the steps are performed at the same time as the resin molding step, the semiconductor device according to claim 1 is manufactured without changing a manufacturing step or adding a new step that is generally performed in a method for manufacturing a semiconductor device. You can Therefore, the semiconductor device according to claim 1 can be manufactured at low cost.

According to the seventh aspect of the present invention, since the portion where the protruding portion is formed is thinner than the other portion, it is carried out when the connecting portion is protruded to form the protruding portion. The plastic working can be performed with a small working force, and the internal pressure generated when the resin is filled in the mold can surely plastically deform the connecting portion. Further, since half etching is used as a means for thinning the portion where the protruding portion is formed with respect to other portions, the thin portion can be easily formed, and the lead portion is formed in the lead portion forming step. By using etching as a method, the thin portion and the lead portion can be collectively formed in the lead portion forming step.

Further, according to the method of the invention as defined in claim 8, by forming a concave portion corresponding to the shape of the protruding portion at a portion opposite to the protruding portion forming position of the mold used for molding the resin package, The projecting portion forming step can be performed at the same time as the resin molding step by only making a small change to the mold structure. In addition, the shape of the protrusion formed is determined by the shape of the recess, so by forming a plurality of recesses formed in the mold with high accuracy, the shape of the protrusion formed by this mold can be changed. It can be made uniform.

According to the method of the present invention as defined in claim 9, a suction device for sucking the connecting portion toward the outside is provided at a portion of the mold where the protruding portion is formed, and the suction force generated by the suction device is used as an auxiliary force. As the above-mentioned protruding portion is projected outward, the protruding portion is formed by the suction force generated by the suction device in addition to the internal pressure force generated when the resin is filled in the mold, so that The protruding portion can be formed with high processing efficiency.

According to the invention of claim 10, when the semiconductor chip is mounted, the chip mounting portion, the inner lead portion connected to the semiconductor chip, and the resin package when embedded in the resin package. A lead frame having an outer lead portion having a connection portion exposed to the outside, and by forming a protrusion on the connection portion, when the lead frame is mounted in a resin package, the protrusion is Since it projects to the outside of the resin package, it can function as an external connection terminal.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a semiconductor device that is an embodiment of the present invention.

FIG. 2 is a perspective view showing a bottom surface of a semiconductor device according to an embodiment of the present invention.

FIG. 3 is an enlarged view showing one of a plurality of connecting portions formed in a semiconductor device.

4 is a cross-sectional view taken along the line AA in FIG.

FIG. 5 is a plan view of a lead frame that is an embodiment of the present invention.

FIG. 6 is a view showing a state in which a lead frame on which a semiconductor chip is mounted is mounted on a mold.

FIG. 7 is a view showing a state where mold resin is filled in the cavity.

FIG. 8 is a view showing a state in which a cavity is completely filled with a mold resin to form a resin package.

FIG. 9 is a view showing a modified example of a mold used in a resin molding process.

FIG. 10 is a view showing a modified example of the method of forming the protruding portion in the resin molding step, and is a view showing a state where the lead frame on which the semiconductor chip is mounted is mounted on the mold.

FIG. 11 is a view showing a modified example of the method of forming the protrusion in the resin molding step, and is a view showing a state in which the press rod is moved downward to plastically process the half-etched portion.

FIG. 12 is a diagram showing a modified example of the method of forming the protrusion in the resin molding step, and is a diagram showing a state in which the resin package is formed.

FIG. 13 is a diagram showing a state in which a TAB tape on which a semiconductor chip is mounted is mounted on a mold.

FIG. 14 is a diagram showing a state in which a resin package is formed in the configuration using the TAB tape.

FIG. 15 is a cross-sectional view of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 semiconductor device 11 semiconductor chip 12 lead part 13 resin package 13a bottom surface 13-1 mold resin 16 chip side electrode 17 inner lead part 18 outer lead part 19 wire 20 connection part 20a surface 21 protrusion part 22 mounting substrate 23 board side electrode 25 lead Frame 26 Frame 27 Positioning hole 28 Half etching part 29, 35, 39 Mold 30, 40 Upper mold 31 Lower mold 32 Recessed portion 33 Cavity 36, 37 Suction pipe 38 Suction device 41 Press rod 42 TAB tape 43 Resin tape 44 Lead Pattern 45 holes

Claims (12)

[Claims] 1. A semiconductor chip (11) and lead portions (12, 44) connected to the semiconductor chip (11) are internally provided in a resin package (13), and the lead portions (12, 44) are also provided. A part of the outside of the resin package (13) has an exposed surface (20a) on the resin package (13).
Exposed so as to be flush with the outer surface (13a) of the connecting portion (2)
0) is formed on the connecting portion (20), the protruding portion (21) protruding outward from the outer surface (13a) of the resin package (13) is provided on the lead portion (12, 44). A semiconductor device, which is formed integrally with a semiconductor device. 2. The thickness dimension (h) of the protrusion (21) is
The semiconductor device according to claim 1, wherein the lead portion (12) excluding the protruding portion (21) is formed thinner than the thickness dimension (H). 3. The protrusion (21) is provided with the connecting portion (20).
The semiconductor device according to claim 1, wherein the semiconductor device is plastically deformed to be projected outward. 4. The semiconductor device according to claim 1, wherein the lead portion (12) constitutes a part of the lead frame (25). 5. The lead portion (44) is formed of TAB (Tape Au).
4. The semiconductor device according to claim 1, which constitutes a part of a tomated bonding tape (42). 6. A lead portion forming step of forming a lead portion (12, 44) having a connecting portion (20) connected to a semiconductor chip (11) and connected to an external terminal (23), and the lead portion. The lead portion formed by the forming process (12,
44) and a semiconductor chip mounting step of electrically connecting the mounted semiconductor chip (11), and a lead portion (12, 12) on which the semiconductor chip (11) is mounted.
44) is mounted in the mold (29, 35, 39), and the mold (29, 35, 39) is filled with resin (13-1) to form the semiconductor chip (11) and the lead portion (14). 12, 4
4) is embedded in the resin (13-1), and the surface (20a) of the connecting portion (20) formed in a part of the lead portion (12, 44) is flush with the outer surface of the resin. And a resin molding step of forming a resin package (13) so that the resin package (13) is exposed at the same time, and the resin (13-1) is filled in the mold (29, 35, 39). The internal pressure (F) generated by the
0) is plastically deformed and is projected outward so that the projection (2)
1) The method for manufacturing a semiconductor device, which comprises a step of forming a protrusion. 7. The connecting portion (20) formed in the lead portion (12) is half-etched in the lead portion forming step, and the protruding portion (21) is formed in a protruding portion forming step performed later. 7. The method of manufacturing a semiconductor device according to claim 6, wherein the formed part is thinner than the other parts. 8. The mold (29, 29) used when molding the resin package (13) in the resin molding step.
8. A manufacturing method of a semiconductor device according to claim 6, wherein a recess (32) corresponding to the shape of the protrusion (21) is formed at a portion of the protrusion (35, 39) facing the protrusion forming position. Method. 9. The mold (35) used in molding the resin package (13) in the resin molding step.
At the site where the protrusion (21) is formed,
0) is connected to a suction device (38) for sucking outward,
9. The method for manufacturing a semiconductor device according to claim 6, wherein the projection (21) is projected outward by using a suction force generated by the suction device (38) as an auxiliary force. 10. A chip mounting part (14) when a semiconductor chip (11) is mounted, an inner lead part (17) connected to the semiconductor chip (11) and a resin package (13) embedded therein. When the resin package (13)
A lead frame having an outer lead part (18) having a connection part (20) exposed to the outside, characterized in that a protrusion part (21) is formed on the connection part (20). Lead frame. 11. The thickness dimension of the projecting portion (21) is formed thinner than the thickness dimension of the outer lead portion (18) excluding the projecting portion (21). 10. The lead frame described in 10. 12. The protrusion (21) is provided with the connecting portion (2).
The lead frame according to claim 10 or 11, wherein the lead frame (0) is plastically deformed to be projected outward.