CN117584361A - Integrated circuit chip package manufacturing equipment - Google Patents
Integrated circuit chip package manufacturing equipment Download PDFInfo
- Publication number
- CN117584361A CN117584361A CN202311600888.8A CN202311600888A CN117584361A CN 117584361 A CN117584361 A CN 117584361A CN 202311600888 A CN202311600888 A CN 202311600888A CN 117584361 A CN117584361 A CN 117584361A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- cavity
- plate
- die cavity
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000007789 sealing Methods 0.000 claims abstract description 41
- 238000005520 cutting process Methods 0.000 claims abstract description 15
- 238000005452 bending Methods 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 238000005538 encapsulation Methods 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 25
- 238000001746 injection moulding Methods 0.000 abstract description 16
- 238000004806 packaging method and process Methods 0.000 abstract description 14
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses integrated circuit chip packaging manufacturing equipment, which relates to the technical field of chip packaging manufacturing and comprises a base and a pressing and cutting assembly, wherein a lower die cavity is symmetrically arranged on the upper surface of the base, a material ejection assembly is arranged below the lower die cavity, bending assemblies are symmetrically arranged around the lower die cavity, supporting rods are symmetrically and fixedly connected to four corners of the base, the upper ends of the supporting rods are fixedly connected with cross beams, lifting rods are symmetrically and fixedly connected to the lower parts of the cross beams, a bottom plate is fixedly connected to the lower parts of the lifting rods, and the pressing and cutting assembly is symmetrically arranged around the upper die cavity. According to the invention, during injection molding, air in the mold cavity can be pumped out, no air bubble exists in the packaging shell, the mold cavity can be sealed by close fit between the sealing plates, material exudation is avoided, after packaging is completed, the chip packaging can be directly cut and pins are bent, so that the chip packaging is separated from the frame, and when the device is reset, the product can be synchronously unloaded.
Description
Technical Field
The invention relates to the technical field of chip package manufacturing, in particular to integrated circuit chip package manufacturing equipment.
Background
The chip package is a housing for mounting a semiconductor integrated circuit chip, plays roles of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and is also a bridge for communicating the world inside the chip with external circuits, and contacts on the chip are connected to pins of the package housing by wires, and the pins are connected with other devices by wires on a printed board. Therefore, packaging plays an important role for both CPU and other LSI integrated circuits.
When the package is manufactured, the chip and the frame which are subjected to wire bonding are placed in a plastic packaging device for plastic packaging, and then the chip and the frame are taken out and transported to a cutting device for cutting, and the pins are bent, so that the chip and the frame are difficult to directly cut and bend after plastic packaging.
Accordingly, in view of the above, research and improvement are made with respect to the conventional structure and defects, and an integrated circuit chip package manufacturing apparatus is proposed.
Disclosure of Invention
The present invention is directed to an integrated circuit chip package manufacturing apparatus for solving the above-mentioned problems.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides an integrated circuit chip encapsulation manufacture equipment, includes base and pressure and cuts the subassembly, the lower die cavity has been seted up to base upper surface symmetry, and is provided with the liftout subassembly below the die cavity down, die cavity symmetry is provided with the subassembly of bending down all around, base four corners symmetry fixedly connected with branch, and branch upper end fixedly connected with crossbeam, crossbeam below symmetry fixedly connected with lifter, and lifter below fixedly connected with bottom plate, bottom plate middle part fixedly connected with filling tube, and bottom plate below symmetry fixedly connected with pressure spring, pressure spring below fixedly connected with mould, and the mould lower part is provided with the die cavity, go up die cavity top central authorities and be connected with the inlet pipe, and go up the die cavity top symmetry and be provided with the subassembly of bleeding, pressure is cut the subassembly symmetry and is set up around last die cavity.
Further, the feeding pipe is sleeved on the outer side of the feeding pipe, and the die is in sliding connection with the bottom plate through a pressure spring.
Further, the liftout subassembly includes roof, ejector pin and slider, lower die cavity lower part block is connected with the roof, and roof below fixedly connected with ejector pin, ejector pin other end symmetry fixedly connected with slider all around.
Further, the material ejection assembly further comprises a sleeve and a sliding groove, the sleeve is sleeved on the outer side of the other end of the ejector rod, the sliding groove is symmetrically formed in the four sides of the sleeve, and the sliding block is in sliding connection with the sleeve through the sliding groove.
Further, the bending assembly comprises a sliding cavity, support plates and springs, the sliding cavity is symmetrically formed in the periphery of the lower die cavity, the support plates are fixedly connected to the side walls of the sliding cavity, and the springs are fixedly connected to the inside of the sliding cavity.
Further, the bending assembly further comprises a supporting plate and a supporting groove, the supporting plate is arranged at the upper end of the spring, the supporting groove is formed in the side wall of the supporting plate, the supporting plate is in clamping sliding connection with the supporting plate through the supporting groove, and the supporting plate is in elastic connection with the sliding cavity through the spring.
Further, the air extraction component comprises an air passage and an air cavity, wherein the air passage is symmetrically arranged on the left side and the right side above the upper die cavity, and the other end of the air passage is connected with the air cavity.
Further, the air extraction assembly further comprises a plug plate and a connecting rod, the plug plate is arranged in the air cavity in a fit mode, the connecting rod is fixedly connected to the upper portion of the plug plate, the connecting rod is fixedly connected with the bottom plate, and the plug plate is slidably connected with the air cavity.
Further, the press-cutting assembly comprises a through groove and a sealing plate, the through groove is symmetrically arranged around the upper die cavity, the sealing plate is connected in the through groove in a clamping mode, the sealing plate and the through groove are in a convex shape, the sealing plate is in sliding connection with the die through the through groove, and the sealing plate is tightly attached to each other.
Further, press and cut the subassembly and still include top spring and cutter, shrouding top fixedly connected with top spring, and the laminating of one side that goes up the die cavity is kept away from to the shrouding is provided with the cutter, top spring all with bottom plate fixed connection, and the shrouding passes through top spring and bottom plate elastic connection.
The invention provides integrated circuit chip package manufacturing equipment, which has the following beneficial effects: when moulding plastics, can take out the air in the die cavity, guarantee not have the bubble in the encapsulation shell, and closely laminate between the shrouding can seal the die cavity, avoid the material to ooze, and after the encapsulation is accomplished, can directly cut the chip package and the pin is bent to separate chip package and frame, and when the device resets, can unload the product in step.
1. According to the invention, when injection molding is performed, the lifting rod drives the bottom plate to descend, the sealing plate is tightly pressed on the supporting plate, the sealing plate can be matched with the supporting plate to seal the upper die cavity and the lower die cavity, so that material leakage is avoided when injection molding is performed, then the lifting rod drives the bottom plate to descend continuously, the upper die cavity and the lower die cavity are closed to form a complete cavity, material is injected into the upper die cavity and the lower die cavity from the feeding pipe through the feeding pipe, meanwhile, the lifting rod drives the bottom plate to descend continuously, the pressure spring and the top spring are compressed, the pressing plate drives the plug plate to move downwards in the air cavity through the connecting rod, so that air in the cavity is pumped out, the material is accelerated to enter into and exhaust air bubbles in the material under the action of negative pressure, the quality after encapsulation molding is ensured, the bottom plate can drive the feeding pipe to slide in the feeding pipe, the material can be ensured to enter the cavity continuously, and when injection molding is performed, the air in the die cavity is pumped out, no air bubbles are ensured in the encapsulation shell, the tight fit between the sealing plate can seal the die cavity, and material leakage is avoided.
2. According to the invention, when the support plate is in injection molding, the support plate can be supported through the support grooves, deformation of the sealing plate caused by pressure applied to the pins due to the descent of the support plate is avoided, the lifting rod can drive the bottom plate to descend again, the pressure spring and the top spring are compressed again, the bottom plate drives the cutter to cut off the connection part of the pins and the frame, after the cutting is completed, the cutter can squeeze the support plate to displace in the sliding cavity along with the continuous descent of the bottom plate, the support plate is separated from the support grooves, the sealing plate can be pressed by the sealing plate to slide in the sliding cavity under the action of the top spring, the spring is compressed, the sealing plate is matched with the support plate to bend the pins, after the bending is completed, the lifting rod drives the bottom plate to rebound, the sealing plate can be pulled out from the sliding cavity, then the spring drives the support plate to rebound, the support plate is clamped into the support grooves again, the support plate is limited again, when the injection molding is completed, the pins are prevented from being subjected to compression deformation, and the pins are cut and bent immediately after the injection molding is completed, the separation of the chips and the frame is completed, and the processing procedure is simplified.
3. In the injection molding process, the top plate can seal the lower die cavity to avoid material leakage, when the lifting rod drives the bottom plate to descend, the sliding block can slide on the sleeve through the sliding groove to avoid the ejector rod from obstructing the bottom plate to descend through the sleeve, when the lifting rod drives the bottom plate to lift back after the processing is finished, the plug plate can be driven by the bottom plate through the connecting rod to move upwards in the air cavity to squeeze the cavity in the air cavity into the upper die cavity, so that the package is extruded from the upper die cavity to avoid adhesion between the package and the wall of the upper die cavity, and meanwhile, the bottom plate drives the sleeve to ascend.
Drawings
FIG. 1 is a schematic diagram of an integrated circuit chip package fabrication apparatus according to the present invention;
FIG. 2 is a schematic cross-sectional front view of an integrated circuit chip package fabrication apparatus according to the present invention;
FIG. 3 is a schematic cross-sectional front view of an integrated circuit chip package fabrication apparatus according to the present invention;
FIG. 4 is a schematic cross-sectional front view of a base of an integrated circuit chip package fabrication apparatus according to the present invention;
FIG. 5 is an enlarged schematic view of the structure of the integrated circuit chip package fabrication apparatus of FIG. 4A according to the present invention;
FIG. 6 is a schematic diagram showing a perspective structure of a carrier bar of an integrated circuit chip package manufacturing apparatus according to the present invention;
fig. 7 is a schematic cross-sectional front view of a sleeve of an integrated circuit chip package fabrication apparatus according to the present invention.
In the figure: 1. a base; 2. a lower die cavity; 3. a material ejection assembly; 301. a top plate; 302. a push rod; 303. a slide block; 304. a sleeve; 305. a chute; 4. a bending assembly; 401. a sliding cavity; 402. a support plate; 403. a spring; 404. a supporting plate; 405. a groove is formed; 5. a support rod; 6. a cross beam; 7. a lifting rod; 8. a bottom plate; 9. a feeding tube; 10. a pressure spring; 11. a mold; 12. an upper die cavity; 13. a feed pipe; 14. an air extraction assembly; 1401. an airway; 1402. an air cavity; 1403. a plug plate; 1404. a connecting rod; 15. a pressing and cutting assembly; 1501. a through groove; 1502. a sealing plate; 1503. a top spring; 1504. and (5) a cutter.
Detailed Description
Referring to fig. 1 to 7, the present invention provides the following technical solutions: the utility model provides an integrated circuit chip encapsulation manufacture equipment, including base 1 and pressure cutting subassembly 15, lower die cavity 2 has been seted up to base 1 upper surface symmetry, and lower die cavity 2 below is provided with liftout subassembly 3, lower die cavity 2 symmetry is provided with the subassembly of bending 4 all around, base 1 four corners symmetry fixedly connected with branch 5, and branch 5 upper end fixedly connected with crossbeam 6, crossbeam 6 below symmetry fixedly connected with lifter 7, and lifter 7 below fixedly connected with bottom plate 8, bottom plate 8 middle part fixedly connected with filling tube 9, and bottom plate 8 below symmetry fixedly connected with pressure spring 10, pressure spring 10 below fixedly connected with mould 11, and the mould 11 lower part is provided with mould cavity 12, go up die cavity 12 top central authorities are connected with inlet pipe 13, and upward die cavity 12 top symmetry is provided with bleed subassembly 14, pressure cutting subassembly 15 symmetry sets up around last die cavity 12.
Referring to fig. 1 to 5, a feeding tube 13 is sleeved outside a feeding tube 9, a mold 11 is slidably connected with a bottom plate 8 through a compression spring 10, a bending assembly 4 comprises a sliding cavity 401, a support plate 402 and a spring 403, the sliding cavity 401 is symmetrically arranged around a lower mold cavity 2, the support plate 402 is fixedly connected with the side wall of the sliding cavity 401, the spring 403 is fixedly connected with the sliding cavity 401, the bending assembly 4 further comprises a support plate 404 and a support groove 405, the support plate 404 is arranged at the upper end of the spring 403, the support groove 405 is arranged on the side wall of the support plate 404, the support plate 402 is slidably connected with the support plate 404 in a clamping manner through the support groove 405, the support plate 404 is elastically connected with the sliding cavity 401 through the spring 403, an air extracting assembly 14 comprises an air channel 1401 and an air cavity 1402, the air channel 1401 is symmetrically arranged at the left side and the right side above the upper mold cavity 12, the other end of the air channel 1401 is connected with the air cavity 1402, the air extracting assembly 14 further comprises a plug 1403 and a connecting rod 1404, a stopper 1403 is arranged in the air cavity 1402 in a fitting way, a connecting rod 1404 is fixedly connected above the stopper 1403, the connecting rod 1404 is fixedly connected with a bottom plate 8, the stopper 1403 is in sliding connection with the air cavity 1402, the pressing and cutting assembly 15 comprises a through groove 1501 and a sealing plate 1502, through grooves 1501 are symmetrically arranged around the upper die cavity 12, the sealing plate 1502 is connected in the through groove 1501 in a clamping way, the sealing plate 1502 and the through groove 1501 are both convex, the sealing plate 1502 is in sliding connection with the die 11 through the through grooves 1501, the sealing plates 1502 are tightly attached, the pressing and cutting assembly 15 further comprises a top spring 1503 and a cutter 1504, the top spring 1503 is fixedly connected above the sealing plate 1502, the cutter 1504 and the top spring 1503 are fixedly connected with the bottom plate 8, and the sealing plate 1502 is elastically connected with the bottom plate 8 through the top spring 1503;
the concrete operation is that, when injection molding, the lifting rod 7 drives the bottom plate 8 to descend, the sealing plate 1502 is pressed on the supporting plate 404, the sealing plate 1502 can be matched with the supporting plate 404 to seal the space between the upper die cavity 12 and the lower die cavity 2, material leakage is avoided during injection molding, then the lifting rod 7 drives the bottom plate 8 to descend continuously, the space between the upper die cavity 12 and the lower die cavity 2 is closed to form a complete cavity, material is injected into the upper die cavity 12 and the lower die cavity 2 from the feeding pipe 9 through the feeding pipe 9, meanwhile, the lifting rod 7 drives the bottom plate 8 to descend continuously, the pressure spring 10 and the top spring 1503 are compressed, the pressing plate drives the plug plate 1403 to move downwards in the air cavity 1402 through the connecting rod 1404, air in the cavity is pumped out, the material is accelerated to enter and exhaust air bubbles in the material under the action of negative pressure, the quality after encapsulation molding is ensured, and in the process of descending the bottom plate 8, the feeding pipe 9 can be driven to slide in the feeding pipe 13, ensuring that the materials can continuously enter the cavity, fully-covering, during injection molding, air in the mold cavity can be pumped out, no air bubble exists in the packaging shell, the close fit between the sealing plates 1502 can seal the mold cavity, material seepage is avoided, during injection molding, the supporting plate 402 can support the supporting plate 404 through the supporting grooves 405, the deformation of the pins caused by the pressing of the sealing plates 1502 due to the falling of the supporting plate 404 is avoided, the packaging and cooling molding is carried out, the lifting rod 7 can drive the bottom plate 8 to descend again, the pressure spring 10 and the top spring 1503 are compressed again, the bottom plate 8 can drive the cutter 1504 to cut off the connection part of the pins and the frame, after the cutting is completed, the cutter 1504 can press the supporting plate 404 to displace in the sliding cavity 401 along with the driving of the cutter 1504 by the bottom plate 8, the supporting plate 402 is separated from the supporting grooves 405, the sealing plates 1502 can press the sliding supporting plate 404 to slide in the sliding cavity 401 under the action of the top spring 1503, and compress spring 403 for shrouding 1502 cooperation fagging 404 bends the pin, and after bending, lifter 7 drives bottom plate 8 and kick-backs, alright draw shrouding 1502 from smooth intracavity 401, then spring 403 alright drive fagging 404 and kick-backs, make fagging 402 block into in the supporting groove 405 again, limit fagging 404 again, in sum, when moulding plastics, can avoid the pin to receive the compression deformation, and after moulding plastics is accomplished, can cut and bend the pin immediately, accomplish the separation of chip and frame, retrench the processing procedure.
Referring to fig. 1-2 and fig. 4-7, the ejector assembly 3 includes a top plate 301, an ejector rod 302 and a sliding block 303, the lower portion of the lower die cavity 2 is connected with the top plate 301 in a clamping manner, the ejector rod 302 is fixedly connected below the top plate 301, the sliding block 303 is symmetrically and fixedly connected around the other end of the ejector rod 302, the ejector assembly 3 further includes a sleeve 304 and a chute 305, the sleeve 304 is sleeved on the outer side of the other end of the ejector rod 302, the chute 305 is symmetrically arranged on the four sides of the sleeve 304, and the sliding block 303 is slidably connected with the sleeve 304 through the chute 305;
the method specifically comprises the following steps that in the injection molding process, a top plate 301 can seal a lower die cavity 2 to avoid material leakage, when a lifting rod 7 drives a bottom plate 8 to descend, a sliding block 303 can slide on a sleeve 304 through a sliding groove 305 to avoid a push rod 302 from obstructing the bottom plate 8 to descend through the sleeve 304, when the lifting rod 7 drives the bottom plate 8 to ascend after machining is finished, a plug plate 1403 can be driven by the bottom plate 8 through a connecting rod 1404 to move upwards in an air cavity 1402, so that a cavity in the air cavity 1402 is extruded into an upper die cavity 12, a package is extruded from the upper die cavity 12 to avoid adhesion between the package and the wall of the upper die cavity 12, meanwhile, the bottom plate 8 drives the sleeve 304 to ascend, and when the sliding block 303 moves to the lowest end of the sliding groove 305, the sleeve 304 can drive the push rod 302 to slide in a base 1 through the sliding groove 305, so that the package is ejected out of the lower die cavity 2 through the top plate 301 to facilitate unloading the package.
In summary, when the integrated circuit chip package manufacturing apparatus is used, firstly, the frame connected with the chip is placed on the base 1, the chip is located in the center of the lower die cavity 2, then the lifting rod 7 drives the bottom plate 8 to descend, the sealing plate 1502 is pressed on the supporting plate 404, the sealing plate 1502 cooperates with the supporting plate 404 to seal between the upper die cavity 12 and the lower die cavity 2, material leakage is avoided during injection molding, then the lifting rod 7 drives the bottom plate 8 to continuously descend, the upper die cavity 12 and the lower die cavity 2 are closed to form a complete cavity, material is injected into the upper die cavity 12 and the lower die cavity 2 from the feeding pipe 9 through the feeding pipe 9, meanwhile, the lifting rod 7 drives the bottom plate 8 to continuously descend, the pressure spring 10 and the top spring 1503 are compressed, the pressing plate drives the plug plate 1403 to move downwards in the air cavity 1402 through the connecting rod 1404, air in the cavity is pumped out, the material is accelerated to enter and exhaust air bubbles in the material under the action of negative pressure, the quality after packaging and molding is ensured, in the process of descending the bottom plate 8, the bottom plate 8 can drive the feeding pipe 9 to slide in the feeding pipe 13, the material can be ensured to continuously enter the cavity, during injection molding, the supporting plate 402 can support the supporting plate 404 through the supporting groove 405, the deformation of the sealing plate 1502 caused by the pressing of pins by the supporting plate 404 is avoided, the packaging and cooling molding is carried out, the lifting rod 7 can drive the bottom plate 8 to descend again, the pressure spring 10 and the top spring 1503 are compressed again, the bottom plate 8 drives the cutter 1504 to cut off the connection part of the pins and the frame, after the cutting is completed, the cutter 1504 can press the supporting plate 404 to displace in the sliding cavity 401 along with the continuous descending of the bottom plate 8, the supporting plate 402 is separated from the supporting groove 405, the supporting plate 1502 can press the supporting plate 404 to slide in the sliding cavity 401 under the action of the top spring 1503, and the spring 403 is compressed, the sealing plate 1502 is matched with the supporting plate 404 to bend pins, after bending is completed, the lifting rod 7 drives the bottom plate 8 to rebound, the sealing plate 1502 can be pulled out of the sliding cavity 401, then the spring 403 can drive the supporting plate 404 to rebound, the supporting plate 402 is clamped into the supporting groove 405 again, the supporting plate 404 is limited again, in the injection molding process, the top plate 301 can seal the lower die cavity 2 to avoid material leakage, when the lifting rod 7 drives the bottom plate 8 to descend, the sliding block 303 can slide on the sleeve 304 through the sliding groove 305 to avoid the ejector rod 302 from obstructing the descending of the bottom plate 8 through the sleeve 304, after processing is completed, when the lifting rod 7 drives the bottom plate 8 to ascend, the plug plate 1403 can be driven by the bottom plate 8 through the connecting rod 1404 to move upwards in the air cavity 1402, so that the cavity in the air cavity 1402 is extruded into the upper die cavity 12, the package is extruded out of the upper die cavity 12, adhesion between the package and the wall of the upper die cavity 12 is avoided, meanwhile, when the sliding block 303 moves to the lowest end of the sliding groove 305, the sleeve 304 can slide in the base 1 through the sliding groove 305, the ejector rod 302 can slide in the base 1, and the top plate 301 can be conveniently unloaded by the ejector rod 301, and the top plate 2 can be conveniently unloaded.
The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (10)
1. The utility model provides an integrated circuit chip encapsulation manufacture equipment, its characterized in that, includes base (1) and presses and cuts subassembly (15), die cavity (2) down have been seted up to base (1) upper surface symmetry, and die cavity (2) below is provided with liftout subassembly (3) down, die cavity (2) symmetry all around is provided with subassembly (4) of bending down, base (1) four corners symmetry fixedly connected with branch (5), and branch (5) upper end fixedly connected with crossbeam (6), crossbeam (6) below symmetry fixedly connected with lifter (7), and lifter (7) below fixedly connected with bottom plate (8), bottom plate (8) middle part fixedly connected with filling tube (9), and bottom plate (8) below symmetry fixedly connected with pressure spring (10), pressure spring (10) below fixedly connected with mould (11), and mould cavity (11) lower part are provided with mould cavity (12) down, mould cavity (12) top central authorities are connected with inlet pipe (13), and go up mould cavity (12) top symmetry and are provided with bleed subassembly (14), press and cut subassembly (15) to set up in on symmetry all around.
2. An integrated circuit chip package manufacturing apparatus according to claim 1, wherein the feeding pipe (13) is sleeved outside the feeding pipe (9), and the die (11) is slidably connected with the base plate (8) through the compression spring (10).
3. The integrated circuit chip package manufacturing apparatus according to claim 1, wherein the ejector assembly (3) comprises a top plate (301), an ejector rod (302) and a slider (303), the top plate (301) is connected to the lower portion of the lower die cavity (2) in a clamping manner, the ejector rod (302) is fixedly connected to the lower portion of the top plate (301), and the slider (303) is symmetrically and fixedly connected to the periphery of the other end of the ejector rod (302).
4. An integrated circuit chip package manufacturing apparatus according to claim 3, wherein the ejector assembly (3) further comprises a sleeve (304) and a chute (305), the sleeve (304) is sleeved on the outer side of the other end of the ejector rod (302), the chute (305) is symmetrically arranged on the four sides of the sleeve (304), and the slider (303) is slidably connected with the sleeve (304) through the chute (305).
5. The integrated circuit chip package manufacturing equipment according to claim 1, wherein the bending component (4) comprises a sliding cavity (401), a support plate (402) and a spring (403), the sliding cavity (401) is symmetrically formed around the lower die cavity (2), the support plate (402) is fixedly connected to the side wall of the sliding cavity (401), and the spring (403) is fixedly connected to the inside of the sliding cavity (401).
6. The integrated circuit chip package manufacturing apparatus according to claim 5, wherein the bending component (4) further comprises a supporting plate (404) and a supporting groove (405), the supporting plate (404) is disposed at the upper end of the spring (403), the supporting groove (405) is disposed on the side wall of the supporting plate (404), the supporting plate (402) is slidably connected with the supporting plate (404) through the supporting groove (405) in a clamping manner, and the supporting plate (404) is elastically connected with the sliding cavity (401) through the spring (403).
7. The integrated circuit chip package manufacturing apparatus according to claim 1, wherein the air extraction assembly (14) comprises an air channel (1401) and an air cavity (1402), the air channel (1401) is symmetrically arranged on the left and right sides above the upper die cavity (12), and the other end of the air channel (1401) is connected with the air cavity (1402).
8. The integrated circuit chip package manufacturing apparatus according to claim 7, wherein the air extraction assembly (14) further comprises a plug board (1403) and a connecting rod (1404), the plug board (1403) is disposed in the air cavity (1402) in a fitting manner, the connecting rod (1404) is fixedly connected above the plug board (1403), the connecting rod (1404) is fixedly connected with the bottom plate (8), and the plug board (1403) is slidably connected with the air cavity (1402).
9. The integrated circuit chip package manufacturing apparatus according to claim 1, wherein the pressing and cutting assembly (15) includes a through groove (1501) and a sealing plate (1502), the through groove (1501) is symmetrically disposed around the upper die cavity (12), the sealing plate (1502) is connected in a clamping manner in the through groove (1501), the sealing plate (1502) and the through groove (1501) are both in a convex shape, the sealing plate (1502) is slidably connected with the die (11) through the through groove (1501), and the sealing plates (1502) are tightly attached to each other.
10. The integrated circuit chip package manufacturing apparatus of claim 9, wherein the pressing and cutting assembly (15) further includes a top spring (1503) and a cutter (1504), the top spring (1503) is fixedly connected to the sealing plate (1502), the cutter (1504) is attached to a side, away from the upper die cavity (12), of the sealing plate (1502), the cutter (1504) and the top spring (1503) are fixedly connected to the bottom plate (8), and the sealing plate (1502) is elastically connected to the bottom plate (8) through the top spring (1503).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311600888.8A CN117584361A (en) | 2023-11-28 | 2023-11-28 | Integrated circuit chip package manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311600888.8A CN117584361A (en) | 2023-11-28 | 2023-11-28 | Integrated circuit chip package manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117584361A true CN117584361A (en) | 2024-02-23 |
Family
ID=89912920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311600888.8A Pending CN117584361A (en) | 2023-11-28 | 2023-11-28 | Integrated circuit chip package manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117584361A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117772979A (en) * | 2024-02-26 | 2024-03-29 | 溧阳市金昆锻压有限公司 | Anti-offset axle bridge forging method and equipment |
-
2023
- 2023-11-28 CN CN202311600888.8A patent/CN117584361A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117772979A (en) * | 2024-02-26 | 2024-03-29 | 溧阳市金昆锻压有限公司 | Anti-offset axle bridge forging method and equipment |
| CN117772979B (en) * | 2024-02-26 | 2024-05-28 | 溧阳市金昆锻压有限公司 | Anti-offset axle bridge forging method and equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6770236B2 (en) | Method of resin molding | |
| CN117584361A (en) | Integrated circuit chip package manufacturing equipment | |
| KR20190017684A (en) | Resin molding product transportation device, resin molding device and method for preparing resin molding product | |
| CN213350481U (en) | Stamping die for step-shaped forming | |
| US8011917B2 (en) | Compression molding of an electronic device | |
| CN211662289U (en) | Upper and lower powder forming die carrier of servo press | |
| JP3999909B2 (en) | Resin sealing device and sealing method | |
| KR101801977B1 (en) | Injection molding apparatus and method for injection molding | |
| CN206937956U (en) | A kind of automated production equipment of hot-water bottle | |
| CN111112495A (en) | Flexible forming method and forming die for pins of SOT integrated circuit packaging products | |
| CN114571664B (en) | Flash removing device and method for semiconductor chip packaging | |
| CN212093897U (en) | Door frame hydraulic press | |
| JPS6294312A (en) | Mold | |
| CN218286539U (en) | Die with ejection mechanism for processing LED lamp | |
| CN118156216B (en) | Device and method for QFP packaging chip | |
| CN218429631U (en) | Intelligent manufacturing equipment and processing die for manufacturing ice compress device | |
| CN219947031U (en) | Automatic injection molding equipment for plug inner frame | |
| CN210877241U (en) | Discharge mechanism with reset function and punching machine thereof | |
| CN221392027U (en) | Novel motor cover injection molding die | |
| CN215266214U (en) | Semiconductor plastic package mold capable of preventing glue overflow | |
| CN214773465U (en) | Double-layer compression molding device | |
| CN213443373U (en) | Hot press unit is used in blister pack processing | |
| CN215279514U (en) | Stamping die who punches buckles | |
| CN216902803U (en) | QFN (quad Flat No lead) packaging mold | |
| CN218083948U (en) | Injection mold with ejection mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |