CN115985811A - Manufacturing equipment and manufacturing process of DFN semiconductor device for electronic product - Google Patents
Manufacturing equipment and manufacturing process of DFN semiconductor device for electronic product Download PDFInfo
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- CN115985811A CN115985811A CN202211591142.0A CN202211591142A CN115985811A CN 115985811 A CN115985811 A CN 115985811A CN 202211591142 A CN202211591142 A CN 202211591142A CN 115985811 A CN115985811 A CN 115985811A
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Abstract
The invention relates to the technical field of semiconductor device manufacturing, and discloses manufacturing equipment of a DFN semiconductor device for an electronic product. The invention can conveniently and finely amplify the pins of the semiconductor device locally and accurately detect whether the semiconductor device is inclined or the pins are lack by arranging the detection device at the top of the conveying device, thereby improving the detection quality of the semiconductor device.
Description
Technical Field
The invention relates to the technical field of semiconductor device manufacturing, in particular to manufacturing equipment and a manufacturing process of a DFN semiconductor device for an electronic product.
Background
The semiconductor device is an electronic device which has conductivity between a good conductor and an insulator and performs a specific function by using the special electrical characteristics of a semiconductor material, and can be used for generating, controlling, receiving, converting, amplifying a signal and performing energy conversion.
When the DFN semiconductor device is manufactured, manufacturing equipment of the DFN semiconductor device is needed, the manufacturing equipment comprises detection equipment after the DFN semiconductor device is manufactured, so that whether the DFN semiconductor device meets the manufacturing qualified standard or not can be detected, and the defect and defective products are prevented from flowing into the market.
However, when the existing DFN semiconductor device manufacturing and production detection equipment is used, the following problems still exist: the pin of the semiconductor device is inconvenient to be amplified and carefully detected, so that whether the semiconductor device is inclined or the pin is lack cannot be accurately identified, and meanwhile, the continuity of the semiconductor device is inconvenient to be automatically detected, so that the detection efficiency of the semiconductor device is inconvenient to be improved.
Disclosure of Invention
An object of the present invention is to provide a manufacturing apparatus and a manufacturing process of a DFN semiconductor device for electronic products, which solve the problems of the background art mentioned above.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a DFN semiconductor device's manufacture equipment for electronic product, includes detection device, conveyer, conveyor and handling device, conveyer's rotation is installed at conveyer's upper surface center, detection device fixed mounting just is located conveyer's top center at conveyer's upper surface, handling device fixed mounting just is located detection device's top center at conveyer's upper surface, detection device's inside fixed mounting has the support frame, the upper surface front end fixed mounting of support frame has the camera, the front end of support frame just is located the equal fixed mounting in both sides of camera and has the display, the upper surface rear end fixed mounting of support frame has a driving motor, a driving motor's bottom center fixed connection has drive gear.
Preferably, a turntable is fixedly mounted inside the transportation device, a rotating shaft is welded at the center of the turntable, first plunger type air cylinders are uniformly and fixedly mounted at the edge of the center of the inside of the turntable, limiting sliding grooves are uniformly formed in the upper surface of the turntable, a feeding bottom plate is connected to the inside of the limiting sliding grooves in a sliding and clamping mode, and tooth grooves are uniformly formed in the periphery of the turntable.
Preferably, conveyor's inside fixed mounting has the support base, the top center welding of supporting the base has the support chassis, the marginal surface fixed mounting who supports the chassis has second conveyor, the upper surface that supports the chassis and be located second conveyor's opposite face fixed mounting has first conveyer belt, the bottom fixed mounting who supports the surface of base and be located first conveyer belt has the collecting vat.
Preferably, the inside fixed mounting of handling device has spacing frame, the joint threaded rod is rotated to spacing frame's upper portion surface, spacing frame's front end surface fixed mounting has second driving motor, the equal fixed mounting in front end surface of threaded rod and second driving motor has drive sprocket, drive sprocket's surface mesh is connected with drive chain, spacing frame's upper portion surface slidable mounting has second plunger type cylinder, the bottom fixedly connected with crossbeam of second plunger type cylinder, the equal fixed mounting in bottom both ends of crossbeam has the sucking disc.
Preferably, first driving motor passes through drive gear and is connected with the tooth's socket meshing of carousel surface, the camera aligns with the upper surface center of spacing spout, the carousel rotates the joint through pivot and the top surface center that supports the chassis.
Preferably, the cross beam is movably aligned with the feeding bottom plate on the upper surface of the rotary table through suckers at two ends of the bottom, the second plunger type cylinder is in threaded connection with the threaded rod on the outer surface of the limiting frame, one end of the first plunger type cylinder penetrates through the limiting sliding groove and is fixedly connected with the outer surface of the feeding bottom plate, and the bottom end of the limiting frame is fixedly connected with the outer surface of the supporting base.
Preferably, a support rod is fixedly mounted inside the camera, and the rear end face of the support rod is uniformly inserted with an insertion column in a sliding manner.
Preferably, the outer surface of the inserting column is provided with a clamping groove, the rear end face of the inserting column is fixedly connected with a connecting block, the bottom rear end of the connecting block is fixedly provided with a shooting lens, and the rear end of the supporting rod is fixedly provided with a limiting frame.
Preferably, the inside sliding clamping of spacing frame has the location cardboard, the surface center fixedly connected with pull ring of location cardboard, the inside symmetry of spacing frame has cup jointed the tension spring, the location cardboard runs through the bracing piece and pegs graft the joint groove joint of post surface.
A manufacturing process of manufacturing equipment of a DFN semiconductor device for an electronic product, comprising the steps of:
s1, uniformly placing the semiconductor devices on the upper surface of a second conveying device, so that the semiconductor devices are conveyed to the edge of a conveying device and wait to be conveyed;
s2, simultaneously starting a second driving motor to drive a second plunger type air cylinder to transversely slide through a threaded rod, simultaneously driving a sucker to synchronously slide through a cross beam by the second plunger type air cylinder until the sucker moves to the upper surface of the semiconductor device on the upper surface of a second conveying device, simultaneously controlling the second plunger type air cylinder to descend until the sucker descends and adsorbs the upper surface of the semiconductor device, and simultaneously controlling the second plunger type air cylinder to ascend so as to drive the semiconductor device to synchronously ascend, and then continuously controlling the second driving motor to rotate and operate so as to enable the sucker to drive the semiconductor device to move until the semiconductor device is moved to the upper surface of a feeding bottom plate, and then controlling the second plunger type air cylinder to descend so as to enable the sucker to clamp the semiconductor device in the feeding bottom plate, so that the semiconductor device is conveyed;
s3, when a new semiconductor device is conveyed into the feeding bottom plate on the upper surface of the conveying device, the first driving motor is started to drive the rotary table to rotate through the driving gear on the bottom, the rotary table can carry out circumferential conveying on the semiconductor device on the upper surface until the semiconductor device is conveyed to the position right below the camera, and therefore the camera can conveniently carry out identification detection on the semiconductor device;
s4, after the camera detects the semiconductor device below, whether the pins of the semiconductor device are qualified or not can be judged, when the semiconductor device is qualified, the transportation device can be continuously controlled to rotate, the next group of semiconductor devices can be detected, and when the semiconductor device is unqualified, the first plunger type air cylinder can automatically run to push the feeding bottom plate to transversely slide in the limiting sliding groove, so that the feeding bottom plate conveys the semiconductor device to be separated from the inside of the transportation device.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the reciprocating sliding of the second plunger type air cylinder can be controlled by controlling the forward and reverse rotation operation of the threaded rod, and meanwhile, two groups of suckers can be used for synchronously feeding and discharging two groups of semiconductor devices, so that the continuous intermittent rotation operation of the conveying device is ensured, and meanwhile, the conveying device rotates to convey the semiconductor devices to the bottom of the camera for detection, so that the continuity detection can be carried out on the semiconductor devices.
2. According to the invention, the detection device is arranged at the top of the conveying device, so that the pins of the semiconductor device can be conveniently and locally amplified in a meticulous manner, and whether the semiconductor device is inclined or is lack of pins can be accurately detected, thereby improving the detection quality of the semiconductor device.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a front perspective view of a main body according to the present invention;
FIG. 2 is a perspective view of the main body of the present invention;
FIG. 3 is a perspective view of the main body of the present invention;
FIG. 4 is a perspective view of the front view of the inspection device of the present invention;
FIG. 5 is a perspective view of the rear view of the inspection device of the present invention;
FIG. 6 is a front perspective view of the transporter of the present invention;
FIG. 7 is a perspective view of the front of the conveyor of the present invention;
FIG. 8 is a perspective view of the carrying device of the present invention;
FIG. 9 is a rear perspective expanded view of the second embodiment of the camera device of the present invention;
fig. 10 is a perspective view of a second embodiment a of the present invention with a partially enlarged view.
In the figure: the device comprises a detection device 1, a transport device 2, a conveying device 3, a carrying device 4, a camera 5, a support frame 6, a first driving motor 7, a display 8, a driving gear 9, a feeding bottom plate 10, a limiting sliding groove 11, a first plunger type air cylinder 12, a turntable 13, a rotating shaft 14, a tooth groove 15, a first conveying belt 16, a supporting chassis 17, a second conveying device 18, a supporting base 19, a collecting tank 20, a second driving motor 21, a transmission chain 22, a transmission chain wheel 23, a second plunger type air cylinder 24, a threaded rod 25, a limiting frame 26, a suction disc 27, a beam 28, a plug column 29, a support rod 30, a clamping groove 31, a shooting lens 32, a connecting block 33, a positioning clamping plate 34, a pull ring 35, a limiting frame 36 and a tensioning spring 37.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the application herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is further described below with reference to the accompanying drawings.
Example 1
Referring to fig. 1, 4 and 5, an embodiment of the present invention is shown: the utility model provides a manufacturing equipment of DFN semiconductor device for electronic product, including detection device 1, conveyer 2, conveyor 3 and handling device 4, conveyor 2's rotation is installed at conveyor 3's upper surface center, 1 fixed mounting of detection device just is located conveyor 2's top center at conveyor 3's upper surface, handling device 4 fixed mounting is at conveyor 3's upper surface and is located detection device 1's top center, detection device 1's inside fixed mounting has support frame 6, the upper surface front end fixed mounting of support frame 6 has camera 5, the equal fixed mounting in both sides that the front end of support frame 6 just is located camera 5 has display 8, the upper surface rear end fixed mounting of support frame 6 has first driving motor 7, the bottom center fixed connection of first driving motor 7 has drive gear 9.
Referring to fig. 6, a rotating disc 13 is fixedly installed inside the transportation device 2, a rotating shaft 14 is welded at the center of the rotating disc 13, first plunger type cylinders 12 are uniformly and fixedly installed at the edge of the inner center of the rotating disc 13, limiting sliding grooves 11 are uniformly formed in the upper surface of the rotating disc 13, a feeding bottom plate 10 is slidably clamped inside the limiting sliding grooves 11, and tooth sockets 15 are uniformly formed in one periphery of the rotating disc 13.
Referring to fig. 7, a supporting base 19 is fixedly installed inside the conveying device 3, a supporting chassis 17 is welded at the top center of the supporting base 19, a second conveying device 18 is fixedly installed on the outer surface of the edge of the supporting chassis 17, a first conveying belt 16 is fixedly installed on the upper surface of the supporting chassis 17 and located on the opposite surface of the second conveying device 18, and a collecting tank 20 is fixedly installed on the outer surface of the supporting base 19 and located at the bottom of the first conveying belt 16.
Referring to fig. 8, a limiting frame 26 is fixedly mounted inside the carrying device 4, a threaded rod 25 is rotatably clamped on the outer surface of the upper portion of the limiting frame 26, a second driving motor 21 is fixedly mounted on the outer surface of the front end of the limiting frame 26, transmission chain wheels 23 are fixedly mounted on the outer surfaces of the front ends of the threaded rod 25 and the second driving motor 21, transmission chains 22 are meshed and connected to the outer surfaces of the transmission chain wheels 23, a second plunger type cylinder 24 is slidably mounted on the outer surface of the upper portion of the limiting frame 26, a cross beam 28 is fixedly connected to the bottom end of the second plunger type cylinder 24, and suckers 27 are fixedly mounted at both ends of the bottom of the cross beam 28.
The first driving motor 7 is meshed with a tooth groove 15 on the outer surface of a rotary table 13 through a driving gear 9, the camera 5 is aligned with the center of the upper surface of a limiting sliding groove 11, the rotary table 13 is rotationally clamped with the center of the top surface of a supporting chassis 17 through a rotating shaft 14, a cross beam 28 is movably aligned with a feeding bottom plate 10 on the upper surface of the rotary table 13 through sucking discs 27 at two ends of the bottom, so that semiconductor devices are accurately adsorbed and conveyed, a second plunger type cylinder 24 is in threaded connection with a threaded rod 25 on the outer surface of a limiting frame 26, one end of a first plunger type cylinder 12 penetrates through the limiting sliding groove 11 to be fixedly connected with the outer surface of the feeding bottom plate 10, so that the feeding bottom plate 10 can be controlled to convey unqualified semiconductor devices, the bottom end of the limiting frame 26 is fixedly connected with the outer surface of a supporting base 19, and the stability of reciprocating sliding of the second plunger type cylinder 24 can be guaranteed.
A manufacturing process of manufacturing equipment of a DFN semiconductor device for an electronic product, comprising the steps of:
s1, uniformly placing the semiconductor devices on the upper surface of a second conveying device 18, so that the semiconductor devices are conveyed to the edge of a conveying device 2 and wait to be conveyed;
s2, simultaneously starting the second driving motor 21 to drive the second plunger type air cylinder 24 to transversely slide through the threaded rod 25, simultaneously enabling the second plunger type air cylinder 24 to drive the sucker 27 to synchronously slide through the cross beam 28 until the sucker 27 moves to the upper surface of the semiconductor device on the upper surface of the second conveying device 18, simultaneously controlling the second plunger type air cylinder 24 to descend until the sucker 27 descends to be adsorbed to the upper surface of the semiconductor device, simultaneously controlling the second plunger type air cylinder 24 to ascend to drive the semiconductor device to synchronously ascend, and then continuously controlling the rotation operation of the second driving motor 21 so as to enable the sucker 27 to drive the semiconductor device to move until the semiconductor device is conveyed to the upper surface of the feeding bottom plate 10, and then controlling the second plunger type air cylinder 24 to descend to operate so as to enable the sucker 27 to clamp the semiconductor device inside the feeding bottom plate 10 and finish conveying of the semiconductor device, wherein when the semiconductor device is conveyed by the two groups of suckers 27, the semiconductor device detected inside the feeding bottom plate 10 is conveyed to the upper surface of the first conveying belt 16 so as to convey and collect the detected semiconductor device;
s3, when a new semiconductor device is conveyed into the feeding bottom plate 10 on the upper surface of the conveying device 2, the first driving motor 7 is started to drive the rotary table 13 to rotate through the driving gear 9 at the bottom, the rotary table 13 can carry out circumferential conveying on the semiconductor device on the upper surface until the semiconductor device is conveyed to the position right below the camera 5, and therefore the camera 5 can conveniently carry out identification detection on the semiconductor device;
and S4, after the camera 5 detects the semiconductor device below, whether the pins of the semiconductor device are qualified or not is judged, when the semiconductor device is qualified, the transportation device 2 is continuously controlled to rotate, the next group of semiconductor devices are detected, and when the semiconductor device is unqualified, the first plunger type air cylinder 12 automatically operates to push the feeding bottom plate 10 to transversely slide in the limiting sliding groove 11, so that the feeding bottom plate 10 conveys the semiconductor device to be separated from the inside of the transportation device 2.
Working principle of example 1: the semiconductor devices are uniformly placed on the upper surface of the second conveying device 18, so that the operating second conveying device 18 can convey the semiconductor devices and convey the semiconductor devices to the peripheral edge of the conveying device 2, wherein the second conveying device 18 is driven by a stepping motor to rotate, so that the second conveying device 18 can perform adaptive operation along with the displacement of the cross beam 28, and the semiconductor devices are enabled to wait for being adsorbed and conveyed by the suction cups 27 on the upper surface of the second conveying device 18, meanwhile, the second driving motor 21 is started to drive the threaded rod 25 to synchronously rotate through the transmission chain 22, the rotation of the threaded rod 25 can drive the second plunger type air cylinder 24 to transversely slide on the outer surface of the top of the limiting frame 26, and meanwhile, the second plunger type air cylinder 24 can drive the two groups of suction cups 27 at the bottom to synchronously slide through the cross beam 28, until one group of suction cups 27 is moved to the upper surface of the semiconductor device above the second conveying device 18, the second plunger type air cylinder 24 is controlled to extend and operate, meanwhile, the bottom end of the second plunger type air cylinder 24 can drive the cross beam 28 to descend synchronously, the cross beam 28 can drive the suction cups 27 at the bottom to descend to be adsorbed on the upper surface of the semiconductor device, then the second plunger type air cylinder 24 is controlled to retract and operate, so that the cross beam 28 drives the semiconductor device to ascend synchronously through the suction cups 27, then the second driving motor 21 is controlled to rotate reversely to operate, meanwhile, the second plunger type air cylinder 24 can slide reversely on the upper surface of the limiting frame 26, the suction cups 27 can drive the semiconductor device to move synchronously until the semiconductor device is conveyed to the upper surface of the feeding bottom plate 10, then the second plunger type air cylinder 24 is controlled to extend and operate downwards, so that the cross beam 28 descends to clamp the semiconductor device in the feeding bottom plate 10 through the suction cups 27, thereby completing the transportation of the semiconductor device, and simultaneously, in the process of synchronously moving another group of suckers 27, completing the transportation of the semiconductor device which is detected inside the feeding bottom plate 10 at the opposite position to the upper surface of the first conveyor belt 16, thereby synchronously feeding, conveying and collecting the detected semiconductor device, wherein when a new semiconductor device is transported to the inside of the feeding bottom plate 10 at the upper surface of the transporting device 2, the first driving motor 7 is started to drive the rotary table 13 to rotate through the driving gear 9 at the bottom, and the rotary table 13 can circumferentially convey the semiconductor device at the upper surface until the semiconductor device is conveyed to the position right below the camera 5, thereby facilitating the camera 5 to identify and detect the semiconductor device, and simultaneously synchronizing the shot picture to the display 8 for detection, thereby amplifying the condition of the pin position of the semiconductor device, after the camera 5 detects the semiconductor device below, whether the pin of the semiconductor device is qualified or not can be judged, when the semiconductor device is qualified, the transportation device 2 can be continuously controlled to rotate, and the next group of semiconductor devices can be detected, when the detected semiconductor device is unqualified, the system can control the first plunger type air cylinder 12 to automatically run to push the feeding bottom plate 10 to transversely slide in the limiting chute 11, so that the feeding bottom plate 10 conveys the semiconductor device to be separated from the inside of the transportation device 2, the pin of the semiconductor device can be conveniently amplified by arranging the detection device 1 at the top of the transportation device 2, whether the semiconductor device is inclined or lack of the pin can be detected, the detection quality of the semiconductor device can be improved, and the carrying device 4 is arranged at the top of the transportation device 3, so that the semiconductor device can be automatically loaded and unloaded, meanwhile, the semiconductor device can be continuously and automatically detected conveniently, so that the detection efficiency of the semiconductor device is improved.
Example 2
On the basis of embodiment 1, as shown in fig. 9 to 10, a support rod 30 is fixedly installed inside the camera 5, a plug-in post 29 is inserted on a rear end surface of the support rod 30 in a uniform sliding manner, a clamping groove 31 is formed in an outer surface of the plug-in post 29, a connecting block 33 is fixedly connected to a rear end surface of the plug-in post 29, a shooting lens 32 is fixedly installed at a rear end of the bottom of the connecting block 33, a limiting frame 36 is fixedly installed on an outer surface of a rear end of the support rod 30, a positioning clamping plate 34 is clamped inside the limiting frame 36 in a sliding manner, a pull ring 35 is fixedly connected to a center of an outer surface of the positioning clamping plate 34, tension springs 37 are symmetrically sleeved inside the limiting frame 36, and the positioning clamping plate 34 penetrates through the support rod 30 and is clamped with the clamping groove 31 in the outer surface of the plug-in post 29.
When implementing this embodiment, drive the joint groove 31 separation of location cardboard 34 and the outer surface of grafting post 29 through pulling pull ring 35, location cardboard 34 can extrude the shrink of tension spring 37 simultaneously, then pulling connecting block 33 drives the transverse sliding of grafting post 29, connecting block 33 can drive shooting lens 32 synchronous motion simultaneously, and can enlarge the distance between connecting block 33 and the bracing piece 30, thereby be convenient for adjust the position of shooting lens 32 and shoot the different positions of semiconductor device, can focus on the local of semiconductor device surface as required simultaneously.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A manufacturing equipment of DFN semiconductor device for electronic product, including detection device (1), conveyer (2), conveyor (3) and handling device (4), the rotation of conveyer (2) is installed at the upper surface center of conveyer (3), detection device (1) fixed mounting is at the upper surface of conveyer (3) and is located the top center of conveyer (2), handling device (4) fixed mounting is at the upper surface of conveyer (3) and is located the top center of detection device (1), its characterized in that: the utility model discloses a camera, including detection device (1), the inside fixed mounting of detection device (1) has support frame (6), the upper surface front end fixed mounting of support frame (6) has camera (5), the front end of support frame (6) and the equal fixed mounting in both sides that are located camera (5) have display (8), the upper surface rear end fixed mounting of support frame (6) has a driving motor (7), the bottom center fixedly connected with drive gear (9) of a driving motor (7).
2. The manufacturing apparatus of a DFN semiconductor device for electronic products according to claim 1, wherein: the inside fixed mounting of conveyer (2) has carousel (13), the center welding of carousel (13) has pivot (14), the even fixed mounting in inside center edge of carousel (13) has first plunger type cylinder (12), spacing spout (11) have evenly been seted up to the upper surface of carousel (13), the inside slip joint of spacing spout (11) has pay-off bottom plate (10), tooth's socket (15) have evenly been seted up to peripheral a week of carousel (13).
3. The manufacturing apparatus of a DFN semiconductor device for electronic products according to claim 2, wherein: the inside fixed mounting of conveyor (3) has support base (19), the top center welding that supports base (19) has support chassis (17), the marginal fixed surface who supports chassis (17) installs second conveyor (18), the upper surface that supports chassis (17) and the facade fixed mounting that is located second conveyor (18) has first conveyer belt (16), the bottom fixed mounting that the surface that supports base (19) and is located first conveyer belt (16) has collecting vat (20).
4. The manufacturing apparatus of a DFN semiconductor device for electronic products according to claim 3, wherein: the inside fixed mounting of handling device (4) has spacing frame (26), the joint threaded rod (25) is rotated to the upper portion surface of spacing frame (26), the front end surface fixed mounting of spacing frame (26) has second driving motor (21), the equal fixed mounting of front end surface of threaded rod (25) and second driving motor (21) has drive sprocket (23), the surface engagement of drive sprocket (23) is connected with drive chain (22), the upper portion surface slidable mounting of spacing frame (26) has second plunger type cylinder (24), the bottom fixedly connected with crossbeam (28) of second plunger type cylinder (24), the equal fixed mounting in bottom both ends of crossbeam (28) has sucking disc (27).
5. The manufacturing apparatus of a DFN semiconductor device for electronic products according to claim 4, wherein: first driving motor (7) are connected through tooth's socket (15) meshing of drive gear (9) and carousel (13) surface, camera (5) align with the upper surface center of spacing spout (11), carousel (13) rotate the joint through pivot (14) and the top surface center that supports chassis (17).
6. The manufacturing apparatus of a DFN semiconductor device for electronic products according to claim 5, wherein: the cross beam (28) is movably aligned with the feeding bottom plate (10) on the upper surface of the rotary table (13) through the suction cups (27) at the two ends of the bottom.
7. The manufacturing apparatus of a DFN semiconductor device for electronic products according to claim 6, wherein: the second plunger type air cylinder (24) is in threaded connection with a threaded rod (25) on the outer surface of a limiting frame (26), and one end of the first plunger type air cylinder (12) penetrates through a limiting sliding groove (11) and is fixedly connected with the outer surface of the feeding bottom plate (10).
8. The manufacturing apparatus of a DFN semiconductor device for electronic products according to claim 7, wherein: the bottom end of the limiting frame (26) is fixedly connected with the outer surface of the supporting base (19).
9. The manufacturing apparatus of a DFN semiconductor device for electronic products according to claim 8, wherein: the utility model discloses a camera, including camera (5), the inside fixed mounting of camera (5) has bracing piece (30), the even slip grafting of rear end face of bracing piece (30) has grafting post (29), joint groove (31) have been seted up to the surface of grafting post (29), the rear end face fixedly connected with connecting block (33) of grafting post (29), the bottom rear end fixed mounting of connecting block (33) has shooting lens (32), the rear end fixed surface of bracing piece (30) installs spacing frame (36), the inside slip joint of spacing frame (36) has location cardboard (34), the outer surface center fixedly connected with pull ring (35) of location cardboard (34), the inside symmetry of spacing frame (36) has cup jointed tight spring (37), location cardboard (34) run through joint groove (31) the joint of bracing piece (30) and grafting post (29) surface.
10. A manufacturing process of a manufacturing apparatus of a DFN semiconductor device for electronic products using the manufacturing apparatus of the DFN semiconductor device for electronic products of any one of claims 1 to 9, comprising the steps of:
s1, uniformly placing the semiconductor devices on the upper surface of a second conveying device (18) so as to convey the semiconductor devices to the edge of a conveying device (2) and enable the semiconductor devices to wait to be conveyed;
s2, simultaneously starting a second driving motor (21) to drive a second plunger type air cylinder (24) to transversely slide through a threaded rod (25), simultaneously enabling the second plunger type air cylinder (24) to drive a sucker (27) to synchronously slide through a cross beam (28) until the sucker (27) moves to the upper surface of the semiconductor device on the upper surface of a second conveying device (18), simultaneously controlling the second plunger type air cylinder (24) to descend until the sucker (27) descends to adsorb to the upper surface of the semiconductor device, simultaneously controlling the second plunger type air cylinder (24) to ascend to drive the semiconductor device to synchronously ascend, then continuously controlling the rotating operation of the second driving motor (21), enabling the sucker (27) to drive the semiconductor device to move until the semiconductor device is conveyed to the upper surface of a feeding bottom plate (10), and then controlling the second plunger type air cylinder (24) to descend to enable the sucker (27) to clamp the semiconductor device in the feeding bottom plate (10) so as to finish conveying the conveying of the semiconductor device, wherein when two groups of suckers (27) convey the semiconductor device to the semiconductor device, the semiconductor device is conveyed to the first conveying belt (16) to finish the detection of the semiconductor device collection and the collection;
s3, when a new semiconductor device is conveyed into the feeding bottom plate (10) on the upper surface of the conveying device (2), the first driving motor (7) is started to drive the rotary table (13) to rotate through the driving gear (9) on the bottom, and the rotary table (13) can carry out circumferential conveying on the semiconductor device on the upper surface until the semiconductor device is conveyed to the position right below the camera (5), so that the camera (5) can conveniently identify and detect the semiconductor device;
s4, after the camera (5) detects the semiconductor device below, whether the pins of the semiconductor device are qualified or not can be judged, when the semiconductor device is qualified, the conveying device (2) can be continuously controlled to rotate, the next group of semiconductor devices can be detected, and when the semiconductor device is unqualified, the first plunger type air cylinder (12) can automatically run to push the feeding bottom plate (10) to transversely slide in the limiting sliding groove (11), so that the feeding bottom plate (10) conveys the semiconductor device to be separated from the inside of the conveying device (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211591142.0A CN115985811A (en) | 2022-12-12 | 2022-12-12 | Manufacturing equipment and manufacturing process of DFN semiconductor device for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211591142.0A CN115985811A (en) | 2022-12-12 | 2022-12-12 | Manufacturing equipment and manufacturing process of DFN semiconductor device for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115985811A true CN115985811A (en) | 2023-04-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211591142.0A Withdrawn CN115985811A (en) | 2022-12-12 | 2022-12-12 | Manufacturing equipment and manufacturing process of DFN semiconductor device for electronic product |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116779463A (en) * | 2023-07-13 | 2023-09-19 | 江苏富坤光电科技有限公司 | Optical semiconductor device and preparation method thereof |
| CN117637536A (en) * | 2023-11-09 | 2024-03-01 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
| CN118099070A (en) * | 2024-04-24 | 2024-05-28 | 陇芯微(西安)电子科技有限公司 | Full-automatic material equipment of sending out of semiconductor encapsulation suction nozzle |
| CN118315312A (en) * | 2024-06-07 | 2024-07-09 | 马丁科瑞半导体(浙江)有限公司 | Detection induction mechanism, conveying device and chip loader |
-
2022
- 2022-12-12 CN CN202211591142.0A patent/CN115985811A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116779463A (en) * | 2023-07-13 | 2023-09-19 | 江苏富坤光电科技有限公司 | Optical semiconductor device and preparation method thereof |
| CN116779463B (en) * | 2023-07-13 | 2023-12-12 | 江苏富坤光电科技有限公司 | Optical semiconductor device and preparation method thereof |
| CN117637536A (en) * | 2023-11-09 | 2024-03-01 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
| CN117637536B (en) * | 2023-11-09 | 2024-06-11 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
| CN118099070A (en) * | 2024-04-24 | 2024-05-28 | 陇芯微(西安)电子科技有限公司 | Full-automatic material equipment of sending out of semiconductor encapsulation suction nozzle |
| CN118099070B (en) * | 2024-04-24 | 2024-06-21 | 陇芯微(西安)电子科技有限公司 | Full-automatic material equipment of sending out of semiconductor encapsulation suction nozzle |
| CN118315312A (en) * | 2024-06-07 | 2024-07-09 | 马丁科瑞半导体(浙江)有限公司 | Detection induction mechanism, conveying device and chip loader |
| CN118315312B (en) * | 2024-06-07 | 2024-09-10 | 马丁科瑞半导体(浙江)有限公司 | Detection induction mechanism, conveying device and chip loader |
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Application publication date: 20230418 |
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