CN212322977U

CN212322977U - Pressing type integrated circuit board packaging equipment

Info

Publication number: CN212322977U
Application number: CN202021370369.9U
Authority: CN
Inventors: 唐瑞
Original assignee: Guizhou Fuji Shenwang Photoelectric Manufacturing Co ltd
Current assignee: Guizhou Fuji Shenwang Photoelectric Manufacturing Co ltd
Priority date: 2020-07-14
Filing date: 2020-07-14
Publication date: 2021-01-08
Anticipated expiration: 2030-07-14

Abstract

The utility model discloses a pressing type integrated circuit board packaging device, in particular to the field of packaging devices, which comprises a protective frame, a base, a packaging mold and a plurality of supporting columns, wherein the top ends of the supporting columns are fixedly provided with pop-up mechanisms; the pop-up mechanism comprises a workbench, a groove is formed in the workbench, a first sleeve is fixedly arranged at the top end of the base, a first spring is fixedly arranged at the bottom end of the first sleeve, a first round bar is fixedly arranged at the top end of the first spring, a transverse plate is fixedly arranged at the top end of the first round bar, second sliding grooves are formed in two side walls in the workbench, second sliding blocks are fixedly arranged on two sides of the transverse plate, and a fixing mechanism is fixedly arranged at the top end of the transverse plate. The utility model discloses a pop-up mechanism can pop out it between two risers after the integrated circuit board encapsulation, and easy operation is convenient, can help the staff to practice thrift more time, shortens process time, improves machining efficiency.

Description

Pressing type integrated circuit board packaging equipment

Technical Field

The embodiment of the utility model provides a relate to the encapsulation equipment field, concretely relates to press type integrated circuit board encapsulation equipment.

Background

The integrated circuit board is a carrier for loading integrated circuits, is mainly composed of silica gel, so the integrated circuit board is generally green, the integrated circuit board adopts a semiconductor manufacturing process, a plurality of transistors, resistors, capacitors and other components are manufactured on a smaller monocrystalline silicon chip, the components are combined into a complete electronic circuit according to a multilayer wiring or tunnel wiring method, and the packaging is a process for assembling the integrated circuit into a chip final product.

The prior art has the following defects: most of pressing type integrated circuit board encapsulation equipment's fixing device is fixed firm to integrated circuit board, and after the encapsulation, inconvenient taking out integrated circuit board, the manual work is taken out and can be wasted more time, leads to whole process time longer, and machining efficiency is low.

SUMMERY OF THE UTILITY MODEL

Therefore, the embodiment of the utility model provides a press type integrated circuit board encapsulation equipment, can pop out it between two risers after the integrated circuit board encapsulation through pop-up mechanism, easy operation is convenient, can help the staff to practice thrift more time, shorten process time, improve machining efficiency, because the fixing device of most press type integrated circuit board encapsulation equipment is fixed firm to integrated circuit board among the solution prior art, after leading to the encapsulation, inconvenient taking out integrated circuit board, the manual work is taken out and can be wasted more time, lead to whole process time longer, the problem that machining efficiency is low.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: a pressing type integrated circuit board packaging device comprises a protection frame, a base, a packaging mold and a plurality of support columns, wherein the protection frame is fixedly arranged at the top end of the protection frame, the support columns are fixedly arranged at the top end of the base, the support columns are arranged in the protection frame, the packaging mold is arranged in the protection frame, and pop-up mechanisms are fixedly arranged at the top ends of the support columns;

the pop-up mechanism comprises a workbench, the workbench is fixedly arranged on the top ends of a plurality of supporting columns, a groove is formed in the workbench, a first sleeve is fixedly arranged on the top end of the base, a first spring is fixedly arranged at the bottom end of the interior of the first sleeve, a first round rod is fixedly arranged on the top end of the first spring, the top end of the first round rod penetrates through the bottom end of the workbench and extends into the groove, a transverse plate is fixedly arranged on the top end of the first round rod and is arranged in the groove, second sliding grooves are formed in two side walls of the interior of the workbench and are communicated with the groove, second sliding blocks are fixedly arranged on two sides of the transverse plate and are respectively clamped in the two second sliding grooves, and a fixing mechanism is fixedly arranged on the top end of the transverse plate.

Further, fixed establishment includes two risers, two first sliders and two first spouts, two the riser all is established on the diaphragm top, two first slider top respectively with two riser bottom fixed connection, two first spout is all seted up at the diaphragm top, two first slider joint respectively is inside two first spouts.

And furthermore, two second round rods are arranged between the vertical plates, two cavities and four cavities are formed inside the second round rods, a second spring and four springs are fixedly arranged inside the cavities, one end of each second spring is fixedly provided with a third round rod, and one end of each third round rod extends out of the outer end of each second round rod and is fixedly connected with one side of each vertical plate.

Further, the inside top of base is fixed and is equipped with bamboo joint formula electric putter, bamboo joint formula electric putter bottom mounting is equipped with the fixed plate, packaging mold passes through threaded connection with the fixed plate, packaging mold establishes at the workstation top.

Furthermore, a plurality of positioning ribs are fixedly arranged at the bottom end of the fixing plate, and the plurality of positioning ribs are arranged on the periphery of the packaging mold.

Furthermore, a plurality of positioning holes are formed in the top end of the workbench, and the plurality of positioning holes correspond to the plurality of positioning ribs one to one.

Furthermore, a plurality of multi-section telescopic rods are fixedly arranged at the top end inside the protective frame, and the bottom ends of the multi-section telescopic rods are fixedly connected with the top end of the fixing plate.

Further, third chutes are formed in two side walls inside the protective frame, third sliding blocks are fixedly arranged on two sides of the fixing plate, and the third sliding blocks are connected inside the two third chutes in a clamped mode respectively.

The embodiment of the utility model provides a have following advantage:

the utility model discloses an initial position is resumeed to first spring utilization self elasticity, then first spring can be to first round bar and the ascending elastic action of diaphragm, and the integrated circuit board that the diaphragm top was placed can receive ascending elasticity to make it pop out between two risers, compare with prior art, can pop out it between two risers after the integrated circuit board encapsulation, easy operation is convenient, can help the staff to practice thrift more time, shortens process time, improves machining efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.

Fig. 1 is a schematic view of the overall structure provided by the present invention;

FIG. 2 is an enlarged view of the part A of FIG. 1 according to the present invention;

fig. 3 is a top view of the transverse plate provided by the present invention;

fig. 4 is a cross-sectional view of a second round bar provided by the present invention;

fig. 5 is a perspective view of a first sleeve provided by the present invention;

in the figure: the automatic positioning device comprises a protective frame 1, a base 2, a support column 3, a workbench 4, a groove 5, a first sleeve 6, a first spring 7, a first round rod 8, a transverse plate 9, a vertical plate 10, a second round rod 11, a second spring 12, a third round rod 13, a first slider 14, a first sliding groove 15, a second slider 16, a second sliding groove 17, a cavity 18, a bamboo joint type electric push rod 19, a fixing plate 20, a packaging mold 21, a positioning rib 22, a positioning hole 23 and a telescopic rod 24.

Detailed Description

The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5 in the specification, the press-type integrated circuit board packaging device of the embodiment includes a protection frame 1, a base 2, a packaging mold 21, and a plurality of support columns 3, where the protection frame 1 is fixedly disposed at a top end of the protection frame 1, the plurality of support columns 3 are all fixedly disposed at a top end of the base 2, the plurality of support columns 3 are all disposed inside the protection frame 1, the packaging mold 21 is disposed inside the protection frame 1, and top ends of the plurality of support columns 3 are fixedly disposed with an ejection mechanism;

the ejection mechanism comprises a workbench 4, the workbench 4 is fixedly arranged at the top ends of a plurality of supporting columns 3, a groove 5 is arranged in the workbench 4, a first sleeve 6 is fixedly arranged at the top end of the base 2, a first spring 7 is fixedly arranged at the bottom end inside the first sleeve 6, a first round rod 8 is fixedly arranged at the top end of the first spring 7, the top end of the first round bar 8 passes through the bottom end of the workbench 4 and extends into the groove 5, a transverse plate 9 is fixedly arranged at the top end of the first round bar 8, the transverse plate 9 is arranged inside the groove 5, the two side walls inside the workbench 4 are both provided with second sliding chutes 17, the two second sliding chutes 17 are communicated with the groove 5, diaphragm 9 both sides all are fixed and are equipped with second slider 16, two second slider 16 joint respectively inside two second spouts 17, diaphragm 9 top is fixed and is equipped with fixed establishment.

Further, fixed establishment includes two risers 10, two first sliders 14 and two first spouts 15, two riser 10 all establishes on diaphragm 9 top, two 14 top of first slider respectively with two riser 10 bottom fixed connection, two first spout 15 all sets up at diaphragm 9 top, two first slider 14 joint is inside two first spouts 15 respectively, conveniently with the integrated circuit board centre gripping between two risers 10.

Furtherly, two be equipped with two second pole 11 between the riser 10, two cavity 18, four have all been seted up to second pole 11 inside all fixed second spring 12, four of being equipped with of cavity 18 inside all the one end of second spring 12 is all fixed and is equipped with third pole 13, four third pole 13 one end all extends second pole 11 outer end and respectively with two riser 10 one side fixed connection, because two risers 10 and four third pole 13 one end are fixed, the one end of third pole 13 is connecting second spring 12, therefore the interval between two risers 10 can be transferred big, conveniently with the integrated circuit board centre gripping between two risers 10.

Further, the inside top of base 2 is fixed and is equipped with bamboo joint formula

electric putter

19, 19 bottom mounting of bamboo joint formula electric putter is equipped with fixed plate 20, packaging mold 21 passes through threaded connection with fixed plate 20, packaging mold 21 establishes at workstation 4 top, conveniently changes when damaging.

Further, fixed plate 20 bottom mounting is equipped with a plurality of location ribs 22, and is a plurality of location ribs 22 all establish at packaging mold 21 periphery, and location ribs 22 can the joint inside locating hole 23, prevent packaging mold 21 skew.

Furthermore, a plurality of locating holes 23 are opened at the top end of the working table 4, and a plurality of locating holes 23 correspond to the plurality of locating ribs 22 one by one, and the locating holes 23 can be clamped with the locating ribs 22 to prevent the package mold 21 from deviating.

Furthermore, a plurality of multi-section telescopic rods 24 are fixedly arranged at the top end inside the protective frame 1, the bottom ends of the multi-section telescopic rods 24 are fixedly connected with the top end of the fixing plate 20, and when the bamboo joint type electric push rod 19 pushes the fixing plate 20 to move, the multi-section telescopic rods 24 can play a balance role.

Further, the inside both sides wall of protective frame 1 has all seted up the third spout, fixed plate 20 both sides are all fixed and are equipped with the third slider, two the third slider joint is inside two third spouts respectively, and third slider and third spout move for fixed plate 20 and carry on spacingly.

The implementation scenario is specifically as follows: firstly, a worker manually stretches two vertical plates 10, one ends of the two vertical plates 10 and four third round rods 13 are fixed, one ends of the third round rods 13 are connected with second springs 12, so that the interval between the two vertical plates 10 can be adjusted, an integrated circuit board is placed between the two vertical plates 10, then the two vertical plates 10 clamp the integrated circuit board between the two vertical plates 10 under the elastic action of the second springs 12, then a bamboo-joint-type electric push rod 19 is started, the bamboo-joint-type electric push rod 19 drives a fixing plate 20 and a packaging mold 21 to move together when working, at the moment, a third sliding groove and a third sliding block play a limiting role in moving the fixing plate 20, when the packaging mold 21 abuts against the integrated circuit board, the transverse plate 9 is pressed to move towards the bottom of the groove 5, at the moment, the second sliding block 16 and the second sliding groove 17 can limit the transverse plate 9 in moving, the positioning ribs 22 are clamped inside the positioning holes 23, the positioning ribs 22 and the positioning holes 23 position the fixing plate 20 to prevent deviation, when the bottom end of the transverse plate 9 contacts the bottom end of the groove 5, the integrated circuit board can be packaged, the first spring 7 is in a compressed state, after the packaging is finished, the bamboo joint type electric push rod 19 drives the fixing plate 20 and the packaging mold 21 to move upwards, the first spring 7 can restore the initial position by utilizing the elastic force of the first spring, the first spring 7 can have an upward elastic action on the first round rod 8 and the transverse plate 9, the integrated circuit board placed at the top end of the transverse plate 9 can be subjected to the upward elastic force, so that the integrated circuit board is ejected out between the two vertical plates 10, and at the moment, a worker can store the integrated circuit board well, the integrated circuit board can be ejected out between the two vertical plates 10 by the ejection mechanism after the packaging of the integrated circuit board is finished, the integrated circuit board packaging device has the advantages that the operation is simple and convenient, more time can be saved for workers, the processing time is shortened, the processing efficiency is improved, the fixing device for most of pressing type integrated circuit board packaging devices in the prior art is fixed and firm to the integrated circuit board, after the packaging is finished, the integrated circuit board is inconvenient to take out, more time can be wasted due to manual taking out, and the problems of long whole processing time and low processing efficiency are solved.

Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims

1. The utility model provides a press type integrated circuit board encapsulation equipment, includes protective frame (1), base (2), packaging mold (21) and a plurality of support column (3), protective frame (1) is fixed to be established on protective frame (1) top, and is a plurality of support column (3) are all fixed to be established on base (2) top, and are a plurality of inside protective frame (1) is all established in support column (3), inside protective frame (1), its characterized in that is established in packaging mold (21): the top ends of the support columns (3) are fixedly provided with ejection mechanisms;

the popping mechanism comprises a workbench (4), the workbench (4) is fixedly arranged at the top ends of a plurality of supporting columns (3), a groove (5) is formed in the workbench (4), a first sleeve (6) is fixedly arranged at the top end of the base (2), a first spring (7) is fixedly arranged at the bottom end in the first sleeve (6), a first round rod (8) is fixedly arranged at the top end of the first spring (7), the top end of the first round rod (8) penetrates through the bottom end of the workbench (4) and extends into the groove (5), a transverse plate (9) is fixedly arranged at the top end of the first round rod (8), the transverse plate (9) is arranged in the groove (5), second sliding grooves (17) are formed in two side walls in the workbench (4), the two second sliding grooves (17) are communicated with the groove (5), second sliding blocks (16) are fixedly arranged on two sides of the transverse plate (9), the two second sliding blocks (16) are respectively clamped inside the two second sliding grooves (17), and a fixing mechanism is fixedly arranged at the top end of the transverse plate (9).

2. The press-type ic board package apparatus according to claim 1, wherein: fixed establishment includes two riser (10), two first slider (14) and two first spout (15), two riser (10) all are established on diaphragm (9) top, two first slider (14) top respectively with two riser (10) bottom fixed connection, two first spout (15) are all seted up at diaphragm (9) top, two first slider (14) joint respectively is inside two first spout (15).

3. The press-type ic board package apparatus according to claim 2, wherein: two be equipped with two second pole (11), two between riser (10) two cavity (18), four have all been seted up to second pole (11) inside all fixed second spring (12), four of being equipped with in cavity (18) inside all the third pole (13), four are fixed to second spring (12) one end all extends second pole (11) outer end and respectively with two riser (10) one side fixed connection.

4. The press-type ic board package apparatus according to claim 1, wherein: the bamboo joint type electric push rod (19) is fixedly arranged at the top end inside the base (2), a fixing plate (20) is fixedly arranged at the bottom end of the bamboo joint type electric push rod (19), a packaging mold (21) is connected with the fixing plate (20) through threads, and the packaging mold (21) is arranged at the top of the workbench (4).

5. The press-type ic board package apparatus according to claim 4, wherein: the fixed plate (20) bottom mounting is equipped with a plurality of location ribs (22), and is a plurality of location rib (22) all establish at encapsulation mould (21) periphery.

6. The press-type ic board package apparatus according to claim 5, wherein: a plurality of positioning holes (23) are formed in the top end of the workbench (4), and the plurality of positioning holes (23) correspond to the plurality of positioning ribs (22) one to one.

7. The press-type ic board package apparatus according to claim 4, wherein: a plurality of multi-section telescopic rods (24) are fixedly arranged at the top end inside the protective frame (1), and the bottom ends of the multi-section telescopic rods (24) are fixedly connected with the top end of the fixing plate (20).

8. The press-type ic board package apparatus according to claim 4, wherein: third chutes are formed in two side walls inside the protective frame (1), third sliding blocks are fixedly arranged on two sides of the fixed plate (20), and the third sliding blocks are respectively clamped inside the two third chutes.