CN216370566U - Combined jig and processing equipment - Google Patents
Combined jig and processing equipment Download PDFInfo
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- CN216370566U CN216370566U CN202122510918.9U CN202122510918U CN216370566U CN 216370566 U CN216370566 U CN 216370566U CN 202122510918 U CN202122510918 U CN 202122510918U CN 216370566 U CN216370566 U CN 216370566U
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- placing groove
- positioning frame
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Abstract
The utility model relates to the field of jigs, in particular to a combined jig and processing equipment, wherein the combined jig comprises a positioning frame and a base which are movably matched, the base is fixedly arranged on an external rack, a first placing groove for bearing a substrate and a second placing groove for matching with the base are arranged on the positioning frame, the first placing groove is communicated with the second placing groove, and an adhesive piece is arranged on the first placing groove; the combined jig comprises a positioning frame and a base, wherein a substrate can be placed on the positioning frame when the combined jig is used, and then the positioning frame with the substrate placed thereon is placed on the base of each process for processing; when each process of a set of process procedure is carried out, the positioning frame is only required to be moved to be matched with different bases, so that the use is simple, the universality is strong, and the production efficiency of the M iNi L ED can be effectively improved; and the bonding piece in the first placing groove can better fix the substrate, and the working stability of the combined jig is improved.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to the field of jigs, in particular to a combined jig and processing equipment.
[ background of the utility model ]
The MiNi LED processing usually includes processes such as tin brushing, die bonding, and reflow soldering, and in order to improve the efficiency and yield of the related processes, related tools are usually made according to the specific requirements of each process.
In the prior art, the jigs used in the processes of brushing tin, die bonding, reflow soldering and the like of the MiNi LED are different, so that the jigs need to be replaced when each process is carried out, and the process is very troublesome.
[ Utility model ] content
The utility model provides a combined jig and processing equipment for solving the problem that the jig needs to be replaced when each process is carried out on the existing MiNi LED.
The technical scheme for solving the technical problem is to provide a combined jig which comprises a positioning frame and a base, wherein the positioning frame and the base are movably matched, the base is fixedly arranged on an external rack, a first placing groove used for bearing a substrate and a second placing groove used for being matched with the base are arranged on the positioning frame, the first placing groove is communicated with the second placing groove, and an adhesive piece is arranged on the first placing groove.
Preferably, one surface of the base, which is close to the first placing groove, is defined as a tin brushing surface, and a through hole is formed in the tin brushing surface.
Preferably, the positioning frame is provided with a positioning column for limiting the substrate.
Preferably, a support structure is arranged in the middle area of the positioning frame.
Preferably, the support structure is provided in the second placement groove and divides a hollow area of the second placement groove to form a plurality of notches.
Preferably, the base is provided with a first avoidance groove for avoiding the support structure.
Preferably, the adhesive is low-viscosity high-temperature-resistant adhesive paper.
Preferably, a second avoiding position is arranged at the corner of the positioning frame.
Preferably, a third placing groove for placing the bonding piece is formed in the groove bottom of the first placing groove, and the thickness of the bonding piece is larger than or equal to the depth of the third placing groove.
Another technical solution of the present invention is a processing apparatus including any one of the above-mentioned combination jigs.
Compared with the prior art, the combined jig and the processing equipment have the following advantages:
1. when the combined jig is used, the substrate can be placed on the positioning frame, and then the positioning frame with the substrate placed thereon is placed on the base of each process for processing; when each process of a set of process procedure is carried out, the positioning frame is only required to be moved to be matched with different bases, so that the use is simple, the universality is strong, and the production efficiency of the MiNi LED can be effectively improved; and the bonding piece in the first placing groove can better fix the substrate, and the working stability of the combined jig is improved.
2. The base is provided with the through hole, one end of the through hole, which is far away from the tin brushing surface, can be connected with the vacuum machine, and the vacuum machine is used for adsorbing the substrate in the first placing groove, so that the working stability of the combined jig is further improved.
3. The positioning column is convenient for limiting the substrate, and further improves the working stability of the combined jig.
4. The support structure on the positioning frame can support the substrate, so that the substrate is prevented from deforming in the processing process, and the quality of a finished product is improved.
5. The supporting structure divides the hollow structure of the positioning frame into a plurality of gaps, the base is provided with a first avoiding groove used for being matched with the supporting structure, and the tin brushing surface of the base can enter the gaps to be attached to the substrate through the design.
6. The adhesive piece adopts low-viscosity high-temperature-resistant adhesive paper, the low-viscosity characteristic is convenient for quickly detaching the substrate from the positioning frame, and the substrate is prevented from being deformed in the detaching process due to overlarge viscosity; the high temperature resistance enables the adhesive tape to adapt to the high temperature during reflow soldering, so that the substrate does not need to be detached from the positioning frame during reflow soldering, and the universality of the combined jig is further enhanced.
8. The second avoiding groove can avoid the corner of the substrate, and the corner of the substrate is generally right-angled, so that the second avoiding groove can avoid the corner of the substrate from being damaged due to excessive extrusion, and the reduction of the reject ratio of a finished product is facilitated.
9. The third placing groove can accommodate the bonding piece, and the overall size of the combined jig can be reduced by the design; the thickness of the adhesive piece is larger than or equal to the depth of the third placing groove. The design is favorable for ensuring the bonding effect of the bonding piece on the substrate.
10. The utility model also provides a processing device which has the beneficial effects of the combined jig.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a perspective view of a top view of a positioning frame according to a first embodiment of the present invention.
Fig. 2 is a perspective view of a positioning frame according to a first embodiment of the present invention.
Fig. 3 is a top view of a base provided in accordance with a first embodiment of the present invention.
Fig. 4 is a side view of a base provided in accordance with a first embodiment of the present invention.
Fig. 5 is an enlarged view of a in fig. 2.
Fig. 6 is a block diagram of a processing apparatus according to a second embodiment of the present invention.
The attached drawings indicate the following:
100. processing equipment; 1001. a main body; 1002. a processing platform;
1. a positioning frame; 11. a first placing groove; 12. a second placing groove; 13. a support structure; 14. a notch; 15. pressing edges; 16. A second avoiding groove; 17. a third placing groove;
2. a base; 21. brushing a tin surface; 22. a through hole; 23. a first avoiding groove;
3. and (4) bonding the parts.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the utility model and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Referring to fig. 1 to 3, a first embodiment of the present invention provides a combination jig, including a positioning frame 1 and a base 2 movably engaged with each other, where the base 2 is fixedly disposed on an external machine frame, the positioning frame 1 is provided with a first placing slot 11 for bearing a substrate and a second placing slot 12 for engaging with the base 2, the first placing slot 11 is communicated with the second placing slot 12, and the first placing slot 11 is provided with an adhesive member 3.
The combined jig comprises the positioning frame 1 and the base 2, and when the combined jig is used, a substrate can be placed on the positioning frame 1, and then the positioning frame 1 with the substrate placed thereon is placed on the base 2 of each process for processing; when each process of a set of process procedures is carried out, the positioning frame 1 only needs to be moved to be matched with different bases 2, so that the use is simple, the universality is strong, and the production efficiency of the MiNi LED can be effectively improved; and the bonding piece 3 in the first placing groove 11 can better fix the substrate, and the working stability of the combined jig is improved.
Further, the adhesive member 3 is a high temperature resistant adhesive paper having a low viscosity. The low-viscosity characteristic facilitates the rapid detachment of the substrate from the positioning frame 1, and the deformation of the substrate in the detachment process caused by excessive viscosity is avoided; the high temperature resistance enables the adhesive tape to adapt to the high temperature during reflow soldering, so that the substrate does not need to be detached from the positioning frame 1 during reflow soldering, and the universality of the combined jig is further enhanced.
Optionally, the base 2 may include a brush tin base and/or a die bond base. The design is beneficial to improving the universality of the combined jig.
Specifically, in this embodiment, the first placing groove 11 is located in the middle area of one surface of the positioning frame 1 away from the second placing groove 12, and communicates the second placing groove 12 with the outside; the second placing groove 12 is located in the middle area of one surface of the positioning frame 1 far away from the first placing groove 11 and is communicated with the outside through the first placing groove 11.
Referring to fig. 1 and fig. 2, an edge 15 is disposed on an outer edge of a side of the positioning frame 1 away from the first placing slot 11. It can be understood that the pressing edge 15 can provide a force application point for taking and placing the positioning frame 1, so that the operation is convenient, and the production efficiency can be further improved.
Furthermore, the positioning frame 1 is provided with a positioning post (not shown) for limiting the substrate. The positioning column is convenient for limiting the substrate, and further improves the working stability of the combined jig.
Furthermore, the number of the positioning columns is multiple, and the positioning columns are arranged on the positioning frame 1 in an array mode.
Specifically, in this embodiment, the number of the positioning columns is four, and the four positioning columns are respectively disposed at the corners of the first placing groove 11.
Referring to fig. 1 and fig. 3, one surface of the base 2 close to the first placement groove 11 is defined as a tin brushing surface 21, and the tin brushing surface 21 is provided with a through hole 22.
Specifically, the through-holes 22 are vacuum holes; when the positioning frame 1 is placed on the base 2, one end of the through hole 22 communicates with the first placing groove 11.
It can be understood that, when in use, the end of the through hole 22 far away from the tin brushing surface 21 can be connected with a vacuum machine, and the vacuum machine can adsorb the substrate in the first placing groove 11, so as to further improve the working stability of the combined jig.
Referring to fig. 1, 3 and 4, a support structure 13 is disposed in a middle region of the positioning frame 1. It can be understood that the supporting structure 13 can support the substrate, so as to avoid the substrate from deforming in the processing process, and improve the quality of the finished product.
Further, the support structure 13 is provided in the second placing groove 12 and divides a hollow area of the second placing groove 12 to form a plurality of notches 14.
Specifically, in the present embodiment, the supporting structure 13 divides the second placing slot 12 into six notches 14 in two rows and three columns, and the six notches 14 have the same size.
Referring to fig. 1 and 4, a first avoiding groove 23 is formed on the base 2 corresponding to the supporting structure 13. The design enables the tin brushing surface 21 of the base 2 to enter the gap 14 to be attached to the substrate.
Further, the depth of the first avoiding groove 23 is greater than or equal to the height of the supporting structure 13. The design can further ensure that the tin brushing surface 21 of the base 2 can enter the gap 14 to be attached to the substrate.
Referring to fig. 1, the corner of the positioning frame 1 is provided with a second avoiding groove 16. It can be understood that, because the corner of the substrate is generally right-angled, the second avoiding groove 16 can avoid damage to the corner of the substrate caused by excessive extrusion, which is beneficial to reducing the fraction defective of the finished product.
Referring to fig. 1, 2 and 5, a third placing groove 17 for placing the adhesive member 3 is provided on the bottom of the first placing groove 11.
Further, the thickness of the adhesive member 3 is greater than or equal to the depth of the third placement groove 17. This design is advantageous for ensuring the bonding effect of the bonding member 3 to the substrate.
Referring to fig. 6, a second embodiment of the utility model provides a processing apparatus 100, which includes a main body 1001 and a processing platform 1002 disposed on the main body 1001, wherein a base 2 of the combined fixture is fixed on the processing platform 1002, and a positioning frame 1 is detachably sleeved on the base 2.
It can be understood that the processing equipment 100 may include a plurality of processing platforms 1002 for processing different processes, each processing platform 1002 may be fixedly provided with a base 2, and the positioning frame 1 may be sleeved on the bases 2 corresponding to the different processing platforms 1002, which is highly universal.
Compared with the prior art, the combined jig and the processing equipment have the following advantages:
1. when the combined jig is used, the substrate can be placed on the positioning frame, and then the positioning frame with the substrate placed thereon is placed on the base of each process for processing; when each process of a set of process procedure is carried out, the positioning frame is only required to be moved to be matched with different bases, so that the use is simple, the universality is strong, and the production efficiency of the MiNi LED can be effectively improved; and the bonding piece in the first placing groove can better fix the substrate, and the working stability of the combined jig is improved.
2. The base is provided with the through hole, one end of the through hole, which is far away from the tin brushing surface, can be connected with the vacuum machine, and the vacuum machine is used for adsorbing the substrate in the first placing groove, so that the working stability of the combined jig is further improved.
3. The positioning column is convenient for limiting the substrate, and further improves the working stability of the combined jig.
4. The support structure on the positioning frame can support the substrate, so that the substrate is prevented from deforming in the processing process, and the quality of a finished product is improved.
5. The supporting structure divides the hollow structure of the positioning frame into a plurality of gaps, the base is provided with a first avoiding groove used for being matched with the supporting structure, and the tin brushing surface of the base can enter the gaps to be attached to the substrate through the design.
6. The adhesive piece adopts low-viscosity high-temperature-resistant adhesive paper, the low-viscosity characteristic is convenient for quickly detaching the substrate from the positioning frame, and the substrate is prevented from being deformed in the detaching process due to overlarge viscosity; the high temperature resistance enables the adhesive tape to adapt to the high temperature during reflow soldering, so that the substrate does not need to be detached from the positioning frame during reflow soldering, and the universality of the combined jig is further enhanced.
8. The second avoiding groove can avoid the corner of the substrate, and the corner of the substrate is generally right-angled, so that the second avoiding groove can avoid the corner of the substrate from being damaged due to excessive extrusion, and the reduction of the reject ratio of a finished product is facilitated.
9. The third placing groove can accommodate the bonding piece, and the overall size of the combined jig can be reduced by the design; the thickness of the adhesive piece is larger than or equal to the depth of the third placing groove. The design is favorable for ensuring the bonding effect of the bonding piece on the substrate.
10. The utility model also provides a processing device which has the beneficial effects of the combined jig.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A combination tool, its characterized in that: the base is fixedly arranged on an external rack, a first placing groove used for bearing a substrate and a second placing groove used for being matched with the base are arranged on the positioning frame, the first placing groove is communicated with the second placing groove, and a bonding piece is arranged on the first placing groove.
2. The combination jig of claim 1, wherein: and defining one surface of the base, which is close to the first placing groove, as a tin brushing surface, wherein a through hole is formed in the tin brushing surface.
3. The combination jig of claim 1, wherein: and the positioning frame is provided with a positioning column for limiting the substrate.
4. The combination jig of claim 1, wherein: and a supporting structure is arranged in the middle area of the positioning frame.
5. The combination jig of claim 4, wherein: the supporting structure is arranged in the second placing groove and divides the hollow area of the second placing groove to form a plurality of gaps.
6. The combination jig of claim 4, wherein: the base is provided with a first avoidance groove used for avoiding the support structure.
7. The combination jig of claim 1, wherein: the bonding piece is low-viscosity high-temperature-resistant adhesive paper.
8. The combination jig of claim 1, wherein: and a second avoiding groove is formed in the corner of the positioning frame.
9. The combination jig of claim 1, wherein: the groove bottom of the first placing groove is provided with a third placing groove used for placing the bonding piece, and the thickness of the bonding piece is larger than or equal to the depth of the third placing groove.
10. A processing apparatus, characterized by: the processing equipment comprises the combined jig of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122510918.9U CN216370566U (en) | 2021-10-18 | 2021-10-18 | Combined jig and processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122510918.9U CN216370566U (en) | 2021-10-18 | 2021-10-18 | Combined jig and processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216370566U true CN216370566U (en) | 2022-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122510918.9U Active CN216370566U (en) | 2021-10-18 | 2021-10-18 | Combined jig and processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216370566U (en) |
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2021
- 2021-10-18 CN CN202122510918.9U patent/CN216370566U/en active Active
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