CN211321662U - Support plate device for integrated circuit board processing - Google Patents
Support plate device for integrated circuit board processing Download PDFInfo
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- CN211321662U CN211321662U CN202020358194.3U CN202020358194U CN211321662U CN 211321662 U CN211321662 U CN 211321662U CN 202020358194 U CN202020358194 U CN 202020358194U CN 211321662 U CN211321662 U CN 211321662U
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- integrated circuit
- circuit board
- processing
- fixedly connected
- support plate
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Abstract
The utility model relates to an integrated circuit board technical field just discloses a support plate device is used in integrated circuit board processing, including processing the base, connecting in the loading board at processing base top, the carrier plate groove has been seted up at the top of loading board, the socket joint has all been seted up at the middle part of four sides all around the carrier plate groove, flexible chamber has been seted up to the bottom of socket joint, the medial surface activity of socket joint has cup jointed the pole, the medial extremity fixedly connected with of cup jointing the pole is located the baffle of flexible intracavity portion, the outside end fixedly connected with splint of cup jointing the pole. This support plate device is used in integrated circuit board processing through the compression of spring, can drive the pole of cup jointing and remove the interval between to splint and adjust to make splint can carry out the centre gripping to the integrated circuit board of unidimensional not, and then make the support plate device can load the integrated circuit board of unidimensional, can also stabilize the integrated circuit board centre gripping simultaneously.
Description
Technical Field
The utility model relates to an integrated circuit board technical field specifically is a support plate device is used in integrated circuit board processing.
Background
The integrated circuit board is a carrier for loading the integrated circuit, and is widely applied to various electronic equipment, and in the processing process of the integrated circuit board, the integrated circuit board is placed on a carrier plate device, and then the integrated circuit board is processed through the equipment.
The existing support plate device for processing the integrated circuit board is provided with a placing groove close to the size of the circuit board on the surface, then the integrated circuit board is fixedly sleeved through the placing groove, and then processing is carried out, so that the support plate device cannot be suitable for processing the integrated circuit boards with different sizes, and the investment cost is greatly improved.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a support plate device is used in integrated circuit board processing possesses the advantage that support plate device is applicable to not unidimensional integrated circuit and integrated circuit board machining efficiency height, has solved support plate device and can't be applicable to not unidimensional integrated circuit board and the lower problem of integrated circuit board machining efficiency.
The utility model provides a following technical scheme: the utility model provides a support plate device is used in integrated circuit board processing, includes the processing base, connects in the loading board at processing base top, the loading board groove has been seted up at the top of loading board, the socket joint has all been seted up at the middle part of four sides all around in loading board groove, flexible chamber has been seted up to the bottom of socket joint, the medial surface activity of socket joint has been cup jointed the pole, the medial extremity fixedly connected with of cup joint pole is located the baffle of flexible intracavity portion, the outside end fixedly connected with splint of cup joint pole, the spring has been placed to the inside in flexible chamber.
Preferably, the bottom of the loading plate groove is fixedly connected with a protective pad, and the bottom of the clamping plate is movably connected with the top of the protective pad.
Preferably, the surface of the clamping end of the clamping plate is fixedly connected with a rubber pad.
Preferably, the length values of the left and right sleeved rods are equal, the length values of the front and rear sleeved rods are equal, the length values and stiffness coefficient values of the left and right springs are equal, and the length values and stiffness coefficient values of the front and rear springs are equal.
Preferably, the diameter value of the sleeve rod is smaller than that of the sleeve port, the baffle is circular, and the diameter value of the baffle is smaller than that of the telescopic cavity.
Preferably, the equal fixedly connected with fixed column in four corners department at processing base top, the fixed orifices has all been seted up in the four corners department at loading board top, the fixed orifices cup joints with the fixed column activity, the diameter value of fixed column is less than the diameter value of fixed orifices.
Compared with the prior art, the utility model discloses possess following beneficial effect:
1. this support plate device is used in integrated circuit board processing through the compression of spring, can drive the pole of cup jointing and remove the interval between to splint and adjust to make splint can carry out the centre gripping to the integrated circuit board of unidimensional not, and then make the support plate device can load the integrated circuit board of unidimensional, can also stabilize the integrated circuit board centre gripping simultaneously.
2. This support plate device for integrated circuit board processing cup joints through the activity of fixed orifices and fixed column for can fix a position stably to the support plate device, also conveniently get the support plate device simultaneously, thereby make when processing integrated circuit board, can carry out loading of integrated circuit board and take off integrated circuit board on the support plate device after processing is accomplished to another support plate device, and then the time that can greatly reduced operation, make integrated circuit board's machining efficiency improve greatly.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a partial cross-sectional view of the present invention;
FIG. 3 is a schematic view of the structure of the processing base of the present invention;
FIG. 4 is an enlarged view of A in FIG. 2 according to the present invention;
fig. 5 is an enlarged view of the point B in fig. 2 according to the present invention.
In the figure: 1. processing a base; 2. a carrier plate; 3. fixing a column; 4. a loading plate groove; 5. a sleeved rod; 6. a splint; 7. a fixing hole; 8. a spring; 9. a telescoping chamber; 10. a baffle plate; 11. a rubber pad; 12. a socket; 13. a protective pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, a carrier plate device for processing an integrated circuit board includes a processing base 1, a carrier plate 2 connected to the top of the processing base 1, a carrier plate groove 4 is formed at the top of the carrier plate 2, socket joints 12 are formed at the middle portions of the front, rear, left and right sides of the carrier plate groove 4, a telescopic cavity 9 is formed at the bottom of the socket joint 12, a socket joint rod 5 is movably sleeved on the inner side of the socket joint 12, a baffle 10 located inside the telescopic cavity 9 is fixedly connected to the inner side end of the socket joint rod 5, a clamp plate 6 is fixedly connected to the outer side end of the socket joint rod 5, a spring 8 is placed inside the telescopic cavity 9, and the clamp plate 6 can clamp integrated circuit boards of different sizes and can stably clamp the integrated circuit boards through the mutual cooperation of the spring.
Wherein, 4 bottom fixedly connected with protection pads 13 in year board groove, integrated circuit board's bottom has the solder joint, can prevent through protection pads 13 that the extrusion in the in-process of processing from causing the damage to the solder joint to cause the influence to integrated circuit board's normal use, the bottom of splint 6 and the top swing joint of protection pads 13 make splint 6 can carry out complete centre gripping by integrated circuit board.
Wherein, the clamping end fixed surface of splint 6 is connected with rubber pad 11, can be at the centre gripping to the edge of integrated circuit board effect that plays the protection, avoids the in-process of centre gripping to cause the damage to integrated circuit board.
Wherein, the length value of cup jointing pole 5 about equals, and the length value of cup jointing pole 5 around equals, and the length value and the coefficient of stiffness value of spring 8 are equalling about, and the length value and the coefficient of stiffness value of spring 8 are equalling around for four splint 6 are to the stable back of integrated circuit board centre gripping, and integrated circuit board's position can be located the central point of year board groove 4, thereby the processing device's that conveniently adds man-hour location processing.
Wherein, the diameter value of cup jointing pole 5 is less than the diameter value of socket joint 12, the shape of baffle 10 is circular, the diameter value of baffle 10 is less than the diameter value of flexible chamber 9, the difference of cup jointing pole 5 diameter value and socket joint 12 diameter value is about 0.5mm, the difference of baffle 10 diameter value and flexible chamber 9 diameter value is about 0.5mm, make the lateral surface of cup jointing pole 5 closely laminate with the medial surface of socket joint 12 and the lateral surface of baffle 10 closely laminates with the medial surface of flexible chamber 9, and then guaranteed that the in-process that cup jointing pole 5 removed can only carry out horizontal migration, can not take place the skew to other directions, make integrated circuit board's centre gripping more stable.
Wherein, the equal fixedly connected with fixed column 3 in four corners department at processing base 1 top, fixed orifices 7 has all been seted up in the four corners department at 2 tops of loading board, fixed orifices 7 cup joints with the activity of fixed column 3, cup joint through fixed orifices 7 and fixed column 3, make loading board 2 conveniently get and put, thereby make in-process at processing can carry out the loading and the dismantlement of integrated circuit board on other loading boards 2, and then the time of operation can be reduced by a wide margin, make integrated circuit board's machining efficiency improve greatly, the diameter value of fixed column 3 is less than the diameter value of fixed orifices 7, the difference of fixed column 3 diameter value and fixed orifices 7 diameter value is about 0.5mm, thereby make fixed column 3 cup joint the back with fixed orifice 7, loading board 2's location is more stable, can not take place the skew, the precision of adding man-hour.
The working principle is as follows:
during the use, promote two adjacent splint 6, place the integrated circuit board in the bottom of carrier board groove 4, then loosen splint 6, bounce-back through the flexible of the inside spring 8 of flexible chamber 9, can be stable with the integrated circuit board centre gripping, also make the carrier board device can be applicable to not unidimensional integrated circuit board simultaneously, integrated circuit board loads the completion back, cup joint fixed orifices 7 on the loading board 2 and the fixed column 3 on the processing base 1, can be fixed stable to loading board 2 through four fixed columns 3, thereby the going on of convenient processing.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a support plate device is used in integrated circuit board processing, includes processing base (1), connects in loading board (2) at processing base (1) top, its characterized in that: carrier plate groove (4) have been seted up at the top of loading board (2), socket joint (12) have all been seted up at the middle part of four sides all around carrier plate groove (4), flexible chamber (9) have been seted up to the bottom of socket joint (12), cup joint pole (5) have been cup jointed in the medial surface activity of socket joint (12), the medial surface fixedly connected with of cup joint pole (5) is located baffle (10) of flexible chamber (9) inside, the outside end fixedly connected with splint (6) of cup joint pole (5), spring (8) have been placed to the inside in flexible chamber (9).
2. The carrier board device for processing integrated circuit boards according to claim 1, wherein: the bottom of the loading plate groove (4) is fixedly connected with a protective pad (13), and the bottom of the clamping plate (6) is movably connected with the top of the protective pad (13).
3. The carrier board device for processing integrated circuit boards according to claim 1, wherein: the surface of the clamping end of the clamping plate (6) is fixedly connected with a rubber pad (11).
4. The carrier board device for processing integrated circuit boards according to claim 1, wherein: the length value of the left and right sleeving rods (5) is equal, the length value of the front and back sleeving rods (5) is equal, the length value and the stiffness coefficient value of the left and right springs (8) are equal, and the length value and the stiffness coefficient value of the front and back springs (8) are equal.
5. The carrier board device for processing integrated circuit boards according to claim 1, wherein: the diameter value of the sleeve joint rod (5) is smaller than that of the sleeve joint port (12), the baffle (10) is circular, and the diameter value of the baffle (10) is smaller than that of the telescopic cavity (9).
6. The carrier board device for processing integrated circuit boards according to claim 1, wherein: the processing base (1) is characterized in that fixing columns (3) are fixedly connected to four corners of the top of the processing base, fixing holes (7) are formed in the four corners of the top of the bearing plate (2), the fixing holes (7) are movably sleeved with the fixing columns (3), and the diameter values of the fixing columns (3) are smaller than that of the fixing holes (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020358194.3U CN211321662U (en) | 2020-03-20 | 2020-03-20 | Support plate device for integrated circuit board processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020358194.3U CN211321662U (en) | 2020-03-20 | 2020-03-20 | Support plate device for integrated circuit board processing |
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| Publication Number | Publication Date |
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| CN211321662U true CN211321662U (en) | 2020-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020358194.3U Active CN211321662U (en) | 2020-03-20 | 2020-03-20 | Support plate device for integrated circuit board processing |
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| CN (1) | CN211321662U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113594081A (en) * | 2021-07-28 | 2021-11-02 | 深圳市元众实业有限公司 | LED packaging structure of high-brightness liquid crystal display screen |
-
2020
- 2020-03-20 CN CN202020358194.3U patent/CN211321662U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113594081A (en) * | 2021-07-28 | 2021-11-02 | 深圳市元众实业有限公司 | LED packaging structure of high-brightness liquid crystal display screen |
| CN113594081B (en) * | 2021-07-28 | 2022-05-10 | 深圳市元众实业有限公司 | LED packaging structure of high-brightness liquid crystal display screen |
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