CN210590647U - Chip protection film tectorial membrane device - Google Patents

Chip protection film tectorial membrane device Download PDF

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Publication number
CN210590647U
CN210590647U CN201921146145.7U CN201921146145U CN210590647U CN 210590647 U CN210590647 U CN 210590647U CN 201921146145 U CN201921146145 U CN 201921146145U CN 210590647 U CN210590647 U CN 210590647U
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China
Prior art keywords
fixed mounting
roof
chip
push rod
electric push
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Application number
CN201921146145.7U
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Chinese (zh)
Inventor
殷泽安
殷志鹏
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Suzhou Yipinxin Semiconductor Co Ltd
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Suzhou Yipinxin Semiconductor Co Ltd
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Priority to CN201921146145.7U priority Critical patent/CN210590647U/en
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Abstract

The utility model discloses a chip protective film laminating device, which comprises a conveying roller, wherein the conveying roller is arranged in bilateral symmetry, a conveying belt is arranged on the conveying roller, a plurality of mounting discs are fixedly arranged on the outer side wall of the conveying belt, a fixing frame is arranged in the conveying belt, a plurality of uniformly distributed supporting columns are fixedly arranged on the lower end surface of the fixing frame, a top plate is arranged above the conveying belt, the top plate is fixedly connected with the fixing frame through a plurality of uniformly distributed supporting rods, a laminating mechanism and a shaping mechanism are arranged on the top plate, and a supporting part is arranged on the fixing frame corresponding to the shaping mechanism, low efficiency and influence on the product quality.

Description

Chip protection film tectorial membrane device
Technical Field
The utility model relates to a chip tectorial membrane technical field specifically is a chip protection film tectorial membrane device.
Background
Integrated circuits, or microcircuits, microchips, chips/chips, are a way to miniaturize circuits (mainly including semiconductor devices, also including passive components, etc.) in electronics, and are often manufactured on the surface of semiconductor wafers, and chip coating is a very advanced packaging form in the chip production process, which is a process of implanting a tested wafer onto a specially made circuit board, and then coating the wafer with melted organic materials having special protection functions to complete the later packaging of the chip.
Most of the existing chip protection film laminating devices have poor laminating effect and low efficiency, and influence the product quality.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip protection film tectorial membrane device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a chip protection film tectorial membrane device, includes the conveying roller, the conveying roller bilateral symmetry sets up, be provided with the conveyer belt on the conveying roller, fixed mounting has a plurality of mounting disc on the lateral wall of conveyer belt, the inside of conveyer belt is provided with the mount, fixed mounting has a plurality of evenly distributed's support column on the lower terminal surface of mount, the top of conveyer belt is provided with the roof, bracing piece fixed connection through a plurality of evenly distributed between roof and the mount, be provided with tectorial membrane mechanism and design mechanism on the roof, it is provided with the support component to correspond design mechanism position department on the mount.
Preferably, the tectorial membrane mechanism is including removing the frame, remove frame fixed mounting on the lower terminal surface of roof, the lead screw is installed in the inside rotation of removing the frame, fixed mounting has the motor on the rear end face of removal frame, the output and the lead screw fixed connection of motor, the inside of removing the frame is provided with removes the seat, it sets up on the lead screw to remove the seat, the bottom fixed mounting who removes the seat has third electric putter, third electric putter's output fixed mounting has the installation piece.
Preferably, fixed mounting has the fixed disk on the lower terminal surface of installation piece, the bottom fixed mounting of fixed disk has the scraper blade and extrudes the head, fixed mounting has the material case on the up end of roof, the material case with extrude and be linked together through communicating pipe between the head.
Preferably, the shaping mechanism comprises a first electric push rod, the first electric push rod is fixedly installed on the upper end face of the top plate, and the output end of the first electric push rod is fixedly provided with a lower pressing head.
Preferably, the supporting component comprises a second electric push rod, the second electric push rod is fixedly installed on the lower end face of the fixing frame, a supporting plate is fixedly installed at the output end of the second electric push rod, and the position of the supporting plate corresponds to the lower pressing head.
Preferably, the mounting panel of front and back symmetric distribution is fixedly mounted between mount and the roof, the position of mounting panel corresponds with lower pressure head, fixed mounting has the installation cover on the mounting panel, the inside of installation cover is provided with the fan.
Compared with the prior art, the beneficial effects of the utility model are that: a film covering device for chip protection film is prepared as setting chip on installation plate, conveying chip along with conveyer belt, covering film on chip by film covering mechanism, matching shaping mechanism with support component to raise film covering effect and to raise quality of chip, driving movable seat to move by motor after conveyer belt is stopped to make extrusion head be corresponding to chip position, coating organic material on chip in material box, driving scraper blade to be corresponding to chip position, driving scraper blade to move by movable seat to scrape material on chip uniformly, driving chip to move to shaping mechanism position by conveyer belt, stopping conveyer belt, driving support plate to lift by second electric push rod to support conveyer belt, driving pressure head to lower by first electric push rod, the lower pressure head bottom is provided with the recess with chip shape size looks adaptation, and lower pressure head and chip cooperation flatten the processing to the material of coating on the chip, improve the tectorial membrane quality of chip, drive the circulation of air through the fan for the air-drying of material improves tectorial membrane effect and efficiency. The utility model relates to a chip protection film tectorial membrane device through setting up down pressure head, fan and scraper blade etc. has reached the tectorial membrane effect that improves the chip protection film, improves product quality, and it is poor to have solved present chip protection film tectorial membrane device and mostly all tectorial membrane effect, and is inefficient, influences product quality's problem.
Drawings
FIG. 1 is a schematic structural diagram of a film covering apparatus for a chip protection film;
FIG. 2 is a schematic structural diagram of the right side of a film covering device for a chip protection film;
fig. 3 is a schematic structural diagram of a film covering mechanism in a film covering device for a chip protection film.
In the figure: 1-conveying roller, 2-conveying belt, 3-mounting disc, 4-fixing frame, 5-supporting column, 6-supporting rod, 7-top plate, 8-laminating mechanism, 9-first electric push rod, 10-lower pressing head, 11-second electric push rod, 12-supporting plate, 13-fan, 14-moving frame, 15-screw rod, 16-motor, 17-moving seat, 18-third electric push rod, 19-mounting block, 20-fixing disc, 21-scraping plate, 22-extrusion head, 23-material box, 24-communicating pipe, 25-mounting cover and 26-mounting plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a technical solution: the utility model provides a chip protection film tectorial membrane device, includes conveying roller 1, 1 bilateral symmetry of conveying roller sets up, be provided with conveyer belt 2 on the conveying roller 1, fixed mounting has a plurality of mounting disc 3 on the lateral wall of conveyer belt 2, the inside of conveyer belt 2 is provided with mount 4, fixed mounting has a plurality of evenly distributed's support column 5 on the lower terminal surface of mount 4, the top of conveyer belt 2 is provided with roof 7, 6 fixed connection of bracing piece through a plurality of evenly distributed between roof 7 and the mount 4, be provided with tectorial membrane mechanism 8 and sizing mechanism on the roof 7, it is provided with the support component to correspond sizing mechanism position department on the mount 4.
Through the installation of the installation disc 3, the chip is conveyed along with the conveying belt 2, the film is coated on the chip through the film coating mechanism 8, and the film coating effect is improved and the quality of the chip is improved through the matching of the shaping mechanism and the supporting component.
The laminating mechanism 8 is including removing frame 14, remove 14 fixed mounting on the lower terminal surface of roof 7, the lead screw 15 is installed in the inside rotation of removing frame 14, fixed mounting has motor 16 on the rear end face of removing frame 14, motor 16's output and lead screw 15 fixed connection, the inside of removing frame 14 is provided with removes seat 17, remove the seat 17 setting on lead screw 15, the bottom fixed mounting that removes seat 17 has third electric putter 18, the output fixed mounting of third electric putter 18 has installation piece 19.
The lower end face of the mounting block 19 is fixedly provided with a fixed disc 20, the bottom of the fixed disc 20 is fixedly provided with a scraper 21 and an extrusion head 22, the upper end face of the top plate 7 is fixedly provided with a material box 23, and the material box 23 is communicated with the extrusion head 22 through a communicating pipe 24.
When the chip is carried to tectorial membrane mechanism 8 below along with conveyer belt 2, conveyer belt 2 stops the back, and motor 16 drives and removes seat 17 and removes for extrude head 22 corresponding with the chip position, the inside organic material after melting of material case 23, through extruding head 22 coating on the chip, remove seat 17 and remove, make scraper blade 21 correspond with the chip position, drive scraper blade 21 through removing seat 17 and move, scrape even processing to the material on the chip.
The shaping mechanism comprises a first electric push rod 9, the first electric push rod 9 is fixedly installed on the upper end face of the top plate 7, and a lower pressure head 10 is fixedly installed at the output end of the first electric push rod 9.
The supporting component comprises a second electric push rod 11, the second electric push rod 11 is fixedly installed on the lower end face of the fixing frame 4, a supporting plate 12 is fixedly installed at the output end of the second electric push rod 11, and the position of the supporting plate 12 corresponds to the lower pressing head 10.
Drive the chip through conveyer belt 2 and remove to the forming mechanism position department, conveyer belt 2 stops, and second electric putter 11 drives backup pad 12 and rises, supports conveyer belt 2, and pressure head 10 descends under first electric putter 9 drives, and pressure head 10 bottom is provided with the recess with chip shape size looks adaptation down, and pressure head 10 and chip cooperation down flatten the processing to the material of coating on the chip, improve the tectorial membrane quality of chip.
The utility model discloses a fan, including mount 4, roof 7, mounting panel 26 is last, fixed mounting has installation cover 25, the inside of installation cover 25 is provided with fan 13, and the mounting panel is corresponding with lower pressure head 10 between mount 4 and the roof 7.
Drive the circulation of air through fan 13 for the air-drying of material improves tectorial membrane effect and efficiency.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (6)

1. The utility model provides a chip protection film tectorial membrane device, includes conveying roller (1), its characterized in that: conveying roller (1) bilateral symmetry sets up, be provided with conveyer belt (2) on conveying roller (1), fixed mounting has a plurality of mounting disc (3) on the lateral wall of conveyer belt (2), the inside of conveyer belt (2) is provided with mount (4), fixed mounting has a plurality of evenly distributed's support column (5) on the lower terminal surface of mount (4), the top of conveyer belt (2) is provided with roof (7), bracing piece (6) fixed connection through a plurality of evenly distributed between roof (7) and mount (4), be provided with tectorial membrane mechanism (8) and design mechanism on roof (7), it is provided with support component to correspond design mechanism position department on mount (4).
2. A chip protective film laminating apparatus according to claim 1, characterized in that: tectorial membrane mechanism (8) are including removing frame (14), remove frame (14) fixed mounting on the lower terminal surface of roof (7), the inside of removing frame (14) is rotated and is installed lead screw (15), fixed mounting has motor (16) on the rear end face of removing frame (14), the output and lead screw (15) fixed connection of motor (16), the inside of removing frame (14) is provided with removes seat (17), it sets up on lead screw (15) to remove seat (17), the bottom fixed mounting who removes seat (17) has third electric putter (18), the output fixed mounting of third electric putter (18) has installation piece (19).
3. A chip protective film laminating apparatus according to claim 2, wherein: fixed mounting has fixed disk (20) on the lower terminal surface of installation piece (19), the bottom fixed mounting of fixed disk (20) has scraper blade (21) and extrudes head (22), fixed mounting has material box (23) on the up end of roof (7), material box (23) and extrude and be linked together through communicating pipe (24) between head (22).
4. A chip protective film laminating apparatus according to claim 3, wherein: the shaping mechanism comprises a first electric push rod (9), the first electric push rod (9) is fixedly installed on the upper end face of the top plate (7), and a lower pressure head (10) is fixedly installed at the output end of the first electric push rod (9).
5. A chip protection film laminating apparatus according to claim 4, wherein: the supporting component comprises a second electric push rod (11), the second electric push rod (11) is fixedly installed on the lower end face of the fixing frame (4), a supporting plate (12) is fixedly installed at the output end of the second electric push rod (11), and the position of the supporting plate (12) corresponds to the lower pressure head (10).
6. A chip protection film laminating apparatus according to claim 5, wherein: the utility model discloses a pressure head, including mount (4), roof (7), mounting panel (26) that fixed mounting has front and back symmetric distribution between mount (4) and roof (7), the position of mounting panel (26) is corresponding with lower pressure head (10), fixed mounting has installation cover (25) on mounting panel (26), the inside of installation cover (25) is provided with fan (13).
CN201921146145.7U 2019-07-19 2019-07-19 Chip protection film tectorial membrane device Active CN210590647U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921146145.7U CN210590647U (en) 2019-07-19 2019-07-19 Chip protection film tectorial membrane device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921146145.7U CN210590647U (en) 2019-07-19 2019-07-19 Chip protection film tectorial membrane device

Publications (1)

Publication Number Publication Date
CN210590647U true CN210590647U (en) 2020-05-22

Family

ID=70691066

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921146145.7U Active CN210590647U (en) 2019-07-19 2019-07-19 Chip protection film tectorial membrane device

Country Status (1)

Country Link
CN (1) CN210590647U (en)

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