CN113543489A - Forming equipment and forming method of bent high-density interconnection printed circuit board - Google Patents

Forming equipment and forming method of bent high-density interconnection printed circuit board Download PDF

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Publication number
CN113543489A
CN113543489A CN202110770924.XA CN202110770924A CN113543489A CN 113543489 A CN113543489 A CN 113543489A CN 202110770924 A CN202110770924 A CN 202110770924A CN 113543489 A CN113543489 A CN 113543489A
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China
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plate
fixedly arranged
circuit board
printed circuit
die insert
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CN202110770924.XA
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Chinese (zh)
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于三花
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Individual
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D1/00Devices using naturally cold air or cold water
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

The invention discloses forming equipment of a bent high-density interconnected printed circuit board, which comprises a workbench, an upper forming mechanism, a lower forming mechanism and a rotary straightening device, wherein the lower forming mechanism comprises a rack, a hydraulic oil cylinder and a heat dissipation plate, the hydraulic oil cylinder is fixedly arranged on the bottom surface of a rack stand, the left end surface and the right end surface of the heat dissipation plate are rotatably arranged on a vertical plate through a hollow shaft, a closed cavity communicated with the inner cavity of the hollow shaft is formed in the heat dissipation plate, a plurality of male die inserts A and a plurality of male die inserts B are detachably and fixedly arranged on the top surface and the bottom surface of the heat dissipation plate along the horizontal direction of the heat dissipation plate, a power unit I and an air blower are arranged on the bottom surface of a lifting plate, and a transmission device is connected between the output end of the power unit I and the left hollow shaft. The invention has the beneficial effects that: compact structure, improved product production efficiency, improved product production quality, lightened labor intensity of workers and high degree of automation.

Description

Forming equipment and forming method of bent high-density interconnection printed circuit board
Technical Field
The invention relates to the technical field of production of bent high-density interconnection printed circuit boards, in particular to forming equipment and a forming method of a bent high-density interconnection printed circuit board.
Background
At present, with the development of science and technology, more and more wearing devices (wherein the wearing devices comprise sports helmets, sports cameras, parachute jumping equipment and the like) enter our bodies, and high-density interconnection printed circuit boards for controlling hardware to work are installed in the wearing devices, wherein the high-density interconnection printed circuit boards are important core parts in the wearing devices. The existing high-density interconnection printed circuit board is hard and inconvenient to install inside the wearable device. In addition, the traditional high-density interconnection printed circuit board has higher production cost and poorer economy. In order to solve the problems, a bending type high-density interconnection printed circuit board is appeared on the market, and the bending type high-density interconnection printed circuit board is a combination of a rigid circuit board and a flexible circuit board, has the characteristics of high wiring density, light weight, thin thickness and good bending property, and is very suitable for being installed in wearable equipment. Compared with the traditional high-density interconnection printed circuit board, more electronic components can be welded in unit length. The structure of the finished bent high-density interconnection printed circuit board is shown in fig. 1, and the finished bent high-density interconnection printed circuit board comprises a metal base layer, a heat conduction insulating layer and a conducting layer which are integrated in a reciprocating mode from bottom to top, wherein a circuit layer is arranged on the conducting layer, a plurality of convex hulls 40 are arranged on the upper surface of the finished bent high-density interconnection printed circuit board, and the left portion and the right portion of the bent high-density interconnection printed circuit board form a horizontal plate 41 so that the circuit board can be conveniently installed in wearing equipment through the horizontal plate 41 at a later stage.
At present, a bending device is adopted to produce a bending type high-density interconnected printed circuit board, the bending device comprises a male die and a female die, the male die is arranged on a punch of a punch press, when the bending device works, a blank for producing the bending type high-density interconnected printed circuit board is firstly horizontally placed on the top surface of the female die (the structure of the blank is shown in figure 2 and comprises a plate-shaped metal base layer, a heat conduction insulating layer and a conducting layer which are sequentially compounded into a whole) so as to realize the positioning of the blank, then the punch of the punch press is operated to move downwards, a male die insert on the male die is matched with a groove in the female die, a semi-finished product bending type high-density interconnected printed circuit board is formed, and a worker takes away the semi-finished product bending type high-density interconnected printed circuit board in the bending device; a worker pastes an adhesive film on the conducting layer of the semi-finished product bending type high-density interconnection printed circuit board so as to expose the area to be etched; then, a worker immerses the semi-finished product bent high-density interconnection printed circuit board into an etching groove, the etching solution in the etching groove is used for etching the area, which is not covered by the adhesive film, on the conductive layer, and the adhesive film is torn off to form a circuit layer on the conductive layer, so that the finished product bent high-density interconnection printed circuit board is finally processed.
However, although the bending apparatus can process the bent circuit board, the worker still finds the following defects in the actual operation process: I. in the process of closing the female die and the male die, a large amount of heat is generated between the male die insert and the blank and between the female die and the blank, and the heat is accumulated on the surface of the blank to cause the burning loss of the blank, so that the appearance quality of the produced product is quite poor, and the forming quality of the product is reduced. II. In the process of matching the male die insert and the female die, the horizontal plates positioned on the two sides of the blank can be tilted upwards, and the two horizontal plates (41) are required to be in a horizontal state in the process, so that a product formed by the bending equipment still does not meet the requirements of customers, and the quality of the product is reduced. III, workers are required to transfer the formed semi-finished bent high-density interconnection printed circuit board into the etching grooves, and a certain distance is reserved between the forming equipment and the etching grooves, so that the production time of the whole product is prolonged, and the production efficiency of the product is reduced. IV, the size of die and terrace die mold insert is fixed all the time, when the product of high convex closure in addition is required to the customer, needs the workman to should buckle the equipment remodel and change the machine again, and this is prolonged the production time of high convex closure product undoubtedly, can't satisfy customer's demand, and then has reduced production efficiency.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the forming equipment and the forming method of the bending type high-density interconnection printed circuit board, which have the advantages of compact structure, high product production efficiency, high product production quality, high automation degree and capability of reducing the labor intensity of workers.
The purpose of the invention is realized by the following technical scheme: the forming equipment of the bending type high-density interconnected printed circuit board comprises a workbench, an upper forming mechanism, a lower forming mechanism and a rotary straightening device, wherein the lower forming mechanism and the upper forming mechanism are arranged in an up-and-down symmetrical manner, the lower forming mechanism comprises a rack, a hydraulic oil cylinder and a heat dissipation plate, the hydraulic oil cylinder is fixedly arranged on the bottom surface of a rack stand, a piston rod of the hydraulic oil cylinder penetrates through the stand, a lifting plate is fixedly arranged on an extending end, two vertical plates are fixedly arranged on the top surface of the lifting plate, the left end surface and the right end surface of the heat dissipation plate are rotatably arranged on the vertical plates through a hollow shaft, a closed cavity communicated with the inner cavity of the hollow shaft is formed in the heat dissipation plate, a plurality of male die inserts A and a plurality of male die inserts B are detachably and fixedly arranged on the top surface and the bottom surface of the heat dissipation plate along the horizontal direction, a power unit I and an air blower are arranged on the bottom surface of the lifting plate, and a transmission device is connected between the output end of the power unit I and the hollow shaft on the left side, the air outlet of the blower is connected with the hollow shaft on the right side; the support of the frame of the upper forming mechanism is fixedly arranged on a truss in a workshop, the support of the frame of the lower forming mechanism is fixedly arranged on a workbench, a plurality of female die inserts A matched with the male die inserts A are fixedly arranged on the bottom surface of the heat dissipation plate of the lower forming mechanism, and a plurality of female die inserts B matched with the male die inserts B are fixedly arranged on the top surface of the heat dissipation plate of the lower forming mechanism.
The rotary straightening device comprises a power unit II and a hydraulic motor, a rotary table is fixedly arranged on an output shaft of the hydraulic motor, the power unit II is arranged on the rotary table, a first connecting plate is fixedly arranged on the output shaft of the power unit II, a transverse plate is fixedly arranged on the first connecting plate, a second connecting plate is fixedly arranged at the other end of the transverse plate, a through groove positioned right above the lower forming mechanism is formed in the transverse plate, guide posts are slidably arranged on the two connecting plates respectively, an L plate is fixedly arranged at one end of each guide post, the two L plates are oppositely arranged, a spring is sleeved on each guide post, one end of each spring is fixedly arranged on a vertical plate of the L plate, the other end of each spring is fixedly arranged on the connecting plate, and a positioning post is fixedly arranged on the top surface of the horizontal plate of the L plate; an etching groove is formed in the right side of the hydraulic motor; the rotary straightening device further comprises a limiting column fixedly arranged on the workbench and a limiting plate fixedly arranged on the second connecting plate, wherein a clamping groove is formed in the limiting plate, and the clamping groove of the limiting plate is clamped on the limiting column in a sleeved mode.
The height of the male die insert B is greater than that of the male die insert A.
And a pipeline is connected between the air outlet of the air blower and the right hollow shaft.
The power unit I comprises a speed reducer I and a motor I which are fixedly arranged on the lifting plate, an output shaft of the motor I is connected with an input shaft of the speed reducer I, the transmission device comprises a driving chain wheel, a driven chain wheel and a chain, the driving chain wheel is arranged on the output shaft of the speed reducer I, the driven chain wheel is arranged on a hollow shaft on the left side, and the chain is arranged between the driving chain wheel and the driven chain wheel.
The hydraulic motor and the etching groove are both fixedly arranged on the frame of the lower forming mechanism.
The power unit II comprises a speed reducer II and a motor II which are fixedly arranged on the rotary table, an output shaft of the motor II is connected with an input shaft of the speed reducer II, and an output shaft of the speed reducer II is arranged towards the left and fixedly arranged on the first connecting plate.
The mounting plates are fixedly arranged on the left side and the right side of the male die insert and the female die insert and fixedly arranged on the heat dissipation plate through locking screws so as to fix the male die insert and the female die insert.
The hydraulic control system also comprises a controller, wherein the controller is electrically connected with the motor I, the motor II, the electromagnetic valve of the hydraulic oil cylinder, the blower and the electromagnetic valve of the hydraulic motor.
The method for bending and molding the high-density interconnection printed circuit board by the molding equipment comprises the following steps:
s1, a worker takes a blank, two positioning holes are drilled at the left end and the right end of the blank respectively, and the distance between the two positioning holes is equal to the distance between the two positioning columns; adhering an adhesive film on the heat conducting layer of the blank, and shielding the area which does not need to be etched on the heat conducting layer through the adhesive film;
s2, positioning the blank by a tool, wherein a worker sleeves two positioning holes in the blank on two positioning columns respectively and supports a metal base layer of the blank on the top surfaces of two L plates, so that the quick positioning of the blank by the tool is realized, and the blank is just positioned between a male die insert A of a lower forming mechanism and a female die insert A of an upper forming mechanism and is suspended right above a through groove;
s3, clamping the blank, wherein a worker controls a piston rod of a hydraulic oil cylinder of the lower forming mechanism to extend upwards, the piston rod drives a lifting plate to move upwards, the lifting plate drives a power unit I, a heat dissipation plate and a male die insert A to move upwards synchronously, and when the worker observes that the male die insert A passes through the through groove and the top surface of the male die insert A is pressed on the bottom surface of the blank, the worker immediately closes the hydraulic oil cylinder; then, a worker controls a piston rod of a hydraulic oil cylinder of the upper forming mechanism to extend downwards, the piston rod drives a lifting plate to move downwards, the lifting plate drives a power unit I, a heat dissipation plate and a female die insert A to synchronously move downwards, and when the worker observes that the bottom surface of the female die insert A is pressed on the top surface of the blank, the worker immediately closes the hydraulic oil cylinder, so that the clamping of the blank is realized;
s4, bending and forming the semi-finished product bending type high-density interconnection printed circuit board, wherein a piston rod of a hydraulic oil cylinder of a forming mechanism is controlled by a worker to continuously extend, a male die insert A jacks up a blank material in contact with the male die insert A, and the upwards-jacked blank material is sunken upwards in a groove of a female die insert A; when the piston rod is completely extended out, the male die insert A is just matched with the female die insert A to form a convex hull, and after pressure maintaining is carried out for a period of time, the semi-finished bent high-density interconnected printed circuit board can be formed by bending; in the process of bending forming, a worker controls the two blowers to start, the blowers blow airflow into the pipeline, the airflow is discharged to the outside finally through the pipeline, the inner cavity of the right hollow shaft, the closed cavity of the heat dissipation plate and the inner cavity of the left hollow shaft in sequence, and the airflow discharges heat accumulated on the heat dissipation plate to the outside in the process of flowing through the closed cavity, so that the male die insert A and the female die insert A are dissipated, and further the blank is dissipated;
s5, production of the finished bent high-density interconnection printed circuit board, which comprises the following specific operation steps:
s51, controlling a piston rod of a hydraulic oil cylinder of the lower forming mechanism to retract and reset downwards by a worker, and controlling a piston rod of a hydraulic oil cylinder of the upper forming mechanism to retract and reset upwards at the same time;
s52, after resetting, the worker controls the hydraulic motor to start, the hydraulic motor drives the turntable to rotate, the turntable drives the power unit II, the transverse plate and the semi-finished product bending type high-density interconnection printed circuit board to rotate, when the semi-finished bent high-density interconnection printed circuit board is observed to move right above the etching groove, the worker turns off the hydraulic motor, then turns on the motor II, the torque of the motor II is decelerated by the reducer II to drive the first connecting plate to rotate, the first connecting plate drives the transverse plate and the L plate to rotate, the L plate drives the semi-finished product bending type high-density interconnection printed circuit board to rotate, when the semi-finished product is rotated for a certain angle, the bending type high-density interconnection printed circuit board falls into the etching solution in the etching groove, the etching solution etches the area which is not shielded by the adhesive film, etching a circuit layer on the conductive layer to finally produce a finished bent high-density interconnection printed circuit board;
s6, controlling the hydraulic motor to rotate reversely, driving the transverse plate to reset by the hydraulic motor, closing the hydraulic motor after the limiting plate is clamped into the clamping groove of the limiting column, and repeating the operations to finish the continuous production of a plurality of products;
s7, when the product needs to be subjected to mold changing, a motor I of the lower forming mechanism is started, the torque of the motor I is reduced by a speed reducer I and then drives a driving chain wheel to rotate, the driving chain wheel drives a driven chain wheel to rotate through a chain, the driven chain wheel drives a left hollow shaft to rotate, the left hollow shaft drives a heat dissipation plate to turn over, and when a male mold insert B faces upwards, the motor I is immediately closed; the motor I of the upper forming mechanism is opened, the torque of the motor I is reduced by the speed reducer I and then drives the driving chain wheel to rotate, the driving chain wheel drives the driven chain wheel to rotate through the chain, the driven chain wheel drives the left hollow shaft to rotate, the left hollow shaft drives the heat dissipation plate to overturn, when the female die insert B faces downwards, the motor I is immediately closed, and at the moment, the female die insert B and the male die insert B are matched to form another type of product.
The invention has the following advantages:
1. the rotary straightening device comprises a power unit II and a hydraulic motor, wherein a rotary table is fixedly arranged on an output shaft of the hydraulic motor, the power unit II is arranged on the rotary table, a first connecting plate is fixedly arranged on the output shaft of the power unit II, a transverse plate is fixedly arranged on the first connecting plate, a second connecting plate is fixedly arranged at the other end of the transverse plate, a through groove positioned right above a lower forming mechanism is formed in the transverse plate, guide posts are slidably arranged on the two connecting plates, an L plate is fixedly arranged at one end of each guide post, the two L plates are oppositely arranged, a spring is sleeved on each guide post, one end of each spring is fixedly arranged on a vertical plate of each L plate, the other end of each spring is fixedly arranged on the connecting plate, and a positioning post is fixedly arranged on the top surface of the horizontal plate of each L plate; in the bending forming process, the left end and the right end of the blank are limited by the positioning columns, and the positioning columns can freely stretch out and draw back along the horizontal direction under the elasticity of the springs, so that the left end and the right end of the blank can freely extend in the horizontal direction, namely, the blank is not limited, and therefore two horizontal plates of the semi-finished bending type high-density interconnection printed circuit board are effectively prevented from upwarping upwards, and the production quality of the product is greatly improved.
2. A support of a rack of a lower forming mechanism is fixedly arranged on a workbench, a plurality of female die inserts A matched with the male die inserts A are fixedly arranged on the bottom surface of a heat dissipation plate of the lower forming mechanism, and a plurality of female die inserts B matched with the male die inserts B are fixedly arranged on the top surface of the heat dissipation plate of the lower forming mechanism; opening a motor I of the lower forming mechanism, driving a driving sprocket to rotate after the torque of the motor I is reduced by a speed reducer I, driving a driven sprocket to rotate by a chain by the driving sprocket, driving a left hollow shaft to rotate by the driven sprocket, driving a heat dissipation plate to turn over by the left hollow shaft, and immediately closing the motor I when a convex mold insert B faces upwards; the motor I of the upper forming mechanism is opened, the torque of the motor I is reduced by the speed reducer I and then drives the driving chain wheel to rotate, the driving chain wheel drives the driven chain wheel to rotate through the chain, the driven chain wheel drives the left hollow shaft to rotate, the left hollow shaft drives the heat dissipation plate to overturn, when the female die insert B faces downwards, the motor I is immediately closed, and at the moment, the female die insert B and the male die insert B are matched to form another type of product. Therefore, the rapid die change of the product is realized, the bending equipment is not required to be modified, the requirements of customers are met, the die change time is shortened, and the production efficiency of the product is greatly improved.
3. Turning on a motor II, reducing the torque of the motor II through a speed reducer II, driving a first connecting plate to rotate, driving a transverse plate and an L plate to rotate through the first connecting plate, driving a semi-finished product bending type high-density interconnection printed circuit board to rotate through the L plate, enabling the semi-finished product bending type high-density interconnection printed circuit board to fall into etching liquid in an etching groove after the semi-finished product bending type high-density interconnection printed circuit board rotates for a certain angle, and etching an area which is not shielded by an adhesive film through the etching liquid, so that a circuit layer is etched on a conductive layer, and finally a finished product bending type high-density interconnection printed circuit board is produced; therefore, the semi-finished circuit board is directly conveyed after being formed without manually transferring the semi-finished circuit board into the etching groove by workers, compared with the traditional manual conveying mode, the production time is greatly shortened, the labor intensity of the workers is reduced, and the production efficiency is greatly improved.
4. In the process of bending forming, a worker controls the two blowers to start, the blowers blow airflow into the pipeline, the airflow is discharged to the outside finally through the pipeline, the inner cavity of the right hollow shaft, the closed cavity of the heat dissipation plate and the inner cavity of the left hollow shaft in sequence, and the airflow discharges heat accumulated on the heat dissipation plate to the outside in the process of flowing through the closed cavity, so that the male die insert A and the female die insert A are dissipated, and further the blank is dissipated; thereby avoided the heat to pile up on the blank surface and leaded to the blank by the scaling loss to improved the appearance quality of the semi-manufactured goods type high density interconnection printed circuit board of buckling that the shaping was gone out, and then promoted the quality of product.
Drawings
FIG. 1 is a schematic diagram of a folded high-density interconnection PCB;
FIG. 2 is a schematic structural view of a blank;
FIG. 3 is a schematic structural view of the present invention;
FIG. 4 is a front view of FIG. 3;
FIG. 5 is a schematic view of the structure of the rotary straightening device;
FIG. 6 is a view taken along line A of FIG. 5;
FIG. 7 is an enlarged view of a portion I of FIG. 5;
FIG. 8 is a schematic structural view of the lower molding mechanism;
fig. 9 is a top view of the male mold insert a and the heat sink of fig. 8;
FIG. 10 is a schematic view of tooling blank positioning;
FIG. 11 is an enlarged partial view of section II of FIG. 10;
FIG. 12 is a schematic view of clamping a blank;
FIG. 13 is an enlarged partial view of section III of FIG. 12;
FIG. 14 is a schematic view of a semi-finished bent-type high-density interconnect printed circuit board being formed;
FIG. 15 is an enlarged partial view of the portion IV of FIG. 14;
fig. 16 is a schematic view of a transfer half-finished bent-type high-density interconnection printed circuit board;
in the figure, 1-an upper forming mechanism, 2-a lower forming mechanism, 3-a rotary straightening device, 4-a frame, 5-a hydraulic oil cylinder, 6-a heat dissipation plate, 7-a lifting plate, 8-a vertical plate, 9-a hollow shaft, 10-a closed cavity, 11-a male mold insert A, 12-a male mold insert B, 13-a blower, 14-a female mold insert A, 15-a female mold insert B, 16-a hydraulic motor, 17-a rotary table, 18-a first connecting plate, 19-a transverse plate, 20-a second connecting plate, 21-a through groove, 22-a guide column, 23-an L plate, 24-a spring, 25-a positioning column, 26-an etching groove, 27-a limiting column, 28-a limiting plate, 29-a clamping groove, 30-a pipeline and 31-a reducer I, 32-motor I, 33-driving chain wheel, 34-driven chain wheel, 35-chain, 36-reducer II, 37-motor II, 38-mounting plate, 39-locking screw, 40-convex hull, 41-horizontal plate, 42-workbench, 43-blank, 44-positioning hole, 45-semi-finished product bending type high-density interconnection printed circuit board, and 46-truss.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 3 to 9, the bending type high-density interconnected printed circuit board forming apparatus includes a workbench 42, an upper forming mechanism 1, a lower forming mechanism 2 and a rotary straightening device 3, the lower forming mechanism 2 and the upper forming mechanism 1 are arranged symmetrically up and down, the lower forming mechanism 2 includes a frame 4, a hydraulic cylinder 5 and a heat dissipation plate 6, the hydraulic cylinder 5 is fixedly arranged on the bottom surface of the frame 4, a piston rod of the hydraulic cylinder 5 penetrates through the frame, a lifting plate 7 is fixedly arranged on an extending end of the piston rod, two vertical plates 8 are fixedly arranged on the top surface of the lifting plate 7, the left and right end surfaces of the heat dissipation plate 6 are rotatably mounted on the vertical plates 8 through a hollow shaft 9, a closed cavity 10 communicating the inner cavity of the hollow shaft 9 is arranged in the heat dissipation plate 6, a plurality of male mold inserts a11 and a male mold insert B12 are detachably and fixedly arranged on the top surface and the bottom surface of the heat dissipation plate 6 along the horizontal direction, a power unit I and an air blower 13 are arranged on the bottom surface of the lifting plate 7, a transmission device is connected between the output end of the power unit I and the left hollow shaft 9, the air outlet of the air blower 13 is connected with the right hollow shaft 9, and a pipeline 30 is connected between the air outlet of the air blower 13 and the right hollow shaft 9; the support of the frame 4 of the upper forming mechanism 1 is fixedly arranged on a truss in a workshop, the support of the frame 4 of the lower forming mechanism 2 is fixedly arranged on a workbench, a plurality of female die inserts A14 matched with the male die inserts A11 are fixedly arranged on the bottom surface of the heat dissipation plate 6 of the lower forming mechanism 2, a plurality of female die inserts B15 matched with the male die inserts B12 are fixedly arranged on the top surface of the heat dissipation plate 6 of the lower forming mechanism 2, and the female die inserts and the male die inserts are both made of heat conducting materials. The height of the convex mold insert B12 is greater than that of the convex mold insert A11.
The rotary straightening device 3 comprises a power unit II and a hydraulic motor 16, the hydraulic motor 16 and an etching groove 26 are fixedly arranged on a frame 4 of the lower forming mechanism 2, a rotary table 17 is fixedly arranged on an output shaft of the hydraulic motor 16, the power unit II is arranged on the rotary table 17, a first connecting plate 18 is fixedly arranged on the output shaft of the power unit II, a transverse plate 19 is fixedly arranged on the first connecting plate 18, a second connecting plate 20 is fixedly arranged at the other end of the transverse plate 19, a through groove 21 positioned right above the lower forming mechanism 2 is arranged on the transverse plate 19, guide columns 22 are slidably arranged on the two connecting plates, an L plate 23 is fixedly arranged at one end of each guide column 22, the two L plates 23 are oppositely arranged, a spring 24 is sleeved on each guide column 22, one end of each spring 24 is fixedly arranged on a vertical plate of the L plate 23, the other end of each spring is fixedly arranged on the connecting plate, and a positioning column 25 is fixedly arranged on the top surface of a horizontal plate of each L plate 23; an etching groove 26 is arranged on the right side of the hydraulic motor 16; the rotary straightening device 3 further comprises a limiting column 27 fixedly arranged on the workbench 42 and a limiting plate 28 fixedly arranged on the second connecting plate 20, wherein a clamping groove 29 is formed in the limiting plate 28, and the clamping groove 29 of the limiting plate 28 is clamped on the limiting column 27 in a clamping manner.
The power unit I comprises a speed reducer I31 and a motor I32 which are fixedly arranged on the lifting plate 7, an output shaft of the motor I32 is connected with an input shaft of the speed reducer I31, the transmission device comprises a driving chain wheel 33, a driven chain wheel 34 and a chain 35, the driving chain wheel 33 is arranged on the output shaft of the speed reducer I31, the driven chain wheel 34 is arranged on the left hollow shaft 9, and the chain 35 is arranged between the driving chain wheel 33 and the driven chain wheel 34. The power unit II comprises a speed reducer II36 and a motor II37 which are fixedly arranged on the rotary table 17, an output shaft of the motor II37 is connected with an input shaft of the speed reducer II36, and an output shaft of the speed reducer II36 is arranged towards the left and is fixedly arranged on the first connecting plate 18.
The mounting plates 38 are fixedly arranged on the left side and the right side of the male die insert and the female die insert, the mounting plates 38 are fixedly arranged on the heat dissipation plate 6 through the locking screws 39 so as to fix the male die insert and the female die insert, when one of the male die insert and the female die insert is damaged, the corresponding locking screw 39 can be screwed out, and then a new female die insert or male die insert is arranged at the original position again, so that the integral replacement is not needed, and the production cost of the product is saved.
The hydraulic cylinder automatic control system further comprises a controller, wherein the controller is electrically connected with the motor I32, the motor II37, the electromagnetic valve of the hydraulic cylinder 5, the blower 13 and the electromagnetic valve of the hydraulic motor 16, a worker can control the motor I and the motor II to be started or closed through the controller, the blower 13 and the hydraulic motor 16 can be controlled to be started or closed simultaneously, and the piston rod of the hydraulic cylinder can be controlled to extend or retract, so that the remote operation of the worker is facilitated, and the hydraulic cylinder automatic control system has the characteristic of high automation degree.
The method for bending and molding the high-density interconnection printed circuit board by the molding equipment comprises the following steps:
s1, a worker takes a blank 43, and two positioning holes 44 are drilled at the left end and the right end of the blank 43 respectively to ensure that the distance between the two positioning holes 44 is equal to the distance between the two positioning columns 25; adhering an adhesive film on the heat conducting layer of the blank 43, and shielding the area which does not need to be etched on the heat conducting layer through the adhesive film;
s2, positioning the blank by using a tooling, wherein a worker respectively sleeves the two positioning holes 44 on the blank 43 on the two positioning columns 25, and supports the metal base layer of the blank 43 on the top surfaces of the two L-shaped plates 23 as shown in FIGS. 10-11, so that the quick positioning of the blank by using the tooling is realized, and the blank 43 is just positioned between the male mold insert A11 of the lower forming mechanism 2 and the female mold insert A14 of the upper forming mechanism 1 and is suspended right above the through groove 21;
s3, clamping the blank, wherein a worker controls a piston rod of a hydraulic oil cylinder 5 of the lower forming mechanism 2 to extend upwards, the piston rod drives a lifting plate 7 to move upwards, the lifting plate 7 drives a power unit I, a heat dissipation plate 6 and a male die insert A11 to move upwards synchronously, and when the worker observes that the male die insert A11 penetrates through the through groove 21 and the top surface of the male die insert A is pressed on the bottom surface of the blank 43, the worker immediately closes the hydraulic oil cylinder 5; then, a worker controls a piston rod of a hydraulic oil cylinder 5 of the upper forming mechanism 1 to extend downwards, the piston rod drives a lifting plate 7 to move downwards, the lifting plate 7 drives a power unit I, a heat dissipation plate 6 and a female die insert A14 to move downwards synchronously, and when the worker observes that the bottom surface of the female die insert A14 presses the top surface of a blank 43, the worker immediately closes the hydraulic oil cylinder 5 as shown in figures 12-13, so that clamping of the blank is realized, the blank 43 is in a horizontal state at the moment, and the quality of a subsequently formed convex hull is improved;
s4, bending and forming the semi-finished product bent high-density interconnected printed circuit board, wherein a worker controls a piston rod of a hydraulic oil cylinder 5 of the lower forming mechanism 2 to continuously extend, a male die insert A11 upwards jacks a blank 43 material in contact with the male die insert A11, the upwards-jacked blank material is upwards sunken in a groove of a female die insert A14, in the process, heat is generated on the blank 43, the blank 43 transmits the heat to a male die insert A11 and a female die insert A14, and the male die insert A11 and the female die insert A14 correspondingly transmit the heat to respective connected heat dissipation plates 6; when the piston rod is completely extended out, the male die insert A11 is just matched with the female die insert A14 to form a convex hull 40 as shown in figures 14-15, and when the pressure is maintained for a period of time, the semi-finished bent high-density interconnection printed circuit board can be bent and formed; in the bending forming process, a worker controls the two blowers 13 to be started, the blowers 13 blow airflow into the pipeline 30, the airflow is discharged to the outside finally through the pipeline 30, the inner cavity of the right hollow shaft 9, the sealed cavity of the heat dissipation plate 6 and the inner cavity of the left hollow shaft 9 in sequence, and the airflow discharges heat accumulated on the heat dissipation plate 6 to the outside in the process of flowing through the sealed cavity 10, so that the heat dissipation of the male die insert A11 and the female die insert A14 is realized, and further the blank is radiated; therefore, the burning loss of the blank caused by the heat accumulated on the surface of the blank is avoided, the appearance quality of the formed semi-finished product bent high-density interconnection printed circuit board is improved, and the quality of the product is further improved; in addition, in the bending and forming process, because the left end and the right end of the blank 43 are both limited by the positioning column 25, and the positioning column 25 can freely stretch out and draw back along the horizontal direction under the elasticity of the spring 24, the left end and the right end of the blank 43 can freely extend in the horizontal direction, namely, are not limited, so that the two horizontal plates 41 of the semi-finished product bending type high-density interconnection printed circuit board are effectively prevented from tilting upwards, and the production quality of the product is greatly improved.
S5, production of the finished bent high-density interconnection printed circuit board, which comprises the following specific operation steps:
s51, controlling the piston rod of the hydraulic oil cylinder 5 of the lower forming mechanism 2 to retract and reset downwards by workers, and controlling the piston rod of the hydraulic oil cylinder 5 of the upper forming mechanism 1 to retract and reset upwards at the same time;
s52, after resetting, a worker controls the hydraulic motor 16 to start, the hydraulic motor 16 drives the turntable 17 to rotate, the turntable 17 drives the power unit II, the transverse plate 19 and the semi-finished product bending type high-density interconnection printed circuit board 45 to rotate, when the semi-finished product bending type high-density interconnection printed circuit board 45 is observed to move right above the etching groove 26, the worker closes the hydraulic motor 16, then the worker opens the motor II37, the torque of the motor II37 is reduced by the reducer II36 to drive the first connecting plate 18 to rotate, the rotation direction is as shown by an arrow in figure 16, the first connecting plate 18 drives the transverse plate 19 and the L plate 23 to rotate, the L plate 23 drives the semi-finished product bending type high-density interconnection printed circuit board 45 to rotate, when the semi-finished product bending type high-density interconnection printed circuit board 45 rotates for a certain angle, the semi-finished product bending type high-density interconnection printed circuit board 45 falls into the etching liquid in the etching groove 26, and the etching liquid etches the area which is not shielded by the glue film, etching a circuit layer on the conductive layer to finally produce a finished bent high-density interconnection printed circuit board; therefore, workers do not need to manually transfer the semi-finished circuit board into the etching groove 26, and the semi-finished circuit board is directly conveyed after being formed, so that compared with the traditional manual conveying mode, the production time is greatly shortened, the labor intensity of the workers is reduced, and the production efficiency is greatly improved;
s6, controlling the hydraulic motor 16 to rotate reversely, driving the transverse plate 19 to reset by the hydraulic motor 16, closing the hydraulic motor 16 after the limiting plate 28 is clamped into the clamping groove 29 of the limiting column 27, and repeating the operation to finish the continuous production of a plurality of products;
s7, when the product needs to be reshaped, a motor I32 of the lower forming mechanism 2 is turned on, the torque of the motor I32 is reduced by a reducer I31 and then drives a driving sprocket 33 to rotate, the driving sprocket 33 drives a driven sprocket 34 to rotate by a chain 35, the driven sprocket 34 drives a left hollow shaft 9 to rotate, the left hollow shaft 9 drives a heat dissipation plate 6 to turn over, and when a male die insert B12 faces upwards, the motor I32 is immediately turned off; the motor I32 of the upper forming mechanism 1 is turned on, the torque of the motor I32 is reduced by the reducer I31 and then drives the driving chain wheel 33 to rotate, the driving chain wheel 33 drives the driven chain wheel 34 to rotate through the chain 35, the driven chain wheel 34 drives the left hollow shaft 9 to rotate, the left hollow shaft 9 drives the heat dissipation plate 6 to turn over, the motor I32 is immediately turned off when the female die insert B15 faces downwards, and at the moment, another type of product can be formed by the matching of the female die insert B15 and the male die insert B12. Therefore, the rapid die change of the product is realized, the bending equipment is not required to be modified, the requirements of customers are met, the die change time is shortened, and the production efficiency of the product is greatly improved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. Bending type high-density interconnection printed circuit board forming equipment is characterized in that: the device comprises a workbench (42), an upper forming mechanism (1), a lower forming mechanism (2) and a rotary straightening device (3), wherein the lower forming mechanism (2) and the upper forming mechanism (1) are arranged in an up-down symmetrical manner, the lower forming mechanism (2) comprises a rack (4), a hydraulic oil cylinder (5) and a heat dissipation plate (6), the hydraulic oil cylinder (5) is fixedly arranged on the bottom surface of a rack of the rack (4), a piston rod of the hydraulic oil cylinder (5) penetrates through the rack, a lifting plate (7) is fixedly arranged on an extending end of the piston rod, two vertical plates (8) are fixedly arranged on the top surface of the lifting plate (7), the left end surface and the right end surface of the heat dissipation plate (6) are rotatably arranged on the vertical plates (8) through a hollow shaft (9), a closed cavity (10) communicated with the inner cavity of the hollow shaft (9) is formed in the heat dissipation plate (6), and a plurality of male mold inserts A (11) and B (12) are fixedly arranged on the top surface and the bottom surface of the heat dissipation plate (6) along the horizontal direction, a power unit I and an air blower (13) are arranged on the bottom surface of the lifting plate (7), a transmission device is connected between the output end of the power unit I and the hollow shaft (9) on the left side, and an air outlet of the air blower (13) is connected with the hollow shaft (9) on the right side; the post of the rack (4) of the upper forming mechanism (1) is fixedly arranged on a truss in a workshop, the post of the rack (4) of the lower forming mechanism (2) is fixedly arranged on a workbench, a plurality of female die inserts A (14) matched with the male die inserts A (11) are fixedly arranged on the bottom surface of the heat dissipation plate (6) of the lower forming mechanism (2), and a plurality of female die inserts B (15) matched with the male die inserts B (12) are fixedly arranged on the top surface of the heat dissipation plate (6) of the lower forming mechanism (2).
2. The apparatus for forming a meander-type high-density interconnect printed circuit board as recited in claim 1, wherein: the rotary straightening device (3) comprises a power unit II and a hydraulic motor (16), a rotary table (17) is fixedly arranged on an output shaft of the hydraulic motor (16), the power unit II is arranged on the rotary table (17), a first connecting plate (18) is fixedly arranged on the output shaft of the power unit II, a transverse plate (19) is fixedly arranged on the first connecting plate (18), a second connecting plate (20) is fixedly arranged at the other end of the transverse plate (19), a through groove (21) positioned right above the lower forming mechanism (2) is formed in the transverse plate (19), guide columns (22) are slidably arranged on the two connecting plates respectively, an L plate (23) is fixedly arranged at one end of each guide column (22), the two L plates (23) are oppositely arranged, a spring (24) is sleeved on each guide column (22), one end of each spring (24) is fixedly arranged on a vertical plate of the L plate (23), the other end of each guide column is fixedly arranged on the connecting plate, and a positioning column (25) is fixedly arranged on the top surface of a horizontal plate of each L plate (23); an etching groove (26) is arranged on the right side of the hydraulic motor (16); the rotary straightening device (3) further comprises a limiting column (27) fixedly arranged on the workbench (42) and a limiting plate (28) fixedly arranged on the second connecting plate (20), a clamping groove (29) is formed in the limiting plate (28), and the clamping groove (29) of the limiting plate (28) is clamped on the limiting column (27).
3. The apparatus for forming a meander-type high-density interconnect printed circuit board as recited in claim 1, wherein: the height of the convex mold insert B (12) is greater than that of the convex mold insert A (11).
4. The apparatus for forming a meander-type high-density interconnect printed circuit board as recited in claim 1, wherein: and a pipeline (30) is connected between the air outlet of the air blower (13) and the right hollow shaft (9).
5. The apparatus for forming a meander-type high-density interconnect printed circuit board as recited in claim 1, wherein: the power unit I comprises a speed reducer I (31) and a motor I (32) which are fixedly arranged on a lifting plate (7), an output shaft of the motor I (32) is connected with an input shaft of the speed reducer I (31), the transmission device comprises a driving chain wheel (33), a driven chain wheel (34) and a chain (35), the driving chain wheel (33) is arranged on the output shaft of the speed reducer I (31), the driven chain wheel (34) is arranged on a left hollow shaft (9), and the chain (35) is arranged between the driving chain wheel (33) and the driven chain wheel (34).
6. The apparatus for forming a meander-type high-density interconnect printed circuit board as recited in claim 1, wherein: the hydraulic motor (16) and the etching groove (26) are both fixedly arranged on the frame (4) of the lower forming mechanism (2).
7. The apparatus for forming a meander-type high-density interconnect printed circuit board as recited in claim 1, wherein: the power unit II comprises a speed reducer II (36) and a motor II (37) which are fixedly arranged on the rotary table (17), an output shaft of the motor II (37) is connected with an input shaft of the speed reducer II (36), and an output shaft of the speed reducer II (36) is arranged towards the left and fixedly arranged on the first connecting plate (18).
8. The apparatus for forming a meander-type high-density interconnect printed circuit board as recited in claim 1, wherein: the mounting plates (38) are fixedly arranged on the left side and the right side of the male die insert and the right side of the female die insert, and the mounting plates (38) are fixedly arranged on the heat dissipation plate (6) through locking screws (39) so as to fix the male die insert and the female die insert.
9. The apparatus for forming a meander-type high-density interconnect printed circuit board as recited in claim 1, wherein: the hydraulic control system further comprises a controller, and the controller is electrically connected with the motor I (32), the motor II (37), the electromagnetic valve of the hydraulic oil cylinder (5), the blower (13) and the electromagnetic valve of the hydraulic motor (16).
10. The method for bending and forming a high-density interconnection printed circuit board by using the forming apparatus according to any one of claims 1 to 9, wherein: it comprises the following steps:
s1, a worker takes a blank (43), two positioning holes (44) are drilled at the left end and the right end of the blank (43) respectively, and the distance between the two positioning holes (44) is ensured to be equal to the distance between the two positioning columns (25); pasting an adhesive film on the heat conduction layer of the blank (43), and shielding the area which does not need to be etched on the heat conduction layer through the adhesive film;
s2, positioning the blank by using a tooling, namely respectively sleeving two positioning holes (44) in the blank (43) on two positioning columns (25) by using a worker, and supporting a metal base layer of the blank (43) on the top surfaces of two L-shaped plates (23) by using the worker, so that the quick tooling positioning of the blank is realized, and at the moment, the blank (43) is just positioned between a male die insert A (11) of a lower forming mechanism (2) and a female die insert A (14) of an upper forming mechanism (1) and is suspended right above a through groove (21);
s3, clamping the blank, controlling a piston rod of a hydraulic oil cylinder (5) of the lower forming mechanism (2) to extend upwards by a worker, driving the piston rod to move upwards by a lifting plate (7), driving a power unit I, a heat dissipation plate (6) and a male die insert A (11) to move upwards synchronously by the lifting plate (7), and immediately closing the hydraulic oil cylinder (5) by the worker after the worker observes that the male die insert A (11) penetrates through the through groove (21) and the top surface of the male die insert A is pressed on the bottom surface of the blank (43); then, a worker controls a piston rod of a hydraulic oil cylinder (5) of the upper forming mechanism (1) to extend downwards, the piston rod drives a lifting plate (7) to move downwards, the lifting plate (7) drives a power unit I, a heat dissipation plate (6) and a female die insert A (14) to synchronously move downwards, and when the worker observes that the bottom surface of the female die insert A (14) is pressed on the top surface of a blank (43), the worker immediately closes the hydraulic oil cylinder (5), so that the blank is clamped;
s4, bending and forming the semi-finished product bent high-density interconnection printed circuit board, wherein a worker controls a piston rod of a hydraulic oil cylinder (5) of a lower forming mechanism (2) to continuously extend, a male die insert A (11) jacks up a blank (43) material contacted with the male die insert A, the upwards-jacked blank material is upwards sunken in a groove of a female die insert A (14), in the process, heat is generated on the blank (43), the blank (43) transmits the heat to the male die insert A (11) and the female die insert A (14), and the male die insert A (11) and the female die insert A (14) correspondingly transmit the heat to respective connected heat dissipation plates (6); after the piston rod is completely extended out, the male die insert A (11) is just matched with the female die insert A (14) to form a convex hull (40), and after pressure maintaining is carried out for a period of time, the semi-finished bent high-density interconnection printed circuit board can be bent and formed; in the bending forming process, a worker controls the two air blowers (13) to be started, the air blowers (13) blow air flows into the pipeline (30), the air flows are discharged to the outside finally through the pipeline (30), the inner cavity of the right hollow shaft (9), the sealed cavity of the heat dissipation plate (6) and the inner cavity of the left hollow shaft (9) in sequence, and the air flows through the sealed cavity (10) to discharge heat accumulated on the heat dissipation plate (6) to the outside, so that the heat dissipation of the male die insert A (11) and the female die insert A (14) is realized, and further the blank is radiated;
s5, production of the finished bent high-density interconnection printed circuit board, which comprises the following specific operation steps:
s51, controlling a piston rod of a hydraulic oil cylinder (5) of the lower forming mechanism (2) to retract and reset downwards by a worker, and controlling a piston rod of the hydraulic oil cylinder (5) of the upper forming mechanism (1) to retract and reset upwards at the same time;
s52, after resetting, a worker controls the hydraulic motor (16) to start, the hydraulic motor (16) drives the turntable (17) to rotate, the turntable (17) drives the power unit II, the transverse plate (19) and the semi-finished product bending type high-density interconnection printed circuit board (45) to rotate, when the semi-finished product bending type high-density interconnection printed circuit board (45) is observed to move right above the etching groove (26), the worker closes the hydraulic motor (16), then the worker opens the motor II (37), the torque of the motor II (37) is reduced by the reducer II (36) to drive the first connecting plate (18) to rotate, the first connecting plate (18) drives the transverse plate (19) and the L plate (23) to rotate, the L plate (23) drives the semi-finished product bending type high-density interconnection printed circuit board (45) to rotate, and when the semi-finished product bending type high-density interconnection printed circuit board (45) falls into the etching solution in the etching groove (26) after rotating for a certain angle, etching the area which is not shielded by the adhesive film by the etching solution so as to etch a circuit layer on the conductive layer, thereby finally producing a finished product of the bent high-density interconnection printed circuit board;
s6, controlling the hydraulic motor (16) to rotate reversely, enabling the hydraulic motor (16) to drive the transverse plate (19) to reset, closing the hydraulic motor (16) after the limiting plate (28) is clamped into the clamping groove (29) of the limiting column (27), and repeating the operation to finish the continuous production of a plurality of products;
s7, when a product needs to be subjected to mold changing, a motor I (32) of the lower forming mechanism (2) is started, the torque of the motor I (32) is reduced by a speed reducer I (31) and then drives a driving sprocket (33) to rotate, the driving sprocket (33) drives a driven sprocket (34) to rotate by a chain (35), the driven sprocket (34) drives a left hollow shaft (9) to rotate, the left hollow shaft (9) drives a heat dissipation plate (6) to turn over, and when a male mold insert B (12) faces upwards, the motor I (32) is immediately closed; the motor I (32) of the upper forming mechanism (1) is opened, the torque of the motor I (32) is reduced by the speed reducer I (31) and then drives the driving chain wheel (33) to rotate, the driving chain wheel (33) drives the driven chain wheel (34) to rotate through the chain (35), the driven chain wheel (34) drives the left hollow shaft (9) to rotate, the left hollow shaft (9) drives the heat dissipation plate (6) to overturn, the motor I (32) is immediately closed when the female die insert B (15) faces downwards, and at the moment, the female die insert B (15) and the male die insert B (12) can be used for forming another type of product in a matching mode.
CN202110770924.XA 2021-07-07 2021-07-07 Forming equipment and forming method of bent high-density interconnection printed circuit board Withdrawn CN113543489A (en)

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Application Number Priority Date Filing Date Title
CN202110770924.XA CN113543489A (en) 2021-07-07 2021-07-07 Forming equipment and forming method of bent high-density interconnection printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110770924.XA CN113543489A (en) 2021-07-07 2021-07-07 Forming equipment and forming method of bent high-density interconnection printed circuit board

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113709994A (en) * 2021-11-01 2021-11-26 四川英创力电子科技股份有限公司 Production equipment and method for forming conducting layer on resistance welding surface of circuit board
CN117507322A (en) * 2024-01-04 2024-02-06 新创源云海(成都)科技有限公司 Automatic production device and method for carrier tape for packaging components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113709994A (en) * 2021-11-01 2021-11-26 四川英创力电子科技股份有限公司 Production equipment and method for forming conducting layer on resistance welding surface of circuit board
CN113709994B (en) * 2021-11-01 2022-01-25 四川英创力电子科技股份有限公司 Production equipment and method for forming conducting layer on resistance welding surface of circuit board
CN117507322A (en) * 2024-01-04 2024-02-06 新创源云海(成都)科技有限公司 Automatic production device and method for carrier tape for packaging components
CN117507322B (en) * 2024-01-04 2024-03-19 新创源云海(成都)科技有限公司 Automatic production device and method for carrier tape for packaging components

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