TW202111766A - Double-swing-arm die-bonding device for LED die bonding and die bonding method thereof - Google Patents

Abstract

The invention discloses a double-swing-arm die-bonding device for LED die bonding and a die bonding method thereof. The die-bonding device comprises a table board, and a double-swing-arm die-bonding mechanism arranged on the table board, wherein a crystal ring moving platform is arranged above the double-swing-arm die-bonding mechanism, and a clamp moving platform is arranged below the double-swing-arm die-bonding mechanism; an automatic crystal ring feeding mechanism is arranged on one side of the clamp moving platform, while a lens assembly is arranged on the other side of the clamp moving platform; and an ejector pin assembly is further arranged above the crystal ring moving platform. The lens assembly is used for assisting the crystal ring moving platform and a clamp to move to a designated position. The ejector pin assembly is used for ejecting an LED wafer on the crystal ring moving platform; the double-swing-arm die-bonding mechanism drives the two die-bonding arms to rotate in a plane perpendicular to the horizontal plane, and then sucks ejected wafers to fix the ejected wafers to an LED bracket; the automatic crystal ring feeding mechanism is used for feeding or recovering he crystal ring; and compared with a traditional crystal fixing mode, the die bonding device is used for carrying out continuous die bonding by arranging the two die-bonding swing arms to rotate, so that the die bonding speed is increased, and the application range is wide.

Description

Double-swing arm crystal bonding device for LED crystal bonding and crystal bonding method thereof

The invention relates to LED processing equipment, in particular to a double-swing arm die-bonding device for LED die-bonding and a die-bonding method thereof.

Light Emitting Diode (LED) is a light emitting element that can convert electrical energy into light energy. LED products can be used in many fields such as lighting, display, and signal indication. With the continuous development of LED technology, the requirements for LED die-bonding speed are getting higher and higher.

The current LED die bonding process is as follows: because the LED chips are usually glued on the wafer ring film by the supplier, first the ejector mechanism lifts the designated LED chip from the wafer ring film, and then through the die die bonding mechanism The swing arm rotates horizontally to directly above the designated LED chip and then moves up and down to absorb the designated LED chip on the crystal ring film and transport it to the designated position of the dispensed LED bracket. The die-bonding arm moves up and down to complete the die-bonding operation. In this way of working, since only one LED chip can be sucked and transported at a time, the work efficiency is low and the die bonding speed is slow. And for the die bonding of large-size LED stents, traditional die bonding methods often need to increase the length and weight of the swing arm to meet the needs of die bonding. The increase in the length and weight of the swing arm will increase the amount of inertia during the movement, which will lead to Coming speed and accuracy drop.

In view of the above-mentioned shortcomings of the prior art and market demand, there is an urgent need to develop a new type of LED die-bonding device.

In view of this, our inventors devoted themselves to further research, and proceeded to develop and improve, hoping to develop a better invention to solve the above problems, and after continuous experimentation and modification, the present invention came out.

In view of the shortcomings in the prior art, the technical problem to be solved by the present invention is to provide a dual-swing arm die-bonding device for LED die-bonding and a die-attaching method thereof. The purpose of developing the double-swing arm die-bonding device for LED die is to reduce LED processing links, improve LED processing efficiency and accuracy.

In order to solve the above technical problems, the present invention is implemented by the following scheme: a dual-swing arm die-bonding device for LED die-bonding, the double-swing arm die-bonding device includes:

Platen;

It also includes:

A die-bonding mechanism is provided with two die-bonding pendulum arms, a telescopic drive mechanism that drives the two die-bonding pendulum arms to move toward or in the opposite direction, and the telescopic drive mechanism is connected and driven to drive the two die-bonding pendulum arms to rotate Rotary drive mechanism;

The fixture moving platform is arranged on the adjacent side of the crystal bonding mechanism, and is provided with a first lateral slide mechanism, a first longitudinal slide mechanism seated on the first lateral slide mechanism, and a first longitudinal slide mechanism installed on the first lateral slide mechanism. A pulley assembly used for receiving and conveying the LED bracket at the upper end of the longitudinal slide rail mechanism, the LED bracket can be conveyed to the clamping part of the two solid crystal swing arms;

The mounting frame is vertically fixed on the corner side of the fixture moving platform, the lower surface of the mounting plate at the upper end is provided with a crystal ring moving platform assembly and a thimble assembly, and the crystal ring moving platform assembly is provided with a second transverse slide rail mechanism , A second longitudinal slide rail mechanism arranged on the lower side of the second transverse slide rail mechanism, a crystal frame mounting plate horizontally arranged on the second longitudinal slide rail mechanism, and a belt mounted on the crystal frame mounting plate A rotating assembly, the belt rotating assembly is provided with a crystal ring placement groove for placing a crystal ring, and the thimble assembly is provided with an LED chip jacking mechanism for jacking up the LED chip on the crystal ring;

The lens assembly is arranged on one side of the fixture moving platform, and is provided with a crystal taking lens assembly for cooperating with the crystal ring moving platform assembly to move to a set position and performing chip correction, and for assisting the fixture moving platform to move the LED bracket to Set position of die-bonding lens assembly;

The automatic crystal ring mechanism is provided with a material box lifting assembly for lifting the material box and a crystal ring conveying assembly. The material box is stored with a crystal ring, and the material box lifting assembly raises the material box to a set height so that the The crystal ring handling component picks up the crystal ring and sends it to the crystal ring placement groove on the crystal ring moving platform assembly.

Further, the die-bonding mechanism further includes a die-attachment base fixed on the platen, the top plate surface of the die-bonding base is provided with a lateral rotation drive mechanism, the rotation drive mechanism and the telescopic drive mechanism There is a rigid connection between the two ends of the telescopic drive mechanism. Both ends of the telescopic drive mechanism are provided with telescopic parts. The outer end of the telescopic part is provided with a connecting block. The connecting block is connected with a die-bonding pendulum arm. The swing arms move towards or opposite to each other to form an open-close loosening or clamping action. The side of the telescopic drive mechanism is also provided with a cross slide rail, and the die-bonding pendulum arm is driven by the telescopic drive mechanism along the cross slide rail. Telescopic movement, and the die-bonding swing arm can rotate and telescopically move relative to the die-bonding base in its rotating plane. The telescopic drive mechanism along with the die-bonding pendulum arm is driven by the rotary drive mechanism and is perpendicular to the horizontal plane. Do a rotation movement in the plane of the

Further, the fixture moving platform includes a first base, a first longitudinal slide rail longitudinally arranged on the first base, a first transverse slide platform transversely arranged on the first longitudinal slide rail, and the first longitudinal slide rail is provided on the first longitudinal slide rail. There are two longitudinal slide rails, which are fixed side by side on the first base, and form a first longitudinal slide rail mechanism with the slider provided at the lower end of the first horizontal slide table. Fixture mounting seat is provided on it;

The first horizontal sliding table is provided with a first horizontal sliding rail, the first horizontal sliding rail is provided with two, which are fixed side by side on the first horizontal sliding table, and the The sliding block forms a first transverse sliding rail mechanism;

The clamp mounting seat is provided with a pulley assembly, the pulley assembly includes a belt and a motor assembly that drives the belt to rotate, a pallet connecting block is provided on the belt down belt, the pallet connecting block is connected with a pallet, and the motor The assembly drives the belt to rotate to drive the pallet to move back and forth. The pallet is used to provide an LED bracket conveying device, the LED bracket conveying device is used to receive and convey the LED bracket, and the pulley assembly passes through the first longitudinal slide rail and the first longitudinal slide rail. The horizontal sliding table moves horizontally and vertically;

The first longitudinal slide rail and the first transverse slide table are both driven by motors connected to them.

Further, the crystal ring mobile platform assembly includes a second base fixed on the lower end surface of the upper end mounting plate of the mounting frame, a second horizontal slide rail disposed transversely on the second base, and a second horizontal slide rail longitudinally disposed on the second horizontal slide rail The first longitudinal slide table, the first longitudinal slide table is provided with a second longitudinal slide rail, the second longitudinal slide rail is provided with a crystal frame mounting plate, and the crystal frame mounting plate is provided with a belt rotating assembly , The belt rotating assembly is provided with a crystal ring placing groove for placing the crystal ring, the crystal ring is fed into the crystal ring placing groove from the automatic crystal ring loading mechanism, and the crystal ring can be carried out by the belt rotating assembly Rotate, and can move horizontally and vertically through the second horizontal slide rail and the second longitudinal slide rail;

There are two second transverse slide rails, which are arranged on both sides of the lower end surface of the second base. A slider is provided between the two second transverse slide rails, and the slider is connected to the first motor through the first screw. It forms a second horizontal slide mechanism with the second horizontal slide, and the first motor drives the screw to rotate to drive the slider and the second longitudinal slide mechanism connected to the lower end of the slider to move;

The second longitudinal slide rail mechanism is provided with two second longitudinal slide rails and a slider assembly. The two second longitudinal slide rails are arranged on both sides of the lower end of the first longitudinal slide table. The slider assembly is connected to the second motor through the second screw. , The second motor drives the second screw to rotate and drive the slider assembly and the crystal frame mounting plate connected with the lower end of the slider assembly to move longitudinally.

Further, the thimble assembly includes a thimble and a thimble driving mechanism, the thimble driving mechanism is used to drive the thimble to move up and down, and the thimble is used to push up a wafer at a set position on the crystal ring.

Further, the lens assembly includes a lens assembly fixing column, a crystal-taking lens assembly and a die-attach lens assembly. The crystal-taking lens assembly and the die-attach lens assembly are fixed on the upper side of the lens assembly fixing column one by one. Both are provided with a lens and a camera, the crystal taking lens assembly is used to coordinate the crystal ring mobile platform assembly to move to a set position and calibrate the wafer, and the die-attach lens assembly is used to cooperate with the fixture moving platform to move the LED bracket to the set position, The lens and camera on the crystal-taking lens assembly and the die-bonding lens assembly perform image recognition and storage.

Further, the automatic crystal ring loading mechanism includes a material box lifting assembly and a crystal ring handling assembly;

The material box lifting assembly includes a third motor, a third screw, a first sliding block assembly, and a material box. The third motor is installed in the hole of the platen through the motor box. The third screw rod is connected to the first slider assembly, the first slider assembly is horizontally installed with a horizontal plate obliquely upward, and the horizontal plate is installed with a material box, and the vertical side plate of the first slider assembly is set in the vertical direction. On the slide rail, the vertical slide rail is fixed on the support plate at the upper end of the motor box,

The crystal ring handling assembly is arranged on the adjacent side of the magazine lifting assembly, and includes a screw mounting seat, a fourth motor, a fourth screw, a second sliding block assembly, and a crystal ring holding frame. The screw mounting seat is fixed On the platen, a fourth screw is arranged inside, one side end of which fixes the fourth motor, the driving end of the fourth motor is connected to the fourth screw, and the rod of the fourth screw is screwed A crystal ring holding frame, the crystal ring holding frame includes an L-shaped bracket rod and a crystal ring holding portion, the end of the L-shaped bracket is connected to the crystal ring holding portion, and the crystal ring holding portion is provided with a clip Holding the cylinder, the clamping part of the clamping cylinder faces the direction of the material box;

The cartridge lifting assembly is used to lift the crystal ring stored in the cartridge, the fourth motor drives the fourth screw to rotate to drive the second slider assembly to move, and the second slider assembly drives the crystal ring holder to move, The clamping part on the clamping cylinder enters the material box to clamp the crystal ring, and then the crystal ring is transported to the crystal ring placement groove on the crystal ring moving platform assembly through the crystal ring conveying assembly.

A method for bonding a dual-swing arm bonding device of an LED bonding machine, the method includes the following steps:

Step 1: With the assistance of the die-bonding lens assembly, the system controls the fixture moving platform to move horizontally and longitudinally, thereby driving the LED bracket on it to move to the die-bonding position;

Step 2: With the assistance of the crystal lens assembly, the system control ring moves the platform assembly to move horizontally and longitudinally, thereby driving the crystal ring on it to move to the specified position and correct it;

Step 4: The rotary drive mechanism drives one of the die-bonding swing arms to rotate and move directly above the wafer, the ejector pin assembly ejects an LED chip on the die ring, and the driven die-bonding swing arm sucks the ejected wafer and rotates Fix it to the LED bracket at 180°, and at the same time, the other die-bonding swing arm rotates at the same angle and moves to the top of the chip;

Step 5: The ejector pin assembly pushes out another LED chip on the crystal ring, and the die-bonding swing arm sucks the chip and rotates 180° to fix the chip on the LED bracket;

Step 6, repeat steps 4 and 5 to complete the die bonding of the entire LED bracket.

Compared with the prior art, the beneficial effects of the present invention are:

1. Compared with the traditional bonding method, the present invention is provided with two bonding swing arms for continuous bonding, which improves the bonding efficiency.

2. The present invention has a compact structure, saves production space for enterprises, and can adapt to the solid crystal bonding of LED brackets of various sizes without increasing the length of the swing arm. It has multiple functions, better adaptability, and can effectively improve enterprise benefits.

Regarding the technical means of our inventors, several preferred embodiments are described in detail below in conjunction with the drawings, in order to provide a thorough understanding and approval of the present invention.

The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those with ordinary knowledge in the technical field to which the present invention belongs. Therefore, the protection scope of the present invention is defined more clearly. Obviously, the described embodiments of the present invention are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person with ordinary knowledge in the technical field of the present invention without making progressive work shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the pointed device or element must have a specific orientation or a specific orientation. The structure and operation cannot therefore be understood as a limitation of the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.

In the description of the present invention, it should be noted that the terms "installed", "connected", and "connected" should be understood in a broad sense unless otherwise clearly specified and limited. For example, they can be fixed or detachable. Connected or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of the two components, it can be a wireless connection, or it can be a wired connection connection. For those with ordinary knowledge in the technical field to which the present invention belongs, the specific meaning of the above-mentioned terms in the present invention can be understood in specific situations.

In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

Example 1. The specific structure of the present invention is as follows:

Please refer to Figures 1-8, a dual-swing arm die-bonding device for LED die bonding of the present invention, the double-swing arm die-bonding device includes:

Platen 1;

It also includes:

The die-bonding mechanism 6 is provided with two die-bonding swing arms 6-4, a telescopic drive mechanism 6-3 that drives the two die-bonding pendulum arms 6-4 to move toward or in the opposite direction, and connects and drives the telescopic drive mechanism 6-3 Rotation drive mechanism 6-2 that drives the two die-bonding swing arms 6-4 to rotate;

The fixture moving platform 2 is arranged on the adjacent side of the crystal bonding mechanism 6, on which is arranged a first transverse slide rail mechanism, a first longitudinal slide rail mechanism seated on the first transverse slide rail mechanism, and a first longitudinal slide rail mechanism installed on the first transverse slide rail mechanism. The pulley assembly 2-6 at the upper end of the first longitudinal slide mechanism for receiving and conveying the LED bracket, the LED bracket can be conveyed to the clamping part of the two die-bonding swing arms 6-4;

The mounting frame is vertically fixed on the corner side of the fixture moving platform 2. The crystal ring moving platform assembly 3 and the thimble assembly 5 are arranged on the lower bottom surface of the mounting plate at the upper end, and the crystal ring moving platform assembly 3 is provided with a second A horizontal slide mechanism, a second longitudinal slide mechanism arranged on the lower side of the second horizontal slide mechanism, a crystal frame mounting plate 3-5 horizontally arranged on the second longitudinal slide mechanism, and a crystal frame mounting plate 3-5 installed on the The belt rotating assembly 3-6 on the crystal frame mounting plate 3-5, the belt rotating assembly 3-6 is provided with a crystal ring placement groove for placing the crystal ring, and the thimble assembly 5 is provided with a place for lifting up The LED chip jacking mechanism of the LED chip on the crystal ring;

The lens assembly 4 is arranged on one side of the fixture moving platform 2, and is provided with a crystal taking lens assembly 4-1 for cooperating with the crystal ring moving platform assembly 3 to move to a set position and performing wafer correction, and for assisting the movement of the fixture The platform 2 moves the LED bracket to the fixed crystal lens assembly 4-2 at the set position;

The automatic crystal ring mechanism 7 is provided with a material box lifting assembly 7-1 for lifting the material box and a crystal ring handling assembly 7-2. The crystal ring is stored in the material box, and the material box lifting assembly 7-1 will The material box is raised to a set height so that the crystal ring handling assembly 7-2 picks up the crystal ring and sends it to the crystal ring placement groove on the crystal ring moving platform assembly 3.

A preferred technical solution of this embodiment: The die bonding mechanism 6 further includes a die bonding base 6-1 fixed on the platen 1, and the top plate of the die bonding base 6-1 is provided with a lateral The rotary drive mechanism 6-2, the rotary drive mechanism 6-2 and the telescopic drive mechanism 6-3 are rigidly connected, both ends of the telescopic drive mechanism 6-3 are provided with telescopic parts, and the outer ends of the telescopic parts are connected Block, the connecting block is connected with the die-bonding pendulum arm 6-4, the two die-bonding pendulum arms 6-4 are in a straight line, and the two die-bonding pendulum arms 6-4 move toward or opposite to each other, forming a tension-closing loosening or clamping The side of the telescopic drive mechanism 6-3 is also provided with a cross slide 6-5, and the die bonding arm 6-4 is driven by the telescopic drive mechanism 6-3 along the cross slide 6-5. Telescopic movement, and then the die bonding swing arm 6-4 can rotate and telescopically move relative to the die bonding base 6-1 in its rotating plane, and the telescopic drive mechanism 6-3 is together with the die bonding swing arm 6-4 Driven by the rotary drive mechanism 6-2, the rotary motion is performed along a plane perpendicular to the horizontal plane.

A preferred technical solution of this embodiment: The fixture moving platform 2 includes a first base 2-1, a first longitudinal slide rail 2-2 longitudinally arranged on the first base 2-1, and a first longitudinal slide rail 2-2 arranged transversely on the first base 2-1. The first horizontal slide 2-3 on the first longitudinal slide rail 2-2, the first longitudinal slide rail 2-2 is provided with two, which are fixed side by side on the first base 2-1, and The sliding block arranged at the lower end of the first horizontal sliding table 2-3 forms a first longitudinal sliding rail mechanism, and the first horizontal sliding rail 2-4 is provided with a clamp mounting seat 2-5;

The first horizontal sliding table 2-3 is provided with a first horizontal sliding rail 2-4, the first horizontal sliding rail 2-4 is provided with two, which are fixed side by side on the first horizontal sliding table 2- 3, it forms a first transverse slide rail mechanism with the slider provided at the bottom of the fixture mounting seat 2-5;

The clamp mounting seat 2-5 is provided with a pulley assembly 2-6, the pulley assembly 2-6 includes a belt 2-7 and a motor assembly that drives the belt to rotate, and the belt 2-7 is provided with a support plate on the lower belt Connecting block, the connecting block of the pallet is connected with a pallet, the motor assembly drives the belt to rotate to drive the pallet to move back and forth, the pallet is used to be provided with an LED bracket conveying device, and the LED bracket conveying device is used to receive and convey the LED A bracket, the pulley assembly 2-6 is moved horizontally and vertically through the first longitudinal slide rail 2-2 and the first horizontal slide table 2-3;

Both the first longitudinal slide rail 2-2 and the first transverse slide table 2-3 are driven by motors respectively connected to them.

A preferred technical solution of this embodiment: the crystal ring mobile platform assembly 3 includes a second base 3-1 fixed on the lower end surface of the upper end mounting plate of the mounting frame, and a second base 3-1 transversely arranged on the second base 3-1. Horizontal slide 3-2, a first longitudinal slide 3-3 longitudinally arranged on a second horizontal slide 3-2, and a second longitudinal slide 3-4 is provided on the first longitudinal slide 3-3 , The second longitudinal slide rail 3-4 is provided with a crystal frame mounting plate 3-5, the crystal frame mounting plate 3-5 is provided with a belt rotation assembly 3-6, and the belt rotation assembly 3-6 is A crystal ring placement groove for placing a crystal ring is provided. The crystal ring is fed into the crystal ring placement groove from the automatic crystal ring loading mechanism 7. The crystal ring can be rotated by the belt rotating assembly 3-6, and Can be moved horizontally and longitudinally through the second horizontal slide rail 3-2 and the second longitudinal slide rail 3-4;

There are two second horizontal sliding rails 3-2, which are arranged on both sides of the lower end surface of the second base 3-1, and sliding blocks are arranged between the two second horizontal sliding rails 3-2. The first motor is connected through the first screw, which forms a second horizontal slide mechanism with the second horizontal slide 3-2. The first motor drives the screw to rotate and drives the slide and the second longitudinal slide mechanism connected to the lower end of the slide to move ；

The second longitudinal slide rail mechanism is provided with two second longitudinal slide rails 3-4 and a slider assembly. The two second longitudinal slide rails 3-4 are provided on both sides of the lower end of the first longitudinal slide table 3-3. The assembly is connected to a second motor through a second screw, and the second motor drives the second screw to rotate and drive the slider assembly and the crystal frame mounting plate 3-5 connected to the lower end of the slider assembly to move longitudinally.

A preferred technical solution of this embodiment: the thimble assembly 5 includes a thimble 5-1 and a thimble driving mechanism 5-2, the thimble driving mechanism 5-2 is used to drive the thimble 5-1 to move up and down, and the thimble 5- 1 is used to lift up the wafer at the set position on the crystal ring.

A preferred technical solution of this embodiment: the lens assembly 4 includes a lens assembly fixing post, a crystal-taking lens assembly 4-1 and a die-attach lens assembly 4-2, the crystal-taking lens assembly 4-1 and the die-attach lens assembly 4-2 is fixed up and down on the upper side of the fixed column of the lens assembly, and lenses and cameras are arranged on them. The crystal taking lens assembly 4-1 is used to cooperate with the crystal ring moving platform assembly 3 to move to the set position and perform For the calibration of the chip, the die-bonding lens assembly 4-2 is used to cooperate with the fixture moving platform 2 to move the LED bracket to the set position. The lens and camera on the die-taking lens assembly 4-1 and the die-bonding lens assembly 4-2 come from Perform image recognition and storage.

A preferred technical solution of this embodiment: the automatic crystal ring loading mechanism 7 includes a cartridge lifting assembly 7-1 and a crystal ring handling assembly 7-2;

The material box lifting assembly 7-1 includes a third motor, a third screw, a first slider assembly, and a material box. The third motor is installed in the hole of the platen through the motor box, and the driving end of the third motor is upward and connected. There is a third screw that faces upwards, the third screw is connected to the first slider assembly, the first slider assembly is installed with a horizontal plate obliquely upwards, and the horizontal plate is installed with a material box, and the vertical side plate of the first slider assembly is arranged On the vertical slide rail, the vertical slide rail is fixed on the support plate at the upper end of the motor box,

The crystal ring handling assembly 7-2 is arranged on the adjacent side of the magazine lifting assembly 7-1, and includes a screw mounting seat, a fourth motor, a fourth screw, a second slider assembly, and a crystal ring holding frame, The screw mounting seat is fixed on the platen, and a fourth screw is arranged in it. One side end of the screw mounting seat is fixed to the fourth motor. The driving end of the fourth motor is connected to the fourth screw. A crystal ring holding frame is screwed on the rod body. The crystal ring holding frame includes an L-shaped bracket rod and a crystal ring holding part. The end of the L-shaped bracket is connected to the crystal ring holding part. The ring clamping part is provided with a clamping cylinder, and the clamping part of the clamping cylinder faces the direction of the material box;

The cartridge lifting assembly 7-1 is used to lift the crystal ring stored in the cartridge, the fourth motor drives the fourth screw to rotate to drive the second slider assembly to move, and the second slider assembly drives the crystal ring to clamp The rack moves, the clamping part on the clamping cylinder enters the material box to clamp the crystal ring, and then the crystal ring is transported to the crystal ring placement groove on the crystal ring moving platform assembly 3 through the crystal ring conveying assembly 7-2 Inside.

Embodiment 2: A method for bonding a dual-swing arm bonding device of an LED bonding machine according to the present invention, the method includes the following steps:

Step 1: With the assistance of the die-bonding lens assembly 4-2, the system controls the fixture moving platform 2 to move horizontally and vertically to drive the LED bracket on it to move to the die-bonding position;

Step 2: With the assistance of the crystal lens assembly 4-1, the system control ring mobile platform assembly 3 performs horizontal and vertical movement, thereby driving the crystal ring located on it to move and correct the specified position;

Step 4: The rotary drive mechanism 6-2 drives one of the die-bonding swing arms 6-4 to rotate and move to the top of the wafer, the ejector pin assembly 5 ejects an LED chip on the die ring, and the driven die-bonding swing arm 6 -4 Take the ejected chip and rotate it 180° to fix it on the LED bracket. At the same time, another die-bonding swing arm 6-4 rotates the same angle and moves to the top of the chip;

Step 5: The ejector pin assembly 5 ejects another LED chip on the crystal ring, the die-bonding swing arm 6-4 sucks the chip and then rotates 180° to fix the chip on the LED bracket;

Step 6, repeat steps 4 and 5 to complete the die bonding of the entire LED bracket.

In summary, the dual swing arm die bonding device of the LED die bonder provided by the present invention is compared with the traditional die bonding method, by setting two die bonding swing arms for continuous die bonding, thereby speeding up the die bonding speed. Can greatly improve work efficiency. At the same time, the die-bonding device of the present invention can adapt to the die-attachment of LED brackets of various sizes without increasing the length of the swing arm. It has multiple functions and better adaptability, and its structure is simple and compact, easy to assemble, low in cost, and can effectively improve the enterprise. benefit.

The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the description and drawings of the present invention, or directly or indirectly applied to other related The technical field is similarly included in the scope of patent protection of the present invention.

In summary, the technical means disclosed in the present invention can effectively solve the conventional problems and achieve the expected purpose and effect. It has not been seen in the publications, has not been used publicly, and has long-term progress before the application. The patent law claims that the invention is correct. Yan filed an application in accordance with the law and prayed that Jun Shanghui would give a detailed examination and grant a patent for invention.

However, the above are only a few preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, all equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the description of the invention are all It should still fall within the scope of the invention patent.

〔this invention〕 1: plate 2: Fixture mobile platform 2-1: The first base 2-2: The first longitudinal slide 2-3: The first horizontal sliding table 2-4: The first horizontal slide 2-5: Fixture mounting seat 2-6: Pulley assembly 2-7: Belt 3: Jinghuan mobile platform components 3-1: Second base 3-2: The second horizontal slide 3-3: The first longitudinal slide 3-4: The second longitudinal slide 3-5: Crystal frame mounting plate 3-6: Belt rotation assembly 4: lens assembly 4-1: Crystal lens assembly 4-2: Solid crystal lens assembly 5: thimble assembly 5-1: Thimble 5-2: thimble drive mechanism 6: Bonding mechanism 6-1: Solid crystal base 6-2: Rotary drive mechanism 6-3: Telescopic drive mechanism 6-4: Solid crystal swing arm 6-5: Cross slide 7: Automatic crystal ring mechanism 7-1: Material box lifting assembly 7-2: Crystal ring handling components

[Figure 1] is a schematic view of the structure of a dual swing arm die bonding device of an embodiment of the present invention; [Figure 2] is an exploded schematic view of the dual swing arm die bonding device of an embodiment of the present invention; [Figure 3] is a schematic diagram of the structure of the clamp platform of the dual swing arm die bonding device of the embodiment of the present invention; [Figure 4] is a schematic view of the structure of the crystal ring mobile platform of the dual swing arm die bonder of the embodiment of the present invention; [Figure 5] is a schematic view of the structure of the lens assembly of the dual swing arm die bonding device according to an embodiment of the present invention; [Figure 6] is a schematic view of the structure of the thimble assembly of the double swing arm die bonder of the embodiment of the present invention; [Figure 7] is a schematic structural view of the dual swing arm die bond mechanism of the double swing arm die bond device of the embodiment of the present invention; [Fig. 8] is a schematic diagram of the structure of the automatic crystal loading ring of the double swing arm crystal bonding device according to the embodiment of the present invention.

1: plate

2: Fixture mobile platform

3: Jinghuan mobile platform components

4: lens assembly

5: thimble assembly

6: Bonding mechanism

7: Automatic crystal ring mechanism

Claims (8)

A dual-swing arm die-bonding device for LED die bonding, the double-swing arm die-bonding device includes: Platen (1); It is characterized in that it also includes: The die-bonding mechanism (6) is provided with two die-bonding swing arms (6-4), a telescopic drive mechanism (6-3) that drives the two die-bonding swing arms (6-4) to move toward or in the opposite direction, and A rotary drive mechanism (6-2) that connects and drives the telescopic drive mechanism (6-3) to drive the two die-bonding swing arms (6-4) to rotate; The fixture moving platform (2) is arranged on the adjacent side of the crystal bonding mechanism (6), and is provided with a first lateral slide mechanism and a first longitudinal slide mechanism seated on the first lateral slide mechanism And a pulley assembly (2-6) installed at the upper end of the first longitudinal slide rail mechanism for receiving and conveying the LED bracket, and the LED bracket can be conveyed to the two solid crystal swing arms (6-4) ) The clamping part; The mounting frame is vertically fixed on the corner side of the fixture moving platform (2), and the crystal ring moving platform assembly (3) and the thimble assembly (5) are arranged on the lower bottom surface of the mounting plate at the upper end. The crystal ring moving platform assembly (3) A second transverse slide rail mechanism, a second longitudinal slide rail mechanism provided on the lower side of the second transverse slide rail mechanism, and a crystal frame mounting plate horizontally provided on the second longitudinal slide rail mechanism are provided (3-5) and a belt rotating assembly (3-6) installed on the crystal frame mounting plate (3-5), the belt rotating assembly (3-6) is provided with a crystal ring for placing a crystal ring A placement groove, the thimble assembly (5) is provided with an LED chip jacking mechanism for jacking up the LED chip located on the crystal ring; The lens assembly (4) is arranged on one side of the fixture moving platform (2), and the crystal taking lens assembly (4-) is arranged on it to cooperate with the crystal ring moving platform assembly (3) to move to the set position and perform wafer correction. 1) And the die-bonding lens assembly (4-2) used to assist the fixture moving platform (2) to move the LED bracket to the set position; The automatic crystal ring mechanism (7) is provided with a material box lifting assembly (7-1) and a crystal ring handling assembly (7-2) for lifting the material box, the crystal ring is stored in the material box, and the material box The lifting assembly (7-1) raises the material box to a set height so that the crystal ring handling assembly (7-2) picks up the crystal ring and sends it to the crystal ring set on the crystal ring moving platform assembly (3). Put it in the slot. The dual-swing arm die-bonding device for LED die bonding according to claim 1, wherein the die-bonding mechanism (6) further includes a die-bonding base (6-1) fixed on the platen (1), A lateral rotary drive mechanism (6-2) is provided on the top plate surface of the die-bonding base (6-1), and the rotary drive mechanism (6-2) and the telescopic drive mechanism (6-3) are between Rigid connection, both ends of the telescopic drive mechanism (6-3) are provided with telescopic parts, and a connecting block is provided at the outer end of the telescopic part. The connecting block is connected with a die-bonding swing arm (6-4), and two die-bonding swing arms ( 6-4) In a straight line and the two die-bonding swing arms (6-4) move towards or opposite to each other to form an open-close loosening or clamping action, the side of the telescopic drive mechanism (6-3) is also provided There are cross slide rails (6-5), and the solid crystal pendulum arm (6-4) is driven by the telescopic drive mechanism (6-3) to move along the cross slide rail (6-5), and then the solid crystal The crystal swing arm (6-4) can rotate and telescopically move relative to the die-bonding base (6-1) in its rotating plane. The telescopic drive mechanism (6-3) follows the die-bonding swing arm (6-4). Rotate together in a plane perpendicular to the horizontal plane under the drive of the rotary drive mechanism (6-2). The dual-swing arm die-bonding device for LED die-bonding according to claim 1, wherein the fixture moving platform (2) includes a first base (2-1), which is longitudinally arranged on the first base (2-1) ) On the first longitudinal slide rail (2-2), the first transverse slide table (2-3) transversely arranged on the first longitudinal slide rail (2-2), the first longitudinal slide rail ( 2-2) There are two, which are fixed side by side on the first base (2-1), and form a first longitudinal slide with the slider provided at the lower end of the first horizontal slide (2-3) Rail mechanism, the first transverse slide rail (2-4) is provided with a clamp mounting seat (2-5); The first lateral sliding table (2-3) is provided with a first lateral sliding rail (2-4), the first lateral sliding rail (2-4) is provided with two, which are fixed side by side on the first lateral sliding rail (2-4). On a horizontal sliding table (2-3), it forms a first horizontal sliding rail mechanism with a sliding block arranged at the bottom of the fixture mounting seat (2-5); The clamp mounting seat (2-5) is provided with a pulley assembly (2-6). The pulley assembly (2-6) includes a belt (2-7) and a motor assembly that drives the belt to rotate. The belt (2-6) -7) A pallet connecting block is provided on the down belt, and the pallet connecting block is connected with a pallet. The motor assembly drives the belt to rotate and then drives the pallet to move back and forth. The pallet is used to provide an LED bracket conveying device and an LED bracket. The conveying device is used for receiving and conveying the LED bracket, and the pulley assembly (2-6) moves horizontally and vertically through the first longitudinal slide rail (2-2) and the first horizontal slide table (2-3); The first longitudinal slide rail (2-2) and the first transverse slide table (2-3) are both driven by motors respectively connected to them. The dual-swing arm die-bonding device for LED die-bonding according to claim 1, wherein the crystal ring mobile platform assembly (3) includes a second base (3-1) fixed on the lower end surface of the mounting plate at the upper end of the mounting frame, The second horizontal slide rail (3-2) horizontally arranged on the second base (3-1), the first longitudinal slide table (3-3) vertically arranged on the second horizontal slide rail (3-2) ), the first longitudinal sliding table (3-3) is provided with a second longitudinal sliding rail (3-4), and the second longitudinal sliding rail (3-4) is provided with a crystal frame mounting plate (3- 5) The crystal frame mounting plate (3-5) is provided with a belt rotating assembly (3-6), and the belt rotating assembly (3-6) is provided with a crystal ring placing groove for placing the crystal ring, The crystal ring is fed into the crystal ring placement groove from the automatic crystal loading ring mechanism (7). The crystal ring can be rotated by the belt rotating assembly (3-6) and can pass through the second lateral slide rail (3). -2) Move horizontally and longitudinally with the second longitudinal slide rail (3-4); There are two second lateral slide rails (3-2), which are arranged on both sides of the lower end surface of the second base (3-1), and are arranged between the two second lateral slide rails (3-2) There is a sliding block, the sliding block is connected to the first motor through the first screw rod, which forms a second horizontal sliding rail mechanism with the second horizontal sliding rail (3-2), the first motor drives the screw rod to rotate and drives the sliding block and is connected with the lower end of the sliding block The second longitudinal slide rail mechanism moves; The second longitudinal slide rail mechanism is provided with two second longitudinal slide rails (3-4) and a slider assembly, and the two second longitudinal slide rails (3-4) are provided on the first longitudinal slide table (3-3). On both sides of the lower end, the slider assembly is connected to the second motor through the second screw, and the second motor drives the second screw to rotate and drive the slider assembly and the crystal frame mounting plate (3-5) connected to the lower end of the slider assembly to move longitudinally. The dual-swing arm die bonding device for LED die bonding according to claim 1, wherein the thimble assembly (5) includes a thimble (5-1) and a thimble driving mechanism (5-2), and the thimble driving mechanism (5) 5-2) It is used to drive the thimble (5-1) to move up and down, and the thimble (5-1) is used to push up the wafer at the set position on the crystal ring. The dual-swing arm die-bonding device for LED die-bonding according to claim 1, wherein the lens assembly (4) includes a lens assembly fixing column, a die-taking lens assembly (4-1), and a die-attach lens assembly (4- 2) The crystal-taking lens assembly (4-1) and the die-bonding lens assembly (4-2) are fixed on the upper part of the side of the lens assembly fixing column one by one, and lenses and cameras are arranged on them. The crystal lens assembly (4-1) is used to cooperate with the crystal ring mobile platform assembly (3) to move to the set position and the correction of the wafer, the die-attach lens assembly (4-2) is used to cooperate with the fixture moving platform (2), and the LED The bracket is moved to the set position, and the lens and camera on the crystal-taking lens assembly (4-1) and the die-bonding lens assembly (4-2) perform image recognition and storage. The dual-swing arm die attaching device for LED die bonding according to claim 1, wherein the automatic die loading ring mechanism (7) includes a magazine lifting assembly (7-1) and a die ring handling assembly (7-2) ； The material box lifting assembly (7-1) includes a third motor, a third screw, a first sliding block assembly and a material box. The third motor is installed in the hole of the platen through the motor box, and the driving end of the third motor faces upward. And connected with a third upward screw, the third screw is connected to the first slider assembly, the first slider assembly is installed with a horizontal plate obliquely upwards, the horizontal plate is installed with a material box, the vertical of the first slider assembly The side plate is arranged on the vertical slide rail, and the vertical slide rail is fixed on the support plate at the upper end of the motor box, The crystal ring handling assembly (7-2) is arranged on the adjacent side of the magazine lifting assembly (7-1), and includes a screw mounting seat, a fourth motor, a fourth screw, a second slider assembly and a crystal ring The clamping frame, the screw mounting seat is fixed on the platen, and a fourth screw is arranged in it. One end of the screw is fixed to the fourth motor. The driving end of the fourth motor is connected to the fourth screw. A crystal ring holding frame is screwed on the rod body of the fourth screw rod. The crystal ring holding frame includes an L-shaped support rod and a crystal ring holding part. The end of the L-shaped support is connected to the crystal ring holding part. , The crystal ring clamping portion is provided with a clamping cylinder, and the clamping portion of the clamping cylinder faces the direction of the material box; The material box lifting assembly (7-1) is used to lift the crystal ring stored in the material box, the fourth motor drives the fourth screw to rotate to drive the second slider assembly to move, and the second slider assembly drives the crystal ring The clamping frame moves, the clamping part on the clamping cylinder enters the material box to clamp the crystal ring, and then the crystal ring is transported to the crystal ring moving platform assembly (3) through the crystal ring handling assembly (7-2) The crystal ring is placed in the groove. A method for bonding a double-swing arm die-bonding device of an LED die-bonding machine according to any one of claims 1 to 7, characterized in that the method includes the following steps: Step 1. With the assistance of the die-bonding lens assembly (4-2), the system controls the fixture moving platform (2) to move horizontally and longitudinally to drive the LED bracket on it to move to the die-attach position; Step 2: With the assistance of the crystal lens assembly (4-1), the system control ring moves the platform assembly (3) to move horizontally and vertically to drive the crystal ring located on it to move to the specified position and correct it; Step 4: The rotary drive mechanism (6-2) drives one of the die-bonding swing arms (6-4) to rotate and move directly above the wafer, and the thimble assembly (5) pushes out an LED wafer on the wafer ring and is driven The die-bonding arm (6-4) sucks the ejected chip and rotates it 180° to fix it on the LED bracket. At the same time, the other die-bonding arm (6-4) rotates the same angle and moves to the front of the wafer. Above Step 5: The ejector pin assembly (5) ejects another LED chip on the crystal ring, the die-bonding swing arm (6-4) sucks the chip and then rotates 180° to fix the chip on the LED support; Step 6, repeat steps 4 and 5 to complete the die bonding of the entire LED bracket.

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