CN202651079U - Double-swing arm type direct-drive die bonder - Google Patents
Double-swing arm type direct-drive die bonder Download PDFInfo
- Publication number
- CN202651079U CN202651079U CN 201220257299 CN201220257299U CN202651079U CN 202651079 U CN202651079 U CN 202651079U CN 201220257299 CN201220257299 CN 201220257299 CN 201220257299 U CN201220257299 U CN 201220257299U CN 202651079 U CN202651079 U CN 202651079U
- Authority
- CN
- China
- Prior art keywords
- swing arm
- connecting plate
- coil motor
- die bond
- slide block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a double-swing arm type direct-drive die bonder. The die bonder includes a rotary motor, a swing arm connecting plate connected to an output end of the rotary motor, and two sets of swing arm mechanisms which are arranged on the swing arm connecting plate and face opposite directions; the swing arm mechanisms include swing arm seats, voice-coil motor stators fixed in the swing seats, slide blocks which are connected to the swing arm seats through vertically-arranged third guide rails, voice-coil motor rotors which are fixed on the slide blocks and are matched with the voice-coil motor stators, and swing arms which are fixed on the slide blocks; the voice-coil motor stators and the voice-coil motor rotors cooperate with each other to drive the slide blocks to perform lifting and descending movement along the third guide rails and relative to the swing arm seats; the swing arm seats are driven to rotate by the swing arm connecting plate so as to enable the whole swing arm mechanisms to rotate. According to the double-swing arm type direct-drive die bonder of the utility model, simultaneous driving of the rotation movement and the up-down movement of the swing arms can be realized through simple connection relations with high control accuracy; the two sets of swing arm mechanisms which are arranged in the die bonder and face opposite directions can simultaneously perform die-taking operation and die-bonding operation, thereby shortening an operating period and improving work efficiency.
Description
Technical field
The utility model relates to the semiconductor packaging device technical field, relates in particular to a kind of double-swing arm and directly drives the die bond machine.
Background technology
The die bond machine is the key equipment in the LED packing producing line, its die bond process is: glue applying mechanism is put glue at the die bond station of substrate first, then, taken out from wafer LED crystal grain by swing arm (also claiming crystal taking arm), it is transferred on the die bond station of putting glue again.LED crystal grain put into package position precisely whether, directly affect the luminous efficacy of whole LED device, therefore have in the die bond process, the speed of service of oscillating arm mechanisms and positioning accuracy play vital effect to die bond quality and efficient.In the existing die bond machine, usually adopt one to provide the electric rotating machine that rotatablely moves and one to provide straight-line motor to control rotatablely moving of swing arm and elevating movement, need to use for example drive disk assembly of spline coupling and screw mandrel and so between electric rotating machine and the linear electric motors, structure is assembled more complicated, can have influence on the kinematic accuracy of swing arm; Swing arm needs reciprocating rotary in getting brilliant place and die bond place in addition, owing in the die bond machine swing arm is only arranged, rotates back and forth can only finish in the process at one and once gets brilliant and the die bond action, and production efficiency is not high.
The utility model content
The technical problem that the utility model mainly solves provides and a kind ofly can guarantee the swing arm kinematic accuracy and have direct-driving solid crystal machine than high efficiency.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide a kind of double-swing arm directly to drive the die bond machine, comprise electric rotating machine, be connected in the electric rotating machine output the swing arm connecting plate, be installed on the oscillating arm mechanisms of two groups of opposing settings on the swing arm connecting plate; The slide block that described oscillating arm mechanisms comprises the swing arm seat, be fixed in voice coil motor stator in the swing arm seat, be connected with the swing arm seat by the 3rd guide rail that vertically arranges, be fixed on the slide block and with the suitable voice coil motor mover of voice coil motor stator, be fixed in the swing arm on the slide block; The voice coil motor stator cooperates the driving slide block to move up and down with respect to the swing arm seat along described the 3rd guide rail with the voice coil motor mover; The swing arm seat is made whole oscillating arm mechanisms rotation by swing arm connecting plate driven rotary.
Wherein, described oscillating arm mechanisms is connected by mount pad with the swing arm connecting plate, and two groups of oscillating arm mechanisms lay respectively at the relative sidewall of mount pad two, wherein one group of oscillating arm mechanisms by horizontally disposed the second guide rails assembling on the sidewall of mount pad; The mount pad upper end is connected with the swing arm connecting plate by the first guide rail, and the first guide rail parallel arranges in the oscillating arm mechanisms length direction.
Wherein, described the first guide rail and the second guide rail are the crossed roller guideway.
Wherein, described electric rotating machine output is installed a gear box, and described swing arm connecting plate is fixed in the gear box bottom, and gearbox drive shown in the rotary power of electric rotating machine passes through drives the rotation of swing arm connecting plate.
Wherein, a sidewall of described slide block is fixed with the grating scale of vertical placement; One sidewall of described swing arm seat is installed with an inductive head holder, and the inductive head holder is U font bar shape, one side its openend be provided with outwardly lug, described lug and swing arm seat are fixed, fixed installation grating scale inductive head in the inductive head holder; The position probing that grating scale corresponding matching on grating scale inductive head and the slide block provides slide block to move up and down.
Wherein, described swing arm seat lower end sidewall is fixed with inductor, and described slide block lower end sidewall is provided with corresponding induction support, the origin position reference that induction support and inductor relative engagement provide slide block to move up and down.
Wherein, described the 3rd guide rail is the crossed roller guideway.
The beneficial effects of the utility model are: be different from the die bond machine of prior art and only have simple pendulum arm, and swing arm need to be by special spline bearing as rotation and the connection that moves up and down and the design of part of other connecting rods, the utility model provides double-swing arm directly to drive the die bond machine, the power source that adopts an electric rotating machine to rotate as two swing arms simultaneously, and voice coil motor is set as the power source that moves up and down in each oscillating arm mechanisms, voice coil motor is fixed on the swing arm seat, the swing arm seat is installed on the swing arm connecting plate by the electric rotating machine driven rotary, drive when can realize swing arm rotatablely moved and move up and down by this simple annexation, ensure the movement effects of swing arm, help to realize the high-speed of swing arm, high precision position control, structural member is few, and assembling is simple; Be provided with the oscillating arm mechanisms of two groups of opposing installations in the die bond machine, when one group of oscillating arm mechanisms was got crystalline substance, another group oscillating arm mechanisms can be carried out die bond simultaneously, therefore shortens the work period, increases work efficiency, and increases the benefit.
In addition, wherein one group of oscillating arm mechanisms can adjust upward the position with respect to swing arm connecting plate two Vertical Squares on a horizontal plane by the cooperation of mount pad, the first guide rail and the second guide rail, thereby so that also can be with two groups of oscillating arm mechanisms in that to get brilliant position consistent with the die bond position regulation when two groups of oscillating arm mechanisms specifications are not quite identical, practicality be stronger.
Description of drawings
Fig. 1 is the structural representation that the utility model one embodiment directly drives the die bond machine;
Fig. 2 is the STRUCTURE DECOMPOSITION figure that the utility model one embodiment directly drives the die bond machine;
Fig. 3 is that the utility model one embodiment directly drives the STRUCTURE DECOMPOSITION figure of oscillating arm mechanisms in the die bond machine.
Label declaration:
10, electric rotating machine; 20, gear box; 30, swing arm connecting plate; 40, the first guide rail; 50, mount pad; 60, the second guide rail; 70, oscillating arm mechanisms; 71, swing arm seat; 72, slide block; 73, swing arm; 74a, voice coil motor stator; 74b, voice coil motor mover; 75, the 3rd guide rail; 76, inductive head holder; 77a, grating scale inductive head; 77b, grating scale; 78a, inductor; 78b, induction support; 79, suction nozzle.
Embodiment
By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, below in conjunction with execution mode and cooperate that accompanying drawing is detailed to give explanation.
See also Fig. 1, present embodiment provides the structure that a kind of double-swing arm directly drives the die bond machine, this die bond machine comprises that one is used for providing the electric rotating machine 10 of rotary power, electric rotating machine 10 outputs are equipped with gear box 20, this gear box 20 improves the torsion of electric rotating machine 10 and precision, in the gear box bottom one swing arm connecting plate 30 is installed, the oscillating arm mechanisms 70 of two groups of opposing settings is installed at swing arm connecting plate 30, the rotary power that electric rotating machine 10 provides improves torsion and 30 rotations of precision rear drive swing arm connecting plate by gear box 20, thereby drives 70 rotations of two groups of oscillating arm mechanisms.In this structure, gear box 20 is not necessary structure, thereby the output shaft of electric rotating machine 10 can be directly to connect swing arm connecting plate 30 to drive 30 rotations of swing arm connecting plate.
Please again in conjunction with Fig. 2, described double-swing arm directly drives in the die bond machine, be connected by mount pad 50 between swing arm connecting plate 30 and the oscillating arm mechanisms 70, two groups of oscillating arm mechanisms 70 lay respectively at 50 liang of relative sidewalls of mount pad, wherein one group of oscillating arm mechanisms 70 is connected with mount pad 50 by the second guide rail 60, the second guide rail 60 is horizontally disposed with, so that this oscillating arm mechanisms 70 can move along y direction of principal axis among the figure with respect to mount pad 50; Mount pad 50 upper ends are connected with swing arm connecting plate 30 by the first guide rail 40, and the first guide rail 40 is parallel to oscillating arm mechanisms 70 length direction settings, so that mount pad 50 can move along the direction of principal axis of x shown in the figure with respect to swing arm connecting plate 30.Consist of position adjusting mechanisms by mount pad 50, the first guide rail 40 and the second guide rail 60 and make that wherein one group of oscillating arm mechanisms 70 can be with respect to swing arm connecting plate 30 in x axle and y direction of principal axis adjustment position, when the length of two groups of oscillating arm mechanisms 70 or width are not quite identical, getting on crystalline substance and the die bond position can both adjustment unanimously according to what this position adjusting mechanism can make two groups of oscillating arm mechanisms 70, practicality be stronger.Certainly, if two groups of oscillating arm mechanisms 70 specifications are the same, and with get brilliant position, the die bond position is suitable, can omit mount pad 50, the first guide rail 40 and the second guide rail 60, directly two groups of oscillating arm mechanisms 70 are fixed on the swing arm connecting plate 30.
Consult Fig. 3, the slide block 72 that oscillating arm mechanisms 70 specifically comprises swing arm seat 71, be fixed in voice coil motor stator 74a in the swing arm seat 71, be connected with swing arm seat 71 by the 3rd guide rail 75 that vertically arranges, be fixed on the slide block 72 and with the suitable voice coil motor mover 74b of voice coil motor stator 74a, be fixed in the swing arm 73 on the slide block 72; Voice coil motor stator 74a and voice coil motor mover 74b cooperate to provide the power source of elevating movement, and slide block 72 can be moved up and down with respect to swing arm seat 71 along the 3rd guide rail 75, move up and down thereby drive swing arm 73; Suction nozzle 79 is installed in order to LED crystal grain is taken out from getting brilliant wafer in swing arm 73 ends, and during die bond, suction nozzle 79 puts down LED crystal grain and finishes die bond.Swing arm seat 71 is by swing arm connecting plate 30 driven rotary, thereby makes whole oscillating arm mechanisms 70 rotations.
One sidewall of slide block 72 is fixed with the grating scale 77b of vertical placement.One sidewall of swing arm seat 71 is installed with an inductive head holder 76, and inductive head holder 76 is U font bar shape, one side its openend be provided with outwardly lug, described lug and swing arm seat 71 are fixing; Inductive head holder 76 interior fixed installation grating scale inductive head 77a, grating scale inductive head 77a and grating scale 77b corresponding matching for the position probing that provides slide block 72 to move up and down, thereby are accurately controlled moving up and down of swing arm 73.Grating is the structure commonly used of sensory field, and its principle repeats no more.
In addition, also be fixed with inductor 78a at swing arm seat 71 lower end sidewalls, slide block 72 lower end sidewalls are the corresponding induction support 78b that is provided with then, position when induction support 78b is relative with inductor 78a is the origin position that slide block 72 moves up and down, the origin position reference that namely provides swing arm 73 to move up and down by inductor 78a and induction support 78b can be so that the swing arm Rapid reset.
This double-swing arm directly drives the die bond machine when work, and the position of two groups of oscillating arm mechanisms 70 is 180 ° correspondence just.When being positioned at, one group of oscillating arm mechanisms 70 wherein gets crystalline substance when getting brilliant position, another group oscillating arm mechanisms 70 is positioned at the die bond position and carries out die bond, when getting brilliant and die bond is moved when all finishing, electric rotating machine 10 turns, two groups of oscillating arm mechanisms 70 positions are exchanged, and two groups of oscillating arm mechanisms 70 are got equally respectively brilliant action and die bond action.Electric rotating machine 10 rotarily drive two groups of oscillating arm mechanisms 70 back and forth, swing arm 73 drives lifting by voice coil motor (cooperation of voice coil motor stator 74a and voice coil motor mover 74b) in the oscillating arm mechanisms 70, finishes and gets crystalline substance and die bond by being installed on suction nozzle 79 in the swing arm 73.Obviously, compare with the existing die bond machine that only has a swing arm, die bond machine operating efficiency of the present utility model is the twice of existing die bond machine.
Be different from the die bond machine of prior art and only have simple pendulum arm, and swing arm need to be by special spline bearing as rotation and the connection that moves up and down and the design of part of other connecting rods, the utility model provides double-swing arm directly to drive the die bond machine, the power source that adopts an electric rotating machine to rotate as two swing arms simultaneously, and voice coil motor is set as the power source that moves up and down in each oscillating arm mechanisms, voice coil motor is fixed on the swing arm seat, the swing arm seat is installed on the swing arm connecting plate by the electric rotating machine driven rotary, drive when can realize swing arm rotatablely moved and move up and down by this simple annexation, ensure the movement effects of swing arm, help to realize the high-speed of swing arm, high precision position control, structural member is few, and assembling is simple; Be provided with the oscillating arm mechanisms of two groups of opposing installations in the die bond machine, when one group of oscillating arm mechanisms was got crystalline substance, another group oscillating arm mechanisms can be carried out die bond simultaneously, therefore shortens the work period, increases work efficiency, and increases the benefit.
It is worth mentioning that, in the illustrated embodiment, what the first guide rail 40, the second guide rail 60 and the 3rd guide rail 75 all adopted is two groups of crossed roller guideways that be arranged in parallel, every group of crossed roller guideway comprises two guide rails with raceway, the roller that has cross arrangement between the raceway of two guide rails makes two guide rails can relative motion.Adopt the crossed roller guideway to have the low little characteristics of starting friction power of force of rolling friction resistance, stability and servo-actuated performance are good; And the elastic deformation amount is little for the crossed roller guideway, and the effective exercise body is many, can realize high rigidity, high load capacity motion; Structural design is flexible, and is easy to install.Certainly, in the utility model, also can use the level and smooth track of common steel, only need to realize that linear relative movement gets final product.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (7)
1. a double-swing arm directly drives the die bond machine, it is characterized in that, comprise electric rotating machine, be connected in the electric rotating machine output the swing arm connecting plate, be installed on the oscillating arm mechanisms of two groups of opposing settings on the swing arm connecting plate;
The slide block that described oscillating arm mechanisms comprises the swing arm seat, be fixed in voice coil motor stator in the swing arm seat, be connected with the swing arm seat by the 3rd guide rail that vertically arranges, be fixed on the slide block and with the suitable voice coil motor mover of voice coil motor stator, be fixed in the swing arm on the slide block; The voice coil motor stator cooperates the driving slide block to move up and down with respect to the swing arm seat along described the 3rd guide rail with the voice coil motor mover;
The swing arm seat is made whole oscillating arm mechanisms rotation by swing arm connecting plate driven rotary.
2. double-swing arm according to claim 1 directly drives the die bond machine, it is characterized in that: described oscillating arm mechanisms is connected by mount pad with the swing arm connecting plate, two groups of oscillating arm mechanisms lay respectively at the relative sidewall of mount pad two, wherein one group of oscillating arm mechanisms by horizontally disposed the second guide rails assembling on the sidewall of mount pad; The mount pad upper end is connected with the swing arm connecting plate by the first guide rail, and the first guide rail parallel arranges in the oscillating arm mechanisms length direction.
3. double-swing arm according to claim 2 directly drives the die bond machine, it is characterized in that: described the first guide rail and the second guide rail are the crossed roller guideway.
4. double-swing arm according to claim 1 directly drives the die bond machine, it is characterized in that: described electric rotating machine output is installed a gear box, described swing arm connecting plate is fixed in the gear box bottom, and gearbox drive shown in the rotary power of electric rotating machine passes through drives the rotation of swing arm connecting plate.
5. each described double-swing arm directly drives the die bond machine according to claim 1-4, it is characterized in that: a sidewall of described slide block is fixed with the grating scale of vertical placement; One sidewall of described swing arm seat is installed with an inductive head holder, and the inductive head holder is U font bar shape, one side its openend be provided with outwardly lug, described lug and swing arm seat are fixed, fixed installation grating scale inductive head in the inductive head holder; The position probing that grating scale corresponding matching on grating scale inductive head and the slide block provides slide block to move up and down.
6. each described double-swing arm directly drives the die bond machine according to claim 1-4, it is characterized in that: described swing arm seat lower end sidewall is fixed with inductor, described slide block lower end sidewall is provided with corresponding induction support, the origin position reference that induction support and inductor relative engagement provide slide block to move up and down.
7. each described double-swing arm directly drives the die bond machine according to claim 1-4, it is characterized in that: described the 3rd guide rail is the crossed roller guideway.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220257299 CN202651079U (en) | 2012-06-01 | 2012-06-01 | Double-swing arm type direct-drive die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220257299 CN202651079U (en) | 2012-06-01 | 2012-06-01 | Double-swing arm type direct-drive die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202651079U true CN202651079U (en) | 2013-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220257299 Expired - Lifetime CN202651079U (en) | 2012-06-01 | 2012-06-01 | Double-swing arm type direct-drive die bonder |
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| CN103367183A (en) * | 2013-06-26 | 2013-10-23 | 广东工业大学 | Double-swing-arm die bonder welding head mechanism and die bonder |
| CN103367566A (en) * | 2013-06-26 | 2013-10-23 | 广东工业大学 | Voice coil motor and spline shaft-based die bonder welding head mechanism and die bonder |
| CN103400784A (en) * | 2013-08-08 | 2013-11-20 | 王敕 | Multipurpose encapsulating equipment |
| CN103531677A (en) * | 2013-09-22 | 2014-01-22 | 潍坊永昱电控科技有限公司 | Dual-welding-arm system for automatic LED (Light Emitting Diode) wafer sorting machine |
| CN103600349A (en) * | 2013-10-25 | 2014-02-26 | 深圳市恒睿智达科技有限公司 | Novel welding arm driving device of die bonder |
| CN103599871A (en) * | 2013-10-25 | 2014-02-26 | 深圳市恒睿智达科技有限公司 | Separated type dispensing mechanism |
| CN103681401A (en) * | 2013-10-25 | 2014-03-26 | 深圳市恒睿智达科技有限公司 | Die bonder detection mechanism and continuous detection method |
| CN103972363A (en) * | 2014-04-23 | 2014-08-06 | 东莞市凯格精密机械有限公司 | Swing arm combined motion module of die bonder |
| CN104282597A (en) * | 2014-07-31 | 2015-01-14 | 深圳市恒睿智达科技有限公司 | Double-welding-head die bonder |
| CN104637835A (en) * | 2013-11-06 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | Device for driving double pendulums through single motor |
| CN105789101A (en) * | 2014-12-25 | 2016-07-20 | 北京中电科电子装备有限公司 | Chip supplying and feeding mechanism and chip bonder |
| CN109461689A (en) * | 2018-12-04 | 2019-03-12 | 奥特马（无锡）电子科技有限公司 | A kind of high-speed double-head automatic loading/unloading bonder |
| CN110164804A (en) * | 2019-06-24 | 2019-08-23 | 东莞市凯格精密机械有限公司 | Chip attachment mechanism with sliding block |
| CN110610869A (en) * | 2019-10-22 | 2019-12-24 | 苏州艾科瑞思智能装备股份有限公司 | Chip packaging equipment |
| CN111439572A (en) * | 2019-10-12 | 2020-07-24 | 深圳市昌富祥智能科技有限公司 | Voice coil motor double-swing arm taking and placing structure |
| WO2020237497A1 (en) * | 2019-05-28 | 2020-12-03 | 深圳新益昌科技股份有限公司 | Double-swing-arm die-bonding device for led die bonding and die bonding method therefor |
| TWI753440B (en) * | 2019-05-28 | 2022-01-21 | 大陸商深圳新益昌科技股份有限公司 | A dual-swing arm die-bonding device for LED die-bonding and a die-bonding method thereof |
| CN114496892A (en) * | 2022-04-02 | 2022-05-13 | 山东泓瑞光电科技有限公司 | Control method and device for LED and semiconductor laser chip absorbing and releasing device |
| CN115108323A (en) * | 2022-07-18 | 2022-09-27 | 湖南联芯精密科技有限公司 | MiniLED out-of-order arranging machine |
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- 2012-06-01 CN CN 201220257299 patent/CN202651079U/en not_active Expired - Lifetime
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| CN103367566B (en) * | 2013-06-26 | 2016-01-20 | 广东工业大学 | Based on bonder Welding head mechanism and the bonder of voice coil motor and splined shaft |
| CN103367566A (en) * | 2013-06-26 | 2013-10-23 | 广东工业大学 | Voice coil motor and spline shaft-based die bonder welding head mechanism and die bonder |
| CN103367183B (en) * | 2013-06-26 | 2016-03-02 | 广东工业大学 | Double-swing arm bonder Welding head mechanism and bonder |
| CN103367183A (en) * | 2013-06-26 | 2013-10-23 | 广东工业大学 | Double-swing-arm die bonder welding head mechanism and die bonder |
| CN103400784A (en) * | 2013-08-08 | 2013-11-20 | 王敕 | Multipurpose encapsulating equipment |
| CN103400784B (en) * | 2013-08-08 | 2016-01-20 | 王敕 | Multipurpose sealed in unit |
| CN103531677A (en) * | 2013-09-22 | 2014-01-22 | 潍坊永昱电控科技有限公司 | Dual-welding-arm system for automatic LED (Light Emitting Diode) wafer sorting machine |
| CN103681401A (en) * | 2013-10-25 | 2014-03-26 | 深圳市恒睿智达科技有限公司 | Die bonder detection mechanism and continuous detection method |
| CN103599871A (en) * | 2013-10-25 | 2014-02-26 | 深圳市恒睿智达科技有限公司 | Separated type dispensing mechanism |
| CN103600349A (en) * | 2013-10-25 | 2014-02-26 | 深圳市恒睿智达科技有限公司 | Novel welding arm driving device of die bonder |
| CN104637835A (en) * | 2013-11-06 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | Device for driving double pendulums through single motor |
| CN104637835B (en) * | 2013-11-06 | 2017-02-22 | 沈阳芯源微电子设备有限公司 | Device for driving double pendulums through single motor |
| CN103972363A (en) * | 2014-04-23 | 2014-08-06 | 东莞市凯格精密机械有限公司 | Swing arm combined motion module of die bonder |
| CN103972363B (en) * | 2014-04-23 | 2017-03-29 | 东莞市凯格精密机械有限公司 | Bonder swing arm compound motion module |
| CN104282597A (en) * | 2014-07-31 | 2015-01-14 | 深圳市恒睿智达科技有限公司 | Double-welding-head die bonder |
| CN105789101B (en) * | 2014-12-25 | 2020-05-05 | 北京中电科电子装备有限公司 | Chip supply mechanism and chip bonding machine |
| CN105789101A (en) * | 2014-12-25 | 2016-07-20 | 北京中电科电子装备有限公司 | Chip supplying and feeding mechanism and chip bonder |
| CN109461689A (en) * | 2018-12-04 | 2019-03-12 | 奥特马（无锡）电子科技有限公司 | A kind of high-speed double-head automatic loading/unloading bonder |
| WO2020237497A1 (en) * | 2019-05-28 | 2020-12-03 | 深圳新益昌科技股份有限公司 | Double-swing-arm die-bonding device for led die bonding and die bonding method therefor |
| TWI753440B (en) * | 2019-05-28 | 2022-01-21 | 大陸商深圳新益昌科技股份有限公司 | A dual-swing arm die-bonding device for LED die-bonding and a die-bonding method thereof |
| CN110164804A (en) * | 2019-06-24 | 2019-08-23 | 东莞市凯格精密机械有限公司 | Chip attachment mechanism with sliding block |
| CN111439572A (en) * | 2019-10-12 | 2020-07-24 | 深圳市昌富祥智能科技有限公司 | Voice coil motor double-swing arm taking and placing structure |
| CN110610869A (en) * | 2019-10-22 | 2019-12-24 | 苏州艾科瑞思智能装备股份有限公司 | Chip packaging equipment |
| CN114496892A (en) * | 2022-04-02 | 2022-05-13 | 山东泓瑞光电科技有限公司 | Control method and device for LED and semiconductor laser chip absorbing and releasing device |
| CN115108323A (en) * | 2022-07-18 | 2022-09-27 | 湖南联芯精密科技有限公司 | MiniLED out-of-order arranging machine |
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