CN115188871A - Microminiature LED transfer device, transfer method and bearing frame - Google Patents

Microminiature LED transfer device, transfer method and bearing frame Download PDF

Info

Publication number
CN115188871A
CN115188871A CN202211106881.6A CN202211106881A CN115188871A CN 115188871 A CN115188871 A CN 115188871A CN 202211106881 A CN202211106881 A CN 202211106881A CN 115188871 A CN115188871 A CN 115188871A
Authority
CN
China
Prior art keywords
seat
bearing
clamping
along
bearing frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202211106881.6A
Other languages
Chinese (zh)
Other versions
CN115188871B (en
Inventor
陈思
焦锐
王龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Hongshida Intelligent Technology Co ltd
Original Assignee
Kunshan Hongshida Intelligent Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Hongshida Intelligent Technology Co ltd filed Critical Kunshan Hongshida Intelligent Technology Co ltd
Priority to CN202211106881.6A priority Critical patent/CN115188871B/en
Priority to CN202211384982.XA priority patent/CN115621397A/en
Publication of CN115188871A publication Critical patent/CN115188871A/en
Application granted granted Critical
Publication of CN115188871B publication Critical patent/CN115188871B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses a microminiature LED transfer device, a transfer method and a bearing frame. The transfer device comprises a base, a feeding mechanism, a first bearing mechanism, a second bearing mechanism and an LED transfer mechanism, wherein the feeding mechanism, the first bearing mechanism, the second bearing mechanism and the LED transfer mechanism are arranged on the base. The first bearing mechanism comprises a first bearing seat and a first movable seat, the first movable seat comprises a seat body and an adjusting table, the seat body can be arranged on the first bearing seat in a relatively moving mode along a second direction, the adjusting table can rotate relatively around a first rotation center line and is connected with the seat body, the first rotation center line extends along the up-down direction, and the adjusting table can be connected with the seat body in a relatively moving mode along the up-down direction; each bearing frame is fixedly provided with a magnetic part, the adjusting platform is provided with an electromagnet, the electromagnet has a power-on state and a power-off state, and when the electromagnet is in the power-off state, the adjusting platform can be matched with and adsorb one bearing frame; when the electromagnet is in a power-on state, the adjusting table is disengaged from the bearing frame.

Description

Microminiature LED transfer device, transfer method and bearing frame
Technical Field
The invention relates to the technical field of semiconductor chip manufacturing, in particular to a microminiature LED transfer device, a transfer method and a bearing frame.
Background
A Light Emitting Diode (LED) is a commonly used light emitting device, which emits light by energy released by recombination of electrons and holes, and is widely used in the fields of illumination, flat panel display, medical devices, and the like. At present, the miniaturization of the LED is gradually advanced, and with the appearance of Micro LEDs such as Mini LED (chip size is about 100 to 300 μm) and Micro LED (chip size is about 50 to 100 μm), the technology of directly using the LED for screen display gradually moves to the market. The development direction of the display technology in the future is that the display made of the micro-miniature LED has smaller pixels and higher quality pictures. In the prior art, micro LEDs are usually manufactured by a wafer process, wherein the LEDs are firstly prepared on a wafer, the wafer is cut into a large number of single micro LED chips, and then the micro LEDs are transferred to target substrates such as a circuit board, a wafer tape, a blue film, a white film and the like.
In the above process, the efficiency of transferring the cut micro-LEDs to the target substrate is one of the key factors limiting the production efficiency of the micro-LED display. Because the micro-LEDs are small in size and large in number, if the micro-LEDs are transferred in a mode that a traditional suction nozzle sucks one by one, the transfer efficiency is very low. Some improved transfer devices combine a plurality of suction nozzles together to suck and mount, the comprehensive speed is improved to a certain extent, but the size of the transfer device is obviously increased, the operation difficulty is increased, and the transfer speed is difficult to break through qualitatively. The needle-punching transfer method appearing in recent years is a faster mode. The principle of this approach is: the cut micro-LEDs are firstly adhered to a raw substrate (such as a PVC film) with certain viscosity, and then one of the LEDs is separated from the raw substrate and is contacted with a target substrate in a needling mode, wherein the target substrate is also a material with certain viscosity, so that the LEDs can be transferred to the target substrate through adhesion. In the needle transfer mode, the moving distance of the needle is very small, so that high reciprocating frequency can be achieved. However, the conventional needle-punching type transfer device still has one or more problems of large device volume, poor flexibility, low transfer precision and the like.
Disclosure of Invention
The invention aims to provide a novel microminiature LED transfer device and a novel microminiature LED transfer method, aiming at the defects in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that:
a microminiature LED transfer device is used for transferring microminiature LED chips adhered on a first substrate to a second substrate, the first substrate is fixedly arranged in a bearing frame, the transfer device comprises a base, and a feeding mechanism, a first bearing mechanism, a second bearing mechanism and an LED transfer mechanism which are arranged on the base, wherein,
the feeding mechanism comprises a storage bin and a feeding assembly, the storage bin is used for storing one or more bearing frames, and the feeding assembly is used for conveying the bearing frames between the storage bin and the first bearing mechanism;
the first bearing mechanism comprises a first bearing seat and a first movable seat, the first bearing seat can be arranged on the base in a relative movement manner along a first direction, the first movable seat can be arranged on the first bearing seat in a relative movement manner along a second direction, the first direction and the second direction respectively extend along the horizontal direction, and the first direction and the second direction are perpendicular to each other;
the second bearing mechanism comprises a second movable seat, the second movable seat can be arranged on the base along the second direction and can move relatively along the up-down direction, and the second movable seat is used for mounting the second substrate;
the LED transferring mechanism comprises a third bearing seat, a third movable seat and a transferring punching needle, the third bearing seat can be arranged on the base in a relatively moving mode along the first direction, the third movable seat can be arranged on the third bearing seat in a relatively moving mode along the second direction, and the transferring punching needle can be arranged on the third movable seat in a relatively moving mode along the vertical direction;
the first movable seat comprises a seat body and an adjusting platform, the seat body can be arranged on the first bearing seat in a relative motion manner along the second direction, the adjusting platform can rotate relative to the seat body around a first rotation center line, the first rotation center line extends along the vertical direction, and the adjusting platform can be connected with the seat body in a relative motion manner along the vertical direction; each bearing frame is provided with a magnetic part, the adjusting platform is provided with an electromagnet, the electromagnet has a power-on state and a power-off state, and when the electromagnet is in the power-off state, the adjusting platform can be matched with and adsorb one bearing frame; when the electromagnet is in a power-on state, the adjusting table is disengaged from the bearing frame.
In some embodiments, a leveling mechanism is arranged between the base body and the adjusting table, the leveling mechanism comprises at least three groups of leveling assemblies, multiple groups of leveling assemblies are arranged at intervals in the horizontal plane, each group of leveling assemblies comprises a first leveling member and a second leveling member, the first leveling member is fixedly arranged on the base body, the second leveling member is connected with the adjusting table, and each group of leveling assemblies is arranged in the second leveling member and can be connected with the first leveling member along the vertical direction in a relative motion manner.
In some embodiments, in each leveling assembly, one of the first leveling member and the second leveling member is a plug, and the other leveling member has a slot, the plug can be inserted into the slot in a vertically moving manner, and a peripheral wall of the plug is in clearance fit with an inner side wall of the slot.
In some embodiments, the plurality of sets of leveling assemblies are equally spaced apart along a circumference of the conditioning station.
In some embodiments, a circular mounting groove is formed in the adjusting table, a first circular ring-shaped track is arranged on the inner side wall of the mounting groove, the axial lead of the mounting groove coincides with the first rotation center line, each leveling component comprises a roller, the roller is fixedly arranged with the second leveling component, or the roller is connected with the second leveling component in a manner of relative rotation around the second rotation center line, the second rotation center line extends along the up-down direction, and each roller can be connected with the first track in a manner of relative movement along the extending direction of the first track.
In some embodiments, each of the bearing frames is provided with a plurality of first positioning structures, each of the first positioning structures is provided with a plurality of second positioning structures arranged at intervals in a horizontal plane, the adjusting platform is provided with a plurality of second positioning structures, each of the second positioning structures is provided with a plurality of first positioning structures, and when the adjusting platform is matched with and adsorbs one of the bearing frames, the plurality of first positioning structures of the bearing frame are matched with the plurality of second positioning structures of the adjusting platform in a one-to-one correspondence manner.
In some embodiments, the feeding assembly includes a feeding support seat and a feeding movable seat, the feeding support seat is disposed on the base in a relatively movable manner, the feeding movable seat is disposed on the feeding support seat in a relatively movable manner along an up-down direction, a clamping member and an ejector member are disposed on the feeding support seat, and the clamping member and the ejector member are respectively disposed on the feeding support seat in a relatively movable manner along a horizontal direction; each bearing frame is provided with a clamping side wall, a plurality of clamping openings are formed in the clamping side wall at intervals, each clamping piece is provided with a clamping head, and the clamping heads are provided with a plurality of clamping openings corresponding to the clamping openings; when the bearing frame is positioned in the storage bin, the plurality of clamping heads and the openings of the plurality of clamping openings are oppositely arranged along the first direction; each clamping head can be inserted into a corresponding clamping opening along the up-down direction, and a limiting structure used for limiting the clamping heads and the clamping openings to be separated along the first direction is arranged between the clamping heads and the clamping openings; when the clamping piece clamps one bearing frame, the clamping heads are inserted into the clamping openings in a one-to-one correspondence mode, and the pushing piece abuts against the clamping side wall.
In some embodiments, a supporting guide rail is disposed on the material loading movable seat, an extending direction of the supporting guide rail is parallel to a moving direction of the clamping members, and when the clamping members clamp one of the carrying frames, the supporting guide rail is supported below the carrying frame.
In some embodiments, the storage bin is configured to store a plurality of the carrying frames stacked in an up-down direction, and the feeding mechanism further includes a photoelectric sensor configured to detect whether the carrying frames are stored at a certain height in the storage bin, where the photoelectric sensor has a plurality of the carrying frames stacked in the up-down direction.
In some embodiments, a mounting mechanism for fixedly mounting the second substrate is disposed on the second movable seat, and the mounting mechanism includes a vacuum suction port, where the vacuum suction port has a plurality of vacuum suction ports disposed at intervals on the second movable seat; the second bearing mechanism further comprises a second rail and a lifting assembly, the second rail extends along the second direction, the second movable seat can be arranged on the second rail in a relative motion manner along the second direction, a lifting space is formed between the lower portion of the second movable seat and the base, and the lifting assembly is arranged in the lifting space; the lifting assembly comprises a driving seat and a lifting seat, the driving seat is arranged below the lifting seat, the driving seat can be arranged on the base in a relatively moving mode along the second direction, the lifting seat can be arranged on the base in a relatively moving mode along the vertical direction, and the lifting seat can be supported below the second movable seat and lift the second movable seat; the driving seat is provided with a driving inclined plane, the lifting seat is provided with a matching inclined plane, the driving inclined plane is abutted against the matching inclined plane, the driving inclined plane and the matching inclined plane are gradually extended in an inclined mode in the second direction from top to bottom respectively, and the lifting assembly further comprises a driving mechanism for driving the driving seat to move in the second direction in a relative mode.
A microminiature LED transfer method for transferring microminiature LED chips adhered to a first substrate to a second substrate, the transfer method comprising the steps of:
s1, acquiring one or more datum point information on a second substrate by a positioning camera, sending the datum point information to a control unit, and determining the real coordinate position of a position to be subjected to microminiature LED chip transfer on the second substrate by the control unit according to the datum point information;
s2, the positioning camera collects image information of the microminiature LED chip on the first base material;
s3, controlling the first substrate to move to the position above the second substrate according to the real coordinate position in the step S1 and the image information in the step S2, enabling the micro-miniature LED chip to be located right above the real coordinate position, and controlling the transfer punch pin to move to the position above the real coordinate position and the micro-miniature LED chip;
and S4, transferring the microminiature LED chip from the first base material to the second base material by the transfer punch pin.
Another object of the present invention is to provide a carrier frame suitable for transferring micro LEDs. In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a bearing frame, bearing frame has seted up the installing port, the installing port is followed bearing frame's thickness direction runs through bearing frame follows on bearing frame's the thickness direction, one side of bearing frame is equipped with bearing structure, and the opposite side is equipped with the installation and presss from both sides, the installation presss from both sides to have the edge a plurality of circumference interval setting of installing port, every the installation press from both sides homoenergetic relatively rotate ground with bearing frame connects, bearing frame still is equipped with and is used for providing the installation presss from both sides the orientation the installing port rotates the elastic component of required effort.
In some embodiments, the carrier frame has a mounting surface and a clamping side wall, the mounting surface is located on one side of the carrier frame in the thickness direction, the clamping side wall is perpendicular to the mounting surface, a magnetic member and a first positioning structure are arranged on the mounting surface, the first positioning structure has a plurality of pins or slots arranged at intervals on the mounting surface, and each first positioning structure is a pin or a slot; a plurality of clamping openings are formed in the clamping side wall at intervals, and a limiting protrusion is arranged at the opening of each clamping opening.
Due to the application of the technical scheme, the microminiature LED transfer device provided by the invention has the advantages that the whole transfer device is compact in structure by arranging the feeding mechanism, the first bearing mechanism, the second bearing mechanism, the LED transfer mechanism and the like, and the mechanisms can be efficiently matched and can flexibly and orderly work. The angle of the adjusting table can be adjusted in a rotating mode during use, so that the micro-miniature LED chips on the first base material are aligned with the second base material accurately, the micro-miniature LED chips are accurately transferred to the corresponding positions of the second base material, the height and the levelness of the adjusting table can be adjusted finely, and the transferring precision of the micro-miniature LED chips is further improved from the details. Furthermore, each bearing frame can be quickly installed on the adjusting platform through a magnetic structure, and the bearing frame is convenient to disassemble and assemble, reliable and high in automation degree. Particularly, the electromagnet is made of a permanent magnet, and the permanent magnet has magnetism in a conventional power-off state and can keep adsorbing the bearing frame; and in the electrified state, a reverse electromagnetic field is applied to the permanent magnet electromagnet, so that the permanent magnet electromagnet loses the magnetic field in a short time, and the bearing frame is rapidly disassembled. The design is favorable for reducing the energy consumption of the first bearing mechanism, and simultaneously, the working stability of the first bearing mechanism is improved, and the control method is simpler.
According to the microminiature LED transfer method provided by the invention, the images and the position information of the first base material and the second base material are acquired through the same positioning camera, so that the flexible alignment of the first base material and the second base material can be realized, and each microminiature LED chip can be accurately transferred to a target site on the second base material. The bearing frame provided by the invention has a flat structure, can stably clamp the first base material therein, and is further beneficial to improving the efficiency and precision of transferring the micro LED chip.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic perspective view of a microminiature LED transfer device according to an embodiment of the present invention;
FIG. 2 is a schematic top view of the micro-miniature LED transfer device of the present embodiment;
FIG. 3 is a schematic diagram of the operation principle of the microminiature LED transferring device in this embodiment;
fig. 4 is a schematic perspective view of the feeding mechanism in this embodiment, in which the holding member does not hold the carrying frame;
FIG. 5 is an enlarged view of the point A in FIG. 4;
fig. 6 is a partial perspective view of the feeding mechanism in the embodiment, wherein the holding member holds the carrying frame;
fig. 7 is a perspective view of the carriage in this embodiment;
FIG. 8 is a perspective view of a first carriage mechanism in the present embodiment;
FIG. 9 is a partial perspective view of the first carriage in this embodiment;
FIG. 10 is a schematic front view of FIG. 9;
FIG. 11 is a schematic cross-sectional view B-B of FIG. 10;
FIG. 12 is an enlarged view of FIG. 11 at C;
FIG. 13 is a perspective view of a second carriage mechanism in the present embodiment;
FIG. 14 is a partial perspective view of a second carriage mechanism in the present embodiment;
FIG. 15 is a front view of FIG. 14;
FIG. 16 is a perspective view of the LED transfer mechanism of this embodiment;
wherein: 1. a first substrate; 2. a second substrate; 3. a microminiature LED chip;
100. a bearing frame; 101. an installation port; 102. a mounting surface; 103. clamping the side wall; 104. a clamping port; 105. a limiting bulge; 110. installing a clamp; 120. an elastic member; 130. a magnetic member; 140. a first positioning structure;
200. a base; 210. a third track;
300. a feeding mechanism; 310. a storage bin; 320. a feeding assembly; 321. a feeding bearing seat; 322. a feeding movable seat; 323. a clamping member; 324. pushing the piece; 325. a clamping head; 325a, a head; 325b, a neck; 326. supporting the guide rail; 330. a photosensor;
400. a first bearing mechanism; 410. a first bearing seat; 411. a first support rail; 420. a first movable seat; 421. a base body; 4211. a connecting portion; 4212. an installation part; 422. an adjusting table; 422a and a mounting groove; 430. a leveling assembly; 431. a first leveling member; 432. a second leveling member; 433. a roller; 440. a first track; 441. a rack; 450. an electromagnet; 460. rotating the adjustment motor;
500. a second bearing mechanism; 501. lifting the space; 510. a second movable seat; 511. a vacuum adsorption port; 520. a second track; 530. a lifting assembly; 531. a driving seat; 531a, a drive ramp; 532. a lifting seat; 532a, a mating ramp; 533. a drive rail; 534. a drive motor;
600. an LED transfer mechanism; 610. a third bearing seat; 611. a third support rail; 620. a third movable seat; 630. transferring the punching needle; 640. positioning a camera; 650. a laser range finder; 660. a voice coil motor;
x, a first direction; y, a second direction; z, up-down direction; 1001. a first rotational centerline; 1002. a second centerline of rotation.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the invention may be more readily understood by those skilled in the art.
Referring to fig. 1 to 3, a micro-miniature LED transfer apparatus for transferring a micro-miniature LED chip 3 adhered on a first substrate 1 to a second substrate 2. The transfer device mainly comprises a base 200, a feeding mechanism 300, a first bearing mechanism 400, a second bearing mechanism 500, an LED transfer mechanism 600 and the like, wherein the feeding mechanism 300, the first bearing mechanism 400, the second bearing mechanism 500, the LED transfer mechanism 600 and the like are arranged on the base 200. The transfer device further comprises a control unit (not shown in the figure), and the control unit is in signal connection with each mechanism, so that the overall control and automatic management of the whole transfer device can be realized.
Referring to fig. 1, in order to facilitate description and understanding of a specific structure of the transfer device, an XYZ three-dimensional coordinate system is established with reference to a base 200 in the present embodiment, wherein a first direction X, a second direction Y, and an up-down direction Z are perpendicular to each other two by two, the first direction X and the second direction Y extend in a horizontal direction, and the up-down direction Z extends in a vertical direction. It should be noted that the terms of orientation such as "up," "down," "left," "right," "front," "back," "horizontal" and "vertical" in the present embodiment are defined based on the orientation shown in the drawings, and are only used to describe the relative position and connection relationship of the components in the present embodiment, and do not represent that the components in the transfer device have to have a specific orientation or placement position, and therefore, the present invention is not limited thereto.
Referring to fig. 3, the basic operation principle of the transfer device in this embodiment is shown. The first substrate 1 is fixed in the carrying frame 100, and the first substrate 1 may be a carrying material with certain viscosity and elasticity, such as a wafer tape, a blue film, a white film, and the like. A large number of Micro LED chips 3 to be transferred are adhered to the first substrate 1, and the Micro LED chips 3 may be Mini LEDs, micro LEDs, or the like. The second substrate 2 is fixed on the second movable seat 510, and the second movable seat 510 remains fixed during the transferring process of the micro LED chip 3. The second substrate 2 may be a rigid or flexible material such as a circuit board, an FPC, a wafer tape, a blue film, a white film, etc., and the second substrate 2 is coated with an adhesive coating such as a glue, a solder paste, a silver paste, etc., so that the micro LED chip 3 transferred from the first substrate 1 can be adhered thereto. In this embodiment, the transferring device at least includes a transferring punch pin 630 and a positioning camera 640. The positioning camera 640 is used for visually detecting and positioning the first substrate 1, the second substrate 2 and each micro-miniature LED chip 3, so that the LED transfer process can be efficiently and accurately performed. The transfer punch pin 630 is used for moving at high speed in the first direction X, the second direction Y and the vertical direction Z to apply a certain pressure to each micro LED chip 3 from above the first substrate 1, so that the micro LED chip 3 can be quickly separated from the first substrate 1 and transferred to a corresponding position on the second substrate 2.
Referring to fig. 1 and 2, in the present embodiment, the base 200 is fixedly provided with two third rails 210, the two third rails 210 are arranged at intervals along the second direction Y, and each third rail 210 extends along the first direction X. The feeding mechanism 300 includes a storage bin 310 and a feeding assembly 320, the storage bin 310 is used for storing one or more carriers 100, and the feeding assembly 320 is used for transporting the carriers 100 between the storage bin 310 and the first carrier 400. The first supporting mechanism 400 is used for fixing and adjusting the position of the supporting frame 100, and includes a first supporting seat 410 and a first movable seat 420, the first supporting seat 410 is disposed on the base 200 in a manner of being capable of relatively moving along the first direction X, the first supporting seat 410 is specifically disposed on the two third rails 210 in a manner of being capable of relatively sliding along the first direction X, and the first movable seat 420 is disposed on the first supporting seat 410 in a manner of being capable of relatively moving along the second direction Y. The second carrying mechanism 500 is used for fixing and adjusting the position of the second substrate 2, the second carrying mechanism 500 includes a second movable seat 510, the second movable seat 510 can be disposed on the base 200 along the second direction Y and along the vertical direction Z, and the second movable seat 510 is used for fixedly mounting the second substrate 2. The LED transfer mechanism 600 includes a third support block 610, a third movable block 620, and a transfer punch pin 630, the third support block 610 is provided on the base 200 so as to be relatively movable in the first direction X, specifically, the third support block 610 is provided on the two third rails 210 so as to be relatively slidable in the first direction X, the third movable block 620 is provided on the third support block 610 so as to be relatively movable in the second direction Y, and the transfer punch pin 630 is provided on the third movable block 620 so as to be relatively movable in the vertical direction Z.
Referring to fig. 7, in the present embodiment, each of the carrying frames 100 is a flat rectangular plate, and the carrying frames 100 are horizontally arranged in the orientation shown in the figure during the operation process, so the structure of the carrying frame 100 is still described with reference to the XYZ three-dimensional coordinate system in the present embodiment. It should be noted that, since each carriage 100 is an independent component, when the carriage is in a non-operating state or outside the transfer device, the carriage 100 may be placed in any other orientation. In this embodiment, the carrying frame 100 is provided with an installation opening 101, and the installation opening 101 penetrates through the carrying frame 100 along a thickness direction (i.e., a vertical direction Z) of the carrying frame 100. The mounting opening 101 is used for mounting the first substrate 1, and the transfer punch pin 630 presses the first substrate 1 from above. In this embodiment, the mounting opening 101 is specifically circular corresponding to the circular first substrate 1; in other embodiments, the mounting opening 101 may be configured with other geometric shapes according to the shape of the first substrate 1 or the second substrate 2.
Further, referring to fig. 7, in the present embodiment, in the thickness direction of the carrying frame 100, a carrying structure (not shown) is disposed on one side of the carrying frame 100, and a mounting clip 110 is disposed on the other side of the carrying frame 100, where the carrying structure may be a circular ring with an inner diameter slightly smaller than the mounting opening 101, so that the carrying structure and the mounting clip 110 cooperate with each other to stably clamp the first substrate 1 in the mounting opening 101. In this embodiment, the mounting clips 110 are provided in a plurality at intervals along the circumferential direction of the mounting opening 101, each mounting clip 110 is connected to the carrying frame 100 in a relatively rotatable manner, and the carrying frame 100 is further provided with an elastic member 120 for providing a force required for rotating the mounting clip 110 toward the mounting opening 101. Specifically, in this embodiment, the mounting clips 110 are respectively disposed at four corners of the rectangular carrying frame 100, the four mounting clips 110 are distributed at equal intervals, a rotation center line of each mounting clip 110 extends along the horizontal direction, and the elastic element 120 is specifically a torsion spring wound around a rotation shaft of the corresponding mounting clip 110. Referring to fig. 7, each mounting clip 110 only clips to the edge of the first substrate 1, and thus does not interfere with the normal operation of the transfer punch pins 630 during the LED transfer process.
Referring to fig. 7, in the present embodiment, the bezel 100 has a mounting surface 102 and a clamping sidewall 103, the mounting surface 102 is located on one side of the bezel 100 in the thickness direction, and the clamping sidewall 103 is perpendicular to the mounting surface 102. In this embodiment, the mounting surface 102 is specifically located on the upper side of the carriage 100, and the clamping sidewall 103 is located on one side in the first direction X. As can be seen from the figure, since the concave-convex structure such as a rib is further provided above the carriage 100, the mounting surface 102 is not a flat horizontal surface. In this embodiment, the magnetic member 130 and the first positioning structure 140 are disposed on the mounting surface 102, and the magnetic member 130 and the first positioning structure 140 are disposed on the mounting surface 102 at intervals. In this embodiment, the magnetic member 130 may be an iron block or a magnet, which can be attracted by magnetic force, and specifically, three magnetic members 130 are shown in the figure and are disposed at intervals along the circumferential direction of the mounting opening 101. Each first positioning structure 140 may be a plug or a slot, and two first positioning structures 140 are shown in the figure and are spaced along the second direction Y, and the two first positioning structures 140 are respectively disposed at two sides of the mounting opening 101. Furthermore, a plurality of clamping openings 104 are formed in the clamping side wall 103 at intervals, and a limiting protrusion 105 is arranged at an opening of each clamping opening 104. In this embodiment, two clamping ports 104 symmetrically arranged along the second direction Y are specifically formed in the clamping side wall 103, an inner cavity of each clamping port 104 is substantially rectangular, and two limiting protrusions 105 at two sides of an opening of each clamping port 104 reduce the width of the opening of each clamping port 104, so that the width of the opening is smaller than that of the inner cavity, and each clamping port 104 is substantially in a shape of a Chinese character 'tu'.
Referring to fig. 4, in the present embodiment, the storage bin 310 is used for storing a plurality of carrying frames 100 stacked in the up-down direction Z. The feeding mechanism 300 further includes a plurality of photoelectric sensors 330 for detecting whether the carrying frame 100 is stored at a certain height in the storage bin 310, the photoelectric sensors 330 are stacked along the vertical direction Z, the plurality of photoelectric sensors 330 are in one-to-one correspondence with the plurality of heights in the storage bin 310, and the plurality of photoelectric sensors 330 are arranged in parallel on one side of the storage bin 310 in the second direction Y. Thus, when the photoelectric sensor 330 detects that the carrying frame 100 is stored at a certain height in the storage bin 310, the detection signal can be fed back to the control unit, and the loading assembly 320 receives the instruction of the control unit, so that the carrying frame 100 can be rapidly taken out from the storage bin 310 and transferred to the first carrying mechanism 400.
Referring to fig. 4 to 6, in the present embodiment, the feeding assembly 320 includes a feeding holder 321 and a feeding movable seat 322, wherein the feeding holder 321 is disposed on the base 200 in a relatively movable manner, and the feeding movable seat 322 is disposed on the feeding holder 321 in a relatively movable manner along the up-down direction Z. In this embodiment, the loading holder 321 is disposed on the base 200 at least along the first direction X and the second direction Y in a relatively movable manner, and is disposed on the base 200 in a relatively rotatable manner around a vertical rotation center line, so as to accurately transfer and fix the carrier frame 100 held by the loading movable holder 322 to the first movable holder 420 of the first carrier mechanism 400. In this embodiment, the material loading support seat 321 is provided with a clamping member 323 and an ejecting member 324, and the clamping member 323 and the ejecting member 324 are respectively disposed on the material loading support seat 321 in a manner of being capable of relatively moving along a horizontal direction. In this embodiment, when the loading tray 321 is engaged with the storage bin 310 (as shown in fig. 4), the clamping member 323 and the pushing member 324 are respectively disposed on the loading tray 321 in a manner of relatively moving along the first direction X. The loading movable base 322 is further provided with a bearing guide rail 326, and the extension direction of the bearing guide rail 326 is parallel to the movement direction of the clamping member 323. In this embodiment, when the material loading bearer 321 is matched with the storage bin 310, the bearer rail 326 has two spaced apart edges along the second direction Y, and each bearer rail 326 extends along the first direction X, so as to provide a more stable support for the carrier frame 100 clamped by the clamping members 323.
Referring to fig. 5 to 6, in the present embodiment, the clamping member 323 has a clamping head 325, and the clamping head 325 has a plurality corresponding to the plurality of clamping openings 104, specifically two spaced apart in the second direction Y. When the carriage 100 is located in the storage bin 310, the plurality of clamping heads 325 are disposed opposite to the openings of the plurality of clamping openings 104 along the first direction X. Each clamping head 325 can be inserted into a corresponding clamping opening 104 along the vertical direction Z, and a limiting structure for limiting the clamping head 325 and the clamping opening 104 to be separated from each other along the first direction X is arranged between the clamping head 325 and the clamping opening 104. In this embodiment, each clamping head 325 comprises a head 325a and a neck 325b, wherein the head 325a is located on a side close to the clamping opening 104, the head 325a has a width greater than the neck 325b, and the head 325a has a width greater than the opening width of the corresponding clamping opening 104. Thus, the head 325a of each clamping head 325 and the limiting protrusion 105 of the corresponding clamping opening 104 form a limiting structure between the clamping head 325 and the clamping opening 104. Referring to fig. 6, each head 325a can be engaged and clamped in the clamping opening 104 on the same side along the vertical direction Z, and at this time, the neck 325b is just located in the narrow opening between the two limiting protrusions 105, and the clamping head 325 cannot be separated from the clamping opening 104 along the first direction X. Further, when the clamping member 323 clamps one carrying frame 100, the plurality of clamping heads 325 are inserted into the plurality of clamping openings 104 in a one-to-one correspondence manner, the pushing member 324 abuts against the clamping side wall 103, and here the pushing member 324 is specifically located between the two clamping heads 325, so that the clamping member 323 can stably clamp the carrying frame 100 and is not easy to loosen. Furthermore, when the clamping member 323 clamps one of the carrying frames 100, both of the supporting rails 326 are supported under the carrying frame 100, and when the clamping member 323 horizontally pulls the carrying frame 100, the carrying frame 100 can relatively move along the extending direction of the supporting rails 326.
In this embodiment, the loading operation of the loading assembly 320 is as follows: first, the loading supporter 321 moves along the base 200 to a position close to the storage bin 310; subsequently, the loading movable seat 322 moves up and down along the loading support seat 321, and is aligned to the height of the loading frame 100 to be taken out; then, the clamping member 323 moves along the first direction X until the clamping member 323 moves to the lower side of the target carrying frame 100, and the loading movable seat 322 moves up slightly, so that the two clamping heads 325 can be just inserted into the corresponding two clamping openings 104; at this time, the pushing member 324 moves along the first direction X and pushes against the clamping sidewall 103 of the target carriage 100, so that the clamping member 323 completely clamps the carriage 100; thereafter, the holding member 323 and the pushing member 324 move in the reverse direction of the first direction X synchronously, and pull the carriage 100 out of the storage bin 310 and onto the two support rails 326; finally, the carriage 100 is completely taken out of the loading movable seat 322, and can move to a designated loading position along with the loading movable seat 322 and the loading bearing seat 321, where the loading position is specifically the first movable seat 420 of the first carriage 400 in this embodiment.
Referring to fig. 8 to 12, in the present embodiment, the first supporting base 410 is a long arm extending along the second direction Y, and two ends of the first supporting base 410 are respectively mounted on the third rails 210 at two sides of the base 200. The first supporting base 410 is fixedly provided with a first supporting rail 411 extending along the second direction Y. The first movable base 420 includes a base 421 and an adjusting stage 422, the base 421 can be disposed on the first supporting base 410 along the second direction Y in a relatively movable manner, the adjusting stage 422 can be connected to the base 421 around a first rotation center line 1001 in a relatively rotatable manner, the first rotation center line 1001 extends along the up-down direction Z, and the adjusting stage 422 can be connected to the base 421 along the up-down direction Z in a relatively movable manner. In this embodiment, the seat body 421 specifically includes a connecting portion 4211 and a mounting portion 4212 integrally provided, the connecting portion 4211 and the mounting portion 4212 are respectively shaped as a flat plate, and the extending directions of the connecting portion 4211 and the mounting portion 4212 are perpendicular to each other, wherein the connecting portion 4211 extends along the up-down direction Z, the connecting portion 4211 is directly slidably connected to the first supporting rail 411, the mounting portion 4212 extends along the horizontal direction from the lower end portion of the connecting portion 4211, the adjusting platform 422 is connected below the connecting portion 4211, and the adjusting platform 422 is used for directly fixing and mounting the carriage 100.
Referring to fig. 9, in the present embodiment, a circular mounting groove 422a is formed on the adjusting stage 422, an annular first rail 440 is disposed on an inner side wall of the mounting groove 422a, and an axial line of the mounting groove 422a coincides with the first rotation center line 1001. In this embodiment, the connecting portion 4211 is also provided with a circular groove corresponding to the position and size of the mounting groove 422a and further corresponding to the position and size of the mounting opening 101 of the carrying frame 100 mounted below the adjusting stage 422, so that the first movable seat 420 is integrally provided with a cavity penetrating along the vertical direction Z, and the cavity can be used for the transfer punch pin 630 to extend from above and press the first substrate 1 and the micro LED chip 3 in the mounting opening 101 from top to bottom.
Referring to fig. 11, in the present embodiment, the adjusting platform 422 is provided with an electromagnet 450, the electromagnet 450 has a power-on state and a power-off state, when the electromagnet 450 is in the power-off state, the adjusting platform 422 can cooperatively adsorb one of the bearing frames 100; when the electromagnet 450 is in the energized state, the adjusting stage 422 is disengaged from the carriage 100. In this embodiment, the electromagnet 450 is made of a permanent magnet material, which has magnetism in a natural power-off state and can keep adsorbing the carrying frame 100, so that the electromagnet 450 does not need to be powered on during a normal LED transferring operation process, and is more energy-saving, and there is no need to worry about accidents such as the carrying frame 100 falling off. When the transfer operation of a group of LEDs is completed, the electromagnet 450 is energized, and the applied current can generate an electromagnetic field opposite to the magnetic field of the permanent magnet itself, so that the effect of transient demagnetization is achieved, and the used carrying frame 100 can be rapidly detached from the adjusting table 422. In this embodiment, the adjusting platform 422 has a plurality of electromagnets 450, and the plurality of electromagnets 450 correspond to the plurality of magnetic members 130 on the carrying frame 100 in position and number one by one, so that the carrying frame 100 can be stably adsorbed. In this embodiment, the bottom of the adjusting platform 422 is provided with a second positioning structure (not shown), the second positioning structure has a plurality of first positioning structures 140 matching with the plurality of bearing frames 100, and when the first positioning structures 140 are slots, the second positioning structures are corresponding to pins. Therefore, when the adjusting table 422 is matched with and adsorbs one bearing frame 100, the mounting surface 102 of the bearing frame 100 faces upwards, the plurality of first positioning structures 140 on the mounting surface 102 are matched with the plurality of second positioning structures of the adjusting table 422 in a one-to-one correspondence manner, and each plug pin is inserted into the corresponding slot. In this way, the first positioning structure 140 and the second positioning structure function to position the carrying frames 100 in the first direction X and the second direction Y, so that each carrying frame 100 can be quickly and accurately mounted on the adjusting table 422.
Referring to fig. 8 to 12, in the present embodiment, a leveling mechanism is disposed between the seat 421 and the adjusting table 422 for adjusting the levelness of the first base material 1. The leveling mechanism comprises at least three groups of leveling assemblies 430, and the groups of leveling assemblies 430 are arranged at intervals in a horizontal plane. Each leveling assembly 430 includes a first leveling member 431 and a second leveling member 432, the first leveling member 431 is fixedly disposed on the seat 421, and the second leveling member 432 is connected to the adjusting platform 422. In each leveling assembly 430, the second leveling member 432 is connected to the first leveling member 431 to be movable in the up-down direction Z. The leveling assemblies 430 are equidistantly distributed along the circumferential direction of the adjusting table 422, in this embodiment, three leveling assemblies 430 are specifically provided, the three leveling assemblies 430 are equidistantly distributed along the circumferential direction of the mounting groove 422a, and the included angle between the circle centers of every two adjacent leveling assemblies 430 is about 120 °.
Referring to fig. 11 to 12, in each leveling assembly 430, in the present embodiment, one of the first leveling member 431 and the second leveling member 432 is a plug, the other one of the first leveling member and the second leveling member has a slot, the plug is inserted into the slot in a manner of relative movement along the up-down direction Z, and an outer peripheral wall of the plug is in clearance fit with an inner side wall of the slot, so that each plug can be inclined within a certain angle, thereby achieving adjustment of the levelness of the adjusting table 422. In this embodiment, the first leveling member 431 is specifically a nut fixedly disposed on the mounting portion 4212, and the second leveling member 432 is specifically a bolt, and the bolt is in threaded fit with the nut, so that the retraction amount between the first leveling member 431 and the second leveling member 432 can be changed by rotating the nut. In this embodiment, the load-bearing frame 100 below the adjusting platform 422 can be adjusted to be completely horizontal by comprehensively adjusting the retraction amount of the three leveling assemblies 430.
Referring to fig. 9 to 12, each leveling assembly 430 further includes a roller 433, and each roller 433 is connected to the first rail 440 to be relatively movable along an extending direction of the first rail 440. The roller 433 and the second leveling member 432 are fixedly disposed, or the roller 433 and the second leveling member 432 are connected to each other so as to be rotatable around a second rotation center line 1002, and the second rotation center line 1002 extends in the vertical direction Z. In this embodiment, in each leveling assembly 430, the roller 433 can be relatively rotatably connected to the lower end of the second leveling member 432 around the second rotation center line 1002, an annular groove is formed in the circumferential direction of the roller 433, and the lateral edge of the first rail 440 can be clamped in the groove in a shape-fitting manner, so that the roller 433 can be in rolling fit with the first rail 440, and the rotary guide of the adjusting table 422 relative to the seat 421 is realized.
Referring to fig. 9, in the present embodiment, a rack 441 and a rotation adjusting motor 460 are further disposed between the seat body 421 and the adjusting table 422, so as to automatically and precisely adjust and control the angle of the adjusting table 422 rotating around the first rotation center line 1001, so that the micro LED chip 3 can be transferred onto the second substrate 2 in a correct direction and angle.
Referring to fig. 13 to 15, in the embodiment, the second movable seat 510 is provided with a mounting mechanism for fixedly mounting the second substrate 2, the mounting mechanism specifically includes a plurality of vacuum suction ports 511, the vacuum suction ports 511 are arranged on the second movable seat 510 at intervals, and the plurality of vacuum suction ports 511 are all connected to a vacuum pumping device (not shown in the figure) through an exhaust tube, so that the second substrate 2 can be flatly and firmly sucked on the upper surface of the second movable seat 510.
In this embodiment, the second supporting mechanism 500 further includes a second rail 520 and a lifting assembly 530. The second rail 520 extends along the second direction Y, the second movable seat 510 is disposed on the second rail 520 and capable of moving relatively along the second direction Y, a lifting space 501 is provided between the lower portion of the second movable seat 510 and the base 200, and the lifting assembly 530 is disposed in the lifting space 501. In this embodiment, the second track 520 specifically has two spaced apart rails along the first direction X, two sides of the second movable base 510 are respectively matched with the two second tracks 520, and the lifting assembly 530 is disposed between the two second tracks 520.
Referring to fig. 14 to 15, in the present embodiment, the lifting assembly 530 includes a driving base 531 and a lifting base 532. The driving seat 531 is disposed below the lifting seat 532, the driving seat 531 is disposed on the base 200 in a manner that the driving seat 531 can move relatively along the second direction Y, the lifting seat 532 is disposed on the base 200 in a manner that the lifting seat 532 can move relatively along the vertical direction Z, and the lifting seat 532 can be supported below the second movable seat 510 and lift or lower the second movable seat 510. In this embodiment, the driving seat 531 has a driving inclined surface 531a, the lifting seat 532 has a matching inclined surface 532a, the driving inclined surface 531a and the matching inclined surface 532a abut against each other, and the driving inclined surface 531a and the matching inclined surface 532a respectively extend from top to bottom gradually and obliquely along the second direction Y. The lifting assembly 530 further comprises a driving mechanism for driving the driving socket 531 to move relatively in the second direction Y. In this embodiment, the driving mechanism specifically includes a driving rail 533 and a driving motor 534, the driving rail 533 extends along the second direction Y, and the driving seat 531 is disposed on the driving rail 533 in a relatively movable manner. Therefore, the driving seat 531 can be controlled to horizontally move along the second direction Y by controlling the driving motor 534 to work, the vertical movement of the lifting seat 532 along the vertical direction Z is realized, the overall height of the lifting component 530 is obviously reduced, and the occupied space is smaller.
Referring to fig. 16, in the present embodiment, similar to the first holder 410, the third holder 610 is a long arm extending in the second direction Y, and two ends of the third holder 610 respectively span the third rails 210 on two sides of the base 200. Third bearing seat 610 is last to set firmly along the third bearing track 611 of second direction Y extension, and third sliding seat 620 can set up on third bearing track 611 along second direction Y relatively sliding. The LED transferring mechanism 600 further includes a positioning camera 640, a laser range finder 650 and a voice coil motor 660 disposed on the third movable mount 620, wherein the positioning camera 640 and the laser range finder 650 are used for guiding the transferring punch pin 630 to accurately align the micro LED chip 3 on the first substrate 1, and the voice coil motor 660 is used for driving the transferring punch pin 630 to reciprocate at a high speed in the up-down direction Z, so as to improve the transferring efficiency of the micro LED chip 3.
Referring to fig. 2, in the present embodiment, the first and third bearing blocks 410 and 610 are disposed at an interval along the first direction X, and the first movable seat 420 and the third movable seat 620 are disposed opposite to each other along the first direction X, so that when the transfer device performs the LED transfer operation, the first movable seat 420, the third movable seat 620 and the second movable seat 510 can approach each other and cooperate with each other. In the idle state, along the first direction X, the first carrying mechanism 400 and the LED transferring mechanism 600 are disposed on one side of the second carrying mechanism 500, and the feeding mechanism 300 is disposed on the other side of the second carrying mechanism 500, so that the transferring device is not prone to interference when being started to work, and is more flexible in operation.
The embodiment also provides a microminiature LED transferring method based on the transferring device, which comprises the following steps:
s1, acquiring one or more datum point information on a second base material 2 by a positioning camera 640, sending the datum point information to a control unit, determining the real position of the second base material 2 by the control unit according to the datum point information, and determining the real coordinate position of the position to be transferred by the micro-miniature LED chip 3 on the second base material 2;
s2, acquiring image information of the microminiature LED chip 3 on the first substrate 1 by the positioning camera 640;
step S3, according to the real coordinate position in step S1 and the image information in step S2, controlling the first substrate 1 to move to the upper side of the second substrate 2, so that the micro-LED chip 3 is located right above the real coordinate position, and controlling the transfer punch pin 630 to move to the real coordinate position and right above the micro-LED chip 3;
step S4, transferring the punch pin 630 to transfer the micro LED chip 3 from the first substrate 1 to the second substrate 2.
Thus, in the transferring method in this embodiment, it is not necessary to strictly control the coordinate position of the second base material 2 on the base 200 from the beginning, and only after the second base material 2 is roughly transferred to the right position, the positioning camera 640 performs image acquisition, so that the control unit can obtain the real position of the second base material 2 on the base 200, and further determine the real coordinate position of the position to be transferred by the micro LED chip 3 on the second base material 2. Further, in this embodiment, the same positioning camera 640 is used to acquire the image information of the micro LED chip 3 on the first substrate 1, and the control unit compares the position information included in the image with the real coordinate position of the second substrate 2, so as to plan the movement path of the first substrate 1, thereby achieving the precise alignment of the first substrate 1 and the second substrate 2. The whole alignment method has higher flexibility and stronger operability.
Specifically, before step S1, the second movable base 510 is first moved to one side of the base 200 along the second rail 520, and the second substrate 2 to be processed is fixed to the second movable base 510. At the same time, the loading assembly 320 takes one carriage 100 out of the storage bin 310 and transfers and fixes it to the bottom of the adjusting table 422.
Then, the second movable base 510 moves to the center of the base 200 along the second direction Y, and the lifting assembly 530 lifts the second movable base 510, at this time, the second movable base 510 is disengaged from the second rail 520. According to the thickness difference of the second substrate 2, the second movable seat 510 may have different lifting heights, and the second movable seat 510 is kept stationary after being lifted to a preset height, and waits for the LED transfer processing.
In step S1, the third support seat 610 moves along the first direction X, and the third movable seat 620 moves along the second direction Y, so that the positioning camera 640 can move above the second substrate 2, and the positioning camera 640 can capture an image of the upper surface of the second substrate 2.
In step S2, at least one of the LED transfer mechanism 600 and the first carrying mechanism 400 moves, so that the positioning camera 640 can move above the adjusting stage 422 to perform image acquisition on the first substrate 1 to be subjected to LED transfer.
In step S3, the first movable stage 420 mounted with the carriage 100 moves in the first direction X and/or the second direction Y to a position directly above the second movable stage 510. At this time, the transfer punch pin 630 is also driven by the third bearing seat 610 and the third movable seat 620 to move to the upper side of the adjusting table 422, and the transfer punch pin 630, the first substrate 1, and the second substrate 2 are precisely aligned from top to bottom.
In step S4, after the first substrate 1, the second substrate 2 and the transfer punch pin 630 are all moved to the right position, the LED transfer mechanism 600 drives the LED transfer mechanism to perform LED transfer processing, during the transfer process, the first substrate 1 and the second substrate 2 are all kept fixed, and the transfer punch pin 630 continuously moves in the first direction X and the second direction Y, and simultaneously reciprocates at a high speed in the up-down direction Z, so as to transfer the micro LED chips 3 on the lower surface of the first substrate 1 to the upper surface of the second substrate 2 one by one.
After all the micro LED chips 3 are transferred, the feeding assembly 320 takes away the carrying frame 100, and meanwhile, the second movable seat 510 moves to the other side of the base 200 along the second track 520, so that the transferred second substrate 2 can be continuously transferred to a downstream process.
In summary, the micro-LED transfer device provided in this embodiment can transfer a large number of micro-LED chips 3 with high efficiency and high quality by coordinating the mechanisms.
The above-mentioned embodiments are only for illustrating the technical idea and features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the protection scope of the present invention by this, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims (12)

1. A microminiature LED transfer device is used for transferring microminiature LED chips adhered on a first substrate to a second substrate, wherein the first substrate is fixedly arranged in a bearing frame, and the microminiature LED transfer device is characterized in that: the transfer device comprises a base, a feeding mechanism, a first bearing mechanism, a second bearing mechanism and an LED transfer mechanism which are arranged on the base, wherein,
the feeding mechanism comprises a storage bin and a feeding assembly, the storage bin is used for storing one or more bearing frames, and the feeding assembly is used for conveying the bearing frames between the storage bin and the first bearing mechanism;
the first bearing mechanism comprises a first bearing seat and a first movable seat, the first bearing seat can be arranged on the base in a relatively movable mode along a first direction, the first movable seat can be arranged on the first bearing seat in a relatively movable mode along a second direction, the first direction and the second direction respectively extend along the horizontal direction, and the first direction and the second direction are perpendicular to each other;
the second bearing mechanism comprises a second movable seat, the second movable seat can be arranged on the base along the second direction and can move relatively along the up-down direction, and the second movable seat is used for mounting the second substrate;
the LED transferring mechanism comprises a third bearing seat, a third movable seat and a transferring punching needle, the third bearing seat can be arranged on the base in a relatively moving mode along the first direction, the third movable seat can be arranged on the third bearing seat in a relatively moving mode along the second direction, and the transferring punching needle can be arranged on the third movable seat in a relatively moving mode along the vertical direction;
the first movable seat comprises a seat body and an adjusting platform, the seat body can be arranged on the first bearing seat in a relative motion manner along the second direction, the adjusting platform can rotate relative to the seat body around a first rotation center line, the first rotation center line extends along the vertical direction, and the adjusting platform can be connected with the seat body in a relative motion manner along the vertical direction; each bearing frame is provided with a magnetic part, the adjusting platform is provided with an electromagnet, the electromagnet has a power-on state and a power-off state, and when the electromagnet is in the power-off state, the adjusting platform can be matched with and adsorb one bearing frame; when the electromagnet is in a power-on state, the adjusting table is disengaged from the bearing frame.
2. The microminiature LED transfer device of claim 1, wherein: the seat body with be equipped with leveling mechanism between the regulation platform, leveling mechanism includes three at least groups of leveling subassemblies, the multiunit leveling subassembly interval sets up in the horizontal plane, every group the leveling subassembly all includes first leveling spare and second leveling spare, first leveling spare set firmly in on the seat body, the second leveling spare with the regulation platform is connected, every group in the leveling subassembly, the second leveling spare all can be along upper and lower direction relative motion ground with first leveling spare is connected.
3. The microminiature LED transfer device of claim 2, wherein: the leveling assemblies are distributed at equal intervals along the circumferential direction of the adjusting table; every group among the leveling subassembly, first leveling spare with one of the two of second leveling spare is the bolt, and another has the slot, the bolt can be followed upper and lower direction relative motion ground and inserted and establish in the slot, the periphery wall of bolt with clearance fit between the inside wall of slot.
4. The microminiature LED transfer device of claim 2, wherein: seted up the circular shape mounting groove on the regulation platform, the inside wall of mounting groove is equipped with the annular first track of circle, the axial lead of mounting groove with first rotation center line coincides mutually, every group the leveling subassembly all includes the gyro wheel, the gyro wheel with the fixed setting of second leveling piece, or, the gyro wheel with second leveling piece can connect around second rotation center line relative rotation, second rotation center line extends along upper and lower direction, every the gyro wheel homoenergetic is followed first orbital extending direction relative motion ground with first rail connection.
5. The microminiature LED transfer device of claim 1, wherein: every the carriage all is equipped with first location structure, first location structure has a plurality ofly that the interval set up in the horizontal plane, be equipped with second location structure on the regulation platform, second location structure have with a plurality of first location structure matched with are a plurality of, work as the regulation platform cooperation adsorbs one during the carriage, this the carriage a plurality of first location structures with the regulation platform a plurality of second location structure one-to-one cooperation.
6. The microminiature LED transfer device of claim 1, wherein: the feeding assembly comprises a feeding bearing seat and a feeding movable seat, the feeding bearing seat can be arranged on the base in a relatively movable mode, the feeding movable seat can be arranged on the feeding bearing seat in a vertically relatively movable mode, a clamping piece and a pushing piece are arranged on the feeding bearing seat, and the clamping piece and the pushing piece can be arranged on the feeding bearing seat in a horizontally relatively movable mode respectively;
each bearing frame is provided with a clamping side wall, a plurality of clamping openings are formed in the clamping side wall at intervals, the clamping piece is provided with a clamping head, and the clamping head is provided with a plurality of clamping openings corresponding to the plurality of clamping openings; when the bearing frame is positioned in the storage bin, the plurality of clamping heads and the openings of the plurality of clamping openings are oppositely arranged along the first direction; each clamping head can be inserted into a corresponding clamping opening along the up-down direction, and a limiting structure used for limiting the clamping heads and the clamping openings to be separated along the first direction is arranged between the clamping heads and the clamping openings; when the clamping piece clamps one bearing frame, the clamping heads are inserted into the clamping openings in a one-to-one correspondence mode, and the pushing piece abuts against the clamping side wall.
7. The microminiature LED transfer device of claim 6, wherein: the material loading sliding seat is provided with a bearing guide rail, the extending direction of the bearing guide rail is parallel to the moving direction of the clamping piece, and when the clamping piece clamps one of the bearing frame, the bearing guide rail is supported below the bearing frame.
8. The microminiature LED transfer device of claim 1, wherein: the storage bin is used for storing a plurality of bearing frames stacked along the vertical direction, the feeding mechanism further comprises a photoelectric sensor used for detecting whether the bearing frames are stored at a certain height in the storage bin, and the photoelectric sensor is provided with a plurality of bearing frames stacked along the vertical direction.
9. The microminiature LED transfer device of claim 1, wherein: the second movable seat is provided with an installation mechanism for fixedly installing the second base material, the installation mechanism comprises a plurality of vacuum adsorption ports, and the vacuum adsorption ports are arranged on the second movable seat at intervals; the second bearing mechanism further comprises a second rail and a lifting assembly, the second rail extends along the second direction, the second movable seat can be arranged on the second rail in a relatively moving mode along the second direction, a lifting space is formed between the lower portion of the second movable seat and the base, and the lifting assembly is arranged in the lifting space; the lifting assembly comprises a driving seat and a lifting seat, the driving seat is arranged below the lifting seat, the driving seat can be arranged on the base in a relatively moving mode along the second direction, the lifting seat can be arranged on the base in a relatively moving mode along the vertical direction, and the lifting seat can be supported below the second movable seat and lift the second movable seat; the driving seat is provided with a driving inclined plane, the lifting seat is provided with a matching inclined plane, the driving inclined plane is abutted against the matching inclined plane, the driving inclined plane and the matching inclined plane are gradually extended in an inclined mode in the second direction from top to bottom respectively, and the lifting assembly further comprises a driving mechanism for driving the driving seat to move in the second direction in a relative mode.
10. A microminiature LED transfer method for transferring microminiature LED chips adhered to a first substrate to a second substrate, characterized by comprising the steps of:
s1, acquiring one or more datum point information on a second substrate by a positioning camera, sending the datum point information to a control unit, and determining the real coordinate position of a position to be subjected to microminiature LED chip transfer on the second substrate by the control unit according to the datum point information;
s2, the positioning camera collects image information of the microminiature LED chip on the first base material;
s3, controlling the first substrate to move to the position above the second substrate according to the real coordinate position in the step S1 and the image information in the step S2, enabling the micro-miniature LED chip to be located right above the real coordinate position, and controlling the transfer punch pin to move to the position above the real coordinate position and the micro-miniature LED chip;
and S4, transferring the microminiature LED chip from the first base material to the second base material by the transfer punch pin.
11. A bearing frame is characterized in that: the utility model discloses a bearing frame, including bearing frame, installing port, installing clamp, installing structure, installing clamp, bearing frame has seted up the installing port, the installing port is followed the thickness direction of bearing frame runs through the bearing frame follows in the thickness direction of bearing frame, on the thickness direction of bearing frame, one side of bearing frame is equipped with bearing structure, and the opposite side is equipped with the installing clamp, the installing clamp has along a plurality of the circumference interval setting of installing port, every the installing clamp homoenergetic relatively rotation ground with the bearing frame is connected, the bearing frame still is equipped with and is used for providing the installing clamp orientation the installing port rotates the elastic component of required effort.
12. The bezel of claim 11, wherein: the bearing frame is provided with a mounting surface and clamping side walls, the mounting surface is positioned on one side of the bearing frame in the thickness direction, the clamping side walls are perpendicular to the mounting surface, the mounting surface is provided with magnetic parts and first positioning structures, the first positioning structures are arranged on the mounting surface at intervals, and each first positioning structure is a bolt or a slot; a plurality of clamping openings are formed in the clamping side wall at intervals, and a limiting protrusion is arranged at the opening of each clamping opening.
CN202211106881.6A 2022-09-13 2022-09-13 Microminiature LED transferring device and transferring method Active CN115188871B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202211106881.6A CN115188871B (en) 2022-09-13 2022-09-13 Microminiature LED transferring device and transferring method
CN202211384982.XA CN115621397A (en) 2022-09-13 2022-09-13 Bearing frame for transferring micro LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211106881.6A CN115188871B (en) 2022-09-13 2022-09-13 Microminiature LED transferring device and transferring method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202211384982.XA Division CN115621397A (en) 2022-09-13 2022-09-13 Bearing frame for transferring micro LED

Publications (2)

Publication Number Publication Date
CN115188871A true CN115188871A (en) 2022-10-14
CN115188871B CN115188871B (en) 2022-12-09

Family

ID=83524481

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202211106881.6A Active CN115188871B (en) 2022-09-13 2022-09-13 Microminiature LED transferring device and transferring method
CN202211384982.XA Pending CN115621397A (en) 2022-09-13 2022-09-13 Bearing frame for transferring micro LED

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202211384982.XA Pending CN115621397A (en) 2022-09-13 2022-09-13 Bearing frame for transferring micro LED

Country Status (1)

Country Link
CN (2) CN115188871B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116598236A (en) * 2023-07-19 2023-08-15 昆山鸿义精微科技有限公司 Grain sorting method and sorting system

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714905A (en) * 1993-06-25 1995-01-17 Kokusai Electric Co Ltd Vacuum treatment vessel with substrate transfer mechanism in semiconductor manufacturing device
JP2001267391A (en) * 2000-03-16 2001-09-28 Ses Co Ltd Cassette storing equipment and substrate cleaning system
JP2006114602A (en) * 2004-10-13 2006-04-27 Matsushita Electric Ind Co Ltd Component mounting apparatus
JP2009044044A (en) * 2007-08-10 2009-02-26 Juki Corp Method and apparatus for mounting electronic-component
JP2009301843A (en) * 2008-06-12 2009-12-24 Toshiba Corp Transfer device, and method for manufacturing organic electroluminescent display
KR100969531B1 (en) * 2009-12-01 2010-07-12 (주)에이에스티 Head part of led die bonder
CN101863351A (en) * 2009-04-20 2010-10-20 鸿富锦精密工业(深圳)有限公司 Substrate bearing device
US20160079199A1 (en) * 2014-09-16 2016-03-17 Seung-dae SEOK Apparatus for bonding semiconductor chips
CN108946124A (en) * 2018-08-28 2018-12-07 惠州市昇沪汽车紧固件科技有限公司 Transmission mechanism and fastener automatic producing device
CN109768129A (en) * 2019-02-01 2019-05-17 南昌大学 A kind of transfer equipment towards Micro LED chip
CN109768128A (en) * 2019-02-01 2019-05-17 南昌大学 A kind of flood tide pickup and mounting device towards Micro LED chip
CN209097498U (en) * 2018-04-02 2019-07-12 福建省速卖通电子商务有限公司 A kind of adjustable space utilization rate height and the intelligent storage rack of anti-deformation
US20190304818A1 (en) * 2018-03-30 2019-10-03 Point Engineering Co., Ltd. System for transferring micro led
WO2020103405A1 (en) * 2018-11-20 2020-05-28 昆山工研院新型平板显示技术中心有限公司 Transfer method for micro light-emitting device and transfer apparatus
US20210028047A1 (en) * 2019-07-22 2021-01-28 Samsung Display Co., Ltd. Micro device transfer apparatus and method
CN112908899A (en) * 2021-01-27 2021-06-04 深圳市卓兴半导体科技有限公司 Chip transfer method, system and equipment
CN215345284U (en) * 2021-07-14 2021-12-28 安泰德智能装备(深圳)有限公司 Paster device and LED chip mounter
KR20220081143A (en) * 2020-12-08 2022-06-15 에스케이하이닉스 주식회사 Semiconductor manufacturing equipment, method of reading position of carrier and method of attaching semiconductor die on carrier using semiconductor manufacturing equipment

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714905A (en) * 1993-06-25 1995-01-17 Kokusai Electric Co Ltd Vacuum treatment vessel with substrate transfer mechanism in semiconductor manufacturing device
JP2001267391A (en) * 2000-03-16 2001-09-28 Ses Co Ltd Cassette storing equipment and substrate cleaning system
JP2006114602A (en) * 2004-10-13 2006-04-27 Matsushita Electric Ind Co Ltd Component mounting apparatus
JP2009044044A (en) * 2007-08-10 2009-02-26 Juki Corp Method and apparatus for mounting electronic-component
JP2009301843A (en) * 2008-06-12 2009-12-24 Toshiba Corp Transfer device, and method for manufacturing organic electroluminescent display
CN101863351A (en) * 2009-04-20 2010-10-20 鸿富锦精密工业(深圳)有限公司 Substrate bearing device
KR100969531B1 (en) * 2009-12-01 2010-07-12 (주)에이에스티 Head part of led die bonder
US20160079199A1 (en) * 2014-09-16 2016-03-17 Seung-dae SEOK Apparatus for bonding semiconductor chips
US20190304818A1 (en) * 2018-03-30 2019-10-03 Point Engineering Co., Ltd. System for transferring micro led
CN209097498U (en) * 2018-04-02 2019-07-12 福建省速卖通电子商务有限公司 A kind of adjustable space utilization rate height and the intelligent storage rack of anti-deformation
CN108946124A (en) * 2018-08-28 2018-12-07 惠州市昇沪汽车紧固件科技有限公司 Transmission mechanism and fastener automatic producing device
WO2020103405A1 (en) * 2018-11-20 2020-05-28 昆山工研院新型平板显示技术中心有限公司 Transfer method for micro light-emitting device and transfer apparatus
CN109768129A (en) * 2019-02-01 2019-05-17 南昌大学 A kind of transfer equipment towards Micro LED chip
CN109768128A (en) * 2019-02-01 2019-05-17 南昌大学 A kind of flood tide pickup and mounting device towards Micro LED chip
US20210028047A1 (en) * 2019-07-22 2021-01-28 Samsung Display Co., Ltd. Micro device transfer apparatus and method
KR20220081143A (en) * 2020-12-08 2022-06-15 에스케이하이닉스 주식회사 Semiconductor manufacturing equipment, method of reading position of carrier and method of attaching semiconductor die on carrier using semiconductor manufacturing equipment
CN112908899A (en) * 2021-01-27 2021-06-04 深圳市卓兴半导体科技有限公司 Chip transfer method, system and equipment
CN215345284U (en) * 2021-07-14 2021-12-28 安泰德智能装备(深圳)有限公司 Paster device and LED chip mounter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116598236A (en) * 2023-07-19 2023-08-15 昆山鸿义精微科技有限公司 Grain sorting method and sorting system
CN116598236B (en) * 2023-07-19 2023-10-13 昆山鸿义精微科技有限公司 Grain sorting method and sorting system

Also Published As

Publication number Publication date
CN115621397A (en) 2023-01-17
CN115188871B (en) 2022-12-09

Similar Documents

Publication Publication Date Title
JP3477321B2 (en) Electronic component mounting device
JP2823481B2 (en) Electronic component automatic mounting device
CN115188871B (en) Microminiature LED transferring device and transferring method
JPH0823194A (en) Electronic part surface mounter
CN111424234A (en) Alignment module, alignment equipment, thin film deposition production line and control method
JPH11220294A (en) Electronic component transfer equipment, holder replacing method and device therefor
CN112705925A (en) Lens assembling equipment
JP2002319799A (en) Printed board holder, electronic parts mounting system, and method of manufacturing printed circuit board
KR20050092415A (en) Electronic parts mounting apparatus and electronic parts mounting method
US4029536A (en) Methods of and apparatus for mounting articles to a carrier member
JP2003273582A (en) Component mounting head for component mounting device
CN218817435U (en) Automatic change paster equipment
JPH02155244A (en) Feeder for chip
CN213624342U (en) Alignment module, alignment equipment and film deposition production line
JP3610941B2 (en) Electronic component mounting equipment
JPH01317000A (en) Electronic component packaging device
US6557247B1 (en) Component placement apparatus
JP5201483B2 (en) Electronic component mounting device
JP2011049504A (en) Device for mounting electronic component
CN220131295U (en) Clamping mechanism for IC carrier plate and IC carrier plate placing machine
CN118073486B (en) Method for transferring light-emitting element in large quantity, sucker structure and large quantity transferring system
JPH0429496B2 (en)
JP2001267797A (en) Electronic component-mounting device
CN213485526U (en) Reverse side mounting device
CN118299313B (en) Wafer loading mechanism and loading calibration method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant