CN215345284U - Paster device and LED chip mounter - Google Patents

Abstract

The utility model provides a chip mounting device and an LED chip mounter, wherein the chip mounting device comprises at least one group of material carrying assemblies for carrying LED chips and material moving assemblies for moving the LED chips on the material carrying assemblies to an LED lamp panel; the material moving assembly comprises a first support, a material sucking assembly and a first driving assembly, wherein the material sucking assembly comprises a base, a plurality of circular suction nozzles and a chip guide jig; the material loading assembly comprises a material loading plate for loading a plurality of LED chips. According to the chip mounting device provided by the utility model, the circular suction nozzle is adopted to replace the traditional square suction nozzle, and the chip guide jig is matched with the circular suction nozzle for use, so that the rotation problem of the circular suction nozzle during blanking is effectively controlled, the product cost and the service life of the suction nozzle in the chip mounting device can be greatly improved, the chip mounting precision of an LED chip can be further improved, and the yield of an LED lamp panel is ensured. The utility model also provides an LED chip mounter which comprises the chip mounting device.

Description

Paster device and LED chip mounter

Technical Field

The utility model relates to the technical field of LED product automatic processing equipment, in particular to a chip mounting device and an LED chip mounter.

Background

The LED chip mounter belongs to an SMT chip mounter, and is gradually refined into automatic chip mounting equipment which more accords with the characteristics of LED products along with the continuous development of LED technologies. The LED chip mounter mainly utilizes various automatic devices to mount an LED chip on a printed circuit board at high speed and high efficiency. With the size of the LED chips being gradually reduced, the number of the LED chips that can be accommodated on a single PCB is increased, the arrangement density of the LED chips on the PCB is also increased, and the requirement for the mounting speed required by the LED chip mounter is also increased. A chip mounting device in the LED chip mounter needs to transfer a plurality of LED chips which are transferred to a material loading plate on a chip mounting feeding platform to an LED lamp panel for chip mounting after uniform and one-time grabbing.

The chip mounting device used in the existing LED chip mounter adopts a vacuum adsorption mode to complete the loading and unloading operation of an LED chip. And the special square suction nozzle needs to be matched in the chip mounting device, so that the LED chips on the material carrying plate are uniformly adsorbed to the LED circuit board to complete the chip mounting process. However, the suction nozzle in the conventional chip mounting device is limited by the rectangular structure of the LED chip, and in order to meet the requirement of keeping uniform and aligned arrangement of the rectangular arrangement of the LED chip during chip mounting, the suction nozzle must be matched with the square suction nozzle, so that the suction nozzle cannot rotate when the LED chip is adsorbed by the suction nozzle during loading and the LED chip is placed by the suction nozzle during unloading.

In a traditional LED chip mounter, square suction nozzles used on the chip mounter are special parts, and each suction nozzle needs to be processed independently. The square suction nozzle has a structure which needs to pay more attention on the processing difficulty and the processing cost compared with a round suction nozzle of a universal part. Moreover, the square nozzle can only be made of common stainless steel materials which are convenient to machine, just because the square nozzle needs machining. Under the long-time high strength paster operation, the life of square suction nozzle is short. And in order to ensure the stability and consistency of the patches on the LED chips in each row, the square suction nozzle needs to be replaced regularly, which results in high post-maintenance cost. Therefore, the square suction nozzle in the existing chip mounting device is not beneficial to the chip mounting requirement of the existing large-batch micro LED chips.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of high processing difficulty and processing cost of a square suction nozzle used on a chip mounting device in the conventional LED chip mounter, short service life and high later maintenance cost under long-time high-strength chip mounting operation, and provides the chip mounting device.

The technical scheme adopted by the utility model for solving the technical problems is as follows: a chip mounting device comprises at least one group of material loading assemblies for loading LED chips and material moving assemblies for moving the LED chips on the material loading assemblies to an LED lamp panel; the material moving assembly comprises a first support, a material sucking assembly arranged on the first support and a first driving assembly fixed on the first support and used for driving the material sucking assembly to move, and the material sucking assembly comprises a base, a plurality of circular suction nozzles fixed below the base and a chip guide jig fixed on the base and positioned below the circular suction nozzles; the material loading assembly comprises a material loading plate for bearing a plurality of LED chips.

Further, the chip guide jig of the material moving assembly is an L-shaped substrate fixed on the base, the chip guide jig comprises a vertical connecting plate connected with the base and a horizontal guide plate extending from the vertical connecting plate to a plurality of positions below the circular suction nozzles, a plurality of guide holes for the circular suction nozzles to pass through are formed in the horizontal guide plate, and the guide holes are in one-to-one correspondence with the circular suction nozzles.

Further, the guiding hole on the chip guiding jig comprises a first guiding section extending downwards from the upper surface of the horizontal guiding plate and a second guiding section extending downwards from the first guiding section to the lower surface of the horizontal guiding plate, the cross sections of the first guiding section and the second guiding section are both rectangular structures, the cross section area of the first guiding section is gradually reduced from top to bottom, and the cross section area of the second guiding section is unchanged from top to bottom.

Furthermore, the circular suction nozzle comprises an upper cylindrical section fixedly connected with the base and a lower cylindrical section communicated with the upper cylindrical section, and a vacuum channel penetrating through the upper cylindrical section and the lower cylindrical section is arranged in the circular suction nozzle.

Specifically, the cross-sectional area of the lower cylindrical section of the circular suction nozzle is smaller than that of the upper cylindrical section, and the lower cylindrical section can adsorb the LED chip and penetrate through the guide hole of the chip guide jig.

Further, the first driving assembly of the material moving assembly comprises a horizontal driving assembly fixed on the first support and a vertical driving assembly fixed on the horizontal driving assembly, and the base is fixed on the vertical driving assembly.

Furthermore, the material loading assembly further comprises a second support and a second driving assembly arranged on the second support and used for driving the material loading plate to horizontally move, and the material loading plate is fixed on a second sliding block of the second driving assembly through a connecting piece.

Specifically, the material loading assembly further comprises a material loading pipe fixed on the second support, a plurality of gaps for placing the LED chips are formed in the material loading plate, and the material loading pipe and the material loading plate are perpendicular to each other and can be communicated with the gaps.

Specifically, the material loading assembly further comprises a rear limiting plate fixed on one side, away from the feeding pipe, of the material loading plate and a front limiting plate fixed on the second support and located on the side face of the feeding pipe.

The paster device provided by the utility model has the beneficial effects that: this paster device has adopted circular suction nozzle to replace traditional square suction nozzle, circular suction nozzle can choose for use comparatively common general parts as the replacement, and choose for use the longer more durable tungsten steel material suction nozzle of life to use as the suction nozzle that adsorbs the LED chip, and be provided with chip direction tool and circular suction nozzle cooperation and use, thereby the rotatory problem of effective control circular suction nozzle when the unloading, can accomplish the unloading operation of LED chip according to the unloading direction and the unloading position that set up on the chip direction tool when guaranteeing LED chip paster, thereby the product cost of suction nozzle among the improvement paster device that both can be by a wide margin, and long service life, reduce the later maintenance cost of paster device, can also further improve the paster precision of LED chip, guarantee the yield of LED lamp plate.

The utility model also provides an LED chip mounter which comprises the chip mounting device.

The LED chip mounter provided by the utility model has the beneficial effects that: the LED chip mounter has the advantages that the suction nozzle in the LED chip mounter is optimized and matched with the blanking guide piece for use, the processing cost of the chip mounter is reduced, the service life of the suction nozzle in the chip mounter is prolonged, and meanwhile the consistency of the blanking position and the blanking posture of the chip mounter for LED chips in chip mounting can be guaranteed.

Drawings

FIG. 1 is a front view of a patch device provided by the present invention;

FIG. 2 is a schematic perspective view of a suction assembly of a chip mounter according to the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

FIG. 4 is a full cross-sectional view of a circular nozzle of a chip mounting device provided by the present invention;

FIG. 5 is a front view of a chip guiding jig in a chip mounter according to the present invention;

FIG. 6 is a cross-sectional view taken at B-B of FIG. 5;

FIG. 7 is an enlarged view of a portion of FIG. 6 at C;

FIG. 8 is a schematic perspective view of a carrier assembly of a chip mounter according to the present invention;

FIG. 9 is a schematic perspective view of a connecting member, a material carrying plate and a rear limiting plate of the chip mounting device according to the present invention;

fig. 10 is a front view of a material carrying plate and a rear limiting plate in a chip mounting device provided by the present invention;

fig. 11 is a partial enlarged view at D in fig. 10.

In the figure: 100-a patch device; 10-material moving component, 11-first bracket, 12-material sucking component, 121-base, 122-circular suction nozzle, 1221-upper cylindrical segment, 1222-lower cylindrical segment, 1223-vacuum channel, 123-chip guide jig, 1231-vertical connecting plate, 1231 a-positioning groove, 1231 b-first connecting hole, 1232-horizontal guiding plate, 1233-guiding hole, 1233 a-first guiding segment, 1233 b-second guiding segment, 13-first driving component, 131-horizontal driving component, 132-vertical driving component; 20-material loading component, 21-second bracket, 22-second driving component, 221-second sliding block, 222-connecting piece, 2221-first mounting hole, 2222-second mounting hole, 23-material loading plate, 231-notch, 2311-left side of notch, 2312-right side of notch, 24-rear limiting plate, 241-abutting surface, 242-light transmission hole, 25-front limiting plate, 251-rear side of front limiting plate, 252-connecting plate and 26-feeding pipe.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

Referring to fig. 1 to 11, in order to provide a chip mounting device 100 according to the present invention, the chip mounting device 100 is disposed in an LED chip mounter, and can be applied to various types of LED chips 90 for use, so as to perform a chip mounting operation on the LED chips 90. No matter the size of the LED chip 90, the uniform and consistent arrangement and pasting requirements can be realized, and the accuracy of the LED chip 90 during pasting is ensured.

Further, as shown in fig. 1, there is provided a front view of a patch device 100 according to the present invention. The utility model provides a chip mounting device 100 which comprises at least one group of material loading assemblies 20 for loading LED chips 90 and a material moving assembly 10 for moving a plurality of LED chips 90 on the material loading assemblies 20 to an LED lamp panel. In this embodiment, the placement device 100 is provided with a set of material moving assemblies 10 and two sets of material loading assemblies 20. The material moving assemblies 10 in the same group can simultaneously act on the two groups of material loading assemblies 20, so as to respectively perform the chip transferring operation of the LED chips 90 for the two groups of material loading assemblies 20. When the first group of the carrier assemblies 20 on the left side is loaded, the LED chips 90 are transferred for the second group of the carrier assemblies 20 on the right side. After the loading of the first group of loading assemblies 20 on the left side is completed, the LED chips 90 are transferred to the first group of loading assemblies 20 on the left side, and at the same time, the second group of loading assemblies 20 on the right side are loaded. Two sets of year material subassembly 20 and a set of material subassembly 10 that moves mutually support, and the paster operation of reciprocating cycle like this can very big improvement move the material loading speed and the material loading efficiency of material subassembly 10, accords with the user demand of current LED chip mounter, and the high efficiency as much as possible provides continuous paster operation.

Further, as shown in fig. 1, the material moving assembly 10 provided by the present invention includes a first support 11, a material sucking assembly 12 disposed on the first support 11, and a first driving assembly 13 fixed on the first support 11 for driving the material sucking assembly 12 to move. The material moving assembly 10 is mainly used for synchronously transferring a plurality of LED chips 90 placed on the material loading assembly 20 to an LED lamp panel for chip mounting at one time. Therefore, the first support 11 on the material moving assembly 10 must span the station where the material loading assembly 20 and the LED lamp panel are located, so that the first driving assembly 13 drives the material sucking assembly 12 to move back and forth between the material loading assembly 20 and the LED lamp panel. As shown in fig. 1, in the embodiment, two sets of material loading assemblies 20 are simultaneously disposed, and the LED lamp panel is located between the two sets of material loading assemblies 20 (not shown in the figure), so that the two sets of material loading assemblies 20 are symmetrically disposed along the center, and the material moving assembly 10 can simultaneously serve the two sets of material loading assemblies 20. After the loading of the plurality of LED chips 90 on the first group of left material loading assembly 20 is completed, the LED chips 90 are unloaded by moving the material moving assembly 10 from left to right and moving the leftmost end of the first support 11 to the center of the first support 11 (right above the LED lamp panel). After the loading of the plurality of LED chips 90 on the second group of the material loading assembly 20 on the right side is completed, the material moving assembly 10 moves from right to left, and the discharging of the LED chips 90 is completed by moving the rightmost end of the first support 11 to the center of the first support 11 (right above the LED lamp panel). The first driving assembly 13 is disposed on the first support 11 and extends along the disposition direction of the first support 11, so that the first driving assembly 13 can drive the suction assembly 12 to move freely in the region where the first support 11 is disposed.

Further, as shown in fig. 1, the first driving assembly 13 of the material moving assembly 10 in the sheet device 100 provided by the present invention includes a horizontal driving assembly 131 fixed on the first support 11 and a vertical driving assembly 132 fixed on the horizontal driving assembly 131, and the base 121 is fixed on the vertical driving assembly 132. The first driving assembly 13 is used for driving the suction assembly 12 on the first support 11 to move horizontally and vertically. And the vertical driving assembly 132 is fixed on the horizontal driving assembly 131, so that the vertical driving assembly 132 can perform reciprocating movement in the horizontal direction as the horizontal driving assembly 131 is driven. The suction assembly 12 is fixed to the vertical driving assembly 132, and the vertical driving assembly 132 can simultaneously drive the suction assembly 12 to move up and down in the vertical direction. For example, when the suction assembly 12 needs to suck the first group of carrier assemblies 20 located on the left side, the vertical driving assembly 132 may drive the suction assembly 12 to move vertically downward to the carrier plate 23 of the carrier assembly 20, so that the suction assembly 12 may better contact and suck the LED chip 90, and then the horizontal driving assembly 131 drives the suction assembly 12 to move leftward to the carrier plate 23 of the carrier assembly 20 for sucking. After the material sucking component 12 finishes sucking, the horizontal driving component 131 drives the sucking component 12 to horizontally move to the upper side of the LED lamp panel. And then the vertical driving component 132 drives the material sucking component 12 to move downwards to the LED lamp panel, the material sucking component 12 stops adsorbing the LED chip 90, and the LED chip 90 is attached to the LED lamp panel. So, use through mutually supporting of horizontal drive assembly 131 and vertical drive assembly 132 of first drive assembly 13, realized inhaling horizontal migration and the vertical lift process of material subassembly 12 on first support 11 to the transfer process of LED chip 90 by year material subassembly 20 to LED lamp plate department has been accomplished. And the second group of carrier assemblies 20 on the right side also repeatedly operate as described above to transfer the LED chips 90. In this embodiment, the horizontal driving assembly 131 and the vertical driving assembly 132 in the first driving assembly 13 are driving components formed by matching and assembling a driving motor and a lead screw guide rail assembly, wherein the vertical driving assembly 132 is fixed on a sliding block of the lead screw guide rail assembly of the horizontal driving assembly 131, and the material sucking assembly 12 is fixed on a sliding block of the lead screw guide rail assembly of the vertical driving assembly 132, so that synchronous driving is realized.

Further, as shown in fig. 2, there is a schematic perspective view of the suction assembly 12 and the vertical driving assembly 132 in the material moving assembly 10 of the chip device 100 according to the present invention. The material sucking assembly 12 in the material moving assembly 10 is mainly used for synchronously feeding and discharging a plurality of LED chips 90 on the material loading assembly 20. As shown in fig. 2, the suction assembly 12 includes a base 121, a plurality of circular suction nozzles 122 fixed below the base 121, and a chip guide jig 123 fixed on the base 121 and located below the circular suction nozzles 122. The base 121 of the suction assembly 12 is fixed on the vertical driving assembly 132 of the first driving assembly 13, and is driven by the vertical driving assembly 132 to vertically lift. A row of circular suction nozzles 122 arranged in parallel are arranged below the base 121, and the circular suction nozzles 122 are used for sucking the LED chips 90. The number of the circular suction nozzles 122 is consistent with the number of the required attached LED chips 90 in a row on the LED lamp panel, so that the attachment of each row of the LED chips 90 on the LED lamp panel can be completed by the transfer of the LED chips 90 of the suction assembly 12 every time.

Specifically, as shown in fig. 3, a chip guide jig 123 is fixed below the base 121, and the chip guide jig 123 is fixed on the base 121 and located below the circular suction nozzle 122. When the suction assembly 12 moves downward to suck the LED chip 90 on the carrier assembly 20, the chip guide jig 123 is inserted below the carrier plate 23 of the carrier assembly 20 along with the horizontal movement of the suction assembly 12. This chip direction tool 123 acts on when inhaling material subassembly 12 and remove to LED lamp plate top. When the plurality of circular suction nozzles 122 on the suction assembly 12 adsorb the LED chips 90 and move to the upper side of the LED lamp panel. The circular suction nozzle 122 may rotate slightly during the suction process due to the contact between the circular suction nozzle 122 and the LED chip 90. Therefore, when the circular suction nozzle 122 drives the LED chip 90 to move above the LED lamp panel, the vertical driving assembly 132 drives the adsorption assembly 12 to move downward, and the distance between the bottom surface of the chip guide jig 123 located below the base 121 and the LED lamp panel is smaller than the height of the LED chip 90. At this time, the circular suction nozzle 122 moves downward again, and the bottom of the LED chip 90 and the bottom of the circular suction nozzle 122 pass through the chip guide jig 123, so that the chip guide jig 123 is used to realize the guide correction of the torsion of the circular suction nozzle 122, and the arrangement consistency and stability of the LED chip 90 loaded and unloaded by the circular suction nozzle 122 are ensured.

Further, as shown in fig. 8, a perspective view of the loading assembly 20 in the chip device 20 according to the present invention is shown. The carrier assembly 20 includes a carrier plate 23 for carrying a plurality of LED chips 90. The material loading component 20 is used for containing the LED chips 90 which are conveyed from the surface mounting and feeding platform of the LED chip mounter and are subjected to sequencing detection, and each detected LED chip 90 enters the material loading plate 23 in sequence at one time. The number of the LED chips 90 that can be placed on the material loading plate 23 at one time is determined by the number of the LED chips 90 in one row on the LED lamp panel.

Further, as shown in fig. 3 and 4, the suction nozzles in the row disposed on the base 121 of the suction assembly 12 are all circular suction nozzles 122. The circular suction nozzle 122 is shown in cross-section in FIG. 4. The circular suction nozzle 122 comprises an upper cylindrical section 1221 fixedly connected with the base 121 and a lower cylindrical section 1222 communicated with the upper cylindrical section 1221, and a vacuum passage 1223 penetrating through the upper cylindrical section 1221 and the lower cylindrical section 1222 is arranged inside the circular suction nozzle 122. The circular suction nozzle 122 provided by the utility model is a universal suction nozzle with a circular structure in section and two sections, the suction nozzle made of tungsten steel can be purchased through conventional parts, and the circular suction nozzle 122 made of tungsten steel is arranged on the base 121 for use, so that the use cost and later maintenance cost of the suction nozzle can be greatly reduced, the service life of the suction nozzle on the material suction assembly 12 can be prolonged, and the purposes of reducing the cost and prolonging the service life are achieved. The circular suction nozzle 122 is divided into an upper and a lower two-segment structure, which is more beneficial for the circular suction nozzle 122 to cooperate with the chip guide jig 123, so that the lower cylindrical segment 1222 of the circular suction nozzle 122 can be inserted into the chip guide jig 123 to guide and correct the LED chip 90 adsorbed by the circular suction nozzle.

Further, as shown in fig. 5, it is a front view of a chip guiding jig 123 in the chip mounter 100 provided by the present invention. Fig. 6 is a cross-sectional view of the chip guide jig 123 of the chip mounter 100 according to the present invention at the guide hole 1233. As shown in fig. 7, a partial enlarged view of the chip guide jig 123 of the chip mounter 100 according to the present invention is shown at the guide hole 1233. In this embodiment, the chip guiding jig 123 of the material moving assembly 10 in the chip mounter 100 is an L-shaped substrate fixed on the base 121, and the chip guiding jig 123 can be inserted below the material carrying plate 23 of the material carrying assembly 20 when the material sucking assembly 12 sucks the LED chip 90, so as to avoid affecting the material sucking process of the circular suction nozzle 122. When the blowing, laminate to LED lamp plate top almost, when circular suction nozzle 122's unloading, the lower cylinder section 1222 of circular suction nozzle 122 takes LED chip 90 to pass this chip direction tool 123 back, with LED chip 90 attached to the LED lamp plate.

Specifically, as shown in fig. 5 and 6, the chip guide jig 123 includes a vertical connection plate 1231 connected to the base 121 and a horizontal guide plate 1232 extending from the vertical connection plate 1231 to below the plurality of circular suction nozzles 122. Wherein, a pair of positioning grooves 1231a are disposed on the vertical connecting plate 1231, and the chip guiding jig 123 realizes the relative pre-positioning with the base 121 through the pair of positioning grooves 1231 a. And three first connection holes 1231b are further provided on the vertical connection plate 1231, and the whole chip guide jig 123 is fixedly connected to the bottom of the base 121 through the three first connection holes 1231 b. The chip guiding jig 123 is fixed to the bottom of the base 121 of the suction assembly 12, wherein the horizontal guiding plate 1232 on the chip guiding jig 123 is located below all the circular suction nozzles 122, so as to guide and correct the blanking of the LED chips 90 adsorbed on the circular suction nozzles 122. The horizontal guide plate 1232 is provided with a plurality of guide holes 1233 for the circular suction nozzles 122 to pass through, and the guide holes 1233 are arranged corresponding to the circular suction nozzles 122 one to one. As shown in fig. 3, a plurality of guiding holes 1233 are arranged on the horizontal guiding plate 1232 at intervals and penetrate through the horizontal guiding plate 1232 from top to bottom, and a circular suction nozzle 122 is correspondingly arranged above each guiding hole 1233. The bottom of each circular suction nozzle 122 is adsorbed with an LED chip 90, and during blanking, the circular suction nozzle 122 carries the LED chip 90 to move downwards and pass through the guiding hole 1233 to be attached to the LED lamp panel.

Specifically, as shown in fig. 3 and 4, the cross-sectional area of the lower cylindrical section 1222 of the circular suction nozzle 122 is smaller than that of the upper cylindrical section 1221, and the cross-sectional area of the lower cylindrical section 1222 is also smaller than that of the guide holes 1233 of the chip guide jig 123, so that the lower cylindrical section 1222 of the circular suction nozzle 122 can suck the LED chip 90 through the guide holes 1233 of the chip guide jig 123.

Further, as shown in fig. 6, the guiding hole 1233 disposed on the chip guiding jig 123 includes a first guiding section 1233a extending downward from the upper surface of the horizontal guiding plate 1232 and a second guiding section 1233b extending downward from the first guiding section 1233a to the lower surface of the horizontal guiding plate 1232, both the cross sections of the first guiding section 1233a and the second guiding section 1233b are rectangular structures, the cross section area of the first guiding section 1233a is gradually reduced from top to bottom, and the cross section area of the second guiding section 1233b is unchanged from top to bottom. The guide hole 1233 of the chip guide jig 123 not only can play a role in correcting the horizontal rotation direction of the LED chips 90 during mounting, but also can correct the blanking interval, the blanking position and the blanking direction of each LED chip 90. When each LED chip 90 is discharged from the circular suction nozzle 122, the LED chips are corrected by the guide holes 1233 and then attached to the LED lamp panel, and the discharging accuracy of the tiny LED chips 90 can be greatly improved through the guide holes 1233. The first guiding section 1233a of the guiding hole 1233 has a trumpet-shaped structure, and the guiding slope formed by the trumpet-shaped structure can guide the LED chip 90 to the second guiding section 1233 b. The cross-sectional area of the second guiding portion 1233b is slightly larger than that of the LED chip 90, so as to ensure that the LED chip 90 can smoothly pass through the guiding hole 1233. And the interval and the size that all guiding holes 1233 on this horizontal guiding plate 1232 set up have decided the interval that LED chip 90 placed on the LED lamp plate and the accuracy nature of position. The chip mounter 100 provided by the present invention controls the blanking precision of the suction assembly 12 through the chip guide jig 123.

Further, as shown in fig. 7, a perspective view of the material loading assembly 20 in the patch device 100 provided by the present invention is shown. The material loading component 20 is in butt joint with a surface mounting material feeding platform in the LED chip mounter, so that after a discharging pipe on the surface mounting material feeding platform is communicated with the material loading component 20, the LED chips 90 which are subjected to sequencing detection can be conveyed to the material loading component 20 one by one, and the automatic material loading process of the material loading component 20 is completed. The material loading assembly 20 further comprises a second bracket 21 and a second driving assembly 22 arranged on the second bracket 21 and used for driving the material loading plate 23 to move horizontally, and the material loading plate 23 is fixed on a second sliding block 221 of the second driving assembly 22 through a connecting piece. The loading plate 23 is disposed on the second slider 221 of the second driving assembly 22, so that the loading plate 23 can be driven by the second driving assembly 22 to move horizontally along the disposing direction of the second bracket 21.

Specifically, as shown in fig. 7, the loading assembly 20 further includes a feeding pipe 26 fixed to the second bracket 21. The feeding pipe 26 is arranged on the second support 21, one end of the feeding pipe 26 is fixedly connected with a surface mounting feeding platform of the LED surface mounting machine, and the other end of the feeding pipe 26 is in butt joint with the material carrying plate 23, so that the feeding function of holding the LED chip 90 on the surface mounting feeding platform is achieved, and the LED chip 90 on the surface mounting feeding platform is fed onto the material carrying plate 23. Specifically, as shown in fig. 9, 10 and 11, a plurality of notches 231 for placing the LED chips 90 are disposed on the material-carrying plate 23, and each notch 231 is formed with a space for placing the LED chip 90. The feeding tube 26 and the loading plate 23 are perpendicular to each other and can be communicated with the gap 231, that is, after the feeding tube 26 is communicated with the gap 231, the LED chips 90 can be fed into the spaces formed by the gap 231 one by one through the feeding tube 26. The material loading plate 23 is used in cooperation with the second driving assembly 22, so that all the gaps 231 on the material loading plate 23 are filled with the LED chips 90. After one LED chip 90 is fed from the feeding tube 26 into the notch 231 of the material carrying plate 23, the material carrying plate 23 moves one grid, and a second LED chip 90 is fed onto the material carrying plate 23 on the patch feeding platform until all the notches 231 on the material carrying plate 23 are filled with the LED chips 90, and then all the LED chips 90 on the material carrying plate 23 are moved once by the material moving assembly 10.

Specifically, as shown in fig. 9, a perspective structure diagram is provided in which the material-carrying plate 23 and the rear limiting plate 24 of the material-carrying assembly 20 provided by the present invention are fixed together. Fig. 10 is a front view of the loading plate 23 and the rear limiting plate 24 of the loading assembly 20 provided by the present invention. Fig. 11 is a partially enlarged view of the material loading plate 23 of the material loading assembly 20 according to the present invention at the notch 231. As shown in fig. 11, it can be clearly seen that the notch 231 provided on the material loading plate 23 is a groove provided downward from the top surface of the material loading plate 23, the groove is penetrated at both the front side surface and the rear side surface of the material loading plate 23, the notch 231 only forms a bottom surface 2313 on which the LED chip 90 can be placed on the material loading plate 23, a left side surface 2311 and a right side surface 2312 of the LED chip 90 in the horizontal left-right direction are provided, and the LED chip 90 has no effective limit in the horizontal front-rear direction of the material loading plate 23. Therefore, in order to enable the carrier plate 23 to communicate with the feeding pipe 26, the front side of the carrier plate 23 is abutted against the feeding pipe 26, and the front through hole of the notch 231 communicates with the feeding pipe 26. For the convenience of processing the material loading plate 23, a rear limiting plate 24 is disposed at the rear side of the material loading plate 23 to limit the LED chip 90 to be horizontally limited in the front-rear direction and the rear side on the notch 231 of the material loading plate 23.

Specifically, as shown in fig. 9, the material loading assembly 20 further includes a rear limiting plate 24 fixed to a side of the material loading plate 23 away from the feeding pipe 26. The rear limiting plate 24 and the bronze drum locking piece of the loading plate 23 are fixed on the connecting piece 222 and are fixed on the second sliding block 221 of the second driving assembly 22 through the connecting piece 222. The connecting member 222 is provided with a first mounting hole 2221 for fixing the material-carrying plate 23 and the rear retainer plate 24, and the material-carrying plate 23 and the rear retainer plate 24 can be integrally connected to the connecting member 222 by a fastening member and fixed thereto. Meanwhile, the connecting member 222 is further provided with a second mounting hole 2222 for fixedly connecting with the second driving assembly 22, so that the loading plate 23 and the rear limiting plate 24 can horizontally move on the second bracket 21 along with the driving of the second driving assembly 22.

Specifically, as shown in fig. 11, the rear limiting plate 24 is disposed on a side surface of the carrier plate 23 away from the feeding pipe 26, i.e., a rear side of the carrier plate 23, for limiting a relative position of the LED chip 90 on the rear side of the notch 231 of the carrier plate 23 in front of and behind the horizontal. Therefore, the front surface of the rear stopper 24 forms a contact surface 241 that can contact the LED chip 90 at the notch 231 of the carrier plate 23, and the LED chip 90 is stopped by the contact surface 241. As shown in fig. 8, the loading assembly 20 is provided with an optical detection device 27 at a station where the feeding pipe 26 communicates with the loading plate 23, and the optical detection device 27 determines whether loading of the LED chip 90 has been completed at the notch 231 of the loading plate 23 at the station. In order to ensure that light on the optical detection device 27 can pass through the gap 231 and then pass through the rear limiting plate 24, a plurality of light holes 242 arranged at intervals are further arranged on the rear limiting plate 24, and when the LED chip 90 is not arranged on the gap 231 of the material loading plate 23, the light holes 242 can be used for the optical detection device 27 to pass through, so that the normal use of the optical detection device 27 is ensured.

Further, as shown in fig. 8, in the chip mounter 100 according to the present invention, the notch 231 of the loading plate 23 in the loading assembly 20 is located at the front side in the horizontal front-back direction, and after the loading of the LED chip 90 is completed, the rear side of the notch 231 is controlled by the rear limiting plate 24, so as to limit the LED chip 90 to relatively move backward in the notch 231. The front side of the gap 231 limits the forward relative movement of the LED chip 90 in the gap 231 by the front limiting plate 25 fixed on the second bracket 21 and located at the side of the feeding tube 26. After the feeding tube 26 inputs the LED chip 90 to the notch 231, the material loading plate 23 is driven by the second driving assembly 22 to move toward the side having the front limiting plate 25. And the front stopper plate 25 is directly fixed to the second bracket 21 by the connection plate 252. The front stopper plate 25 seals the front side of the notch 231 of the carrier plate 23 by its rear side 251 contacting the front side of the carrier plate 23, thereby defining a distance by which the LED chip 90 moves forward in the horizontal front-rear direction within the notch 231. The front and rear limiting plates 25 and 24 respectively limit the front and rear directions of the notch 231 from the front and rear sides of the loading plate 23.

The material carrying plate 23, the front limiting plate 25 and the rear limiting plate 24 in the material carrying assembly 20 provided by the utility model are all three plates, the manufacturing of the carrying space of the LED chip 90 can be realized by processing the front and rear through grooves on the material carrying plate 23, and the limiting of the positions of the LED chip 90 in three directions is realized by the way that the material carrying plate 23 and the rear limiting plate 24 are mutually fixed and matched. The material loading plate 23 is convenient to process, simple in processing technology, low in processing cost and easy to realize, different notches 231 can be replaced according to the sizes of different LED chips 90, and different LED chips 90 can be processed, so that the universality is high.

According to the chip mounting device 100 provided by the utility model, the circular suction nozzle 122 is adopted to replace a traditional square suction nozzle, the circular suction nozzle 122 can be replaced by a common universal part, a tungsten steel suction nozzle with longer service life and more durability is selected to be used as a suction nozzle for adsorbing the LED chip 90, and the chip guide jig 123 is arranged to be matched with the circular suction nozzle 122 for use, so that the rotation problem of the circular suction nozzle 122 during blanking is effectively controlled, the blanking operation of the LED chip 90 can be completed according to the blanking direction and the blanking position arranged on the chip guide jig 123 during chip mounting of the LED chip 90, the product cost and the service life of the suction nozzle in the chip mounting device 100 can be greatly improved, the later maintenance cost of the chip mounting device 100 is reduced, the chip mounting precision of the LED chip 90 can be further improved, and the yield of an LED lamp panel is ensured.

The utility model also provides an LED chip mounter which comprises the chip mounting device 100.

The LED chip mounter provided by the utility model is provided with the chip mounting device 100, so that the suction nozzle in the LED chip mounter is optimized and matched with the blanking guide piece for use, the processing cost of the chip mounting device 100 is reduced, the service life of the suction nozzle in the chip mounting device 100 is prolonged, and meanwhile, the consistency of the blanking position and the blanking posture of the chip mounting device 100 in the process of mounting the LED chip 90 can be ensured.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A chip mounting device is characterized by comprising at least one group of material loading assemblies for loading LED chips and a material moving assembly for moving the LED chips on the material loading assemblies to an LED lamp panel; the material moving assembly comprises a first support, a material sucking assembly arranged on the first support and a first driving assembly fixed on the first support and used for driving the material sucking assembly to move, and the material sucking assembly comprises a base, a plurality of circular suction nozzles fixed below the base and a chip guide jig fixed on the base and positioned below the circular suction nozzles; the material loading assembly comprises a material loading plate for bearing a plurality of LED chips.

2. The chip mounting device according to claim 1, wherein the chip guide jig of the material moving assembly is an L-shaped substrate fixed on the base, the chip guide jig comprises a vertical connecting plate connected with the base and a horizontal guide plate extending from the vertical connecting plate to a position below the circular suction nozzles, the horizontal guide plate is provided with a plurality of guide holes for the circular suction nozzles to pass through, and the guide holes are arranged in one-to-one correspondence with the circular suction nozzles.

3. The chip mounting apparatus according to claim 2, wherein the guiding hole of the chip guiding jig includes a first guiding section extending downward from the upper surface of the horizontal guiding plate and a second guiding section extending downward from the first guiding section to the lower surface of the horizontal guiding plate, the first guiding section and the second guiding section are both rectangular in cross section, the cross-sectional area of the first guiding section is gradually reduced from top to bottom, and the cross-sectional area of the second guiding section is unchanged from top to bottom.

4. A patch device as claimed in claim 2, wherein said circular nozzle includes an upper cylindrical section fixedly connected to said base and a lower cylindrical section communicating with said upper cylindrical section, and wherein a vacuum passage is provided through said upper cylindrical section and said lower cylindrical section.

5. The chip mounting device according to claim 4, wherein a cross-sectional area of a lower cylindrical section of the circular suction nozzle is smaller than a cross-sectional area of the upper cylindrical section, and the lower cylindrical section can suck the LED chip to pass through the guide hole of the chip guide jig.

6. A die attachment device as recited in claim 1, wherein the first drive assembly of the transfer assembly includes a horizontal drive assembly secured to the first frame and a vertical drive assembly secured to the horizontal drive assembly, the base being secured to the vertical drive assembly.

7. A patch device as claimed in claim 1, wherein said loading assembly further comprises a second frame and a second driving assembly disposed on said second frame for driving said loading plate to move horizontally, said loading plate being fixed to a second slide block of said second driving assembly by a connecting member.

8. A patch device as claimed in claim 7, wherein the carrier further comprises a feeding tube fixed to the second frame, the carrier has a plurality of notches for receiving the LED chips, and the feeding tube is perpendicular to the carrier and communicates with the notches.

9. A patch device as claimed in claim 8, wherein the carrier assembly further comprises a rear retainer plate secured to a side of the carrier plate remote from the feed tube and a front retainer plate secured to the second frame to a side of the feed tube.

10. An LED placement machine, comprising the placement device according to any one of claims 1 to 9.

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