CN115709142A - Semiconductor mounting machine - Google Patents
Semiconductor mounting machine Download PDFInfo
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- CN115709142A CN115709142A CN202210381872.1A CN202210381872A CN115709142A CN 115709142 A CN115709142 A CN 115709142A CN 202210381872 A CN202210381872 A CN 202210381872A CN 115709142 A CN115709142 A CN 115709142A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a semiconductor mounter which comprises a workbench and an annular flexible transmission rail for transferring a frame from one station to another station, wherein the annular flexible transmission rail is provided with a first station for feeding the frame, a second station for brushing glue on the frame, a third station for mounting a chip on the frame, a fourth station for dispensing the mounted chip, a fifth station for mounting a jumper wire and a sixth station for transferring the frame to a semiconductor sintering furnace, which are sequentially arranged in a surrounding manner. The invention has the advantages that the stations are closely connected, the number of the stations is reduced, the size of equipment is greatly reduced, the space occupied by the equipment is greatly reduced, and the production cost is saved.
Description
Technical Field
The present invention relates to a mounter, and more particularly, to a semiconductor mounter.
Background
The semiconductor has the characteristics of small volume, convenient use and the like, and is widely applied to household appliances and industrial electronic circuits. The existing semiconductor mounting machine mainly adopts a linear assembly line, has more stations, has larger overall size of the equipment and needs to occupy larger space.
Disclosure of Invention
In order to solve the problems in the prior art, the present invention provides a semiconductor mounter.
The invention provides a semiconductor mounter, which comprises a workbench and an annular flexible transmission rail for transferring a frame from one station to another station, wherein the annular flexible transmission rail is provided with a first station for feeding the frame, a second station for brushing glue on the frame, a third station for mounting a chip on the frame, a fourth station for dispensing the mounted chip, a fifth station for carrying out jumper wire mounting and a sixth station for transferring the frame to a semiconductor sintering furnace, which are sequentially arranged in a surrounding manner, the semiconductor mounter also comprises a frame feeding mechanical arm, a feeding platform, a flexible glue brushing device, a glue brushing detection mechanism, a chip mounting device, an automatic glue dispensing mechanism, a glue dispensing detection mechanism, a jumper wire bonding mechanism, a jumper wire feeding platform and a furnace feeding mechanical arm, the frame feeding mechanical arm and the feeding platform are respectively arranged on the workbench and positioned at the first station, the feeding platform is arranged in a frame for temporarily storing the to-be-pasted glue, the frame feeding mechanical arm is used for transferring the frame from the feeding platform to the first station of the annular flexible transmission track, the flexible glue brushing device is arranged on the workbench and positioned at the second station, the flexible glue brushing device is used for brushing the glue on the frame at the second station, the glue brushing detection mechanism is arranged on the workbench and positioned between the second station and the third station, the glue brushing detection mechanism is used for shooting the gluing area of the frame after passing gluing without stopping the frame so as to detect the glue brushing effect, the chip pasting device is arranged on the workbench and positioned at the third station, and the chip pasting device comprises a chip table for placing the to-be-pasted chip and a chip pasting mechanism for adsorbing the chip at the chip table and for pasting the chip on the frame positioned at the third station, the automatic dispensing mechanism is arranged on the workbench and located on the fourth station, the automatic dispensing mechanism is used for dispensing chips finished in a mounting mode, the dispensing detection mechanism is arranged on the workbench and located between the fourth station and the fifth station, the dispensing detection mechanism is used for carrying out flying shooting without stopping of a frame in a dispensing area of the frame after the dispensing of the passing process, so that dispensing effect detection is carried out, the jumper wire attaching mechanism and the jumper wire feeding platform are respectively arranged on the workbench and located on the fifth station, the jumper wire feeding platform is used for temporarily storing jumper wires to be attached, the jumper wire attaching mechanism is used for transferring and attaching jumper wires on the jumper wire feeding platform to the frame located on the fifth station, the furnace entering mechanical arm is arranged on the workbench and located on the sixth station, and the furnace entering mechanical arm is used for grabbing and placing a frame, located on the sixth station, for mounting the chips and the jumper wires, on the semiconductor sintering furnace, of the frame.
As a further improvement of the invention, the annular flexible transmission track is in a track shape.
As a further improvement of the invention, a frame recovery box for placing a frame which does not pass the brush glue detection is arranged on the workbench, and the frame recovery box is positioned on the third station.
The flexible glue brushing device comprises a glue brushing Z-axis lifting mechanism, a glue brushing Y-axis micro-arrangement mechanism, a glue brushing X-axis translation mechanism, a glue brushing scraper component and a screen plate quick-change mechanism, wherein the glue brushing Z-axis lifting mechanism is connected with the glue brushing X-axis translation mechanism through the glue brushing Y-axis micro-arrangement mechanism, the glue brushing X-axis translation mechanism is connected with the glue brushing scraper component, the glue brushing scraper component is suspended right above the screen plate quick-change mechanism, the screen plate quick-change mechanism comprises a screen plate, a screen plate placing plate and screen plate pressing plates, the screen plate is placed on the screen plate placing plate, the two screen plate pressing plates are respectively installed at the left end and the right end of the screen plate, each screen plate pressing plate is provided with an elastic pressing mechanism and a screen plate pressing plate height adjusting screw for adjusting the height of the screen plate, the screen plate pressing plates are pressed on the screen plate placing plate by the screen plate pressing plates under the elastic action of the elastic pressing mechanisms, the screen plate pressing plate height adjusting screws are in threaded fit with the screen plate pressing plates, and the screen plate pressing plates penetrate through the screen plate pressing plates until the screen plate is placed on the placing plate.
As a further improvement of the invention, the elastic pressing mechanism comprises a spring pressing shaft and a compression spring arranged on the spring pressing shaft, the compression spring is clamped between the screen pressing plate and the spring pressing shaft, two elastic pressing mechanisms arranged in the front-back direction are arranged on each screen pressing plate, and the screen pressing plate height adjusting screw is arranged between the two elastic pressing mechanisms arranged in the front-back direction.
As a further improvement of the invention, the glue brushing scraper component comprises a glue brushing scraper component base, a scraper Z-axis lifting cylinder, a scraper mounting plate and a scraper, wherein the glue brushing scraper component base is connected with the glue brushing X-axis translation mechanism, the scraper Z-axis lifting cylinder is mounted on the glue brushing scraper component base, the scraper Z-axis lifting cylinder is connected with the scraper mounting plate, the scraper is mounted at the bottom of the scraper mounting plate, the scraper mounting plate is connected with a scraper guide mechanism, the scraper guide mechanism comprises a linear bearing and a scraper guide shaft mounted on the linear bearing, the linear bearing is mounted on the glue brushing scraper component base, the scraper guide shaft is connected with the scraper mounting plate, and the scraper is in a splayed shape.
As a further improvement of the present invention, the chip mounting mechanism includes a chip mounting gantry, a chip mounting Y-axis mechanism, a chip mounting X-axis mechanism, and a chip mounting Z-axis mechanism, the chip mounting gantry includes a support column and a cross beam erected on the support column, the chip mounting Y-axis mechanism includes a chip mounting Y-axis servo motor module and a chip mounting Y-axis module connecting plate, the chip mounting Y-axis servo motor module is mounted at the bottom of the cross beam of the chip mounting gantry along the length direction of the chip mounting gantry, the chip mounting Y-axis servo motor module is connected with the chip mounting Y-axis module connecting plate, the chip mounting X-axis mechanism includes a chip mounting X-axis base plate, a chip mounting X-axis linear motor stator, a chip mounting X-axis linear motor mover and a chip mounting X-axis linear motor mover base, the chip mounting X-axis base plate is connected with the chip mounting Y-axis module connecting plate, the chip mounting X-axis base plate is located below the chip mounting Y-axis servo motor module, the chip mounting X-axis linear motor stator is mounted on the chip mounting X-axis linear motor mover base plate, and the chip mounting X-axis linear motor mover base plate is connected with the chip mounting X-axis linear motor mover base plate, and the chip mounting X-axis linear motor mover base plate is connected with the chip mounting X-axis linear motor base plate.
As a further improvement of the invention, the chip mounting Z-axis mechanism comprises a chip mounting Z-axis mounting seat, a chip mounting Z-axis servo motor, a chip mounting Z-axis synchronous belt transmission mechanism, a chip mounting Z-axis lead screw component, a chip sucker connecting plate and a chip vacuum sucker component, wherein the chip mounting Z-axis servo motor and the chip mounting Z-axis lead screw component are respectively mounted on the chip mounting Z-axis mounting seat, the chip mounting Z-axis servo motor is connected with the chip mounting Z-axis lead screw component through the chip mounting Z-axis synchronous belt transmission mechanism, the chip mounting Z-axis lead screw component is connected with the chip sucker connecting plate, the chip sucker connecting plate is connected with the chip vacuum sucker component, the chip mounting Z-axis synchronous belt transmission mechanism is positioned above the chip mounting Z-axis servo motor and the chip mounting Z-axis lead screw component, and the chip mounting Z-axis mounting seat is L-shaped.
As a further improvement of the present invention, the automatic dispensing mechanism includes a dispensing XY dual-axis module and a dispensing assembly, the dispensing XY dual-axis module is connected to the dispensing assembly, the dispensing assembly includes a dispensing Z-axis servo motor, a dispensing Z-axis mounting plate, a dispensing Z-axis screw rod assembly, a dispensing Z-axis platform, a fixed dispensing head and an adjusting dispensing head, the dispensing Z-axis servo motor and the dispensing Z-axis screw rod assembly are respectively mounted on the dispensing Z-axis mounting plate, the dispensing Z-axis mounting plate is connected to the dispensing XY dual-axis module, the dispensing Z-axis servo motor is connected to the dispensing Z-axis platform through the dispensing Z-axis screw rod assembly, the fixed dispensing head and the adjusting dispensing head are respectively mounted on the dispensing Z-axis platform, the adjusting dispensing head includes a dispensing Z-axis adjusting block, an X-axis adjusting block and an adjusting dispensing needle cylinder, the adjusting cylinder is connected to the dispensing Z-axis adjusting block, the adjusting needle of the dispensing needle is connected to the dispensing Z-axis adjusting block, and the dispensing adjusting cylinder is connected to the dispensing Z-axis adjusting block.
As a further improvement of the invention, a Z-direction slotted hole is formed in the dispensing Z-axis platform, the dispensing Z-axis adjusting block is locked on the Z-direction slotted hole through a locking bolt, an X-direction guide slot is formed in the dispensing Z-axis platform, the dispensing X-axis adjusting block is in sliding fit with the X-direction guide slot, the fixed dispensing head comprises a fixed dispensing needle cylinder, a cylinder body of the fixed dispensing needle cylinder is fixed on the dispensing Z-axis platform through a needle cylinder mounting plate, and a needle head of the fixed dispensing needle cylinder is fixed on the dispensing Z-axis platform through a dispensing head fixing block.
The invention has the beneficial effects that: through above-mentioned scheme, each station closely links up, has reduced station quantity, and the equipment size obtains great reduction, and the shared space of equipment that has significantly reduced has practiced thrift manufacturing cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other solutions can be obtained according to the drawings without inventive efforts.
Fig. 1 is a process flow diagram of a semiconductor mounter according to the present invention.
Fig. 2 is a schematic view of a semiconductor mounter of the present invention.
Fig. 3 is a schematic view of another perspective of a semiconductor mounter according to the present invention.
Fig. 4 is a schematic view of an endless flexible driving rail of a semiconductor mounter of the present invention.
FIG. 5 is a schematic diagram of a frame feeding robot and a feeding platform of a semiconductor mounter according to the present invention.
Fig. 6 is a schematic view of a frame feeding robot of a semiconductor mounter according to the present invention.
Fig. 7 is an installation diagram of a flexible glue brushing device of a semiconductor mounter according to the present invention.
Fig. 8 is a schematic view of a flexible glue brushing device of the semiconductor mounter according to the present invention.
Fig. 9 is a schematic view of a squeegee assembly of the flexible squeegee assembly of the semiconductor mounter of the present invention.
Fig. 10 is a side view of a squeegee assembly of a flexible squeegee assembly of a semiconductor mounter according to the present invention.
Fig. 11 is a schematic view showing the arrangement of the paste dispensing detecting mechanism and the paste dispensing detecting mechanism of the semiconductor mounter according to the present invention.
Fig. 12 is a mounting diagram of a chip mounter of a semiconductor mounter of the present invention.
Fig. 13 is a schematic view of a chip mounting mechanism of a semiconductor mounter of the present invention.
Fig. 14 is a schematic view of a die mounting Y-axis mechanism and a die mounting X-axis mechanism of a die mounting mechanism of a semiconductor mounter of the present invention.
Fig. 15 is a schematic view showing the mounting of the wire guides of the chip mounting mechanism of the semiconductor mounter according to the present invention.
Fig. 16 is a schematic view of a die-attach Z-axis mechanism of a die-attaching mechanism of a semiconductor mounter according to the present invention.
Fig. 17 is a front view of a die-attach Z-axis mechanism of a die-attaching mechanism of a semiconductor mounter according to the present invention.
Fig. 18 is a schematic view of an automatic dispensing mechanism of a semiconductor mounter according to the present invention.
FIG. 19 is a schematic view of the installation of the jumper attaching mechanism and the jumper feeding platform of the semiconductor mounter according to the present invention.
Fig. 20 is a schematic view of a jumper feeding platform of a semiconductor mounter according to the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the scope of the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention is further described in the following description and embodiments with reference to the drawings.
As shown in fig. 1 to 20, a semiconductor mounter includes a table 2 and an endless flexible driving rail 1 that transfers a frame from one station to another station.
As shown in fig. 4, the annular flexible transmission track 1 is provided with a first station 101 for feeding the frame, a second station 102 for brushing glue on the frame, a third station 103 for mounting the chip on the frame, a fourth station 104 for dispensing the mounted chip, a fifth station 105 for performing jumper mounting, and a sixth station 106 for transferring the frame to the semiconductor sintering furnace, which are arranged in sequence in a surrounding manner.
The annular flexible transmission track 1 is in a runway shape.
And a frame recovery box 3 for placing a frame which does not pass the brush glue detection is arranged on the workbench 2, and the frame recovery box 3 is positioned on the third station 103.
The endless flexible transmission track 1 includes a chain transmission mechanism 1010 and a frame platform 1020 on which a frame is placed.
As shown in fig. 2 and 3, the semiconductor placement machine further includes a frame feeding manipulator 11, a feeding platform 12, a flexible glue brushing device 13, a glue brushing detection mechanism 14, a chip placement device 16, an automatic glue dispensing mechanism 17, a glue dispensing detection mechanism 18, a jumper wire bonding mechanism 19, a jumper wire feeding platform 20, and a furnace feeding manipulator 21.
As shown in fig. 5 and 6, the frame feeding mechanical arm 11 and the feeding platform 12 are respectively disposed on the workbench 2 and located at the first station 101, the feeding platform 12 is used for temporarily storing a frame to be brushed, and the frame feeding mechanical arm 11 is used for transferring the frame from the feeding platform 12 to the first station 101 of the annular flexible transmission track 1.
The frame feeding manipulator 11 comprises a feeding servo motor Y-axis module 111, a feeding linear rail 112, a feeding linear rail supporting plate 113, a feeding sucker component bottom plate 114, a feeding cylinder mounting plate 115, a feeding MG cylinder 116, a feeding vacuum sucker component mounting plate 117, a feeding vacuum sucker component 118, a feeding linear guide 119 and a feeding Y-axis module platform 1110, wherein the feeding servo motor Y-axis module 111 drives the feeding Y-axis module platform 1110 to move along the Y axis, so that the feeding vacuum sucker component 118 is driven to transfer the frame from the feeding platform 12 to the first station 101 of the annular flexible transmission track 1.
The frame feeding manipulator 11 adopts double-cylinder feeding and can simultaneously feed two frames, a U-shaped groove opening is formed in the feeding vacuum chuck assembly mounting plate 117, an air rod of the feeding MG cylinder 116 is inserted into the U-shaped groove opening of the feeding vacuum chuck assembly mounting plate 117, a nut at one end of the air rod of the cylinder supports the feeding vacuum chuck assembly mounting plate 117 and drives the feeding vacuum chuck assembly 118 to be close to or far away from the feeding platform 12 along the Z direction; the feed Y-axis module platform 1110 is connected to the feed chuck assembly base plate 114 to drive the feed vacuum chuck assembly 118 to move along the Y-axis.
As shown in fig. 7 to 10, the flexible glue brushing device 13 is disposed on the work table 2 and located at the second station 102, and the flexible glue brushing device 13 is used for brushing glue on the frame at the second station 102.
Flexible brush mucilage binding is put 13 mainly glues Z axle elevating system, brush and glues Y axle and establish mechanism, brush a little, glue X axle translation mechanism, brush and glue scraper subassembly 134 and otter board quick change mechanism, brush glues Z axle elevating system and passes through brush glue Y axle establish a little with brush glues X axle translation mechanism and connect, brush glues X axle translation mechanism with brush glues scraper subassembly 134 and connects, brush glue scraper subassembly 134 hang in directly over otter board quick change mechanism.
The screen board quick-change mechanism comprises a screen board 137, a screen board placing board 138 and screen board pressing boards 139, wherein the screen board 137 is placed on the screen board placing board 138, two screen board pressing boards 139 are arranged at the left end and the right end of the screen board 137 respectively, each screen board pressing board 139 is provided with an elastic pressing mechanism and a screen board pressing board height adjusting screw 1310 for adjusting the height of the screen board pressing board 139, under the elastic action of the elastic pressing mechanisms, the screen board pressing boards 139 press the screen board 137 on the screen board placing board 138, the screen board pressing board height adjusting screw 1310 is in threaded fit with the screen board pressing board 139, the screen board pressing board height adjusting screw 1310 penetrates through the screen board pressing board 139 until reaching the screen board placing board 138, the height of the screen board pressing board 139 can be adjusted by rotating the screen board pressing board height adjusting screw 1310, when the screen board 137 needs to be taken and placed, the screen board pressing board height adjusting screw 1310 can be rotated to lift the screen board pressing board 139 to enable the screen board 137 to be taken and placed in place quickly, and the pressing board 139 is pressed downwards after the screen board 137 is placed in place.
The screen plate 137 is provided with a groove and a pore corresponding to the glue brushing position of the product.
The elastic pressing mechanism comprises a spring pressing shaft 136 and a compression spring 135 arranged on the spring pressing shaft 136, the compression spring 135 is clamped between the screen pressing plate 139 and the spring pressing shaft 136, and under the elastic force of the compression spring 135, the screen pressing plate 139 presses the screen 137 on the screen placing plate 138.
Two elastic pressing mechanisms which are arranged in the front-back direction are arranged on each screen plate pressing plate 139, and the screen plate pressing plate height adjusting screw 1310 is arranged between the two elastic pressing mechanisms which are arranged in the front-back direction.
The glue brushing scraper assembly 134 comprises a glue brushing scraper assembly base 1316, a scraper Z-axis lifting cylinder 1317, a scraper mounting plate 1320 and a scraper 1321, the glue brushing scraper assembly base 1316 is connected with a glue brushing X-axis translation mechanism, the scraper Z-axis lifting cylinder 1317 is installed on the glue brushing scraper assembly base 1316, the scraper Z-axis lifting cylinder 1317 is connected with the scraper mounting plate 1320, and the scraper 1321 is installed at the bottom of the scraper mounting plate 1320.
A blade locking plate 1322 is mounted to the blade 1321 for securing the blade 1321 to the blade mounting plate 1320.
The scraper mounting plate 13220 is connected with a scraper guide mechanism, the scraper guide mechanism comprises a linear bearing 1319 and a scraper guide shaft 1318 installed on the linear bearing 1319, the linear bearing 1319 is installed on the glue brushing scraper assembly base 1316, the scraper guide shaft 1318 is connected with the scraper mounting plate 1320, and the scraper guide shaft 1318 and the linear bearing 1319 are matched to provide a guide effect for the lifting motion of the scraper mounting plate 1320.
The scraper 1321 is splayed, which is beneficial to the glue brushing in the X direction.
The scraper 1321 is driven by the scraper Z-axis lifting cylinder 1317 to move up and down, when the glue brushing action is performed, the scraper Z-axis lifting cylinder 1317 drives the scraper 1321 to descend to the position of the screen plate 137, and when the glue brushing action is finished, the scraper Z-axis lifting cylinder 1317 drives the scraper 1321 to ascend.
Doctor Z-axis lift cylinder 1317 is preferably a SDAJ cylinder for controlling doctor 1321 to move toward and away from web 137 along the Z-axis.
The glue brushing X-axis translation mechanism comprises a glue brushing X-axis mounting seat 133, a glue brushing X-axis cylinder 1311 and a glue brushing X-axis guide rail mechanism 1312, the glue brushing X-axis cylinder 1311 and the glue brushing X-axis guide rail mechanism 1312 are respectively mounted on the glue brushing X-axis mounting seat 133, the glue brushing X-axis cylinder 1311 is connected with the glue brushing scraper component base 1316, the glue brushing scraper component base 1316 is connected with the glue brushing X-axis guide rail mechanism 1312, the glue brushing scraper component base 1316 performs X-direction left-right glue brushing under the driving of the glue brushing X-axis cylinder 1311, and the glue brushing X-axis guide rail mechanism 1312 provides a guiding effect for X-direction left-right movement of the glue brushing scraper component base 1316.
The brushing X-axis cylinder 1311 is preferably a rodless cylinder for controlling the brushing action of the brushing blade assembly 134 to achieve brushing in the X-direction.
Brush gluey Z axle elevating system includes brush gluey Z axle platform 132 and drive brush gluey Z axle platform 132 carries out elevating movement's servo motor lead screw subassembly 131, brush gluey Z axle platform 132 with brush gluey Y axle is established the mechanism a little and is connected.
The glue brushing Y-axis micro-setting mechanism comprises a Y-direction fine-adjustment locking block 1315, a Y-direction guide shaft 1313 and a Y-direction bearing 1314, the Y-direction bearing 1314 is installed on the glue brushing X-axis installation base 133, the Y-direction guide shaft 1313 is installed on the glue brushing Z-axis platform 132, the Y-direction guide shaft 1313 penetrates through the Y-direction bearing 1314, the Y-direction fine-adjustment locking block 1315 is fixedly connected with the glue brushing Z-axis platform 132, the Y-direction fine-adjustment locking block 1315 is in locking connection with the glue brushing X-axis installation base 133 through an adjusting bolt, a Y-direction long round hole matched with the adjusting bolt is formed in the Y-direction fine-adjustment locking block 1315, and fine adjustment of the glue brushing X-axis installation base 133 in the Y-direction position can be achieved through the Y-direction fine-adjustment locking block 1315.
The flexible glue brushing device 13 realizes the quick taking and placing of the screen plate through the screen plate quick-changing mechanism, and the taking and placing of the screen plate are more convenient and faster; establish mechanism, brush through brush gluey Z axle elevating system, brush gluey Y axle a little, brush gluey X axle translation mechanism, brush gluey scraper subassembly 134 have realized the flexible brush of scraper and have glued, and the commonality is higher.
As shown in fig. 11, the glue brushing detection mechanism 14 is disposed on the workbench 2 and located between the second station 102 and the third station 103, and the glue brushing detection mechanism 14 is configured to perform flying photography without frame stop on a gluing area of the frame after passing gluing, so as to perform glue brushing effect detection.
The glue brushing detection mechanism 14 is used for detecting the glue brushing effect, NG processing is carried out on a frame brushed with glue, chip mounting processing is carried out on the frame passing detection at the third station 103, the frame not passing detection is moved away from the annular flexible transmission track 1 at the third station 103, and the frame is placed to the frame recovery box 3.
The dispensing detection mechanism 18 is arranged on the workbench 2 and located between the fourth station 104 and the fifth station 105, and the dispensing detection mechanism 18 is used for performing flying shooting without stopping the frame in a dispensing area of the frame after the dispensing so as to perform dispensing effect detection.
The glue brushing camera detection mechanism 14 is arranged between the second station 102 and the third station 103, the glue dispensing camera detection 18 is arranged between the fourth station 104 and the fifth station 105, and does not occupy working positions.
As shown in fig. 12 to 17, the die attachment device is disposed on the worktable 2 and located on the third station 103, and includes a die table 15 on which a die to be attached is placed, and a die attachment mechanism 16 that adsorbs and attaches the die on the die table 15 to a frame located on the third station 103.
The chip mounting mechanism 16 includes a chip mounting gantry, a chip mounting Y-axis mechanism, a chip mounting X-axis mechanism, and a chip mounting Z-axis mechanism, and the chip mounting Y-axis mechanism and the chip mounting X-axis mechanism constitute an XY moving platform 163.
The chip mounting gantry includes a support column 161 and a beam 162 erected on the support column 161.
The chip mounting Y-axis mechanism comprises a chip mounting Y-axis servo motor module 166 and a chip mounting Y-axis module connecting plate 168, the chip mounting Y-axis servo motor module 166 is mounted at the bottom of the beam 162 of the chip mounting gantry along the length direction of the chip mounting gantry, the chip mounting Y-axis servo motor module 166 is connected with the chip mounting Y-axis module connecting plate 168, and the chip mounting Y-axis servo motor module 166 can drive the chip mounting Y-axis module connecting plate 168 to move along the Y axis.
The X-axis mechanism is pasted with the chip and includes that chip dress X axle base 1611, chip dress X axle linear electric motor stator 1612, chip dress X axle linear electric motor active cell 167 and chip dress X axle linear electric motor active cell base 1613, chip dress X axle base 1611 with chip dress Y axle module connecting plate 168 is connected, chip dress X axle base 1611 is located the chip dress Y axle servo motor module 168's below, chip dress X axle linear electric motor stator 1612 is installed on chip dress X axle base 1611, chip dress X axle linear electric motor stator 1612 with chip dress X axle linear electric motor active cell 167 has constituted chip dress X axle linear electric motor, chip dress X axle linear electric motor active cell base 1613 with chip dress X axle linear electric motor active cell 167 is connected, chip dress X axle linear electric motor active cell base 1613 with chip dress Z axle mechanism is connected, chip dress Z axle mechanism is located the chip dress X axle linear electric motor base 1613's below, and the accessible dress X axle linear electric motor drive chip dress X axle dress Z axle dress moves and carries out chip dress Z axle dress mechanism.
The beam 162 of the chip mounting gantry, the chip mounting Y-axis module connecting plate 168, the chip mounting X-axis base plate 1611 and the chip mounting X-axis linear motor mover base 1613 are all parallel to the horizontal plane, the side of the chip mounting X-axis base plate 1611 is provided with an inductor 169, and the side of the chip mounting X-axis linear motor mover base 1613 is provided with an inductor trigger piece 1617 matched with the inductor 169 and used for position sensing.
Two ends of the chip mounting X-axis bottom plate 1611 are respectively provided with an X-axis position mounting baffle 1610 which can be used for X-axis limiting.
Two chip mounting X-axis linear guide rails 1614 are arranged on the bottom surface of the chip mounting X-axis bottom plate 1611 and used for X-axis guiding, two sides of the top surface of the chip mounting X-axis linear motor rotor base 1613 are in sliding fit with the chip mounting X-axis linear guide rails 1614 through sliders respectively, and an installation groove for installing a chip mounting X-axis linear motor rotor 167 is arranged in the middle of the top surface of the chip mounting X-axis linear motor rotor base 1613.
The side surface of the chip mounting X-axis linear motor rotor base 1613 is provided with a photoelectric sensor mounting base 1615, and a photoelectric sensor 1616 is mounted on the photoelectric sensor mounting base 1615.
The side of the chip mounting X-axis base plate is provided with a linear rail mounting plate 1618, a linear rail 1619 is mounted on the linear rail mounting plate 1618, and the linear rail 1619 is connected with a chip mounting X-axis linear motor rotor base 1613 through a linear rail supporting plate 1620.
Chip dress Z axle mechanism mainly includes Z axle drive section 164 and chip absorption part 165, has specifically included chip dress Z axle mount pad 1623, chip dress Z axle servo motor 1622, chip dress Z axle synchronous belt drive 1624, chip dress Z axle lead screw subassembly 1625, chip sucking disc connecting plate 1626 and chip vacuum chuck subassembly 1627, chip dress Z axle servo motor 1622 and chip dress Z axle lead screw subassembly 1625 install respectively on the chip dress Z axle mount pad 1623, chip dress Z axle servo motor 1622 through chip dress Z axle synchronous belt drive 1624 with chip dress Z axle lead screw subassembly 1625 connects, chip dress Z axle lead screw subassembly 1625 with chip sucking disc connecting plate 1626 connects, chip sucking disc connecting plate 1626 with chip vacuum chuck subassembly 1627 connects, and accessible chip dress Z axle servo motor 1622 drives chip vacuum chuck subassembly 1627 and is close to or keeps away from the frame platform along the Z axle, realizes the subsides of chip and pastes the dress.
The chip mounting Z-axis synchronous belt transmission mechanism 1624 is located above the chip mounting Z-axis servo motor 1622 and the chip mounting Z-axis screw assembly 1625.
The die attach Z-axis mount 1623 is L-shaped.
The chip suction cup connection plate 1626 is in snap connection with the chip vacuum suction cup assembly 1627.
A plurality of vacuum chucks are provided on the chip vacuum chuck assembly 1627.
The chip mounting device fully utilizes the space from the gantry to the chip vacuum sucker component 1627, reasonably arranges a chip mounting Y-axis mechanism, a chip mounting X-axis mechanism and a chip mounting Z-axis mechanism, and has the advantages of compact structure and small volume.
As shown in fig. 18, the automatic dispensing mechanism 17 is disposed on the workbench 2 and located on the fourth station 104, and the automatic dispensing mechanism 17 is configured to dispense a mounted chip.
The automatic dispensing mechanism 17 mainly comprises a dispensing XY double-shaft module and a dispensing component, and the dispensing XY double-shaft module is connected with the dispensing component.
The glue dispensing assembly comprises a glue dispensing Z-axis servo motor 1715, a glue dispensing Z-axis mounting plate 1726, a glue dispensing Z-axis screw rod assembly 1714, a glue dispensing Z-axis platform 177, a fixed glue dispensing head and an adjusting glue dispensing head, wherein the glue dispensing Z-axis servo motor 1715 and the glue dispensing Z-axis screw rod assembly 1714 are respectively mounted on the glue dispensing Z-axis mounting plate 1726, the glue dispensing Z-axis mounting plate 1726 is connected with the glue dispensing XY dual-axis module, the glue dispensing Z-axis servo motor 1715 is connected with the glue dispensing Z-axis platform 177 through the glue dispensing Z-axis screw rod assembly 1714, and the fixed glue dispensing head and the adjusting glue dispensing head are respectively mounted on the glue dispensing Z-axis platform 177.
The dispensing adjusting head comprises a dispensing Z-axis adjusting block 178, a dispensing X-axis adjusting block 179 and an adjusting dispensing syringe 1727, the barrel body of the adjusting dispensing syringe 1727 is connected with the dispensing Z-axis adjusting block 178 through a syringe mounting plate 1713, the needle of the adjusting dispensing syringe 1727 is connected with the dispensing X-axis adjusting block 179, the dispensing Z-axis adjusting block 178 is connected with the dispensing Z-axis platform 177 in a Z-direction adjusting manner, and the dispensing X-axis adjusting block 179 is connected with the dispensing Z-axis platform 177 in an X-direction adjusting manner.
The dispensing Z-axis platform 177 is provided with a Z-direction long circular hole, and the dispensing Z-axis adjusting block 178 is locked on the Z-direction long circular hole through a locking bolt.
An X-direction guide groove is formed in the dispensing Z-axis platform 177, and the dispensing X-axis adjusting block 179 is in sliding fit with the X-direction guide groove.
The fixed point is glued the head and is glued syringe 1711 including fixed point, the stack shell that fixed point was glued syringe 1711 is fixed through syringe mounting panel 1712 on Z axle platform 177 is glued to the point, the syringe needle that fixed point was glued syringe 1711 is fixed through dispensing first fixed block 1710 on Z axle platform 177 is glued to the point.
The glue-dispensing XY double-axis module comprises a glue-dispensing X-axis module and a glue-dispensing Y-axis module arranged on the glue-dispensing X-axis module, and the glue-dispensing Y-axis module is connected with the glue-dispensing Z-axis mounting plate 1726.
X axle linear electric motor is glued including a little to the point to X axle module, X axle linear electric motor is glued including a little to glue X axle linear electric motor stator 171 and a little to glue X axle linear electric motor active cell 173, Y axle module is glued including a little to glue Y axle linear electric motor, Y axle linear electric motor is glued including a little to glue Y axle linear electric motor stator 1724 and a little to glue Y axle linear electric motor active cell 1717, Y axle linear electric motor stator 1724 is glued to a little to install on the point to glue X axle linear electric motor active cell 173, it installs a little to glue Y axle linear electric motor active cell 1719 on the Y axle linear electric motor active cell 1717 to glue, a little to glue Y axle linear electric motor active cell 1719 with a little to glue Z axle mounting plate 1726 and connect.
The dispensing Y-axis linear motor rotor base 1719 is perpendicular to the dispensing Z-axis mounting plate 1726, and a reinforcing plate 1716 is connected between the dispensing Y-axis linear motor rotor base 1719 and the dispensing Z-axis mounting plate 1726.
The both ends of some gluing X axle linear electric motor stator 171 are connected with some gluey X axle baffle 172 respectively, it is equipped with some gluey X axle linear guide subassembly 174 on the X axle linear electric motor stator 171 to some glue, some gluey X axle linear electric motor active cell 173 with some gluey X axle linear guide subassembly 174 is connected, the side of some gluey X axle linear electric motor active cell 173 is equipped with some gluey X axle photoelectric sensor subassembly 175 and some gluey X axle inductor trigger piece 176, the side of some gluey X axle linear electric motor stator 171 be equipped with some gluey X axle inductor trigger piece 176 matched with some gluey X axle inductor.
Two ends of the Y-axis dispensing linear motor stator 1724 are respectively connected with a Y-axis dispensing baffle 1723, a Y-axis dispensing linear guide rail assembly 1722 is arranged on the Y-axis dispensing linear motor stator 1724, the Y-axis dispensing linear motor rotor 1717 is connected with the Y-axis dispensing linear guide rail assembly 1722, a Y-axis dispensing photoelectric sensor assembly 1720 and a Y-axis dispensing sensor trigger piece 1721 are arranged on the side surface of the Y-axis dispensing linear motor rotor 1717, and a Y-axis dispensing sensor 1725 matched with the Y-axis dispensing sensor trigger piece 1721 is arranged on the side surface of the Y-axis dispensing linear motor stator 1724.
And a linear rail 1718 is arranged on the dispensing Y-axis linear motor stator 1724.
The automatic dispensing mechanism 17 can drive the dispensing Z-axis platform 177 to move in the XYZ direction through the dispensing X-axis linear motor, the dispensing Y-axis linear motor and the dispensing Z-axis servo motor 1715, so as to realize automatic dispensing of the product frame.
As shown in fig. 19 to 20, the jumper attaching mechanism 19 and the jumper feeding platform 20 are respectively disposed on the workbench 2 and located on the fifth station 105, the jumper feeding platform 20 is used for temporarily storing the jumper to be attached, and the jumper attaching mechanism 19 is used for transferring and attaching the jumper on the jumper feeding platform 20 to the frame located on the fifth station 105.
The jumper attaching mechanism 19 comprises a jumper attaching Z-axis transmission mechanism 191, a jumper attaching XY transmission assembly 192 and a jumper attaching sucker assembly 193.
The jumper feeding platform 20 comprises a jumper feeding servo motor 201, a slider connecting plate 202, a jumper feeding platform 203, a jumper rocking disc 204 and a rocking disc 205.
The jumper feeding platform 20 is controlled by a servo motor module, and a slider connecting plate 202 is fixedly connected with a slider of the jumper feeding servo motor 201 through threads; the slider connecting plate 202 is connected with the jumper feeding platform 203, and drives the jumper rocking disc 204 to move in the X direction. When the jumper is adsorbed, the jumper attaching sucker component 193 reaches the position above the jumper rocking disc 204 to accurately take materials under the action of the jumper attaching Z-axis transmission mechanism 191 and the jumper attaching XY transmission component 192, and then accurate attaching is carried out, wherein the process and the principle of the jumper attaching mechanism 19 for adsorbing the jumper are the same as those of the chip attaching mechanism 16.
The furnace entering mechanical arm 21 is arranged on the workbench 2 and positioned on the sixth station 106, and the furnace entering mechanical arm 21 is used for grabbing and placing the frame on the sixth station 106, on which the chip and jumper wire mounting is completed, onto the semiconductor sintering furnace, so as to realize butt joint of the semiconductor mounter and the semiconductor sintering furnace.
The semiconductor mounter has the advantages of small occupied space, compact structure, high production beat and high efficiency.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A semiconductor mounter characterized by: the semiconductor mounter further comprises a frame feeding mechanical arm, a feeding platform, a flexible glue brushing device, a chip mounting detection mechanism, a jumper feeding platform, a chip mounting device, an automatic glue dispensing mechanism, a glue dispensing detection mechanism, a jumper bonding mechanism, a jumper feeding platform and a furnace entering mechanical arm, wherein the frame feeding mechanical arm and the feeding platform are respectively arranged on the workbench and are positioned on the first station, the feeding platform is arranged on the frame to be temporarily stored with glue to be brushed, the frame feeding mechanical arm is used for transferring the frame from the feeding platform to the first station of the annular flexible transmission rail, the flexible glue brushing device is arranged on the workbench and is positioned on the second station, the flexible transmission rail is used for transferring the frame onto the frame to be brushed, the chip mounting device is arranged on the second station and is used for placing the chip to be brushed on the second station, the chip mounting detection mechanism is arranged on the second station, the chip mounting detection mechanism is arranged on the second station, the chip mounting detection mechanism is used for detecting the chip mounting the chip, and the chip mounting effect of the chip mounting is achieved when the chip mounting device is arranged on the second station, the automatic dispensing mechanism is arranged on the workbench and located on the fourth station, the automatic dispensing mechanism is used for dispensing chips finished in mounting, the dispensing detection mechanism is arranged on the workbench and located between the fourth station and the fifth station, the dispensing detection mechanism is used for carrying out flying shooting without stopping of a frame in a dispensing area of the frame after the dispensing of the passing process, so that dispensing effect detection is carried out, the jumper wire attaching mechanism and the jumper wire feeding platform are respectively arranged on the workbench and located on the fifth station, the jumper wire feeding platform is used for temporarily storing jumper wires to be attached, the jumper wire attaching mechanism is used for transferring and attaching jumper wires on the jumper wire feeding platform to the frame located on the fifth station, the furnace entering mechanical arm is arranged on the workbench and located on the sixth station, and the furnace entering mechanical arm is used for grabbing and placing a frame used for mounting the finished chips and the jumper wires on the sixth station on a semiconductor sintering furnace.
2. The semiconductor mounter according to claim 1, wherein: the annular flexible transmission track is in a runway shape.
3. The semiconductor mounter according to claim 1, wherein: and a frame withdrawing box for placing a frame which does not pass the glue brushing detection is arranged on the workbench, and the frame withdrawing box is positioned on the third station.
4. The semiconductor mounter according to claim 1, wherein: the flexible glue brushing device comprises a glue brushing Z-axis lifting mechanism, a glue brushing Y-axis micro-establishment mechanism, a glue brushing X-axis translation mechanism, a glue brushing scraper component and a screen plate quick-change mechanism, wherein the glue brushing Z-axis lifting mechanism passes through the glue brushing Y-axis micro-establishment mechanism and the glue brushing X-axis translation mechanism are connected, the glue brushing X-axis translation mechanism is connected with the glue brushing scraper component, the glue brushing scraper component is suspended right above the screen plate quick-change mechanism, the screen plate quick-change mechanism comprises a screen plate, a screen plate placing plate and a screen plate pressing plate, the screen plate is placed on the screen plate placing plate, the screen plate pressing plate is provided with two pressing plates which are respectively installed at the left end and the right end of the screen plate, each pressing plate is provided with an elastic pressing mechanism and a screen plate height adjusting screw for adjusting the height of the screen plate, the screen plate pressing plate is pressed on the screen plate placing plate under the elastic action of the elastic pressing mechanism, the screen plate pressing plate height adjusting screw is in threaded fit with the screen plate pressing plate, and the screen plate height adjusting screw penetrates through the screen plate pressing plate until the screen plate is placed on the screen plate.
5. The semiconductor mounter according to claim 4, wherein: the elastic pressing mechanism comprises a spring pressing shaft and a compression spring arranged on the spring pressing shaft, the compression spring is clamped between the screen pressing plate and the spring pressing shaft, two elastic pressing mechanisms which are arranged in the front-back direction are arranged on each screen pressing plate, and the screen pressing plate height adjusting screw is arranged between the two elastic pressing mechanisms which are arranged in the front-back direction.
6. The semiconductor mounter according to claim 4, wherein: brush and glue scraper subassembly including brush and glue scraper subassembly base, scraper Z axle lift cylinder, scraper mounting panel and scraper, brush and glue scraper subassembly base with brush and glue X axle translation mechanism and connect, scraper Z axle lift cylinder is installed on the brush and glue scraper subassembly base, scraper Z axle lift cylinder with the scraper mounting panel is connected, the scraper is installed the bottom of scraper mounting panel, the scraper mounting panel is connected with scraper guiding mechanism, scraper guiding mechanism includes linear bearing and installs scraper guiding axle on the linear bearing, linear bearing installs on the brush glues scraper subassembly base, the scraper guiding axle with the scraper mounting panel is connected, the scraper is eight characters type.
7. The semiconductor mounter according to claim 1, wherein: the chip mounting mechanism comprises a chip mounting gantry, a chip mounting Y-axis mechanism, a chip mounting X-axis mechanism and a chip mounting Z-axis mechanism, the chip mounting gantry comprises a support column and a cross beam erected on the support column, the chip mounting Y-axis mechanism comprises a chip mounting Y-axis servo motor module and a chip mounting Y-axis module connecting plate, the chip mounting Y-axis servo motor module is mounted at the bottom of the cross beam of the chip mounting gantry along the length direction of the chip mounting gantry, the chip mounting Y-axis servo motor module is connected with the chip mounting Y-axis module connecting plate, the chip mounting X-axis mechanism comprises a chip mounting X-axis base plate, a chip mounting X-axis linear motor stator, a chip mounting X-axis linear motor rotor and a chip mounting X-axis linear motor rotor base, the chip mounting X-axis base plate is connected with the chip mounting Y-axis module connecting plate, the chip mounting X-axis base plate is located below the chip mounting Y-axis servo motor module, the chip mounting X-axis linear motor stator is mounted on the chip mounting X-axis base plate, the chip mounting X-axis linear motor rotor is connected with the rotor base, and the chip mounting X-axis linear motor rotor is connected with the chip mounting X-axis linear motor base, and the rotor is connected with the chip mounting X-axis linear motor.
8. The semiconductor mounter according to claim 7, wherein: chip dress Z axle mechanism includes chip dress Z axle mount pad, chip dress Z axle servo motor, chip dress Z axle synchronous belt drive mechanism, chip dress Z axle lead screw subassembly, chip sucking disc connecting plate and chip vacuum chuck subassembly, chip dress Z axle servo motor and chip dress Z axle lead screw subassembly are installed respectively on the chip dress Z axle mount pad, chip dress Z axle servo motor pass through chip dress Z axle synchronous belt drive mechanism with chip dress Z axle lead screw subassembly is connected, chip dress Z axle lead screw subassembly with chip sucking disc connecting plate is connected, chip sucking disc connecting plate with chip vacuum chuck subassembly is connected, chip dress Z axle synchronous belt drive mechanism is located the top of chip dress Z axle servo motor and chip dress Z axle lead screw subassembly, chip dress Z axle mount pad is the L type.
9. The semiconductor mounter according to claim 1, wherein: the automatic glue dispensing mechanism comprises a glue dispensing XY double-shaft module and a glue dispensing assembly, the glue dispensing XY double-shaft module is connected with the glue dispensing assembly, the glue dispensing assembly comprises a glue dispensing Z-shaft servo motor, a glue dispensing Z-shaft mounting plate, a glue dispensing Z-shaft screw rod assembly, a glue dispensing Z-shaft platform, a fixed glue dispensing head and an adjusting point glue dispensing head, the glue dispensing Z-shaft servo motor and the glue dispensing Z-shaft screw rod assembly are respectively mounted on the glue dispensing Z-shaft mounting plate, the glue dispensing Z-shaft mounting plate is connected with the glue dispensing XY double-shaft module, the glue dispensing Z-shaft servo motor passes through the glue dispensing Z-shaft screw rod assembly and the glue dispensing Z-shaft platform, the fixed glue dispensing head and the adjusting point glue dispensing head are respectively mounted on the Z-shaft platform, the adjusting point glue dispensing head comprises a glue dispensing Z-shaft adjusting block, a glue dispensing X-shaft adjusting block and an adjusting needle cylinder, the needle head of the adjusting needle cylinder is connected with the glue dispensing X-shaft adjusting block, the Z-shaft adjusting block is connected with the glue dispensing X-shaft adjusting block.
10. The semiconductor mounter according to claim 9, wherein: it is equipped with Z to the slotted hole on the Z axle platform to glue, it is in to glue Z axle adjusting block through locking bolt locking Z to on the slotted hole, it is equipped with X to the guide slot to glue on the Z axle platform to glue, glue X axle adjusting block with X is sliding fit to the guide slot, fixed point glue head is including fixed point glue cylinder, the stack shell of fixed point glue cylinder is fixed through the cylinder mounting panel on the Z axle platform is glued to the point, the syringe needle of fixed point glue cylinder is fixed through the first fixed block of gluing on the Z axle platform is glued to the point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210381872.1A CN115709142A (en) | 2022-04-13 | 2022-04-13 | Semiconductor mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210381872.1A CN115709142A (en) | 2022-04-13 | 2022-04-13 | Semiconductor mounting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115709142A true CN115709142A (en) | 2023-02-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210381872.1A Pending CN115709142A (en) | 2022-04-13 | 2022-04-13 | Semiconductor mounting machine |
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| Country | Link |
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| CN (1) | CN115709142A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153960A (en) * | 2023-10-31 | 2023-12-01 | 深圳平晨半导体科技有限公司 | Full-automatic die bonding processing equipment and processing method thereof |
-
2022
- 2022-04-13 CN CN202210381872.1A patent/CN115709142A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153960A (en) * | 2023-10-31 | 2023-12-01 | 深圳平晨半导体科技有限公司 | Full-automatic die bonding processing equipment and processing method thereof |
| CN117153960B (en) * | 2023-10-31 | 2024-02-02 | 深圳平晨半导体科技有限公司 | Full-automatic die bonding processing equipment and processing method thereof |
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