CN220131295U - Clamping mechanism for IC carrier plate and IC carrier plate placing machine - Google Patents
Clamping mechanism for IC carrier plate and IC carrier plate placing machine Download PDFInfo
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- CN220131295U CN220131295U CN202321457220.8U CN202321457220U CN220131295U CN 220131295 U CN220131295 U CN 220131295U CN 202321457220 U CN202321457220 U CN 202321457220U CN 220131295 U CN220131295 U CN 220131295U
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- 230000007246 mechanism Effects 0.000 title claims abstract description 41
- 230000000712 assembly Effects 0.000 claims abstract description 57
- 238000000429 assembly Methods 0.000 claims abstract description 57
- 239000013307 optical fiber Substances 0.000 claims description 7
- 230000001154 acute effect Effects 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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Abstract
The utility model discloses a clamping mechanism for an IC carrier plate and an IC carrier plate placing machine, which comprise two oppositely arranged moving assemblies, wherein a containing space is formed between the two moving assemblies, the two moving assemblies can move relative to a main body part along a first direction so as to adjust the size of the containing space, thereby matching IC carrier plates with different specifications, when the moving assemblies move along the first direction, the clamping assemblies also move along and then are brought to a preset position, at the moment, the IC carrier plate is positioned between a first clamping part and a second clamping part, and then the second clamping part is close to the first clamping part until the IC carrier plate is clamped between the first clamping part and the second clamping part. By adopting the clamping mechanism for the IC carrier plate, the IC carrier plate is always stable in the switching process of different positions, so that the plate falling phenomenon is effectively avoided, and the risk of damage to the surface of the IC carrier plate can be reduced due to the fact that the first clamping part and the second clamping part clamp the edge of the IC carrier plate.
Description
Technical Field
The utility model relates to the technical field of automatic transportation of an IC carrier plate, in particular to a clamping mechanism for the IC carrier plate and an IC carrier plate placing machine.
Background
The 21 st century electronic industry rapidly develops, and in particular, the product technology such as 5G communication, artificial intelligence, cloud computing, automatic driving, intelligent wearing, intelligent home and the like upgrades and expands application scenes, and the IC carrier is one of important parts of the electronic industry, so that the performance requirements on the IC carrier are also continuously improved.
Most of the equipment in the current IC industry needs to utilize a sucker to absorb an IC carrier plate in the production and manufacture switching process of the IC carrier plate, and then drives the IC carrier plate to move, but the surface of the IC carrier plate is easily scratched in the moving process, and the sucker is greatly influenced by the material and the perforating condition of the surface of the IC carrier plate, so that the falling rate is high easily due to insufficient adsorption force.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides a clamping mechanism for an IC carrier plate, which aims to solve the problem that the IC carrier plate is easy to scratch in the moving process.
The technical scheme of the utility model is as follows: the clamping mechanism for the IC carrier plate comprises a main body part, two moving assemblies and four clamping assemblies, wherein the main body part is arranged along a first direction, the two moving assemblies are oppositely arranged, the two moving assemblies are connected with the main body part, a containing space is formed between the two moving assemblies, the two moving assemblies can move relative to the main body part along the first direction, and the moving directions of the two moving assemblies are opposite to each other so as to adjust the size of the containing space; two clamping assemblies are arranged on one moving assembly, and the other two clamping assemblies are arranged on the other moving assembly; the clamping assembly comprises a first clamping part, a second clamping part and a first driving cylinder, wherein the first driving cylinder drives the second clamping part to switch between a clamping position and an opening position, and when the clamping assembly is in the clamping position, the first clamping part and the second clamping part are respectively abutted to the upper end face and the lower end face of the IC carrier plate.
Further, the first driving cylinder drives the second clamping portion to move in a second direction to be close to or away from the first clamping portion, so that the second clamping portion is switched between a clamping position and an opening position, wherein the first direction and the second direction are perpendicular to each other.
Further, one end of the second clamping part is connected with the output end of the first driving cylinder, the other end of the second clamping part is provided with a cylindrical abutting block, the first driving cylinder drives the second clamping part to rotate, and after the second clamping part rotates for a certain angle, the abutting block is matched with the second clamping part to clamp the IC carrier plate.
Further, in the orthographic projection direction of the moving assembly, the projection centers of the four clamping assemblies are sequentially connected to form a rectangle.
Further, the main body part includes connection pad and mounting panel, the connection pad is installed the up end middle part position of mounting panel, just offer on the connection pad and be used for with draw arm mechanism connection's mounting hole, a plurality of the mounting hole is the annular distribution.
Further, the moving assembly comprises a second driving cylinder and a fixing plate connected with the second driving cylinder, the fixing plate is connected with the mounting plate through the second driving cylinder, and the second driving cylinder is arranged along the extending direction of the mounting plate.
Further, the fixing plate comprises a plate body and an extension part formed by protruding the middle part of the plate body outwards along the first direction, and the width of the plate body gradually decreases from the middle part to two ends.
Further, the plate body comprises a first inclined surface, a second inclined surface and a flat surface, the first inclined surface and the second inclined surface are oppositely arranged, the first inclined surface and the second inclined surface are arranged on one side of the flat surface facing the main body part, an included angle between the first inclined surface and the flat surface is an acute angle, and an included angle between the second inclined surface and the flat surface is an acute angle.
Further, the clamping assembly is provided with an optical fiber sensor, and the optical fiber sensor is used for sensing the IC carrier plate.
The utility model also provides an IC carrier plate placing machine, which comprises the clamping mechanism for the IC carrier plate.
The utility model according to the scheme has the beneficial effects that:
(1) The utility model provides a clamping mechanism for an IC carrier plate, which comprises two oppositely arranged moving assemblies, wherein a containing space is formed between the two moving assemblies, the two moving assemblies can move relative to a main body part along a first direction, the moving directions of the two moving assemblies are opposite to each other, so that the size of the containing space is adjusted, the size of the containing space is controllable, the clamping assemblies are matched with IC carrier plates with different specifications, when the moving assemblies move along the first direction, the clamping assemblies also move along and then are brought to preset positions, at the moment, the IC carrier plate is positioned between a first clamping part and a second clamping part, and then the second clamping part is close to the first clamping part until the IC carrier plate is clamped between the first clamping part and the second clamping part. By adopting the clamping mechanism for the IC carrier plate, the IC carrier plate is always stable in the switching process of different positions, so that the plate falling phenomenon is effectively avoided, the edges of the IC carrier plate are clamped by the first clamping part and the second clamping part, and the risk of damage to the surface of the IC carrier plate can be reduced.
(2) According to the clamping mechanism for the IC carrier plate, the two oppositely arranged second driving cylinders are utilized to drive the fixed plates connected with the two opposite driving cylinders to perform telescopic movement in the horizontal direction of the first direction, so that the clamping assemblies respectively arranged on the two fixed plates can reciprocate in the first direction, 4 clamping assemblies are arranged, the first driving cylinder in each clamping assembly can drive the second clamping part to realize opening and clamping actions in the second direction, wiring arrangement of the clamping mechanism is optimized, and compared with the traditional sucker adsorption, the clamping mechanism for the IC carrier plate is more regular.
(3) According to the clamping mechanism for the IC carrier plate, the four clamping assemblies adopt the hard clamping mode to take the IC carrier plate, the plate dropping rate can be effectively reduced, the contact area between the clamping assemblies and the IC carrier plate is reduced, the four clamping assemblies can be sequentially connected to form a rectangular shape, and the four clamping assemblies can be clamped in the clampable area of the IC carrier plate, so that the surface quality of the IC carrier plate is not affected.
Drawings
Fig. 1 is a schematic diagram of a clamping mechanism for an IC carrier in embodiment 1 of the present utility model;
fig. 2 is a schematic perspective view of a clamping mechanism for clamping an IC carrier in embodiment 1 of the present utility model;
FIG. 3 is a second schematic diagram of a clamping mechanism for IC carrier in embodiment 1 of the present utility model;
FIG. 4 is a schematic view of a clamping assembly according to embodiment 1 of the present utility model;
fig. 5 is a schematic structural diagram of a clamping mechanism for an IC carrier in embodiment 2 of the present utility model;
fig. 6 is a schematic perspective view of a clamping assembly in embodiment 2 of the present utility model;
FIG. 7 is a schematic view of the clamping assembly of embodiment 2 of the present utility model in an open state;
fig. 8 is a schematic view of the clamping assembly in embodiment 2 of the present utility model in a clamped state.
In the figure, 1, a main body; 11. a connecting disc; 111. a mounting hole; 12. a mounting plate; 2. a moving assembly; 2a, an accommodating space; 21. a second driving cylinder; 22. a fixing plate; 221. a plate body; 221a, a first inclined surface; 221b, a second inclined surface; 221c, a flat surface; 222. an extension; 3. a clamping assembly; 31. a first clamping part; 32. a second clamping portion; 321. an abutment block; 33. a first drive cylinder; 4. an optical fiber sensor; 5. a cross plate; 6. a fixed block; 7. a mounting base; 8. an IC carrier; x, a first direction; y, second direction.
Detailed Description
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the utility model and are not intended to limit the scope of the utility model, i.e., the utility model is not limited to the embodiments described.
In the description of the present utility model, it is to be noted that, unless otherwise indicated, the meaning of "plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like are merely used for convenience in describing the present utility model and to simplify the description, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model can be understood as appropriate by those of ordinary skill in the art.
For a better understanding of the present utility model, the present utility model is further described below with reference to the drawings and the embodiments:
in the process of manufacturing and transferring the IC carrier plates, the IC carrier plates are required to be sequentially transferred to a plurality of stations, the common IC carrier plate placing machine adopts the suction disc to absorb the IC carrier plates, and the IC carrier plates with different specifications are different in plate surface materials and hole opening conditions, so that the reserved absorption surfaces of the IC carrier plates with different specifications are different, at the moment, a suction disc structure matched with the reserved absorption surfaces of the IC carrier plates is required to be arranged, when the suction disc contacts with the surfaces of the IC carrier plates, a closed space is formed between the suction disc and the IC carrier plates, air in the closed space is pumped away to form negative pressure, the negative pressure is diffused to the absorption surfaces of the suction disc, so that an absorption force is generated between the absorption surfaces of the suction disc and the surfaces of the IC carrier plates, and the surfaces of the IC carrier plates are easy to leave marks when the IC carrier plates are absorbed by the suction disc, and then, the suction disc is required to ensure that the negative pressure is stable, and the IC carrier plates absorbed by the suction disc can drop when the conditions such as power failure or equipment failure occur, and the IC chip is caused to scatter.
Based on this, the inventor provides a clamping mechanism for an IC carrier board, which solves the technical problem.
Example 1
Referring to fig. 1 to 4, embodiment 1 of the present utility model provides a clamping mechanism for an IC carrier board, which includes a main body portion 1 disposed along a first direction X, two moving assemblies 2 disposed opposite to each other, and four clamping assemblies 3.
In this embodiment 1, two oppositely disposed moving assemblies 2 are disposed below the main body 1, more specifically, in this embodiment 1, a space between the two moving assemblies 2 forms a receiving space 2a, when the two moving assemblies 2 are close to each other along the first direction X, the size of the receiving space 2a becomes smaller, and when the two moving assemblies 2 are far away from each other along the first direction X, the size of the receiving space 2a becomes larger, and the size of the receiving space 2a can be adjusted by adjusting the distance between the two moving assemblies 2, so that the size of the receiving space 2a can be adjusted according to the size of the IC carrier 8, thereby matching IC carriers 8 of various specifications.
In this embodiment 1, two clamping assemblies 3 are disposed on one moving assembly 2, and the other two clamping assemblies 3 are disposed on the other moving assembly 2, so that when the moving assembly 2 moves, the clamping assemblies 3 can be driven to move along with the moving assembly, and the clamping assemblies 3 can be further moved to the periphery of the IC carrier 8.
More specifically, the clamp assembly 3 includes a first clamp portion 31, a second clamp portion 32, and a first drive cylinder 33, the first drive cylinder 33 driving the second clamp portion 32 to switch between a clamped position and an open position, the first clamp portion 31 and the second clamp portion 32 respectively abutting against upper and lower end surfaces of the IC carrier plate 8 when in the clamped position.
It should be noted that, in embodiment 1, the first direction X is a horizontal direction, and the second direction Y is a vertical direction.
When the two moving assemblies 2 in the clamping mechanism for the IC carrier are moved to the proper positions so that the size of the accommodating space 2a is larger than the size of the IC carrier 8, the extracting arm mechanism drives the clamping mechanism for the IC carrier to move downward by a certain distance as a whole, then the two moving assemblies 2 are close to each other so that the IC carrier 8 is positioned between the first clamping part 31 and the second clamping part 32, and then the second clamping part 32 is driven by the first driving cylinder 33 to move upwards along the second direction Y so as to be close to the first clamping part 31, so that the first clamping part 31 and the second clamping part 32 fix the IC carrier 8. The IC carrier plate 8 is taken by adopting the four clamping assemblies 3 in a hard clamping mode, the plate dropping rate can be effectively reduced, compared with a traditional sucking disc adsorption mode, the contact area with the IC carrier plate 8 can be reduced, the four clamping assemblies 3 can be sequentially connected to form a rectangular shape, the four clamping assemblies 3 can be clamped in the clampable area of the IC carrier plate 8, the surface quality of the IC carrier plate 8 is not affected, and compared with a common sucking disc structure, the clamping mechanism for the IC carrier plate provided by the utility model has fewer marks left on the surface of the IC carrier plate 8, the plate dropping stability is high, the plate dropping phenomenon can be effectively avoided, and the transportation quality of the IC carrier plate 8 is improved.
In embodiment 1, the main body 1 includes a land 11 and an attachment plate 12, the land 11 is attached to the middle portion of the upper end surface of the attachment plate 12, and the land 11 is provided with attachment holes 111 for connection to the arm mechanism, and the plurality of attachment holes 111 are distributed in a ring shape. More specifically, the mounting hole 111 is a threaded hole, and the extraction arm mechanism and the connecting disc 11 are fixedly connected by a fastener, wherein one end of the fastener is locked in the threaded hole, and when the IC carrier 8 needs to be clamped, the extraction arm mechanism pushes the IC carrier clamping mechanism to move in the second direction Y, so as to adjust the positional relationship between the IC carrier clamping mechanism and the IC carrier 8.
In the present embodiment, the moving assembly 2 includes the second driving cylinder 21 and the fixing plate 22 connected to the second driving cylinder 21, the fixing plate 22 and the mounting plate 12 are connected by the second driving cylinder 21, and the second driving cylinder 21 is disposed along the extending direction of the mounting plate 12.
More specifically, the fixing plate 22 includes a plate body 221 and an extension 222 formed by protruding outwardly from a middle portion of the plate body 221 along the first direction X, and gradually decreases in width from the middle portion to both ends of the plate body 221. The plate body 221 includes a first inclined surface 221a, a second inclined surface 221b, and a flat surface 221c, the first inclined surface 221a and the second inclined surface 221b are disposed opposite to each other, and the first inclined surface 221a and the second inclined surface 221b are disposed on a side of the flat surface 221c facing the main body 1, wherein an included angle between the first inclined surface 221a and the flat surface 221c is an acute angle, and an included angle between the second inclined surface 221b and the flat surface 221c is an acute angle. By such a design, the mounting firmness of the fixing plate 22 can be improved, and the weight of the fixing plate 22 can be reduced to the greatest extent.
In this embodiment 1, in the orthographic projection direction of the moving assembly 2, the projection centers of the four holding assemblies 3 are sequentially wired to form a rectangle. By means of the design, when the IC carrier plate 8 is clamped by the four clamping assemblies 3, the clamping positions of the four clamping assemblies are close to four corners of the IC carrier plate 8, stability of the IC carrier plate 8 in the moving process can be improved, and risks of damage to the surface of the IC carrier plate 8 can be reduced.
In this embodiment 1, in order to facilitate positioning of the IC carrier plate 8 and avoid occurrence of a push plate/damage plate phenomenon, in this embodiment 1, the four clamping assemblies 3 are each mounted with an optical fiber sensor 4, and the optical fiber sensors 4 can sense the IC carrier plate 8, so that sensing signals are fed back to the controller, and the first driving lever and the second driving cylinder 21 are controlled to stretch and retract by the controller.
In embodiment 1, the first driving cylinder 33 is a cylinder, and the second driving cylinder 21 is an electric cylinder.
Example 2
Referring to fig. 5 to 8, unlike embodiment 1, in the clamping mechanism for an IC carrier provided in embodiment 2, a first driving cylinder 33 is provided along a first direction X, a cross plate 5 is provided at an upper end of the first driving cylinder 33, the cross plate 5 is connected to a fixing plate 22, an output end of the first driving cylinder 33 is connected to a second clamping portion 32 through a fixing block 6, more specifically, in order to improve the mounting firmness of the second clamping portion 32, a mounting seat 7 is provided at a bottom of the fixing plate 22, and the second clamping portion 32 is movably mounted in the mounting seat 7.
In embodiment 2, the first driving cylinder 33 drives the second clamping portion 32 to rotate by a certain angle, and then the second clamping portion 32 is pressed against the lower end surface of the IC carrier plate 8, and the first clamping portion 31 abuts against the upper end surface of the IC carrier plate 8, so that the IC carrier plate 8 is fixed between the first clamping portion 31 and the second clamping portion 32.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
While the utility model has been described above with reference to the accompanying drawings, it will be apparent that the implementation of the utility model is not limited by the above manner, and it is within the scope of the utility model to apply the inventive concept and technical solution to other situations as long as various improvements made by the inventive concept and technical solution are adopted, or without any improvement.
Claims (10)
1. The utility model provides a fixture for IC support plate which characterized in that: comprising
A main body portion disposed along a first direction;
the two moving assemblies are oppositely arranged, the two moving assemblies are connected with the main body part, a containing space is formed between the two moving assemblies, the two moving assemblies can move relative to the main body part along a first direction, and the moving directions of the two moving assemblies are opposite to each other so as to adjust the size of the containing space;
four clamping assemblies, wherein two clamping assemblies are installed on one moving assembly, and the other two clamping assemblies are installed on the other moving assembly;
the clamping assembly comprises a first clamping part, a second clamping part and a first driving cylinder, wherein the first driving cylinder drives the second clamping part to switch between a clamping position and an opening position, and when the clamping assembly is in the clamping position, the first clamping part and the second clamping part are respectively abutted to the upper end face and the lower end face of the IC carrier plate.
2. The IC carrier clamping mechanism as set forth in claim 1, wherein: the first driving cylinder drives the second clamping part to move along a second direction to be close to or far away from the first clamping part so that the second clamping part is switched between a clamping position and an opening position, wherein the first direction and the second direction are perpendicular to each other.
3. The IC carrier clamping mechanism as set forth in claim 1, wherein: one end of the second clamping part is connected with the output end of the first driving cylinder, the other end of the second clamping part is provided with a cylindrical abutting block, the first driving cylinder drives the second clamping part to rotate, and after the second clamping part rotates for a certain angle, the abutting block is matched with the second clamping part to clamp the IC carrier plate.
4. The IC carrier clamping mechanism as set forth in claim 1, wherein: and in the orthographic projection direction of the moving assembly, the projection centers of the four clamping assemblies are sequentially connected to form a rectangle.
5. The IC carrier clamping mechanism as set forth in claim 1, wherein: the main part includes connection pad and mounting panel, the connection pad is installed the up end middle part position of mounting panel, just offer on the connection pad and be used for with draw arm mechanism connection's mounting hole, a plurality of the mounting hole is annular distribution.
6. The IC carrier clamping mechanism as recited in claim 5, wherein: the moving assembly comprises a second driving cylinder and a fixed plate connected with the second driving cylinder, wherein the fixed plate is connected with the mounting plate through the second driving cylinder, and the second driving cylinder is arranged along the extending direction of the mounting plate.
7. The IC carrier clamping mechanism as recited in claim 6, wherein: the fixing plate comprises a plate body and an extension part formed by protruding the middle part of the plate body outwards along a first direction, wherein the width of the plate body gradually decreases from the middle part to two ends.
8. The IC carrier clamping mechanism as recited in claim 7, wherein: the plate body comprises a first inclined surface, a second inclined surface and a flat surface, wherein the first inclined surface and the second inclined surface are oppositely arranged, the first inclined surface and the second inclined surface are arranged on one side of the flat surface facing the main body part, an included angle between the first inclined surface and the flat surface is an acute angle, and an included angle between the second inclined surface and the flat surface is an acute angle.
9. The IC carrier clamping mechanism as set forth in claim 1, wherein: the clamping assembly is provided with an optical fiber sensor, and the optical fiber sensor is used for sensing the IC carrier plate.
10. An IC carrier board placing machine comprising the clamping mechanism for IC carriers according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321457220.8U CN220131295U (en) | 2023-06-08 | 2023-06-08 | Clamping mechanism for IC carrier plate and IC carrier plate placing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321457220.8U CN220131295U (en) | 2023-06-08 | 2023-06-08 | Clamping mechanism for IC carrier plate and IC carrier plate placing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220131295U true CN220131295U (en) | 2023-12-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321457220.8U Active CN220131295U (en) | 2023-06-08 | 2023-06-08 | Clamping mechanism for IC carrier plate and IC carrier plate placing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220131295U (en) |
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2023
- 2023-06-08 CN CN202321457220.8U patent/CN220131295U/en active Active
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