CN204090325U - The automatic suction nozzle seat of a kind of chip mounter - Google Patents

The automatic suction nozzle seat of a kind of chip mounter Download PDF

Info

Publication number
CN204090325U
CN204090325U CN201420511981.1U CN201420511981U CN204090325U CN 204090325 U CN204090325 U CN 204090325U CN 201420511981 U CN201420511981 U CN 201420511981U CN 204090325 U CN204090325 U CN 204090325U
Authority
CN
China
Prior art keywords
suction nozzle
hole
chip mounter
cover plate
nozzle seat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420511981.1U
Other languages
Chinese (zh)
Inventor
冷晓勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201420511981.1U priority Critical patent/CN204090325U/en
Application granted granted Critical
Publication of CN204090325U publication Critical patent/CN204090325U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Abstract

The utility model relates to the automatic suction nozzle seat of a kind of chip mounter, it is for automatic clamping and placing suction nozzle, this suction nozzle comprises a nozzle head, the automatic suction nozzle seat of this chip mounter comprises the first cover plate, one baffle plate and the second cover plate, this barrier slides formula is arranged between the first cover plate and the second cover plate, on first cover plate and the second cover plate and baffle plate, array is provided with multiple first hole respectively, second hole and the 3rd hole, first hole, the position one_to_one corresponding of the second hole and the 3rd hole, 3rd hole comprises a large Huan Dong and a little ring hole, large Huan Dong and little ring hole have between the two occurs simultaneously and UNICOM is arranged.This suction nozzle seat is light and cheap, easily practical.

Description

The automatic suction nozzle seat of a kind of chip mounter
[technical field]
The utility model relates to chip mounter technical field, particularly relates to the automatic suction nozzle seat of a kind of chip mounter used on chip mounter.
[background technology]
In surface mount process, attachment process takes the tram of pcb board on by the suction nozzle of mounting head end by various components and parts by chip mounter, can according to the suction nozzle needing replacing different size in actual production.When changing suction nozzle, needing temporary transient no suction nozzle manually to take off from mounting head end, being then placed on and depositing in the suction nozzle seat of suction nozzle.
Existing suction nozzle seat only can reach the function depositing suction nozzle, and is needed manually to come manually to complete from the action that mounting head end is taken off by suction nozzle.In addition, existing suction nozzle holder structure complexity is heavy again, and base is unstable, and expensive.
[utility model content]
For overcoming many difficult problems of existing chip mounter, the utility model provides the automatic suction nozzle seat of a kind of novel chip mounter.
The scheme of the utility model technical solution problem is to provide the automatic suction nozzle seat of a kind of chip mounter, it is for automatic clamping and placing suction nozzle, this suction nozzle comprises a nozzle head, the automatic suction nozzle seat of this chip mounter comprises the first cover plate, one baffle plate and the second cover plate, this barrier slides formula is arranged between the first cover plate and the second cover plate, on first cover plate and the second cover plate and baffle plate, array is provided with multiple first hole respectively, second hole and the 3rd hole, first hole, the position one_to_one corresponding of the second hole and the 3rd hole, 3rd hole comprises a large Huan Dong and a little ring hole, large Huan Dong and little ring hole have between the two occurs simultaneously and UNICOM is arranged.
Preferably, the automatic suction nozzle seat of this chip mounter comprises a contiguous block and a cylinder further, and cylinder is connected with contiguous block, is fixedly connected with between contiguous block with baffle plate.
Preferably, large ring hole is arranged towards the direction of contiguous block, and little ring hole deviates from contiguous block direction and arranges.
Preferably, the size in the first hole and large ring hole is greater than the size of the maximum cross section of suction nozzle, and the size in little ring hole is less than the size of the maximum cross section of suction nozzle.
Preferably, the second hole mates with nozzle head size.
Preferably, the second hole is inverted "convex" shape.
Preferably, the bottom size of this second hole is less than top dimension, and mate with nozzle head size bottom this second hole, its top dimension is greater than the size of the maximum cross section of suction nozzle.
Preferably, the height of the second hole is greater than the height of maximum cross section to nozzle head of suction nozzle.
Preferably, the second cover plate comprises the groove that has one fixed width, and this groove is positioned in the middle part of the second cover plate, and baffle plate to be embedded in this groove and to be consistent with the width of groove, baffle plate in this groove slidably.
Preferably, the automatic suction nozzle seat of this chip mounter comprises two identical wooden support frame.
Compared with prior art, the utility model chip mounter can substitute with automatic suction nozzle seat and be taken off by the mounting head end of suction nozzle from chip mounter manually, when needing the suction nozzle changed on a head of mounting head, mounting head overall operation to this chip mounter with head corresponding for suction nozzle being run downwards above automatic suction nozzle seat, at this moment move downward together with suction nozzle until ring body is corresponding with the second hole with nozzle head, drive baffle plate to carry out side-to-side movement together by the side-to-side movement of air cylinder driven contiguous block simultaneously, make the thin bar of suction nozzle switching position between the little Huan Dong of the 3rd hole and large ring hole, when thin bar is positioned at little ring hole, the head of mounting head is up walked, because suction nozzle is fixed so it can be separated automatically with mounting head, do not need when the end of such mounting head is separated with suction nozzle manually to have come.This chip mounter base area of the bracing frame of automatic suction nozzle seat is greater than the joint face of itself and frame body, it is more stable when the large area design of this base makes chip mounter be positioned on ground with automatic suction nozzle seat, this bracing frame adopts wood material, so lighter and cheap.This chip mounter can be arranged to varying in size of two-part first hole in left and right, the second hole and the 3rd hole with the cover plate of automatic suction nozzle seat and proportional in some variant, makes the suction nozzle that the automatic suction nozzle seat configurable size of this chip mounter is different.
[accompanying drawing explanation]
Fig. 1 is the stereogram of the utility model chip mounter with automatic suction nozzle seat.
Fig. 2 is the detonation configuration schematic diagram of the utility model chip mounter with automatic suction nozzle seat.
Fig. 3 is the mounting head schematic diagram of chip mounter.
Fig. 4 is the suction nozzle stereogram that the utility model chip mounter is deposited with automatic suction nozzle seat.
[embodiment]
In order to reach the purpose of this utility model, technical scheme and advantage clearly being understood, below in conjunction with accompanying drawing and embodiment, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, the automatic suction nozzle seat 1 of this chip mounter comprises cover plate 11, contiguous block 13, cylinder 15 bracing frame 17 identical with two.Cover plate 11 place plane orthogonal is in bracing frame 17 and cover plate 11 is positioned on bracing frame 17 body, contiguous block 13 is positioned at the right side of cover plate 11 (in all embodiments, the position determiners such as upper and lower, left and right are only limitted to the relative position in given view, but not absolute position), cylinder 15 is positioned at below the cover plate 11 and outside of close bracing frame 17.Cover plate 11 places suction nozzle 10 for array.
Refer to Fig. 2, cover plate 11 comprises the first cover plate 111, second cover plate 112 and baffle plate 113.Second cover plate 112 is between the first cover plate 111 and bracing frame 17, and the first cover plate 111 is identical with the second cover plate 112 size and corresponding up and down, baffle plate 113 be positioned at this between the two and can relatively both horizontally slip.
The first hole 1111, first hole 1111 size that first cover plate 111 comprises several array arrangements is greater than the size of the maximum cross section of suction nozzle 10; Second cover plate 112 comprises the groove 1123 that has one fixed width, and this groove 1123 is positioned in the middle part of the second cover plate 112, and the edge of the second hole 1121, first cover plate 111 and the second cover plate 112 that arrange several array arrangements in it is provided with several screw holes; Screw hole position one_to_one corresponding on screw hole on first cover plate 111 and the second cover plate 112, and twist between the two and be connected to screw (not shown), the first cover plate 111 and the second cover plate 112 are fixed by it.
Baffle plate 113 comprises several the 3rd holes 1131, the side of the 3rd hole 1131 is provided with several screw holes, be consistent with the width of groove 1123 in the groove 1123 that baffle plate 113 is embedded in the second cover plate 112, it can horizontally slip in this groove 1123, and its side being provided with screw hole is connected with contiguous block 13 outside groove 1123.First hole 1111, second hole 1121 and the 3rd hole 1131 position one_to_one corresponding, wherein the second hole 1121 is in inverted "convex" shape, its bottom size is less, top dimension is larger, this second hole 1121 mates with suction nozzle 10 suction device end size, its top dimension is greater than the size of the maximum cross section of suction nozzle 10, the height of the second hole 1121 is greater than the height of maximum cross section to suction device end of suction nozzle 10, 3rd hole 1131 comprises little ring hole 141 and large ring hole 142, large ring hole 142 is arranged towards the direction of contiguous block 13, little ring hole 141 deviates from contiguous block 13 direction and arranges, little ring hole 141 and large ring hole 142 are between the two by occur simultaneously and left and right UNICOM forms the 3rd hole 1131 jointly, the size in large ring hole 142 is greater than the size of the maximum cross section of suction nozzle 10, the size in little ring hole 141 is less than the size of the maximum cross section of suction nozzle 10, the radius ratio in little ring hole 141 and large ring hole 142 is between 1:(1.2 ~ 3) between, it is determined according to the size of the suction nozzle 10 of required setting, the concrete shape of the second hole 1121 is determined by the concrete structure of suction nozzle 10.
Contiguous block 13 there are several screw holes, the screw hole one_to_one corresponding on itself and baffle plate 113, and have screw to fix the connection of contiguous block 13 and baffle plate 113 between the two.
Cylinder 15 is double-acting cylinder, and it to be fixed on below cover plate 11 and to be connected with contiguous block 13.Compressed-air actuated pressure energy is converted to mechanical energy by cylinder 15, and contiguous block 13 can be driven to do bilateral reciprocation.
Bracing frame 17 comprises frame body 171 and base 172, and frame body 171 is positioned on base 172, and both are integrally connected.Respectively some is exposed at outside the coupled joint face (not shown) of frame body 171 in the both sides of base 172, namely the area of base 172 is greater than the area of the joint face of itself and frame body 171, more stable when the large area design of this base 172 makes chip mounter be positioned on ground with automatic suction nozzle seat 1.This bracing frame 17 is wood material, makes it lighter and cheap relative to metal material.
Please refer to Fig. 3 and Fig. 4, the mounting head 20 of chip mounter comprises multiple head 201 that can run up and down respectively, the the picking and placeing of suction nozzle 10 be connected at first on one of them head 201 for one is described, the special suction nozzle 10 of this head 201 comprises installed part 101 from top to bottom successively, jacket casing 102, thin bar 103, ring body 104 and nozzle head 105, nozzle head 105 is the suction device end of suction nozzle 10, ring body 104 place cross section is maximum, the size of thin bar 103 is less than the size of ring body 104, the size of thin bar 103 is less than the size in the little ring hole 141 of the 3rd hole 1131, the size of this ring body 104 is greater than the size in the little ring hole 141 of the 3rd hole 1131 and is less than the diameter in large ring hole 142, installed part 101 is connected to the end of mounting head 20.When chip mounter is in non-operating state with automatic suction nozzle seat 1, cylinder 15 is in loosening state, the large ring hole 142 of the 3rd hole 1131 is just corresponding with the first hole 1111 and the second hole 1121, when suction nozzle 10 need to take off from mounting head 20 be put into chip mounter with on automatic suction nozzle seat 1 time, mounting head 20 is transported to the first hole 1111 place on cover plate 11 suction nozzle 10 and moves straight down, size due to the large ring hole 142 of the first hole 1111 and the 3rd hole 1131 is all greater than the size of the maximum cross section of suction nozzle 10, namely this both size is greater than the size of ring body 104, second hole 1121 mates with the size of suction nozzle 10 suction device end, the height of the second hole 1121 is greater than the height of maximum cross section to suction device end of suction nozzle 10, therefore the nozzle head 105 of suction nozzle 10 is arranged in the thinner position of the second hole 1121, its ring body 104 is arranged in the thicker position of the second hole 1121, its thin bar 103 is positioned at the large ring hole 142 of the 3rd hole 1131, its jacket casing 102 is positioned at the first hole 1111, before mounting head 20 will depart from the installed part 101 of suction nozzle 10, the while that cylinder 15 driving contiguous block 13 to move right, contiguous block 13 drives baffle plate 113 to move right, at this moment the thin bar 103 of suction nozzle 10 is positioned at the little ring hole 141 of the 3rd hole 1131, when mounting head 20 moves straight up, below ring body 104 is locked in by little ring hole 141, suction nozzle 10 is fixed on chip mounter with in automatic suction nozzle seat 1, it can not move upward together with mounting head 20, mounting head 20 is separated automatically with suction nozzle 10.After mounting head 20 departs from suction nozzle 10, cylinder 15 loosens, contiguous block 13 drives baffle plate 113 to left movement to left movement simultaneously, at this moment the thin bar 103 of suction nozzle 10 is positioned at the large ring hole 142 of the 3rd hole 1131, it is not fixed with in automatic suction nozzle seat 1 at chip mounter, when needs take out this suction nozzle 10, move straight up again after being close to it after installed part 101 place that mounting head 20 moves to suction nozzle 10 moves downward, suction nozzle 10 by mounting head 20 from chip mounter taking-up in automatic suction nozzle seat 1.Putting into and taking out of suction nozzle 10 is all drive baffle plate 113 side-to-side movement by the driving of cylinder 15, and whole process does not need manually to have come, and brings convenience to production.
This chip mounter cover plate 11 of automatic suction nozzle seat 1 also can be divided into two parts as required, wherein a part of the first hole 1111, second hole 1121 relative to another part and the 3rd hole 1131 zoom in or out a circle all in proportion, make the suction nozzle that automatic suction nozzle seat 1 configurable size of this chip mounter is different like this, it can also arrange multiple region, is used for placing the suction nozzle of different model.
Compared with prior art, the utility model chip mounter can substitute with automatic suction nozzle seat 1 and be taken off by mounting head 20 end of suction nozzle 10 from chip mounter manually, when needing the suction nozzle 10 changed on a head 201 of mounting head 20, mounting head 20 overall operation to this chip mounter with above automatic suction nozzle seat 1 head 201 of suction nozzle 10 correspondence being run downwards, at this moment move downward together with suction nozzle 10 until ring body 104 and nozzle head 105 corresponding with the second hole 1121, drive contiguous block 13 side-to-side movement to drive baffle plate 113 to carry out side-to-side movement together by cylinder 15 simultaneously, make the thin bar 103 of suction nozzle 10 switching position between the little ring hole 141 of the 3rd hole 1131 and large ring hole 142, when thin bar 103 is positioned at little ring hole 141, the head 201 of mounting head 20 is up walked, because suction nozzle 10 is fixed so it can be separated automatically with mounting head 20, the end of such mounting head 20 does not need manually to have come when being separated with suction nozzle 10.This chip mounter base 172 area of the bracing frame 17 of automatic suction nozzle seat 1 is greater than the joint face of itself and frame body 171, it is more stable when the large area design of this base 172 makes chip mounter be positioned on ground with automatic suction nozzle seat 1, this bracing frame 17 adopts wood material, so lighter and cheap.This chip mounter can be arranged to varying in size of two-part first hole 1111, second hole 1121 in left and right and the 3rd hole 1131 with the cover plate 11 of automatic suction nozzle seat 1 and proportional in some variant, makes the suction nozzle that automatic suction nozzle seat 1 configurable size of this chip mounter is different.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all any amendments done within principle of the present utility model, equivalent replacement and improvement etc. all should comprise within protection range of the present utility model.

Claims (10)

1. the automatic suction nozzle seat of chip mounter, it is for automatic clamping and placing suction nozzle, this suction nozzle comprises a nozzle head, it is characterized in that: the automatic suction nozzle seat of this chip mounter comprises the first cover plate, one baffle plate and the second cover plate, this barrier slides formula is arranged between the first cover plate and the second cover plate, on first cover plate and the second cover plate and baffle plate, array is provided with multiple first hole respectively, second hole and the 3rd hole, first hole, the position one_to_one corresponding of the second hole and the 3rd hole, 3rd hole comprises a large Huan Dong and a little ring hole, large Huan Dong and little ring hole have between the two occurs simultaneously and UNICOM is arranged.
2. the automatic suction nozzle seat of chip mounter as claimed in claim 1, is characterized in that: the automatic suction nozzle seat of this chip mounter comprises a contiguous block and a cylinder further, and cylinder is connected with contiguous block, is fixedly connected with between contiguous block with baffle plate.
3. the automatic suction nozzle seat of chip mounter as claimed in claim 2, is characterized in that: large ring hole is arranged towards the direction of contiguous block, and little ring hole deviates from contiguous block direction and arranges.
4. the automatic suction nozzle seat of chip mounter as claimed in claim 1, it is characterized in that: the size in the first hole and large ring hole is greater than the size of the maximum cross section of suction nozzle, the size in little ring hole is less than the size of the maximum cross section of suction nozzle.
5. the automatic suction nozzle seat of chip mounter as claimed in claim 1, is characterized in that: the second hole mates with nozzle head size.
6. the automatic suction nozzle seat of chip mounter as claimed in claim 1, is characterized in that: the second hole is inverted "convex" shape.
7. the automatic suction nozzle seat of chip mounter as claimed in claim 6, it is characterized in that: the bottom size of this second hole is less than top dimension, mate with nozzle head size bottom this second hole, its top dimension is greater than the size of the maximum cross section of suction nozzle.
8. the automatic suction nozzle seat of chip mounter as claimed in claim 1, is characterized in that: the height of the second hole is greater than the height of maximum cross section to nozzle head of suction nozzle.
9. the automatic suction nozzle seat of chip mounter as claimed in claim 1, it is characterized in that: the second cover plate comprises the groove that has one fixed width, this groove is positioned in the middle part of the second cover plate, and baffle plate to be embedded in this groove and to be consistent with the width of groove, baffle plate in this groove slidably.
10. the automatic suction nozzle seat of chip mounter as claimed in claim 1, is characterized in that: the automatic suction nozzle seat of this chip mounter comprises two identical wooden support frame.
CN201420511981.1U 2014-09-05 2014-09-05 The automatic suction nozzle seat of a kind of chip mounter Expired - Fee Related CN204090325U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420511981.1U CN204090325U (en) 2014-09-05 2014-09-05 The automatic suction nozzle seat of a kind of chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420511981.1U CN204090325U (en) 2014-09-05 2014-09-05 The automatic suction nozzle seat of a kind of chip mounter

Publications (1)

Publication Number Publication Date
CN204090325U true CN204090325U (en) 2015-01-07

Family

ID=52182988

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420511981.1U Expired - Fee Related CN204090325U (en) 2014-09-05 2014-09-05 The automatic suction nozzle seat of a kind of chip mounter

Country Status (1)

Country Link
CN (1) CN204090325U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108312725A (en) * 2018-05-08 2018-07-24 广上科技(广州)有限公司 A kind of PCB ink gets mouth and its automatically dotting device ready
CN110817406A (en) * 2019-11-06 2020-02-21 昆山中新捷信自动化设备科技有限公司 Operation method of automatic material transferring mechanism

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108312725A (en) * 2018-05-08 2018-07-24 广上科技(广州)有限公司 A kind of PCB ink gets mouth and its automatically dotting device ready
CN110817406A (en) * 2019-11-06 2020-02-21 昆山中新捷信自动化设备科技有限公司 Operation method of automatic material transferring mechanism
CN110817406B (en) * 2019-11-06 2021-02-02 昆山中新捷信自动化设备科技有限公司 Operation method of automatic material transferring mechanism

Similar Documents

Publication Publication Date Title
CN103258939B (en) LED module packaging automation complete set of equipments
CN203260626U (en) Novel automation complete equipment for LED module group packaging
CN202587619U (en) LED mounting processing device adopting vibrating feeding mode
CN204642237U (en) A kind of carrier module
CN204090325U (en) The automatic suction nozzle seat of a kind of chip mounter
US10538954B2 (en) External inflator
CN207094549U (en) A kind of LED light source board visual-alignment assembling device
CN205716256U (en) A kind of LED module debugging mechanism
CN205968033U (en) Disk gasket feed mechanism of diaphragm solenoid valve kludge
CN211637127U (en) Dispensing machine and magnetic fixing jig
CN203753966U (en) Suction device
CN203364008U (en) Light guiding plate assembly installing system for LED backlight source
CN203556793U (en) Multi-functional wax injection nozzle regulating device
CN203887790U (en) Pluggable tube punch machine
CN215548929U (en) High frequency printed circuit board cutting device
CN202828874U (en) End product automatic collection device
CN202551512U (en) Synchronous operation structure of feeder and mounting head of chip mounter
CN206690360U (en) A kind of new silicon rod adhesive tool
CN105107677A (en) Combined jig for magnetic circuit systems of loudspeakers
CN203681000U (en) Automatic waste discharge device
CN205057436U (en) Locating pin assembly machine
CN204887736U (en) Feeding platform of communication electronics board chip mounter and suction nozzle thereof
CN203549310U (en) Sucking mechanism capable of automatically adjusting positions
CN203652756U (en) Emptying mechanism
CN207613304U (en) A kind of mould bases and a kind of zipper strip gluing sheet mechanism

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Fei Pusi Science and Technology Ltd. of Shenzhen

Assignor: Leng Xiaoyong

Contract record no.: 2015440020056

Denomination of utility model: Automatic suction nozzle seat for chip mounter

Granted publication date: 20150107

License type: Exclusive License

Record date: 20150226

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150107

Termination date: 20180905

CF01 Termination of patent right due to non-payment of annual fee