CN111446180A

CN111446180A - Semiconductor packaging detection equipment

Info

Publication number: CN111446180A
Application number: CN202010354349.0A
Authority: CN
Inventors: 邓胜万
Original assignee: Shaanxi Hasfu Trading Co ltd
Current assignee: Shaanxi Hasfu Trading Co ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2020-07-24

Abstract

The invention discloses a semiconductor packaging detection device, which structurally comprises a detection host, a display screen, a warning lamp, a support table, a box door and a placement mechanism, wherein the display screen is embedded on the front surface of the detection host and is electrically connected, the warning lamp is arranged at the top of the detection host and is electrically connected, the top of a diode is inserted into a placement groove in an inverted manner, a squeezing plate is squeezed by the top of the diode, plate bodies on two sides tightly adhere to the top surface of the diode at the moment, the tops of the diodes with different sizes can be clamped, the pin detection position of the diode is ensured to be vertical to a detection head in the detection host, the detection position is prevented from being deviated, each sliding frame is ensured to be stopped when being positioned under the detection head in the detection host through the clamping action of a clamping block, then a push rod is used for pushing a top plate to move, so that the pin position detected by the diode is adhered to the detection, the accuracy of the detection data is improved.

Description

Semiconductor packaging detection equipment

Technical Field

The invention relates to the field of semiconductors, in particular to a semiconductor package detection device.

Background

The diode is the device that adopts the semiconductor to make, the encapsulation form of diode is pin insertion type, the diode encapsulates the back, need detect pin department, detect its positive, reverse resistance value, whether can carry out the circular telegram, thereby detect whether diode damages, but need overturn the diode when detecting pin department to the diode, make the pin of lower extreme be in the top, because the diode upper end is spherical structure, when the diode enters into the check out test set inside, the spherical structure of diode is difficult to vertically place, cause the diode to take place the slope, and the area of pin junction is less, at this moment, the detection head detects the position to the diode and takes place the skew easily, it is inaccurate to appear detecting data, cause to detect and appear the mistake.

Disclosure of Invention

The technical scheme adopted by the invention for realizing the technical purpose is as follows: this semiconductor package check out test set, its structure is including detecting host computer, display screen, warning light, brace table, chamber door, placement machine, it has the display screen and the electricity is connected to detect the host computer front surface, the warning light is installed and is being detected the host computer top and the electricity is connected, detect host computer bottom fixed mounting at brace table upper surface, the brace table front surface is equipped with the chamber door, placement machine installs at brace table upper surface to placement machine is located and detects the host computer below, placement machine includes slide mechanism, transport mechanism bottom surface fixed mounting is at brace table upper surface, slide mechanism adopts clearance fit to install inside transport mechanism, slide mechanism is located and detects the host computer below.

As a further improvement of the invention, the sliding mechanism comprises a sliding frame, an adjusting clamping mechanism and a connecting rod, wherein the sliding frame is arranged in the conveying mechanism in a clearance fit manner, the adjusting clamping mechanism is arranged at the middle end in the sliding frame in a clearance fit manner, the connecting rod is arranged on the left side surface of the sliding frame, a groove is further formed in the right side of the sliding frame, and the groove of the sliding frame is in clearance fit with the conveying mechanism.

As a further improvement of the invention, the sliding frame comprises a frame body, a convex block, lifting grooves and fixed polish rods, wherein a connecting rod is arranged on the left side surface of the frame body, the lifting grooves are embedded in the middle end of the frame body, the convex block is arranged between the frame body and the lifting grooves, the lower ends of the fixed polish rods are fixedly arranged in the lifting grooves, adjusting and clamping mechanisms are arranged in the lifting grooves, two convex blocks are arranged and respectively arranged on the left side and the right side between the frame body and the lifting grooves, and four fixed polish rods are arranged and are of a cylindrical structure and arranged at four corners in the lifting grooves.

The invention further improves the structure, the adjusting and clamping mechanism comprises a lifting block, a placing groove, an extrusion plate, a telescopic pipe, an air pressure conduction pipe and a clamping plate, the lifting block is installed inside the sliding frame, the placing groove is embedded in the middle of the lifting block, the extrusion plate is arranged at the bottom of the inner side of the placing groove, the lower end of the extrusion plate is fixed with the top of the telescopic pipe, the lower end of the telescopic pipe is communicated with the lower end of the air pressure conduction pipe, the output end of the air pressure conduction pipe is fixed with the clamping plate, the clamping plate is installed on the inner wall of the upper end of the placing groove in a clearance fit mode, the lower end of the placing groove is of a cavity hemispheroid structure, the extrusion plate is of an arc plate structure, the telescopic pipe is made of rubber and is of a corrugated structure, and the air pressure conduction pipe and the.

As a further improvement of the invention, the clamping plate comprises a connecting block, a plate body and particles, wherein the left side of the connecting block is fixed with the output end of the air pressure conduction pipe, the right end of the connecting block is fixed with the left side surface of the plate body, the particles are embedded on the right side surface of the plate body, the connecting block is arranged on the inner wall of the upper end of the placing groove in a clearance fit manner, the plate body is of an arc plate structure, the particles are made of rubber materials and are uniformly arranged on the right side surface of the plate body.

As a further improvement of the invention, the conveying mechanism comprises a guide groove, a slide rod, a pushing mechanism and an upward pushing mechanism, the slide rod is arranged on the inner side surface of the right end of the guide groove, the pushing mechanism is arranged inside the left end of the guide groove, the upward pushing mechanism is arranged inside the middle end of the guide groove, the guide groove is of a groove-shaped structure, and the upward pushing mechanism is positioned right below the detection head inside the detection host.

As a further improvement of the invention, the pushing mechanism comprises a slide rail, two magnetic blocks, a slide block and clamping blocks, the slide rail is arranged inside the left end, the two magnetic blocks are respectively arranged at the head end and the tail end of the slide rail, the magnetic blocks are magnetically adsorbed with the slide block, the slide block is slidably arranged inside the slide rail, the clamping blocks are arranged on the inner wall of the slide rail, the magnetic blocks are in a permanent magnet structure and are connected and controlled by a detection host, the slide block is made of iron, the clamping blocks are totally twenty, the two clamping blocks are in a group and are symmetrically arranged on the inner walls of the upper side and the lower side of the slide rail.

As a further improvement of the invention, the jacking mechanism comprises a push rod, a top plate, clamping rods, guide rods and a sliding frame, wherein the top end of the push rod is fixed with the middle end of the bottom surface of the top plate, the clamping rods are arranged on the upper surface of the top plate, the guide rods are fixedly arranged on the left side of the top plate, the guide rods are arranged in the sliding frame in a clearance fit manner, four guide rods and four sliding frames are arranged and are respectively arranged at four corners of the top plate, and two clamping rods are arranged and are symmetrically arranged on the upper surface of the clamping rods in a left-right manner.

The invention has the beneficial effects that:

1. inside inserting the top of diode upside down and getting into the standing groove, the top of diode extrudees the stripper plate, carry out the atmospheric pressure conduction when at this moment flexible pipe contracts, atmospheric pressure conduction pipe through both sides is ejecting with the connecting block, the plate body of at this moment both sides closely laminates to the top surface of diode, can press from both sides tightly the diode top of equidimension not, ensure that the diode keeps vertical direction, ensure that the pin detection position of diode keeps vertical with the inside detection head of detection host computer, prevent that the detection position from taking place the skew.

2. Switch on through the magnetic path and make the magnetic path carry out magnetic adsorption at the slider, make the slider slide in the slide rail is inside, screens effect through the screens piece, guarantee that every sliding frame pauses when being in under the inside detection head of detection host computer, promote the roof through the push rod and remove after that, at this moment, adjust the inside diode of screens mechanism and carry out vertical steady promotion, make the pin department that the diode detected laminate with the inside detection head of detection host computer, ensure that the pin junction of diode carries out in close contact with the detection head, improve the accuracy of detection data.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor package inspection apparatus according to the present invention.

Fig. 2 is a schematic perspective view of a placement mechanism according to the present invention.

Fig. 3 is a schematic top view of a sliding mechanism according to the present invention.

Fig. 4 is a schematic perspective view of a sliding frame according to the present invention.

Fig. 5 is a schematic cross-sectional internal structure diagram of an adjusting detent mechanism according to the present invention.

Fig. 6 is a schematic perspective view of a splint according to the present invention.

Fig. 7 is a schematic cross-sectional view of a transfer mechanism according to the present invention.

Fig. 8 is a partial internal structure diagram of a pushing mechanism according to the present invention.

Fig. 9 is a schematic perspective view of a mechanism for lifting a roof according to the present invention.

In the figure: the device comprises a detection host machine-1, a display screen-2, a warning lamp-3, a support table-4, a box door-5, a placement mechanism-6, a sliding mechanism-61, a transmission mechanism-62, a sliding frame-611, an adjusting clamping mechanism-612, a connecting rod-613, a frame body-11 a, a bump-11 b, a lifting groove-11 c, a fixed polished rod-11 d, a lifting block-12 a, a placement groove-12 b, a squeezing plate-12 c, a telescopic pipe-12 d, an air pressure conduction pipe-12 e, a clamping plate-12 f, a connecting block-f 1, a plate body-f 2, particles-f 3, a guide groove-621, a sliding rod-622, a pushing mechanism-623, an upward pushing mechanism-624, a sliding rail-23 a, a magnetic block-23 b, a sliding block-23 c, a sliding block-, A clamping block-23 d, a push rod-24 a, a top plate-24 b, a clamping rod-24 c, a guide rod-24 d and a sliding frame-24 e.

Detailed Description

The invention is further described below with reference to the accompanying drawings:

example 1:

as shown in figures 1 to 6:

the invention discloses semiconductor packaging detection equipment which structurally comprises a detection host 1, a display screen 2, a warning lamp 3, a support table 4, a box door 5 and a placement mechanism 6, wherein the display screen 2 is embedded on the front surface of the detection host 1 and is electrically connected with the front surface of the detection host 1, the warning lamp 3 is installed at the top of the detection host 1 and is electrically connected with the top surface of the detection host 1, the bottom of the detection host 1 is fixedly installed on the upper surface of the support table 4, the box door 5 is arranged on the front surface of the support table 4, the placement mechanism 6 is installed on the upper surface of the support table 4, the placement mechanism 6 is located below the detection host 1, the placement mechanism 6 comprises a sliding mechanism 61 and a conveying mechanism 62, the bottom surface of the conveying mechanism 62 is fixedly installed on the upper surface of the support table 4, the sliding mechanism.

The sliding mechanism 61 includes a sliding frame 611, an adjusting detent mechanism 612, and a connecting rod 613, the sliding frame 611 is installed inside the conveying mechanism 62 in a clearance fit manner, the adjusting detent mechanism 612 is installed at the middle end inside the sliding frame 611 in a clearance fit manner, the connecting rod 613 is disposed on the left side surface of the sliding frame 611, a groove is further disposed on the right side of the sliding frame 611, and the groove of the sliding frame 611 and the conveying mechanism 62 are in a clearance fit manner, which is beneficial for the sliding frame 611 to slide smoothly on the conveying mechanism 62.

Wherein, the sliding frame 611 includes framework 11a, lug 11b, lift groove 11c, fixed polished rod 11d, framework 11a left side surface is equipped with connecting rod 613, lift groove 11c has been inlayed to the middle-end of framework 11a, lug 11b is established between framework 11a and lift groove 11c, fixed polished rod 11d lower extreme fixed mounting is inside lift groove 11c, lift groove 11c internally mounted has regulation screens mechanism 612, lug 11b is equipped with two, establishes the left and right sides between framework 11a and lift groove 11c respectively, fixed polished rod 11d is equipped with four, is the cylinder structure, establishes the inside four corners in lift groove 11c, does benefit to and makes regulation screens mechanism 612 carry out steady lift inside lift in lift groove 11 c.

Wherein, the adjusting and clamping mechanism 612 comprises a lifting block 12a, a placing groove 12b, an extrusion plate 12c, an extension tube 12d, an air pressure conduction tube 12e and a clamping plate 12f, the lifting block 12a is installed inside the sliding frame 611, the placing groove 12b is embedded in the middle of the lifting block 12a, the extrusion plate 12c is arranged at the bottom of the inner side of the placing groove 12b, the lower end of the extrusion plate 12c is fixed with the top of the extension tube 12d, the lower end of the extension tube 12d is communicated with the lower end of the air pressure conduction tube 12e, the output end of the air pressure conduction tube 12e is fixed with the clamping plate 12f, the clamping plate 12f is installed on the inner wall of the upper end of the placing groove 12b in a clearance fit manner, the lower end of the placing groove 12b is of a cavity hemisphere structure, which is beneficial to placing the top of the diode, the extrusion plate 12c is of an arc plate, make the stripper plate 12c steadily descend, flexible pipe 12d adopts the rubber material to be the fold type structure, do benefit to and make flexible pipe 12d carry out the atmospheric pressure conduction when stretching out and drawing back, atmospheric pressure conduction pipe 12e and splint 12f all are equipped with two to be bilateral symmetry structure for the center with standing groove 12b, do benefit to and press from both sides tightly the top both sides of diode.

Wherein, splint 12f includes connecting block f1, plate body f2, granule f3, connecting block f1 left side is fixed with atmospheric pressure conduction pipe 12e output, connecting block f1 right-hand member is fixed mutually with plate body f2 left side surface, granule f3 has been inlayed to plate body f2 right side surface, connecting block f1 adopts clearance fit to install at standing groove 12b upper end inner wall, plate body f2 is the arc board structure, granule f3 adopts the rubber material to be equipped with a plurality of, evenly establish at plate body f2 right side surface, do benefit to plate body f2 and carry out the in-process of closely laminating to the top of diode, can not cause the extrusion excessively to the diode outside, protect the diode surface.

The specific use mode and function of the embodiment are as follows:

in the invention, the top of the diode is inserted into the placing groove 12b in an inverted manner, the extrusion plate 12c is extruded by the top of the diode, the extension tube 12d contracts and conducts air pressure, the connecting block f1 is ejected out through the air pressure conducting tubes 12e on two sides, the top surfaces of the diode are tightly attached by the plate bodies f2 on two sides, the rubber material of the particles f3 ensures that the top surfaces of the diode are not excessively extruded, the tops of the diodes with different sizes can be clamped, the diode is ensured to keep the vertical direction, the diode is conveyed into the detection host 1 through the conveying mechanism 62, the lifting block 12a is ejected upwards through the ejecting mechanism 624 on the conveying mechanism 62, the lifting block 12a is stably lifted through the guiding action of the bump 11b and the fixed polished rod 11d, and the pin detection position of the diode is ensured to be kept vertical to the detection head in the detection host 1, the detection position is prevented from being displaced.

Example 2:

as shown in fig. 7 to 8:

wherein, transport mechanism 62 includes guide way 621, slide bar 622, pushing mechanism 623, goes up top mechanism 624, the inboard surface of guide way 621 right-hand member is equipped with slide bar 622, the inside pushing mechanism 623 that is equipped with of guide way 621 left end, it installs inside the middle-end in the guide way 621 to go up top mechanism 624, guide way 621 is fluted body structure, does benefit to and places sliding frame 611, it is located and detects the inside head under that detects of host computer 1 to go up top mechanism 624, does benefit to make and goes up top mechanism 624 to promote the vertical direction of detecting the head of diode and remove.

Wherein, the pushing mechanism 623 comprises a slide rail 23a, a magnetic block 23b, a slide block 23c and a clamping block 23d, the slide rail 23a is arranged in the left end, the two magnetic blocks 23b are arranged in total and are respectively arranged at the head end and the tail end of the slide rail 23a, the magnetic block 23b and the sliding block 23c are magnetically attracted, the sliding block 23c is slidably mounted inside the sliding rail 23a, the clamping block 23d is arranged on the inner wall of the slide rail 23a, the magnetic block 23b adopts a permanent magnet structure, and the detection host machine 1 is used for connection control, the sliding block 23c is made of iron, so that the magnetic block 23b can perform magnetic adsorption on the sliding block 23c, the clamping blocks 23d are arranged in twenty, two are a group, and are symmetrically arranged on the inner walls of the upper side and the lower side of the sliding rail 23a from top to bottom, so that the ten sliding frames 611 are clamped in a sliding manner, and the sliding frames 611 are ensured to be positioned under the internal detection head of the detection host 1.

Wherein, it includes push rod 24a, roof 24b, kelly 24c, guide bar 24d, smooth frame 24e to go up top mechanism 624, push rod 24a top is fixed with roof 24b bottom surface middle-end, roof 24b upper surface is equipped with kelly 24c, guide bar 24d fixed mounting is on roof 24b left side, guide bar 24d adopts clearance fit to install inside smooth frame 24e, guide bar 24d and smooth frame 24e all are equipped with four to install respectively in roof 24b four corners, do benefit to and make board 24b carry out steady movement, kelly 24c is equipped with two altogether, is bilateral symmetry and installs at kelly 24c upper surface, does benefit to and carries out the screens with promotion piece 12a bottom, ensures that promotion piece 12a carries out vertical promotion.

The specific use mode and function of the embodiment are as follows:

in the invention, the magnetic block 23b is electrified to make the magnetic block 23b perform magnetic adsorption on the sliding block 23c, so that the sliding block 23c slides in the sliding rail 23a, the sliding block 23c drives the ten sliding frames 611 to slide under the clamping action of the clamping block 23d, each sliding frame 611 is stopped when being positioned right below the detection head in the detection host 1, then the push rod 24a pushes the top plate 24b to move, the top plate 24b is stably lifted through the matching use of the four guide rods 24d and the sliding frames 24e, the clamping rod 24c is clamped at the bottom of the adjustment clamping mechanism 612, the top plate 24b drives the adjustment clamping mechanism 612 to stably lift through the clamping action of the clamping rod 24c, the diode in the adjustment clamping mechanism 612 is vertically and stably lifted, so that the pin positions detected by the diode are attached to the detection head in the detection host 1, the pin connection part of the diode is ensured to be in close contact with the detection head, and the accuracy of detection data is improved.

The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.

Claims

1. The utility model provides a semiconductor package check out test set, its structure is including detecting host computer (1), display screen (2), warning light (3), brace table (4), chamber door (5), placement machine (6), it has display screen (2) and electricity to inlay to detect host computer (1) front surface, warning light (3) are installed and are being connected at detection host computer (1) top and electricity, detect host computer (1) bottom fixed mounting at brace table (4) upper surface, brace table (4) front surface is equipped with chamber door (5), placement machine (6) are installed at brace table (4) upper surface to placement machine (6) are located and detect host computer (1) below, its characterized in that:

place mechanism (6) and include slide mechanism (61), transport mechanism (62) bottom surface fixed mounting is in brace table (4) upper surface, slide mechanism (61) adopt clearance fit to install inside transport mechanism (62), slide mechanism (61) are located and detect host computer (1) below.

2. The semiconductor package inspection apparatus according to claim 1, wherein: the sliding mechanism (61) comprises a sliding frame (611), an adjusting clamping mechanism (612) and a connecting rod (613), the sliding frame (611) is installed inside the conveying mechanism (62) in a clearance fit mode, the adjusting clamping mechanism (612) is installed at the middle end inside the sliding frame (611) in a clearance fit mode, and the connecting rod (613) is arranged on the left side surface of the sliding frame (611).

3. The semiconductor package inspection apparatus according to claim 2, wherein: slide frame (611) includes framework (11a), lug (11b), lift groove (11c), fixed polished rod (11d), framework (11a) left side surface is equipped with connecting rod (613), end has inlayed lift groove (11c) in framework (11a), lug (11b) are established between framework (11a) and lift groove (11c), fixed polished rod (11d) lower extreme fixed mounting is inside lift groove (11c), lift groove (11c) internally mounted has regulation screens mechanism (612).

4. The semiconductor package inspection apparatus according to claim 2, wherein: adjust screens mechanism (612) including promoting piece (12a), standing groove (12b), stripper plate (12c), flexible pipe (12d), atmospheric pressure conduction pipe (12e), splint (12f), it installs inside sliding frame (611) to promote piece (12a), standing groove (12b) have been inlayed in promotion piece (12a) middle part, standing groove (12b) inboard bottom is equipped with stripper plate (12c), stripper plate (12c) lower extreme is fixed mutually with flexible pipe (12d) top, flexible pipe (12d) lower extreme link up mutually with atmospheric pressure conduction pipe (12e) lower extreme, atmospheric pressure conduction pipe (12e) output is fixed mutually with splint (12f), splint (12f) adopt clearance fit to install at standing groove (12b) upper end inner wall.

5. The semiconductor package inspection apparatus according to claim 4, wherein: splint (12f) are including connecting block (f1), plate body (f2), granule (f3), connecting block (f1) left side is fixed with atmospheric pressure conduction pipe (12e) output, connecting block (f1) right-hand member is fixed mutually with plate body (f2) left side surface, granule (f3) have been inlayed to plate body (f2) right side surface, connecting block (f1) adopt clearance fit to install at standing groove (12b) upper end inner wall.

6. The semiconductor package inspection apparatus according to claim 1, wherein: the conveying mechanism (62) comprises a guide groove (621), a sliding rod (622), a pushing mechanism (623) and an upward pushing mechanism (624), the sliding rod (622) is arranged on the inner side surface of the right end of the guide groove (621), the pushing mechanism (623) is arranged inside the left end of the guide groove (621), and the upward pushing mechanism (624) is arranged inside the middle end of the guide groove (621).

7. The semiconductor package inspection apparatus of claim 6, wherein: push mechanism (623) include slide rail (23a), magnetic block (23b), slider (23c), screens piece (23d), slide rail (23a) are installed inside the left end, magnetic block (23b) are equipped with two altogether, establish respectively at the head and the end both ends of slide rail (23a), magnetic block (23b) and slider (23c) magnetic adsorption, slider (23c) slidable mounting is inside slide rail (23a), screens piece (23d) are established at slide rail (23a) inner wall.

8. The semiconductor package inspection apparatus of claim 6, wherein: go up top mechanism (624) including push rod (24a), roof (24b), kelly (24c), guide bar (24d), sliding frame (24e), push rod (24a) top is fixed with roof (24b) bottom surface middle-end, roof (24b) upper surface is equipped with kelly (24c), guide bar (24d) fixed mounting is on roof (24b) left side, guide bar (24d) adopt clearance fit to install inside sliding frame (24 e).