JP6389651B2 - Inspection method, mounting method, and mounting apparatus - Google Patents

Inspection method, mounting method, and mounting apparatus Download PDF

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JP6389651B2
JP6389651B2 JP2014120985A JP2014120985A JP6389651B2 JP 6389651 B2 JP6389651 B2 JP 6389651B2 JP 2014120985 A JP2014120985 A JP 2014120985A JP 2014120985 A JP2014120985 A JP 2014120985A JP 6389651 B2 JP6389651 B2 JP 6389651B2
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mounting
image data
area
substrate
value
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JP2015079933A (en
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今野 貴史
貴史 今野
由佳 中西
由佳 中西
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Juki株式会社
Juki株式会社
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Description

  The present invention relates to an inspection method, a mounting method, and a mounting apparatus.

  In a manufacturing process of an electronic device, for example, a mounting apparatus for mounting an electronic component on a substrate as disclosed in Patent Document 1, Patent Document 2, and Patent Document 3 is used.

JP 2005-537630 A Special table 2007-511094 gazette JP 2012-039096 A

  Electronic components are mounted on the substrate mounting area. When inspecting whether or not an electronic component is mounted in the mounting area, if the inspection accuracy decreases, the expected electronic device may not be manufactured, and productivity may decrease.

  An object of the present invention is to provide an inspection method in which a decrease in inspection accuracy is suppressed. Another object of the present invention is to provide a mounting method and a mounting apparatus in which a decrease in productivity is suppressed.

  In order to solve the above-described problems and achieve the object, an inspection method according to the present invention is an inspection method performed in mounting an electronic component on a substrate, and before the electronic component is mounted on a mounting region of the substrate. Acquiring image data including the mounting area and a peripheral area of the substrate around the mounting area by an imaging device; and an image including the mounting area and the peripheral area after mounting the electronic component on the mounting area. A step of acquiring data, a step of comparing the image data before mounting and the image data after mounting, and based on a result of the comparison, an abnormality of at least one of the mounting region and the peripheral region Determining the presence or absence.

  In the inspection method according to the present invention, the method includes a step of calculating a difference value of a luminance value for each pixel of the image sensor between the image data before mounting and the image data after mounting, and the comparing step includes: Comparing the difference value with a predetermined threshold value, the presence / absence of an abnormality in each of the mounting area and the peripheral area may be determined based on a result of the comparison.

  In the inspection method according to the present invention, the method includes a step of calculating a difference value of a luminance value for each pixel of the imaging element between the image data of the mounting area before mounting and the image data of the mounting area after mounting. The step of comparing includes comparing the difference value with a predetermined threshold value, and determining whether there is an abnormality in the mounting area based on the result of the comparison; Selecting whether or not to calculate a difference value of luminance values for each pixel of the image sensor between the image data of the region and the image data of the peripheral region after the mounting.

  The inspection method according to the present invention may include a step of updating the threshold value based on information on a plurality of the difference values.

  In the inspection method according to the present invention, the substrate is provided with a silk including lines, figures, marks, and characters of a color different from that of the substrate, and obtains a luminance value detected by each of the plurality of pixels of the image sensor. And excluding data from pixels that have detected a luminance value greater than or equal to a threshold value related to a predetermined luminance value among luminance values detected by each of the plurality of pixels, and the data is excluded Then, a step of calculating a difference value of a luminance value for each pixel of the image sensor between the image data before mounting and the image data after mounting may be performed.

  The inspection method according to the present invention includes a step of setting an upper limit value of the luminance value, and a step of correcting the image data before mounting and the image data after mounting based on the upper limit value. But you can.

  In the inspection method according to the present invention, the determination of whether there is an abnormality in the mounting area may include determination of whether there is an abnormality in the mounting state of the electronic component in the mounting area.

  In the inspection method according to the present invention, a nozzle that holds the electronic component and can be mounted on the substrate is included in the image data before mounting and the image data after mounting, and the image data before mounting and Removing a part of the data including the nozzles from each of the image data after the mounting, and after the part of the data is removed, the image data before the mounting and the image after the mounting A step of comparing the data may be performed.

  In the inspection method according to the present invention, the step of comparing the image data before mounting and the image data after mounting includes the image data before mounting by template matching processing in a first window including the mounting area. Aligning the image data after mounting and the image data after mounting by the template matching processing in a second window that includes the mounting area and is smaller than the first window. Aligning the image data.

  In the inspection method according to the present invention, the step of comparing the image data before mounting and the image data after mounting includes the image data before mounting and the image data after mounting by template matching processing. Calculating a correlation value of the electronic component, determining that the mounting state of the electronic component in the mounting area is normal when the correlation value is equal to or less than a first threshold, and when the correlation value is equal to or greater than a second threshold. Determining that the mounting state of the electronic component in the mounting region is abnormal, and when the correlation value is larger than the first threshold and smaller than the second threshold, the image before the mounting The difference value of the luminance value for each pixel of the image sensor between the data and the image data after mounting is calculated, and at least one of the mounting region and the peripheral region is calculated. The presence or absence of an abnormality may be determined.

  In the inspection method according to the present invention, the substrate is held by a substrate holding unit, and the imaging element that is an arithmetic processing target region in each of a state where the substrate held by the substrate holding unit is bent and deformed and a state where the substrate is not deformed The window may be set so that the mounting area continues to be arranged in the window.

  In order to solve the above-described problems and achieve the object, a mounting method according to the present invention is a mounting method for mounting an electronic component on a board, and the inspection method includes at least the mounting region and the peripheral region. Including inspecting one.

  In order to solve the above-described problems and achieve the object, a mounting apparatus according to the present invention is a mounting apparatus for mounting an electronic component on a substrate, and includes a nozzle that holds the electronic component and can be mounted on the substrate. An imaging device including an imaging element that acquires image data including the mounting region and a peripheral region of the substrate around the mounting region before and after mounting the electronic component on the mounting region of the substrate; And a processing device that determines whether or not there is an abnormality in at least one of the mounting area and the peripheral area based on a result of comparing the image data before mounting and the image data after mounting.

  According to the inspection method of the present invention, a decrease in inspection accuracy is suppressed. Moreover, according to the mounting method and the mounting apparatus according to the present invention, the reduction in productivity is suppressed.

FIG. 1 is a perspective view showing an example of a mounting apparatus according to the first embodiment. FIG. 2 is a perspective view illustrating an example of the transfer head according to the first embodiment. FIG. 3 is a front view illustrating an example of the imaging apparatus according to the first embodiment. FIG. 4 is a diagram illustrating an example of the operation of the mounting apparatus according to the first embodiment. FIG. 5 is a diagram illustrating an example of the operation of the mounting apparatus according to the first embodiment. FIG. 6 is a diagram illustrating an example of a functional block diagram of the mounting apparatus according to the first embodiment. FIG. 7 is a flowchart illustrating an example of the inspection method according to the first embodiment. FIG. 8 is a diagram illustrating an example of image data according to the first embodiment. FIG. 9 is a diagram illustrating an example of image data according to the first embodiment. FIG. 10 is a diagram illustrating an example of image data according to the first embodiment. FIG. 11 is a diagram illustrating an example of image data according to the first embodiment. FIG. 12 is a schematic diagram for explaining an example of a method for creating difference image data according to the first embodiment. FIG. 13 is a diagram illustrating an example of image data according to the first embodiment. FIG. 14 is a diagram illustrating an example of image data according to the first embodiment. FIG. 15 is a diagram illustrating an example of image data according to the first embodiment. FIG. 16 is a flowchart illustrating an example of the mounting method according to the second embodiment. FIG. 17 is a diagram illustrating an example of pre-mounting image data according to the third embodiment. FIG. 18 is a diagram illustrating an example of post-mounting image data according to the third embodiment. FIG. 19 is a diagram illustrating an example of template image data according to the third embodiment. FIG. 20 is a flowchart illustrating an example of an inspection method according to the fourth embodiment. FIG. 21 is a flowchart illustrating an example of an inspection method according to the fifth embodiment. FIG. 22 is a diagram schematically illustrating a relationship among the first threshold value, the second threshold value, the correlation value, and the processing content according to the fifth embodiment. FIG. 23 is a diagram illustrating an example of image data according to the sixth embodiment. FIG. 24 is a diagram illustrating an example of image data according to the seventh embodiment. FIG. 25 is a schematic diagram illustrating an example of an inspection method according to the seventh embodiment. FIG. 26 is a schematic diagram illustrating an example of an inspection method according to the seventh embodiment. FIG. 27 is a schematic diagram illustrating an example of a relationship between an imaging apparatus and a substrate according to the eighth embodiment. FIG. 28 is a schematic diagram illustrating an example of the relationship between the imaging device and the substrate according to the eighth embodiment. FIG. 29 is a diagram illustrating an example of image data according to the eighth embodiment. FIG. 30 is a diagram illustrating an example of pre-mounting image data according to the ninth embodiment. FIG. 31 is a diagram illustrating an example of difference image data according to the ninth embodiment.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings, but the present invention is not limited thereto. The components of the embodiments described below can be combined as appropriate. Some components may not be used. In addition, constituent elements in the embodiments described below include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range.

  In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. One direction in the horizontal plane is defined as the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and the direction orthogonal to each of the X-axis direction and Y-axis direction (that is, the vertical direction) is defined as the Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively. The XY plane is a horizontal plane. Each of the XZ plane and the YZ plane intersects the XY plane perpendicularly.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a perspective view illustrating an example of a mounting apparatus 100 according to the present embodiment. The mounting apparatus 100 mounts the electronic component 18 on the substrate 3, and includes a transport device 2 that transports the substrate 3, a supply unit 4 that supplies the electronic component 18, and a nozzle 10 that holds the electronic component 18. And a transfer head 7 for transferring and mounting the electronic component 18 from the supply unit 4 to the substrate 3. In the present embodiment, the electronic component 18 is a so-called chip type electronic component (mounting type electronic component), and is mounted on and mounted on the substrate 3. In addition, the mounting apparatus 100 includes a drive system 10D that moves the nozzle 10 (transfer head 7), a camera 9 that is arranged in the movement path of the transfer head 7 and acquires image data of the transfer head 7, and the substrate 3. The electronic component 18 is mounted on the electronic component 18 and the image pickup device 14 including an image pickup device that acquires image data of at least part of the substrate 3. The mounting apparatus 100 includes a base 1, and at least a part of the transport device 2 and the drive system 10 </ b> D is supported by the base 1.

  The transfer device 2 includes a substrate holding unit that holds the substrate 3 and a transfer path 2R that extends in the X-axis direction and moves the substrate holding unit, and transfers the substrate 3 and positions the held substrate 3. . The supply unit 4 supplies the electronic component 18 mounted on the substrate 3. In the present embodiment, the supply unit 4 is disposed on both sides of the transport path 2R with respect to the Y-axis direction. The supply unit 4 has a plurality of parts feeders 5 arranged in the X-axis direction. The parts feeder 5 stores a carrier tape held by a plurality of electronic components 18 and sequentially supplies the electronic components 18 by feeding out the carrier tape.

  The drive system 10D includes an X-axis table 6 that supports the transfer head 7 and moves in the X-axis direction, a Y-axis table 8A that supports the X-axis table 6 and moves in the Y-axis direction, and a Y-axis table 8A. The guide member 8B is disposed so as to face each other and guides the X-axis table 6 in the Y-axis direction. The X-axis table 6 extends in the X-axis direction above the transport path 2R. The −X side end of the X axis table 6 is supported by the Y axis table 8A, and the + X side end of the X axis table 6 is supported by the guide member 8B. The Y-axis table 8 </ b> A and the guide member 8 </ b> B are disposed on the upper surface of the base 1. In the present embodiment, at least a part of the Y-axis table 8A is disposed above the −X side end of the transport path 2R, and at least a part of the guide member 8B is a + X side end of the transport path 2R. Arranged above.

  The transfer head 7 has a nozzle 10 that holds the electronic component 18 in a releasable manner. The nozzle 10 can hold the electronic component 18 and can be mounted on the substrate 3. The transfer head 7 is disposed on the lower surface side of the X-axis table 6. When the Y-axis table 8A moves the X-axis table 6 in the Y-axis direction, the transfer head 7 supported by the X-axis table 6 moves in the Y-axis direction together with the X-axis table 6. Further, the transfer head 7 can be moved in the X-axis direction by the X-axis table 6. In other words, in the present embodiment, the transfer head 7 including the nozzle 10 is movable in the X-axis direction and the Y-axis direction by the operation of the X-axis table 6 and the Y-axis table 8A.

  In the above configuration, the X-axis table 6 is movable in the Y-axis direction by the Y-axis table 8A and the guide member 8B. Instead of this, it is possible to easily move the X-axis table in the Y-axis direction by using a well-known pair of Y-axis guide tables provided with a drive mechanism and a guide mechanism.

  The camera 9 photographs the transfer head 7 and the nozzle 10 from below. The camera 9 is arranged on the movement path of the transfer head 7 between the transport path 2R and the supply unit 4, and can acquire image data of the transfer head 7 (nozzle 10) in a state where the electronic component 18 is held. It is. By acquiring the image data of the transfer head 7 in a state where the electronic component 18 is held, the electronic component 18 is identified and misalignment is detected.

  The imaging device 14 includes an optical system and an imaging element, and can acquire at least part of image data of the substrate 3. In the present embodiment, the imaging device 14 is attached to the transfer head 7 and is movable together with the transfer head 7.

  FIG. 2 is a perspective view showing an example of the transfer head 7 according to the present embodiment. The transfer head 7 includes a nozzle 10 that releasably holds the electronic component 18, a nozzle shaft 11 that supports the nozzle 10, a holder 54 that holds the nozzle shaft 11, a base member 52 that supports the holder 54, and a base A Z-axis motor 13 supported by the member 52 and moving the holder 54 in the Z-axis direction and a θ-axis motor 12 supported by the holder 54 and moving (rotating) the nozzle shaft 11 in the θZ direction are provided.

  In the present embodiment, a plurality (four) of nozzles 10 and nozzle shafts 11 that support the nozzles 10 are provided. Note that a single nozzle 10 and nozzle shaft 11 may be provided. The nozzle 10 is a suction nozzle that sucks the electronic component 18, and is disposed at the lower end of the nozzle shaft 11. An adsorption hole for sucking gas is provided at the lower end of the nozzle 10. In a state where the lower end portion of the nozzle 10 and the electronic component 18 are in contact with each other, the nozzle 10 holds the electronic component 18 by sucking gas from the suction holes. Further, the electronic component 18 is released from the nozzle 10 by stopping the suction of the gas from the suction hole.

  The θ-axis motor 12 is connected to the upper end of the nozzle shaft 11 and moves (rotates) the nozzle shaft 11 in the θZ direction. When the nozzle shaft 11 moves in the θZ direction, the nozzle 10 supported by the nozzle shaft 11 moves (rotates) in the θZ direction together with the nozzle shaft 11. The Z-axis motor 13 is connected to a holder 54 via a ball screw 56, and moves the holder 54 in the Z-axis direction. When the holder 54 moves in the Z-axis direction, the nozzle shaft 11 and the nozzle 10 held by the holder 54 move in the Z-axis direction together with the holder 54. That is, in the present embodiment, the nozzle 10 is movable in the Z-axis direction and the θZ direction by the operation of the θ-axis motor 12 and the Z-axis motor 13.

  In the present embodiment, the holder 54, the θ-axis motor 12, and the Z-axis motor 13 are arranged for each of the plurality of nozzles 10 and the nozzle shaft 11. The plurality of nozzles 10 are individually movable with respect to the two directions of the Z axis and θZ.

  The drive system 10D includes an X-axis table 6, a Y-axis table 8A, a θ-axis motor 12, and a Z-axis motor 13. In the present embodiment, the nozzle 10 is movable in four directions of the X axis, the Y axis, the Z axis, and θZ by the operation of the drive system 10D.

  FIG. 3 is a front view illustrating an example of the imaging device 14 according to the present embodiment. The imaging device 14 includes a plurality of cameras 15. Each of the plurality of cameras 15 has an optical system and an image sensor. The imaging device 14 acquires image data of at least a part of the substrate 3 when the electronic component 18 is mounted on the substrate 3. In the present embodiment, the imaging device 14 images the substrate 3 from obliquely above. Note that only one camera 15 may be provided for one nozzle 10, or only one camera 15 may be provided for a plurality of nozzles 10. An illumination device that illuminates the substrate 3 imaged by the imaging device 14 may be provided. The imaging device 14 may acquire at least part of image data of the substrate 3 illuminated by the illumination device.

  Next, an example of the operation of the mounting apparatus 100 according to the present embodiment will be described. FIG. 4 is a diagram illustrating a state before the electronic component 18 is mounted on the substrate 3. The electronic component 18 held by the nozzle 10 is mounted on the mounting area 40 of the substrate 3. A solder paste 16 is printed on the mounting area 40 of the substrate 3. In the present embodiment, before the electronic component 18 is mounted on the mounting area 40 of the substrate 3, image data including the mounting area 40 of the substrate 3 and the peripheral area 50 of the substrate 3 around the mounting area 40 is obtained. Acquired by the imaging device 14.

  After images of the mounting area 40 and the peripheral area 50 on the upper surface of the substrate 3 are captured, the nozzle 10 holding the electronic component 18 is lowered, and the electronic component 18 is mounted on the mounting area 40 of the substrate 3. The electronic component 18 is connected to the solder paste 16 printed on the substrate 3. The electronic component 18 includes a body portion 18A and electrode portions 18B formed at both ends of the body portion 18A, and at least a part of the electrode portion 18B and the solder paste 16 are connected.

  FIG. 5 is a diagram illustrating a state after the electronic component 18 is mounted on the substrate 3. After the electronic component 18 is mounted on the substrate 3, the nozzle 10 rises and moves away from the substrate 3 and the electronic component 18. In the present embodiment, after the electronic component 18 is mounted on the mounting area 40 of the substrate 3, image data including the mounting area 40 and the peripheral area 50 of the substrate 3 is acquired by the imaging device 14. In the example shown in FIG. 5, the electronic component 18 is mounted on the mounting area 40 of the substrate 3, and the image data of the mounting area 40 includes image data of the electronic component 18 mounted on the mounting area 40.

  FIG. 6 is a functional block diagram of the mounting apparatus 100 according to the present embodiment. As illustrated in FIG. 6, the mounting apparatus 100 includes an imaging device 14 and a CPU (Central Processing Unit) 25, and inspects at least one of the main control device 26 that controls the mounting apparatus 100, the board 3, and the electronic component 18. And an inspection device 37 for performing the inspection. The imaging device 14 is connected to the main control device 26 and operates based on a command signal from the main control device 26. The inspection device 37 is connected to the main control device 26 and can communicate data with the main control device 26. The inspection device 37 is connected to the imaging device 14 and can communicate data with the imaging device 14.

  The inspection device 37 includes a CPU, and includes a control device 35 that controls the inspection device 37 and a rewritable memory that stores image data acquired by the imaging device 14. A data storage unit 31, an inspection processing unit 32 that processes various data used for inspection to determine the state of the substrate 3 and the electronic component 18, and a difference that stores differential image data output from the inspection processing unit 32 Image data storage unit 33, determination result storage unit 34 including a rewritable memory for storing determination results by inspection processing unit 32, and determination result processing for performing processing based on the determination results stored in determination result storage unit 34 Part 36.

  The inspection processing unit 32 includes an image analysis processing unit 32A that processes image data acquired by the imaging device 14, a mounting region determination processing unit 32B that determines whether there is an abnormality in the mounting region 40, and whether there is an abnormality in the peripheral region 50. A peripheral area determination processing unit 32C.

  The inspection processing unit 32 (the image analysis processing unit 32A, the mounting region determination processing unit 32B, the peripheral region determination processing unit 32C), and the determination result processing unit 36 can be realized by a CPU and software (program), or hard wired. It can also be realized with a circuit. The software (program) may be recorded on a recording medium such as a magnetic disk, an optical disk, or a semiconductor memory, or may be downloaded via a LAN (Local Area Network) or the Internet.

  Next, an example of an inspection method performed when the electronic component 18 is mounted on the substrate 3 will be described with reference to a flowchart of FIG.

  In order to mount the electronic component 18 on the mounting area 40 of the substrate 3, the main control device 26 controls the drive system 10 </ b> D to hold the electronic component 18 of the supply unit 4 with the nozzle 10, and the substrate 3 of the transport device 2. Transport to. The main control device 26 transmits an imaging start command signal to the imaging device 14 before the electronic component 18 is mounted on the substrate 3. The imaging device 14 that has received the command signal images the board 3 before mounting the electronic component 18 on the mounting area 40 of the board 3 and acquires image data including the mounting area 40 and the peripheral area 50 of the board 3 (step). SA1). In the following description, the image data of the mounting area 40 and the peripheral area 50 acquired before mounting the electronic component 18 is appropriately referred to as pre-mounting image data DAa.

  In the present embodiment, the pre-mounting image data DAa is acquired in a state where the imaging device 14 and the substrate 3 are stationary. That is, the pre-mounting image data DAa is acquired in a state where the relative position between the imaging device 14 and the substrate 3 is fixed. The imaging device 14 simultaneously acquires the image data of the mounting area 40 and the image data of the peripheral area 50. The visual field region of the optical system of the imaging device 14 is determined so that the images of the mounting region 40 and the peripheral region 50 are simultaneously acquired by the imaging device of the imaging device 14. The imaging device of the imaging device 14 has a plurality of pixels, and the pre-mounting image data DAa is acquired for each of the plurality of pixels.

  FIG. 8 is a diagram illustrating an example of pre-mounting image data DAa. In FIG. 8, the electronic component 18 is not mounted in the mounting area 40. The outer shape and size of the mounting area 40 are substantially equal to the outer shape and size of the electronic component 18. In the present embodiment, the outer shape of the mounting region 40 in the XY plane parallel to the surface of the substrate 3 is a quadrangle (rectangle). Note that the outer shape of the mounting region 40 may be a square, a parallelogram, or a rhombus. The solder paste 16 is disposed in the mounting region 40 so as to be connected to the electrode portion 18B of the electronic component 18. The electronic component 18 is mounted with the center position 17 of the mounting area 40 as a target.

  The peripheral area 50 is an area around the mounting area 40. Around the mounting area 40, another mounting area (peripheral mounting area) 40E is arranged. In the example shown in FIG. 8, the electronic component 18 is mounted on each of the peripheral mounting areas 40E. The peripheral area 50 includes a peripheral mounting area 40E, an electronic component 18 mounted in the peripheral mounting area 40E, a non-mounting area between the mounting area 40 and the peripheral mounting area 40E, and a peripheral mounting area 40E and its peripheral mounting area 40E. A non-mounting region between adjacent peripheral mounting regions 40E is included. The non-mounting area is an area where the electronic component 18 is not mounted. The concept may be such that the peripheral area 50 includes only a non-mounting area between the mounting area 40 and the peripheral mounting area 40E. With respect to the radial direction with respect to the center position 17, the size of the peripheral region 50 may be larger or smaller than the size of the mounting region 40.

  The pre-mounting image data DAa acquired by the imaging device 14 is transmitted to the inspection device 37. The inspection device 37 stores the pre-mounting image data DAa in the image data storage unit (pre-mounting image data storage unit) 30 (step SA2).

  After the pre-mounting image data DAa is acquired, the electronic component 18 is mounted on the mounting area 40 of the substrate 3 (step SA3). When the electronic component 18 is mounted on the substrate 3 and the nozzle 10 is lifted away from the substrate 3 and the electronic component 18, the main control device 26 transmits an imaging start command signal to the imaging device 14. The imaging device 14 that has received the command signal images the substrate 3 after mounting the electronic component 18 on the mounting region 40 of the substrate 3 and acquires image data including the mounting region 40 and the peripheral region 50 of the substrate 3 (step SA4). ). In the following description, the image data of the mounting area 40 and the peripheral area 50 acquired after mounting the electronic component 18 is appropriately referred to as post-mounting image data DAb.

  In the present embodiment, post-mounting image data DAb is acquired in a state where the imaging device 14 and the substrate 3 are stationary. That is, the post-mounting image data DAb is acquired in a state where the relative position between the imaging device 14 and the substrate 3 is fixed. The positions of the imaging device 14 and the substrate 3 are the same when the pre-mounting image data DAa and the post-mounting image data DAb are acquired, and the relative position between the imaging device 14 and the substrate 3 is fixed. Thus, the pre-mounting image data DAa and the post-mounting image data DAb are acquired. The imaging device 14 simultaneously acquires the image data of the mounting area 40 and the image data of the peripheral area 50. The field of view of the optical system of the imaging device 14 is the same when the pre-mounting image data DAa and the post-mounting image data DAb are acquired, and the post-mounting image data DAb is acquired for each of a plurality of pixels of the image sensor. The

  FIG. 9 is a diagram illustrating an example of the post-mounting image data DAb. In FIG. 9, the electronic component 18 is mounted in the mounting area 40. As described above, when the electronic component 18 is mounted on the mounting area 40 of the substrate 3, the image data of the mounting area 40 of the substrate 3 includes the image data of the electronic component 18. In the example shown in FIG. 9, the state of the peripheral region 50 when the post-mounting image data DAb is acquired is the same as the state of the peripheral region 50 when the pre-mounting image data DAa is acquired. That is, the position and number of the electronic components 18 in the peripheral region 50 are the same when the pre-mounting image data DAa is acquired and when the post-mounting image data DAb is acquired.

  The post-mounting image data DAb acquired by the imaging device 14 is transmitted to the inspection device 37. The inspection device 37 stores the post-mounting image data DAb in the image data storage unit (post-mounting image data storage unit) 31 (step SA5).

  The inspection processing unit 32 compares the pre-mounting image data DAa stored in the pre-mounting image data storage unit 30 with the post-mounting image data DAb stored in the post-mounting image data storage unit 31 (step SA6). . The inspection processing unit 32 determines whether there is an abnormality in at least one of the mounting area 40 and the peripheral area 50 based on the comparison result (step SA7).

  As described above, each of the pre-mounting image data DAa and the post-mounting image data DAb is acquired for each of the plurality of pixels of the image sensor. In the present embodiment, the luminance value for each pixel of the image sensor is detected in the acquisition of the pre-mounting image data DAa and the post-mounting image data DAb. In the present embodiment, each of the pre-mounting image data DAa and the post-mounting image data DAb includes information regarding the luminance value for each of the plurality of pixels of the image sensor.

  FIG. 10 shows image data output for comparing the pre-mounting image data DAa and the post-mounting image data DAb. The image data shown in FIG. 10 is difference image data DS created using the difference value of the luminance value for each pixel of the pre-mounting image data DAa and the post-mounting image data DAb. The difference image data DS is obtained by imaging the absolute value (positive value) by subtracting the luminance value of the post-mounting image data DAb from the luminance value of the pre-mounting image data DAa.

  In the present embodiment, a difference value of luminance values is calculated for each of a plurality of pixels. The difference value between the luminance values detected by the pixels that have captured the same position of the substrate 3 (the pixels on which light from the same position is incident) is calculated when the pre-mounting image data DAa and the post-mounting image data DAb are acquired. Is done.

  FIG. 11 is a schematic diagram for explaining an example of a method for creating difference image data DS. As shown in FIG. 11, the pre-mounting image data storage unit 30 stores pre-mounting image data DAa, and the post-mounting image data storage unit 31 stores post-mounting image data DAb. Each of the pre-mounting image data DAa and the post-mounting image data DAb includes information on the luminance value for each pixel px (px1, px2,..., Pxn).

  The inspection processing unit 32 aligns the pre-mounting image data DAa and the post-mounting image data DAb. For example, the center position 17 of the pre-mounting image data DAa and the center position 17 of the post-mounting image data DAb are aligned. Then, the inspection processing unit 32 calculates a difference value between the luminance value ma in the pixel px of the pre-mounting image data DAa and the luminance value mb in the pixel px of the post-mounting image data DAb that matches the pixel px of the pre-mounting image data DAa. Δm is calculated. For example, in FIG. 11, the difference value Δm1 between the luminance value ma1 in the pixel px1 that images the first region of the pre-mounting image data DAa and the luminance value mb1 in the pixel px1 that images the first region of the post-mounting image data DAb is Calculated. A difference value Δm2 between the luminance value ma2 in the pixel px2 that images the second region of the pre-mounting image data DAa and the luminance value mb2 in the pixel px2 that images the second region of the post-mounting image data DAb is calculated. A difference value Δmi between the luminance value mai at the pixel pxi that images the i-th region of the pre-mounting image data DAa and the luminance value mbi at the pixel pxi that images the i-th region of the post-mounting image data DAb is calculated. Similarly, the luminance value ma (ma1, ma2,..., Mai,..., Man) of the pre-mounting image data DAa in each of the pixels px (px1, px2,..., Pxn) and the mounted image. Difference values Δm (Δm1, Δm2,..., Δmi,..., Δmn) from the luminance values mb (mb1, mb2,..., Mbn) of the data DAb are respectively calculated.

  As described above, in the present embodiment, the difference value Δm (Δm1, Δm2,...) Between the luminance value ma and the luminance value mb for each of the plurality of pixels px of the image sensor between the pre-mounting image data DAa and the post-mounting image data DAb. Δmi,..., Δmn) are calculated.

  Note that the alignment of the pre-mounting image data DAa and the post-mounting image data DAb may be performed by a so-called template matching process. For example, the inspection processing unit 32 (image analysis processing unit 32A) calculates the correlation value between the pre-mounting image data DAa and the post-mounting image data DAb using the pre-mounting image data DAa as a template so that the correlation value becomes the highest. The pre-mounting image data DAa and post-mounting image data DAb are aligned. The inspection processing unit 32 determines the position of the pre-mounting image data DAa and the post-mounting image data DAb having the highest correlation value as the position where the pre-mounting image data DAa and the post-mounting image data DAb match. At this time, sub-pixel calculation may be performed in order to increase alignment accuracy. In addition, in order to shorten the calculation time, the calculation for alignment may be performed for some pixels instead of performing the calculation for alignment for all the pixels.

  The inspection processing unit 32 creates difference image data DS by plotting the difference value Δm obtained for each pixel px. The created difference image data DS is stored in the difference image data storage unit 33.

  In the present embodiment, step SA6 for comparing the pre-mounting image data DAa and the post-mounting image data DAb includes comparing the difference value Δm with a predetermined threshold value R. Based on the result of comparing the difference value Δm and the threshold value R, the presence / absence of an abnormality in each of the mounting area 40 and the peripheral area 50 is determined.

  In the present embodiment, the abnormality in the mounting area 40 includes an abnormality in the mounting state of the electronic component 18 with respect to the mounting area 40, and the determination of whether there is an abnormality in the mounting area 40 is an abnormality in the mounting state of the electronic component 18 with respect to the mounting area 40. Including the determination of the presence or absence of An abnormality in the mounting area 40 includes a state in which the electronic component 18 is not mounted in the mounting area 40 despite the mounting operation being performed, and an electronic component 18 in the mounting area 40 in which the mounting operation is not performed. It includes at least one of the mounted state and the state in which the electronic component 18 is mounted on at least a part of the mounting region 40 but the mounting region 40 and the electronic component 18 are out of position. In the present embodiment, abnormalities in the peripheral area 50 include the state in which the position of the electronic component 18 mounted in the peripheral area 50 (peripheral mounting area 40E) is shifted, and the electrons mounted in the peripheral area 50 (peripheral mounting area 40E). It includes at least one of the states in which the position of the component 18 is shifted and at least a part of the electronic component 18 is arranged in the mounting area 40. Note that a state where the position of the electronic component 18 mounted in the peripheral region 50 (peripheral mounting region 40E) is shifted and at least a part of the electronic component 18 is disposed in the mounting region 40 is regarded as an abnormality in the mounting region 40. Also good.

  In this embodiment, the threshold R40 is compared with the total value of the difference values of the luminance values for each pixel of the image sensor between the mounting area 40 of the pre-mounting image data DAa and the mounting area 40 of the post-mounting image data DAb. . In the present embodiment, the total value of the difference values of the luminance values for each pixel of the image sensor between the peripheral area 50 of the pre-mounting image data DAa and the peripheral area 50 of the post-mounting image data DAb is compared with the threshold value R50. Is done.

  For example, the pixels that image the mounting area 40 are pxa, pxb,..., Pxe, and the luminance values of the pixels pxa, pxb,..., Pxe that image the mounting area 40 of the pre-mounting image data DAa are maa, mab, respectively. ,..., Mae, and the luminance values of the plurality of pixels pxa, pxb,..., Pxe obtained by imaging the mounting area 40 of the post-mounting image data DAb are mba, mbb,. In this embodiment, Δma + Δmb + Δmc + Δmd + Δme is compared with a predetermined threshold value R40 when the difference value for each pxe is Δma, Δmb,. In order to simplify the description, the pixels in which the mounting area 40 is imaged are designated as pxa, pxb,..., Pxe, but in reality, the number of pixels in which the mounting area 40 is imaged is large. Or thousands.

  For example, the pixels that image the peripheral region 50 are pxq, pxr,..., Pxu, and the luminance values in the plurality of pixels pxq, pxr,..., Pxu that image the peripheral region 50 of the pre-mounting image data DAa are maq, mar. ,..., Mau, and the luminance values of the plurality of pixels pxq, pxr,..., Pxu obtained by imaging the peripheral region 50 of the post-mounting image data DAb are mbq, mbr,. In this embodiment, Δmq + Δmr + Δms + Δmt + Δmu is compared with a predetermined threshold value R50 when the difference value for each pxu is Δmq, Δmr,. In order to simplify the description, the pixels that image the peripheral region 50 are assumed to be pxq, pxr,..., Pxu. However, in reality, the number of pixels that image the peripheral region 50 is large, for example, tens or hundreds. Or thousands.

  When there is no abnormality in each of the mounting area 40 and the peripheral area 50, as shown in FIG. 10, the difference value Δm in the mounting area 40 is large and the difference value Δm in the peripheral area 50 is small (including zero). That is, when the electronic component 18 is correctly mounted on the mounting region 40, the luminance value ma of the mounting region 40 based on the substrate 3 (solder paste 16) is detected before mounting, and the mounting based on the electronic component 18 after mounting. Since the luminance value mb of the area 40 is detected, the difference between the luminance value ma of the mounting area 40 before mounting and the luminance value mb of the mounting area 40 after mounting becomes large. Accordingly, in the difference image data DS, the difference value Δm of the mounting area 40 is increased. Further, when the electronic component 18 is correctly mounted on the mounting area 40 and no abnormality has occurred in the peripheral area 50, the periphery based on the substrate 3 (non-mounting area) and the peripheral mounting area 40E (electronic component 18) before mounting. The luminance value ma of the region 50 is detected, and the luminance value mb of the peripheral region 50 based on the substrate 3 (non-mounting region) and the peripheral mounting region 40E (electronic component 18) is detected even after mounting. The difference between the luminance value ma of the region 50 and the luminance value mb of the peripheral region 50 after mounting is small. Therefore, in the difference image data DS, the difference value Δm of the peripheral region 50 is small (including zero). That is, when there is no abnormality in each of the mounting area 40 and the peripheral area 50, the total value of the difference values Δm in the mounting area 40 is larger than the threshold value R40, and the total value of the differential values Δm in the peripheral area 50 is higher than the threshold value R50. Is also small. In this case, it is determined that no abnormality has occurred in each of the mounting area 40 and the peripheral area 50.

  FIG. 12 shows an example in which an abnormality has occurred in the peripheral area 50 when the peripheral area 50 is determined so as to include the peripheral mounting area 40E. In the example shown in FIG. 12, although the electronic component 18 is correctly mounted in the mounting area 40, in the period between the acquisition of the pre-mounting image data DAa and the acquisition of the post-mounting image data DAb related to the mounting area 40, An example in which the position of the electronic component 18 mounted in the peripheral mounting area 40E has shifted from the peripheral mounting area 40E is shown. For example, an external force acts on the substrate 3, the substrate 3 vibrates, or the electronic component 18 in the peripheral mounting area 40E during a period between the acquisition of the pre-mounting image data DAa and the acquisition of the post-mounting image data DAb. If the electronic component 18 mounted on the mounting area 40 comes into contact, the position of the electronic component 18 mounted on the peripheral mounting area 40E may be shifted.

  FIG. 13 shows the difference image data DS of the example shown in FIG. As shown in FIG. 13, the luminance value of the peripheral region 50 changes before and after the electronic component 18 is mounted on the mounting region 40, and a partial difference value of the peripheral region 50 is large in the difference image data DS. Become. That is, in the example shown in FIGS. 12 and 13, the total value of the difference values Δm in the mounting area 40 is larger than the threshold value R40, and the total value of the difference values Δm in the peripheral area 50 is also larger than the threshold value R50. In this case, although the electronic component 18 is correctly mounted in the mounting area 40 and no abnormality has occurred in the mounting area 40, it is determined that an abnormality (positional displacement between the peripheral mounting area 40E and the electronic component 18) has occurred in the peripheral area 50. Is done.

  FIG. 14 shows an example in which an abnormality has occurred in the peripheral area 50 and the mounting area 40. In the example illustrated in FIG. 14, the electronic component 18 is not yet mounted in the mounting area 40, and the position of the electronic component 18 mounted in the peripheral mounting area 40 </ b> E is obtained before the pre-mounting image data DAa related to the mounting area 40 is acquired. An example will be shown in which at least a part of the electronic component 18 has been disposed in the mounting area 40 by deviating from the peripheral mounting area 40E. In addition, the example illustrated in FIG. 14 illustrates an example in which the electronic component 18 is not mounted for some reason even though the mounting operation (driving of the nozzle 10 or the like) of the electronic component 18 in the mounting region 40 is performed. Even in this case, the image data of the mounting area 40 and the peripheral area 50 is acquired before and after the mounting operation of the electronic component 18 on the mounting area 40 and after the mounting operation of the electronic component 18 is performed. The

  FIG. 15 shows the difference image data DS of the example shown in FIG. As shown in FIG. 15, the luminance value of the peripheral region 50 changes before and after the mounting operation of the electronic component 18 in the mounting region 40, and a part of the peripheral region 50 in the difference image data DS. The difference value increases. On the other hand, the luminance value of the mounting area 40 does not change much before and after the mounting operation of the electronic component 18 with respect to the mounting area 40, and the difference value of the mounting area 40 is small in the difference image data DS. That is, in the example shown in FIGS. 14 and 15, the total value of the difference values Δm in the mounting area 40 is smaller than the threshold value R40, and the total value of the difference values Δm in the peripheral area 50 is larger than the threshold value R50. In this case, it is determined that an abnormality (non-mounting of the electronic component 18) has occurred in the mounting area 40, and it is determined that an abnormality (positional displacement between the other mounting area 40E and the electronic component 18) has occurred in the peripheral area 50. .

  Although not described with reference to the drawings, the total value of the difference values Δm in the mounting area 40 is smaller than the threshold value R40, and the total value of the difference values Δm in the peripheral area 50 is smaller than the threshold value R50. Occurs. In this case, it is determined that an abnormality (non-mounting of the electronic component 18) has occurred in the mounting area 40, and it is determined that no abnormality has occurred in the peripheral area 50.

  As described above, according to the present embodiment, the pre-mounting image data DAa and the post-mounting image data DAb of the mounting region 40 and the peripheral region 50 are acquired, so whether there is an abnormality in the mounting region 40, and The presence or absence of an abnormality in the peripheral area 50 can be determined. As described above, when the difference value (total value of difference values) of the luminance values in the mounting area 40 before and after mounting is larger than the predetermined threshold value R40, the electronic component 18 is correctly mounted in the mounting area 40, and the mounting area In 40, it can be determined that no abnormality has occurred. When the difference value of the luminance value of the mounting area 40 before and after mounting is smaller than a predetermined threshold value R40, it can be determined that the electronic component 18 is not mounted on the mounting area 40 and an abnormality has occurred in the mounting area 40. Further, when the difference value of the luminance value of the peripheral region 50 before and after mounting is smaller than a predetermined threshold value R50, it can be determined that no abnormality such as a positional deviation of the electronic component 18 has occurred in the peripheral region 50. When the difference value of the luminance values of the peripheral region 50 before and after mounting is larger than a predetermined threshold value R50, it can be determined that an abnormality such as a positional deviation of the electronic component 18 has occurred in the peripheral region 50.

  For example, when a difference value (luminance value change amount) of the mounting area 40 is calculated and a luminance value difference value (luminance value change amount) of the peripheral area 50 is not calculated, the mounting area 40 may be changed for some reason. If the electronic component 18 is not mounted and the electronic component 18 to be mounted in the peripheral mounting area 40E is disposed in the mounting area 40 due to a positional shift or the like, the correct electronic component 18 is not mounted in the mounting area 40. Nevertheless, there is a possibility of erroneous determination (incorrect inspection) that the electronic component 18 is mounted. In particular, when the distance between the adjacent mounting area 40 and the peripheral mounting area 40E is small (so-called narrow pitch), there is a high possibility that the above-described erroneous determination occurs. According to the present embodiment, not only the difference value of the luminance value of the mounting area 40 but also the difference value of the luminance value of the peripheral area 50 is calculated, so that the erroneous determination as described above is based on the calculation result. Is suppressed.

  Further, according to the present embodiment, since the state of the peripheral region 50 is detected by the imaging device 14, an abnormality (such as a positional deviation) of the electronic component 18 mounted in the peripheral mounting region 40E of the peripheral region 50 is detected. can do.

  Thus, according to the present embodiment, it is possible to determine whether or not an abnormality has occurred at the stage of mounting (mounting) the electronic component 18. Therefore, since the occurrence of problems such as various kinds of processing on the substrate 3 in which an abnormality has occurred is suppressed, a decrease in yield and a decrease in productivity are suppressed.

  In the present embodiment, in determining whether there is an abnormality in the mounting area 40, the total value of the difference values of the luminance values of each of the plurality of pixels on which light from the mounting area 40 is incident is calculated. The presence / absence of an abnormality in the mounting area 40 may be determined based on the average value of the difference values of the luminance values of the plurality of pixels that image the mounting area 40 before and after mounting. Similarly, the presence / absence of abnormality in the peripheral region 50 may be determined based on the average value of the difference values of the luminance values of the plurality of pixels that have captured the peripheral region 50 before and after mounting. The same applies to the following embodiments.

  In the present embodiment, in determining whether there is an abnormality in the mounting area 40 and the peripheral area 50, the difference value of the luminance value for each pixel is obtained. A plurality of micro regions including a plurality of images may be determined, and a difference value of luminance values for each micro region may be obtained. In other words, the unit for obtaining the luminance value (difference value) may be a pixel or a minute area including a plurality of pixels. The same applies to the following embodiments.

  In the present embodiment, the concept that the difference value of the luminance value includes the total value of the difference values of the luminance values for each of a plurality of pixels (small regions) may be used. The same applies to the following embodiments.

Second Embodiment
A second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 16 is a flowchart illustrating an example of a method for mounting the electronic component 18 on the substrate 3 according to the present embodiment.

  Similar to the above-described embodiment, the pre-mounting image data DAa and the post-mounting image data DAb are acquired. The inspection processing unit 32 aligns the pre-mounting image data DAa and the post-mounting image data DAb (step SB1). As described in the above embodiment, the process of aligning the pre-mounting image data DAa and the post-mounting image data DAb is performed by combining the center position 17 of the pre-mounting image data DAa and the center position 17 of the post-mounting image data DAb. A process of matching may be used, or a process including a so-called template matching process may be used.

  As described above, in the present embodiment, the positions of the imaging device 14 and the substrate 3 are the same when the pre-mounting image data DAa is acquired and when the post-mounting image data DAb is acquired. The pre-mounting image data DAa and the post-mounting image data DAb are acquired in a state in which the relative position to the position is fixed. Further, the field of view of the optical system of the imaging device 14 is the same when the pre-mounting image data DAa is acquired and when the post-mounting image data DAb is acquired. However, there is a possibility that a force is applied to the substrate 3 due to the mounting of the electronic component 18 on the substrate 3 or the substrate 3 vibrates. In this case, the alignment process between the pre-mounting image data DAa and the post-mounting image data DAb may be performed by a template matching process that is a known image processing algorithm.

  Next, the inspection processing unit 32 creates the difference image data DS based on the pre-mounting image data DAa and the post-mounting image data DAb according to the above-described embodiment (step SB2). The created difference image data DS is stored in the difference image data storage unit 33.

  Next, the inspection processing unit 32 performs a process of removing noise from the difference image data DS (step SB3). For example, when a high-contrast portion of the substrate 3 (electronic component 18) is imaged by the imaging device, the image data for the high-contrast portion may contain a lot of noise components. Examples of the high contrast portion include a boundary portion between the electronic component 18 and the substrate 3, a pattern provided on the substrate 3, and an edge portion of a character. Therefore, for example, the inspection processing unit 32 excludes the data from the pixels in which the luminance values outside the predetermined range are detected from the luminance values detected by each of the plurality of pixels, and generates the difference image data DS. create. Note that an erosion process or an expansion process, which is an existing image processing algorithm, may be used as a process for removing noise.

  Next, in the present embodiment, the inspection processing unit 32 calculates the difference value of the luminance value for each pixel of the image sensor between the image data of the mounting area 40 before mounting and the image data of the mounting area 40 after mounting. (Step SB4). That is, the total value of the difference values of the luminance values for each pixel of the image sensor between the mounting area 40 of the pre-mounting image data DAa and the mounting area 40 of the post-mounting image data DAb is calculated. Note that the inspection processing unit 32 performs enhancement processing such as squaring the luminance value for each pixel instead of calculating the total value of the luminance value difference for each pixel, and then the difference between the values after the enhancement processing. A total value may be calculated. Thereby, the difference value is emphasized. After the sum of the difference values is calculated, the sum of the difference values is compared with the threshold value R40.

  Next, the inspection processing unit 32 determines whether or not there is an abnormality in both the mounting area 40 and the peripheral area 50, or whether or not there is an abnormality in the mounting area 40 and determines whether there is an abnormality in the peripheral area 50 Are selected (step SB5). Whether to determine whether or not there is an abnormality in the peripheral region 50 is determined by the difference in luminance value for each pixel of the image sensor between the image data of the peripheral region 50 before mounting and the image data of the peripheral region 50 after mounting. This includes selection of whether or not to calculate a value (total value of difference values).

  For example, when the distance between the mounting area 40 and the peripheral mounting area 40E (the distance between the peripheral mounting area 40E and the peripheral mounting area 40E adjacent to the peripheral mounting area 40E) is large (when the pitch is not narrow), the above-described error may occur. It is considered that the possibility that the determination will occur is reduced. In such a case, the processing time (calculation time) is shortened by determining whether there is an abnormality in the mounting area 40 and not determining whether there is an abnormality in the peripheral area 50. On the other hand, in the case of a narrow pitch, it is considered that the possibility of erroneous determination as described above increases. In such a case, occurrence of erroneous determination is suppressed by determining whether or not there is an abnormality in both the mounting area 40 and the peripheral area 50.

  In the present embodiment, information (related to whether or not the pitch is narrow) between the mounting area 40 and the peripheral mounting area 40E (interval between the peripheral mounting area 40E and the peripheral mounting area 40E adjacent to the peripheral mounting area 40E). Information) is known information such as design value information. Based on the known information, the inspection processing unit 32 determines whether there is an abnormality in both the mounting area 40 and the peripheral area 50, or determines whether there is an abnormality in the mounting area 40 and whether there is an abnormality in the peripheral area 50. Select whether or not to judge.

  If it is selected in step SB5 that the presence / absence of both the mounting area 40 and the peripheral area 50 is determined to be abnormal (step SB5: Yes), the inspection processing unit 32 displays the image data of the peripheral area 50 before mounting and the post-mounting. The difference value of the luminance value for each pixel of the image sensor from the image data of the peripheral region 50 is calculated (step SB6). That is, the total value of the difference values of the luminance values for each pixel of the image sensor between the peripheral area 50 of the pre-mounting image data DAa and the peripheral area 50 of the post-mounting image data DAb is calculated. Note that the inspection processing unit 32 performs enhancement processing such as squaring the luminance value for each pixel instead of calculating the total value of the luminance value difference for each pixel, and then the difference between the values after the enhancement processing. A total value may be calculated. Thereby, the difference value is emphasized. After the sum of the difference values is calculated, the sum of the difference values is compared with the threshold value R50.

  The inspection processing unit 32 compares the total value of the difference values in the peripheral region 50 with the threshold value R50, and determines whether there is an abnormality in the peripheral region 50 based on the comparison result (step SB7). Similar to the above-described embodiment, when the total difference value in the peripheral region 50 is smaller than the threshold value R50, it is determined that no abnormality has occurred in the peripheral region 50, and the total difference value in the peripheral region 50 is the threshold value R50. Is larger than that, it is determined that an abnormality has occurred in the peripheral region 50.

  If it is determined in step SB7 that the total difference value in the peripheral region 50 is greater than the threshold value R50 (abnormality has occurred in the peripheral region 50) (step SB7: Yes), error processing is executed (step SB7: Yes). Step SB8). In the error processing, information indicating that an abnormality has occurred in the peripheral area 50 is transmitted to the main control device 26, and that an abnormality has occurred in the peripheral area 50 using a display device or a notification device is transmitted to the operator. Processing to include. The display device can transmit information indicating that an abnormality has occurred on a screen display, and the notification device can transmit information indicating that an abnormality has occurred using sound or light. When receiving information indicating that an abnormality has occurred in the peripheral region 50 from the inspection processing unit 32, the main control device 26 stops the mounting operation of the electronic component 18.

  In step SB5, when it is selected that the presence / absence of abnormality in the mounting area 40 is determined and the presence / absence of abnormality in the peripheral area 50 is not determined (step SB5: No), or the difference value in the peripheral area 50 is determined in step SB7. When it is determined that the total value is smaller than the threshold value R50 (no abnormality has occurred in the peripheral region 50) (step SB7: No), the inspection processing unit 32 determines the total value of the difference values in the mounting region 40 and the threshold value R40. And whether or not there is an abnormality in the mounting area 40 is determined based on the comparison result (step SB9). Similar to the above-described embodiment, when the total difference value in the mounting area 40 is larger than the threshold value R40 (step SB9: Yes), no abnormality has occurred in the mounting area 40 (the mounting of the electronic component 18 in the mounting area 40). It is determined that the state is normal) (step SB10). On the other hand, when the total difference value in the mounting area 40 is smaller than the threshold value R40 (step SB9: No), an abnormality has occurred in the mounting area 40 (the mounting state of the electronic component 18 in the mounting area 40 is abnormal). ) Is determined (step SB11). When it is determined that an abnormality has occurred in the mounting area 40, a process for transmitting information indicating that an abnormality has occurred in the mounting area 40 to the main control device 26, and a display device or a notification device is used to enter the mounting area 40. A process of notifying the operator that an abnormality has occurred may be performed. When receiving information indicating that an abnormality has occurred in the mounting area 40 from the inspection processing unit 32, the main control device 26 stops the mounting operation of the electronic component 18.

  As described above, in the present embodiment, whether or not to perform the process of determining whether there is an abnormality in the peripheral region 50 is selected based on the information regarding the interval (pitch) between the adjacent mounting regions 40. When the interval between the adjacent mounting areas 40 is small, the occurrence of erroneous determination (incorrect inspection) is suppressed by determining whether there is an abnormality in both the mounting area 40 and the peripheral area 50. When the interval between the adjacent mounting areas 40 is large, the processing time (calculation time) can be shortened by determining only whether there is an abnormality in the mounting area 40 without determining whether there is an abnormality in the peripheral area 50.

  In the above-described embodiment, the difference value of the brightness value in the peripheral region 50 is compared with the predetermined threshold value R50 in step SB7. However, based on the information regarding the difference value calculated in step SB6. Thus, the threshold value R50 may be updated. That is, for the first substrate 3, the difference value (total value of a plurality of difference values) detected by the imaging device 14 in a situation in which no abnormality has occurred in the peripheral region 50 is used as the peripheral region of the next second substrate 3. You may use as a threshold value when determining the presence or absence of 50 abnormalities. In addition, when a plurality of difference values (total values of a plurality of difference values) detected by the imaging device 14 in a situation where no abnormality has occurred in the peripheral region 50 are accumulated, the standard deviation is obtained when N number of difference values are obtained. And the value of the standard deviation may be used as a threshold when determining whether there is an abnormality in the peripheral region 50.

  Similarly, in the above-described embodiment, the difference value of the luminance value in the mounting area 40 is compared with the predetermined threshold value R40 in step SB9, but the difference value calculated in step SB4 is related. The threshold value R40 may be updated based on the information. That is, with respect to the first substrate 3, the difference value (total value of a plurality of difference values) detected by the imaging device 14 in a state where no abnormality has occurred in the mounting region 40 is used as the next second substrate 3 mounting region. You may use as a threshold value when determining the presence or absence of 40 abnormalities. In addition, when a plurality of difference values (total values of a plurality of difference values) detected by the imaging device 14 in a situation where no abnormality has occurred in the mounting area 40 and N number of difference values are obtained, the standard deviation is obtained. And the value of the standard deviation may be used as a threshold when determining whether or not there is an abnormality in the mounting area 40.

<Third Embodiment>
A third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 17 is a diagram illustrating an example of pre-mounting image data DAa according to the present embodiment. FIG. 18 is a diagram illustrating an example of post-mounting image data DAb according to the present embodiment. FIG. 17 is a modification of FIG. 8, in which the pre-mounting image data DAa includes an image of the nozzle 10. FIG. 18 is a modification of FIG. 9, in which the post-mounting image data DAb includes an image of the nozzle 10.

  The pre-mounting image data DAa is acquired immediately before the electronic component 18 is mounted on the substrate 3 by the nozzle 10. The post-mounting image data DAb is acquired immediately after the electronic component 18 is mounted on the substrate 3 by the nozzle 10. For example, when the nozzle 10 moves at a high speed during the mounting operation, the nozzle 10 may be imaged by the imaging device 14 in the acquisition of the pre-mounting image data DAa as shown in FIG. As illustrated in FIG. 18, the nozzle 10 may be imaged by the imaging device 14 in acquiring the post-mounting image data DAb. FIG. 17 shows an example in which the nozzle 10 that descends at a high speed in order to mount the electronic component 18 on the substrate 3 is included in the pre-mounting image data DAa. FIG. 18 shows an example in which the nozzle 10 that rises after the electronic component 18 is mounted on the substrate 3 is included in the post-mounting image data DAb.

  The image of the nozzle 10 included in the pre-mounting image data DAa and the image of the nozzle 10 included in the post-mounting image data DAb are highly likely to function as noise components. Therefore, when the correlation value is calculated using the pre-mounting image data DAa and the post-mounting image data DAb including the nozzle 10, it may not be possible to accurately determine the presence / absence of at least one of the mounting region 40 and the peripheral region 50. There is.

  In the present embodiment, when the nozzle 10 is included in the pre-mounting image data DAa and the post-mounting image data DAb, the inspection processing unit 32 removes the nozzle influence range 42 as in the template image data shown in FIG. Mask). The nozzle influence range 42 is a range in which there is a high possibility that the nozzle 10 is disposed in the pre-mounting image data DAa and the post-mounting image data DAb (a range in which there is a high possibility of being captured). The nozzle influence range 42 is known information that can be acquired in advance based on the movement conditions (movement speed and movement path) of the nozzle 10 or experiments.

  The inspection processing unit 32 sets the nozzle influence range 42 as a mask area, removes the nozzle influence range 42, and then sets the pre-mounting image data DAa and the post-mounting image data DAb from which the nozzle influence range 42 has been removed. Align by template matching process. The inspection processing unit 32 calculates a correlation value between the pre-mounting image data DAa and the post-mounting image data DAb using the pre-mounting image data DAa as a template, and the pre-mounting image data DAa and the post-mounting so that the correlation value becomes the highest. Align with the image data DAb. That is, the inspection processing unit 32 removes a part of the data including the nozzle 10 (data included in the nozzle influence range 42) from each of the pre-mounting image data DAa and the post-mounting image data DAb, and converts the partial data. After the removal, the correlation value is calculated by comparing the pre-mounting image data DAa and the post-mounting image data DAb. The inspection processing unit 32 determines the position of the pre-mounting image data DAa and the post-mounting image data DAb having the highest correlation value as the position where the pre-mounting image data DAa and the post-mounting image data DAb match.

  After the alignment, according to the above-described embodiment, the difference value Δm between the luminance value ma of the pre-mounting image data DAa and the luminance value mb of the post-mounting image data DAb in each pixel px is calculated, and the difference value Δm And the threshold value R are compared, and the presence or absence of abnormality in each of the mounting area 40 and the peripheral area 50 is determined based on the comparison result.

  As described above, according to the present embodiment, part of the data including the nozzle 10 is removed (mask process) so that the nozzle influence range 42 is not included in the correlation value calculation. Thus, it is possible to accurately determine whether or not there is an abnormality in at least one of the mounting area 40 and the peripheral area 50.

<Fourth embodiment>
A fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  Similar to the above-described embodiment, also in this embodiment, the pre-mounting image data DAa and the post-mounting image data DAb are acquired for each of a plurality of pixels of the image sensor. At the time of acquiring the pre-mounting image data DAa and at the time of acquiring the post-mounting image data DAb, a luminance value is detected for each pixel (a pixel on which light from the same position is incident) that images the same position of the substrate 3. In addition, a difference value of luminance values is calculated for each of the plurality of pixels.

  Similar to the above-described embodiment, the inspection processing unit 32 aligns the center position 17 of the pre-mounting image data DAa and the center position 17 of the post-mounting image data DAb, and then aligns the pixels of the pre-mounting image data DAa. A difference value Δm between the luminance value ma at px and the luminance value mb at the pixel px of the post-mounting image data DAb that matches the pixel px of the pre-mounting image data DAa is calculated.

  The inspection processing unit 32 includes the luminance value ma (ma1, ma2,..., Mai,..., Man) of the pre-mounting image data DAa in each of the pixels px (px1, px2,..., Pxi). Difference values Δm (Δm1, Δm2,..., Δmi,..., Δmn) from the luminance values mb (mb1, mb2,..., Mbn) of the post-image data DAb are calculated. After the difference value Δm is calculated, the difference value Δm is compared with a predetermined threshold value R, and the presence / absence of abnormality in each of the mounting area 40 and the peripheral area 50 is determined based on the comparison result.

  When the positioning accuracy when comparing the pre-mounting image data DAa and the post-mounting image data DAb is insufficient, mounting based on the difference value Δm for the electronic component 18 having a small mounting area 40 such as a very small chip component. The accuracy of determining whether there is an abnormality in the region 40 and the peripheral region 50 is higher than the accuracy of determining whether there is an abnormality in the mounting region 40 and the peripheral region 50 based on the difference value Δm for the electronic component 18 having a large mounting region 40. There is a high possibility of decline.

  As described above, in the comparison between the pre-mounting image data DAa and the post-mounting image data DAb, the alignment accuracy between the center position 17 of the pre-mounting image data DAa and the center position 17 of the post-mounting image data DAb is sufficient. In this case, for example, a difference value between the luminance value ma1 at the pixel px1 for the pre-mounting image data DAa and the luminance value mb1 at the pixel px1 for the post-mounting image data DAb is calculated. That is, the difference value between the luminance values (ma1, mb1) of the same pixel px1 is calculated between the pre-mounting image data DAa and the post-mounting image data DAb.

  When the pre-mounting image data DAa and the post-mounting image data DAb are compared, if the alignment accuracy between the center position 17 of the pre-mounting image data DAa and the center position 17 of the post-mounting image data DAb is insufficient, the pixel px1 The difference value between the luminance value ma1 and the luminance value mb1 is not calculated. For example, the difference between the luminance value ma1 at the pixel px1 for the pre-mounting image data DAa and the luminance value mb2 at the pixel px2 for the post-mounting image data DAb. A value may be calculated. That is, a difference value between luminance values (ma1, mb2) of different pixels (px1, px2) is calculated between the pre-mounting image data DAa and the post-mounting image data DAb.

  The number of pixels px used to acquire the image data of the electronic component 18 with the small mounting area 40 is larger than the number of pixels px used to acquire the image data of the electronic component 18 with the large mounting area 40. Few. When the pre-mounting image data DAa and the post-mounting image data DAb are compared, the alignment is not sufficiently performed. When the pre-mounting image data DAa and the post-mounting pixel data DAb are compared, the difference between the luminance values of different pixels. When the value is calculated, the accuracy of determining whether there is an abnormality in the mounting area 40 and the peripheral area 50 for the electronic component 18 having a small mounting area 40 is the accuracy of the mounting area 40 and the peripheral area for the electronic component 18 having a large mounting area 40. There is a possibility that it is lower than the accuracy of determination of the presence or absence of 50 abnormalities.

  That is, for the electronic component 18 having a small mounting area 40, even if the pixel px of the pre-mounting image data DAa and the pixel px of the post-mounting image data DAb are shifted by one pixel, the calculated variation amount of the difference value Δm is large. In other words, the electronic component 18 having a small mounting area 40 is more likely to be difficult to obtain a stable difference value (evaluation value) than the electronic component 18 having a large mounting area 40.

  In the present embodiment, as shown in FIG. 20, the inspection processing unit 32 includes a mounting area 40 in the step of comparing the pre-mounting image data DAa and the post-mounting image data DAb (see step SA6 in FIG. 7). A step (step SC1) of aligning the pre-mounting image data DAa and the post-mounting image data DAb by template matching processing in the first window (arithmetic processing target region), and a second including the mounting region 40 after step SC1. A step (step SC2) of aligning the pre-mounting image data DAa and the post-mounting image data DAb by template matching processing in the window (arithmetic processing target region) is executed.

  The first window is a large area including the mounting area 40 (electronic component 18). The second window includes a mounting area 40 and is smaller than the first window. The number of pixels in the second window is smaller than the number of pixels in the first window. In step SC1, the inspection processing unit 32 calculates a correlation value between the pre-mounting image data DAa and the post-mounting image data DAb using the pre-mounting image data DAa as a template in the first window so that the correlation value becomes the highest. The pre-mounting image data DAa and post-mounting image data DAb are aligned. The inspection processing unit 32 determines the position of the pre-mounting image data DAa and the post-mounting image data DAb having the highest correlation value as the position where the pre-mounting image data DAa and the post-mounting image data DAb match.

  After step SC1, the inspection processing unit 32 calculates a correlation value between the pre-mounting image data DAa and the post-mounting image data DAb using the pre-mounting image data DAa as a template in a second window smaller than the first window, The pre-mounting image data DAa and the post-mounting image data DAb are aligned so that the correlation value becomes the highest. The inspection processing unit 32 determines the position of the pre-mounting image data DAa and the post-mounting image data DAb having the highest correlation value as the position where the pre-mounting image data DAa and the post-mounting image data DAb match.

  After the positioning of the pre-mounting image data DAa and the post-mounting image data DAb by the two-stage template matching processing, the luminance value ma of the pre-mounting image data DAa in each pixel px and the mounting according to the above-described embodiment. A difference value Δm from the luminance value mb of the post-image data DAb is calculated, the difference value Δm and the threshold value R are compared, and the presence / absence of abnormality in each of the mounting area 40 and the peripheral area 50 is determined based on the comparison result. Is done.

  As described above, according to the present embodiment, the mounting area 40 and the peripheral area for the electronic component 18 having a small mounting area 40 are obtained by performing matching processing in two stages based on different windows (arithmetic processing target areas). A decrease in accuracy in determining whether there are 50 abnormalities is suppressed.

<Fifth Embodiment>
A fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the above-described embodiment, the example in which the template matching process is used for positioning the pre-mounting image data DAa and the post-mounting image data DAb has been described. In the present embodiment, an example of determining whether there is an abnormality in the mounting state of the electronic component 18 in the mounting area 40 based on the correlation value between the pre-mounting image data DAa and the post-mounting image data DAb calculated by the template matching process. Will be described.

  For example, as described with reference to FIG. 7, the pre-mounting image data DAa is acquired (step SA1), the pre-mounting image data DAa is stored (step SA2), and the electronic component 18 is mounted on the substrate 3 (step SA1). SA3), post-mounting image data DAb is acquired (step SA4), and post-mounting image data DAb is stored (step SA5). After step SA5, the pre-mounting image data DAa and the post-mounting image data DAb are compared (step SA6).

  FIG. 21 is a flowchart showing an example of steps for comparing the pre-mounting image data DAa and the post-mounting image data DAb according to the present embodiment. The process shown in FIG. 21 corresponds to the subroutine of step SA6 in FIG.

  As shown in FIG. 21, the step of comparing the pre-mounting image data DAa and the post-mounting image data DAb is a step of calculating a correlation value between the pre-mounting image data DAa and the post-mounting image data DAb by the template matching process (step). SD1), and when the correlation value calculated in step SD1 is greater than or equal to the second threshold value, the step of determining that the mounting state of the electronic component 18 in the mounting region 40 is abnormal (step SD3) and the step SD1 A step of determining that the mounting state of the electronic component 18 in the mounting area 40 is normal when the correlation value is equal to or less than the first threshold (step SD5).

  Template matching processing is performed on the pre-mounting image data DAa and the post-mounting image data DAb, and a correlation value is calculated (step SD1). For example, the inspection processing unit 32 calculates the correlation value between the pre-mounting image data DAa and the post-mounting image data DAb using the pre-mounting image data DAa as a template, and the pre-mounting image data DAa so that the correlation value becomes the highest. Alignment with post-mounting image data DAb is performed. The inspection processing unit 32 determines the position of the pre-mounting image data DAa and the post-mounting image data DAb having the highest correlation value as the position where the pre-mounting image data DAa and the post-mounting image data DAb match.

  When the correlation value is high, there is a high possibility that the pre-mounting image data DAa and the post-mounting image data DAb match. When the correlation value is low, there is a high possibility that the pre-mounting image data DAa and the post-mounting image data DAb do not match. When the electronic component 18 is not mounted on the mounting area 40, the correlation value is high because the pre-mounting image data DAa and the post-mounting image data DAb match. When the electronic component 18 is mounted in the mounting area 40, the correlation value is low because the pre-mounting image data DAa and the post-mounting image data DAb do not match.

  After the correlation value is calculated, it is determined whether or not the correlation value is greater than or equal to a second threshold value (step SD2). If it is determined in step SD2 that the correlation value is greater than or equal to the second threshold value (Yes), it is determined that the mounting state of the electronic component 18 in the mounting area 40 is abnormal (step SD3).

  When it is determined in step SD2 that the correlation value is smaller than the second threshold value (No), it is determined whether or not the correlation value is equal to or less than the first threshold value (step SD4). The second threshold is a value larger than the first threshold.

  In step SD4, when it is determined that the correlation value is equal to or less than the first threshold value (in the case of Yes), it is determined that the mounting state of the electronic component 18 in the mounting area 40 is normal (step SD5).

  If it is determined in step SD4 that the correlation value is larger than the first threshold value (in the case of No), that is, it is determined that the correlation value calculated in step SD1 is larger than the first threshold value and smaller than the second threshold value. In this case, the step of comparing the pre-mounting image data DAa and the post-mounting image data DAb is completed. Thereafter, the process of step SA7 shown in FIG. 7 is executed.

  As described above, the process of step SA7 shown in FIG. 7 calculates the difference value Δm between the luminance value ma and the luminance value mb for each pixel px of the image sensor between the pre-mounting image data DAa and the post-mounting image data DAb. Comparing the difference value Δm with predetermined threshold values R40 and R50, and determining whether there is an abnormality in each of the mounting region 40 and the peripheral region 50 based on the comparison result. Including.

  FIG. 22 is a diagram schematically illustrating a relationship among the first threshold value, the second threshold value, the correlation value, and the content of the process. As shown in FIG. 22, the second threshold value is larger than the first threshold value. When the pre-mounting image data DAa matches the post-mounting image data DAb, the correlation value is high. When the pre-mounting image data DAa and the post-mounting image data DAb do not match, the correlation value is low. Therefore, when the electronic component 18 is not mounted on the mounting area 40, the correlation value becomes high. When the electronic component 18 is mounted on the mounting area 40, the correlation value becomes low. Therefore, when it is determined in step SD2 that the correlation value is equal to or greater than the second threshold value, it can be determined that the mounting state is abnormal (the electronic component 18 is not mounted in the mounting region 40). If it is determined in step SD4 that the correlation value is equal to or less than the first threshold value, it can be determined that the mounting state is normal (the electronic component 18 is mounted in the mounting area 40).

  On the other hand, when it is determined that the correlation value is larger than the first threshold value and smaller than the second threshold value, the presence or absence of abnormality in each of the mounting area 40 and the peripheral area 50 is determined using the correlation value that is the result of the template matching process. It is judged that it cannot be done. In that case, as described in the above-described embodiment, the difference value Δm between the luminance value ma and the luminance value mb for each pixel px is calculated. Based on the difference value Δm, the abnormality of each of the mounting area 40 and the peripheral area 50 is detected. Presence / absence is determined.

  As described above, according to the present embodiment, the correlation value is obtained using the template matching process that requires a short time for the calculation, and the correlation value is very large (when it is equal to or larger than the second threshold), Since it is determined that the mounting state is abnormal and the correlation value is very small (below the first threshold value), the mounting state is determined to be normal. Can be determined by time. Also, when the correlation value is an intermediate value (when larger than the first threshold and smaller than the second threshold), the difference value Δm is calculated without determining whether there is an abnormal mounting state based on the correlation value, Since the difference value Δm is used to determine whether there is an abnormality in the mounting state, the determination can be made accurately. As described above, according to the present embodiment, the presence / absence of an abnormality in the mounting state is determined by different methods depending on whether the correlation value is very large or small and the correlation value is an intermediate value. The time required for determination can be shortened while suppressing a decrease in determination accuracy.

<Sixth Embodiment>
A sixth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 23 is a diagram illustrating an example of the substrate 3 according to the present embodiment. As shown in FIG. 23, a line, a figure, a mark, a pattern, and a character may be provided on the substrate 3 in some cases. These lines, figures, marks, patterns, and characters are generally called silk 43. The color of the substrate 3 and the color of the silk 43 are different. In the present embodiment, the substrate 3 (base) is black, and the silk 43 is white. In addition, the board | substrate 3 may be not only black but green or white, for example. The silk 43 may be not only white but also yellow or black, for example.

  For example, when the substrate 3 is black and the silk 43 is white, the contrast between the substrate 3 and the silk 43 may increase. As a result, there is a high possibility that the image data includes noise.

  As described with reference to FIG. 16, the inspection processing unit 32 performs a process of removing noise from the difference image data DS (step SB3). As described with reference to FIG. 16, when a high-contrast portion of the substrate 3 (electronic component 18), such as a boundary portion between the electronic component 18 and the substrate 3, is imaged by the image sensor, the high-contrast portion Image data may contain a lot of noise components. Therefore, the inspection processing unit 32 acquires the luminance value detected by each of the plurality of pixels of the image sensor, and detects a luminance value equal to or higher than a predetermined threshold among the luminance values detected by each of the plurality of pixels. The difference image data DS is created by excluding data from the pixels that have been processed. The creation of the difference image data DS includes a step of calculating the difference value of the luminance value for each pixel of the image sensor between the pre-mounting image data DAa and the post-mounting image data DAb after removing the data.

  The contrast at the boundary between the silk 43 and the substrate 3 (base) is larger than the contrast at the boundary between the electronic component 18 and the substrate 3, for example. Therefore, the image data about the boundary between the silk 43 and the substrate 3 may include a very high noise component. That is, the generated noise level changes depending on whether the silk 43 is present or not.

  In the present embodiment, when the silk 43 is present, the inspection processing unit 32 excludes data from pixels that have detected a luminance value equal to or higher than a predetermined threshold among the luminance values detected by each of the plurality of pixels. Then, difference image data DS is created. The threshold value regarding the luminance value at the boundary portion between the silk 43 and the substrate 3 is larger than, for example, the threshold value regarding the luminance value at the boundary portion between the electronic component 18 and the substrate 3. In this way, the inspection processing unit 32 changes the threshold for cutting the noise in consideration of the noise level that changes depending on the presence or absence of the silk 43.

  For example, as shown in FIG. 23, when the silk 43 (silk printing solder) is present in the mounting area 40, the inspection processing unit 32 determines the presence or absence of the silk 43 in the mounting area 40 based on the pre-mounting image data DAa. judge. When the inspection processing unit 32 acquires the luminance value of the mounting area 40 of the pre-mounting image data DAa and determines that the ratio of the number of pixels having a high luminance value is high, the inspection processing unit 32 determines that the silk 43 exists in the mounting area 40. it can. When the inspection processing unit 32 determines that the silk 43 is present in the mounting area 40, the inspection processing unit 32 increases the threshold for cutting noise.

  As described above, according to the present embodiment, when there is a silk 43 that easily generates noise, the threshold for cutting noise is changed (increased), so that noise can be cut. .

  Note that the process of increasing the threshold for cutting noise is applicable not only to the case where the silk 43 is present but also to a structure having a high luminance value arranged on the substrate 3.

<Seventh embodiment>
A seventh embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  Similar to the above-described embodiment, the inspection processing unit 32 calculates a difference value Δm between the luminance value ma and the luminance value mb for each pixel px of the image sensor between the pre-mounting image data DAa and the post-mounting image data DAb.

  As shown in FIG. 24, the traveling direction of the light reflected by the partial region 45 on the surface of the solder paste 16 of the substrate 3 may change due to, for example, the deflection and inclination of the substrate 3. When the traveling direction of the light reflected by the region 45 changes, the light enters the imaging device of the imaging device 14 with a high luminance value (intensity), enters the imaging device with a low luminance value, or enters the imaging device. There is a possibility of not. Therefore, the imaging device 14 is incident on the imaging device when acquiring the pre-mounting image data DAa and when acquiring the post-mounting image data DAb, even though the same position (same part) of the substrate 3 is imaged. There is a possibility that the luminance value of the light to be changed will change. As a result, for example, the inspection processing unit 32 mounts the electronic component 18 in the mounting area 40 even though the electronic component 18 is not mounted in the mounting area 40 (although the mounting state is abnormal). (There is a possibility that the mounting state is normal).

  Therefore, in the present embodiment, an upper limit value of the luminance value is set, and the pre-mounting image data DAa and the post-mounting image data DAb are corrected based on the upper limit value.

  FIG. 25 is a diagram for explaining the upper limit value of the luminance value. In the graph shown in FIG. 25, the horizontal axis indicates the luminance values of the pre-mounting image data DAa and the post-mounting image data DAb derived from the detection result of the imaging device 14. The vertical axis indicates the luminance values of the pre-mounting image data DAa and the post-mounting image data DAb after correction.

  In the example shown in FIG. 25, the upper limit value of the luminance value is set to about 180. In the example shown in FIG. 25, all the luminance values such as the luminance value 190 and the luminance value 230 of the pre-mounting image data DAa and the post-mounting image data DAb are corrected to the luminance value 180.

  Thus, in this embodiment, the upper limit value of the luminance value is provided, and when the luminance value is equal to or higher than the upper limit value, the luminance value is corrected to the upper limit value. Thereby, generation | occurrence | production of the misjudgment regarding the presence or absence of abnormality of a mounting state can be suppressed.

  In addition, in the acquisition of the pre-mounting image data DAa and the acquisition of the post-mounting image data DAb for the same part of the substrate 3, a misjudgment regarding the presence or absence of an abnormality in the mounting state due to a change in the luminance value of the light incident on the image sensor When the difference value Δm (difference image data DS) of the luminance value for each pixel px of the pre-mounting image data DAa and the post-mounting image data DAb exceeds a certain value, the difference value Δm is A value divided by 2 may be added to the luminance value of the pre-mounting image data DAa to obtain the luminance value of the post-mounting image data DAb after correction.

  FIG. 26 is a schematic diagram for explaining a process of dividing the difference value Δm by 2. In the graph shown in FIG. 26, the horizontal axis indicates the luminance value of the difference image data DS. The vertical axis represents the luminance value of the post-mounting image data DAb after correction.

  When the difference value of the luminance of one pixel exceeds a certain value, it can be considered that there is a sudden change in the luminance value of light incident on the image sensor before and after the electronic component 18 is mounted on the substrate 3. it can.

  In this embodiment, when the difference value becomes larger than a certain value, the difference value (the pre-mounting image data DAa and the post-mounting image data DAb for calculating the difference value) is not removed, and the difference value A value of 1/2 is calculated. A half value of the difference value is added to the luminance value of the pre-mounting image data DAa. Thereby, the luminance value of the post-mounting image data DAb after correction is derived.

  As described above, the upper limit value is set to 180, for example. The constant value is set to 120, for example. When the difference value of the luminance value of one pixel exceeds 120, it can be considered that there is a sudden change in the luminance value before and after mounting. As an effect of reducing the weight of the luminance value of the pixel, a half value of the difference value is added.

  In addition, in the acquisition of the pre-mounting image data DAa and the acquisition of the post-mounting image data DAb for the same part of the substrate 3, a misjudgment regarding the presence or absence of an abnormality in the mounting state due to a change in the luminance value of the light incident on the image sensor In order to suppress the occurrence of the above, the process of correcting the luminance value to the upper limit value when the luminance value is equal to or higher than the upper limit value, and the pixel px of each of the pre-mounting image data DAa and the post-mounting image data DAb When the difference value Δm (difference image data DS) of the luminance value exceeds a certain value, the difference value Δm may be divided by 2 and the divided value may be added.

<Eighth Embodiment>
An eighth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  In the mounting operation, there is a possibility that the substrate 3 held by the substrate holding part of the transfer device 2 is deformed. For example, the substrate 3 may be bent and deformed (upwardly deformed) so that the upper surface of the substrate 3 protrudes upward while being held by the substrate holder.

  In addition, since the lower surface of the substrate 3 is held by the substrate holding portion, the possibility that the substrate 3 is bent and deformed (downwardly deformed) so that the lower surface of the substrate 3 protrudes downward is low.

  FIG. 27 is a diagram illustrating an example of the relationship between the imaging device 14 and the substrate 3. In FIG. 27, the substrate 3 is not deformed. The upper surface of the substrate 3 is flat. As shown in FIG. 27, in the present embodiment, the imaging device 14 is disposed above the upper surface of the substrate 3. The imaging device 14 images the upper surface of the substrate 3 from a direction inclined with respect to the normal line of the upper surface of the substrate 3. The positional relationship between the imaging device 14 and the substrate holder that holds the substrate 3 is adjusted so that the center of the window of the imaging device 14 and the center position 17 of the mounting area 40 coincide.

  FIG. 28 is a diagram illustrating an example of the relationship between the imaging device 14 and the substrate 3. In FIG. 28, the substrate 3 is warped and deformed. Even if the positional relationship between the imaging device 14 and the substrate holding unit that holds the substrate 3 is adjusted so that the center of the window of the imaging device 14 and the center position 17 of the mounting area 40 coincide with each other, as shown in FIG. In addition, the center of the window of the imaging device 14 and the center position 17 of the mounting area 40 may be shifted due to the warping deformation of the substrate 3.

  In the present embodiment, the shift of the center of the window from the center position 17 of the mounting area 40 means that the positional relationship in a plane parallel to the upper surface of the substrate 3 (in the horizontal plane in the present embodiment) changes. Say. In the present embodiment, there is a possibility that the center of the window of the imaging device 14 and the center position 17 of the mounting area 40 in the horizontal plane are shifted due to the warping deformation of the substrate 3.

  FIG. 29 is a diagram illustrating an example of the mounting area 40 imaged by the imaging device 14. In a state where the substrate 3 is not deformed, the mounting area 40 is disposed in the window. In FIG. 29, the mounting area 40 when the substrate 3 is not deformed is indicated by a dotted line.

  When the substrate 3 is warped and deformed, the mounting area 40 is shifted in a certain direction from the center of the window. In FIG. 29, the mounting area 40 when the substrate 3 is warped and deformed is indicated by a solid line.

  In the present embodiment, as shown in FIG. 29, a window (arithmetic processing target area) is set in consideration of the shift amount. That is, in consideration of the shift amount of the mounting area 40 due to the warping deformation of the substrate 3, even if the mounting area 40 is shifted, the window is set so that the mounting area 40 is continuously arranged in the window.

  The amount of shift (shift amount) of the substrate 3 in the horizontal plane can be calculated geometrically from the amount of warpage deformation of the substrate 3.

  When the position of the mounting area 40 in the horizontal plane is shifted due to the warping deformation of the substrate 3, at least a part of the mounting area 40 may come out of the window of the imaging device 14. By increasing the size of the window, it is possible to prevent the mounting area 40 from coming out of the window even if the position of the mounting area 40 is shifted. However, as described in the above embodiment, when the window is enlarged, there is a possibility that a lot of noise components are included in the image data.

  In the present embodiment, the window is set in consideration of the shift amount of the mounting area 40 without changing the size of the window. That is, the window is set so that the mounting area 40 is continuously arranged in the window in both the state where the substrate 3 is not deformed and the state where the substrate 3 is warped and deformed.

  As described above, according to the present embodiment, the window of the image sensor that is the calculation processing target area in each of the state in which the substrate 3 held by the substrate holding portion is bent and deformed (upwardly deformed) and the state in which the substrate 3 is not deformed. The window is set so that the mounting area 40 continues to be arranged. Therefore, it can suppress that noise is contained in image data.

<Ninth Embodiment>
A ninth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  As in the above-described embodiment, a step of comparing the pre-mounting image data DAa and the post-mounting image data DAb (see step SA6 in FIG. 7) is performed. In the comparison step, as in the above-described embodiment, the inspection processing unit 32 aligns the center position 17 of the pre-mounting image data DAa and the center position 17 of the post-mounting image data DAb. Then, the inspection processing unit 32 calculates a difference value between the luminance value ma in the pixel px of the pre-mounting image data DAa and the luminance value mb in the pixel px of the post-mounting image data DAb that matches the pixel px of the pre-mounting image data DAa. Δm is calculated.

  FIG. 30 is a diagram illustrating an example of pre-mounting image data DAa according to the present embodiment. FIG. 31 is a diagram illustrating an example of the difference image data DS according to the present embodiment.

  As shown in FIG. 30, in the pre-mounting image data DAa, there is a possibility that the above-described difference value Δm is calculated in a state where the mounting area 40 is actually deviated from the correct mounting area. In that case, the difference value becomes small in the shifted area. As a result, the mounted state may be determined to be abnormal (incorrect determination) even though it is normal.

  In order to prevent such misjudgment, the threshold value R40 may be reduced when the difference value Δm is biased. For example, as shown in FIGS. 30 and 31, when the electronic component 18 is mounted on the upper side of the mounting area 40 in the drawing, the difference value Δm is obtained in the upper half area (upper half area) 44 of the mounting area 40. growing. Therefore, when it is determined that the ratio of the upper half area 44 having a large difference value Δm with respect to the entire mounting area 40 is high, it is determined that the actual mounting area is shifted from the mounting area 40 in the image data. The determination of whether or not there is an abnormality in the mounting area 40 is made based on a new threshold value obtained by halving the threshold value R40.

DESCRIPTION OF SYMBOLS 1 Base 2 Conveyor 2R Conveyance path 3 Substrate 4 Supply part 5 Parts feeder 6 X-axis table 7 Transfer head 8A Y-axis table 8B Guide member 9 Camera 10 Nozzle 10D Drive system 11 Nozzle shaft 12 θ-axis motor 13 Z-axis motor 14 Imaging Device 15 Camera 16 Solder Paste 17 Center Position 18 Electronic Component 18A Body Part 18B Electrode Part 25 CPU
26 Main controller 30 Image data storage unit (pre-mounting image data storage unit)
31 Image data storage unit (image data storage unit after installation)
32 inspection processing unit 32A image analysis processing unit 32B mounting region determination processing unit 32C peripheral region determination processing unit 33 differential image data storage unit 34 determination result storage unit 35 control device 36 determination result processing unit 37 inspection device 40 mounting region 40E peripheral mounting region 50 Peripheral area 52 Base member 54 Holder 56 Ball screw 100 Mounting device DAa Image data before mounting DAb Image data DS after mounting Difference image data

Claims (10)

  1. An inspection method performed in mounting electronic components on a substrate,
    Before mounting the electronic component on the mounting area of the substrate, acquiring image data including the mounting area and a peripheral area of the substrate around the mounting area by an imaging device;
    Obtaining image data including the mounting area and the peripheral area after mounting the electronic component on the mounting area;
    Calculating a difference value of a luminance value for each pixel of the imaging element between the image data of the mounting area before mounting and the image data of the mounting area after mounting;
    Comparing the difference value with a predetermined threshold ;
    Determining whether there is an abnormality in the mounting area based on the result of the comparison;
    Selecting whether or not to calculate the difference value of the luminance value for each pixel of the imaging element between the image data of the peripheral area before mounting and the image data of the peripheral area after mounting;
    Including inspection methods.
  2. The inspection method according to claim 1 , further comprising a step of updating the threshold based on information on a plurality of the difference values.
  3. Setting an upper limit of the luminance value;
    On the basis of the upper limit, the inspection method according to claim 1 or claim 2 including a step of correcting the image data after the image data and the mounting of the front the mounting.
  4. The determination of the presence or absence of the mounting area abnormalities, inspection method according to any one of claims 1 to 3, including the determination of the presence or absence of the mounting state of the electronic component for mounting region abnormality.
  5. The nozzle that holds the electronic component and can be mounted on the substrate is included in the image data before the mounting and the image data after the mounting,
    Removing a part of the data including the nozzle from each of the image data before the mounting and the image data after the mounting,
    After the portion of data has been removed, the inspection method according to claim 1 or claim 2 step of comparing the image data after the mounting and the image data before the mounting is performed.
  6. The step of comparing the image data before mounting and the image data after mounting includes the image data before mounting and the image data after mounting by template matching processing in a first window including the mounting area. And aligning the image data before mounting and the image data after mounting in the second window that includes the mounting area and is smaller than the first window by the template matching process. The inspection method according to any one of claims 1 to 5 , comprising:
  7. The step of comparing the image data before mounting and the image data after mounting,
    Calculating a correlation value between the image data before mounting and the image data after mounting by template matching processing;
    Determining that the mounting state of the electronic component in the mounting region is normal when the correlation value is equal to or less than a first threshold;
    Determining that the mounting state of the electronic component in the mounting region is abnormal when the correlation value is greater than or equal to a second threshold,
    When the correlation value is larger than the first threshold value and smaller than the second threshold value, a difference value of a luminance value for each pixel of the image sensor between the image data before mounting and the image data after mounting is calculated. The inspection method according to claim 1, wherein the inspection method calculates and determines whether there is an abnormality in at least one of the mounting area and the peripheral area.
  8. The substrate is held by a substrate holding unit,
    The window is set so that the mounting area continues to be arranged in the window of the imaging element, which is a calculation processing target area, in each of a state where the substrate held by the substrate holding portion is bent and deformed and a state where the substrate is not deformed. The inspection method according to any one of claims 1 to 7 .
  9. A mounting method for mounting electronic components on a substrate,
    In the inspection method as claimed in any one of claims 8, mounting method comprising the step of inspecting at least one of the mounting region and the peripheral region.
  10. A mounting device for mounting electronic components on a substrate,
    A nozzle that holds the electronic component and can be mounted on the substrate;
    An imaging apparatus including an imaging element that acquires image data including the mounting area and a peripheral area of the substrate around the mounting area before and after mounting of the electronic component with respect to the mounting area of the substrate;
    A difference value of a luminance value for each pixel of the image sensor between the image data of the mounting area before mounting and the image data of the mounting area after mounting is calculated, and the difference value and a predetermined threshold value are calculated. Based on the comparison result, the presence / absence of abnormality in the mounting area is determined , and the luminance value for each pixel of the image sensor of the image data of the peripheral area before mounting and the image data of the peripheral area before mounting and after And a processing device that selects whether or not to calculate the difference value .
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JP2017034202A (en) * 2015-08-06 2017-02-09 Juki株式会社 Inspection device, mounting device, inspection method and program
WO2017064774A1 (en) * 2015-10-14 2017-04-20 ヤマハ発動機株式会社 Substrate working system and component mounting device
WO2017064786A1 (en) * 2015-10-15 2017-04-20 ヤマハ発動機株式会社 Component mounting apparatus
JP2017150927A (en) * 2016-02-24 2017-08-31 Juki株式会社 Inspection device, mounted device, inspection method, and program
CN110024511A (en) * 2016-12-01 2019-07-16 株式会社富士 The production management system of element mounting production line

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