JPH11289199A - Electronic parts recognizing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the sucked attitude of electronic parts accurately recognizable, by controlling a moving mechanism based on the positional data of a first storing means when the image of the parts is picked up at a first position, or based on the positional data of a second storing means when the image is picked up at a second position. SOLUTION: Each mounting head 12 is incorporated with a motor which rotates electronic parts S in a horizontal plane through a suction nozzle 25. When parts recognition is performed on electronic parts S (for example, Sa) by utilizing an LED group 61a for reflected illumination, the parts Sa are caused to reflect the light La from the LED group 61a for recognizing lead pins, etc., around the parts Sa. In this case, the electronic parts Sa sucked by means of the suction nozzle 25 for mounting the parts Sa on a substrate are lowered to the position of the focal plane (focal point) Fp of a parts recognizing camera 13 which is a prescribed image picking-up position to which the camera 13 is focused, and the parts Sa are recognized by picking up the image of the parts Sa with the camera 13 by utilizing the reflected light La from the reflective illumination 61.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component recognition device used for an electronic component mounting device, for example.

[0002]

2. Description of the Related Art For example, in a conventional electronic component recognition apparatus in an electronic component mounting apparatus, before mounting an electronic component, an electronic component (recognition target component) sucked by a mounting (suction) nozzle to be mounted on a substrate is replaced with a component. The recognition camera is lowered to a predetermined imaging position (focal position) at which the recognition camera is in focus, and an image of the electronic component is captured by the component recognition camera using reflected light from reflected illumination or transmitted light from transmitted illumination to perform component recognition.

In this case, the electronic component recognizing apparatus uses image recognition to determine the suction attitude (suction position, suction angle, etc.) of the recognition target component in an X / Y coordinate system of the component recognition camera based on predetermined position data. After recognizing the values as the direction and the angle θ, the electronic component mounting device including the electronic component recognition device corrects the suction attitude based on the recognition result, and then mounts the electronic component S on the board.

[0004]

In the conventional electronic component recognition apparatus as described above, in a component recognition camera, reflection or transmission is performed so that the best image can be obtained when a recognition target component is captured at a focal position. Determine the lighting arrangement,
Depending on the type (part type) of the recognition target component, an image suitable for component recognition cannot be obtained at the angle of light from the illumination.

However, installing a dedicated illumination and a component recognition camera having a different focus position for each component type not only increases the equipment cost but also requires a physical space and requires a complicated structure. And the control becomes complicated.

The present invention provides an electronic component recognizing apparatus capable of accurately recognizing the suction posture of a component to be recognized even if the imaging position is changed according to the type of the component to be recognized while utilizing an existing mechanism. The purpose is to:

[0007]

SUMMARY OF THE INVENTION An electronic component recognition apparatus according to the present invention includes a mounting head for holding an electronic component, a component recognition camera for imaging the electronic component held on the mounting head from below, and an electronic component for imaging. A lighting device for illuminating, a head elevating mechanism for elevating and lowering the mounting head, and varying the imaging position of the electronic component within the depth of focus of the component recognition camera, and an XY moving mechanism for moving the mounting head in the XY directions in a horizontal plane A control means for controlling the XY moving mechanism so that the center of the electronic component faces the center of the field of view of the component recognition camera, and stores the position data of the center of the field of view when the imaging position is the first position within the depth of focus. A first storage unit; and a second storage unit that stores position data of a center of the field of view when the imaging position is set to a second position within the depth of focus. When the child part is imaged at the first position, the XY moving mechanism is controlled based on the position data in the first storage means. The XY movement mechanism is controlled based on position data.

Generally, once the position of the center of the field of view is determined, the coordinate system of the component recognition camera can be determined based on the data (position data). If the movement (position) of the recognition target component (the mounting head that holds the recognition target component) is controlled so as to match the center of the visual field, an appropriate captured image (data) can be obtained in a coordinate system based on the position data. The suction posture can be recognized.

However, if the imaging position of the part to be recognized is different depending on the part type or the like, if the same position data is used uniformly as the position data to be used as the reference of the coordinate system of the part recognition camera, the part cannot be used. It is not possible to accurately recognize the posture of suction. In this electronic component recognition device, since the position data corresponding to the imaging position of the recognition target component is used, the XY moving mechanism for moving the component can be appropriately controlled, and thereby the component's suction posture and the like can be accurately recognized.

Since both the first position and the second position are within the depth of focus of the component recognition camera, the image of the electronic component can be sufficiently recognized with recognizable clarity. There is no need to install it. And other components, namely the mounting head, the lighting equipment, the head elevating mechanism,
Since the XY moving mechanism and the like are also existing mechanisms in, for example, an electronic component mounting apparatus, they can be used, so that the mechanism (structure) and the like do not become complicated.

Further, since the reference position data which has been required in the past is merely made to correspond to the imaging position, the control does not become complicated. Therefore, the electronic component recognition device can accurately recognize the suction posture of the component even if the imaging position is changed according to the type of the component to be recognized, etc., while using the existing mechanism. If one of the imaging positions, that is, the first position or the second position is the focus position of the component recognition camera, the existing position data can be used, so that the applicability from the existing device is further improved. improves.

In the electronic component recognition apparatus according to the first aspect, the position data includes XY-direction deviation data, and the deviation data is obtained when the imaging position is set as the focal position of the component recognition camera. It is preferable that the deviation data included in the position data of the center of the visual field is corrected by a deviation based on a difference in angle between the axis of the electronic component and the optical axis of the component recognition camera.

In this electronic component recognizing device, the position data includes the deviation data in the X and Y directions. Therefore, in the coordinate system of the component recognition camera based on the position data, the position deviation (deviation) in the X and Y directions of the component to be recognized is determined. Can be recognized.
Also, for example, in an electronic component mounting device to which the electronic component recognition device is applied, based on the recognition result, it is possible to detect a shift in the XY direction of the picked-up recognition target component and perform correction or the like.

The displacement data contained in the position data of the center of the field of view when the imaging position is set as the focal position of the component recognition camera, that is, the displacement data contained in the conventional reference position data, is used to move the electronic component up and down. The deviation data of the position data at the first position and the second position can be obtained only by correcting the deviation based on the difference between the angle between the axis at and the optical axis of the component recognition camera. Therefore, even if the imaging position is changed according to the type of the recognition target component or the like, not only the existing mechanism but also the existing position data can be used, so that the applicability from the existing device is further improved.

[0015] In the electronic component recognition apparatus according to claim 1 or 2, it is preferable that the position data include magnification data in imaging.

In this electronic component mounting apparatus, since the position data includes magnification data in imaging, the imaging position of the recognition target component differs depending on the component type or the like, that is, even if the distance between the component recognition camera and the recognition target component differs. , The difference due to the difference can be recognized. For this reason, for example, an electronic component mounting apparatus to which this electronic component recognition device is applied, based on the recognition result, accurately recognizes, for example, pitches between leads, between pins, between solder balls, and the like, and performs correction, etc. Can be.

Preferably, in the electronic component recognition device according to any one of claims 1 to 3, the position data includes rotation angle data in a horizontal plane.

In this electronic component mounting apparatus, since the position data includes the rotation angle data in the horizontal plane, the deviation of the suction angle of the recognition target component can be recognized in the coordinate system of the component recognition camera based on the position data. . In addition, for example, in an electronic component mounting device to which the electronic component recognition device is applied, it is possible to detect and correct a shift in the suction angle of the suctioned recognition target component based on the recognition result.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component mounting apparatus to which an electronic component recognition apparatus according to an embodiment of the present invention is applied will be described with reference to the accompanying drawings.

FIG. 1 is a plan view of an electronic component mounting apparatus.
The electronic component mounting apparatus 1 is a so-called multifunctional chip mounter, and includes other components such as a circuit element component Sp such as a chip capacitor and a chip resistor and a multi-lead package component (multi-lead component) Sl such as a QFP (Quad Flat Package). , PGA with one or more bare chips (Pi
area array package parts (grid parts) Sg such as n Grid Array) and BGA (Ball Grid Array)
It is configured such that various electronic components S (Sp, Sl, Sg) can be mounted.

As shown in FIG.
A machine unit 2, a conveyor unit 3 extending in the left-right direction at the center of the machine unit 2, a first component supply unit 4 a arranged at the front (lower side in the figure) of the machine unit 2, A second component supply unit 4b disposed at the rear (upper side in the drawing) of the table 2, a first XY stage 6a movably disposed at the front of the table 2, and a movably disposed at the rear of the table 2; And the second XY stage 6b provided.

On the first XY stage 6a, there is provided a first head unit 8a for sucking and mounting the electronic component S.
Similarly, the second head unit 8b is mounted on the second XY stage 6b. Each head unit 8
(8a, 8b) includes one substrate recognition camera 11 and two mounting heads 1 so as to be attached to the support member 10.
2 and 12 are mounted.

Further, on the machine base 2, a pair of two sets of component recognition units 60 and two nozzle stockers 14 are respectively arranged with the conveyor section 3 interposed therebetween. In this case, the pair of component recognition units 60 and the nozzle stocker 14 located at the front correspond to the first head unit 8a, and the pair of component recognition units 60 and the nozzle stocker 14 located at the rear correspond to the second head unit 8b. doing. In the vicinity of the front nozzle stocker 14,
Deflection recognition unit 1 for accommodating a dummy component 40 described later
5 are provided.

In this electronic component mounting apparatus 1, a small electronic component S such as a surface mount component is supplied from a first component supply unit 4a and a second component supply unit 4b, and a large electronic component S such as a multi-pin IC component is It is supplied from a tray type component supply unit (not shown). The substrate is supplied from the left side by the conveyor unit 3 and is immovably set at the center of the machine base 2.
It is discharged to the right. Normally, the first XY stage 6a
And the second XY stage 6b are operated alternately.

For example, in mounting the electronic component S using the first XY stage 6a, the first XY stage 6a allows the first head unit 8a to face the first component supply unit (other component supply unit is possible) 4a, and The mounting head 12 is lowered by the elevating mechanism 26 to suck a desired electronic component S.

Subsequently, after the mounting head 12 is raised to a predetermined position, the electronic component S is made to face the component recognition camera 13 of the component recognition unit 60.
Is lifted up and the suction posture of the electronic component S is recognized.
Move the head unit 8a to a predetermined position on the substrate,
Similarly, after the board position and the mounting position on the board are recognized by the board recognition camera 11, the electronic component S is mounted on the board.

At this time, based on the recognition result of the component recognition camera 13, correction of a deviation between a design value (nozzle position of the mounting head) and a suction posture (suction position, suction angle, etc.) of the sucked electronic component S is corrected. Is performed, and the deviation between the design value, the board position, and the mounting position on the board is corrected based on the recognition result of the board recognition camera 11.

In this case, by image recognition, the suction posture of the recognition target component is represented by the values of the X and Y directions and the angle θ (hereinafter, the angle θ is expressed as the Z direction) in the coordinate system of the component recognition camera 13. After correcting the suction attitude based on the recognition result, the electronic component S is mounted on the board.

Similarly, in the position recognition by the board recognizing camera 11, the values are recognized as values in the X, Y and Z directions in the coordinate system of the board recognizing camera, and the position is corrected based on the recognition result.

The conveyor unit 3 includes a set table 1 at the center.
6, a carry-in conveyance path 17 on the left and a carry-out conveyance path 18 on the right
And The substrate is supplied from the carry-in conveyance path 17 to the set table 16, and is immovably set at a predetermined height at the set table 16 so that the electronic component S is mounted. Then, the substrate on which the electronic components S have been mounted is discharged from the set table 16 via the unloading conveyance path 18.

In this case, the carry-in transport path 17 has substrates in a supply standby state, and the carry-out transport path 18 has substrates in a discharge standby state (not shown), and these substrates are transported sequentially. As will be described in detail later, the abutting end of the substrate on the set table 16 is the origin of the absolute reference coordinate system of the entire apparatus.

Each of the first component supply section 4a and the second component supply section 4b has a number of tape cassettes 19 arranged side by side. Each of the tape cassettes 19 contains the electronic components S loaded in a carrier tape (not shown), and the electronic components S are supplied one by one from the leading end of the tape cassette 19.

In the normal operation, when the first head unit 8a is in the mounting operation, the second component supply unit 4b
When the second head unit 8b is in the mounting operation, the tape cassette 19 is replaced by the first component supply unit 4a.

The first XY stage 6a and the second XY stage 6b are guided by a pair of Y-axis guide rails 21 disposed on both right and left ends of the machine base 2, and are moved in the front-rear direction (Y-axis direction).
, Respectively.

The Y motion beam 22 of the first XY stage 6a
Is a ball screw (not shown) on the left and Y for rotating the ball screw.
It is advanced and retracted in the Y-axis direction (front-back direction) by an axis motor (Y motor: see FIG. 2). Similarly, the Y motion beam 22 of the second XY stage 6b advances and retreats in the Y axis direction by a ball screw (not shown) on the right and a Y axis motor (Y motor) for rotating the same.

On the other hand, both Y motion beams 22, 22 are exactly the same, each having an X-axis guide rail 23,
Similarly to the above-described drive system, the head units 8a and 8b are advanced and retracted in the X-axis direction (left-right direction) with the configuration of a ball screw and an X-axis motor (Y motor: see FIG. 2) not shown. Thus, each of the head units 8a and 8b is movable in the X-axis direction and the Y-axis direction, that is, in the horizontal plane.

Each head unit 8 (8a, 8b)
Support member 10 moved in the X-axis direction by moving beam 22
And a head elevating mechanism 26 attached to the support member 10
To be moved up and down as necessary by the head elevating mechanism 26 2
The mounting head 12 includes one mounting head 12 and one board recognition camera 11 disposed between the mounting heads 12 and 12. The board recognition camera 11 recognizes a reference mark on each board, and the reference mark serves as a reference for the mounting position of the electronic component S.

Next, the control unit 100 of the electronic component mounting apparatus 1 will be described with reference to FIG. In addition,
In this description, only the first XY stage 6a side and only one component recognition unit 60 and one head unit 8 will be described.

As shown in FIG. 1, the control unit 100 includes an X motor 101 and a Y motor 102 for moving the head unit 8 in the XY directions via the XY stage 6.
And a Z motor (rotation) 103 mounted on the mounting head 12
And are connected. X motor 101, Y motor 102
X motor driver 1 and Z motor 103
04, via a Y motor driver 105 and a Z motor driver 106, are connected to a CPU 107 which controls them collectively.

Similarly, the head unit 8 is connected to the board recognition camera 11 via the head unit driver 108.
And the component recognition camera 13 via the board image processing unit 111 and the component image processing unit 109, respectively.
07. Similarly, a component recognition illumination driver 61 and a deflection recognition illumination driver 112, which will be described later, are a component recognition illumination driver 110 and a deflection recognition illumination driver 112, respectively.
Is connected to the CPU 107 via the.

Further, a memory 120 is connected to the CPU 107. The memory 120 includes a first data area 121 for an electronic component S recognized at a focal position, which will be described later, and an electronic component recognized at a position other than the focal position. It has a second data area 122 for S.

These include position data, which will be described later, for recognizing each recognition target component and correcting the recognition result, that is, the first displacement (offset) data 121d and the first magnification (zoom), respectively. ) Data 121z,
Further, the second offset data 122d and the second zoom data 122z are stored.

The memory 120 also stores offset data for correcting the deviation of the coordinate system of the board recognition camera 11 and the above-mentioned motors 104, 105,
6 and design value data for controlling the recognition cameras 11 and 13 are stored.

Each offset data is updated by a displacement calculation operation described later, and the CPU 107 corrects the design value data with each offset data, and corrects each motor 104, 10.
5 and 106 and the recognition cameras 11 and 13 are controlled. Recognition of the object to be imaged by each of the recognition cameras (CCD cameras) 11 and 13 is performed by using the image processing results of the image processing units 111 and
After performing processing such as binarization in step 09,
This is performed by performing arithmetic processing in.

The component recognition unit 60 includes the component recognition camera 13 and the component recognition illumination 61. The component recognition illumination 61 is, as shown in FIGS.
LED group 61 serving as reflective illumination for p and multi-lead components Sl
a and an LED array having a large number of LEDs, such as an LED group 61b serving as a transmission illumination and an LED group 61g serving as an illumination for a grid component Sg, and an inner peripheral surface of which is an electronic component to be recognized. Each LED is selectively lit according to the type of S.

On the other hand, each mounting head 12 is mounted on the head unit 8 so as to be moved up and down a predetermined range by a head elevating mechanism 26 (see FIG. 2).
In addition to the diffusion plate 12b and the diffusion plate 12c, a suction nozzle 25 connected to a vacuum suction device (not shown) is detachably attached to the lower end thereof. Each mounting head 1
2, a motor (not shown) for rotating the electronic component S in a horizontal plane via the suction nozzle 25 is incorporated.

For example, as shown in FIG.
In the component recognition using the ED group 61a, the circuit element component S
An electronic component S (for example, Sa in the drawing) such as p or a multi-lead component Sl is regarded as an electronic component to be recognized (a recognition target component).
The reflected light L is used to recognize the surrounding lead pins P1 and the like.
a is reflected by the electronic component Sa.

In this case, the electronic component (component to be recognized) Sa sucked by the suction nozzle 25 to be mounted on the substrate is moved to a predetermined imaging position where the component recognition camera 13 is focused, that is, a focal plane position (focal position) Fp And the component recognition camera 13 captures an image of the electronic component Sa using the reflected light La from the reflected illumination 611 to perform component recognition.

For example, as shown in FIG. 4, in component recognition using the head transmitted illumination 12a, an electronic component S (for example, Sb shown in FIG. 3) similar to FIG. In order to recognize a shadow (silhouette) or the like, the electronic component Sb is lowered to the focal position Fp, and an image of the electronic component Sb is captured by the component recognition camera 13 using the transmitted light Lb to perform component recognition.

In the component recognition using the LED group 61b of the transmitted illumination, the transmitted light Lc is reflected by the diffusion plate 12c to similarly recognize the electronic component Sc.

In these cases, in the coordinate system of the component recognition camera 13 based on the first offset data 121d, the electronic component (recognition target component) S is recognized by image recognition.
The suction posture (suction position, suction angle, etc.) of the device is recognized as a value in the X, Y, and Z directions, the suction posture is corrected based on the recognition result, and the electronic component S is mounted on the board. .

That is, generally, when the position of the center of the visual field is determined, the coordinate system of the component recognition camera can be determined based on the data (position data).
Appropriate position data of the center of the field of view is first offset data 1
By controlling the movement (position) of the mounting head 12 so as to match the center of the field of view of the component recognition camera 13, the data of the captured image is appropriately stored in the coordinate system based on the first offset data 121 d. Can be obtained, and the suction posture can be recognized.

By the way, in a grid component Sg such as PGA or BGA, (P) is placed on the lower surface (area) of the component Sg.
Since the pins (GA) and the solder balls (BGA) (hereinafter referred to as “solder balls”) Hb are arranged in a net (grid) shape (see FIG. 6), the types are recognized in the component recognition using transmitted light. Can not do it. In addition, multi-lead products Sl
And the like, the type cannot be recognized by its peripheral form, that is, the form of the lead Pl (see FIG. 7).

The pitch of the solder balls Hb differs depending on the kind of the grid component Sg. In a metallic package, the contrast of the solder balls Hb to the reflected light is hard to be obtained. Even if Hb is missing, there is a problem that it cannot be recognized due to the reflection (back reflection) by the package in the background, and the electronic component S (Sg) emits light having an angle different from that of the multi-lead component Sl described above. Need to be irradiated.

Therefore, in the electronic component mounting apparatus 1, when the component to be recognized is the grid component Sg, as shown in FIG. 5, the LED group 61g disposed above the other LED groups 61a and 61b is connected to the grid component Sg. Light (reflected light) L that is less affected by back reflection
Component recognition is performed by g1.

The electronic component S to be recognized is particularly a BGA
In some cases, depending on the type, the illumination light relatively higher is better, and in this case, as shown in the figure, the illumination light reaches the lower end position within the depth of focus Fd of the component recognition camera 13. The electronic component Sg is lowered, and component recognition is performed using the illumination light Lg2.

However, in the above case, that is, when the imaging position of the electronic component S to be recognized is different depending on the component type or the like, as the position data to be used as the reference of the coordinate system of the component recognition camera 13, the imaging position is the focal position. If the same position data as in the case of Fp is used, it is not possible to accurately recognize the suction posture (suction position, suction angle, etc.) of the component.

For example, in the above-described grid component Sg and the like, since there are other types of components such as solder balls that differ only in the pitch of Hb, it is necessary to accurately recognize each pitch and the like. In the above case, since the distance between the component recognition camera 13 and the recognition target component S (imaging position) is different, in order to accurately recognize and correct the pitch between the solder balls Hb and the like, the imaging magnification must be corrected. Need to be reflected in

When the mounting head 12 is raised and lowered by the head raising and lowering mechanism 26, an angle deviation may occur between the axis of the mounting and lowering and the optical axis of the component recognition camera 13. The deviation must be reflected in the correction.

For this reason, in the electronic component mounting apparatus 1, FIG.
As described above, the first data area 121 of the memory 120
Inside, as the position data when the imaging position is set to the focal position Fp, first zoom data 121z indicating the imaging magnification at that time is stored in addition to the first offset data 121d.

Similarly, in the second data area 122 of the memory 120, the position data of the imaging position for the grid component Sg (particularly, BGA) described above with reference to FIG. The second offset data 122d and the second zoom data 121z indicating the imaging magnification at that time are stored as the position data when the position is set.

The position data is obtained by using a dummy part 40 (DSg: see FIG. 6; DS1: see FIG. 7), which will be described later, which is prepared and provided on the basis of a predetermined standard specification. This is calculated in advance from an image captured at the position and stored in the memory 120.
That is, the result of actual imaging by the component recognition camera 13 can be appropriately corrected based on these position data.

Therefore, in the electronic component mounting apparatus 1, since the position data corresponding to the imaging position of the electronic component S to be recognized is used, the XY stage 6, the head unit 8, the head elevating mechanism 26 for moving the component S, etc. Can be appropriately controlled, thereby accurately recognizing the suction attitude of the component and correcting the deviation (of the suction attitude).

In the above-described example, the imaging position for the multi-lead component Sl is set as the focal position of the component recognition camera 13.
If it is within the depth of focus Fd, another position, for example, the depth of focus F
It may be set at the upper end position in d.

That is, for example, when the imaging position of the multi-lead component Sl is the first position within the depth of focus Fd and the imaging position of the grid component Sg is the second position within the depth of focus Fd, the first position is also the second position. Also, since it is within the focal depth Fd of the component recognition camera 13, the image of the electronic component S can be sufficiently recognized with recognizable clarity, and it is not necessary to install the component recognition camera 13 for each component type.

Further, as described above, even if a plurality of image pickup positions are set, a mechanism or the like which is far apart from the existing one is not required as the configuration of the apparatus, that is, the mounting head 12 and the component recognition camera 13 described above. Of course, XY
Stage 6, head unit 8, head elevating mechanism 26,
An existing mechanism for moving the electronic component S such as the suction nozzle 25 can be used, so that the mechanism (structure) and the like do not become complicated.

Further, since the reference position data which has been required in the past is merely made to correspond to the imaging position, the control does not become complicated. Therefore, in the electronic component recognition device 1, even if the imaging position is changed according to the type of the recognition target component S while using the existing mechanism,
The suction posture of the component S can be accurately recognized.

When one of the imaging positions, that is, the first position or the second position (the first position in the above example) is the focal position Fp of the component recognition camera 13,
Since the existing position data (the first offset data 121d and the first zoom data 121z) can be used, the applicability from the existing device is further improved.

In the electronic component mounting apparatus 1, as described above, the first offset data 12 is added to the position data at the first position and the position data at the second position.
1d and the second offset data 122d, ie, X
Since the displacement data in the Y direction is included, in the coordinate system of the component recognition camera 13 based on these position data (deviation data), the position deviation (deviation) in the XY direction of the recognition target component S in the coordinate system.
Can be recognized, and based on the recognition result, the displacement of the sucked recognition target component S in the XY directions can be detected and corrected.

Hereinafter, the method of correcting the position data and various deviations based on the position data will be described more specifically.

First, when the mounting head 12 is raised and lowered by the head raising and lowering mechanism 26, the deviation due to the deviation of the angle between the axis line and the optical axis of the component recognition camera 13 in the vertical movement is, for example, as shown in FIG. The image of the suction nozzle 25 mounted on the mounting head 12 is imaged from below by the recognition camera 13 so that the image of the suction nozzle 25 at the focal position Fp and another imaging position (for example, the lower end of the focal depth Fd described above in FIG. 5). By comparing with the image at position (1).

Therefore, the first offset data 1
When 21d is determined, the second offset data 122d becomes
The first offset data 121d is transferred to the suction nozzle 2
5 can be easily obtained by correcting with the deviation (data) obtained by imaging.

Also, as described above, the imaging position of the multi-lead component Sl is changed to the first position within the depth of focus Fd, the grid component S
g, the imaging position is the second position within the depth of focus Fd, the imaging position is the focal position F of the component recognition camera 13.
The offset data included in the position data of the center of the field of view when p is set, that is, the offset data included in the conventional reference position data,
Of the position data at the first position and the second position only by correcting with the deviation obtained by the imaging of (i.e., the deviation based on the difference in the angle between the axis of the electronic component S and the optical axis of the component recognition camera). Position data can be obtained.

Therefore, in this case, even if the imaging position is changed according to the type of the recognition target component S, not only the existing mechanism but also the existing position data can be used, so that the existing device can be used. Is further improved. The method of obtaining the offset data serving as a reference in these cases will be described later.

Even if the offset data is not the offset data at the focal position Fp, if one of the offset data at the imaging position within the depth of focus Fp can be obtained, the above-mentioned method (imaging of the suction nozzle 25) is used as a reference. Thus, other (first and second) offset data can be obtained. Therefore, hereinafter, these will be simply referred to as offset data.

Next, in the electronic component mounting apparatus 1, as described above, the position data at the first position and the position data at the second position respectively include the first zoom data 121z.
And the second zoom data 122z, that is, magnification data in imaging, which are
Using 0 (DSg, DSl), it can be calculated from the images captured at each imaging position.

The dummy component 40 is manufactured based on a predetermined standard specification. First, as shown in FIG. 6, a dummy component 40 (DSg) corresponding to the grid component Sg is composed of a square base 41 (41g) and an imaging pattern 42 (42g) drawn on the back surface of the base 41 (41g). It is configured.

As shown in FIG. 7, the dummy component 40 (DSl) corresponding to the multi-lead component Sl has a square base 41 (41l) with chamfered corners, and a base 41 (41l).
1) and the imaging target pattern 42 (421) drawn on the back surface.

The base 41 (41g, 41l) is made of glass having a thickness of about 1 to 2 mm in consideration of rigidity, and the image-receiving pattern 42 (42g, 42l) is formed by depositing chromium oxide on the base 41. Have been.

In the pattern to be imaged 42g, small round (ball) pattern elements 46 are arranged at regular intervals in a grid at a predetermined pitch corresponding to solder balls Hb arranged in a grid. It has a configuration.

On the other hand, the pattern to be imaged 421 is composed of a large pattern portion 43 having the same center and a small pattern portion 44 drawn in a hollow portion of the large pattern portion 43.
The large and small pattern portions 43 and 44 have a pattern resembling a lead component. A large number of rectangular pattern elements 45 corresponding to leads are arranged at equal intervals on the outer peripheral portion, and have a rectangular outline as a whole. .

The electronic component mounting apparatus 1 uses the dummy components 40 (DSg, DSl) in advance to capture the image at each image capturing position, and converts the captured image to the first zoom. Data 121z and second zoom data 122z are calculated.

That is, each dummy component 40 (DSg, Dg
Since the pattern elements 46 and 45 of S1) are arranged at predetermined regular intervals (pitch), the imaging magnification, that is, each of the zoom data 121z and 122z is calculated from the ratio of the pitch to the pitch on the captured image. You can ask.

Incidentally, the dummy component DS1 corresponding to the multi-lead component DS1 is configured to be able to support two types of electronic components S depending on its size (number of leads). That is, for example, when handling an electronic component S such as a multi-pin IC, the imaging magnification of the component recognition camera 13 is increased to increase the resolution, and the pattern to be imaged 42 (421) is appropriate in the field of view of the component recognition camera 13. The small pattern portion 44 is set as an imaging target so as to fit in, and in the opposite case, the large pattern portion 43 is set as an imaging target. Thereby, each recognition camera 1
Pattern recognition in accordance with the resolutions of 1 and 13 becomes possible.

Further, by arranging the pattern portions 43 and 44 by arranging the rectangular pattern elements 45, a plurality of recognitions can be performed on the single pattern portions 43 and 44 using the pattern elements 45. Therefore, by averaging a plurality of recognition results, more accurate pattern recognition becomes possible.

Each of these dummy parts 40 (DSg, DSg
1) is stored in the dummy stocker 31 of the deviation recognition unit 15 described below so that the pattern to be imaged 42 (42g, 42l) is on the lower side, and is sucked and imaged in this posture.

Note that each of these dummy components 40 (DS
g, DSl) differ only in the form of the pattern element, and each zoom data 12 calculated using the same
Since 1z and 122z are the same in the following handling, similarly to the offset data, hereinafter, they are simply referred to as dummy parts 40 and zoom data, respectively, as representatives thereof.

As described above, in the electronic component mounting apparatus 1,
Since the position data includes zoom (magnification) data in imaging, if the imaging position of the recognition target component S is different depending on the component type or the like, that is, even if the distance between the component recognition camera 13 and the recognition target component S is different, the difference depends on the difference. The deviation can be recognized, and based on the recognition result, for example, the pitch between leads, between pins, between solder balls, and the like of the recognition target component S can be accurately recognized and corrected.

Further, as described above, in the electronic component mounting apparatus 1, since the position data includes the rotation angle data in the horizontal plane (the above-described angle “θ”, that is, data handled as the Z direction), the position data is used. In the coordinate system of the component recognition camera 13, the suction angle θ of the recognition target component S
(Z-direction deviation) can be recognized, and based on the recognition result, a deviation of the suction angle θ of the suctioned recognition target component S can be detected and corrected.

Note that this rotation angle data (offset data in the Z direction) is also used in the following XY
Since it is the same as the offset data in the direction, it is simply treated as one element of the offset data below.

Next, a description will be given of a method of obtaining various types of offset data and a method of correcting deviation using the data.

As shown in FIGS. 1 and 2, the displacement recognition unit 15 includes a dummy stocker 31 for stocking a dummy component 40 and a backlight plate 32 for capturing an image of the dummy component 40. A shallow groove into which the dummy component 40 fits is formed on the surface of the dummy stocker 31, and the dummy component 40 is placed in the shallow groove.

The backlight plate 32 includes a mounting table 33 capable of diffusing and transmitting light, and an L disposed below the mounting table 33.
And a deflection recognition illumination 34 composed of an ED array or the like. As will be described later in detail, when the dummy component 40 is imaged by the board recognition camera 11, the dummy component 40 mounted on the mounting table 33 is illuminated by the deflection recognition illumination 34, and is imaged from above.

The deviation recognition unit 15 is for correcting a deviation between the coordinate system of the board recognition camera 11 for recognizing the position of the board and the coordinate system of the component recognition camera 13 for recognizing the position of the electronic component S. This correction is performed by imaging the dummy component 40 transferred by the mounting head 12 with the board recognition camera 11 and the component recognition camera 13, respectively, and recognizing the image.

Prior to this correction, the dummy substrate 50
Is introduced into the set table 16, a predetermined portion of the dummy substrate 50 is recognized by the substrate recognition camera 11, and the deviation of the coordinate system of the substrate recognition camera 11 from the absolute reference coordinate system of the machine base 2 is corrected. .

The dummy substrate 50 is formed in a rectangular shape as shown in FIG. 8, and has an average size as a substrate.
On the surface of the dummy substrate 50, a recognition pattern 51 similar to the small pattern portion 44 is drawn at the center thereof, and a pair of recognition marks 52 are drawn apart in the longitudinal direction.

On the other hand, the leading end of the dummy substrate 50 introduced into the set table 16 in the transport direction abuts against a stopper (not shown) of the set table 16 and is set on the absolute reference coordinate system of the machine base 2.

Therefore, by recognizing the recognition pattern 51 with the board recognition camera 11, the coordinate system of the board recognition camera 11 can be corrected with respect to the absolute reference coordinate system, and a pair of recognition marks separated in the left-right direction can be obtained. By recognizing 52, the coordinate system of the board recognition camera 11 can be corrected based on the displacement angle of each XY stage 6.

Next, a method of correcting a positional deviation (deviation) between the board recognition camera 11 and the component recognition camera 13 will be described. In this deviation correction method, first, the deviation of the coordinate system of the board recognition camera 11 with respect to the absolute reference coordinate system is corrected using the dummy substrate 50 described above with reference to FIG. The angle deviation of the moving coordinate system of the beam 22 is corrected. Thereafter, the deviation of the coordinate system of the component recognition camera 13 with respect to the coordinate system of the board recognition camera 11 is corrected using the dummy component 40 described above with reference to FIGS.

Board recognition camera 1 for absolute reference coordinate system
In the correction of the coordinate system 1, when the deviation (angle shift) based on the movement of the XY stage 6 is not considered, the recognition pattern 5 of the dummy substrate 50 imaged by the substrate recognition camera 11 is used.
If 1 is recognized by the CPU 107, the correction can be easily performed with the deviation amount (offset data) between the recognition result and the design value. Therefore, here, only the movement angle deviation of the XY stage 6 with respect to the absolute reference coordinate system, that is, the one based on the movement coordinate system of the Y motion beam 22 with respect to the absolute reference coordinate system will be described.

FIG. 9 shows an XY stage 6 having a displacement of the moving angle and a dummy substrate 5 set on a set table 16.
FIG. 11 is an image diagram showing 0, where the dummy substrate 50 is accurately positioned on an absolute reference coordinate system (substrate positioning coordinate system).

In this case, the substrate positioning XY coordinates (PL-XY:
The driving XY coordinates (BeamA) of the Y motion beam 22 viewed from the origin P0
The offset data for adjusting the positional deviation and the angular deviation with respect to the design dimensions of -XY) is obtained, and correction is performed based on the offset data with reference to the PL-XY coordinate system.

The scanning coordinate center of the board recognition camera 11 mounted on the Y motion beam (that is, the head unit 8) 22 is set to the Y motion beam (that is, the head unit 8).
It coincides with the origin of the 22 drive XY coordinates.

More specifically, the dummy substrate 50 is positioned on the substrate positioning XY coordinates, and offset data (of the coordinate system (scanning coordinate center) of the substrate recognition camera 11) is obtained by the operation flow of FIG.

As shown in the figure, first, a Y motion beam (Y
The board recognition camera 11 mounted on the beam 22 is moved in accordance with the design value so that the center position (the center of the field of view) matches the position of the recognition mark 52 on one side (right side) (S1).

Here, the recognition mark 52 is imaged by the board recognition camera 11 and its recognition is performed (S2). Then, the recognition result (the mark center position coordinates as viewed from the camera center at the scanning coordinates of the board recognition camera 11) is temporarily stored in the memory 120 as "dx1, dy1" (S
3).

Next, the board recognition camera 11 is moved in accordance with the design value so that the center position (the center of the visual field) matches the position of the recognition mark 52 on the other side (left side) (S
4). Here, the recognition mark 5 is obtained by the board recognition camera 11.
2 is recognized (S5), and the recognition result (the mark center position coordinates from the camera center at the scanning coordinates of the board recognition camera 11) is stored in the memory 120 as "dx2, dy2".
Is temporarily stored (S6).

Here, offset data (offset amount) of the coordinate system of the board recognition camera 11 is obtained by the following formula (S7). The X (horizontal) and Y (vertical) offsets of the Y beam are obtained by the following formula. dx1 '= dx1 * COS (-(CAMA3 angle offset: board recognition camera) -dy1 * SIN (-(CAMA3 angle offset: board recognition camera) dy1' = dy1 * COS (-(CAMA3 angle offset: board recognition camera) + dy1 * SIN (-(CAMA3 angle offset: board recognition camera) P is the pitch in the X direction between the first and second recognition marks.
(Zero in the Y direction), and the angular offset of the Y beam is obtained by the following formula. dz = tan ^-1 {P * (dy1'-dy2 ') / P * (P + (dx1'-dx
2 ′))} The offset amounts of “” and “” thus determined are stored in the memory 120 as offset data, and the design value is corrected based on the offset data.

Next, correction of the coordinate system of the component recognition camera 13 with respect to the coordinate system of the board recognition camera 11 will be described.

In this case, after the dummy component 40 is sucked from the dummy stocker 31, the Y beam 22 is adjusted to the PL-XY coordinates in consideration of the beam offset [X (horizontal), Y (vertical), angle]. The recognition is performed by moving the component recognition camera 13 to the design position as viewed from the system. Then, this recognition result is referred to as [Pr
ec_1x, Prec_1y, Prec_1z].

Next, while maintaining the suction posture of the dummy component 40 as it is, the Y beam 22 is moved to the design position (without offset) of the backlight plate 32 (considering the beam offset), and the dummy component 40 is moved to the backlight plate. 32 is mounted (mounted).

Next, the board recognition camera 11 is moved to the design position of the backlight plate 32 by the Y beam 22 (in consideration of the beam offset), and the dummy component 40 is recognized. Then, this recognition result is referred to as [Prec_2x, Prec_2y, Pr
ec_2z]. That is, thereby, the stitch between the coordinate system of the component recognition camera 13 and the coordinate system of the board recognition camera 11 is obtained.

Specifically, offset data of the coordinate system of the component recognition camera 13 is obtained according to the operation flow of FIG. The data used to describe the operation flow of FIG. 11 is as follows (all of these are values on the substrate positioning XY coordinate system). Bmoff_x: Beam offset X, Bmoff_y: Beam offset Y, Bmoff_z: Beam offset angle STK_X: Dummy stocker design position X, STK_Y: Dummy stocker design position Y Position Y · BLT_X: Backlight plate design position X, BLT_
Y: Backlight plate design position Y • BM_X: Beam origin design position X, BM_Y: Beam origin design position Y • HD_X: Head design position X from beam pivot point A0, HD_Y: Head design position Y from beam pivot point A0

Referring to FIG. 11, first, the mounting head 12 is moved to the position of the dummy stocker 31 by the Y beam 22 (S11), and the dummy component 40 is sucked from the dummy stocker 31 (S12). The movement target value (X, Y) of the Y beam 22 in this case is as follows. X = (STK_X-(BM_X + HD_X + Bmoff_x)) * COS (Bmoff_z)-(STK_Y-(BM_Y + HD_Y + Bmoff_y)) * SIN (Bmoff_z) Y = (STK_Y-(BM_Y + HD_Y + Bmoff_y)) * COS (Bmoff_z)-(STK_X-(BM_X + HD_X + Bmoff_x)) * SIN (Bmoff_z)

Next, the dummy component 40 is connected to the dummy stocker 3
1 to the position of the component recognition camera 13 (S
13), which is recognized by the component recognition camera 13 (S1).
4). Here, for example, the above-described focal position Fp in FIG.

The movement target value (X, Y) of the Y beam 22 in this case is as follows. X = (CAM_X-(BM_X + HD_X + Bmoff_x)) * COS (Bmoff_z)-(CAM_Y-(BM_Y + HD_Y + Bmoff_y)) * SIN (Bmoff_z) Y = (CAM_Y-(BM_Y + HD_Y + Bmoff_y)) * COS (Bmoff_z)-(CAM_X-(BM_X + HD_X + Bmoff_x)) * SIN (Bmoff_z)

The recognition result (the component recognition camera 1)
The part center position coordinates viewed from the camera center at the scanning coordinates of No. 3) are temporarily stored as [Prec_1x, Prec_1y, Prec_1z] (S15).

Next, the mounting head 12 sucking the dummy component 40 is moved to the position of the backlight plate 32 (S16), and the dummy component 40 is moved to the backlight plate 3 (S16).
2 (S17). The movement target value (X, Y) of the Y beam 22 in this case is as follows. X = (BLT_X-(BM_X + HD_X + Bmoff_x)) * COS (Bmoff_z)-(BLT_Y-(BM_Y + HD_Y + Bmoff_y)) * SIN (Bmoff_z) Y = (BLT_Y-(BM_Y + HD_Y + Bmoff_y)) * COS (Bmoff_z)-(BLT_X-(BM_X + HD_X + Bmoff_x)) * SIN (Bmoff_z)

Next, the board recognition camera 11 is moved to the position of the backlight plate 32 (S18), and the dummy component 40 is recognized by the board recognition camera 11 (S19). At this time, the deflection recognition illumination 34 is turned on to illuminate the dummy component 40. The movement target value (X, Y) of the Y beam 22 in this case is as follows. X = (BLT_X-(BM_X + Bmoff_x)) * COS (Bmoff_z)-(BLT_Y-(BM_Y + Bmoff_y)) * SIN (Bmoff_z) Y = (BLT_Y-(BM_Y + Bmoff_y)) * COS (Bmoff_z)-(BLT_X -(BM_X + Bmoff_x)) * SIN (Bmoff_z) Then, the recognition result (the component center position coordinates as viewed from the camera center in the scanning coordinates of the board recognition camera 11) is temporarily stored as [Prec_2x, Prec_2y, Prec_2z] ( S20).

Next, the offset data (offset amount) of the coordinate system of the component recognition camera 13 is obtained by the following formula (S21). The X (horizontal), Y (vertical), and angle of the component recognition camera are obtained by the following formulas. Θ '= Prec_2z-Prec_1z + CAMA3
Z (angle): When the offset of the board recognition camera is set, Rcnv_1x = Prec_1x * COS (-Θ ')-Prec_1y * SIN (-Θ') Rcnv_1y = Prec_1y * COS (-Θ ') + Prec_1x * SIN (-)') Rcnv_2x = Prec_2x * COS (-CAMA3Z)-Prec_2y * SIN (-CAMA3Z) Rcnv_2_y = Prec_2y * COS (-CAMA3Z) + Prec_2x * SIN (-CAMA3Z) Offset X (horizontal), Y of the component recognition camera to be obtained
(Vertical), the angle is Cmoff_x = Rcnv_2x-Rcnv_1x Cmoff_y = Rcnv_2y-Rcnv_1y Cmoff_z = Θ '= Prec_2z-Prec_1z + CAMA3Z (angle)

The component recognition camera 1 obtained as described above
The offset amount of the coordinate system 3 is used as offset data (for example, first offset data 121d) in the memory 120.
(For example, in the first data area 121),
(Furthermore, based on this, for example, the second offset data 122d is obtained by the above-described method, and the second data area 12d is obtained.
2), and the design value is corrected based on the (these) offset data.

When the offset data is calculated (S2
1) Then, the mounting head 12 is moved to the backlight plate 3
2 (S22), and the dummy head 40 is sucked by the mounting head 12 (S23). Subsequently, the mounting head 12 is moved from the backlight plate 32 to the position of the dummy stocker 31 (S24), and the dummy component 40 is stored in the dummy stocker 31 (S25). In this way, the dummy component 40 is returned to the original position, and a series of correction work ends.

As described above, according to the present embodiment, the deviation of the coordinate system of the board recognition camera 11 with respect to the absolute reference coordinate system and the angular deviation of the XY stage 6 (the board recognition camera 11 Is corrected, and then the deviation of the coordinate system of the component recognition camera 13 with respect to the coordinate system of the board recognition camera 11 is corrected using the dummy component 40. The deviation between the coordinate system and the component recognition camera 13 and the deviation between the coordinate system of the recognition cameras 11 and 13 and the absolute reference coordinate system can be corrected very accurately.

In particular, the deviation between the coordinate system of the board recognizing camera 11 and the component recognizing camera 13 can be detected by recognizing the dummy component 40 by the respective recognizing cameras 11 and 13, so that it is simple and quick. Can be corrected. In addition, since the dedicated dummy component 40 is used and illuminated to capture an image, the dummy component 40 can be accurately recognized, and the correction can be accurately performed as a whole. Therefore, the electronic component S can be mounted on the board with high accuracy and stability.

[0125]

As described above, according to the electronic component recognizing apparatus of the present invention, even if the imaging position is changed according to the type of the component to be recognized while using the existing mechanism, the component is not attracted. The effect is that the posture can be accurately recognized.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram illustrating a control system of the electronic component mounting apparatus.

FIG. 3 is a schematic cross-sectional view illustrating an example of component recognition of an electronic component.

FIG. 4 is a view similar to FIG. 3, showing another example.

FIG. 5 is a view similar to FIG. 3, showing an example of a different imaging position as yet another example.

FIG. 6 is a plan view showing an example of a dummy component used for obtaining position data.

FIG. 7 is a view similar to FIG. 6, showing another example.

FIG. 8 is a plan view of a dummy substrate used for deviation correction according to the embodiment.

FIG. 9 is an image diagram showing an XY stage having a displacement of a moving angle and a dummy substrate set on a set table.

FIG. 10 is an operation flow for obtaining a deviation of the coordinate system of the board recognition camera based on the displacement angle of the XY stage.

FIG. 11 is an operation flow for obtaining deviations of the coordinate system of the board recognizing camera and the coordinate system of the component recognizing camera in consideration of the absolute reference coordinate system and the displacement angle of the XY stage.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 6a 1st XY stage 6b 2nd XY stage 8a 1st head unit 8b 2nd head unit 11 Substrate recognition camera 12 Mounting head 13 Component recognition camera 25 Suction nozzle 26 Head raising / lowering mechanism 32 Backlight plate 34 Deflection recognition illumination Reference Signs List 40 dummy component 45 pattern element 46 pattern element 50 dummy substrate 61 component recognition illumination 100 control unit 120 memory 121 first data area 122 second data area S electronic component

Continuation of front page (72) Inventor Takashi Yoshii 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd.

Claims (4)

[Claims] 1. A mounting head for holding an electronic component, a component recognition camera for imaging the electronic component held on the mounting head from below, a lighting device for illuminating the electronic component for imaging, and a component for raising and lowering the mounting head. A head elevating mechanism for changing an imaging position of the electronic component within a depth of focus of a recognition camera, and an X for moving a mounting head in XY directions in a horizontal plane
Control means for controlling the Y movement mechanism and the XY movement mechanism so that the center of the electronic component faces the center of the field of view of the component recognition camera; and the center of the field of view when the imaging position is the first position within the depth of focus. A first storage unit for storing position data; and a second storage unit for storing position data of a center of the field of view when the imaging position is a second position within the depth of focus. When imaging at the first position, the XY movement mechanism is controlled based on the position data of the first storage means, and when imaging at the second position, the position data of the second storage means is controlled. XY based on
An electronic component recognition device for controlling a moving mechanism. 2. The position data includes deviation data in the X and Y directions, and the deviation data is included in position data of the center of the field of view when the imaging position is the focal position of the component recognition camera. 2. The electronic component according to claim 1, wherein the deviation data is corrected by a deviation based on a difference in an angle between an axis of the electronic component when moving up and down and an optical axis of the component recognition camera. 3. Recognition device. 3. The apparatus according to claim 1, wherein the position data includes magnification data in imaging.
An electronic component recognition device according to claim 1. 4. The apparatus according to claim 1, wherein the position data includes rotation angle data in a horizontal plane.
4. The electronic component recognition device according to any one of claims 1 to 3.