WO2022059055A1 - Dispositif de génération de données de position de bosse - Google Patents

Dispositif de génération de données de position de bosse Download PDF

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Publication number
WO2022059055A1
WO2022059055A1 PCT/JP2020/034832 JP2020034832W WO2022059055A1 WO 2022059055 A1 WO2022059055 A1 WO 2022059055A1 JP 2020034832 W JP2020034832 W JP 2020034832W WO 2022059055 A1 WO2022059055 A1 WO 2022059055A1
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WO
WIPO (PCT)
Prior art keywords
image
bump
bumps
position data
group
Prior art date
Application number
PCT/JP2020/034832
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English (en)
Japanese (ja)
Inventor
幹也 鈴木
勇太 横井
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2020/034832 priority Critical patent/WO2022059055A1/fr
Priority to JP2022550058A priority patent/JP7423809B2/ja
Publication of WO2022059055A1 publication Critical patent/WO2022059055A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the present specification relates to an apparatus that generates bump position data representing the positional relationship of a plurality of bumps arranged on a component.
  • bump component having a plurality of regularly arranged bumps (electrodes).
  • Bump parts are also called BGA (Ball Grid Array) or CSP (Chip Size Package). It is important to acquire data representing the regular positional relationship of the bumps in advance in order to capture the bump component in the mounting operation and detect the actual position of the bumps by image processing.
  • Patent Document 1 discloses a technical example of acquiring data regarding the position of a bump.
  • the component data generation device of Patent Document 1 converts the captured image into data, the means for converting the captured image into an image of a reference angle to set the measurement area, and the specifications of the electrodes in the measurement area. Means and. Further, according to the description of the embodiment, the image recognition device sequentially reads out from the left side for each pixel along one line of image data, detects the change position of the density, and repeats this for a plurality of lines to obtain a ball electrode. We are looking for the edge of (bump). According to this, even an electronic component having a complicated electrode arrangement can surely create component data.
  • design data showing the reference positional relationship of a plurality of bumps of a bump component is often disclosed by the manufacturer of the bump component.
  • a sample bump component may be provided in place of the design data to the manufacturer of the board product.
  • the manufacturer can generate bump position data in place of the design data by taking an image of the sample product and performing image processing.
  • the bump position data generated from the sample product includes the error included in the sample product.
  • This error is smaller than the tolerance specified in the standard or product specifications, but it may be close to the limit of the tolerance.
  • the three bumps that actually exist on the sample product may deviate from the straight line arrangement due to an error, and the bump position data also deviates from the straight line arrangement. ..
  • the position error of the bump located in the opposite direction of the tolerance exceeds the tolerance compared to the sample product, and an image processing error occurs. And there is a risk of mounting position error.
  • the present specification describes a bump position data generation device capable of generating bump position data with high practical accuracy in a device of a method of capturing a plurality of bumps arranged on a component and generating bump position data. Providing is an issue to be solved.
  • the present specification is an image pickup unit that captures a plurality of bumps arranged on a component to acquire image data, and an image of each of the bumps included in the image data by subjecting the image data to image processing.
  • An image processing unit that extracts a plurality of image bumps, a group forming unit that forms a bump group by the image bumps having a predetermined regular image positional relationship that allows a position error in the image data, and one of the above.
  • the bump position data that estimates the design reference positional relationship of the plurality of the bumps arranged in the component is generated.
  • a data generation unit and a bump position data generation device including the data generation unit are disclosed.
  • a bump group is formed by image bumps having a regular image positional relationship in the image data, and a plurality of image bumps belonging to one bump group are used.
  • Generate bump position data that estimates the reference position relationship of the bump design. According to this, it is possible to estimate the design reference positional relationship so as to eliminate or cancel the positional error of a plurality of image bumps, and to improve the practical accuracy of the bump position data as compared with the conventional case. Further, since the bump position data having high practical accuracy can be applied in the image processing at the time of mounting the component, it is possible to suppress an image processing error and a mounting position error.
  • It is a partial diagram of image data which schematically shows the predetermined width set in step S12 of a sub operation flow. It is a partial view of image data which shows typically the image bump mutually recognized in step S14 of a sub operation flow.
  • image data which shows typically the image bump which was not recognized mutually. It is a partial diagram of image data which schematically explains the function of a data generation part. It is a partial view of image data which shows typically the predetermined angle set in step S12 of a sub operation flow. It is a partial diagram of image data explaining an application form in which an and condition of a predetermined width and a predetermined angle is set in step S12 of a sub-operation flow. It is a figure of the sub-operation flow of the modified form which the function of a group forming part is different.
  • the component 71 has a substantially rectangular parallelepiped outer shape, and has a dark color with low brightness or an appearance color close to black.
  • a plurality of bumps 72 are regularly arranged on the bottom surface of the component 71.
  • the shape of the bump 72 is a hemispherical shape that swells downward or a circle, and is not limited to this, and may be another shape such as a square or a rectangle.
  • the bump 72 is an electrode soldered onto the land of the printed circuit board and has high brightness.
  • the nine bumps 72 are arranged in a regular 3 ⁇ 3 grid arrangement.
  • the design data of the component 71 shows design specifications such as the shape, size, and reference positional relationship representing the arrangement pitch of the bump 72. Although the design data does not include an error, the bump 72 of the actual component 71 contains an error, so that the size and the arrangement pitch may vary.
  • the bump position data generation device 1 takes an image of a plurality of bumps 72 arranged on the component 71, processes the acquired image data, and finally estimates the design reference position relationship of the plurality of bumps 72. Generate position data.
  • the bump position data generation device 1 is composed of an image pickup unit 2 and a control unit 3.
  • the image pickup unit 2 captures a plurality of bumps 72 arranged on the component 71 to acquire image data GD.
  • the image data GD is digitized numerical information and can be displayed as an image as shown in FIG.
  • the image pickup unit 2 may take an image of the component 71 placed on the transparent glass from below, or may take an image of the component 71 with the bottom surface facing up from above.
  • the image data GD shown in FIG. 3 the image of the outer shape of the component 71 is shown in black, and the image of the bump 72 is shown in white.
  • the image of the component 71 in the image data GD is referred to as an image component 81
  • the image of the bump 72 in the image data GD is referred to as an image bump 82.
  • the positional relationship between the members in the image data GD is referred to as an image positional relationship.
  • the image data GD includes the image bumps 82 of all the bumps 72. Further, the image data GD preferably includes an image component 81 representing the entire outer shape of the component 71, but is not essential. For the large component 71, it is permissible to connect a plurality of image data obtained by a plurality of imagings to obtain a predetermined image data GD.
  • the image data GD may be a black-and-white image or a color image as long as the outer shape of the image bump 82 can be detected by the difference in brightness in the image processing.
  • the acquired image data GD is transferred to the control unit 3.
  • the control unit 3 is configured by using a computer device.
  • the control unit 3 includes three functional units realized by software, that is, an image processing unit 4, a group forming unit 5, and a data generation unit 6.
  • the image processing unit 4 performs image processing on the image data GD received from the image pickup unit 2 to extract a plurality of image bumps 82 which are images of the bumps 72 included in the image data GD. "Extracting” includes detecting the outer shape of the image bump 82 and obtaining the size of the image bump 82 and the position of the center point. A known boundary detection method, region detection method, or the like can be applied to this image processing.
  • the group forming unit 5 forms a bump group with image bumps 82 having a predetermined regular image positional relationship that allows a position error in the image data GD.
  • the regular image positional relationship is an image positional relationship of a lattice arrangement arranged in the image data GD separated in the first direction of the component 71 and the second direction orthogonal to the first direction while including the position error.
  • the group forming unit 5 requires that the image bumps 82 have the same size within the margin of error, which is a necessary condition for one bump group. That is, the group forming unit 5 sets two image bumps 82 having a size difference exceeding the permissible error as separate bump groups.
  • the data generation unit 6 is a design reference position of the plurality of bumps 72 arranged in the component 71 based on the positions of the center points of the plurality of image bumps 82 belonging to one bump group and the regular image positional relationship. Generate bump position data with estimated relationships. Specifically, the data generation unit 6 generates bump position data in which the arrangement pitch of the lattice arrangement is constant. The functions of the group forming unit 5 and the data generating unit 6 will be described in detail in the following description of the operation.
  • step S1 of the main operation flow of FIG. 4 the image pickup unit 2 takes an image of a plurality of bumps 72 arranged in the component 71, and acquires, for example, the image data GD shown in FIG.
  • step S2 the image processing unit 4 performs image processing of the image data GD to obtain the sizes of the plurality of image bumps 82 and the positions of the center points.
  • step S3 the group forming unit 5 performs a recognition process for recognizing another image bump 82 that is separated from each other in the first direction and the second direction while including a position error with respect to a certain image bump 82. Further, the group forming unit 5 performs recognition processing on the basis of all the image bumps 82 in order, and forms a bump group by the combination of the mutually recognized image bumps 82. Details of step S3 are shown in the sub-operation flow of FIG.
  • the group forming unit 5 determines the orthogonal first direction and the second direction.
  • the first direction and the second direction are directions in which the arrangement direction of the lattice arrangement of the plurality of image bumps 82 is estimated.
  • the first direction and the second direction are two horizontal directions along the bottom surface of the component 71.
  • the group forming unit 5 obtains the smallest rectangular RC including all the image bumps 82 in the image data GD, as shown by the white broken line in FIG. Then, the group forming portion 5 sets the directions of two adjacent sides of the rectangular RC as the first direction and the second direction.
  • the group forming unit 5 accurately arranges the arrangement direction of the lattice arrangement. Can be estimated to.
  • the group forming portion 5 may have the directions of two adjacent sides of the rectangular image component 81 as the first direction and the second direction.
  • the group forming unit 5 sets a predetermined width W (see FIG. 6).
  • the predetermined width W corresponds to the position error allowed for the bump 72, in other words, corresponds to the position error allowed for the image bump 82 in the image data GD. Practically, the predetermined width W is initially set based on the size of the reference image bump 82.
  • the predetermined width W may be set based on the tolerance allowed for the position error of the bump 72. According to this, the predetermined width W becomes a larger value than the case where it is set based on the past actual results. In other words, the predetermined width W allows a position error close to the tolerance specified in the standard, product specifications, or the like.
  • the allowable position error becomes large when the arrangement pitch of the image bumps 82 is large, but in the method of setting the predetermined width W, the allowable position error is large. It is preferable that the pitch is constant regardless of the magnitude of the arrangement pitch.
  • step S13 the group forming unit 5 first sets the reference image bump 821. Since the iterative loop composed of step S13, step S14, and step S15 is executed for all the image bumps 82, the order of the image bumps 82 to be set is not important.
  • step S13 as shown in FIG. 6, a band-shaped recognition area having a predetermined width W extending in a “+” shape in the first direction and the second direction is set with reference to the center point C1 of the image bump 821. Will be done.
  • the group forming unit 5 performs a recognition process for recognizing the center point of another image bump 82 that is spaced apart from each other in the first direction and the second direction.
  • another image bump 822 is located on the right side of the image bump 821 in the first direction.
  • the size of the image bump 822 is equal to that of the image bump 821 within the margin of error. Therefore, the image bump 822 is a candidate for forming a bump group one with the image bump 821. If the size of the image bump 822 exceeds the margin of error and differs from the image bump 821, the recognition process is terminated. In this case, the group forming unit 5 determines that the image bump 822 could not be recognized from the image bump 821.
  • the center point C2 of the image bump 822 is recognized in the recognition area on the right side in the first direction of the image bump 821. Further, in the recognition area on the left side in the first direction of the image bump 821, the center point C3 of another image bump 823 whose size is within the tolerance is recognized. In this case, the group forming unit 5 determines that the image bump 822 and the image bump 823 can be recognized from the image bump 821.
  • the center point of another image bump 82 may be recognized in the recognition area extending in the second direction of the image bump 821.
  • the center point C4 of another image bump 824 may be out of the recognition area. In this case, the group forming unit 5 determines that the image bump 824 could not be recognized from the image bump 821.
  • step S15 the group forming unit 5 determines whether or not the recognition process based on all the image bumps 82 is completed. If no, the execution of the operation flow is returned to step S13.
  • step S13 another image bump 82 is set as a reference, and step S14 is executed. In the image data GD shown in FIG. 3, the iterative loop is executed 9 times corresponding to the 9 image bumps 82.
  • the image bump 822 may be the reference.
  • the group forming unit 5 can determine that the image bump 821 can be recognized from the image bump 822.
  • the image bump 823 may be used as a reference. In this case, the group forming unit 5 can determine that the image bump 821 can be recognized from the image bump 823.
  • step S16 the group forming unit 5 forms a bump group by the combination of the mutually recognized image bumps 82.
  • the image bump 821 and the image bump 822 are mutually recognized, and the image bump 821 and the image bump 823 are mutually recognized. Therefore, the image bumps 821, the image bumps 822, and the image bumps 823 form one bump group.
  • the nine image bumps 82 shown in FIG. 3 form one bump group.
  • a plurality of bump groups are formed.
  • step S4 the data generation unit 6 generates bump position data in which the arrangement pitch of the lattice arrangement is constant.
  • making the array pitch constant corresponds to estimating the design reference positional relationship so as to eliminate or cancel the positional error of the plurality of image bumps 82.
  • the data generation unit 6 corrects so that the center points C1, C2, and C3 of the three image bumps 821, 822, and 823 arranged apart from each other in the first direction are arranged in a straight line, for example, as shown by the broken line in FIG. do. Further, the data generation unit 6 corrects the distance between the center points C1 and the center point C2 (arrangement pitch) so as to match the distance between the center points C1 and the center point C3 (arrangement pitch).
  • the above correction is performed on the nine image bumps 82 in the first direction and the second direction.
  • the center points of the nine image bumps 82 are arranged in 3 ⁇ 3 in the first direction and the second direction, and a total of 12 arrangement pitches in the first direction and the second direction are arranged.
  • the bump position data may further include an average value of the sizes of the plurality of image bumps 82, in other words, data of an average diameter.
  • the bump position data may be edited into the component data in combination with other data regarding the shape of the component 71, or may be used alone.
  • the bump position data generation device 1 can create a template to be used in the component mounting work based on the bump position data.
  • the template contains, for example, data on the constant arrangement pitch and average diameter of the plurality of image bumps 82 and does not include data on the shape of the image component 81.
  • the bump position data is data with high practical accuracy that estimates the design reference position relationship of the plurality of bumps 72
  • the template does not include the position error and the diameter error of each of the image bumps 82. Has high accuracy. If a template is created as it is from the image bumps 821, 822, and 823 shown in FIG. 7, the template has low accuracy including the position error and the diameter error of the bump 72 in the specific component 71.
  • the bottom surface of the parts 71 collected by the parts collecting tool of the mounting head is imaged and image data is acquired.
  • Image processing using a template having high accuracy is performed on this image data, and the position of the bump 72 with respect to the mounting head is accurately obtained. Therefore, image processing errors and mounting position errors are suppressed.
  • the group forming unit 5 may set a predetermined angle A.
  • the predetermined angle A corresponds to the position error allowed for the image bump 82 in the image data GD.
  • a recognition area that expands in a fan shape in the first direction and the second direction is set with reference to the center point C5 of the image bump 825.
  • the group forming unit 5 may set both a predetermined width W and a predetermined angle A.
  • the area within the predetermined width W and within the predetermined angle A is the recognition area (hatched area) with reference to the center point C6 of the image bump 826.
  • the group forming unit 5 After setting the predetermined angle A or both the predetermined width W and the predetermined angle A in step S12, the group forming unit 5 performs steps S13 to S16 in the same manner as described above, except that the shape of the recognition area is different. Execute.
  • a bump group is formed by image bumps (82, 821, 822, 823) having a regular image positional relationship in the image data GD, and a plurality of bump groups belonging to one bump group are formed.
  • the bump position data in which the design reference positional relationship of the plurality of bumps 72 is estimated is generated.
  • the reference positional relationship in the design is estimated so as to eliminate or cancel the positional error of a plurality of image bumps (82, 821, 822, 823), and the practical accuracy of the bump position data is improved as compared with the conventional case. be able to.
  • the bump position data having high practical accuracy can be applied in the image processing at the time of mounting the component 71, it is possible to suppress an image processing error and a mounting position error.
  • the group forming unit 5 performs a recognition process for recognizing another image bump 82 that is separated from each other in the first direction and the second direction while including a position error with respect to a certain image bump 82.
  • the image bump 82 is recognized, another image bump 82 is incorporated into a bump group including a certain image bump 82.
  • the group forming unit 5 further repeats the recognition process and the transfer process with the plurality of image bumps 82 as a reference in order. Details of this operation are shown in the sub-operation flow of FIG.
  • Steps S11 to S13 of FIG. 12 are the same as the description of the embodiment (see FIG. 5).
  • step S13 the case where the group forming unit 5 first sets the reference image bump 823 (see FIG. 7) will be described.
  • the group forming unit 5 sets the first bump group including the image bump 823.
  • the group forming portions 5 are arranged apart from each other in the recognition areas of the first direction and the second direction of the image bump 823, and the center point of another image bump 82 whose size is within the tolerance. Performs recognition processing to recognize.
  • the group forming unit 5 can recognize the center point C1 of another image bump 821 in the recognition area on the right side in the first direction of the image bump 823.
  • step S22 it is determined whether or not another image bump 82 has been recognized. If there is, in step S23, the group forming unit 5 incorporates the recognized image bump 821 into the first bump group. Further, when the group forming unit 5 recognizes the center point of another image bump 82 in the second direction, the group forming unit 5 incorporates another image bump 82 in the second direction into the first bump group.
  • step S24 the group forming unit 5 determines whether or not the recognition process based on all the image bumps 82 is completed. If no, the execution of the operation flow is returned to step S13.
  • step S13 the image bump 821 incorporated into the first bump group is set as a new reference, and step S21 is executed.
  • the group forming unit 5 can recognize the center point C2 of another image bump 822 in the recognition area on the right side in the first direction of the image bump 821. Therefore, in the second step S23 via step S22, the group forming unit 5 incorporates the recognized image bump 822 into the first bump group. In this way, the group forming portion 5 can increase the image bumps 82 in a so-called potato-like manner to form the first bump group. In the image data GD shown in FIG. 3, the nine image bumps 82 are finally incorporated into the first bump group.
  • step S24 the group forming unit 5 determines whether or not the recognition process based on all the image bumps 82 is completed. If it has ended, it means that all the image bumps 82 have been incorporated into the first bump group, and the sub operation flow ends.
  • the group forming unit 5 sets a second bump group including the image bump 82 that is not incorporated into the first bump group, and returns the execution of the operation flow to step S13. Then, the group forming unit 5 performs the recognition process of step S21 and the transfer process of step S23 with the image bump 82 not incorporated into the first bump group as a new reference. Further, the group forming unit 5 can form the final second bump group by changing the reference and repeating the recognition process and the transfer process.
  • the process of forming the bump group is different from that of the embodiment, but the formed bump group and the generated bump position data are the same as those of the embodiment. Therefore, as in the embodiment, the practical accuracy of the bump position data can be improved as compared with the conventional case, and further, the image processing error and the mounting position error during the mounting work of the component 71 can be suppressed.
  • the arrangement of the bumps 72 may be different in number in the first direction and the second direction, and may be arranged in a 3 ⁇ 4 lattice arrangement, for example.
  • a total of 13 bumps (74, 75) are staggered on the bottom surface thereof.
  • the nine bumps 74 shown in a circle have a regular 3 ⁇ 3 grid arrangement.
  • the remaining four bumps 75 which are shown as circles with hatches, are located in the middle of the nine bumps 74 in the diagonal direction, and have a regular 2 ⁇ 2 grid arrangement.
  • the group forming unit 5 can determine the first direction and the second direction by finding the smallest rectangle containing 13 bumps (74, 75).
  • the bump 75 is not located in the first direction or the second direction when viewed from the bump 74, but is located in a direction approximately at an angle of 45 °. Therefore, the group forming portion 5 forms the first bump group by the image bumps of the nine bumps 74, and forms the second bump group by the image bumps of the four bumps 75.
  • the data generation unit 6 generates bump position data for each of the first bump group and the second bump group, which are arranged intricately with each other. Further, the data generation unit 6 generates data representing the mutual positional relationship between the two sets of bump position data. In the case of the component 73 shown in FIG. 13, the mutual positional relationship data that the centers of the two sets of bump position data coincide with each other is generated.
  • the component 76 of the third example shown in FIG. 14 six bumps 77 for input are arranged on the left side of the bottom surface, and four bumps 78 for output are arranged on the right side of the bottom surface. ..
  • the six bumps 77 have a regular 2x3 grid arrangement and the four bumps 78 have a regular 2x2 grid arrangement.
  • the bump 77 is much larger than the bump 78.
  • the group forming unit 5 can determine the first direction and the second direction by finding the smallest rectangle containing a total of 10 bumps (77, 78). ..
  • the group forming portion 5 forms the first bump group by the image bumps of the six bumps 77, and forms the second bump group by the image bumps of the four bumps 78.
  • the data generation unit 6 generates bump position data for each of the first bump group and the second bump group, which are arranged apart from each other. Further, the data generation unit 6 generates data representing the mutual positional relationship between the two sets of bump position data. In the case of the component 76 shown in FIG. 14, data on the separation distance at which the centers of the two sets of bump position data are separated in the first direction is generated.
  • the bump position data generation device 1 of the embodiment and the modified form operates in the same manner as the part 71 exemplified in FIG. 1, and has the same operation. And the effect occurs. Further, the bump position data generation device 1 can be applied to, for example, a component in which a plurality of electrodes are arranged on two opposite sides of the bottom surface of a quadrangle, in addition to the illustrated components (71, 73, 76).
  • the predetermined width W is constant to the long side, the short side, or the diagonal length of the rectangle. It can be set by multiplying the ratio.
  • the data generation unit 6 performs each of the first direction and the second direction. Generate bump position data with uniform arrangement pitch. Further, it is not essential to create a template from the bump position data, and the bump position data can be applied to image processing at the time of mounting work by various methods. The embodiments and modifications can be applied and modified in various other ways.
  • Bump position data generation device 2 Imaging unit 3: Control unit 4: Image processing unit 5: Group forming unit 6: Data generation unit 71: Parts 72: Bump 73: Parts 74: Bump 75: Bump 76: Parts 77: Bump 78: Bump 81: Image parts 82, 821-826: Image bump GD: Image data RC: Rectangle W: Predetermined width A: Predetermined angle C1 to C6: Center point

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Abstract

Dispositif de génération de données de position de bosse comprenant : une unité d'imagerie qui capture des images d'une pluralité de bosses disposées sur un composant et acquiert des données d'image ; une unité de traitement d'image qui met en œuvre un traitement d'image sur les données d'image et extrait une pluralité de bosses d'image, qui sont des images de chacune des bosses incluses dans les données d'image ; une unité de formation de groupe qui, à l'intérieur des données d'image, forme un groupe de bosses à partir des bosses d'image présentant une relation de position d'image régulière prescrite qui permet une erreur de position ; et une unité de génération de données qui, sur la base des positions de la pluralité de bosses d'image appartenant au groupe de bosses et à la relation de position d'image régulière, génère des données de position de bosse dans lesquelles est estimée une relation de position de référence pour la conception de la pluralité de bosses disposées sur le composant.
PCT/JP2020/034832 2020-09-15 2020-09-15 Dispositif de génération de données de position de bosse WO2022059055A1 (fr)

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PCT/JP2020/034832 WO2022059055A1 (fr) 2020-09-15 2020-09-15 Dispositif de génération de données de position de bosse
JP2022550058A JP7423809B2 (ja) 2020-09-15 2020-09-15 バンプ位置データ生成装置

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JP2005123352A (ja) * 2003-10-16 2005-05-12 Juki Corp 部品データ生成装置及び電子部品実装装置
JP2008283050A (ja) * 2007-05-11 2008-11-20 Fuji Mach Mfg Co Ltd 画像処理用データ作成方法及び画像処理用データ作成装置

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JP2000315896A (ja) * 1999-04-30 2000-11-14 Tenryu Technics Co Ltd 表面実装部品装着機
JP2001094296A (ja) * 1999-09-21 2001-04-06 Yamaha Motor Co Ltd 電子部品位置計測方法
JP2005123352A (ja) * 2003-10-16 2005-05-12 Juki Corp 部品データ生成装置及び電子部品実装装置
JP2008283050A (ja) * 2007-05-11 2008-11-20 Fuji Mach Mfg Co Ltd 画像処理用データ作成方法及び画像処理用データ作成装置

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