CN101442899B - Component mounting method and apparatus - Google Patents
Component mounting method and apparatus Download PDFInfo
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- CN101442899B CN101442899B CN2008101775473A CN200810177547A CN101442899B CN 101442899 B CN101442899 B CN 101442899B CN 2008101775473 A CN2008101775473 A CN 2008101775473A CN 200810177547 A CN200810177547 A CN 200810177547A CN 101442899 B CN101442899 B CN 101442899B
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Abstract
The present invention provides a method and device for mounting a component, which can accurately select suitable shape of a section to be absorbed and an absorption nozzle, even if a special shaped component, such as a shielding component for preventing noise of processing panel shaped metal. The method for mounting a component uses a replaceable absorption nozzle (17a) mounted on a freely movable carrying end (17) to absorb a component (P) supplied with a component supply device (11), and carries the same on a substrate (10), the shape of the component to be absorbed is detected at a component supply position of the component supply device (11), according to the detection result, the absorption nozzle (17a) suitable for the component to be absorbed is selected.
Description
Technical field
The present invention relates to a kind of component mounting method and device, it utilizes adsorption mouth that the profiled parts such as shield member of the noise that is used to prevent the machining plate-like metal are adsorbed, and carries on substrate.
Background technology
In apparatus for mounting component; Shown in patent documentation 1; The boarded head that adsorption mouth is installed and can move freely is moved to parts supply with the position, boarded head is descended and behind the adsorption element, boarded head is moved on the substrate that transports; Boarded head is descended, with the assigned position place of the component mounting that adsorbs at substrate.
In above-mentioned apparatus for mounting component, must select best adsorption mouth accordingly with parts.Therefore, in patent documentation 2, according to the overall dimension of the parts that carry, the adsorption mouth of selecting to have the area of regulation and can obtaining stable adsorption plane is installed as the optimal adsorption mouth.
In addition, in patent documentation 3, adopt following method: the adsorption mouth of selecting is presented on the display, the image of shooting is moved, thereby adsorption mouth and absorption position are aimed at.
Patent documentation 1: the spy opens 2005-No. 183412 communiques (Fig. 1～Fig. 3)
Patent documentation 2: the spy opens flat 10-No. 329073 communiques
Patent documentation 3: the spy opens communique 2004-No. 146661
Summary of the invention
But, in recent years,, be used to prevent that the shield member etc. of the noise of machining plate-like metal from installing the industry extensive use like Fig. 1 or Fig. 2 institute illustration.Because this is used to prevent that the shield member of noise has various shapes, for example reduce for lightweight the precision that the cutting on wall thickness, surface handles low, or pad etc. is arranged, so have absorption position and the confined tendency of adsorption area on the surface.Its result, shown in patent documentation 2, the adsorption mouth of differentiating according to the member profile size differs and is decided to be the best, must be set at the adsorption mouth of the shape of the absorption position of having considered parts once more.
Therefore, current, operating personnel use survey tools such as vernier caliper, and practical measurement is adsorbed the size of portion, perhaps select best adsorption mouth from drawing fetch unit size.But, in these methods, exist the activity duration that is used for size up or reads drawing because of generation that operating efficiency is descended, perhaps taking place under the selected wrong situation, stably the problem of adsorption element.
The present invention is in order to address the above problem, and its problem does, to the profiled parts such as shield member of the noise that is used to prevent the machining plate-like metal, also can accurately and automatically select to be fit to the adsorption mouth of shape of the portion that is adsorbed of parts.
The present invention provides a kind of component mounting method, and it utilizes the adsorption mouth of boarded head to adsorb the profiled parts of the absorption position that is positioned at assembly supply device at the portion of the being adsorbed place of this profiled parts; It is moved on the substrate and carry; It is characterized in that, utilize and take the said at least portion that is adsorbed that unit photographs is positioned at the said profiled parts of said absorption position, according to shooting results; Obtain the said area that is adsorbed portion through computing, select adsorption mouth corresponding to the area of obtaining.
Here, with the image overlay of the adsorption hole of selected adsorption mouth on the said image that is adsorbed portion and show, thereby can confirm reliably.
In addition, can be in the size of the adsorption hole of selected adsorption mouth than the whole size of parts hour, with the translational speed of boarded head, keep the rising or falling speed and the rotary speed of the axle of adsorption mouth to be set at low speed.
The present invention provides a kind of apparatus for mounting component; It is to the profiled parts of the absorption position that is positioned at assembly supply device; Utilize the adsorption mouth of boarded head to adsorb at the portion of being adsorbed of this profiled parts place, it is moved on the substrate and carries, it is characterized in that; Have: take the unit, its shooting is positioned at the said at least portion that is adsorbed that parts are supplied with the profiled parts of position; And control unit, it obtains the said area that is adsorbed portion according to shooting results through computing, selects adsorption mouth corresponding to the area of obtaining.
The effect of invention
According to the present invention; Owing to detect in the parts absorption position of assembly supply device shape to the portion that is adsorbed of parts; Selection is suitable for the adsorption mouth of detected shape; So, also can generate the production routine that stably to produce at short notice and stably produce at short notice to the profiled parts such as shield member of the noise that is used to prevent the machining plate-like metal.
Description of drawings
Fig. 1 is the vertical view of an example of the shape of expression parts.
Fig. 2 is the vertical view of other examples of the shape of expression parts.
Fig. 3 is that expression has been used the overall structure of apparatus for mounting component of the present invention and cut a part and the stereogram of expression.
Fig. 4 is the stereogram of its boarded head part of expression.
Fig. 5 is the block diagram of the formation of its control part of expression.
Fig. 6 is the flow chart of the processing sequence of expression the 1st execution mode of the present invention.
Fig. 7 is the figure of the example that shows of the display of expression parts shown in Figure 1.
Fig. 8 is the figure of the example that shows of the display of expression parts shown in Figure 2.
Fig. 9 is the figure of the principle of the height sensor that uses in the 3rd execution mode of the present invention of expression.
Figure 10 is that expression is through the vertical view of the 3rd execution mode to situation about highly measuring.
Figure 11 (a) representes its front elevation, (b) figure of the example of the output of expression height sensor.
Embodiment
Below, with reference to accompanying drawing, execution mode of the present invention is at length described.
As shown in Figure 3, apparatus for mounting component 1 has: substrate transport path 15, and it is compared with central portion and is configured in rear side, extends and circuit substrate (abbreviating " substrate " as) 10 is moved along left and right directions; Assembly supply device (Feeder) 11, it is compared with central portion and is configured in the front side, and savings also keeps to substrate 10 mounted component; And X axle travel mechanism 12 and y-axis shift actuation mechanism 13, they are used to make boarded head 17 to move along directions X or Y direction.X axle travel mechanism 12 makes boarded head 17 move along X-direction, and y-axis shift actuation mechanism 13 makes X axle travel mechanism 12 and boarded head 17 move along Y direction in addition.
As shown in Figure 4; Boarded head 17 has a plurality of adsorption mouth 17a of adsorption element; With the number (being 3 in illustrated example) of adsorption mouth accordingly, have and make vertically (Z-direction) Z axle travel mechanism 18 of liftably moving and to make it be the θ axle rotating mechanism 19 that the center is rotated with adsorption mouth and suction nozzle shaft (absorption axle) of adsorption mouth 17a.The component identification camera 32 of height sensor 30 and pair of right and left is set on boarded head 17 in addition.As the component identification camera 32 of taking the unit, the parts of the absorption position that is positioned at assembly supply device are taken.In addition, height sensor 30 makes laser radiation to the parts of assembly supply device, accepts its reverberation and definite component height or component locations (parts center).
In addition, on boarded head 17, with the number of adsorption mouth accordingly, well-known laser calibration device (laser recognition device) 33 is installed.This laser calibration device 33 has the 33a of lasing fluorescence portion of emission laser and accepts the laser light accepting part 33b from the laser of the 33a of lasing fluorescence portion; Adsorbed the parts of the absorption position that is positioned at assembly supply device 11 at adsorption mouth 17a after; Adsorption mouth descends towards the peristome 33c of laser calibration device 33; Utilize θ axle rotating mechanism 19 to make to be adsorbed parts in from the laser beam of the 33a of lasing fluorescence portion, to carry out the rotation of θ axle, the shadow of laser during this period receives light by laser light accepting part 33b.After the arithmetic unit (CPU) of the control part stated; Obtain maximum, the minimum value of shadow of the parts of the suffered light of laser light accepting part; Thereby (inclinations of parts center and parts) are carried out computing to component locations, obtain the skew and the absorption of parts center and adsorption site and tilt.
In addition, as shown in Figure 3 on the main body of apparatus for mounting component 1, component identification camera 16 is set regularly.Component identification camera 16 is taken from the below to the parts that adsorbed by adsorption mouth.The image of the parts of taking, by after the image processing part stated carry out calculation process, obtain the skew and the absorption inclination of parts center and adsorption site.This component identification camera 16 is mainly used in to be discerned the high parts that carry precision of requirements such as IC parts, for small-sized parts such as chip parts, utilizes above-mentioned laser calibration device 33 its positions of identification.
In addition, on apparatus for mounting component 1, as shown in Figure 3 being provided with: CRT monitor 2, it shows the image of the parts of being taken by component identification camera 16,32 and imports data, operational data; LCD 3, its display-operation picture; And keyboard 4, its input command, data etc.
As shown in Figure 5, apparatus for mounting component 1 has control part (control unit) 21, and it is by constituting with the lower part: CPU 21a, and the whole parts of its control are installed; ROM 21c, it stores various control programs and data; And RAM 21b, its storage control data, deal with data provide the operating area.
In addition; In apparatus for mounting component 1, be provided with data and send acceptance division 26; It can carry out data and sends and receive between itself and master computer (not shown), the production routine that sends from master computer sends acceptance division 26 via these data and receives, and is stored in the data store 25.
Control part 21 utilizes X/Y drive division 22 control X axle travel mechanisms 12 and y-axis shift actuation mechanism 13 according to the data of the production routine that sends from master computer and the data of importing via data input part 27 (keyboard 4 etc.), and boarded head 17 is moved along X, Y direction.In addition, control part 21 utilizes other drive division 23, and control Z axle travel mechanism 18 and θ axle rotating mechanism 19 make adsorption mouth go up in Z-direction (short transverse) and move and be that the center is rotated with absorption axle (θ).
In addition; Control part 21 makes boarded head 17, and X, Y direction move in the assembly supply device upper edge; Thereby by from the laser of height sensor 30 parts of absorption position being carried out cross scan (cross scan), CPU (arithmetic element) 21a handles this signal and computing is carried out in the height and the parts center of parts.In addition; The CPU 21a of control part 21 obtains maximum, the minimum value of shadow of parts of the suffered light of laser light accepting part of laser calibration device 33; Thereby, obtain the offset and the absorption of parts center and adsorption site and tilt carrying out computing in the position component (parts center) of absorption position absorption.
On the other hand, the image of the parts of the absorption position that is positioned at assembly supply device that image processing part 24 reads in unit identification camera 32 is taken carries out computing to this position component (parts center).In addition, the image that image processing part 24 is handled from component identification camera 16 utilizes computing to obtain the parts center of the parts that adsorbed by adsorption mouth and the offset and the absorption of adsorption site is tilted.The offset and the absorption that utilize image processing part 24 to obtain are tilted; Boarded head 17 to circuit substrate move during; Utilize X axle travel mechanism 12, y-axis shift actuation mechanism 13 and θ axle rotating mechanism 19 to proofread and correct, thereby parts are carried on substrate 10 with correct attitude.
Below, with reference to Fig. 6, the processing sequence of the 1st execution mode is at length explained.
Apparatus for mounting component 1 adsorbs parts at the absorption position of the regulation of assembly supply device 11, is installed in the lift-launch assigned address on the substrate 10.Usually; On assembly supply device installation portion 11a; The a plurality of assembly supply devices 11 corresponding with variety of components are installed, through the manual input or the teaching input of coordinate position data, record and each assembly supply device 11 corresponding components absorption positions (step 100).
Boarded head 17 is moved,, the parts that are positioned at above-mentioned installation portion 11a are taken, the image that obtains is presented on the display 2 (step 120) so that the center of component identification camera 32 matches (step 110) with the absorption position of being set by above-mentioned operation.
The display of the parts that Fig. 7 (a) expression is shown in Figure 1 shows example, and the display of the parts that Fig. 8 (a) expression is shown in Figure 2 shows example.
In addition; Shown in Fig. 7 (b), Fig. 8 (b); The window W that shows circle or rectangle etc. and the regulation of the adsorption hole corresponding shape of adsorption mouth simultaneously is to adjusting operation in position and size, so that this window W is housed in being adsorbed in the portion of parts; Length x, y to the vertical and horizontal of adjusted window W carry out instrumentation, and instrumentation is also obtained the area S (step 130) in the window W automatically simultaneously.Here, because the parts part of the image of taking, usually because of indirect illumination manifests brightlyer, so can obtain the area of the portion of being adsorbed according to the summation of brighter pixel.
Based on the above size x that obtains, y and area S, the adsorption mouth information data of the formization that is had with the apparatus for mounting component 1 that uses contrasts, and in the scope of guaranteeing absorption position skew surplus, selects the maximum adsorption mouth (step 140) of area.Under the situation that can't detect the optimal adsorption mouth (step 150), show this situation (step 160) here, with information.
In addition, this apparatus for mounting component 1 does not have to show this situation (step 180) with information under the situation of corresponding to adsorption mouth (step 170) in the adsorption mouth of device internal standard configuration.In addition, the adsorption mouth of above-mentioned standard remains on the adsorption nozzle replacing platform, and this adsorption nozzle replacing platform is configured in the inside of apparatus for mounting component 1.
In this device, exist under the situation of best adsorption mouth, according to the member profile size be adsorbed portion's size, select best lift-launch Control Parameter (step 190).Specifically, as noted above, exist under the situation than big-difference with the whole size of parts in the size of the adsorption hole of the adsorption mouth of selecting, change the translational speed of boarded head 17.That is,,,, then possibly receive the influence of acceleration, the absorption position of parts slided or parts are fallen etc. if make its high-speed mobile than the adsorption mouth that is suitable for most part dimension hour in the adsorption mouth of selecting according to the size of the portion that is adsorbed of certain large component for example.Therefore, under above-mentioned situation, with the translational speed of boarded head and keep the rising or falling speed and the rotary speed of the axle of adsorption mouth to be set at low speed.
In addition, for to operating personnel's information, on display 2, show the information and the lift-launch Control Parameter of confirming (step 200) of detected optimal adsorption mouth.In addition, in order visually to confirm adsorption mouth, shown in Fig. 7 (c), Fig. 8 (c), show the superimposed image N of adsorption mouth in the picture centre of absorption position.
Here,, carry out under the more news of adsorption mouth information, carry out the setting again (step 220) of adsorption mouth pressing setting button (step 210).
In this execution mode; Can and be adsorbed portion's size according to the member profile size; Setup parameter automatically, thus improved fail safe, this parameter to adsorption element and move to the boarded head of loading position translational speed, keep the rising or falling speed and the rotary speed of the axle of adsorption mouth to control.
In addition; In above-mentioned the 1st execution mode, the window W shown in Fig. 7 (b), Fig. 8 (b) is set in the portion of being adsorbed, but also can be shown in the 2nd execution mode of Fig. 7 (d) or Fig. 8 (d) expression; With the absorption position after setting as the center; Outwards check pixel radially, be adsorbed the shape of portion's periphery, can automatically detect the size of the portion of being adsorbed through detection.As noted above, can utilize the size of mensuration, select best adsorption mouth.
In addition, discerning when handling, because the material character of parts and not under the situation of indirect illumination; Can be shown in the 3rd execution mode of following explanation, the height sensor 30 of the triangulation mode that for example has Lighting Division 30a and light accepting part 30b that utilization structure is as shown in Figure 9, shown in figure 10; Along the for example 8 scan line 30S that contain absorption position to highly measuring; Poor through parts parts and parts value in addition, the shape of judgement part is obtained size.Under the situation of the portion that the is adsorbed size of the horizontal direction of asking parts for example shown in Figure 10 through elevation measurement, shown in Figure 11 (a), height sensor 30 is moved and continuously its value is measured.The value that obtains shown in Figure 11 (b), owing to be surface by the bottom of the conveyer belt T that accommodates parts P and parts P obtain poor, so can be with the length of the part that obtains height as the size that is adsorbed portion.
In the above-described embodiment, owing to all be to utilize component identification camera 32 or height sensor 30, contact component ground is not measured and is adsorbed the size of portion, so can be because of by error parts not being destroyed.
In addition, the method that detects the shape of the portion that is adsorbed is not limited to these.
Claims (5)
1. component mounting method, it utilizes the adsorption mouth of boarded head to adsorb the profiled parts of the absorption position that is positioned at assembly supply device at the portion of the being adsorbed place of this profiled parts, and it is moved on the substrate and carries,
It is characterized in that,
Utilize the said at least portion that is adsorbed that unit photographs is positioned at the said profiled parts of said absorption position of taking,
According to shooting results, obtain the said area that is adsorbed portion through computing,
Select adsorption mouth corresponding to the area of obtaining.
2. component mounting method according to claim 1 is characterized in that,
With the image overlay of the adsorption hole of selected adsorption mouth on the said image that is adsorbed portion and show.
3. component mounting method according to claim 1 and 2 is characterized in that,
In the size of the adsorption hole of selected adsorption mouth than the whole size of parts hour, with the translational speed of boarded head, keep the rising or falling speed and the rotary speed of the axle of adsorption mouth to be set at low speed.
4. apparatus for mounting component, it utilizes the adsorption mouth of boarded head to adsorb the profiled parts of the absorption position that is positioned at assembly supply device at the portion of the being adsorbed place of this profiled parts, and it is moved on the substrate and carries,
It is characterized in that having:
Take the unit, its shooting is positioned at the said at least portion that is adsorbed of the said profiled parts of said absorption position; And
Control unit, it obtains the said area that is adsorbed portion according to shooting results through computing, selects adsorption mouth corresponding to the area of obtaining.
5. apparatus for mounting component according to claim 4 is characterized in that,
Have display unit, its with the image overlay of the adsorption hole of selected adsorption mouth on the said image that is adsorbed portion and show.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007302160A JP5052302B2 (en) | 2007-11-21 | 2007-11-21 | Component mounting method and apparatus |
| JP2007302160 | 2007-11-21 | ||
| JP2007-302160 | 2007-11-21 |
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| Publication Number | Publication Date |
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| CN101442899A CN101442899A (en) | 2009-05-27 |
| CN101442899B true CN101442899B (en) | 2012-04-18 |
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| CN2008101775473A Active CN101442899B (en) | 2007-11-21 | 2008-11-21 | Component mounting method and apparatus |
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| CN (1) | CN101442899B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5492481B2 (en) * | 2009-07-14 | 2014-05-14 | Ｊｕｋｉ株式会社 | Electronic component mounting device |
| JP5562711B2 (en) * | 2010-04-28 | 2014-07-30 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting method and electronic component mounting apparatus |
| JP5852366B2 (en) * | 2011-08-28 | 2016-02-03 | ヤマハ発動機株式会社 | Electronic component mounting device |
| EP3154326B1 (en) * | 2014-06-03 | 2020-09-09 | FUJI Corporation | Bulk component supply device and component mounting device |
| CN105472961B (en) * | 2014-09-30 | 2020-07-21 | 韩华精密机械株式会社 | Component holding head of surface mounting machine |
| KR102140520B1 (en) * | 2015-12-10 | 2020-08-03 | 한화정밀기계 주식회사 | The Apparatus For Selecting Best Adaptable Nozzle And Speed |
| WO2023058169A1 (en) * | 2021-10-06 | 2023-04-13 | ヤマハ発動機株式会社 | Component mounting device |
Citations (3)
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| CN1512836A (en) * | 2002-12-27 | 2004-07-14 | 重机公司 | Part adsorptive position demonstration method for part mounting device |
| CN1741728A (en) * | 2004-08-24 | 2006-03-01 | 雅马哈发动机株式会社 | Element identifying device and surface mounting machine with the same element identifying device |
| US7246429B2 (en) * | 2002-10-25 | 2007-07-24 | Hitachi High-Tech Instruments Co., Ltd. | Electronic component mounting apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3805477B2 (en) * | 1997-05-29 | 2006-08-02 | 山形カシオ株式会社 | Method and apparatus for automatically discriminating compatible nozzles, and recording medium on which a program for automatically discriminating nozzles is recorded |
| JP2000031693A (en) * | 1998-07-10 | 2000-01-28 | Sanyo Electric Co Ltd | Electronic component sucking part teaching apparatus |
| JP4212328B2 (en) * | 2002-10-18 | 2009-01-21 | 富士機械製造株式会社 | Anti-Board Work Machine, Anti-Board Work Machine Monitoring System, and Anti-Board Work Machine Monitoring Method |
| JP2004363634A (en) * | 2004-09-27 | 2004-12-24 | Hitachi High-Tech Instruments Co Ltd | Electronic component mounting device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7246429B2 (en) * | 2002-10-25 | 2007-07-24 | Hitachi High-Tech Instruments Co., Ltd. | Electronic component mounting apparatus |
| CN1512836A (en) * | 2002-12-27 | 2004-07-14 | 重机公司 | Part adsorptive position demonstration method for part mounting device |
| CN1741728A (en) * | 2004-08-24 | 2006-03-01 | 雅马哈发动机株式会社 | Element identifying device and surface mounting machine with the same element identifying device |
Also Published As
| Publication number | Publication date |
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| JP5052302B2 (en) | 2012-10-17 |
| JP2009130058A (en) | 2009-06-11 |
| CN101442899A (en) | 2009-05-27 |
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