WO2023058169A1

WO2023058169A1 - Component mounting device

Info

Publication number: WO2023058169A1
Application number: PCT/JP2021/037029
Authority: WO
Inventors: 佳史郎長瀬; 恒太伊藤
Original assignee: ヤマハ発動機株式会社
Priority date: 2021-10-06
Filing date: 2021-10-06
Publication date: 2023-04-13
Also published as: JPWO2023058169A1; CN117941482A; DE112021008128T5

Abstract

A component mounting device according to the present invention comprises: a mounting execution unit that includes a mounting head which is provided with a suction nozzle and which performs a component mounting process for mounting a component suctioned by the suction nozzle onto a substrate and that includes an imaging unit which acquires an image related to a component suction process; and a nozzle selection process unit that performs a selection process for selecting, from among a plurality of suction nozzles, a suction nozzle which is used in the component mounting process for a predetermined component in terms of the relation with the predetermined component. The nozzle selection process unit acquires information pertaining to the nozzle opening sizes of the plurality of suction nozzles and information pertaining to the size of a suction target surface of the predetermined component, determines, on the basis of the information, whether or not a selection condition is satisfied, and selects, from among the plurality of suction nozzles, a suction nozzle that satisfies the selection condition.

Description

Component mounter

The present invention relates to a component mounting apparatus that produces a component-mounted board by taking out a component from a component supply area, transporting the component onto the board, and mounting (mounting) the component.

A component mounting apparatus includes a feeder that supplies components, a mounting head that has a suction nozzle at its tip that absorbs the components supplied by the feeder, and transports and mounts the components onto the board.

The suction nozzle provided on the mounting head is required to reliably and stably pick up and hold the component. Therefore, usually, a type of suction nozzle suitable for component suction processing is selected and used from among a plurality of types (types) of suction nozzles having different suction surface shapes and sizes. At this time, one type of suction nozzle is often selected and used for one type of component. In some cases, these suction nozzles are selected and used properly.

However, the selection of suction nozzles as described above is performed by the operator, relying on his experience and intuition to guess the compatibility between the parts and the suction nozzles. Therefore, the type to be selected differs depending on the operator, and there are cases where a type of suction nozzle that is not necessarily appropriate in relation to the part is selected. In such a case, the suction state of the component by the suction nozzle tends to become unstable, and in order to compensate for this, it becomes necessary to set the moving speed of the mounting head low, resulting in a decrease in the production efficiency of the component mounting board. can be considered. Therefore, there is a demand for a technology that enables selection of a suction nozzle suitable for component mounting processing of a component in relation to the component without relying on the operator's experience and intuition.

JP 2007-142216 A

An object of the present invention is to provide a component mounting apparatus capable of selecting a suction nozzle suitable for component mounting processing of a component in relation to the component without relying on the operator's experience and intuition.

A component mounting apparatus according to one aspect of the present invention includes a suction nozzle that performs a component suction process for sucking a component supplied in a component supply area, and a component that mounts the component sucked by the suction nozzle on a board. A mounting execution unit including a mounting head that performs mounting processing and an imaging unit that performs image acquisition processing for acquiring a processing state image related to the component pick-up processing; and the component mounting of the predetermined component in relation to the predetermined component. a nozzle selection processing unit that performs a selection process of selecting the suction nozzle to be used for processing from among a plurality of suction nozzles, wherein the nozzle selection processing unit selects the nozzle opening of each of the plurality of suction nozzles. Acquiring information about size and information about the size of the sucked surface of the predetermined part, and satisfying selection conditions associated with the size of the nozzle opening and the size of the sucked surface based on the information It is configured to determine whether or not to select a suction nozzle that satisfies the selection condition from among the plurality of suction nozzles.

FIG. 1 is a block diagram showing the configuration of a component mounting apparatus according to the present invention. FIG. 2 is a plan view of the device main body of the component mounting device. FIG. 3 is a front view mainly showing the head unit of the apparatus main body. FIG. 4 is a diagram showing a suction nozzle attached to a mounting head provided in the head unit. FIG. 5 is a flowchart showing control (main routine) of nozzle selection processing by the nozzle selection processing unit. FIG. 6 is a flow chart showing control (subroutine) of the data acquisition process in the selection process. FIG. 7 is a diagram for explaining selection conditions for the suction nozzles. FIG. 8 is a diagram showing an example of a screen displayed by the display section when there are a plurality of selection candidates. FIG. 9 is a flowchart showing control of component mounting processing by the mounting control unit. FIG. 10 is a flow chart showing a modification of the control of the nozzle selection process.

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[Configuration of Component Mounting Device]
FIG. 1 is a block diagram showing the configuration of a component mounting apparatus 100 according to one embodiment of the present invention. The component mounting system 100 is an apparatus that mounts electronic components (hereinafter referred to as “components”) on a board P such as a printed wiring board to produce a component-mounted board. The component mounting apparatus 100 includes an apparatus body 1 , a control section 2 , a communication section 3 , a display section 4 and an operation section 5 . The apparatus body 1 corresponds to the "mounting executing section" of the present invention, and the operating section 5 corresponds to the command input section of the present invention.

The device main body 1 performs component mounting processing for mounting components on the board P. The communication unit 3 is an interface for performing data communication with the management device 110 described later, and has a function of inputting/outputting various data and information to/from the management device 110 . The control unit 2 controls the component mounting processing by the device main body 1 based on various data stored in the storage device 23 described later, and also controls data communication of the communication unit 3 . The display unit 4 displays various information regarding the component mounting process. The operation unit 5 receives input operations of various commands to the control unit 2 by the operator. The detailed configuration of each of these units will be described below.

2 is a plan view showing the device main body 1 of the component mounting apparatus 100, and FIG. 3 is a front view mainly showing the head unit 16 of the device main body 1. FIG. In addition, in FIGS. 2 and 3, the directional relationship is shown using XYZ orthogonal coordinates.

The apparatus main body 1 includes a base 10, a conveyor 12, a component supply unit 14, a head unit 16, and an imaging section 18. The base 10 is a mounting base for various devices provided in the apparatus main body 1 . The conveyor 12 is a transport line for the substrate P installed on the base 10 so as to extend in the X direction, and is composed of a pair of belt-type conveyors 12a. The conveyor 12 carries the board P from outside the machine to a predetermined work position, and carries the board P out of the machine from the work position after the mounting work. The position of the substrate P shown in FIG. 2 is the working position. The conveyor 12 is provided with a clamping mechanism (not shown), and the substrate P is held at the working position by this clamping mechanism during the component mounting process.

The component supply units 14 are areas for supplying components, and are provided on both sides of the conveyor 12 in the Y direction. A plurality of feeders 14a are installed in the component supply unit 14, and components are supplied by each feeder 14a. In this example, each component supply unit 14 is provided with a tape feeder that supplies components while feeding out a tape containing components (small surface mount components) at regular intervals. Various feeders other than the tape feeder can be arranged in the component supply unit 14 .

The head unit 16 picks a component from the feeder 14a in the component supply unit 14, moves it to a working position, and performs a component mounting process of mounting the component on the board P held by the clamp mechanism. As shown in FIG. 3, the head unit 16 has a plurality of mounting heads 160 each having a suction nozzle 161 at its tip (lower end). The suction nozzle 161 is a nozzle capable of sucking a component supplied by the feeder 14a. The suction nozzle 161 performs component suction processing for sucking a component.

FIG. 4 shows the suction nozzles 161 attached to each mounting head 160 of the head unit 16 and the tip surface of each suction nozzle 161, that is, the component suction surface 162 . In FIG. 4, only the mounting heads 160 at both ends in the X direction are denoted by reference numerals for convenience.

The suction surface 162 consists of a surface orthogonal to the central axis of the suction nozzle 161, and a nozzle opening 162a is provided at the center thereof. The nozzle opening 162a can communicate with any one of a negative pressure generator, a positive pressure generator, and the atmosphere via an electric switching valve. By supplying a negative pressure to the suction nozzle 161, the component can be sucked and held by the suction nozzle 161, and thereafter, by supplying a positive pressure, the component is released from being sucked and held. A suction level sensor (not shown) is provided in a passage between the suction nozzle 161 of each mounting head 160 and each of the electric switching valves. The suction level sensor detects the suction level of the component, more specifically, the level of the negative pressure in the passage, and outputs it to the control section 2 .

The mounting head 160 can move forward and backward (up and down) in the Z direction and rotate around its axis (movement in the R direction), and is driven by a motor (not shown). That is, when picking a component from the feeder 14a, the mounting head 160 descends from a predetermined retracted position to a predetermined component suction position, picks up and holds the component by the suction nozzle 161, and then rises to the retracted position. When a component is to be mounted on the board P, the mounting head 160 descends from the retracted position above the board P to the component mounting position, and the component is released from the sucking and holding position, thereby mounting the component on the board P. Release. Thereby, the component is mounted on the target mounting position set on the substrate P. FIG.

The head unit 16 is movable in the horizontal direction (XY directions) at least in the upper space between the component supply unit 14 and the board P at the working position by the operation of the head unit drive mechanism 17 . 2 and 3, the head unit driving mechanism 17 includes fixed rails 171 each fixed to a pair of elevated frames installed on the base 10, and a beam moving along the fixed rails 171 in the Y direction. It comprises a member 172 and a unit support (not shown) that moves along the beam member 172 in the X direction. A head unit 16 is assembled to this unit support portion. The beam member 172 and the unit support member are each moved by the driving force of the motor. The movement of the beam member 172 and the unit support member causes the head unit 16 to move in the XY directions.

The imaging section 18 includes a first imaging section 181 and a second imaging section 182 . The first imaging unit 181 and the second imaging unit 182 each provide an imaging camera equipped with an imaging device such as a CMOS (Complementary metal-oxide-semiconductor) or a CCD (Charged-coupled device), and lighting for imaging. The first imaging unit 181 is installed on the base 10 between the component supply unit 14 and the conveyor 12 facing upward. The first imaging unit 181 performs component imaging processing for imaging the component in order to recognize the state of the component being sucked and held by the suction nozzle 161 . After the suction nozzle 161 of each mounting head 160 has sucked and held the component from the feeder 14a, the first imaging section 181 moves the first imaging section 181 when the head unit 16 moves above the board P at the working position. By passing above, the component sucked and held by each suction nozzle 161 is imaged from the lower side (that is, the tip side along the axial direction of the suction nozzle 161). The image obtained in this way includes, for example, the posture and shape of the component sucked and held by the suction nozzle 161, the component position relative to the suction nozzle 161, and the component suction error (state in which the component is not picked up) by the suction nozzle 161. This is an image (processing state image related to component pick-up processing) with which it is possible to check the amount of deviation of the picked-up position of the part. When a component is mounted on the substrate P, the movement direction and movement amount of the head unit 16 are corrected based on the attitude and deviation amount of this component. This ensures the mounting accuracy of the component to the target mounting position.

The second imaging section 182 is arranged downward on the head unit 16 . When each mounting head 160 executes the component mounting process, the second imaging unit 182 detects various marks attached to the upper surface of the substrate P placed at the working position from above in order to recognize the various marks. Take an image. By recognizing the marks on the substrate P, the positional deviation amount of the substrate P with respect to the origin coordinates is detected. In addition, the second imaging unit 182, during nozzle selection processing to be described later, uses the component supply unit 14 to recognize the suction surface S (see FIG. 7) of the component, that is, the surface to be picked up by the suction nozzle 161. An image of the components arranged at the component supply position of the installed feeder 14a is taken from above.

The nozzle holder 6 is installed adjacent to the first imaging section 181 in the X direction between the conveyor 12 and one component supply unit 14 . The nozzle holder 6 is a device that holds the suction nozzle 161 . The nozzle holder 6 holds a plurality of suction nozzles 161 in such a manner that they can be attached to any mounting head 160 of the head unit 16 . The suction nozzle 161 held by the nozzle holder 6 is attached to and detached from each mounting head 160 as required before or during the production of component mounting boards.

Returning to FIG. 1, the display unit 4 is configured by, for example, a liquid crystal display, and displays various types of information on the component mounting process by the apparatus main body 1. The display operation of the display section 4 is controlled by the display control section 25 . The operation unit 5 is composed of a keyboard, a mouse, a touch panel provided in the display unit 4, or the like. The operation unit 5 receives input operations of various commands to the control unit 2 by the operator.

The control unit 2 is composed of a CPU (Central Processing Unit), a ROM (Read Only Memory) that stores control programs, a RAM (Random Access Memory) that is used as a work area for the CPU, and the like. The control unit 2 controls the operation of each component of the apparatus main body 1, controls the data communication operation of the communication unit 3, and further performs various arithmetic processing by executing the control program stored in the ROM by the CPU. Execute. As shown in FIG. 1, the control unit 2 includes a mounting control unit 21, a nozzle selection processing unit 22, an image processing unit 24, a display control unit 25, a communication control unit 26, etc. as main functional components. The controller 2 is provided with a storage device 23 such as a rewritable hard disk.

The mounting control unit 21 comprehensively controls the operation of the component mounting process by the apparatus main body 1 based on various data stored in the storage unit 23, and executes various arithmetic processing and determination processing associated with the control. .

The storage device 23 stores various programs executed by the mounting control unit 21 and the nozzle selection processing unit 22, and various data referred to when executing the programs. Various data include board data D1 and mounting data D2.

The board data D1 is data relating to the board P (component-mounted board) that is mainly produced, and includes production plan information D11 and mounted component information D12. The production plan information D11 is information such as the board name indicating the type of board P scheduled to be produced, the order of production of each type of board P, and the number of each type of board P to be produced. Mounted component information D12 includes the components to be mounted on each type of board P, the target mounting position (X, Y, R) of each component on the board P, and the component by the suction nozzle 161 at the time of component suction processing of the component. This is information in which the relationship with the target suction position (X, Y) is registered. The target pick-up position is usually set at the center position of the pick-up surface S of the component.

The mounting data D2 is taken into consideration in various arithmetic processing and determination processing necessary for controlling the component mounting processing of the device main body 1 by the mounting control unit 21 and for controlling the later-described nozzle selection processing of the suction nozzle 161 by the nozzle selection processing unit 22. Information. The mounting data D2 includes component information D21, nozzle information D22, nozzle matching information D23, control parameter information D24, setup information D25, and nozzle holder information D26.

The component information D21 includes the component name indicating the component type, the external dimensions of the component, the dimensions and area of the surface S to be attracted (information related to the size of the surface S to be attracted), the thickness of the component, and the like, which are registered for each type of component. It is information that has been The nozzle information D22 includes type information indicating the type of the suction nozzle 161, the size and area of the suction surface 162 of the suction nozzle 161, the size and area of the nozzle opening 162a (information about the size of the nozzle opening), and the like. This information is registered for each of the 161 types.

The nozzle matching information D23 is information in which the relationship between a component and the type of suction nozzle 161 used for component mounting processing of the component is registered. In the nozzle matching information D23, one type of suction nozzle 161 is registered for each type of component, and the type of suction nozzle 161 selected by the nozzle selection process described later is registered.

The control parameter information D24 is information in which parameters for drive control of the head unit 16 and the mounting head 160 in the component mounting process are registered. Information about the moving speed and the acceleration/deceleration of the head unit 16 is registered as the parameter of the head unit 16 in the control parameter information D24. Also, as the parameters of the mounting head 160, information on the up/down speed and acceleration/deceleration of the mounting head 160 during component pickup and component mounting, as well as the component pickup position and the component mounting position (both positions in the Z direction) are registered. there is

The setup information D25 is information in which a parameter specifying the feeder 14a installed in the component supply unit 14 is registered. The setup information D25 includes parameters for specifying the feeders 14a, such as the type of the feeder 14a, the identifier for specifying the feeder 14a, the set position of the feeder 14a in the component supply unit 14, the type of components supplied by each feeder 14a. etc. are registered.

The nozzle holder information D26 is information in which the suction nozzle 161 set in the nozzle holder 6 and the set position of the suction nozzle 161 in the nozzle holder 6 are registered.

The nozzle selection processing unit 22 executes nozzle selection processing for selecting a type of suction nozzle 161 suitable for the component mounting process of the component in relation to the component. In the nozzle selection process, for example, when a new component that is not registered in the nozzle matching information D23 is included in the mounting component information D12, the suction nozzles 161 and nozzle This is a process of selecting a type of suction nozzle 161 suitable for component mounting processing of the component from among the suction nozzles 161 held in the holder 6 and registering it in the matching information D23. This nozzle selection process will be described in detail later.

The image processing unit 24 takes in image signals output from the first imaging unit 181 and the second imaging unit 182, and generates a digital image based on the image signals. Based on this image, the mounting control unit 21 and the nozzle selection processing unit 22 perform a process of recognizing the posture, shape, and deviation amount of the component suction position of the component sucked and held by the suction nozzle 161 .

The display control unit 25 controls the display operation of the display unit 4. Further, the communication control section 26 controls data communication between the component mounting apparatus 100 and the management apparatus 110 by controlling the communication section 3 .

The management device 110 is configured by, for example, a personal computer connected to the component mounting device 100 so as to be able to communicate with it. The management device 110 acquires the management data DM output from the component mounting system 100, accumulates and stores the management data DM. The management data DM is a history of one component mounting process performed by the mounting head 160, and includes data such as component recognition results in the component mounting process and the amount of displacement of the pick-up position. This is data associated with the nozzle 161, the feeder 14a, and the like. The management data DM is created by the mounting control unit 21, and is output from the component mounting apparatus 100 to the management apparatus 110 when, for example, the production type of the board P is switched.

[Nozzle selection process]
Next, control of the nozzle selection process will be described with reference to FIGS. 5 and 6. FIG. FIG. 5 is a flowchart showing control (main routine) of nozzle selection processing by the control unit 2 (mainly nozzle selection processing unit 22), and FIG. 6 shows control (subroutine) of data acquisition processing in the nozzle selection processing. It is a flow chart.

As described above, the nozzle selection process selects a type of suction nozzle 161 (hereinafter, "type" may be abbreviated) suitable for the component mounting process of the component in relation to the component, and selects the nozzle. This is the process of registering the matching information D23. The nozzle selection process is executed automatically or based on the operation of the operation unit 5 by the operator before the production of the substrate P (component mounting substrate) is changed after the type of the substrate P is changed. Further, the nozzle selection process is executed for each of all the types of components included in the mounted component information D12, or for some of the types of components selected by the operator through the operation of the operation unit 5. .

When the control of the nozzle selection process shown in FIG. 5 is started, the nozzle selection processing unit 22 first executes the data acquisition process of the target component and the suction nozzle 161 according to the flowchart of FIG. 6 (step S1). Specifically, the nozzle selection processing unit 22 considers the nozzle information D22, and determines information about the suction nozzles 161 attached to the mounting heads 160 of the head unit 16 and the suction nozzles 161 held in the nozzle holder 6. The presence or absence is determined (step S31). Specifically, the presence or absence of data on the dimensions and area of the nozzle opening 162a of the adsorption surface 162 is determined, and if Yes, the process proceeds to step S33.

If there is no data for any of the suction nozzles 161 (No in step S31), the nozzle selection processing unit 22 drives the head unit 16 and arranges the suction nozzles 161 without data above the second imaging unit 182. do. Accordingly, a process of acquiring an image of the suction surface 162 of the suction nozzle 161 is executed (step S39). Further, the nozzle selection processing unit 22 determines whether or not the nozzle openings 162a can be recognized in the acquired image (step S41). Here, in the case of No, the display control unit 25 controls the display unit 4 so that the image of the suction surface 162 acquired in step S39 is displayed together with the message requesting the identification of the nozzle opening 162a (step S43). In this case, the operator can specify the nozzle openings 162a by operating the operation unit 5, and the nozzle selection processing unit 22 waits for input of a command to specify the nozzle openings 162a, If there is the input (Yes in step S45), the process proceeds to step S33. Note that the nozzle openings 162a can be specified, for example, by an operator operating a tool displayed on the screen and tracing the outline of the portion corresponding to the nozzle openings 162a on the image of the suction surface 162. .

If it is determined as Yes in steps S41 and S45, the nozzle selection processing unit 22 shifts the process to step S33, reads the data of the nozzle openings 162a from the mounting data D2, or reads the nozzle openings 162a recognized in step S41. or the image of the nozzle opening 162a identified in step S45, the dimensions and area of the nozzle opening 162a are calculated.

Next, the nozzle selection processing unit 22 considers the component information D21 and determines whether or not there is information on the target component (step S35). is determined, and if Yes, the process proceeds to step S37.

If there is no data (No in step S35), the nozzle selection processing unit 22 executes a process of acquiring an image of the suction surface S of the target component (step S47). Specifically, the nozzle selection processing unit 22 drives the feeder 14a that supplies the target component, arranges the component at the component pick-up position, drives the head unit 16, and moves the second imaging unit 182 to the feeder. It is arranged above the part pick-up position of 14a. As a result, the image of the component including the surface S to be sucked is acquired by the first imaging section 181 . Then, it is determined whether or not the surface S to be sucked can be recognized in the acquired image (step S49). The display control unit 25 controls the display unit 4 so that the image is displayed (step S51). In this case, the operator can specify the surface S to be adsorbed by operating the operation unit 5, and the nozzle selection processing unit 22 waits for input of a command to specify the surface S to be adsorbed. If there is the input (Yes in step S53), the process proceeds to step S37. As in the case of the nozzle opening 162a, the surface S to be sucked is specified by the operator operating a tool displayed on the screen and tracing the outline of the portion corresponding to the surface S to be sucked on the image. It can be carried out.

If it is determined as Yes in steps S49 and S53, the nozzle selection processing unit 22 shifts the process to step S37, reads the data of the suction surface S from the mounting data D2, or reads the suction surface S recognized in step S49. or the image of the surface S to be attracted specified in step S53, the size and area of the surface to be attracted S are calculated.

Returning to FIG. 5, next, the nozzle selection processing unit 22 performs , whether or not there is a suction nozzle 161 that satisfies a predetermined selection condition in relation to the target component (step S3).

FIG. 7 is a schematic diagram for explaining the selection conditions, and schematically shows the suction surface 162 of the suction nozzle 161 that has suctioned the part T and its surface S to be sucked. More specifically, the suction nozzle 161 (mounting head 160) arranged at a predetermined position in the rotational direction (position in the R direction) picks up the component T placed at the component supply position of the feeder 14a (tape feeder). A state in which the suction surface S is sucked is schematically shown.

The part T is a rectangular parallelepiped part having a length Sx in the X direction and a length Sy in the Y direction. Therefore, the entire upper surface of the component T is the surface S to be attracted. The suction nozzle 161 has an X-shaped nozzle opening 162a at the center of a rectangular suction surface 162 in plan view. The dimension of the nozzle opening 162a in the X direction is Ax1, and the dimension in the Y direction is Ay.

Here, the amount of deviation of the suction nozzle 161 in the X direction that is allowed during the component adsorption process is Mx, the amount of deviation in the Y direction is My, the area of the nozzle opening 162a of the adsorption nozzle 161 is Ar1, and the surface S of the component T to be adsorbed is The above selection conditions are defined by the following formulas 1 to 3, where Ar2 is the area of , and T1 and T2 (T1>T2) are preset threshold values.
Sx>(Ax+Mx) (Formula 1)
Sy>(Ay+My) (Formula 2)
T1>(Ar1/Ar2)>T2 (Formula 3)
Equations 1 and 2 define a condition (first condition) that the entire nozzle opening 162a overlaps the sucked surface S of the component when the component is picked up. By satisfying the first condition, it can be said that the suction nozzle 161 can apply the negative pressure supplied through the nozzle opening 162a to the surface S to be sucked without omission.

In addition, Equation 3 defines a condition (second condition) that the ratio of the area of the nozzle opening 162a to the area of the surface S to be sucked of the component is within a certain range. As long as the first condition is satisfied, the size (area) of the nozzle opening 162a is preferably as large as possible with respect to the surface S to be attracted. However, if the nozzle opening 162a is too large with respect to the suction surface S, depending on the type of the component, it may take time to release the component from the suction state, which may adversely affect the release of the component. If it is too long, the stability of the sucking and holding of the component by the sucking nozzle 161 is lowered. That is, by satisfying the third condition, the suction nozzle 161 can balance the stability of sucking and holding the component and the release stability of the component when the sucking and holding is cancelled.

In the process of step S3, the nozzle selection processing unit 22 determines whether each suction nozzle 161 satisfies the selection requirements (first and second conditions). Here, in the case of No, the display control unit 25 controls the display unit 4 so that a predetermined error display indicating that there is no corresponding suction nozzle 161 is displayed (step S13). End control.

On the other hand, if there is a suction nozzle 161 that satisfies the first and second conditions (Yes in step S3), the nozzle selection processing unit 22 selects the suction nozzle 161 in question. In this case, the display control unit 25 controls the display unit 4 so that the selection screen G1 for the suction nozzles 161 is displayed. The selection screen G1 shows the operator the suction nozzle 161 selected in the process of step S3 as a final candidate for selection, and whether the suction nozzle 161 is registered in the nozzle matching information D23 as the suction nozzle 161 corresponding to the target component. This is a screen asking the operator to decide whether or not to proceed. This selection screen G1 is displayed regardless of the number of suction nozzles 161 selected in the process of step S3 (that is, suction nozzles 161 satisfying the first and second conditions).

For example, FIG. 8 shows an example of the selection screen G1. This figure schematically shows the selection screen G1 when there are a plurality (three) of suction nozzles 161 selected in the process of step S3. The selection image G1 includes a candidate nozzle image G11 indicating the suction nozzle 161 that is a selection candidate, and a selection request image G12. The candidate nozzle image G11 is an image representing each of the suction nozzles 161 selected in the process of step S3. The candidate nozzle image G11 includes, for example, a front image G11a and a suction surface image G11b of the suction nozzle 161. The selection request image G12 is an image of a character string requesting selection (designation) of any of the suction nozzles 161 (candidate nozzle images G11) displayed on the selection screen G1. By operating the operation unit 5, the operator Any one of the candidate nozzle images G11 displayed in the selection image G1 can be selected.

Although illustration is omitted, when one suction nozzle 161 is selected in the process of step S3, one candidate nozzle image G11 showing the suction nozzle 161 and the selection request image G12 are displayed as the selection screen G1. A selection screen G1 containing the screen is displayed.

The nozzle selection processing unit 22 waits for a selection command input by the operator's operation of the operation unit 5, and if there is an input (Yes in step S7), determines whether or not the selected suction nozzle 161 has been used (step S9). Specifically, the nozzle selection processing unit 22 considers the nozzle matching information D23 of the mounting data D2, and also considers the past management data DM accumulated and stored in the management device 110 via the communication unit 3. . Then, the suction nozzle 161 selected in the processing of step S7 is registered in the nozzle matching information D23 in relation to the target component, or the suction nozzle 161 was used in past component mounting processing of the target component. and whether or not the component pick-up process has been completed normally.

If Yes in step S9, the nozzle selection processing unit 22 updates the mounting data D2 (step S11). That is, the nozzle selection processing unit 22 registers the suction nozzle 161 selected in the process of step S7 in the nozzle matching information D23 as the suction nozzle 161 corresponding to the target component. This completes the control of this flowchart.

On the other hand, when it is determined that the selected suction nozzle 161 has not been used (No in step S9), the nozzle selection processing unit 22 shifts the process to step S15, 1 is controlled to execute a component pick-up test (step S15). In the component pick-up test, the head unit 16 and mounting head 160 are driven based on preset test drive control parameters, and the pick-up nozzle 161 selected in step S7 is used to actually pick up the target component. is performed, and the component imaging process is performed by the first imaging unit 181 . The nozzle selection processing unit 22 obtains the suction level data of the component and the image of the component sucked and held by the suction nozzle 161 by this component suction test, and determines whether or not the predetermined requirements are satisfied. Determine (step S17). Specifically, the nozzle selection processing unit 22 determines whether the suction level is within a specified range and whether the posture of the component sucked and held by the suction nozzle 161 and the amount of deviation of the suction position are within the allowable range. judge. If Yes here, the nozzle selection processing unit 22 shifts the process to step S11 and updates the mounting data D2. If Yes in step S17, the display control unit 25 controls the display unit 4 so that a message to the effect that the above-mentioned requirements are satisfied is displayed together with specific values of the suction level and the displacement amount of the suction position. may be controlled.

On the other hand, if it is determined in the process of step S17 that at least one of the conditions is not satisfied (No in step S17), the selected suction nozzle 161 is not appropriate, and other The display control unit 25 controls the display unit 4 so that a message (mismatch display) recommending selection of the suction nozzle 161 is displayed (step S19).

After that, the nozzle selection processing unit 22 determines whether or not there is a candidate suction nozzle 161 other than the suction nozzle 161 selected in step S7 (step S21). return to On the other hand, if it is determined that there is no other candidate suction nozzle 161 (No in step S21), the process proceeds to step S13.

[Parts mounting process]
Next, control of component mounting processing will be described with reference to FIG. FIG. 9 is a flow chart showing control of component mounting processing by the control unit 2 (mainly the mounting control unit 21).

The component mounting process is executed by the mounting control section 21 controlling each section of the apparatus main body 1 based on the board data D1 while taking the mounting data D2 into consideration.

The mounting control unit 21 first selects the suction nozzle 161 to be used for component mounting processing, and mounts the suction nozzle 161 from the nozzle holder 6 to each mounting head 160 of the head unit 16 (step S41). In this case, the mounting control unit 21 selects the suction nozzle 161 by referring to the nozzle matching information D23 based on the component registered in the mounting component information D12. Therefore, each mounting head 160 is equipped with a suction nozzle 161 that satisfies the first and second conditions of the nozzle selection process.

Next, the mounting control unit 21 determines whether or not there are a plurality of suction nozzles 161 of the same type, ie, a plurality of suction nozzles 161 having the same type information, among the suction nozzles 161 mounted on the mounting head 160 (step S42). ). In the case of Yes here, the mounting control unit 21 selects one mounting head 160 from among the plurality of mounting heads 160 of the same type (step S43). Specifically, the mounting control unit 21 controls each position in the head unit 16 of the plurality of mounting heads 160 to which the same type of suction nozzles 161 are respectively mounted, the set-up information D25, and the mounted component information D12. Based on the target mounting position (X, Y, R) of the existing component, the time required for component mounting processing of the component is calculated, and the mounting head 160 with the shortest time is selected (step S43).

When the selection process of the mounting head 160 is completed, the mounting control unit 21 executes the component mounting process by controlling each part of the apparatus body 1 based on the mounting component information D12. In this case, the device body 1 is controlled by the mounting control unit 21 so that the component mounting process is performed by the suction nozzle 161 selected in step S43 for the component to be subjected to component suction processing by the suction nozzle 161 of the same type. be.

It should be noted that, in the process of step S42, if there are not a plurality of mounting heads 160 to which the same type of suction nozzles 161 are mounted, the mounting control unit 21 skips the processes of steps S42 and S43 and shifts the process to step S45. do.

[Effects, etc.]
According to the component mounting system 100, it is possible to enjoy the following effects. The selection process of the suction nozzle 161 is executed automatically before the operation or based on the operation of the operation unit 5 by the operator (FIGS. 5 and 6). As described above, this nozzle selection process is a process of selecting the type of suction nozzle 161 suitable for the component mounting process of the component in relation to the component.

In this selection process, the nozzle selection processing unit 22 satisfies the first condition (Formula 1, Formula 2) and the second condition (Formula 3) based on the component information D21 and the nozzle information D22. A type of suction nozzle 161 suitable for the component mounting process of the target component is selected (step S3 in FIG. 5). Therefore, the operator does not need to select the type of suction nozzle 161 suitable for the part by relying on his/her own experience and intuition, and the operation of selecting the suction nozzle 161 is automated. In addition, variation in the type of suction nozzle to be selected by operators is also suppressed.

In this case, when the mounting data D2 (nozzle information D22) stored in the storage device 23 does not include the information of the suction nozzle 161 (No in step S31 of FIG. 6), the first imaging unit 181 A process of imaging the suction surface 162 of the suction nozzle 161 is executed. (Step S39). If there is no target component information in the mounting data D2 (component information D21) (No in step S35), the second imaging unit 182 executes component imaging processing for the component (step S47). Then, based on the images acquired by these processes, the dimensions and area of the nozzle opening 162a and the dimensions and area of the suction surface S of the target component are obtained, and whether the first condition and the second condition are satisfied. No is determined. Therefore, even if a new suction nozzle 161 is added, or a new part that has never been used is used, the nozzle selection process can be executed without any trouble. In other words, it can be said that high execution efficiency is ensured for the nozzle selection process.

Moreover, when the nozzle opening 162a cannot be recognized from the image of the suction surface 162 of the suction nozzle 161, a screen requesting to specify the nozzle opening 162a is displayed on the display unit 4 (step S43). Similarly, when the suction surface S cannot be recognized from the image of the component, a screen requesting to specify the suction surface S is displayed on the display unit 4 (step S51). On the other hand, the operator can specify the nozzle opening 162a and the suction surface S by operating the operation unit 5 (steps S43 and S45). In this case, the size and area are determined based on the image of the nozzle opening 162a and the image of the suction surface S specified by the operator, and then whether the first condition and the second condition are satisfied. No is determined. Therefore, in this respect as well, high performance is ensured for the nozzle selection process.

In the nozzle selection process, when there are a plurality of suction nozzles 161 that satisfy the first and second conditions, a candidate nozzle image G11 showing the selection candidate suction nozzles 161 and a selection request image G12 are displayed on the display unit 4. displayed (step S5). In this case, the operator can select any one of the suction nozzles 161 by operating the operation unit 5 (step S7). Therefore, the degree of freedom in selection of the suction nozzle by the operator is ensured. Strictly speaking, this also means that the selected suction nozzle varies depending on the operator. However, all of the plurality of candidate suction nozzles 161 satisfy the first and second conditions, and all of them are suction nozzles 161 suitable for the target component in relation to the target component. Therefore, the variation does not affect the production efficiency of the component-mounted board as in the conventional art, and the conventional problem of the variation in the suction nozzles can be resolved.

If the suction nozzle 161 selected by the operator has no track record of use (No in step S9), the selected suction nozzle 161 executes a component suction test for actually performing component suction processing and image acquisition processing ( step S15). If the suction nozzle 161 selected by the operator is not suitable for the part, the effect is displayed on the display unit 4 (step S19). In other words, the operator can verify the suitability of the selected suction nozzle. Therefore, finally, the reliability of the suction nozzles 161 registered in the nozzle matching information D23 is improved.

Also, in the component mounting system 100, the suction nozzle 161 selected by the selection process is registered in the nozzle matching information D23, and the mounting control section 21 executes the component mounting process based on this nozzle matching information D23. Therefore, it is possible to reduce the occurrence of component pick-up errors due to the use of an inappropriate nozzle holder 6 in relation to the component. Further, in this case, when the same type of suction nozzles 161 used for component mounting processing of a specific component are attached to a plurality of mounting heads 160 of the head unit 16, the component mounting processing for the specific component is performed. The mounting head 160 that requires the shortest time is selected (step S43 in the figure). Then, the selected mounting head 160 performs the component mounting process for the specific component. Therefore, according to the component mounting system 100 described above, it is possible to more efficiently perform the component mounting processing by the mounting head 160 while maintaining the stability of the component suction processing by the suction nozzle 161 .

[Modifications, etc.]
The component mounting apparatus 100 described above is an example of a preferred embodiment of the component mounting apparatus according to the present invention, and the specific configuration can be changed as appropriate without departing from the gist of the present invention. For example, the following configurations (1) to (6) and configurations in which the configurations (1) to (6) are combined with each other also belong to the scope of the present invention.

(1) Control as shown in the flowchart of FIG. 10 can also be applied as control of the nozzle selection process. In the control shown in the flowchart of FIG. 10, steps S8a to S8C (processes enclosed by dashed lines) are provided in place of step S9 in FIG. 5, and steps S15 to S21 are omitted. Other than that, the content of the processing in each step is basically the same as in the flowchart of FIG.

In the control shown in the flowchart of FIG. 10, when one suction nozzle 161 is selected from a plurality of candidate suction nozzles 161 (Yes in step S7), the nozzle selection processing unit 22 selects the selected suction nozzle 161 as the default nozzle. It is determined whether or not (step S8a). That is, the nozzle selection processing unit 22 refers to the nozzle matching information D23 and determines whether or not the selected suction nozzle 161 is already registered in the nozzle matching information D23 as the suction nozzle 161 corresponding to the target component. In the case of No in the process of step S8a, a screen requesting review of setting parameter values of the driving system is displayed, that is, a review request of parameter values registered in the control parameter information D24 of the mounting data D2 is displayed. The display control unit 25 controls the display unit 4 so that the screen of is displayed (step S8b). In response to this, when the operator operates the operation unit 5 to perform an operation to change the parameter value or an operation to maintain the default parameter value (Yes in step S8c), the nozzle selection processing unit 22 converts the mounting data D2 is updated (step S11). Specifically, the nozzle selection processing unit 22 rewrites the suction nozzle 161 registered in the nozzle matching information D23 with the suction nozzle 161 selected in step S7, and furthermore, according to the operation content in step S8, the parameter When the value is changed, the parameter value of the control parameter information D24 is rewritten with the changed parameter value.

Note that when it is determined that the suction nozzle 161 selected in the processing of step S7 is the default nozzle (Yes in step S8a), the nozzle selection processing unit 22 skips the processing of steps S8a to S11. The control of the nozzle selection process according to this flowchart ends.

According to the control of the flowchart in FIG. 10, the suction nozzle 161 selected by the operator in the process of step S5 is finally registered in the nozzle matching information D23 as the suction nozzle 161 corresponding to the target component. Therefore, the nozzle selection process is quickly completed because the component suction test as described above is not performed. Moreover, when the selected suction nozzle 161 is different from the default suction nozzle 161, the operator is prompted to review the parameter values registered in the control parameter information D24. If it is possible to increase the moving speed of the head unit 16 or mounting head 160 in combination with the selected suction nozzle 161, the apparatus can be adjusted by changing the parameter values registered in the control parameter information D24. It becomes possible to speed up the component mounting processing by the main body 1 . Therefore, there is an advantage that the component mounting system 100 contributes to an improvement in the productivity of component mounting boards.

(2) In the embodiment, when one suction nozzle 161 is selected from a plurality of candidate suction nozzles 161 (Yes in step S7 of FIG. 5), the nozzle selection processing unit 22 determines that the selected suction nozzle 161 It is determined whether or not there is However, for example, the nozzle selection processing unit 22 may be configured to register the selected suction nozzle 161 as it is in the nozzle matching information D23 as the suction nozzle 161 corresponding to the target component. In this case, step S9 and steps S15 to S21 in FIG. 5 are omitted.

(3) In the embodiment, the component information D21 and the nozzle information D22 of the mounting data D2 are stored in the storage device 23 of the component mounting apparatus 100, but these information D21 and D22 are stored in the management device 110, for example. may In this case, the nozzle selection processing unit 22 is configured to acquire the information D21 and D22 from the management device 110 as necessary. When a production line for component-mounted boards is configured by connecting a plurality of component mounting apparatuses, the management device 110 stores management data DM output from each of the plurality of component mounting apparatuses. configured to In this case, regarding the processing of step S9 in FIG. 5 (that is, the processing of determining whether or not there is a track record of use), the nozzle selection processing unit 22 performs management data management data of other component mounting apparatuses other than the own machine in addition to the management data DM of the own machine. It is configured to take the DM into consideration.

(4) Control of the component mounting process by the mounting control unit 21, specifically, in the process of step S43 in FIG. Among the mounting heads 160, the mounting head 160 that requires the shortest time for component mounting processing is selected. However, the mounting control unit 21, for example, obtains the distance of the movement path required for component mounting processing of each mounting head 160 (head unit 16), and selects the mounting head 160 with the shortest movement distance. good too. Also with this configuration, as in the embodiment, it is possible to more efficiently perform the component mounting process by the mounting head 160 while maintaining the stability of the component suction process by the suction nozzle 161 .

Also, the mounting control unit 21 may be configured to select the suction nozzle 161 having the strongest suction force in the process of step S43. According to this configuration, it is possible to ensure a higher degree of stability of the component suction processing by the suction nozzle 161 . In this case, the suction force is approximately proportional to the size of the nozzle opening 162a. information) is registered in the nozzle information D22, and the mounting control unit 21 refers to the nozzle information D22, whereby the suction nozzle 161 having the largest area of the nozzle opening 162a among the plurality of front mounting heads 160 is selected. The mounted mounting head 160 may be selected.

(5) In the embodiment, the conditions for selecting the suction nozzles 161 by the nozzle selection processing unit 22 (step S3 in FIG. 5) are the first conditions (formulas 1 and 2) and the second condition (formula 3) described above. It is to be satisfied. However, additional conditions may be provided. Further, the second condition of the embodiment stipulates that the ratio of the area of the nozzle opening 162a to the area of the sucked surface S of the component is within a certain range. However, as long as the first condition is satisfied, it is originally desirable that the size (area) of the nozzle opening 162a is as large as possible with respect to the surface S to be attracted. Therefore, the second condition may be a provision that the ratio of the area of the nozzle opening 162a to the area of the sucked surface S of the component is equal to or greater than the threshold. In other words, (Ar1/Ar2)>T2 may be satisfied in (Formula 3) above.

(6) In the component mounting system 100 according to the embodiment, the imaging unit 18 that performs image acquisition processing for acquiring a processing state image regarding the component suction processing by the suction nozzle 161 picks up the component sucked and held by the suction nozzle 161 from below. Although the second imaging section 182 for imaging is provided, a third imaging section for imaging the component sucked and held by the suction nozzle 161 from the side may be further provided. In this case, in the processing of steps S15 and S17 in FIG. 5 (part pick-up test), the first imaging unit 181 and the third imaging unit pick up images of the parts, and the picked-up state of the parts recognized from the images is within the allowable range. You may make it determine whether there exists.

The present invention described above is summarized as follows.

A component mounting apparatus according to one aspect of the present invention includes a suction nozzle that performs a component suction process for sucking a component supplied in a component supply area, and a component mounting device that mounts the component sucked by the suction nozzle on a board. a mounting head that performs processing; a mounting execution unit that includes an imaging unit that performs image acquisition processing for acquiring a processing state image related to the component pick-up processing; a nozzle selection processing unit that performs a selection process of selecting the suction nozzle to be used for the above from among the plurality of suction nozzles, wherein the nozzle selection processing unit determines the size of the nozzle opening of each of the plurality of suction nozzles. and information on the size of the sucked surface of the predetermined component, and based on the information, satisfy selection conditions associated with the size of the nozzle opening and the size of the sucked surface. Then, a suction nozzle that satisfies the selection condition is selected from among the plurality of suction nozzles.

According to this component mounting apparatus, the nozzle selection processing unit acquires information about the size of each suction nozzle opening and information about the size of the suction surface of the predetermined component, and determines the size of the nozzle opening. And, based on whether or not the selection condition associated with the size of the surface to be sucked is satisfied, the suction nozzle to be used for the component mounting process of the predetermined component is selected in relation to the predetermined component. Therefore, the operator does not need to rely on his/her own experience and intuition to select the suction nozzle suitable for the part, and the selection work of the suction nozzle is automated. In addition, variations in the selected suction nozzle depending on the operator are also suppressed.

In the above configuration, more specifically, the selection conditions include a first condition that the entire nozzle opening overlaps the surface to be attracted, and a second condition that the size of the nozzle opening is equal to or larger than a predetermined threshold value. The nozzle selection processing unit determines whether or not the first condition and the second condition are satisfied, and selects a suction nozzle that satisfies both conditions.

According to this configuration, in the selection processing by the nozzle selection processing unit, the suction nozzles having the largest possible suction force, that is, the suction nozzles having the largest possible suction force with respect to the surface of the component to be picked up by the nozzle openings. It becomes possible to select a suction nozzle. Therefore, in relation to the component, it is possible to select a suction nozzle that can more reliably and stably adsorb and hold the component.

In this case, the nozzle selection processing unit uses a state in which the suction nozzle picks up a position shifted by a preset shift amount from a target pickup position on the surface to be picked up of the predetermined part. , it is preferably determined whether or not the first condition is satisfied.

According to this configuration, it is determined whether or not the first condition is satisfied after taking into consideration the amount of displacement of the suction position by the suction nozzle (permissible amount of displacement). Therefore, it is possible to select a highly reliable suction nozzle suitable for the operation of the actual component mounting process by the mounting head.

In the above-described component mounting apparatus, the display unit displays information about the component mounting process, and when there are a plurality of candidate suction nozzles that satisfy the selection conditions, information indicating each of the plurality of candidate suction nozzles is displayed. and a command input unit for receiving a selection command to select one suction nozzle from among the plurality of candidate suction nozzles displayed on the display unit. Further, the nozzle selection processing unit may be configured to select one suction nozzle selected by inputting the selection command from among the plurality of candidate suction nozzles.

According to this configuration, when there are a plurality of candidate suction nozzles that satisfy the selection conditions, information indicating each of the plurality of candidate suction nozzles is displayed on the display unit. The operator can select one suction nozzle from among the plurality of candidate suction nozzles displayed on the display unit via the command input unit. Therefore, the degree of freedom in selecting the suction nozzle is ensured. In this case, since any of the plurality of candidate suction nozzles satisfies the selection conditions, regardless of which suction nozzle is selected, it can be said that the suction nozzle is suitable for the component mounting process of the component in relation to the component. .

In this case, the display control unit further includes a storage unit that stores nozzle matching information recorded in association with the component and the suction nozzle used for component mounting processing of the component, and the display control unit receives the selection command. When the suction nozzle selected by the input is different from the default suction nozzle stored in the storage unit, information is displayed requesting a review of parameter values for driving control of the mounting head in the component mounting process. The configuration may be such that the display unit is controlled as described above.

With this configuration, when the operator selects a suction nozzle different from the default suction nozzle registered in the nozzle matching information, information requesting a review of the parameter values for driving control of the mounting head is displayed. Therefore, it is urged to change the parameter value for drive control to a more preferable value in relation to the selected suction nozzle and the component.

The component mounting apparatus further includes a storage unit that stores nozzle matching information recorded in association with the component and the suction nozzle used for component mounting processing of the component, and the nozzle selection processing unit comprises: , if the suction nozzle selected by the input of the selection command is different from the default suction nozzle recorded in the nozzle matching information, controlling the mounting execution unit to select the suction nozzle in which the component pickup process and the image acquisition process are performed by driving the mounting head based on preset drive control parameter values, and The suitability of the selected suction nozzle is determined based on the result of the component suction test, and the display control unit controls the display unit so as to display information indicating the determination result by the nozzle selection processing unit. may be configured to

According to this configuration, when the operator selects a suction nozzle different from the default suction nozzle registered in the nozzle matching information, the component suction test for actually performing the component suction processing and the image acquisition processing is executed. and the result is displayed on the display. In other words, the operator can verify the suitability of the selected suction nozzle. Therefore, the operator can gain confidence in the selected suction nozzle.

In this case, the nozzle selection processing unit acquires suction level data indicating a suction level of the component by the suction nozzle in the component suction test, and the processing state image regarding the component suction processing, and determines the suction level. The selected suction nozzle is appropriate when at least one of the condition that the component is within the range and the condition that the suction state of the component recognized from the processing state image is within the allowable range is satisfied. It may be configured to determine that.

According to this configuration, it is possible to appropriately determine the suitability of the selected suction nozzle in the component suction test.

In the component mounting apparatus described above, the imaging section is configured to be capable of imaging the nozzle opening by imaging the suction nozzle from the tip side along the axial direction, and the nozzle selection processing section performs the mounting control. By controlling the unit, the imaging unit is caused to capture an image of the nozzle opening of the suction nozzle, and information regarding the size of the nozzle opening is acquired based on the image of the nozzle opening.

According to this configuration, even when the component mounting apparatus does not have information about the size of the nozzle opening in advance, for example, when a new suction nozzle is added, the selection process by the nozzle selection processing section can be performed. can be done. Therefore, the executability of the selection processing by the nozzle selection processing unit is ensured.

In the component mounting apparatus described above, when the imaging unit is defined as a first imaging unit, the mounting execution unit moves together with the mounting head and is capable of imaging a component placed in the component supply area. The nozzle selection processing unit further includes an imaging unit, and the nozzle selection processing unit controls the mounting control unit to cause the second imaging unit to capture an image of the component placed in the component supply area, and based on the image of the component. The configuration may be such that information relating to the size of the surface to be attracted is acquired.

According to this configuration, even when the component mounting apparatus does not have information about the size of the surface to be picked up of the component, for example, when a new component is used, the selection processing by the nozzle selection processing section can be performed. It can be carried out. Therefore, the executability of the selection processing by the nozzle selection processing unit is ensured.

In the above-described component mounting apparatus, the component and the suction nozzle that is the suction nozzle used for component mounting processing of the component and that is selected by the selection processing by the nozzle selection processing unit are recorded in association with each other. a storage unit that stores nozzle matching information; and mounting control that controls the mounting execution unit so that, according to the component, component mounting processing for the component is performed using the suction nozzle recorded in the nozzle matching information. It is preferred to have a part.

According to this configuration, the component mounting process is executed using the suction nozzle recorded in the nozzle matching information according to the component. Therefore, it is possible to reduce errors in component pick-up processing due to the use of an inappropriate pick-up nozzle in relation to the component.

In this case, the component mounting section includes a head unit that includes a plurality of the mounting heads and is movable between the component supply area and the substrate, and the mounting control section, in relation to a specific component, When a plurality of mounting heads having suction nozzles recorded in the nozzle matching information as suction nozzles corresponding to the specific component exist in the head unit, each mounting head required for component mounting processing of the specific component It is preferable that the mounting execution unit is controlled so that the component mounting process for the specific component is performed using a mounting head with the shortest distance of the movement path.

According to this configuration, it is possible to efficiently carry out the component mounting process while maintaining the stability of the component suction process by the suction nozzle.

Further, in the above component mounting apparatus, the component mounting section includes a head unit having a plurality of the mounting heads and movable between the component supply area and the board, and the mounting control section controls a specific component , in the case where the head unit includes a plurality of mounting heads having suction nozzles recorded in the nozzle matching information as suction nozzles corresponding to the specific component, each of the plurality of mounting heads Information on the suction force may be obtained, and the mounting execution unit may be controlled so that the suction nozzle having the strongest suction force is used to perform component mounting processing for the component.

Further, in the above component mounting apparatus, the component mounting section includes a head unit having a plurality of the mounting heads and movable between the component supply area and the board, and the mounting control section controls a specific component , in the case where the head unit includes a plurality of mounting heads having suction nozzles recorded in the nozzle matching information as suction nozzles corresponding to the specific component, each of the plurality of mounting heads Information on the suction force may be acquired, and the mounting execution unit may be controlled so that the suction nozzle having the strongest suction force is used to perform component mounting processing for the component.

According to this configuration, it is possible to perform the component mounting process while maintaining the stability of the component suction process by the suction nozzle at a higher level.

Claims

A mounting head having a suction nozzle for performing a component suction process for picking up a component supplied in a component supply area, and performing a component mounting process for mounting the component sucked by the suction nozzle on a board; and a process related to the component suction process. a mounting execution unit including an imaging unit that performs image acquisition processing for acquiring a state image;
a nozzle selection processing unit that performs a selection process of selecting, from among a plurality of suction nozzles, the suction nozzle to be used for the component mounting process of the predetermined component in relation to the predetermined component;
The nozzle selection processing unit obtains information about the size of each nozzle opening of the plurality of suction nozzles and information about the size of the sucked surface of the predetermined component, and based on the information, determines the size of the nozzle opening. It is determined whether or not a selection condition associated with the size and the size of the surface to be adsorbed is satisfied, and a suction nozzle that satisfies the selection condition is selected from the plurality of suction nozzles. and component mounting equipment.
In the component mounting apparatus according to claim 1,
The selection conditions include a first condition that the entire nozzle opening overlaps the surface to be adsorbed, and a second condition that the size of the nozzle opening is equal to or greater than a predetermined threshold,
The component mounting apparatus, wherein the nozzle selection processing unit determines whether or not the first condition and the second condition are satisfied, and selects a suction nozzle that satisfies both conditions.
In the component mounting apparatus according to claim 2,
The nozzle selection processing unit selects, as a reference, a state in which the suction nozzle sucks a position shifted by a preset shift amount from a target suction position on the surface to be sucked of the predetermined component. A component mounting apparatus that determines whether or not a first condition is satisfied.
In the component mounting apparatus according to any one of claims 1 to 3,
a display unit for displaying information about the component mounting process;
a display control unit configured to control the display unit such that, when there are a plurality of candidate suction nozzles each satisfying the selection condition, information indicating each of the plurality of candidate suction nozzles is displayed;
a command input unit for inputting a selection command to select one suction nozzle from among the plurality of candidate suction nozzles displayed on the display unit;
The component mounting apparatus according to claim 1, wherein the nozzle selection processing unit selects one suction nozzle selected by input of the selection command from among the plurality of candidate suction nozzles.
In the component mounting apparatus according to claim 4,
further comprising a storage unit that stores nozzle matching information recorded in association with the component and the suction nozzle used for component mounting processing of the component;
When the suction nozzle selected by inputting the selection command is different from the predetermined suction nozzle stored in the storage unit, the display control unit controls the driving of the mounting head in the component mounting process. and controlling the display unit so as to display information requesting a review of the parameter value of the component mounting apparatus.
In the component mounting apparatus according to claim 4,
further comprising a storage unit that stores nozzle matching information recorded in association with the component and the suction nozzle used for component mounting processing of the component;
When the suction nozzle selected by inputting the selection command is different from the predetermined suction nozzle recorded in the nozzle matching information, the nozzle selection processing unit controls the mounting execution unit, A component suction test using the selected suction nozzle, in which the component suction processing and the image acquisition processing are performed by driving the mounting head based on preset parameter values for drive control. executing a test, determining suitability of the selected suction nozzle based on the result of the component suction test;
The component mounting apparatus, wherein the display control section controls the display section so as to display information indicating the determination result by the nozzle selection processing section.
In the component mounting apparatus according to claim 6,
The nozzle selection processing unit acquires suction level data indicating a suction level of the component by the suction nozzle in the component suction test and the processing state image regarding the component suction processing, and determines whether the suction level is within a specified range. and the condition that the suction state of the component recognized from the processing state image is within an allowable range, it is determined that the selected suction nozzle is suitable. , A component mounting apparatus characterized by:
The component mounting apparatus according to any one of claims 1 to 7,
The image capturing unit is configured to capture an image of the nozzle opening by capturing an image of the suction nozzle from the tip side along the axial direction thereof,
The nozzle selection processing unit controls the mounting control unit to cause the image capturing unit to capture an image of the nozzle opening of the suction nozzle, and obtains information about the size of the nozzle opening based on the image of the nozzle opening. A component mounting apparatus characterized by:
The component mounting apparatus according to any one of claims 1 to 8,
When the imaging unit is defined as the first imaging unit,
The mounting execution unit further includes a second imaging unit that moves together with the mounting head and is capable of imaging the component placed in the component supply area,
The nozzle selection processing unit controls the mounting control unit to cause the second imaging unit to capture an image of the component placed in the component supply area, and to determine the size of the suction surface based on the image of the component. A component mounting apparatus, characterized in that it acquires information about the degree of mounting.
The component mounting apparatus according to any one of claims 1 to 4,
A storage unit that stores nozzle matching information recorded in association with the component and the suction nozzle that is the suction nozzle used for component mounting processing of the component and that is selected by the selection processing by the nozzle selection processing unit. and,
a mounting control unit that controls the mounting execution unit so that, according to the component, component mounting processing for the component is performed using the suction nozzle recorded in the nozzle matching information. Component mounting equipment.
In the component mounting apparatus according to claim 10,
the component mounting unit includes a head unit that includes a plurality of the mounting heads and is movable between the component supply area and the substrate;
In relation to a specific component, the mounting control unit controls the head unit to include a plurality of mounting heads having suction nozzles recorded in the nozzle matching information as suction nozzles corresponding to the specific component. finds the distance of the movement path of each mounting head in the component mounting process of the specific component, and performs the component mounting process of the specific component using the mounting head with the shortest distance of the movement path. A component mounting apparatus that controls an execution unit.
In the component mounting apparatus according to claim 10,
the component mounting unit includes a head unit that includes a plurality of the mounting heads and is movable between the component supply area and the substrate;
In relation to a specific component, the mounting control unit controls the head unit to include a plurality of mounting heads having suction nozzles recorded in the nozzle matching information as suction nozzles corresponding to the specific component. obtains the processing time of each mounting head required for component mounting processing of the specific component, and causes the mounting execution unit to perform the component mounting processing of the specific component using the mounting head with the shortest processing time. A component mounting apparatus characterized by:
In the component mounting apparatus according to claim 10,
the component mounting unit includes a head unit that includes a plurality of the mounting heads and is movable between the component supply area and the substrate;
In relation to a specific component, the mounting control unit controls the head unit to include a plurality of mounting heads having suction nozzles recorded in the nozzle matching information as suction nozzles corresponding to the specific component. obtaining information on the suction force of each of the plurality of mounting heads, and controlling the mounting execution unit so that the suction nozzle having the strongest suction force is used to perform component mounting processing for the component; A component mounting device characterized by: