JP2019054027A - Position specification method and position specification device and component mounting device - Google Patents

Abstract

To provide a position specification method and a position specification device and a component mounting device capable of appropriately specifying the position for mounting a component on a board where multiple electrodes are formed.SOLUTION: A component mounting device includes a storage section for storing a reference graphic 33 becoming a reference, multiple specific graphics 34(1)-34(4) including at least one of multiple specific patterns 11c(1)-11c(4), and relative physical relationship of multiple search frames 35(1)-35(4) where the specific graphics 34(1)-34(4) exist and the reference graphic 33, imaging means for obtaining an image by imaging the individual substrate 11a, a reference graphic detector for detecting the reference graphic 33 from an image, a specific graphic detector for detecting multiple specific graphics 34(1)-34(4) in an image from relative physical relationship of the detected reference graphic 33 and relative physical relationship to be stored, and a mounting position calculation section for calculating the mounting position P of the component on the individual substrate 11a on the basis of the detected positions of the multiple specific graphics 34(1)-34(4).SELECTED DRAWING: Figure 4

Description

  The present invention relates to a position specifying method and a position specifying apparatus for specifying a mounting position in a mounting area in which a plurality of patterns are formed, and a component mounting apparatus for mounting a component on a substrate on which a plurality of electrodes are formed.

  A component mounting apparatus is known in which a plurality of bumps formed on a component are aligned and joined to a plurality of electrodes (patterns) formed on a substrate (for example, Patent Document 1). In the component mounting apparatus described in Patent Document 1, a reference mark formed in the vicinity of an electrode on a substrate is imaged with a camera to recognize the mounting position of the component, and the bump of the component is aligned with the electrode of the substrate. In the prior art including Patent Document 1, when the relative positional relationship between the reference mark formed on the substrate and the plurality of electrodes varies due to the material of the substrate, the manufacturing accuracy, etc., the component is placed on the substrate based on the reference mark. When mounted on the board, the bumps of the component may be shifted from the electrodes of the board. For this reason, the mounting position may be specified from the position of a specific plurality of electrodes instead of the reference mark.

JP, 2015-109321, A

  However, since the shape of the plurality of electrodes is the same or similar, and there are many adjacent regions, not only a specific electrode but also a plurality of electrodes having the same or similar shape are mixed in the image captured by the camera To do. For this reason, there is a problem in that the position of another electrode instead of a specific electrode is erroneously detected, and as a result, the wrong mounting position is recognized.

  Accordingly, an object of the present invention is to provide a position specifying method, a position specifying apparatus, and a component mounting apparatus that can specify a position at which a component is mounted on a substrate on which a plurality of identical or similar electrodes are formed by using a specific electrode. And

  The position specifying method of the present invention is a position specifying method for specifying a mounting position in a mounting area in which a plurality of patterns having the same or similar shape is formed, and a reference figure registration step for registering a reference figure as a reference; A specific figure registration step for registering a plurality of specific figures used for specifying the mounting position, including at least one of a plurality of specific patterns included in the plurality of patterns, and an area where the specific figure exists. A relative position registration step of registering a relative positional relationship between a plurality of regions not including a pattern similar to the specific pattern and the reference graphic, and imaging a region including the plurality of the specific graphic and the reference graphic. An imaging step for obtaining an image, a reference graphic detection step for detecting the reference graphic from the image, a reference graphic detected in the reference graphic detection step, and the relative position registration process The specific figure detection step of detecting a plurality of specific figures in the image from the relative positional relationship registered in the above, and the mounting position based on the positions of the plurality of specific figures detected in the specific figure detection step And a mounting position calculating step for calculating.

  The position specifying device of the present invention is a position specifying device for specifying a mounting position of a mounting region in which a plurality of patterns having the same or similar shape is formed, and includes a reference figure as a reference and the plurality of patterns. A plurality of specific figures including at least one of the plurality of specific patterns used for specifying the mounting position, and a plurality of areas in which the specific figure exists and does not include a pattern similar to the specific pattern A storage unit for storing a relative positional relationship with the reference graphic; a plurality of the specific graphic and an imaging unit that captures an image including an area including the reference graphic; and detecting the reference graphic from the image Specific figure detection for detecting a plurality of specific figures in the image from a reference figure detected by the reference figure detection part, a reference figure detected by the reference figure detection part, and a relative positional relationship stored in the storage part If, on the basis of the positions of a plurality of specific shapes in which the specific graphic detecting section detects, and a mounting position calculating unit for calculating the mounting position.

  A component mounting apparatus according to the present invention is a component mounting apparatus that mounts a component on a substrate on which a plurality of electrodes are formed, and includes at least one of a reference figure serving as a reference and a plurality of specific patterns included in the plurality of electrodes. A storage unit that stores a plurality of specific figures including the plurality of specific figures, a plurality of areas including the specific figures that do not include an electrode similar to the specific pattern, and the reference graphic Imaging means for capturing an image by imaging the substrate, a reference graphic detection unit for detecting the reference graphic from the image, a reference graphic detected by the reference graphic detection unit, and a relative information stored in the storage unit Based on the positional relationship, a mounting position of the component on the board is calculated based on a specific graphic detecting unit that detects a plurality of specific graphic in the image and the positions of the specific graphic detected by the specific graphic detecting unit. And a instrumentation position calculating unit.

  According to the present invention, a position where a component is mounted on a substrate on which a plurality of the same or similar electrodes are formed can be specified from the position of a specific electrode.

Structure explanatory drawing of the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of an example of the board | substrate with which components are mounted by the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the reference | standard figure detected by the component mounting apparatus of one embodiment of this invention, and a specific figure (A) Explanatory drawing of a standard graphic template used in the component mounting apparatus of an embodiment of the present invention (b) (c) (d) (e) Explanatory drawing of a specific graphic template Explanatory drawing of the 2nd Example of the reference | standard figure detected by the component mounting apparatus of one embodiment of this invention Explanatory drawing of the 3rd Example of the reference | standard figure detected by the component mounting apparatus of one embodiment of this invention

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configuration, shape, and the like described below are illustrative examples, and can be appropriately changed according to the specifications of the component mounting apparatus. Below, the same code | symbol is attached | subjected to the element which respond | corresponds in all the drawings, and the overlapping description is abbreviate | omitted. In FIG. 1 and a part to be described later, as a biaxial direction orthogonal to each other in a horizontal plane, an X direction (vertical direction in FIG. 4) in the substrate transport direction and a Y direction (horizontal direction in FIG. 1) orthogonal to the substrate transport direction. Is shown. In FIG. 1 and a part to be described later, the Z direction (vertical direction in FIG. 1) is shown as the height direction orthogonal to the horizontal plane. The Z direction is a vertical direction or an orthogonal direction when the component mounting apparatus is installed on a horizontal plane.

  First, the overall configuration of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 has a function of mounting a component such as a semiconductor chip on a substrate. In FIG. 1, a component supply stage 3 and a substrate holding stage 4 are arranged on the base 2 in the Y direction. In addition, the component mounting apparatus 1 includes a control unit 5 that controls each unit.

  The component supply stage 3 is configured by providing a component supply unit 7 above the component supply unit moving unit 6. The component supply unit moving unit 6 is controlled by the control unit 5 and moves the component supply unit 7 in the X direction and the Y direction. A plurality of components 8 are held on the upper portion of the component supply unit 7. The component 8 is held on the upper part of the component supply unit 7 in a state of being placed on the tray or being stuck on the adhesive sheet.

  The substrate holding stage 4 is configured by providing a substrate holding unit 10 above the substrate holding unit moving unit 9. The substrate holding unit moving unit 9 is controlled by the control unit 5 and moves the substrate holding unit 10 in the X direction and the Y direction. The substrate holding unit 10 includes a pair of transport rails 10 a controlled by the control unit 5. The board holding unit 10 carries the board 11 by the transport rail 10a and positions and holds it at a position where the component 8 is mounted. Moreover, the board | substrate holding | maintenance part 10 carries out the board | substrate 11 with which the component 8 was mounted by the conveyance rail 10a.

  Here, with reference to FIG. 2, the structure of the component 8 and the board | substrate 11 is demonstrated. The substrate 11 is composed of a plurality (four in this case) of individual substrates 11a. The substrate 11 is formed with a plurality of slits 11b for separating the individual substrates 11a. The board 11 on which the component 8 is mounted is separated into individual boards 11a along the slits 11b. A plurality of electrodes 11c having the same or similar shape are formed on the upper surface of the individual substrate 11a. As shown in FIG. 4, some of the plurality of electrodes 11c have specific patterns 11c (1), 11c (2), 11c (3) for calculating the mounting position P of the component 8 on the individual substrate 11a. ), 11c (4).

  A substrate mark 12 for position recognition having a shape different from any of the plurality of electrodes 11c is formed on the upper surface of the individual substrate 11a. In this example, two substrate marks 12 having different shapes are formed at diagonal positions of the individual substrate 11a. On one surface of the component 8, bumps 8a to be joined to the electrodes 11c of the individual substrate 11a are formed. The component 8 is mounted on the substrate 11 such that the bumps 8a face downward and the bumps 8a overlap the electrodes 11c of the individual substrate 11a. That is, the individual substrate 11a is a mounting region in which a plurality of electrodes 11c (pattern) having the same or similar shape on which the component 8 is mounted are formed.

  In FIG. 1, the component 8 is held on the component supply unit 7 with the bump 8 a facing upward. A pickup head 13 is installed above the component supply stage 3. The pickup head 13 has a function of sucking and taking out the component 8 on the component supply unit 7. The pickup head 13 is rotated about the X axis as a rotation axis by the pickup head driving unit 14 controlled by the control unit 5 (arrow a). Further, the pickup head 13 moves to a delivery position described later (arrow b). That is, the pickup head 13 holds the component 8 at the delivery position so that the bumps 8a face downward.

  A bonding head 15 is installed above the pickup head 13 and the substrate holding stage 4. The bonding head 15 is moved in the Y direction by the bonding head driving unit 16 controlled by the control unit 5 (arrow c, arrow d). The bonding head 15 and the bonding head drive unit 16 attract and receive the component 8 from the pickup head 13 at the delivery position, move the component 8 to the mounting position of the substrate 11 held by the substrate holding unit 10, and move the component 8 to the substrate 11. It has a function to be implemented.

  In FIG. 1, the component mounting apparatus 1 is provided with a first camera 17, a second camera 18, and a third camera 19. The first camera 17 is installed above the component supply unit 7 with the optical axis direction facing downward. The first camera 17 images the component 8 of the component supply unit 7. The second camera 18 is installed in a state where the bonding head 15 moves from the delivery position to the substrate 11 (between arrows c and d) with the optical axis direction facing upward. The second camera 18 images the component 8 held by the bonding head 15 from below.

  The third camera 19 is installed above the substrate holding unit 10 that holds the substrate 11 with the optical axis direction directed downward. The third camera 19 images the board 11 (individual board 11a) on which the component 8 is mounted. The first camera 17, the second camera 18, and the third camera 19 are controlled by the control unit 5, and the imaging result is transferred to the control unit 5.

  In FIG. 1, the component mounting apparatus 1 includes a touch panel 20 connected to the control unit 5. The touch panel 20 can perform data input to the control unit 5 and operation of the component mounting apparatus 1 with operation buttons displayed on the display unit. The touch panel 20 can display various information and various images captured by the first camera 17, the second camera 18, and the third camera 19 on the display unit.

  Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. The control unit 5 included in the component mounting apparatus 1 includes a component supply unit control unit 21, a substrate holding unit control unit 22, a pickup head control unit 23, a bonding head control unit 24, a supply component recognition unit 25, a holding component recognition unit 26, and a substrate. A recognition unit 27, a storage unit 31, and a registration work unit 32 are provided.

  The component supply unit control unit 21 controls the component supply unit moving unit 6 to move the mounting target component 8 held by the component supply unit 7 to a pickup position where it is picked up by the pickup head 13. The supply component recognition unit 25 controls the first camera 17 to image the component 8 moved to the pickup position and recognize the position of the component 8. The component supply unit control unit 21 corrects the position of the component 8 at the pickup position based on the recognition result of the supply component recognition unit 25.

  In FIG. 3, the pickup head control unit 23 controls the pickup head 13 and the pickup head driving unit 14, picks up and picks up the component 8 supplied to the pickup position by the pickup head 13, and removes the sucked component 8. Invert both sides and move to the delivery position. The bonding head control unit 24 controls the bonding head 15 and the bonding head driving unit 16 so that the component 8 moved to the delivery position is sucked and received by the bonding head 15, and the mounting position of the substrate 11 held by the substrate holding unit 10 is received. Mounted at P (position where the component 8 is mounted).

  The holding component recognition unit 26 controls the second camera 18 to image the component 8 held by the bonding head 15 from below and recognize the position of the component 8. The substrate holding unit control unit 22 controls the substrate holding unit moving unit 9 so that the mounting position P of the individual substrate 11a on which the component 8 is mounted coincides with the center position of the component 8 held by the bonding head 15. The substrate 11 is moved. In that case, the board | substrate holding | maintenance part control part 22 correct | amends the position of the board | substrate 11 based on the position of the component 8 recognized by the holding | maintenance component recognition part 26, and the mounting position P specified by the board | substrate recognition part 27 mentioned later. .

  In FIG. 3, the board recognition unit 27 controls the third camera 19 to image the board 11 (individual board 11 a) moved to the position where the component 8 is mounted, and recognizes the obtained board image. A mounting position specifying process for specifying the mounting position P is executed. That is, the third camera 19 and the board recognition unit 27 are image pickup means for picking up an image of the board 11 and obtaining a board image. The board recognition unit 27 includes a reference graphic detection unit 28, a specific graphic detection unit 29, and a mounting position calculation unit 30.

  The reference graphic detection unit 28 executes a reference graphic detection process for detecting a reference graphic 33 (see FIG. 4) including the board mark 12 included in the board image acquired by the third camera 19. The specific figure detection unit 29 includes specific figures 34 (1), 11c (1), 11c (2), 11c (3), 11c (4) including specific patterns 11c (1), 11c (2), 11c (4) included in the board image acquired by the third camera 19. Specific figure detection processing for detecting 34 (2), 34 (3), 34 (4) (see FIG. 4) is executed. Pattern matching using a template image is applied to the reference graphic detection process and the specific graphic detection process.

  In FIG. 3, the storage unit 31 includes a reference graphic template storage unit 31a that stores a reference graphic template used in the reference graphic detection process, and a specific graphic template storage unit 31b that stores a specific graphic template used in the specific graphic detection process. Similarly, a search frame information storage unit 31c that stores information (search frame information) related to the search frame used in the specific figure detection process is included.

  FIG. 5A shows a reference graphic template 33T. The reference graphic template 33T is created by cutting out the reference graphic 33 in a region indicated by a broken line surrounding the substrate mark 12 from the substrate image shown in FIG. The reference graphic 33 is a unique graphic that matches the reference graphic template 33T in the board image. In this embodiment, a region including the substrate mark 12 that exists only in the substrate image is used as the reference graphic 33, and the same image as the reference graphic 33 is stored as the reference graphic template 33T in the reference graphic template storage unit 31a.

  5B to 5E are specific graphic templates 34T (1), 34T (2), 34T (3), and 34T (4). The specific graphic templates 34T (1), 34T (2), 34T (3), and 34T (4) are generated from the substrate image shown in FIG. 4 with specific patterns 11c (1), 11c (2), 11c (3), and 11c ( It is created by cutting out the image of the area indicated by the broken line surrounding 4). Since there are four specific patterns in the present embodiment, four specific graphic templates 34T (1), 34T (2), 34T (3), and 34T (4) for detecting these are specified graphic template storage units. It is stored in 31b.

  Furthermore, in the present embodiment, the specific graphic templates 34T (1), 34T (2), 34T (3), and 34T (4) have specific patterns 11c (1) and 11c (2) whose centers are included in these. , 11c (3), 11c (4) coincides with the center. As a result, the centers 34c (1), 34c (2), 34c (3), 34c () of the specific figures 34 (1), 34 (2), 34 (3), 34 (4) detected by the specific figure detection processing are obtained. 4) is the center of the specific patterns 11c (1), 11c (2), 11c (3), and 11c (4).

  In FIG. 3, the search frame information storage unit 31 c is a search frame that indicates the position of the search frame that defines the search range when detecting the specific figure 34 (1), 34 (2), 34 (3), 34 (4). Search frame information including a position and a search frame size which is the size of the search frame is stored. In the board image, there are a plurality of figures that match or are similar to the specific figure templates 34T (1), 34T (2), 34T (3), and 34T (4). Therefore, if pattern matching is performed on the entire region of the substrate image, it is difficult to accurately detect the positions of the specific figures 34 (1), 34 (2), 34 (3), 34 (4).

  Therefore, the search range for pattern matching is an area where the specific figures 34 (1), 34 (2), 34 (3), 34 (4) exist, and the specific patterns 11c (1), 11c (2), 11c. It is necessary to limit to a region not including a pattern similar to (3) and 11c (4). As shown by a two-dot chain line in FIG. 4, four search frames 35 (1), 35 (2), 35 (3), and 35 (4) are set in the present embodiment.

  In FIG. 4, the search frame position corresponds to the reference graphic template 33T, that is, the center 33c of the reference graphic 33 and the search frame upper left corner 35c (1), 35c (2), 35c (3), 35c (4). It is the information which shows the relative positional relationship of. In the present embodiment, the above-described relative positional relationship is defined by coordinates having the center 33c of the reference graphic 33 as the origin, the position of the search frame 35 (1) is (X3, Y1), and the search frame 35 (2). Is (X1, Y2), the search frame 35 (3) is (X2, Y1), and the search frame 35 (4) is (X1, Y3).

  In FIG. 4, the search frame size is information including the vertical and horizontal sizes of a rectangular search frame, and the search range by pattern matching is specified as specific patterns 11c (1), 11c (2), 11c (3), 11c (4). The size is limited to an area that does not include patterns similar to the specific patterns 11c (1), 11c (2), 11c (3), and 11c (4). As a result, the position matching the specific graphic template 34T (1), 34T (2), 34T (3), 34T (4) in the search frame is limited to one place. In the present embodiment, the vertical and horizontal sizes of the search frame 35 (1) are h1, w1, the search frame 35 (2) is h2, w2, the search frame 35 (3) is h3, w3, and the search frame 35 (4) is h4 and w4.

  In FIG. 3, the mounting position calculation unit 30 includes centers 34 c (1) and 34 c of a plurality of specific figures 34 (1), 34 (2), 34 (3), and 34 (4) detected by the specific figure detection unit 29. Based on the positions of (2), 34c (3), and 34c (4), the mounting position P of the component 8 in the mounting area (individual substrate 11a) of the substrate 11 is calculated. In the present embodiment, the mounting position P is calculated in the following manner.

  In FIG. 4, first, the mounting position calculation unit 30 includes a straight line A connecting the center 34c (1) of the specific figure 34 (1) detected by the specific figure detection unit 29 and the center 34c (3) of the specific figure 34 (3). And the intersection C where the straight line B connecting the center 34c (2) of the specific figure 34 (2) and the center 34c (4) of the specific figure 34 (4) intersects is calculated. The storage unit 31 stores an offset amount (ΔXc, ΔYc) from the intersection C to the mounting position P in an ideal state in which there is no relative deviation between the plurality of electrodes 11c formed on the individual substrate 11a. .

  Next, the mounting position calculation unit 30 calculates the mounting position P of the component 8 on the individual substrate 11 a based on the calculated intersection C and the offset amount (ΔXc, ΔYc) stored in the storage unit 31. That is, the mounting position calculation unit 30 mounts the substrate 11 based on the positions of the plurality of specific figures 34 (1), 34 (2), 34 (3), and 34 (4) detected by the specific figure detection unit 29. The mounting position P of the component 8 in the region (individual substrate 11a) is calculated.

  In FIG. 3, the registration work unit 32 includes a reference graphic template 33T, specific graphic templates 34T (1), 34T (2), a reference graphic template storage unit 31a, a specific graphic template storage unit 31b, and a search frame information storage unit 31c. Registration work for registering 34T (3), 34T (4) and search frame information is guided to the operator.

  Next, the registration work by the registration work unit 32 will be described with reference to FIGS. First, the operator sets the board 11 on which the component 8 is not mounted on the board holding unit 10. Next, the operator operates the touch panel 20 to activate the registration work unit 32 and performs the registration work according to the guidance displayed on the touch panel 20.

  The registration work unit 32 displays the board image of the individual board 11 a captured by the third camera 19 on the touch panel 20. The operator selects an area to be registered as the reference graphic 33 from the substrate image displayed on the touch panel 20 and touches a registration button displayed on the touch panel 20. Thereby, the registration work unit 32 stores the region selected by the worker as the reference graphic 33 in the reference graphic template storage unit 31a as the reference graphic template 33T (reference graphic registration step). In the present embodiment, the area inside the broken line surrounding the substrate mark 12 in FIG. 4 is selected as the reference graphic 33 and registered as the reference graphic template 33T.

  Next, the operator selects one area to be registered as the specific figure 34 from the substrate image displayed on the touch panel 20 and touches the registration button displayed on the touch panel 20. For example, when the operator registers an area including the specific pattern 11c (1) as the specific figure 34 (1), the specific pattern 11c (1) and the electrode 11c adjacent to the specific pattern 11c (1) as shown by a two-dot chain line in FIG. A region that includes a part of is selected. Next, the worker touches the registration button displayed on the touch panel 20.

  Thus, the registration work unit 32 stores the area selected by the worker as the specific figure 34 (1) in the specific figure template storage unit 31b as the specific figure template 34T (1) (specific figure registration step). Further, the registration working unit 32 sets the search frame 35 (1) of the size set by default with the center 34c (1) of the specific figure 34 (1) as a reference and uses the center of the reference figure 33 as a reference. In this case, the coordinates (X3, Y1) of the search frame 35 (1) are stored in the search frame information storage unit 31c as the search frame position (relative position registration step). The size and position of the search frame can be corrected by the operator on the touch panel 20.

  When the operator finishes the registration of the first specific figure 34 (1) and the search frame 35 (1), the other specific figure 34 (2), 34 (3), 34 (4) is the same. The registration work for the search frames 35 (2), 35 (3), and 35 (4) is performed.

  Next, a mounting operation by the component mounting apparatus 1 will be described with reference to FIG. The component supply unit moving unit 6 moves the component 8 of the component supply unit 7 within the imaging field of view of the first camera 17. The supply component recognition unit 25 recognizes the position of the component 8 imaged by the first camera 17 and obtains a positional deviation from the pickup position by the pickup head 13. The component supply unit moving unit 6 corrects this positional shift and moves the component 8 to the pickup position.

  Next, the pickup head 13 picks up the component 8. after that. The pickup head drive unit 14 reverses the pickup head 13 holding the component 8 upside down and moves it to the delivery position (see the pickup head 13 indicated by a broken line in FIG. 1). Next, the bonding head 15 is turned upside down, receives and holds the component 8 from the pickup head 13, and positions the component 8 within the imaging field of view of the second camera 18. In this state, the holding component recognition unit 26 recognizes the component 8 imaged by the second camera 18 and detects the center position (component recognition).

  In parallel with the transfer of the component 8 from the component supply unit 7 to the second camera 18, the substrate holding unit moving unit 9 is held by the substrate holding unit 10 within the imaging field of view of the third camera 19. Eleven individual substrates 11a (mounting area) are moved. The third camera 19 captures the individual substrate 11a and obtains a substrate image (imaging process). The board recognition unit 27 recognizes this board image and specifies the position of the mounting position P (mounting position recognition). This mounting position recognition will be described later.

  Next, the control unit 5 drives the bonding head driving unit 16 and the substrate holding unit moving unit 9 based on the position of the component 8 obtained by the component recognition and the mounting position P obtained by the mounting position recognition, so that the mounting position P is reached. The individual substrate 11a (mounting area) of the substrate 11 is positioned. Thereafter, the bonding head 15 is lowered and the component 8 is mounted at the mounting position P.

  Next, mounting position recognition will be described. The reference graphic detection unit 28 detects the reference graphic 33 from the board image (reference graphic detection step). Specifically, pattern matching is executed with the reference graphic template 33T, and a position that most closely matches the reference graphic template 33T in the board image is detected as the reference graphic 33.

  After recognizing the reference graphic 33, the specific graphic detecting unit 29 determines whether the specific graphic template 34T stored in the search frame information storage unit 31c and the specific graphic template 34T stored in the specific graphic template storage unit 31b. The specific figure 34 is detected (specific figure detection step).

  The specific figure 34 (3) will be described as an example. The specific figure detection unit 29 reads the search frame position (X2, Y1) from the search frame information storage unit 31c, and searches based on the center 33c of the detected reference figure 33. A frame 35 (3) is set. Next, the specific graphic detection unit 29 detects the specific graphic 34 (3) by executing pattern matching using the specific graphic template 34T (3) within the search frame 35 (3). In the present embodiment, the center of the detected specific figure 34 (3) coincides with the center of the specific pattern 11c (3).

  If all the specific figures 34 (1), 34 (2), 34 (3), and 34 (4) are detected in the specific figure detection process, then the mounting position calculation unit 30 is detected in the specific figure detection process. Based on the positions of the specific figures 34 (1), 34 (2), 34 (3), and 34 (4), the mounting position P is calculated as described above (mounting position calculation step).

  As described above, the position specifying method of the present embodiment includes the reference graphic registration process, the specific graphic registration process, the relative position registration process, the imaging process, the reference graphic detection process, the specific graphic detection process, and the mounting position. A mounting position P of the mounting region (individual substrate 11a) in which a plurality of patterns (electrodes 11c) having the same or similar shape are formed is specified including the calculation step. As a result, the mounting position P is calculated from the positions of the plurality of specific figures 34 (1), 34 (2), 34 (3), 34 (4). Even if the relative positional relationship of 34 is distorted (for example, even if the substrate 11 is warped), it is possible to appropriately specify the mounting position P in the mounting region where a plurality of patterns are formed.

  As described above, the position specifying device according to the present embodiment has the reference figure 33 serving as a reference and the plurality of specific patterns 11c (1), 11c (2), 11c (included in the plurality of patterns (electrodes 11c)). 3), 11c (4), and a plurality of specific figures 34 (1), 34 (2), 34 (3), 34 used for specifying the mounting position P of the mounting area (individual substrate 11a). (4) and a storage unit that stores the relative positional relationship (search frame information) between the reference graphic 33 and the plurality of specific graphics 34 (1), 34 (2), 34 (3), 34 (4) 31 is provided.

  Further, the position specifying device picks up an image (substrate image) by picking up an area including the plurality of specific figures 34 (1), 34 (2), 34 (3), 34 (4) and the reference figure 33. The third camera 19, the board recognition unit 27), the reference graphic detection unit 28 that detects the reference graphic 33 from the image, the detected reference graphic 33, and the specified relative position relationship in the image The mounting position P is calculated based on the specific graphic detecting unit 29 that detects the graphic 34 and the positions of the detected specific graphic 34 (1), 34 (2), 34 (3), 34 (4). A mounting position calculation unit 30, and specifies a mounting position P in a mounting area where a plurality of patterns having the same or similar shape are formed.

  Thereby, the mounting position P for mounting the component 8 on the mounting region (individual substrate 11a) of the substrate 11 on which the plurality of patterns (electrodes 11c) are formed can be appropriately specified.

  Next, a second example of the reference graphic will be described with reference to FIG. Nine individual substrates 40a are formed on the substrate 40 shown in FIG. A plurality of slits 40b are formed between the individual substrates 40a. In addition, a plurality of electrodes 40c are formed on the individual substrate 40a similarly to the individual substrate 11a shown in FIG. However, the substrate mark 12 formed on the individual substrate 11a shown in FIG. 4 is not formed on the individual substrate 40a.

  In the second embodiment, the leftmost electrode 40c among the plurality of electrodes 40c formed on the upper side of the individual substrate 40a and one of the plurality of electrodes 40c formed on the left side. A reference graphic template having a reference graphic 41 as a region including the two electrodes 40c of the uppermost electrode 40c is stored in the reference graphic template storage unit 31a. That is, the reference graphic 41 includes at least two of the plurality of electrodes 40c (pattern). Since the reference figure 41 is a unique figure in the individual board 40a (mounting area), the mounting position P of the component 8 on the individual board 40a is specified even without the board mark 12 having a shape different from that of the electrode 40c. Can do.

  Next, a third example of the reference graphic will be described with reference to FIG. The substrate 40 shown in FIG. 7 is the same as FIG. In the third embodiment, a reference graphic template having an area including the upper left corner of the individual substrate 40a as a reference graphic 42 is stored in the reference graphic template storage unit 31a. That is, the reference graphic 42 includes the outer periphery of the substrate 40 (a mounting region where a plurality of patterns are formed) on which a plurality of electrodes 40c are formed. Since the reference graphic 42 is a unique graphic in the individual board 40a (mounting area), the mounting position P of the component 8 on the individual board 40a can be specified without the board mark 12. A unique figure including the slit 40b formed in the substrate 40 may be used as the reference figure.

  The above is an example in which the mounting position P of the mounting region (individual substrate 11a, individual substrate 40a) of the substrate 11 (substrate 40) is specified by the position specifying device (component mounting device 1). The position is not limited to this. For example, the specified position may be the position (center) of the component 8 held by the bonding head 15. In this case, a plurality of patterns having the same or similar shape are bumps 8 a formed on the component 8, and the imaging means is the second camera 18 and the supply component recognition unit 25. The supply component recognition unit 25 includes a reference graphic detection unit 28, a specific graphic detection unit 29, and a mounting position calculation unit 30.

  The position specifying method, position specifying apparatus, and component mounting apparatus according to the present invention have an effect that a position where a component is mounted on a substrate on which a plurality of the same or similar electrodes are formed can be specified from the position of the specific electrode. However, it is useful in the field of mounting components on a substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 8 Components 11, 40 Board | substrate 11a, 40a Individual board | substrate (mounting area | region)
11c, 40c Electrode (pattern)
11c (1) to 11c (4) Specific pattern 12 Substrate mark (reference pattern)
19 Third camera (imaging means)
33, 41, 42 Reference figure 34 (1) to 34 (4) Specific figure P Mounting position

Claims (14)

A position specifying method for specifying a mounting position of a mounting area in which a plurality of patterns having the same or similar shape are formed,
A reference graphic registration process for registering a reference graphic as a reference;
A specific figure registration step for registering a plurality of specific figures used for specifying the mounting position, including at least one of a plurality of specific patterns included in the plurality of patterns;
A relative position registration step of registering a relative positional relationship between a plurality of areas that do not include a pattern similar to the specific pattern and an area where the specific figure exists, and the reference figure;
An imaging step of obtaining an image by imaging a region including a plurality of the specific figure and the reference figure;
A reference graphic detection step of detecting the reference graphic from the image;
A specific graphic detecting step for detecting a plurality of specific graphic in the image from the reference graphic detected in the reference graphic detecting step and the relative positional relationship registered in the relative position registering step;
A mounting position calculating step of calculating the mounting position based on the positions of a plurality of specific figures detected in the specific figure detecting step.   The position specifying method according to claim 1, wherein the reference graphic is a reference pattern having a shape different from any of the plurality of patterns.   The position specifying method according to claim 1, wherein the reference graphic includes at least two of the plurality of patterns.   The position specifying method according to claim 1, wherein the reference graphic includes an outer periphery of a mounting area in which the plurality of patterns are formed. The plurality of patterns are a plurality of electrodes formed on a substrate on which a component is mounted,
The position specifying method according to claim 1, wherein the mounting position is a position where the component is mounted. A position specifying device for specifying a mounting position of a mounting area in which a plurality of patterns having the same or similar shape are formed,
A reference figure that serves as a reference, a plurality of specific figures that include at least one of a plurality of specific patterns included in the plurality of patterns, and are used for specifying the mounting position, and an area where the specific figure exists, A storage unit that stores a plurality of regions that do not include a pattern similar to the specific pattern and a relative positional relationship between the reference graphic, and
Imaging means for obtaining an image by imaging a region including a plurality of the specific figure and the reference figure;
A reference graphic detector for detecting the reference graphic from the image;
A reference graphic detected by the reference graphic detection unit, and a specific graphic detection unit that detects a plurality of specific graphic in the image from a relative positional relationship stored in the storage unit;
And a mounting position calculation unit that calculates the mounting position based on the positions of a plurality of specific figures detected by the specific figure detection unit.   The position specifying device according to claim 6, wherein the reference graphic is a reference pattern having a shape different from any of the plurality of patterns.   The position specifying device according to claim 6, wherein the reference graphic includes at least two of the plurality of patterns.   The position specifying device according to claim 6, wherein the reference graphic includes an outer periphery of a mounting area where the plurality of patterns are formed. The plurality of patterns are a plurality of electrodes formed on a substrate on which a component is mounted,
The position specifying device according to claim 6, wherein the mounting position is a position where the component is mounted. A component mounting apparatus for mounting a component on a substrate on which a plurality of electrodes are formed,
A reference figure as a reference, a plurality of specific figures including at least one of a plurality of specific patterns included in the plurality of electrodes, and an area where the specific figure exists and does not include an electrode similar to the specific pattern A storage unit that stores a relative positional relationship between a plurality of regions and the reference graphic;
Imaging means for imaging the substrate to obtain an image;
A reference graphic detector for detecting the reference graphic from the image;
A reference graphic detected by the reference graphic detection unit, and a specific graphic detection unit that detects a plurality of specific graphic in the image from a relative positional relationship stored in the storage unit;
A component mounting apparatus comprising: a mounting position calculation unit that calculates a mounting position of the component on the substrate based on the positions of a plurality of specific graphics detected by the specific graphic detection unit.   The component mounting apparatus according to claim 11, wherein the reference graphic is a reference pattern having a shape different from any of the plurality of electrodes.   The component mounting apparatus according to claim 11, wherein the reference graphic includes at least two of the plurality of electrodes.   The component mounting apparatus according to claim 11, wherein the reference graphic includes an outer periphery of the substrate on which the plurality of electrodes are formed.

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