JP3818000B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for mounting electronic components on a substrate.
[0002]
[Prior art]
In an electronic component mounting apparatus for mounting an electronic component on a substrate, the electronic component stored in the supply unit is picked up by a transfer head having a suction nozzle, transferred onto the substrate, and mounted at a predetermined mounting point. A method of using a tray is widely used as one of storage forms of electronic components in the supply unit. In this method, a relatively large electronic component such as QFP is stored in a tray-like container in a planar manner. When picking up electronic components, the trays are pulled out one by one from a plurality of stacked trays. Then, the electronic components on the drawn tray are sucked and picked up. After the pickup, the transfer head rises to a predetermined conveyance height and moves onto the substrate.
[0003]
[Problems to be solved by the invention]
By the way, there are various types of electronic components supplied by the tray, and the shape and size are different for each type. For this reason, the shape and dimensions of the tray for storing the electronic components also differ depending on the electronic components, and for example, the height of the tray is not constant. However, in the past, as the transfer height of the transfer head when picking up electronic components from trays having different height dimensions as described above, a constant transfer height preset for each electronic component mounting apparatus has been used. . In other words, even when electronic components of a low tray height are mounted, the rising height of the transfer head after picking up should be raised to the transport height set assuming the tray with the highest height dimension. It was. For this reason, when mounting electronic components of a type with a low tray height, the transfer head is lifted and lowered unnecessarily, and this extra lifting is repeated for each mounting operation. As a result, wasted time was generated.
[0004]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting method that can improve the mounting efficiency by eliminating dead time.
[0005]
[Means for Solving the Problems]
Electronic component mounting method according to claim 1 is an electronic component mounting method for mounting the tray accommodating a is mounted on the supply portion of the electronic components the electronic components to the pickup by the substrate an electronic component by the placement head, the tray upper edge Is higher than the height of the upper surface of the electronic component housed therein, and the height dimension data of the tray, which differs depending on the type of electronic component, is stored in the data storage unit, and the electronic component is removed from the tray. The transport height of the transfer head when picked up and transferred onto the substrate is determined based on the height dimension data stored in the data storage unit.
[0006]
The electronic component mounting method according to claim 2 is the electronic component mounting method according to claim 1, wherein the transfer head has a height detection function, and the data of the height dimension is transferred prior to the mounting operation. It was determined by the head height detection function.
[0007]
According to the present invention, a transport height of the transfer head when transferring from the tray the electronic component to the pickup and on the substrate, by determining based on the data of the height of the tray, extra transfer head This eliminates unnecessary movement, eliminates wasted time, and improves mounting efficiency.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 4 is an explanatory diagram of an electronic component pickup by the transfer head of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 4 is a graph showing a movement operation pattern of the transfer head in the electronic component mounting operation of the embodiment.
[0009]
First, an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is arranged in the X direction at the center of a base 1. The transport path 2 is a positioning unit that transports and positions the substrate 3. On both sides of the transport path 2, electronic component supply units 4 are arranged, and the supply unit 4 supplies a tape feeder 5 that supplies the taped electronic components and an electronic component P stored in a tray 7 that is a container. A tray feeder 6 is provided.
[0010]
A transfer head 9 for electronic parts is mounted on the X-axis table 8. The transfer head 9 is a multiple type and includes a plurality of suction nozzles 11. The X-axis table 8 is installed on a pair of parallel Y-axis tables 10. By driving the X-axis table 8 and the Y-axis table 10, the transfer head 9 moves horizontally, and from the pickup position 5 a of the tape feeder 5 and a predetermined tray 7 of the tray feeder by the suction nozzle 11 mounted at the lower end. The electronic component P is picked up and transferred to the substrate 3 on the transport path 2. That is, the transfer head 9 picks up different types of electronic components by the plurality of suction nozzles 11 and mounts them on the substrate 3. The X-axis table 8 and the Y-axis table 10 serve as moving means for the transfer head 9.
[0011]
A line camera 15 is disposed on the movement path of the transfer head 9 between the conveyance path 2 and the supply unit 4. While moving the transfer head holding the electronic component horizontally above the line camera 15, the light received through the optical system of the line camera 15 is received by a one-dimensional line sensor, thereby recognizing the electronic component. .
[0012]
Next, the configuration of the control system will be described with reference to FIG. In FIG. 2, a control unit 20 is a CPU and controls the operation of the entire electronic component mounting apparatus. The program storage unit 21 stores programs necessary for various operations such as a sequence program for mounting operations. This program includes a rising height control program in an operation pattern when the transfer head is moved. The data storage unit 22 stores various data such as mounting coordinate data and component data. The component data includes data regarding the tray 7 in which electronic components are stored.
[0013]
The mechanism control unit 24 performs drive control of each motor that drives the XY table mechanism and the transfer head 9. By controlling the drive mechanism of the transfer head 9 based on the sequence program and the component data described above, when the electronic component is picked up from the tray 7 and transferred to the substrate 3, the transfer head 9 is placed on each tray 7. Move at the corresponding transport height. The recognition processing unit 25 performs image processing of the image data of the electronic component acquired by the line camera 15, thereby identifying and position recognition of the electronic component held by the transfer head 9. The operation / input unit 26 is an operation button or a keyboard provided on the operation panel, and inputs component data such as tray height data and an operation command.
[0014]
Here, the operation pattern of the pickup operation by the transfer head 9 will be described with reference to FIGS. This operation pattern is executed based on the operation program stored in the program storage unit 21 and the component data stored in the data storage unit 22. FIG. 3 shows the change in the height position h when the transfer head 9 is moved horizontally, that is, during the three operations of component pickup from the tray 7 of the supply unit 4, component recognition by the line camera 15, and mounting on the substrate 3. The change of the height position h of the lower end part of the suction nozzle 11 with which the transfer head 9 was mounted | worn by is shown with the graph.
[0015]
In FIG. 3, after picking up the electronic component P from the tray 7, the transfer head 9 moves up to the height position h1. The height position h1 will be described. FIG. 4 shows the positional relationship in the height direction when the transfer head 9 picks up the electronic component P from the tray 7 by the suction nozzle 11. Depending on the type of electronic component P, tray height data (height H to the top edge of the tray, depth d, bottom surface thickness t) indicating dimensions in the height direction of the tray 7 is different. The amount of increase required to reach the height position h1 at which the component P can be stably taken out from the tray 7 and transported without obstacles also varies depending on the type of electronic component. Note that, as shown in FIG. 4, the height H of the upper edge of the tray is higher than the height of the upper surface of the electronic component P stored in the tray 7.
[0016]
Here, the height position h <b> 1 means a height position at which a predetermined margin gap C can be secured between the bottom surface of the electronic component P held by the transfer head 9 and the upper edge of the tray 7. . Since the margin gap C is given as a constant value regardless of the type of electronic component, in order to obtain the height position h1, as shown in the figure, the thickness T of the electronic component and the height of the tray 7 described above are shown. It is sufficient if the data is known. That is, the transport height when picking up and transporting the electronic component from the tray 7 is determined based on the height dimension data of the tray 7. These data are stored in advance in the data storage unit 22 as component data.
[0017]
After moving up to the height position h1, the transfer head 9 moves to the line camera 15, where the height is changed to a predetermined recognition height position h2. The height position h2 is a height position determined by characteristics such as the focal length of the line camera 15. Then, until reaching the mounting point on the substrate 3 after recognition, the transfer head 9 changes the height to a different transport height position h3. This height position h3 is determined by the height of an obstacle such as the height of an already mounted component on the board 3.
[0018]
This electronic component mounting apparatus is configured as described above, and the electronic component mounting method will be described below. First, prior to the start of the mounting operation, if there is an electronic component supplied by the tray 7, it is confirmed whether or not the height data of the tray 7 is already input in addition to the normal component data. Thereafter, the mounting operation is started. First, the transfer head 9 picks up the electronic component P from the tray 7 of the supply unit 4. At this time, after the electronic component P is adsorbed, the transfer head 9 moves to the above-described transport height position h1, that is, the clearance from the bottom surface of the electronic component P held by the nozzle to the upper edge of the tray 7 has a predetermined margin C. Ascend to the height position h1. Then, the robot moves onto the line camera 15 while maintaining the height position h1, and descends to the recognition height position h2. During the imaging, the height position h2 is kept and then moved onto the substrate 3 to mount the electronic component P held at the mounting point.
[0019]
In the operation of the transfer head 9, the transfer head 9 rises only to the minimum height necessary for stably picking up the electronic component P from the tray 7. For this reason, it is possible to eliminate the dead time due to the transfer head 9 performing an unnecessary ascending / descending operation for each mounting operation, and to shorten the tact time.
[0020]
Of the component data, the tray height data may be input by teaching using a height detection function such as a touch sensor provided in the transfer head 9. That is, prior to the mounting operation, the transfer head 9 is moved onto the tray 7, the suction nozzle 11 is brought into contact with the upper edge or bottom surface of the tray 7, and the height position at this time is detected. Thereby, the trouble of data input can be saved.
[0021]
【The invention's effect】
According to the present invention, the transfer height of the transfer head when picking up an electronic component from the tray and transferring it to the substrate is determined based on the height dimension data of the tray. However, it is possible to improve the mounting efficiency by eliminating wasted time without excessive rise and fall.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a block diagram illustrating a configuration of a control system of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a graph showing a movement operation pattern of the transfer head in the electronic component mounting operation of the embodiment of the present invention. FIG. 4 is an explanatory diagram of an electronic component pickup by the transfer head of the electronic component mounting apparatus of the embodiment of the present invention. Explanation of]
3 Substrate 4 Supply unit 7 Tray 9 Transfer head 11 Suction nozzle 21 Program storage unit 22 Data storage unit h Height position

Claims (2)

An electronic component mounting method for picking up an electronic component from a tray mounted on the electronic component supply unit and storing the electronic component by a transfer head and mounting the electronic component on a substrate, the height of the upper edge of the tray being stored in the electronic component The height dimension data of the tray is higher than the height of the upper surface of the sheet and is different depending on the type of the electronic component , and is stored in the data storage unit. When the electronic component is picked up from the tray and transferred onto the substrate, transfer A method for mounting an electronic component, comprising: determining a transport height of the head based on height dimension data stored in the data storage unit. 2. The electronic component mounting method according to claim 1, wherein the transfer head has a height detection function, and the height dimension data is obtained by the height detection function of the transfer head prior to the mounting operation.

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