JP6545029B2 - Board work system - Google Patents

Description

  The present invention relates to a substrate-to-substrate operation system provided with a die supply unit for supplying a die formed by dicing a wafer, and a method for managing the order of attachment of components to a circuit board of the substrate-to-substrate operation system.

Some board-to-board work systems for mounting parts on a circuit board include a plurality of part supply units for supplying parts in order to mount different kinds of parts on the circuit board (eg, Patent Document 1). The substrate-to-substrate operation system disclosed in Patent Document 1 includes a component supply unit that supplies a die formed by dicing a wafer. In this component supply unit, for example, the die attached at a predetermined position on the dicing sheet is adsorbed by the reverse transfer means, and the adsorbed die is inverted upside down. The component supply unit transports the die inverted by the reversing transport means to a position where suction can be performed by the suction nozzle of the mounting head. Then, in the substrate-to-substrate operation system, the mounting head with the die suctioned by the suction nozzle is moved to mount the die on the circuit board.

Unexamined-Japanese-Patent No. 2004-47927

  By the way, when there is a defective die (bad die) in the die assembly attached to the dicing sheet, for example, a mark indicating that the wafer is defective is added to the upper surface of the defective die. There is. The component supply unit detects the mark added based on the imaging data of the die camera to determine a defective die. Further, the component supply unit searches for a normal die in place of the detected defective die. For this reason, in this type of component supply unit, the component supply time required until a normal die can be supplied fluctuates according to the number of defective dies included in the die assembly.

  Further, the substrate-to-board operation system includes a plurality of component supply units for supplying a die to one component mounter, or a component supply unit for supplying a die and another component supply unit (a component supply including a tape feeder May be mixed with other parts. In a component mounting machine provided with such a plurality of component supply units, there is a demand for more accurately managing the time during which individual component supply units supply components. This is because, if the component supply time is managed more accurately, for example, by determining the mounting order of various components on the circuit board, the mounting order can be optimized and the production time can be shortened. Therefore, there is a demand for a substrate handling system that can more accurately manage the component supply time of the component supply unit that supplies the die.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an on-board operation system capable of correcting an estimated required supply time of a component mounted on a circuit board.

  The substrate-to-substrate operation system according to the technology disclosed in the present application made in view of the above problems supplies a die mounted by the mounting head to the circuit board from a diced wafer to a supply position where the mounting head adsorbs the die. Die supply unit, the estimated required supply time for the die supply unit to supply the die to the supply position, and the die supply unit attempted supply within a predetermined period during production of a plurality of the circuit boards The estimated supply time of the die mounted on the circuit board is corrected based on the number of defective dies and an error rate determined based on at least one of data on the defective dies included in the wafer. And a control unit.

According to the technology disclosed in the present application, it is possible to provide a board-to-board operation system capable of correcting the estimated supply time of a component mounted on a circuit board.

It is a perspective view which shows the board | substrate working system of 1st Embodiment. It is a perspective view which shows the electronic component mounting apparatus which comprises the board | substrate working system shown in FIG. It is a top view which shows an electronic component mounting machine in the viewpoint from upper direction. It is a perspective view showing a die supply machine. It is a block diagram of an electronic component mounting machine. It is a flowchart which shows the optimization process of the mounting order of components. It is a part of production information, It is a figure which shows the number of the normal die | dye of the wafer and the defect die | dye which were used for every production order of a board | substrate. It is a figure which shows the number of normal dies of wafer kind "A", and the number of defect dies. It is a figure which shows the supply order of the components of the electronic component mounting machine before optimization. It is a schematic diagram for demonstrating the mounting | wearing sequence of an electronic component mounting machine. FIG. 6 is a diagram showing data relating to an estimated component supply time and before considering an error occurrence rate. FIG. 7 is a diagram showing data relating to an estimated component supply time and after taking an error occurrence rate into consideration. It is a figure which shows the data after optimizing the data shown in FIG. It is a schematic diagram which shows the modules arranged along a component mounting line. It is a figure for comparing the production time of each module. It is a flowchart which shows the optimization process of the mounting order of components of 2nd Embodiment. FIG. 5 is a diagram showing the number of normal and defective dies per wafer. It is a flowchart which shows the optimization process of the mounting order of components of 3rd Embodiment. It is a flowchart which shows the process for determining the components remaining number of 4th Embodiment.

First Embodiment
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a substrate-to-board operation system according to the first embodiment. A substrate-to-board operation system (hereinafter sometimes referred to simply as “system”) 10 shown in FIG. 1 is for carrying out an operation of attaching electronic components to a circuit board, and four electronic devices disposed adjacent to each other A component mounting device 12 is provided. The electronic component mounting apparatus 12 has a width in the disposition direction of one system base 14 and two electronic component mounting machines 16 disposed adjacent to each other on the system base 14 or the electronic component mounting apparatus 12 And an electronic component mounting machine 17 which is twice as large as the electronic component mounting machine 16. That is, seven electronic component mounting machines 16 and 17 are arranged in order in order. In the following description, the direction in which the electronic component placement machines 16 and 17 are arranged is referred to as an X-axis direction, and a horizontal direction perpendicular to the direction is referred to as a Y-axis direction.

Of the four electronic component mounting apparatuses 12 constituting the system 10, the three electronic component mounting apparatuses 12 in which the two electronic component mounting machines 16 are arranged have the same configuration, and one of them Is shown in FIG. 2, and the one electronic component mounting device 12 will be described as a representative. Incidentally, FIG. 2 is a perspective view in which a part of the exterior component of the electronic component mounting apparatus 12 is removed. Each of the electronic component mounting machines 16 included in the electronic component mounting system 12 mainly includes a mounting machine main body 24 including a frame portion 20 and a beam portion 22 mounted on the frame portion 20, and a circuit board. A carrying device 26 for carrying in the X axis direction and fixing at a set position, a mounting head 28 for mounting an electronic component on a circuit board fixed by the carrying device 26, and a mounting head provided for the beam portion 22 The moving device 30 moves the X-direction 28 in the X-axis direction and the Y-axis direction, and the supply device 32 which is disposed in front of the frame portion 20 and supplies the electronic components to the mounting head 28.

The transfer device 26 includes two conveyor devices 40 and 42, and the two conveyor devices 40 and 42 are parallel to each other and the central portion of the frame portion 20 in the Y-axis direction so as to extend in the X-axis direction. Are located in Each of the two conveyor devices 40 and 42 is configured to transport a circuit board supported by the conveyor devices 40 and 42 in the X-axis direction by an electromagnetic motor (not shown). Furthermore, each of the conveyor devices 40 and 42 has a substrate holding device (not shown), and is configured to hold the circuit board fixedly at a predetermined position.

Further, the mounting head 28 mounts the electronic component on the circuit board held by the transfer device 26, and has a suction nozzle 50 on the lower surface for suctioning the electronic component. In addition, the mounting head 28 is fixed with the mark camera 44 (see FIG. 3) facing downward, and the mark camera 44 uses the reference position mark of the circuit board, the ID mark for identifying the circuit board and the electronic parts Take images of the mounting status etc. The suction nozzle 50 communicates with the positive / negative pressure supply device 52 (see FIG. 5) through the negative pressure air and positive pressure air passages, suctions and holds the electronic components by the negative pressure, and a slight positive pressure is supplied. It is considered to be a structure that separates the held electronic components. Furthermore, the mounting head 28 has a nozzle lifting device 54 (see FIG. 5) that raises and lowers the suction nozzle 50 and a nozzle rotation device 55 (see FIG. 5) that rotates the suction nozzle 50 about its axis. It is possible to change the vertical position of the electronic component to be held and the holding attitude of the electronic component. The suction nozzle 50 is removable from the mounting head 28, and can be changed according to the size, shape, and the like of the electronic component.

The moving device 30 is for moving the mounting head 28 to an arbitrary position on the frame portion 20, and an X-axis direction slide mechanism (not shown) for moving the mounting head 28 in the X-axis direction; And a Y-axis direction slide mechanism (not shown) for moving in the Y-axis direction. The Y-axis direction slide mechanism has a Y-axis slider 60 (see FIG. 3) provided on the beam portion 22 so as to be movable in the Y-axis direction, and an electromagnetic motor 57 (see FIG. 5) as a drive source. The Y-axis slider 60 can be moved by the electromagnetic motor 57 to any position in the Y-axis direction. The X-axis direction slide mechanism also includes an X-axis slider 66 provided on the Y-axis slider movably in the X-axis direction, and an electromagnetic motor 58 (see FIG. 5) as a drive source. The X-axis slider 66 can be moved to an arbitrary position in the X-axis direction by 58. The mounting head 28 is attached to the X-axis slider 66 so that the mounting head 28 can be moved by the moving device 30 to any position on the frame 20. The mounting head 28 is attachable to and detachable from the X-axis slider 66 with one touch, and can be changed to different types of working heads such as a dispenser head and an inspection head.

Further, on the upper surface of the frame portion 20 as a base, a parts camera 46 is provided between the transport device 26 and the supply device 32 in the Y-axis direction. The parts camera 46 is for picking up an image when the mounting head 28 holding the electronic component by suction holds the upper part, and confirming the suction state by the image pickup data.

Moreover, the supply apparatus 32 is arrange | positioned by the edge part of the front side of the flame | frame part 20, and is set as the feeder type | mold supply apparatus. The feeding device 32 includes a plurality of tape feeders 74 that accommodate the taped components in which the electronic components are taped and wound on the reel 72, and the taped components accommodated in each of the plurality of tape feeders 74. And a plurality of delivery devices (not shown) for delivering the electronic components, and the electronic components are sequentially supplied to the supply position to the mounting head 28 from the taped components. The tape feeder 74 is attachable to and detachable from the device pallet 76 attached to the front end of the frame portion 20, and is compatible with electronic component replacement and the like. The device pallet 76 to which the tape feeder 74 is attached and detached is attachable to and detachable from the frame 20 by the operation of a clamp mechanism (not shown) provided on the frame 20. Therefore, the electronic component placement machine 16 can remove the device pallet 76 from the frame portion 20 and attach a different type of feeding device to the frame portion 20 from the feeder type feeding device 32.

FIG. 3 is a plan view showing the electronic component placement machine 17 of the electronic component placement apparatus 12 as viewed from above. The electronic component mounting apparatus 12 including the electronic component mounting apparatus 17 has the width in the X-axis direction of the frame unit 20, the transport apparatus 26, the Y-axis slider 60, etc. of the electronic component mounting apparatus 17 provided in the electronic component mounting apparatus 16. It has the same configuration as the electronic component mounting apparatus 12 provided with the electronic component mounting machine 16 except that it has a width about twice that of them. In the following description, components of the electronic component mounting machine 17 that are common to the electronic component mounting machine 16 use the same reference numerals, and the description thereof will be omitted as appropriate. The state in which the electronic component mounting machine 17 shown in FIG. 3 removes the device pallet 76 having a width about twice that from the frame portion 20 and mounts the supply device 80 of a type different from the feeder type supply device 32 to the frame portion 20 Is shown. The feeder 80 is a mixed type feeder including a tape-type feeder 81 and a wafer-type feeder 82. In the following description, the electronic component mounting machine 17 in which the mixed type supply device 80 shown in FIG. 3 is attached to the frame portion 20 will be described.

The tape-type feeding device 81 includes a feeding device or the like for feeding the tape feeder 74 or the tape-formed electronic component 77 of the tape feeder 74 described above. The wafer type supply device 82 supplies the die 108 from a die assembly 106 (see FIG. 4) formed by dicing a wafer having a dicing sheet attached to a wafer. The tape-type feeding device 81 and the wafer-type feeding device 82 of the feeding device 80 are attached to the front side of the frame portion 20 of the electronic component placement machine 17.

The wafer type supply device 82 is mounted on the mounting plate 84. The wafer type supply device 82 is disposed substantially at the center of the mounting plate 84 and holds the die assembly 106 in a fixed manner, and a die assembly held by the die assembly holding device 86. Pickup head 88 for picking up die 108 from 106, head moving device 90 for moving pickup head 88 to any position on mounting plate 84, and shuttle mechanism for carrying die 108 picked up by pickup head 88 to the supply position It has 92 and.

As shown in FIG. 4, the die assembly holding device 86 includes a pair of guide rails 100 (only one of which is shown in the figure) disposed so as to extend in the Y-axis direction, and the pair of guides It has a holding frame 102 held movably in the Y-axis direction by the rail 100, and a frame moving mechanism 104 for moving the holding frame 102 in the Y-axis direction. The die assembly holding device 86 is configured such that the die assembly 106 in which the die assembly 106 is held on the holding frame 102 is moved by the frame moving mechanism 104 in the Y-axis direction.

Further, the pickup head 88 is provided with a plurality of holding rods 110 for holding at its lower end a suction nozzle (not shown) for suctioning the die 108. The suction nozzles held by the holding rods 110 communicate with a negative pressure supply device (not shown) through an air passage, and are configured to suction and hold the die 108 by a negative pressure.

The head moving device 90 is an XY robot type moving device, and is capable of moving the pickup head 88 to any position on the die assembly holding device 86. More specifically, the head moving device 90 includes a Y-axis direction slide mechanism 112 for moving the pickup head 88 in the Y-axis direction, and an X-axis direction slide mechanism 114 for moving the pickup head 88 in the X-axis direction. Have. The Y-axis direction slide mechanism 112 has a Y-axis direction slider 116 provided movably in the Y-axis direction, and an electromagnetic motor (not shown) as a drive source. In the Y-axis direction sliding mechanism 112, the Y-axis direction slider 116 can be moved to any position in the Y-axis direction by driving the electromagnetic motor. The X-axis direction slide mechanism 114 has an X-axis direction slider 118 provided on the side surface of the Y-axis direction slider 116 so as to be movable in the X-axis direction, and an electromagnetic motor (not shown) as a drive source. There is. The X-axis direction slide mechanism 114 can move the X-axis direction slider 118 to any position in the X-axis direction by driving the electromagnetic motor. The pickup head 88 can be moved to any position on the die assembly holding device 86 by the head moving device 90 by attaching the pickup head 88 to the X-axis direction slider 118.

 The die camera 120 is provided on the X-axis direction slider 118 to which the pickup head 88 is attached facing downward, and the X-axis direction slider 118 is moved by the head moving device 90 to hold the die assembly. It is possible to image the die assembly 106 held by the device 86 at an arbitrary position. Thereby, it is possible to obtain positional information and the like of each of the plurality of dies 108 of the die assembly 106.

Further, as shown in FIG. 3, the shuttle mechanism 92 is fixed on the mounting plate 84 on one side in the X-axis direction with respect to the die assembly holding device 86. The shuttle mechanism 92 is composed of a generally elongated shuttle body 122 and a die carrier 124 provided on the upper surface of the shuttle body 122. The die carrier 124 is slidable in the longitudinal direction of the shuttle body 122. The die transport stand 124 receives the die 108 from the pickup head 88, transports the received die 108 to the supply position, and has a shuttle nozzle (not shown) for receiving the die 108. In addition, the shuttle body 122 extends in the Y-axis direction, and is fixed to the upper surface of the mounting plate 84 at the proximal end portion thereof, and the distal end portion extends from the mounting plate 84 . Thus, the tip end side portion of the shuttle mechanism 92 extends onto the frame portion 20 in a state where the supply device 80 is attached to the electronic component mounting machine 17. Further, in the supply device 80, a connector (not shown) electrically connected to the frame portion 20 of the electronic component mounting machine 17 is provided on the lower surface of the mounting plate 84. Note that, depending on the type, the die 108 has a die (for example, a flip chip or the like) attached to the dicing sheet upside down. For this reason, the wafer type supply apparatus 82 may include a reversing unit that receives the die 108 picked up by the pickup head 88, reverses the top and bottom as necessary, and supplies the die to the die transport stand 124.

As shown in FIG. 5, the control device 130 of the electronic component placement machine 17 is a computer 132 mainly comprising a CPU, a ROM, a RAM, etc., an electromagnetic motor 57 58 of the transport device 26 and the transport device 30, A plurality of drive circuits 133 corresponding to each of the positive / negative pressure supply device 52, the nozzle lifting device 54, the nozzle rotation device 55, the tape type supply device 81, and the wafer type supply device 82 are provided. The controller 132 is capable of controlling the operation of the conveying device 26, the moving device 30 and the like via each drive circuit 133. The controller 132 also processes image data captured by the mark camera 44 and the part camera 46. The controller 132 processes the image data obtained by the mark camera 44 to detect information on the circuit board. In addition, the controller 132 controls the holding position of the component (the die 108 or the electronic component 77) by the suction nozzle 50 based on the processing result of the image data obtained by the part camera 46 and the position information data stored in the memory 135. Implement error detection and correction. Further, the controller 132 is connected to the general control device 141 of the system 10, and the detection result, the command and the like are transmitted and received with the general control device 141. The general control device 141 includes a display device 143 such as a touch panel, and can receive input of various information or display various information to allow the user to confirm.

The wafer type feeder 82 picks up the die 108 from the die assembly 106 by the pickup head 88 based on the control of the controller 130. Further, the wafer type supply device 82 can supply the die 108 to the mounting head 28 by transporting the picked up die 108 to the supply position by the shuttle mechanism 92. Specifically, first, the control device 130 controls the head moving device 90 to position the die 108 to be picked up among the plurality of dies 108 of the die assembly 106 held by the die assembly holding device 86. The die camera 120 is moved to The control device 130 captures an image of the die 108 by the die camera 120, and obtains positional information of the die 108 based on the captured data.

Next, the control device 130 controls the head moving device 90 based on the acquired positional information of the die 108 to move the pickup head 88 above the die 108 to be picked up. The controller 130 lowers the holding rod 110 of the pickup head 88. The suction nozzle of the holding rod 110 holds the die 108 by suction and picks up the die 108 from the die assembly 106. Note that a lift mechanism (not shown) for pushing up the die 108 from below is provided below the die assembly holding device 86, and when the die 108 is sucked by the suction nozzle, the die 108 is moved upward by the lift mechanism. By being pushed up, pickup of the die 108 is supported.

Next, the control device 130 moves the pickup head 88 picking up the die 108 above the die transfer stand 124 of the shuttle mechanism 92. In addition, when the die 108 is picked up by the pickup head 88, the die transport stand 124 is set to a position on the base end side of the shuttle body 122 (a position where the die transport stand 124 is indicated by a solid line in FIG. 3). . Then, the control device 130 lowers the holding rod 110 of the pickup head 88 to stop the supply of the negative pressure to the suction nozzle, thereby delivering the picked-up die 108 to the shuttle nozzle of the die transport stand 124.

The die transport stand 124 which has received the die 108 is slid by the control device 130 from the proximal end to the distal end of the shuttle body 122, and the tip end side of the shuttle body 122 (the die transport stand 124 in FIG. The die 108 is supplied at the position shown by the dotted line). That is, the position where the die transfer stand 124 is shown by the dotted line in FIG. 3 is the supply position of the die 108 by the wafer type supply apparatus 82, and the die 108 supplied at that position is held by the mounting head 28.

On the other hand, when the control device 130 supplies the electronic component 77 from the tape feeder 74, the control device 130 controls the tape-type supply device 81 to make the electronic component from the taped components accommodated in each of the plurality of tape feeders 74. Control to sequentially supply 77 to the supply position (the tip of the tape feeder 74 in FIG. 3) to the mounting head 28 is executed.

Here, in the supply apparatus for supplying the dies 108 as in the wafer type supply apparatus 82, when there is a defective die (bad die) in the die assembly 106, for example, a defective product added to the upper surface of the defective die It is necessary to detect a mark indicating that is based on the imaging data of the die camera 120. In addition, the wafer type supply device 82 needs processing for searching for a normal die 108 instead of the detected defective die. For this reason, the wafer type supply apparatus 82 varies the component supply time required until supplying a normal die 108 according to the number of defective dies included in the die assembly 106 on the dicing sheet. Do. Therefore, in the system 10 of the present embodiment, a defective die is detected from the die assembly 106 with respect to the electronic component mounting machine 17 having the wafer type supply device 82 among the electronic component mounting machines 16 and 17. Error rate (hereinafter simply referred to as “error rate”), and the estimated component supply time is corrected based on the error rate. Furthermore, the system 10 optimizes the mounting order of mounting components on the circuit board in each of the electronic component mounting machine 16 and the electronic component mounting machine 17 based on the estimated component supply time after correction. The system 10 performs, for example, the optimization processing of the mounting order for each production job or each time a predetermined substrate is produced.

<Optimization processing of mounting order of parts>
The flowchart shown in FIG. 6 shows the contents of the optimization process of the mounting order of parts. First, before producing a substrate based on a production job, for example, the general control device 141 of the system 10 determines whether or not the user has designated an error rate (step S1). For example, according to the display content of the display device 143 of the general control device 141, the user has the electronic component placement machine 17 provided with the wafer type supply device 82 among the electronic component placement machines 16 and 17 connected to the component production line of the system 10. The error rate of is input using the touch panel of the display device 143. The error rate varies depending on the type of die 108 (wafer) and the like. Therefore, the user can set an arbitrary error rate determined based on the result of using the same type of die 108 in the operation of operating the system 10.

When the error rate is designated by the user in step S1 (step S1: "YES"), the general control device 141 determines the designated value as the error rate (step S3). If the user does not specify an error rate (step S1: “NO”), the general control device 141 selects one of the wafers of the same type (die 108) among the wafers used for the production of the substrates in the past. A value obtained by averaging the incidence rate of defective dies is determined as an error rate (step S5).

FIG. 7 shows a part of production information, and shows the number of defective dies of a wafer used for each production order of substrates. For example, the general control device 141 may collectively manage the production information, or the control device 130 of the electronic component placement machine 17 may store and manage it in the memory 135. As shown in FIG. 7, for example, three types of wafer types “A”, “B” and “C” are used for production of the first substrate. At the time of production of the first substrate, each of wafer types “A”, “B” and “C” is used one by one. Also, when the second substrate is produced, each of wafer types “A”, “B” and “C” is a wafer having two wafer types “A” (wafer ID “A-00001” and “A “−00002”) is used, and each of the other wafer types “B” and “C” is used one by one. For example, the electronic component placement machine 17 provided with the wafer type supply device 82 counts the number of normal dies and the number of defective dies of each wafer type every time a substrate is produced. For example, in the production of the first substrate, the wafer type “A” (wafer ID “A-00001”) corresponds to 5000 normal dies out of the dies 108 for which the wafer type supply device 82 attempted to pick up, and defective dies. There are ten.

For example, in step S5, when the general control device 141 determines the error rate, it is assumed that the production information shown in FIG. 8 is aggregated. FIG. 8 shows the number of normal dies and the number of defective dies of wafer type "A". For example, the wafer ID “A-00001” has an error rate of 1% because the number of normal dies is 9900 and the number of defective dies is 100. Further, the wafer ID “A-00002” has an error rate of 0.01% because the number of normal dies is 9999 and the number of defective dies is one. Based on the production information shown in FIG. 8, the control device 130 of the electronic component placement machine 17 calculates the number of normal dies from the wafer ID “A-00001” to the wafer ID “A-00006” having the same wafer type and the defective dies. Calculate the error rate by adding numbers. As a result of the calculation, the error rate of wafer type “A” is 2%. The controller 130 calculates the error rate for the other wafers “B” and “C” as well as the error rate for the wafer type “A”, and transmits the error rates to the general control unit 141. The calculation of the error rate may be performed by the general control device 141.

<Optimization of parts supply order>
Next, in step S6 shown in FIG. 6, the general control device 141 determines the error rate of the wafer type used in the production job of the substrate to be produced next based on the error rate determined by the user's input value or production information. decide. The general control device 141 notifies the determined error rate to the electronic component placement machine 17 using the wafer type supply device 82 in the next production job. The control device 130 of the electronic component mounting machine 17 that has received the notification calculates the estimated component supply time based on the error rate.

Next, the controller 130 controls the wafer type feeder 82 and other component feeders (tape type feeder 81) until the wafer type feeder 82 picks up the normal die based on the calculated estimated component feed time. Etc.) determines whether "waiting for supply" occurs, which causes a delay in the operation of supplying parts (step S7). When a waiting for supply occurs, the control device 130 changes the order of supply of the wafer type supply device 82 and other component supply devices so as to reduce the supply waiting time (step S9). Note that the calculation of the estimated component supply time, the presence or absence of supply waiting, and the change of the supply order may be collectively performed by the general control device 141.

The optimization of the supply order of parts implemented in the above-described steps S6 to S9 will be described. FIG. 9 shows an example of the supply order of components of the electronic component mounting machine 17 before optimization. In the example shown in FIG. 9, the electronic component placement machine 17 first supplies the die 108 of the wafer type feeding device 82 five times (the row of the component type in the figure is “wafer components” row) five times as the component placement sequence. After the implementation, the supply of the electronic component 77 of the tape-type supply device 81 (the item of the type of component in the figure is the line of “feeder component”) is performed five times.

FIG. 10 is a schematic view for explaining the mounting sequence of the electronic component mounting machine 17. As shown in FIG. Further, FIG. 11 is data relating to the estimated component supply time stored in the memory 135 of the control device 130, and shows data before considering the error rate corresponding to the mounting sequence shown in FIG. In the data shown in FIG. 11, the mounting sequence number (Seq number), slot number, estimated supply required time not considering error rate, suction operation content, suction operation time (operation time), presence or absence of supply waiting, total required Data corresponding to each item of time is set. “Estimated supply required time not considering error rate” refers to the type of electronic component 77 or die 108 to be supplied, the type of suction nozzle 50 to be used, the type of mounting head 28 to which the suction nozzle 50 is attached, and the mounting The time is previously estimated by a known method based on the movement distance of the head 28 and the like. In addition, although the electronic component placement machine 17 is provided with a plurality of slots to which the wafer type feeding device 82 and the tape type feeding device 81 are connected, the wafer type feeding device 82 is connected as an example in the following description. It is assumed that the slot number to be stored is "1" and the slot number to which the tape type feeding apparatus 81 is connected is "2". Moreover, about the thing of the same processing content among several mounting | wearing sequences Seq, description is abbreviate | omitted suitably.

First, with the start of the mounting sequence shown in FIG. 11, the control device 130 executes the first (mounting sequence Seq1) of the mounting sequence to supply the supply position of the wafer type supply device 82 connected to the slot number 1 (loading The mounting head 28 is moved to the suction position of the head 28). As indicated by the mounting sequence Seq1 of FIG. 10, the mounting head 28 indicates the supply position of the wafer type supply device 82 from the position where it was waiting before the work, more specifically the die transport stand 124 of FIG. Move to the part. The suction operation time required for the mounting head 28 to move to the suction position is, for example, 2 seconds (see the item "suction operation time" in FIG. 11).

On the other hand, the wafer type supply device 82 starts processing for supplying the die 108 to the supply position as production starts. The supply required time required for the wafer type supply apparatus 82 to supply the die 108 to the supply position is estimated to be, for example, 2 seconds (see the item "supply required time" in FIG. 11). Since the operation time and the estimated required supply time are the same, the total required time of the mounting sequence Seq1 is 2 seconds.

Next, the control device 130 executes the mounting sequence Seq2, and carries out an operation of mounting the die 108 supplied from the wafer type supply device 82 to the mounting head 28 to the circuit board CB. The controller 130 controls the mounting head 28 to suction the die 108 at the supply position of the wafer type supply device 82 by the suction nozzle 50. As shown in the mounting sequence Seq2 of FIG. 10, the control device 130 causes the mounting head 28 to pass from the supply position of the wafer type supply device 82 above the parts camera 46 and mounts the mounting position by the transfer device 26 (see FIG. 3). To the mounting position of the circuit board CB fixed to the When the mounting head 28 passes above the parts camera 46, the control device 130 picks up an image of the suction nozzle 50 with the die 108 adsorbed by the parts camera 46. The control device 130 corrects an error such as the holding position or posture of the die 108 adsorbed to the suction nozzle 50 based on the imaging data of the parts camera 46, corrects the error, and then corrects the die 108 relative to the mounting head 28 Attach to CB. Further, since the die 108 is supplied from the wafer type supply device 82 also in the next mounting sequence Seq3, the control device 130 moves the mounting head 28 to the supply position of the wafer type supply device 82. The suction operation time required for a series of operations of the mounting sequence Seq2 is, for example, 2.5 seconds.

On the other hand, the estimated required supply time of the wafer type supply apparatus 82 is 2 seconds, as in the mounting sequence Seq1. When one of the adsorption operation time and the supply required time is long, the next mounting sequence can not be executed even if the operation with a short processing time is finished. Therefore, the total required time of the mounting sequence Seq2 is 2.5 seconds, which is combined with the suction operation time having a long processing time. Similarly, the control device 130 executes mounting sequences Seq3 to Seq5 for mounting the die 108 supplied from the wafer type supply device 82 to the circuit board CB. In the operation involving the mounting of the component on the circuit board CB as in the mounting sequence Seq2, the suction operation time is determined depending on whether the mounting position of the component on the circuit board CB is close or far from the supply position of the component of the wafer type supply device 82. It will change. Therefore, in the other attachment sequences Seq3 to Seq5 performing the same process, the suction operation times are different from each other.

Next, in the mounting sequence Seq6, the control device 130 moves the mounting head 28 in which the mounting of the die 108 to the circuit board CB is finished to the supply position of the tape-type supply device 81 connected to the slot number 2. Next, the control device 130 executes the mounting sequence Seq7, and carries out an operation of mounting the electronic component 77 supplied from the tape type supply device 81 to the mounting head 28 on the circuit board CB. As shown in FIG. 10, the mounting head 28 passes above the parts camera 46 from the supply position of the tape type supply device 81, moves to the mounting position of the circuit board CB, and mounts the electronic component 77. Similarly, the control device 130 repeatedly executes the mounting of the electronic component 77 supplied from the tape-type supply device 81 to the circuit board CB in the mounting sequences Seq8 to Seq10.

With respect to the data relating to the estimated component supply time shown in FIG. 11 of the content described above, the control device 130 performs wafer type supply based on the error rate notified from the general control device 141 in step S6 shown in FIG. The supply required time of the apparatus 82 is calculated. The control device 130 calculates the error rate and the preset coefficient by multiplying the estimated required supply time of each mounting sequence. FIG. 12 shows data related to the corrected estimated component supply time after calculation based on the error rate. For example, as a result of calculating based on the error rate which a bad die | dye generate | occur | produces, the presumed supply required time of the wafer type supply apparatus 82 is correct | amended to 2 to 2.1 second. In the mounting sequence Seq1, the estimated required supply time (2.1 seconds) after correction is longer than the suction operation time (2 seconds). Therefore, the total required time of the mounting sequence Seq1 is 2.1 seconds to which the estimated required supply time after correction is applied.

As described above, when the estimated required supply time is corrected using the error rate tabulated and averaged for each wafer type, in the operation of the mounting sequence Seq1, the wafer type supply is completed while the movement of the head moving device 90 is completed. It is expected that the dispensing operation will not be completed, which will transport the die 108 picked up by the apparatus 82 to the dispensing position. As a result, the control device 130 causes a delay in the timing at which the operation of the next mounting sequence Seq2 and thereafter is performed. As a result of executing the correction of the estimated required supply time based on the error rate, the control device 130 determines that the waiting for supply has occurred for the mounting sequence in which the total required time has become longer. In the example shown in FIG. 12, the mounting sequences Seq1 and Seq3 correspond to Seq1 to Seq5 corresponding to the wafer type supply device 82. The control device 130 determines that waiting for supply occurs in the mounting sequences Seq1 and Seq3 in which the total required time has become long, and sets data indicating “Available” in the item “presence or absence of occurrence of supply waiting”.

Next, since the controller 130 determines in step S7 shown in FIG. 6 that supply waiting has occurred, the order of supply of the wafer type supply apparatus 82 and the tape type supply apparatus 81 is set so that the supply waiting time is shortened. Is changed (step S9). FIG. 13 shows data after the data related to the estimated part supply time after correction shown in FIG. 12 is optimized. In the following description, the number of the mounting sequence before the change is referred to as the old mounting sequence, and the mounting sequence after the change is referred to as the new mounting sequence.

For example, the control device 130 inserts, as a new mounting sequence Seq1, the old mounting sequence Seq6 for supplying the electronic component 77 from the tape type supply device 81 (slot 2) before the old mounting sequence Seq1 for which the supply waiting has occurred. The old mounting sequence Seq1 is carried forward as a new mounting sequence Seq2.

In the mounting sequence after change, the control device 130 executes the new mounting sequence Seq1 with the start of production of the substrate, and moves the mounting head 28 to the supply position of the tape type supply device 81 connected to the slot number 2 Let The suction operation time required for the mounting head 28 to move to the suction position is 2 seconds.

On the other hand, the wafer type supplying apparatus 82 starts the process for supplying the die 108 to the supplying position while the new mounting sequence Seq1 is performed, that is, while the operation for the other supplying apparatus is being performed. It becomes possible. As described above, the estimated estimated required supply time after the wafer type supply apparatus 82 supplies the die 108 to the supply position is 2.1 seconds because the error rate is taken into consideration. However, the wafer type supply apparatus 82 starts the pickup operation of the die 108 simultaneously with the start of the new mounting sequence Seq1. For this reason, the estimated required supply time after correction of the wafer type supply apparatus 82 is substantially 0.1 seconds obtained by subtracting 2 seconds of the new mounting sequence Seq1 from 2.1 seconds. As a result, in the new mounting sequence Seq after change, the total required time of the old mounting sequence Seq1 is reduced from 2.1 seconds before optimization to 2 seconds. The total required time is 2 seconds because the suction operation time of the mounting head 28 having a long processing time is applied.

Similarly, the control device 130 inserts, as a new mounting sequence Seq4, the old mounting sequence Seq7 for supplying the electronic component 77 from the tape type supply device 81 (slot 2) before the old mounting sequence Seq3 for which the supply waiting has occurred. The old mounting sequence Seq3 is carried forward as a new mounting sequence Seq5. As a result, the total required time of the new attachment sequence Seq5 (old attachment sequence Seq3) after change is shortened from 2.1 seconds before optimization to 2 seconds. In addition, the order of the mounting | wearing sequence after optimization shown in FIG. 13 is an example, and is not limited to this. Moreover, it is preferable to maintain the original order as much as possible, except for the process of changing the order by optimization. For this reason, the control device 130, like the data after optimization shown in FIG. 13, among the mounting sequences related to the tape type supplying device 81 (other supplying devices), the one having the earlier order (for example, the old mounting sequence Seq6 , Seq 7) are preferred as replacement targets.

Since the total required time of the new attachment sequences Seq2 and Seq5 is optimized to the same two seconds as the attachment sequences Seq1 and Seq3 not considering the error rate shown in FIG. The item "presence or absence of occurrence" is assumed to be none. As a result, the control device 130 uses the more accurate total required time based on the delay of the required time for supplying the wafer-type supply device 82 due to the error rate, and the components for the circuit board CB (die 108 and electronic parts 77) It is possible to optimize the mounting order of

In the conventional electronic component mounting machine 17, since the mounting sequence is determined without considering the error rate, the total required time of the mounting sequence being executed becomes longer each time a defective die is found in an actual operation. There was a problem that the start time of work after the next mounting sequence was delayed. And since the start time of the unimplemented mounting | wearing sequence is delayed whenever the delay of total required time generate | occur | produces, the production time of the board | substrate per sheet was lengthened, and it has led to the fall of production efficiency. On the other hand, in the system 10 according to the present embodiment, the control device 130 of the electronic component placement machine 17 optimizes the total required time in consideration of the error rate, so It is possible to reduce the delay as much as possible. As a result, the system 10 can shorten the substrate production time, and can achieve the effect of production efficiency.

<Module optimization>
Next, the general control device 141 of the system 10 performs optimization for each module. As shown in FIG. 1, the system 10 includes two electronic component mounting machines 16 or one electronic component mounting machine 17 each of four electronic component mounting apparatuses 12 arranged adjacent to each other. The central control device 141 manages, for example, each of the plurality of electronic component placement machines 16 and 17 as a module. Then, the general control device 141 performs optimization so as to shorten the production time (tact time) required to mount the components on the circuit board CB in each module (electronic component mounting machines 16 and 17). The unit of the module set by the general control device 141 to manage the production time can be changed as appropriate. For example, the electronic component mounting device 12 may be managed as a module. In the following description, a case where the general control device 141 executes management and optimization processing with one electronic component mounting machine 16 or one electronic component mounting machine 17 as one module will be described.

The general control device 141 executes step S11 next to step S7 or step S9 shown in FIG. The general control device 141 calculates the production time of each module (electronic component mounting machines 16 and 17). For example, in the estimated component supply time after correction where the mounting sequence is optimized based on the error rate shown in FIG. 13, the production required to mount all the components (die 108 and electronic component 77) on the circuit board CB The time is the time (21.5 seconds in this case) obtained by totaling the total required times of the new mounting sequences Seq1 to Seq10.

Next, in step S13, the general control device 141 obtains production time for all modules, and determines a module with the largest production time as a bottleneck module. In the example shown in FIG. 13, since all the total required times are the same as those in FIG. 11 before considering the error rate, there is no increase or decrease in production time (tact time). However, even if the optimization process in step S9 is performed, the production time may increase compared to before the error rate is considered. In this case, there is a possibility that the electronic component mounting apparatus 17 (module) including the wafer type supply device 82 may become a bottleneck. Note that this increase in production time means that it will increase compared to the ideal production time (see FIG. 11) that does not include a defective die, and the order of the mounting sequence shown in FIG. 12 is not changed. It goes without saying that the production time after optimization is shortened compared to the production time as it is.

More specifically, FIG. 14 schematically shows electronic component placement machines 16M1 to M4, M6, M7 and electronic component placement machine 17M5 (hereinafter, M1 to M7 will be referred to as “modules”) arranged along the component mounting lines of the system 10. Is shown. Here, in the case where the system 10 produces a substrate on one component mounting line in which the modules M1 to M7 are lined up, the production efficiency of the entire system 10 can be achieved by reducing the production time of each of the bottleneck modules M1 to M7. (Throughput) can be improved. For example, FIG. 15 shows the production time of each of the modules M1 to M7. For example, the module M5 is the electronic component placement machine 17 provided with the wafer type supply device 82. As shown in FIG. 14, each of the modules M1 to M7 carries out a predetermined mounting process for mounting the component on the circuit board on the circuit board CB transported from the upstream of the component mounting line, and the downstream module M1 to M7 are mounted. Repeat the work to transfer to M7. The system 10 controls the transfer of the circuit board CB of each of the modules M1 to M7 according to the production time of the module with the longest production time among the modules M1 to M7, that is, the module of the bottleneck to maintain the quality. Do. That is, the time required to carry out one substrate produced by the system 10 ("the production time of the system" in FIG. 15) is the production time of the bottleneck module. Therefore, the system 10 improves the production efficiency by shortening the production time of the bottleneck modules M1 to M7.

As shown in FIG. 15, when the optimization based on the error rate is performed, the production time of the wafer type supply device 82 (item of “wafer parts” in the figure) of the module M5 is 8 seconds to 9 seconds. Suppose that it increased by one second. In modules M1 to M7 after optimization based on the error rate, the production time of module M5 is 11 seconds, and the production time of other modules M1 to M4, M6 and M7 is less than 10 seconds . Thus, the module M5 alone is a bottleneck module.

As a result of recalculating the production time in step S11, the general control device 141 changes the mounting condition of the module M5 (step S14) because the module M5 becomes a bottleneck (step S13: "YES"). For example, the general control device 141 changes the arrangement of the tape feeders 74 that can be mounted by the other modules M1 to M4, M6 and M7 among the plurality of tape feeders 74 mounted to the tape type supply device 81 of the module M5. . The general control device 141 determines the arrangement destination of the tape feeder 74 based on the contents of the mounting process of the other modules M1 to M4, M6, and M7 except the module M5 and the individual production time. For example, the general control device 141 notifies the user of an instruction to move one tape feeder 74 attached to the module M5 to the module M2 having the shortest production time. As shown in FIG. 15, the production time of the module M5 after the arrangement of part of the tape feeder 74 is changed (optimized) is reduced from 11 seconds to 10 seconds. Also, the production time of module M2 has been increased from 8 seconds to 9 seconds. However, the production times of the modules M1 to M7 are averaged compared to before optimization, and the production time of the system 10 is reduced from 11 seconds to 10 seconds. As described above, the general control device 141 can improve the production efficiency by changing the arrangement of the tape feeders 74.

In addition, the change content of the above-mentioned mounting condition is an example, and is changed suitably. For example, in the case where the electronic component mounting machine 17 includes a plurality of wafer-type supply devices 82 or other types (tray-type supply devices), the system 10 may use any of the tape feeders 74 instead. Optimization may be achieved by changing the arrangement of parts supplied by the supply device. Further, the determination condition as to whether or not there is a module of the bottleneck of the general control device 141 in the step S13 can be appropriately set according to the configuration of the system 10 or the like. For example, as described above, the general control device 141 may determine that “a bottleneck module is present” when there is a single bottleneck module M5. Further, for example, the general control device 141 may determine that the number of modules of the bottleneck among the modules M1 to M7 is less than or equal to the number set in advance as “the module of the bottleneck is present”. Also, for example, the general control device 141 may determine that the production time of the system 10 increases before and after the process of step S11 (recalculation of production time) as “with bottleneck module”. Also, for example, the general control device 141 may change the mounting condition of the bottleneck modules M1 to M7 and determine that the production time of the system 10 can be shortened as “the bottleneck module is present”.

According to the first embodiment described above in detail, the following effects can be obtained.
<Effect 1> The electronic component placement machine 17 included in the system 10 includes a tape-type feeding device 81 and a wafer-type feeding device as a plurality of component feeding parts for feeding components (electronic component 77 and die 108) to be loaded onto the circuit board CB. 82 is provided (see FIG. 3). When the user inputs an error rate indicating the number of defective dies included in the wafer included in the wafer type supply device 82, the general control device 141 of the system 10 uses the input value for processing (see FIG. 6). See step S3). In addition, when there is no input from the user, the general control device 141 averaged the incidence of defective dies of the same type of wafer (die 108) among the wafers used for past production in the production information. The value is determined as the error rate (step S5). The system 10 determines in advance the mounting order for mounting the components supplied from the tape type supplying device 81 or the wafer type supplying device 82 to the circuit board CB based on the determined error rate, or changes the mounting order after the determination. .

Here, in the electronic component mounting apparatus 17 including the plurality of component supply devices described above, since the component supply time of each component supply device can be estimated more accurately, for example, the mounting order of each component on the circuit board CB is optimal It is possible to shorten the production time by Therefore, according to the system 10 in the present embodiment, it is possible to improve production efficiency by determining the optimum mounting order of parts using the more accurate estimated parts supply time of the wafer type supply device 82. It becomes.

<Effect 2> The control device 130 of the electronic component placement machine 17 calculates the estimated required supply time of the wafer type supply device 82 based on the error rate (step S6), and then the wafer type supply device 82 supplies the die 108. In the mounting sequence, for example, in the mounting sequence Seq1 of FIG. 12, it is detected that the supply waiting time occurs in which the operation of starting the next mounting sequence Seq2 is delayed until the wafer type supplying device 82 supplies the normal die. (Step S7). The control device 130 determines the order of the mounting sequences Seq1 to Seq10 for supplying the components from the wafer type supplying device 82 and the tape type supplying device 81 or appropriately changes the determined order so that the supply waiting time is shortened. .

For example, as shown in FIG. 13, the control device 130 inserts the old mounting sequence Seq6 for supplying the electronic component 77 from the tape type supplying device 81 before the old mounting sequence Seq1 for which the supply waiting has occurred. In the mounting sequence after the change, the control device 130 executes the new mounting sequence Seq 1 to move the mounting head 28 to the supply position of the tape-type supply device 81 while operating the wafer-type supply device 82. The wafer type supply apparatus 82 can start processing for supplying the die 108 to the supply position while the new mounting sequence Seq 1 is being performed, that is, while operations for other supply apparatuses are being performed. It becomes. As a result, in the new mounting sequence after the change, the total required time of the old mounting sequence Seq1 is reduced from 2.1 seconds before optimization to 2 seconds. Thus, the electronic component placement machine 17 can reduce the total required time, that is, the production time.

<Effect 3> The general control device 141 manages each of the plurality of electronic component placement machines 16 and 17 as a module. The general control device 141 corrects the production time of each module according to the type of substrate to be produced based on the error rate (step S11). Next, the general control device 141 determines, among the plurality of modules, a module that is the bottleneck with the largest production time, based on the corrected production time (step S13). Then, the general control device 141 changes the mounting condition of the module (for example, the module M5) that has become the bottleneck (step S14). The general control device 141 changes the arrangement of the tape feeders 74 which can be mounted by the other modules M1 to M4, M6 and M7 among the plurality of tape feeders 74 mounted to the tape type supply device 81 of the module M5. The production times of the modules M1 to M7 are averaged as compared to before optimization and the production time of the system 10 is reduced (see FIG. 15). As a result, the system 10 can improve the production efficiency by optimizing the arrangement of the tape feeders 74.

Second Embodiment
Next, a second embodiment of the present invention will be described. FIG. 16 is a flowchart of the optimization process in the second embodiment. The difference with the flowchart shown in FIG. 6 of the first embodiment described above is that while the die 108 is used up to the number of switching previously designated by the user, the value designated by the user is set as the error rate, and the number of switching After using the die 108, the difference is that processing is performed using the error rate calculated based on the production information. In the following description, the description of the same contents as the processing shown in the flowchart of FIG. 6 of the first embodiment is appropriately omitted.

First, when producing a substrate based on a production job, the general control device 141 acquires the number of samples of the designated wafer type from the production information (step S21 in FIG. 16). For example, the user operates the general control device 141 to set the error rate and the number of switching for each wafer type before the system 10 starts production of a substrate. When the user's setting operation is completed, the central control device 141 resets the number of samples of production information. The number of samples referred to here means the number of normal dies used for each wafer type and the number of defective dies tried to be used. Then, the general control device 141 executes the processing of the flowchart shown in FIG. 16 every time the wafer type supply device 82 uses one wafer (all the dies 108), for example. The overall control device 141 may execute the process shown in FIG. 16 each time one substrate is produced or every time a predetermined number of substrates is produced.

FIG. 17 shows a part of production information, and shows the number of normal dies and the number of defective dies for each wafer ID of wafer type “A” used in the past. In the system 10 having a plurality of electronic component placement machines 17, the wafer types “A-00001,” “A-00002,”... Use the A "wafer. In the production information shown in FIG. 17, when the wafer having the wafer ID “A-00001” is used, the number of normal dies and the number of defective dies are totaled, and 10000 dies 108 are used. Therefore, the number of samples acquired from the production information at this point is 10000.

In step S23, the central control device 141 compares the number of samples acquired from the production information with the number of switching designated by the user. For example, the number of switchings set by the user is “50000”. The integrated control device 141 does not reach the number of dies 108 used, that is, the number of samples of 50000, until all dies 108 of the fifth wafer (wafer ID is “A-00005”) are used. Here, “use” includes the case where a normal die is attached to the circuit board CB, and the inspected defective die. Therefore, the integrated control device 141 has a smaller number of samples than the switching number until all dies 108 of the wafer of wafer ID “A-00005” are used (step S23: “YES”). Execute the process That is, the central control device 141 sets the value specified by the user as the error rate and performs the optimization process based on the error rate until the number of samples becomes larger than the number of switching.

On the other hand, if all the dies 108 of the wafer with wafer ID “A-00005” are used and the number of samples becomes larger than the switching number (step S23: “NO”), the integrated control device 141 performs the process from step S27. Run. That is, when the number of samples is larger than the number of switchings, the central control device 141 sets the value calculated based on the production information as an error rate, and performs optimization processing based on the error rate. Note that the processing contents of step S25 to step S39 after step S23 shown in FIG. 16 are the same as the processing of step S3 to step S14 shown in FIG.

According to the second embodiment described above in detail, the following effects can be obtained.
<Effects> The central control unit 141 sets the value specified by the user as an error rate and performs optimization processing based on the error rate until the number of samples increases compared to the number of switches set by the user. In addition, when the number of samples is larger than the number of switchings, the general control device 141 sets a value calculated based on the production information as an error rate, and performs an optimization process based on the error rate. Thus, according to the general control device 141, the error rate can be changed at an appropriate timing after the production information is accumulated up to the desired switching number (the number of samples) determined by the user based on the operation status and the like. It becomes possible.

Third Embodiment
Next, a third embodiment of the present invention will be described. FIG. 18 is a flowchart of the optimization process in the third embodiment. The difference between the first embodiment described above and the flowchart shown in FIG. 6 is that, as the first point, processing using a wafer map is added. The second difference is that the estimated time required to supply the die 108 is determined depending on which position on the wafer the die 108 is picked up from. In the following description, the description of the same contents as the processing shown in the flowchart of FIG. 6 of the first embodiment is appropriately omitted.

First, when producing a substrate based on a production job, the general control device 141 specifies a wafer to be used in a production job of a production plan (step S41 in FIG. 18). The general control device 141 specifies the electronic component placement machine 17 which places the die 108 on the circuit board CB when producing a substrate, for example, based on the content of the production job. Then, the general control device 141 searches for an ID of a wafer scheduled to be used in production of a substrate among the wafers held by the specified electronic component mounting machine 17. The central control unit 141 determines whether there is a wafer map corresponding to the wafer ID as the search result (step S43). Here, the wafer map referred to here is, for example, data indicating the result of inspection of non-defective product and defective product for each die 108 in the die assembly 106 in the wafer manufacturing process, as the arrangement of the die 108 is there. That is, it is data indicating which position of the die assembly 106 the defective die is disposed. In addition, the general control device 141 may execute processing for inquiring the electronic component mounting machine 17 about the ID of the wafer to be used appropriately, without managing the wafer IDs held by the electronic component mounting machine 17 collectively.

At step S43, if there is a wafer map corresponding to the wafer ID to be used (step S43: "YES"), central controller 141 calculates an error rate based on the data of the wafer map (step S45). . The central control unit 141 analyzes the wafer map to detect the number of normal dies and the number of defective dies, and calculates an error rate from the detection result. The general control device 141 notifies the electronic component mounting machine 17 of the error rate of the calculation result. The control device 130 of the electronic component mounting machine 17 having received the notification calculates the estimated component supply time based on the error rate (step S53).

In addition, for wafers for which there is no corresponding wafer map among the wafers scheduled to be used in the production plan, the general control unit 141 determines the error rate by the user (step S49) or the error rate based on the production information (step S51). Perform processing using In addition, since the processing content of step S47-step S53 shown in FIG. 18 is the same as the processing to step S1-step S6 shown in FIG. 6, description here is abbreviate | omitted.

Next, the control device 130 is based on which position on the wafer the die 108 should be picked up as a pretreatment for processing whether or not supply waiting has occurred (step S59) based on the calculated estimated component supply time. The estimated time required to supply the die 108 is recalculated (step S55, step S57). Here, in the operation of picking up the die 108, the wafer type feeding device 82 receives the die 108 adsorbed by the suction nozzle of the pickup head 88 (see FIG. 4) by the shuttle mechanism 92 (see FIG. 3) Transport to At this time, the estimated time required for the pickup head 88 to move increases or decreases depending on the position of the die 108 to be picked up in the die assembly 106 on the dicing sheet. This is because the die 108 of the wafer type feeding apparatus 82 differs from the electronic component 77 of the tape feeder 74 of the tape type feeding apparatus 81, and the position of the component to be picked up changes from time to time. On the other hand, in step S55, the controller 130 according to the present embodiment starts the die from any position on the wafer based on, for example, the number of dies 108 scheduled to be used in the production plan and the wafer to be used (wafer ID). It is determined whether 108 is to be picked up. The controller 130 determines the pick-up position based on the arrangement of the dies 108 on the dicing sheet, the order in which the dies 108 are picked up from the die assembly 106, the position of the dies 108 to be used, and the like.

Control device 130 corrects the operation time at the time of suction based on the position of the pickup determined in step S55 (step S57). For example, the control device 130 sets the delay time that occurs in the movement of the pickup head 88 for each position of the pickup, and estimates the “required time for supply considering the error rate” of each mounting sequence Seq1 to Seq10 shown in FIG. Correct the time. In the processing contents in steps S55 and S57, the position of the pickup is individually specified, and the estimated required supply time is corrected by the movement time of the pickup head 88 according to the position, but the present invention is not limited thereto. For example, the center of the die assembly 106 on the dicing sheet is used as the position of all the pickups to set an average value of delay times for movement, and the average supply time is used to correct the estimated required supply time for each wafer. You may In each of the above embodiments, the pickup head 88 picks up the die 108. However, for example, the suction nozzle 50 of the mounting head 28 may directly suction the die 108 on the dicing sheet. In this case, for example, the time for which the mounting head 28 moves to pick up the die 108 is corrected according to the position of the pickup. In addition, the correction process according to the position of the component to be adsorbed is not limited to the wafer type supply device 82, but another supply device in which the position to adsorb the component is displaced, for example, electronic components regularly arranged on the tray The present invention may be applied to a tray type feeding device for feeding

Then, the control device 130 determines the supply waiting using the estimated required supply time corrected according to the position of the pickup (step S59). Note that the processing contents of step S59 to step S67 shown in FIG. 18 are the same as the processing of step S7 to step S14 shown in FIG.

According to the third embodiment described above in detail, the following effects can be obtained.
<Effect 1> If there is a wafer map corresponding to the ID of a wafer used for substrate production (step S43: "YES"), the general control device 141 of the present embodiment is based on the data of the wafer map Calculate the error rate. As a result, the general control device 141 can perform processing using a more accurate error rate on wafers for which wafer maps are available in advance.

<Effect 2> The control device 130 recalculates the estimated time required to supply the die 108 depending on which position on the wafer the die 108 is picked up from (step S55, step S57). The control device 130 sets the delay time that occurs in the movement of the pickup head 88 for each position of the pickup, and estimates the "required supply time considering error rate" of each mounting sequence Seq1 to Seq10 shown in FIG. to correct. As a result, the control device 130 can perform the optimization of the mounting order adapted to the mode of the operation in which the pickup head 88 actually picks up the die 108.

Fourth Embodiment
Next, a fourth embodiment of the present invention will be described. FIG. 19 is a flowchart of a process for determining the number of remaining parts in the fourth embodiment. The general control device 141 and the electronic component mounting device 12 notify the user of a request for replenishment when the remaining number of the dies 108 of the wafer provided to each of the wafer type supply devices 82 decreases. Is common. The remaining number of dies 108 required for this processing is a more appropriate value for the number of remaining normal dies excluding defective dies in the die assembly 106 left on the dicing sheet. Therefore, the system 10 according to the present embodiment calculates the more accurate number of remaining dies 108 using the error rate, and changes the timing for notifying the user of the replenishment. In the following description, as an example, a case where the control device 130 of the electronic component placement machine 17 determines the timing of replenishment will be described. In addition, since it becomes the same process about the case where the other apparatuses (general control device 141 grade | etc.,) Of the control apparatus 130 implement, description here is abbreviate | omitted.

First, in step S71 shown in FIG. 19, the control device 130 calculates the remaining number of parts without considering the number of defective dies. The control device 130, for example, inquires of the general control device 141 about the remaining number of data corresponding to the ID of the supplied wafer at the timing when the wafer is supplied to the wafer type supply device 82, and receives it from the general control device 141. The data of the remaining number of parts is associated with the wafer ID. Alternatively, control device 130 searches whether data of the corresponding remaining number of parts is stored in memory 135 (see FIG. 5). Next, the control device 130 determines whether or not there is a wafer map for the wafer for which the remaining number of parts is set (step S73). The control device 130 executes, for example, a process of inquiring the general control device 141 about data of the corresponding wafer map.

If there is no corresponding wafer map (step S73: "NO"), the control device 130 determines whether or not the user has specified an error rate for the wafer for which the remaining number of parts has been set (step S75). When the error rate is designated by the user (step S75: "YES"), the control device 130 sets the designated value as the error rate (step S79). Further, when the error rate is not specified by the user (step S75: “NO”), the control device 130 sets the value calculated based on the data of the same wafer type of the production information as the error rate (step S81). Then, control device 130 corrects the remaining number of components using the error rate determined in step S79 or step S81 (step S83).

For example, the component remaining number after correction is expressed by the following equation.
Number of remaining parts after correction = Number of remaining parts after setting * (100-error rate)
Assuming that the set number of remaining parts is 1000 and the error rate is 5%, the number of remaining parts after correction is 950. As a result, the control device 130 can set the correct number of remaining parts in consideration of the error rate.

Further, when there is a corresponding wafer map (step S 73: “YES”), control device 130 analyzes the wafer map to detect a normal die, and uses the detected number of normal dies as the number of parts after correction. It sets (step S77). Then, for example, each time the die 108 is supplied from the wafer type supply device 82 to the mounting head 28 during production of a substrate, the control device 130 subtracts one from the set remaining number of parts after correction and subtracts it. When the later value reaches a preset threshold, the user is notified of wafer replenishment.

According to the fourth embodiment described above in detail, the following effects can be obtained.
<Effect 1> The control device 130 corrects the remaining number of components of the die 108 of the wafer provided to the wafer type supply device 82 based on the error rate (step S83). Then, the control device 130 determines the timing for supplying the wafer to the wafer type supply device 82 using the corrected remaining number of parts. As a result, since the control device 130 corrects the remaining number of parts using the error rate, it is possible to use a more accurate number of remaining parts excluding the number of defective dies from among the predetermined number of remaining parts. . Therefore, the control device 130 can notify the user of the wafer supply to the wafer type supply device 82 at a more appropriate timing, since the controller 130 determines the remaining number of components using a more accurate value.

The present invention is not limited to the above embodiments, and it goes without saying that various improvements and changes can be made without departing from the spirit of the present invention. For example, the timing at which the error rate is calculated in each of the above embodiments is an example, and can be changed as appropriate. For example, in the second embodiment, the general control device 141 compares the number of parts (the number of samples) used for production with the number of switches preset by the user, and calculates the error rate from the production information. Although determined, it is not limited to this. For example, the general control device 141 may set the number of substrates to be produced in advance as a switching number by the user, and calculate the error rate when production is completed for the number of substrates. Alternatively, the general control device 141 may be configured to set the timing at which a predetermined time has elapsed since the start of production of the substrate as the timing for calculating the error rate.

In each of the above embodiments, although not particularly mentioned, for example, the controller 130 is an image of the parts camera 46 when the suction position is largely shifted in the suction operation of the die 108 by the suction nozzle 50 of the mounting head 28 From the data, it may be set to discard the adsorbed die 108 by determining that the die 108 can not be mounted. In this case, even if the die is normal, it may be discarded depending on the quality of the suction position, and the mounting head 28 needs to pick up the die 108 again. If such a shift in the suction position occurs in an arbitrary mounting sequence, a delay occurs at the start of the next mounting sequence, as in the case of the defective die. On the other hand, when a component (such as the die 108 or the electronic component 77) is discarded due to the displacement of the mounting position, and the operation of picking up the same component again occurs, the mounting sequence is replaced and optimized. It is also good. According to such a system 10, it is possible to process and cope with the optimization even when the waiting operation occurs due to the discarding operation.

In each of the above-described embodiments, the electronic component mounting apparatus 17 having a width twice as large as that of the electronic component mounting apparatus 16 in the X direction includes the wafer type supply device 82 and the tape type supply device 81. The machine 16 may include a wafer type feeder 82 and a tape type feeder 81. In each of the above-described embodiments, the electronic component mounting apparatus 12 and the electronic component mounting machines 16 and 17 are other types of supply devices of the tape type supply device 81 and the wafer type supply device 82, for example, tray type supply devices. You may have. In this case, it is preferable that the system 10 implement the optimization of the mounting order including the tray type supply device. In each of the above embodiments, the electronic component mounting apparatus 17 may be configured to include the plurality of wafer type supply devices 82, and the optimization of the mounting order of the plurality of wafer type supply devices 82 may be performed.

Further, in the above embodiments, in the operation of picking up the die 108, the die 108 adsorbed by the suction nozzle of the pickup head 88 of the wafer type supply device 82 is received by the shuttle mechanism 92 and transferred to a predetermined supply position. The position is configured to be delivered to the suction nozzle 50 of the mounting head 28, but is not limited to this configuration. For example, the suction head of the pick-up head 88 of the wafer type supply device 82 may be turned upside down so that the die 108 faces upward and delivered to the suction nozzle 50 of the mounting head 28. Further, for example, the die 108 on the dicing sheet may be directly suctioned by the suction nozzle 50 of the mounting head 28. In this case, the mounting head 28 functions as a part of the die supply unit in the present application.

Incidentally, the general control device 141 and the control device 130 of the electronic component placement machine 17 are an example of a control unit. The wafer type supply device 82 is an example of a die supply unit. The die 108 and the electronic component 77 are examples of components. The tape-type supply device 81 is an example of a component supply unit. The time to accumulate the past production information in the first embodiment, or the accumulation time of the production information according to the switching number in the second embodiment is an example of a predetermined period during production of the circuit board. The value input by the user is an example of data related to a defective die included in the wafer.

DESCRIPTION OF SYMBOLS 10 10 board | substrate operation | work system (system) 16, 17 electronic component mounting machine, 77 electronic component, 81 tape type supply apparatus, 82 wafer type supply apparatus, 108 die, 141 integrated control apparatus, Seq1-Seq10 mounting sequence, CB circuit board , M1 to M5 modules.

Claims (4)

A die supply unit for supplying a die for mounting a mounting head to a circuit board from a diced wafer to a supply position for the mounting head to adsorb the die;
An estimated required time for the die supply unit to supply the die to the supply position; a number of defective dies that the die supply unit attempted to supply within a predetermined period of time during production of a plurality of the circuit boards; A control unit that corrects an estimated required supply time of the die mounted on the circuit board based on an error occurrence rate determined based on at least one of data relating to a defective die included in the wafer;
A substrate handling system comprising: The data relating to the defective die is a wafer map showing the position of the defective die in the wafer,
The system according to claim 1, wherein the control unit determines the error occurrence rate based on the wafer map. The said board | substrate operation | work system of Claim 1 or Claim 2 characterized by the said control part correct | amending the said estimated required supply time according to the position which picks up the said die | dye in the said wafer. The control unit calculates the remaining number of the dies of the wafer to be supplied to the die supply unit based on the error occurrence rate, and the timing at which the wafer is supplied to the die supply unit based on the calculation result The substrate-to-board operation system according to any one of claims 1 to 3, which is to be determined.

Images