WO2009060705A1 - Electric circuit parts mounting method and system - Google Patents

Electric circuit parts mounting method and system Download PDF

Info

Publication number
WO2009060705A1
WO2009060705A1 PCT/JP2008/068865 JP2008068865W WO2009060705A1 WO 2009060705 A1 WO2009060705 A1 WO 2009060705A1 JP 2008068865 W JP2008068865 W JP 2008068865W WO 2009060705 A1 WO2009060705 A1 WO 2009060705A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting
parts
substrate
face
electric circuit
Prior art date
Application number
PCT/JP2008/068865
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroyuki Ao
Original Assignee
Fuji Machine Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Mfg. Co., Ltd. filed Critical Fuji Machine Mfg. Co., Ltd.
Priority to JP2009540000A priority Critical patent/JP5308345B2/en
Priority to CN2008801150808A priority patent/CN101855956B/en
Publication of WO2009060705A1 publication Critical patent/WO2009060705A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)

Abstract

Provided is an electric circuit parts mounting system, which is constituted by arranging a plurality of mounting modules (2) having substrate conveyors of three lanes, and which is suited for producing double-sided mounting substrates extremely different in the number of mounted parts between the surface and the back. The not-shown parts mounting device for receiving parts from a parts feeding device (26) and mounting them can be mounted on a substrate (6), too, which is held on any of substrate conveyors (10, 12 and 14). The mounting on such a face (6b) of the substrate (6) as has the mounted parts of a small number is performed every time on the substrate conveyor (14), whereas the mounting on a face (6f) having the mounted parts of a large number is performed every other time on each of the substrate conveyors (10 and 12). In the working operation of one cycle, the parts mounting device can perform the mounting operation on each of the face (6f) and the face (6b) can be performed without any waiting time for delivering in and out the substrate (6) and for setting it, and the mounting operations on the surface and the back of the double-sided mounting substrates of a desired number can be substantially simultaneously completed.
PCT/JP2008/068865 2007-11-09 2008-10-17 Electric circuit parts mounting method and system WO2009060705A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009540000A JP5308345B2 (en) 2007-11-09 2008-10-17 Electrical circuit component mounting method and system
CN2008801150808A CN101855956B (en) 2007-11-09 2008-10-17 Electric circuit parts mounting method and system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007292099 2007-11-09
JP2007-292099 2007-11-09

Publications (1)

Publication Number Publication Date
WO2009060705A1 true WO2009060705A1 (en) 2009-05-14

Family

ID=40625605

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068865 WO2009060705A1 (en) 2007-11-09 2008-10-17 Electric circuit parts mounting method and system

Country Status (3)

Country Link
JP (1) JP5308345B2 (en)
CN (2) CN101855956B (en)
WO (1) WO2009060705A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200475A (en) * 2008-01-23 2009-09-03 Panasonic Corp Method of determining mounting condition
JP2009218572A (en) * 2008-02-15 2009-09-24 Panasonic Corp Mounting condition determining method
US8315728B2 (en) 2008-01-23 2012-11-20 Panasonic Corporation Component mounting condition determination method
WO2016021042A1 (en) * 2014-08-08 2016-02-11 富士機械製造株式会社 Substrate production method and substrate production condition determination method
WO2016038730A1 (en) * 2014-09-12 2016-03-17 富士機械製造株式会社 Substrate work device and substrate work system
JPWO2015193975A1 (en) * 2014-06-17 2017-04-20 富士機械製造株式会社 Electronic component mounting method and electronic component mounting system
JP2017135296A (en) * 2016-01-29 2017-08-03 富士機械製造株式会社 Board production method and condition determination method of board production
JP2019054276A (en) * 2018-11-28 2019-04-04 株式会社Ｆｕｊｉ Control device for electronic component attaching system
WO2019186925A1 (en) * 2018-03-29 2019-10-03 平田機工株式会社 Working system and work method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5480776B2 (en) * 2010-11-02 2014-04-23 ヤマハ発動機株式会社 Mounting mode determination method and component mounting system
JP5780905B2 (en) * 2011-09-28 2015-09-16 富士機械製造株式会社 Board work system
JP6277424B2 (en) * 2014-09-17 2018-02-14 パナソニックＩｐマネジメント株式会社 Component mounting apparatus and component mounting method
JP7142203B2 (en) * 2017-12-06 2022-09-27 パナソニックＩｐマネジメント株式会社 COMPONENT MOUNTING SYSTEM, COMPONENT MOUNTING DEVICE, AND BOARD CONVEYING METHOD
WO2019116530A1 (en) * 2017-12-15 2019-06-20 ヤマハ発動機株式会社 Component mounting system and component mounting method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243896A (en) * 2002-02-18 2003-08-29 Fuji Mach Mfg Co Ltd Electronic circuit component mounting device
JP2004031613A (en) * 2002-06-25 2004-01-29 Fuji Mach Mfg Co Ltd Substrate transportation apparatus of electronic component mounting apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391039B2 (en) * 1993-02-23 2003-03-31 松下電器産業株式会社 Mounting board production system
JP2001068898A (en) * 1999-08-26 2001-03-16 Matsushita Electric Ind Co Ltd Electronic part mounting equipment
KR100750413B1 (en) * 1999-12-16 2007-08-21 지멘스 악티엔게젤샤프트 Assembly device comprising several transport lines for substrates to be assembled
CN1250063C (en) * 2000-08-22 2006-04-05 松下电器产业株式会社 Device for mounting parts and its method
CN100508721C (en) * 2002-06-25 2009-07-01 富士机械制造株式会社 Substrate operating system
JP2004128400A (en) * 2002-10-07 2004-04-22 Fuji Mach Mfg Co Ltd Component mounting apparatus, program for controlling operation of the same apparatus, and component mounting system
JP4260721B2 (en) * 2004-10-29 2009-04-30 富士通株式会社 Electronic component board mounting method and board mounting apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243896A (en) * 2002-02-18 2003-08-29 Fuji Mach Mfg Co Ltd Electronic circuit component mounting device
JP2004031613A (en) * 2002-06-25 2004-01-29 Fuji Mach Mfg Co Ltd Substrate transportation apparatus of electronic component mounting apparatus

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8315728B2 (en) 2008-01-23 2012-11-20 Panasonic Corporation Component mounting condition determination method
JP2009200475A (en) * 2008-01-23 2009-09-03 Panasonic Corp Method of determining mounting condition
JP2009218572A (en) * 2008-02-15 2009-09-24 Panasonic Corp Mounting condition determining method
US10667448B2 (en) 2014-06-17 2020-05-26 Fuji Corporation Electronic component mounting method
JPWO2015193975A1 (en) * 2014-06-17 2017-04-20 富士機械製造株式会社 Electronic component mounting method and electronic component mounting system
WO2016021042A1 (en) * 2014-08-08 2016-02-11 富士機械製造株式会社 Substrate production method and substrate production condition determination method
JPWO2016021042A1 (en) * 2014-08-08 2017-05-25 富士機械製造株式会社 Substrate production method and substrate production condition determination method
WO2016038730A1 (en) * 2014-09-12 2016-03-17 富士機械製造株式会社 Substrate work device and substrate work system
US10181250B2 (en) 2014-09-12 2019-01-15 Fuji Corporation Board work device and board work system
JPWO2016038730A1 (en) * 2014-09-12 2017-06-22 富士機械製造株式会社 Anti-substrate work apparatus and anti-substrate operation system
JP2017135296A (en) * 2016-01-29 2017-08-03 富士機械製造株式会社 Board production method and condition determination method of board production
WO2019186925A1 (en) * 2018-03-29 2019-10-03 平田機工株式会社 Working system and work method
JPWO2019186925A1 (en) * 2018-03-29 2021-05-27 平田機工株式会社 Work system and work method
US11351639B2 (en) 2018-03-29 2022-06-07 Hirata Corporation Working system and work method
JP7114692B2 (en) 2018-03-29 2022-08-08 平田機工株式会社 Work system and work method
JP2019054276A (en) * 2018-11-28 2019-04-04 株式会社Ｆｕｊｉ Control device for electronic component attaching system
JP7018379B2 (en) 2018-11-28 2022-02-10 株式会社Fuji Control device for electronic component mounting system

Also Published As

Publication number Publication date
CN101855956B (en) 2013-02-13
JP5308345B2 (en) 2013-10-09
CN101855956A (en) 2010-10-06
JPWO2009060705A1 (en) 2011-03-24
CN102510718B (en) 2015-07-01
CN102510718A (en) 2012-06-20

Similar Documents

Publication Publication Date Title
WO2009060705A1 (en) Electric circuit parts mounting method and system
TW201130074A (en) Process module, substrate processing apparatus, and method of transferring substrate
MY146842A (en) Supply mechanism for the chuck of an integrated circuit dicing device
ATE500176T1 (en) DEVICE AND METHOD FOR UNSTACKING PLATE-SHAPED PARTS
TW200612502A (en) Method and apparatus for mounting semiconductor chips
GB0616458D0 (en) Metering apparatus with independent tool drive means
TW200505593A (en) Electronic-component conveying device
WO2011029817A3 (en) Magazine, charging station, and processing device for connecting elements, and method for feeding connecting elements to the processing device and to the magazine
WO2010150971A2 (en) Apparatus for coupling a module circuit board and a frame together, and backlight using same
HK1144235A1 (en) Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
EP2226700A3 (en) Clock supply method and information processing apparatus
TW200943464A (en) Substrate treating apparatus
WO2007027401A3 (en) Systems and methods for depositing conductive material into openings in microfeature workpieces
MX2010002420A (en) Solar battery module transfer line.
WO2009004977A1 (en) Substrate treatment apparatus, substrate treatment method and storage medium
CN102160162A (en) Component mounting apparatus and component mounting method
MY174601A (en) Taping apparatus and taping method using the same
KR20130051254A (en) Multiplication system of flip chip mounters
AU2001289976A1 (en) Testing system in a circuit boardmanufacturing line for automatic testing of circuit boards
CN104869797A (en) Component mounting line and component mounting method
SG161153A1 (en) Substrate processing apparatus and cleaning method of the same
WO2006113224A3 (en) Apparatus and method for handling short run quick changeover fabrication jobs
JP2008010841A5 (en)
WO2009063800A1 (en) Electronic circuit manufacturing system and electronic circuit manufacturing method
TW200707626A (en) Method and device for displacing a group of components ordered in a matrix structure

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880115080.8

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08846789

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009540000

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08846789

Country of ref document: EP

Kind code of ref document: A1