WO2009063800A1 - Electronic circuit manufacturing system and electronic circuit manufacturing method - Google Patents

Electronic circuit manufacturing system and electronic circuit manufacturing method Download PDF

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Publication number
WO2009063800A1
WO2009063800A1 PCT/JP2008/070269 JP2008070269W WO2009063800A1 WO 2009063800 A1 WO2009063800 A1 WO 2009063800A1 JP 2008070269 W JP2008070269 W JP 2008070269W WO 2009063800 A1 WO2009063800 A1 WO 2009063800A1
Authority
WO
WIPO (PCT)
Prior art keywords
transfer
electronic circuit
circuit manufacturing
lane
transfer lane
Prior art date
Application number
PCT/JP2008/070269
Other languages
French (fr)
Japanese (ja)
Inventor
Shinsuke Suhara
Original Assignee
Fuji Machine Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Mfg. Co., Ltd. filed Critical Fuji Machine Mfg. Co., Ltd.
Priority to CN2008801125384A priority Critical patent/CN101836523B/en
Publication of WO2009063800A1 publication Critical patent/WO2009063800A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Provided are an electronic circuit manufacturing system and an electronic circuit manufacturing method by which throughput can be improved for even printed boards having different number of mounting component items. In the electronic circuit manufacturing system, a first transfer lane (15) is composed of one transfer apparatus (12) of each electronic component mounting apparatus (10), and a second transfer lane (16) is composed of the other transfer apparatus (13) of the electronic component mounting apparatus (10). The electronic circuit manufacturing system is provided with a substrate carry-in section (21), which is arranged at the upstream ends of the first transfer lane (15) and the second transfer lane (16) for carrying a printed substrate (1) to the first transfer lane (15) and the second transfer lane (16); an intermediate substrate carry-in section (26), which is arranged at a certain position in the second transfer lane (16) for carrying the printed board (1) to the second transfer lane (16); and a transfer lane changing section (30), which is arranged adjacent to the intermediate substrate carry-in section (26) in upstream and can transfer the printed substrate (1) in the second transfer lane (16) by changing the lane to the first transfer lane (15).
PCT/JP2008/070269 2007-11-16 2008-11-07 Electronic circuit manufacturing system and electronic circuit manufacturing method WO2009063800A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008801125384A CN101836523B (en) 2007-11-16 2008-11-07 Electronic circuit manufacturing system and electronic circuit manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007298190A JP5020030B2 (en) 2007-11-16 2007-11-16 Electronic circuit production system and electronic circuit production method
JP2007-298190 2007-11-16

Publications (1)

Publication Number Publication Date
WO2009063800A1 true WO2009063800A1 (en) 2009-05-22

Family

ID=40638650

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070269 WO2009063800A1 (en) 2007-11-16 2008-11-07 Electronic circuit manufacturing system and electronic circuit manufacturing method

Country Status (3)

Country Link
JP (1) JP5020030B2 (en)
CN (1) CN101836523B (en)
WO (1) WO2009063800A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5717538B2 (en) * 2011-05-19 2015-05-13 富士機械製造株式会社 PCB production system
JP5863413B2 (en) * 2011-11-24 2016-02-16 富士機械製造株式会社 Parts mounting line
CN106538090B (en) * 2014-08-06 2019-12-10 株式会社富士 substrate working device
JP6277091B2 (en) * 2014-08-29 2018-02-07 ヤマハ発動機株式会社 Component mounting system
CN106817848A (en) * 2017-02-28 2017-06-09 厦门弘信电子科技股份有限公司 The biserial double-manipulator automatic silk screen printing solidification production method of FPC

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62277800A (en) * 1986-05-26 1987-12-02 イビデン株式会社 Automatic manufacturing apparatus for electronic parts mounting board
JP2007116021A (en) * 2005-10-24 2007-05-10 Matsushita Electric Ind Co Ltd Device and method for mounting electronic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62277800A (en) * 1986-05-26 1987-12-02 イビデン株式会社 Automatic manufacturing apparatus for electronic parts mounting board
JP2007116021A (en) * 2005-10-24 2007-05-10 Matsushita Electric Ind Co Ltd Device and method for mounting electronic component

Also Published As

Publication number Publication date
JP5020030B2 (en) 2012-09-05
JP2009124031A (en) 2009-06-04
CN101836523B (en) 2012-03-21
CN101836523A (en) 2010-09-15

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