JP2012124341A - Component mounting method and component mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To notify the timing when a setup change is efficiently performed to prevent the deterioration of operation efficiency of a mounting line.SOLUTION: A mounting line includes: a setup change time acquisition step which acquires a time for changing a setup so that a target device 131 that is any one of component mounting devices 101 can mount a second substrate 202 when switching from a first substrate 201 to the second substrate 202; an arrival time acquisition step which acquires a time from when a device upstream of a mounting line compared with the target device 131 in the component mounting devices 101 starts a processing for the second substrate 202 to when the second substrate is arrived to the target device 131; a specification step which specifies a device in the component mounting devices 101 as a specific device 132 handling a case when the arrival time of the second substrate 202 is more than the setup time; and a notification step which notifies start information for the setup change of the target device 131 when the second substrate 202 is transported to the specific device 132.

Description

  The present invention relates to a component mounting system and a component mounting method applied to the component mounting system, and in particular, it is possible to efficiently perform a setup change that occurs when a mounting target is switched from one board to another board of a different type. The present invention relates to a component mounting system and a component mounting method.

  Conventionally, in a mounting line in which a plurality of component mounting devices are connected in-line and each component mounting device shares a role to mount a component on a substrate, the type of substrate currently mounted is changed to another type of substrate. When switching, after completing the mounting of all types of boards that are currently mounted, the component mounting apparatuses are replaced so that components can be mounted on the new types of boards.

  However, if the setup change method is used, the operation on the mounting line is completely stopped, and then the component mounting equipment included in the mounting line is changed. There is a problem that the operating efficiency of the line deteriorates.

  Therefore, in synchronization with the operation of transporting the final board of the type of board currently mounted from the component mounting apparatus to the next component mounting apparatus, the next component mounting apparatus downstream from the position where the final board exists Japanese Patent Application Laid-Open No. H10-228688 discloses a technique for sequentially transmitting a setup change start signal.

  According to Patent Document 1, by adopting this method, the component mounting apparatus that has received the setup change start signal can determine that the board transported at that time is the final board of the same type of board, It is described that a component can be individually replaced for a component mounting apparatus that has finished mounting the final board without completely stopping the operation of the mounting line.

JP-A-5-177473

  However, in the component mounting method, it is necessary to recognize that the mounted board is the final board in the type of the board. However, in the case where the mounting board is produced by a plurality of mounting lines, such a type is used. In many cases, it is difficult to determine whether the substrate is the final substrate.

  Even if the final board can be recognized, a new board is transported until just before the component mounting apparatus in order to start setup change of the corresponding component mounting apparatus after receiving the setup change start signal and carrying out the final board. However, it is not possible to mount a new type of board until the setup change operation is completed, and at least the component mounting machine upstream is in a waiting state. Therefore, it is difficult to greatly improve the decrease in the operating efficiency of the mounting line.

  The present invention has been made in view of the above problems, and can change the mounting line when switching the mounting target from one type of board to another type of board at a suitable timing. It is an object of the present invention to provide a component mounting method and a component mounting system capable of greatly improving the decrease in operating efficiency due to the above.

  In order to achieve the above object, a component mounting method according to the present invention is a type of a substrate to be mounted in a mounting line in which a plurality of component mounting apparatuses are connected in-line and components are mounted on the substrate. When switching from one board to another type of second board, the setup is the time required for the setup change so that the second board can be mounted on the device of interest which is one of the component mounting apparatuses. A setup time acquisition step for acquiring time, and a time from when the component mounting apparatus upstream of the target apparatus starts processing of the second board until the second board reaches the target apparatus. An arrival time acquisition step acquired as, a specification step of specifying the component mounting device corresponding to the arrival time exceeding the setup time as a specification device, and the specification device When serial second substrate is conveyed, it is characterized by comprising a notification step of notifying the start information of a tooling change of the interest device.

  According to this, it is possible to carry out the setup change of the component mounting apparatus which is the target apparatus until the second board reaches the target apparatus, and the second board can be mounted on the target apparatus without generating a waiting time. It can be implemented. Therefore, it is possible to suppress a decrease in the operating efficiency of the mounting line that occurs due to the setup change.

  In addition, the first required time acquisition that acquires the longest time among the time required for each of the component mounting apparatuses existing upstream from the target apparatus to process the second substrate as the first required time. The arrival time acquisition step may include a product obtained by multiplying the number of the component mounting devices upstream of the target device by the first required time as the arrival time.

  According to this, it is possible to easily obtain the arrival time by analogy.

  Furthermore, the longest time of the time required for the target device and each component mounting device existing downstream from the target device to process the first board is set as the second required time. A second required time acquisition step of acquiring, wherein the arrival time acquisition step is the longer of the first required time and the second required time in the number of the component mounting devices upstream of the device of interest. A product obtained by multiplying the two directions may be acquired as the arrival time.

  According to this, even when there is a difference in the time required for the mounting process between the first board and the second board, such as when the number of parts to be mounted is significantly different, the start timing of the setup change is properly handled. It is possible to notify a person or the like.

  Further, when the first board remains in the component mounting apparatus upstream of the target apparatus when the second board is transported to the specific apparatus, the remaining first board is replaced with another one. A moving step for moving to the mounting line may be included.

  According to this, it is not necessary to coexist the state in which the component can be mounted on the first substrate and the state in which the component can be mounted on the second substrate in the target device, and the reduction in operating efficiency of the mounting line is suppressed as much as possible. Is possible.

  The setup time acquisition step includes an exchange unit that is replaceably attached to the target device in a state where components can be mounted on the first board, and an exchange unit that is replaceably attached to the target device in a state where components can be mounted on the second board. May be obtained, and the setup time may be acquired based on the setup time database storing the individual time that is the required setup time for each switching unit and the difference.

  According to this, even when any type of second substrate is mounted after the first substrate, it is possible to appropriately notify the timing of the setup change.

  In order to achieve the above object, a component mounting system according to the present invention is a component mounting system in which a plurality of component mounting apparatuses are connected in-line to mount a component on a substrate, and the component mounting system is a component mounting system. When switching from the first board of the type to the second board of the other type, the changeover is made so that the device of interest, which is one of the component mounting apparatuses, can be mounted on the second board. A setup time acquisition unit that acquires a setup time, which is a required time, and the component mounting apparatus that is upstream from the target apparatus until the second board reaches the target apparatus after the processing of the second board is started. An arrival time acquisition unit that acquires the time as an arrival time, a specification unit that specifies the component mounting device corresponding to the arrival time exceeding the setup time as a specification device, When the second substrate is transported, characterized in that it comprises a notification unit for notifying the start information of a tooling change of the interest device.

  According to this, it is possible to carry out the setup change of the component mounting apparatus which is the target apparatus until the second board reaches the target apparatus, and the second board can be mounted on the target apparatus without generating a waiting time. It can be implemented. Therefore, it is possible to suppress a decrease in the operating efficiency of the mounting line that occurs due to the setup change.

  It should be noted that execution of a program for causing a computer to execute each step (processing) included in the component mounting method also corresponds to the implementation of the present invention. Of course, implementing the recording medium in which the program is recorded also corresponds to the implementation of the present invention.

  According to the present invention, since it is possible to change the state of the apparatus of interest before the new board arrives and to be able to mount the new board, the operating efficiency of the mounting line that occurs when the board type is switched. Can be suppressed as much as possible.

FIG. 1 is a diagram schematically showing an outline of a component mounting system according to an embodiment of the present invention. FIG. 2 is a plan view schematically showing the main configuration of the component mounting apparatus. FIG. 3 is a block diagram showing the main functional configuration of the host control device. FIG. 4 is a diagram schematically illustrating the flow of the substrate in the first mounting line when switching from the first substrate to the second substrate. FIG. 5 shows the contents of the setup time database. FIG. 6 is a flowchart showing an outline of the component mounting method. FIG. 7 is a flowchart showing an outline of the component mounting method in the lane change mode.

  Next, an embodiment of a component mounting system and a component mounting method according to the present invention will be described with reference to the drawings. The following embodiments are merely examples of the component mounting system and the component mounting method according to the present invention. Accordingly, the scope of the present invention is defined by the wording of the claims with reference to the following embodiments, and is not limited to the following embodiments.

  FIG. 1 is a diagram schematically showing an outline of a component mounting system according to an embodiment of the present invention. In addition, the part enclosed with the broken line in the figure has shown the mounting line, and the upper side enclosed is made into the 1st mounting line 121, and the lower side is made into the 2nd mounting line 122. FIG.

  As shown in the figure, a component mounting system 100 is a system in which a plurality of component mounting apparatuses 101 are connected in-line and components are mounted on a substrate 200. For example, a pre-process for printing solder on the surface of a substrate 200 This is a system in which each component mounting apparatus 101 shares and mounts components on the substrate 200 to continuously produce the mounted substrate, and carries it out to the subsequent process.

  In the case of the present embodiment, the component mounting system 100 includes a plurality of component mounting devices 101 and a host control device 102 that controls them. The component mounting system 100 includes two mounting lines, a first mounting line 121 and a second mounting line 122.

  FIG. 2 is a plan view schematically showing the main configuration of the component mounting apparatus.

  The component mounting apparatus 101 shown in the figure includes two lanes 110 that can transport the board 200, and operates independently on the board 200 transported in any lane 110 to mount a component. A first facility 111 and a second facility 112 are provided. The first equipment 111 and the second equipment 112 are arranged to face each other with the board 200 to be mounted interposed therebetween, and a head 114 having a plurality of nozzles 113 for sucking components, and a plurality of types for mounting. A component supply unit 115 that holds components and supplies the components, and a nozzle station 116 that holds a replacement nozzle 113 are provided. Furthermore, the first facility 111 and the second facility 112 include a display device 155 that can display various types of information to the worker.

  The head 114 is a device that can freely move in the XY plane, includes a plurality of nozzles 113, and can suck and convey a plurality of components and mount the components at a predetermined mounting point.

  In FIG. 2, the head 114 includes eight nozzles 113, but the number of nozzles 113 included in the head 114 is not particularly limited. Further, the head 114 included in the first facility 111 and the head 114 included in the second facility 112 are not necessarily the same.

  The head 114 of the component mounting apparatus 101 can move mechanically independently in the XY plane, and any head 114 can mount a component on the board 200 on any lane 110. It has become. That is, it is possible to mount the second equipment 112 on the board 200 flowing in the lane 110 on the first equipment 111 side while performing the setup change work on the first equipment 111.

  However, the substrate 200 transported in the lane 110 on the side close to the first facility 111 is mounted on the components mainly by the head 114 provided in the first facility 111, and transported in the lane 110 on the side close to the second facility 112. The components 200 are mainly mounted by the head 114 provided in the second equipment 112.

  For example, a plurality of tape feeders and the like are attached to the component supply unit 115, and each tape feeder intermittently supplies different types of components or the same types of components. The component supply unit 115 is changed according to the type of the board 200 to be mounted, and a part of the tape feeder or the like can be replaced even when the component mounting apparatus 101 is performing a mounting operation. It is possible.

  The component mounting apparatus 101 according to the present embodiment may be configured such that the component arrangement pitch in the component supply unit 115 and the pitch of the nozzle 113 coincide with each other. When the alignment with 113 coincides, it is also possible to perform so-called simultaneous suction, in which a plurality of nozzles 113 are simultaneously lowered to suck a plurality of components at the same time.

  The lane 110 is a device that transports the loaded substrate 200 to the mounting stage, holds the substrate 200 on the mounting stage during mounting, and unloads the substrate 200 to the adjacent component mounting apparatus 101 when mounting is completed. For example, it is a conveyor provided with a pair of rails.

  In the present embodiment, the arrangement of the first equipment 111 that mainly mounts the substrate 200 transported in the lane 110 closer to the first equipment 111 is referred to as the first mounting line 121 and is close to the second equipment 112. The arrangement of the second equipment 112 that mainly mounts the board 200 conveyed in the lane 110 on the side is referred to as a second mounting line 122. Further, the first mounting line 121 and the second mounting line 122 may be collectively referred to as a mounting line.

  FIG. 3 is a block diagram showing the main functional configuration of the host control device.

  As shown in the figure, the host control apparatus 102 includes a setup time acquisition unit 151, an arrival time acquisition unit 152, a specification unit 153, and a notification unit 154 as functional units. Further, the host controller 102 includes a setup time database 156 (denoted as setup time DB in FIG. 3).

  As shown in FIG. 4, the setup time acquisition unit 151 switches the first board 201 that is one type of the board 200 to be mounted to the second board 202 that is another type. A target device 131 (in this embodiment, the component mounting device 101 on the rightmost side in FIG. 1 and FIG. 4 is used as the target device 131) that can be mounted on the second substrate 202. It is a processing unit that acquires a setup time that is a time required for the setup change.

  Here, “setup change” means that the component mounting apparatus 101 changes from a state in which the first substrate 201 can be mounted to a state in which the second substrate 202 can be mounted. That is, in order to mount components on the first substrate 201, the feeder A for supplying the component type A, the feeder B for supplying the component type B, and the feeder C for supplying the component type C to the component supply unit 115 of the apparatus 131 of interest. And are attached. On the other hand, in order to mount components on the second substrate 202, it is necessary to attach the feeder A, the feeder D that supplies the component type D, and the feeder E that supplies the component type E to the component supply unit 115 of the apparatus 131 of interest. . In this case, the setup change is an operation in which the common feeder A is left as it is, the feeder B is replaced with the feeder D, and the feeder C is replaced with the feeder E.

  In addition, the term “setup change” includes the following cases. That is, a feeder A and a feeder B of the same type as the feeder A are attached to the component supply unit 115 of the apparatus of interest 131, and there is one empty throttle. In order to mount components on the second substrate 202 with the device of interest 131, it is necessary to attach a feeder C, a feeder D, a feeder E, and a feeder F that supplies a component type F. The first substrate 201 remains upstream from the target device 131 at the time when the setup change for the target device 131 is started (state shown in FIG. 4). In this case, since it is necessary to complete the mounting of the first substrate 201, the setup change is an operation in which the feeder C is inserted into the empty throttle and only one of the two attached feeders A is replaced with the feeder D. is there.

  In this case, the components can be mounted on the first substrate 201 with the feeder A and the feeder B remaining in the component supply unit 115 of the apparatus 131 of interest. Since the feeder A attached to the component mounter 101 is reduced by one, the head 114 cannot simultaneously suck the component type A in the portion where the feeder A is reduced. Therefore, it is necessary for the head 114 to perform the operation of sucking from the feeder A twice, and the mounting efficiency is slightly reduced by the increase in the operation of the head 114. After mounting the remaining two first substrates 201, components are mounted on the second substrate 202 with the feeder C and the feeder D attached to the apparatus of interest 131, while the feeder A And feeder B may be replaced with feeder E and feeder F.

  As described above, the setup change includes a state in which a part of the component can be mounted on the second substrate 202.

  In addition, the method for acquiring the setup time is not particularly limited. For example, the setup time acquisition unit performs a setup change operation in a simulated manner, measures the time required for the operation, and inputs the value. 151 may be acquired.

  In addition, components can be mounted on the second substrate 202 and a replacement unit (not shown) such as a feeder that is replaceably attached to the component supply unit 115 or the like of the target device 131 in a state where components can be mounted on the first substrate 201. The setup time is extracted on the basis of the setup time database 156 in which the individual time, which is the required setup time for each exchange unit, is stored, and the difference. You may get

  FIG. 5 shows the contents of the setup time database.

  Here, the setup time database 156 refers to the attachment time to the target device 131 of the replacement unit that is detachably attached to the target device 131 so as to correspond to the type of the substrate 200 to be mounted, and from the target device 131. The removal time is an information group stored in association with the type of the exchange unit. Therefore, according to the setup time database 156, if the type of the replacement part to be removed and the type of the replacement part to be attached are known, it is possible to calculate the time required for the actual installation work or the removal work, that is, the setup time. Become. Note that the setup time database 156 may include information regarding not only the target device 131 but also a replacement unit that may be attached to another component mounting apparatus 101.

  In the case of the present embodiment, for example, the feeder types “A”, “A”, and “B” that are replacement units are removed from the component supply unit 115, and the feeders “C”, “D”, and “E” that are replacement units are supplied. Assume that a setup change work to be attached to the section 115 occurs. In this case, the difference is “A” “A” “B” (removal) “C” “D” “E” (attachment). On the other hand, the setup time database stored in the storage means such as a hard disk is a data string as shown in FIG. Therefore, what is the setup time that the setup time acquisition unit 151 specifically acquires?

  Setup time = 9 + 9 + 9 (removal of “A”, “A”, “B”) + 12 + 12 + 20 (attachment of “C”, “D”, “E”) = 71 sec.

  The replacement unit is not limited to the tape feeder, but means any member that needs to be replaced at the time of setup change, such as a nozzle 113 (including automatic and manual) and a tray in which parts are arranged in a matrix. ing.

  Furthermore, you may add arbitrary time, such as preparation time, to the time obtained by the said calculation.

  The difference may be determined based on two mounting conditions by separately acquiring the mounting conditions (for example, mounting program) of the first substrate 201 and the mounting conditions of the second substrate 202.

  The arrival time acquisition unit 152 is a time that can be regarded as the time from when the component mounting apparatus 101 upstream of the target device 131 starts processing the second substrate 202 until the second substrate 202 reaches the target device 131. It is a processing part acquired as arrival time.

  For example, the arrival time is obtained as follows. The longest time required for each component mounting apparatus 101 existing upstream of the target apparatus 131 to process the second substrate 202 is acquired as the first required time. A product obtained by multiplying the number of component mounting apparatuses 101 upstream of the target apparatus 131 by the first required time is defined as the arrival time. Specifically, there are four component mounting apparatuses 101 upstream of the target apparatus 131, and after the component mounting apparatus 101 closest to the target apparatus 131 receives the second board 202, the components are mounted. The processing time until the substrate 202 is discharged is 5 minutes. The processing times of the four component mounting apparatuses 101 upstream from the target apparatus 131 are 4 minutes, 6 minutes, and 3 minutes in order. In this case, the first required time is 6 minutes. Therefore, the arrival time corresponding to the component mounting apparatus 101 adjacent to the upstream side of the target apparatus 131 is regarded as 6 minutes, which is a product of 6 minutes multiplied by 1 (number of units). Since the component mounting apparatus 101 on the next upstream side is the second one from the target apparatus 131, the arrival time corresponding to the component mounting apparatus 101 is 12 minutes, which is a product of 6 minutes multiplied by 2 (the number of units). Considered.

  As described above, there are different arrival times corresponding to the respective component mounting apparatuses 101 existing on the upstream side of the target device 131, and the arrival time acquisition unit 152 determines some or all of the plurality of arrival times. get. According to this, it is possible to easily obtain the arrival time by analogy.

  Furthermore, the arrival time acquisition unit 152 has the longest time required for the target device 131 and each component mounting device 101 existing downstream from the target device 131 to process the first substrate 201. The time is acquired as the second required time, and the product obtained by multiplying the longer one compared with the first required time by the number of component mounting apparatuses 101 upstream of the target device 131 may be acquired as the arrival time. Good. This is because if the processing time of the first substrate 201 is longer than the processing time of the second substrate 202, the second required time becomes dominant with respect to the arrival time.

  According to this, even when there is a large difference in processing time between the first substrate 201 and the second substrate 202, it is possible to calculate the arrival time more accurately.

  Note that the arrival time may be calculated using only the second required time. In this case, since the second required time can be obtained by actual measurement during mounting of the first substrate 201 and the arrival time can be calculated based on this, the second substrate 202 enters the first mounting line 121. It is possible to calculate the arrival time before being performed.

  Further, the operation of the entire first mounting line 121 may be simulated, and the arrival time may be derived from this result.

  The specifying unit 153 is closer to the setup device 131 for the setup time acquired by the setup time acquisition unit 151 and the arrival time corresponding to each component mounting device 101 upstream of the target device 131 acquired from the arrival time acquisition unit 152. Comparison is made in order, and a component mounting apparatus corresponding to an arrival time exceeding the setup time is temporarily specified as a temporary specifying apparatus. Since all the component mounting apparatuses 101 upstream of the provisional specific apparatus satisfy the above-described condition, they are provisional specific apparatuses. The specifying unit 153 specifies the specifying device 132 from the temporary specifying devices. For example, a specifying method in which the component mounting device 101 closest to the target device 131 is the specifying device 132 may be employed. Further, since the setup time may be out of order, the component mounting apparatus 101 specifying apparatus 132 upstream of the component mounting apparatus 101 may be used for a margin.

  As described above, the specifying device 132 for the device of interest 131 is specified in advance.

  The notification unit 154 is a processing unit that acquires information indicating that the second substrate 202 has been transported to the specifying device 132 specified by the specifying unit 153 and notifies the start information of the setup change of the device 131 of interest.

  Specifically, for example, the identification device 132 transmits information indicating that the second substrate 202 has been transferred to the notification unit 154 based on the identification information attached to the transferred second substrate 202, and acquires the information. The informing unit 154 transmits information indicating that to the display device 155 provided in the device of interest 131. The display device 155 that has acquired the information displays an image that prompts the start of setup change.

  The worker who recognizes the display starts the work of changing the setup, and the head of the second substrate 202 arrives at the timing when the apparatus of interest 131 is ready to mount components on the second substrate 202.

  Each processing unit is realized by, for example, a CPU (Central Processing Unit) based on a control program for each processing.

  Next, a component mounting method using the component mounting system 100 having the above configuration will be described.

  FIG. 6 is a flowchart showing an outline of the component mounting method.

  First, it is selected whether or not to adopt the lane change mode (S101). Here, the lane change mode is a state in which the first board 201 remains in the component mounting apparatus 101 upstream of the target apparatus 131 at the timing when the first second board 202 is transferred to the specific apparatus 132. In this mode, a moving step of moving the first board 201 being moved to the second mounting line 122 which is another mounting line is executed.

  By executing the moving step, the target device 131 does not need to newly mount a component on the first substrate 201 when the start of the setup change is notified. It can be completely changed to a state where it can be mounted. Therefore, when the first second substrate 202 arrives, components can be mounted on the second substrate 202 using the full capacity of the component mounting apparatus 101, and a decrease in operating efficiency of the first mounting line 121 is substantially suppressed. It becomes possible to do.

  As a method of moving the first board 201 remaining on the first mounting line 121 to the second mounting line 122, a lane changing device (not shown) is provided between the component mounting devices 101, and automatic. In addition, there are a method of moving the first substrate 201 from the first mounting line 121 to the second mounting line 122, a method of moving the first substrate 201 manually, and the like.

  Next, a case where the lane change mode is not employed (S101N) will be described.

  First, the setup time is acquired (S104: setup time acquisition step). Specifically, for example, the setup time acquisition unit 151 acquires the mounting conditions of the first substrate 201 and the mounting conditions of the second substrate 202 in the apparatus of interest 131, and acquires the difference of the replacement unit. Then, while maintaining the mounting on the first substrate 201, the replacement part that can be replaced and attached is extracted. Then, with respect to the extracted exchange unit, the setup time is obtained by calculating using the setup time database 156.

  Next, an arrival time is acquired (S107: arrival time acquisition step). The arrival time is the time from when the first second board 202 is carried into the component mounting apparatus 101 upstream of the target apparatus 131 until the first second board 202 arrives at the target apparatus 131. Therefore, the arrival time exists for the number of component mounting apparatuses 101 existing upstream from the target apparatus 131.

  The arrival time acquisition unit 152 does not have to acquire all the arrival times. For example, the arrival time acquisition unit 152 acquires the arrival times sequentially from the component mounting device 101 near the target device 131, and the arrival time is obtained when the conditions are met. Acquisition may be terminated.

  In addition, as described above, the acquisition method of the arrival time includes a simulation method, a component that is rate-limiting when the first substrate 201 is mounted by the target device 131 and the component mounting device 101 downstream of the target device 131. Examples thereof include a method of using the processing time of the mounting apparatus 101 and a method of using the processing time of the component mounting apparatus 101 which is rate limiting when the second substrate 202 is mounted by the component mounting apparatus 101 upstream of the target apparatus 131.

  Next, using the setup time acquired in the setup time acquisition step (S104) and the arrival time acquired in the arrival time acquisition step (S107), one of the component mounting apparatuses 101 corresponding to the arrival time exceeding the setup time is specified. The device 132 is specified (S110: specifying step).

  Specifically, for example, the component mounting apparatus 101 corresponding to the shortest arrival time that is the arrival time exceeding the setup time is specified as the specifying device 132. Thereby, it becomes possible to make the 1st mounting line 121 into suitable operation efficiency.

  Since the setup change is performed manually, the component mounting apparatus 101 existing on the further upstream side may be used as the specific apparatus 132 in consideration of the time for handling the accident.

  As described above, the specified specifying device 132 always acquires the type of the substrate 200 transported from the upstream side, and determines whether or not it is the second substrate 202 (S113: substrate type determining step). Examples of the determination method include a method of determining by reading an identification symbol such as a barcode printed on the surface of the substrate 200.

  When it is determined that the second substrate 202 has arrived at the specific device 132 in the substrate type determination step (S113) (S113Y), the specific device 132 transmits information indicating that fact to the notification unit 154. The notification unit 154 that has received the signal notifies the start of changeover (S116: notification step).

  Specifically, the notification unit 154 transmits information indicating that the setup change is started to the display device 155 provided in the target device 131, and the display device 155 displays the information. The notification can be exemplified by not only an image but also a method of notifying with a light emission notification device such as a so-called signal lamp, a method of notifying with sound such as a buzzer, a method of notifying them in combination, and the like.

  Finally, the worker who recognizes these notifications performs setup change for the device of interest 131.

  By implementing the component mounting method using the component mounting system 100 as described above, the changeover of the target device 131 is started with the first substrate 201 remaining in the component mounting device 101 upstream of the target device 131. Thus, the mounting efficiency of the component when the target device 131 mounts the component on the remaining first substrate 201 is lowered, but when the second substrate 202 reaches the target device 131, the target device 131. Is in a state in which the second substrate 202 can be mounted, and the replacement part for the remaining second substrate 202 can be attached while the second substrate 202 is being mounted. Therefore, when the substrate 200 flowing in the first mounting line 121 is switched from the first substrate 201 to the second substrate 202, it is not necessary to stop the first mounting line 121, and the operating efficiency of the first mounting line 121 can be reduced. It becomes possible to suppress as much as possible.

  Next, a component mounting method when the lane change mode is employed will be described.

  FIG. 7 is a flowchart showing an outline of the component mounting method in the lane change mode.

  First, a setup time is acquired (S204: setup time acquisition step). Specifically, the setup time acquisition unit 151 acquires the mounting conditions of the first substrate 201 and the mounting conditions of the second substrate 202 in the device of interest 131, and acquires the difference between the replacement units. Then, the replacement and the replacement unit that can be attached are extracted in order to completely complete the mounting on the first substrate 201 and make the target device 131 in a complete state in which components can be mounted on the second substrate 202. Then, with respect to the extracted exchange unit, the setup time is obtained by calculating using the setup time database 156.

  Next, an arrival time acquisition step (S207) is performed. Since the arrival time acquisition step (S207) is the same as the previous arrival time acquisition step (S107), description thereof is omitted.

  Next, a specific step (S210) is performed. Since the specific step (S210) is the same as the previous specific step (S110), the description is omitted.

  Next, in the actual mounting operation, the board type determination step (S213) is performed, and when it is determined that the second board 202 has arrived at the specific apparatus 132 (S213Y), the specific apparatus 132 notifies that fact. The information shown is transmitted to the notification unit 154. The notification unit 154 that has received the signal notifies the start of the setup change (S216: notification step).

  Next, the first substrate 201 held in the lane 110 of the first mounting line 121 and upstream of the target device 131 is moved to the lane 110 of the second mounting line 122 (S219). : Move step). Specifically, a method of manually moving the first substrate 201 and a method of automatically moving the first substrate 201 by a lane changing device provided in the component mounting system 100 can be exemplified.

  When the component mounting system 100 as described above is used to execute the component mounting method to notify that the setup change is started, the first substrate 201 is placed in the component mounting apparatus 101 upstream of the target apparatus 131. It will not exist. Therefore, the target device 131 can be replaced so that components can be completely mounted on the second substrate 202 before the second substrate 202 reaches the target device 131. Therefore, when the substrate 200 flowing through the first mounting line 121 is switched from the first substrate 201 to the second substrate 202, the target device 131 can be replaced without reducing the operating efficiency of the first mounting line 121. It becomes possible.

  In addition, this invention is not limited to the said embodiment. For example, another embodiment realized by arbitrarily combining the components described in this specification and excluding some of the components may be used as an embodiment of the present invention. In addition, the present invention includes modifications obtained by making various modifications conceivable by those skilled in the art without departing from the gist of the present invention, that is, the meaning described in the claims. It is.

  For example, in the above-described embodiment, one target device 131 has been described. However, a plurality of component mounting devices 101 may be used as the target device 131.

  Further, the host control device 102 has been described as including the setup time acquisition unit 151, the arrival time acquisition unit 152, the specifying unit 153, the notification unit 154, and the like. The mounting apparatus 101 may be provided.

  Further, as in the above embodiment, the mounting line is not limited to one in which the component mounting apparatuses 101 having two lanes are connected and each lane is a mounting line. For example, the mounting line may be a mounting line in which component mounting apparatuses having only one lane are connected. In this case, the mounting system is a system having two mounting lines each having a single lane.

  The present invention can be used in the field of manufacturing a mounting substrate by mounting components on a substrate, and in particular, can be used in a component mounting system including a large number of component mounting devices in-line.

DESCRIPTION OF SYMBOLS 100 Component mounting system 101 Component mounting apparatus 102 Host controller 110 Lane 111 First equipment 112 Second equipment 113 Nozzle 114 Head 115 Parts supply part 116 Nozzle station 121 First mounting line 122 Second mounting line 131 Target apparatus 132 Identification apparatus 151 Setup time acquisition unit 152 Arrival time acquisition unit 153 Identification unit 154 Notification unit 155 Display device 156 Setup time database 200 Substrate 201 First substrate 202 Second substrate

Claims (6)

In a mounting line where multiple component mounting devices are connected inline and components are mounted on the board,
When switching from a first substrate, which is one type of substrate to be mounted, to a second substrate, which is another type, the second substrate mounts the target device, which is one of the component mounting devices A setup time acquisition step for acquiring a setup time, which is a time required for the setup change to be made possible;
An arrival time acquisition step of acquiring, as an arrival time, a time from when the component mounting apparatus upstream of the target device starts processing the second substrate until the second substrate reaches the target device;
A specifying step of specifying the component mounting device corresponding to the arrival time exceeding the setup time as a specifying device;
A component mounting method including a notifying step of notifying start information of setup change of the device of interest when the second substrate is transported to the specific device. A first required time acquisition step of acquiring, as the first required time, the longest time among the time required for each of the component mounting devices existing upstream from the target device to process the second substrate; Including
The component mounting method according to claim 1, wherein the arrival time acquisition step acquires a product obtained by multiplying the number of the component mounting devices upstream of the target device by the first required time as the arrival time. The longest time of the time required for the target device and each component mounting device existing downstream from the target device to process the first board is acquired as the second required time. A second required time acquisition step,
The arrival time acquisition step acquires, as the arrival time, a product obtained by multiplying the number of the component mounting devices upstream of the target device by the longer one of the first required time and the second required time. The component mounting method according to claim 2. further,
When the second substrate is transported to the specific device, if the first substrate remains in the component mounting device upstream of the device of interest, the remaining first substrate is transferred to another mounting line. The component mounting method according to claim 1, further comprising a moving step of moving to the position. The setup time acquisition step includes an exchange unit that is replaceably attached to the target device in a state where components can be mounted on the first board, and an exchange unit that is replaceably attached to the target device in a state where components can be mounted on the second board. 2. The component mounting method according to claim 1, wherein the difference is extracted, and the setup time is acquired based on the setup time database storing the individual time that is the required setup time for each switching unit and the difference. A component mounting system in which a plurality of component mounting apparatuses are connected in-line to mount a component on a board,
When switching from the first board, which is one type of board to be mounted, to the second board, which is another type, mount the target device, which is one of the component mounting devices, on the second board A setup time acquisition unit for acquiring a setup time which is a time required for the setup change to be in a ready state;
An arrival time acquisition unit for acquiring, as an arrival time, a time from when the component mounting device upstream of the target device starts processing the second substrate until the second substrate reaches the target device;
A specifying unit that specifies the component mounting device corresponding to the arrival time exceeding the setup time as a specifying device;
A component mounting system comprising: an informing unit for informing start information of setup change of the device of interest when the second substrate is conveyed to the specific device.

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