JPH05177473A - Setup changing method and parts mounter - Google Patents

Abstract

PURPOSE:To perform a job for setup changing in regular succession automatically and efficiently by transmitting such information that a delivery object is a final one successively to the control part of a device at the next process, and performing the setup changing after a process termination of the final object at the control part of each device that has received this information. CONSTITUTION:In selecting a sort of a mounting objective substrate in an electronic part mounting line 1, a sort selector switch installed in a substrate feeder 2 is inputted at a time when a final substrate of the previous sort is conveyed toward a printer 3 or the first mounter of the electronic part mounting line 1 from the substrate feeder 2. If so, a setup changing start signal is outputted from the control part of the substrate feeder 2, thus it is transmitted to a receiving part 12 of the printer 3 through a communication cable 14 from a transmitting part 13. In this printer 3, the setup changing start signal received by the receiving part 12 is inputted into the printer 3, the control part is so judged that the substrate carried in is the previous sort of the final substrate, making the printer 3 into the setup changing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is implemented in an electronic component mounting line for mounting electronic components on a circuit board, an assembly line, a processing line, etc., by a setup change method and a component mounting line which are performed in association with product type switching. The present invention relates to a component mounting device and a relay device.

[0002]

2. Description of the Related Art Conventionally, in an electronic component mounting line including a board supply device, a cream solder printing device, a component mounting device, a line relay device such as an inspection device and an intermediate storage device, each process device is usually asynchronous and independent. Then, the predetermined work is executed.

Therefore, when a product type change occurs, the operator determines the final substrate of the previous product type for each device such as the substrate supply device, the printing device, and the component mounting device, and discharges from the device. Changeover for production varieties,
The start-up instruction for the next production type substrate is issued to synchronize the setup change work between the work process devices.

Further, as shown in FIG. 3, the board supply device 22, the printing device 23, the component mounting device 24, the inspection device 25, the IC mounting device 26, the inspection device 27, and the substrate housing device arranged on the mounting line 21. In the case where control data is transmitted and received from the central control unit 29 to the control unit of each process equipment such as 28, when synchronizing the setup change,
A board identification device such as a bar code reader is attached to each of the devices 22 to 28 by providing a bar code for specifying the board on the board, attaching an ID hole, or flowing a dummy board for final board determination. Provided, central control unit 2
9 software is used to synchronize setup changes.

[0005]

However, when the operator manually performs the setup change as described above,
There is a problem that a skilled worker needs to work with a great deal of time and is inefficient, resulting in a decrease in equipment operating rate.

Further, when the setup change is synchronized by a command from the central control unit 29, there is a problem that a large-scale system configuration requires a large capital investment.

In view of the above problems of the prior art, the present invention implements a setup change method capable of automatically and efficiently performing a setup change with a relatively simple system configuration and improving the operating rate, and a method for implementing the same on a component mounting line. It is an object of the present invention to provide a component mounting device and a line relay device for this.

[0008]

According to the setup change method of the present invention, when the final object to be set up after processing the object is sent to the apparatus of the next process, the sent object is the final object. Is sequentially transmitted to the control unit of the apparatus for the next process, and the control unit of each apparatus that has received the information that it is the final object performs setup change after the processing of the final object is completed. And

Further, a component mounting apparatus for carrying out this setup change method is provided with a receiving unit for a signal from a device on the line side, a transmitting unit for a signal to a device on the line side, and a receiving unit corresponding to a carry-in board. When a predetermined signal is received by the unit, a predetermined changeover process is performed after the substrate is processed, and a control unit that outputs a predetermined signal from the transmission unit when the substrate is carried out is provided.

Similarly, the line relay device receives a signal from a device on the line side, a signal transmission part to a device on the line down side, and a receiving part corresponding to the carry-in board when a predetermined signal is received. And a control unit for outputting a predetermined signal from the transmission unit when the substrate is carried out.

[0011]

According to the present invention, by the above-described structure, even in a mounting line or the like in which each component mounting apparatus or relay apparatus that operates asynchronously and independently of each other are arranged, a predetermined process is performed in synchronization with the final object from the apparatus in the leading process. By issuing the setup command signal of, the setup command signals are sequentially transmitted to the apparatus of the next process in synchronization with the final object, so that the setup change can be executed automatically and efficiently.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic product mounting line to which the setup changing method of the present invention is applied will be described below with reference to FIGS.

In FIG. 1, an electronic component mounting line 1 includes a substrate supply device 2, a printing device 3 for printing and applying cream solder on the substrate, a component mounting device 4 for mounting chip components on the substrate, and a mounting state thereof. Inspection device 5, relay device 6 that temporarily stores the substrate and sends it to the subsequent process at a predetermined timing, IC mounting device 7 that mounts IC components on the substrate and joins the leads to electrodes on the substrate, and mounting thereof State inspection device 8 and substrate storage device 9 for storing the mounted substrate
Are arranged.

In each of the working devices 3 to 8, as shown in FIG. 2, a control unit 11 for controlling the operation of each device main body 10 and a signal transmitted from the upper side of the mounting line 1. And a signal output from the control unit 11 on the mounting line 1
And a transmitting unit 13 for transmitting to the lower side.

Further, in the board supply device 2 at the head of the electronic component mounting line 1, only the transmitter 13 is provided, and the board storage device 9 at the end is provided.
Is provided only with the receiver 12.

Various mounting devices 2 on the upper side and the lower side
5 to 7 and 9 and the transmission unit 13 and the reception unit 12 in the relay device 6 are sequentially connected in series by a communication cable 14. Also, from each communication cable 14, branch cable 14
a is extended and connected to the optical modules 15a to 15g, respectively. The optical modules 15a to 15g are connected in a loop by an optical cable 16.
6 is connected to the board management device 17.

The substrate supply device 2 and the substrate storage device 9
Alternatively, the transmitter 12 and the receiver 13 may be provided, a product type switching signal may be input to the substrate supply device 2 from the outside, and a setup change end signal may be output from the substrate storage device 9 to the line of the next process.

In the above configuration, when the type of the mounting target substrate in the electronic component mounting line 1 is switched, the final substrate of the preceding type from the substrate supply device 2 is printed as the first mounting device of the electronic component mounting line 1. When the sheet is conveyed toward the apparatus 3, the product type changeover switch provided in the substrate supply apparatus 2 is input. Then, the setup change start signal is output from the control unit 11 of the board supply device 2, and is transmitted from the transmission unit 13 to the reception unit 12 of the printing device 3 through the communication cable 14. In the printing apparatus 3, when the setup start signal received by the receiving unit 12 is input to the control unit 11, the control unit 11 determines that the loaded substrate is the final substrate of the previous type, When the printing process is completed and the board is sent to the component mounting apparatus 4 in the next step, the transmitting unit 1
The setup change start signal is output from 2 to the receiving unit 13 of the component mounting apparatus 4 in the next process, and the printing apparatus 3 is set up so as to correspond to the next type of board.

Hereinafter, as the final board is sequentially sent to the component mounting apparatus 4, the inspection apparatus 5, the IC mounting apparatus 7 and the inspection apparatus 8 in the subsequent process, a setup start signal is sequentially transmitted to the control unit 11. By doing so, the setup change is automatically performed in each of the devices 4 to 8 after the processing of the final substrate is completed. In the relay device 6, when the setup change start signal is input to the control unit 11 when the final substrate is loaded, the control unit 11 performs the setup when the final substrate is sent to the IC mounting device 7 in the next process. Output the replacement start signal.

Further, when the setup change operation is completed, the control section 11 of each of the devices 4 to 8 starts the loading operation of the next type of substrate, and thereafter repeats the predetermined work in sequence.

On the other hand, since the setup change start signal transmitted from each of the devices 2 to 8 is also input to the optical modules 15a to 15g, the optical modules 16a to 15g are connected in a loop by the optical fiber 16. It is possible to monitor from which device the final substrate has been sent out by the substrate management device 17 that is in use, and to grasp the progress of the setup change without performing complicated control and commands to each device. ..

In the case of an electronic component mounting line in which the host computer exchanges control data with each device 2-9, a setup change start signal is sent from the host computer instead of inputting the type change switch. Even if the host computer does not output the setup change start signal to each of the devices 3 to 9 at a timing just by outputting the output, each working device on the mounting line synchronizes with each other and sequentially performs the setup change operation. , FMS (Flexible Manufacture System) and CIM (Computer Integrated Manufacture) can be easily deployed.

Further, if an external input is connected to the control unit 11 of each of the devices 2 to 9 through an OR logic circuit, the process can be started from any process, and flexible product type switching can be performed during the process. It is also possible.

Further, in the above-mentioned embodiment, the present invention is applied to the mounting line of electronic parts, but it can be applied to the assembly line and the processing line.

[0025]

As described above, according to the present invention, even between the working devices that operate asynchronously and independently of each other, the working device of the leading process is synchronized with the final target object of the previous product when the product type is switched. When a predetermined signal is issued, the setup command signals are sequentially transmitted to the working device in the next process in synchronization with the final object, so that the setup setup can be executed automatically and efficiently.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an electronic component mounting line according to an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a mounting device and a relay device in the embodiment.

FIG. 3 is a configuration diagram of a conventional electronic component mounting line.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mounting line 2 Substrate supply device 3 Printing device 4 Component mounting device 5 Inspection device 6 Relay device 7 IC mounting device 8 Inspection device 11 Control unit 12 Reception unit 13 Transmission unit

Claims (3)

[Claims] 1. When a final object to be set up after processing the object is sent to an apparatus in the next step, information indicating that the object to be sent is the final object is sent to the controller of the apparatus in the next step. A setup change method characterized in that the control unit of each device, which receives the information that it is the final object, sequentially performs the setup change after the processing of the final object is completed. 2. A receiving unit for receiving a signal from a device on the line side, a transmitting unit for transmitting a signal to a device on the line side, and a receiving unit for receiving a predetermined signal corresponding to a carry-in substrate, a predetermined signal after processing the substrate. A component mounting apparatus comprising: a control unit that executes a setup change process and outputs a predetermined signal from a transmission unit when a substrate is carried out. 3. A signal receiving unit from a device on the line side, a signal transmitting unit to a device on the line lower side, and a receiving unit which receives a predetermined signal corresponding to a carry-in board, transmits it when the board is unloaded. And a control unit that outputs a predetermined signal from the unit.