CN102045996A - Management method of substrate mounting packaging line - Google Patents
Management method of substrate mounting packaging line Download PDFInfo
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- CN102045996A CN102045996A CN201010510367XA CN201010510367A CN102045996A CN 102045996 A CN102045996 A CN 102045996A CN 201010510367X A CN201010510367X A CN 201010510367XA CN 201010510367 A CN201010510367 A CN 201010510367A CN 102045996 A CN102045996 A CN 102045996A
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- electronic component
- component mounting
- packaging line
- work
- mounting apparatus
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Abstract
The present invention provides a management method of a substrate mounting packaging line, which can determine the position where an operation device is equipped in a substrate mounting packaging line for preventing configuration position error. When a second electronic component mounting device (1) from the left side receives an arrangement position confirming instruction from a third electronic component mounting device (1) from the left side, a microcomputer (2) of the second electronic component mounting device (1) controls so a tower lamp (7) is turned on and lightened, and a buzzer (8) is turned on for buzzing. Then, the second electronic component mounting device (1) from the left side responds with the received instruction for the third electronic component mounting device (1) at the transmission side from the left side. Then, when the time which is counted by a timer (3) exceeds three seconds, the microcomputer (2) of the second electronic component mounting device (1) from the left side controls so the tower lamp (7) is turned off and extinguished, and furthermore the buzzer (8) is closed for stopping buzzing.
Description
Technical field
The present invention relates to electronic unit is installed thereon and the management method of the substrate of assembling substrates assembling packaging line.Specifically, relate to by taking out electronic unit from assembly supply device, the management method of the substrate assembling packaging line that the such electronic component mounting apparatus of this electronic unit etc. constitutes is installed on substrate by suction nozzle.
Background technology
Constitute the electronic component mounting apparatus of this substrate assembling packaging line, for example open by patent documentation 1 grade, but when constituting substrate assembling packaging line newly each apparatus for work being set, perhaps after having constituted this substrate assembling packaging line, the situation of the replacement of carrying out apparatus for work is arranged.
The prior art document
(patent documentation)
(patent documentation 1) Japan Patent spy opens the 2005-159209 communique
Summary of the invention
The problem that invention will solve
But,, have following worry owing in substrate assembling packaging line, have many apparatus for work, promptly, consideration is placed in where constitute substrate assembling packaging line with which apparatus for work, though perhaps carry out the replacement of apparatus for work, allocation position is made mistakes sometimes.
Therefore, the present invention makes job management person can confirm apparatus for work has been set at which position in the substrate assembling packaging line, thereby can prevent that allocation position from makeing mistakes.
Solve the means of problem
Therefore, the 1st invention is the management method of a kind of substrate assembling packaging line, and this substrate assembling packaging line is installed electronic unit on substrate and assembling substrates is characterized in that,
Only other designated apparatus for work is sent the affirmation instruction of the arrangement position the described substrate assembling packaging line from the operations specific device that constitutes described substrate assembling packaging line,
The appointed intention of apparatus for work notice that receives.
The 2nd invention also is the management method of a kind of substrate assembling packaging line, and this substrate assembling packaging line is installed electronic unit on substrate and assembling substrates is characterized in that,
From any apparatus for work of constituting described substrate assembling packaging line other designated apparatus for work is sent the affirmation instruction of the arrangement position the described substrate assembling packaging line,
The appointed intention of apparatus for work notice that receives.
The 3rd invention also is the management method of a kind of substrate assembling packaging line, and this substrate assembling packaging line is installed electronic unit on substrate and assembling substrates is characterized in that,
Supervisory computer sends the affirmation instruction of the arrangement position in the described substrate assembling packaging line to the designated apparatus for work in each apparatus for work that constitutes described substrate assembling packaging line,
The appointed intention of apparatus for work notice that receives.
The effect of invention
The present invention makes job management person can confirm apparatus for work has been set at which position in the substrate assembling packaging line, thereby can prevent that allocation position from makeing mistakes.
Description of drawings
Fig. 1 is the skeleton diagram of simple substrate assembling packaging line.
Fig. 2 is the figure of expression line register device table data.
Fig. 3 is the picture that expression is used to specify the electronic component mounting apparatus that will carry out the arrangement position affirmation.
Fig. 4 is the figure of expression about the flow chart of the arrangement position affirmation of the electronic component mounting apparatus of transmitter side.
Fig. 5 is the figure of expression about the flow chart of the reception of the arrangement position affirmation instruction of the electronic component mounting apparatus of receiving terminal.
Label declaration
1 electronic component mounting apparatus
2 microcomputers
3 display unit
4 input units
7 tower lamps
8 buzzers
Embodiment
Below, embodiments of the present invention are described.In the management system of the production line of the printed base plate of Fig. 1, in the substrate assembling packaging line of the assembling substrates of this production line in factory, the apparatus for work that constitutes this substrate assembling packaging line is by constituting with lower device etc., promptly, silk screen printing (screen print) device of coating paste scolding tin on printed base plate, the adhesive applicating apparatus of adhesive-applying on printed base plate, and will be by taking out and the electronic unit that keeps is installed to electronic component mounting apparatus on the printed base plate from the parts feed unit at the suction nozzle that has on the installation head, but for convenience of explanation, as the control that constitutes the installation running in the substrate assembling packaging line the apparatus for work of the device group that can manage, only illustrate 4 electronic component mounting apparatus 1, below describe.But be not limited to this electronic component mounting apparatus 1, also go for other silk-screen printing device, adhesive applicating apparatus, also go for constituting whole apparatus for work of substrate assembling packaging line.
Arrange removably on as the feed station (feeder base) of carrying (cart) platform of assembly bench a plurality of parts feed units are set, the carrying platform is arranged on the apparatus main body of electronic component mounting apparatus 1 removably.Each parts feed unit is configured to the picking region (parts take out zone) of the leading section of parts supply side in the face of installation head, each parts feed unit has: tape-feed, the parts sorption extracting position that band is delivered to electronic unit is off and on accommodated by carrying motor that the angle of carrying sprocket to rotate regulation is made by this mechanism, the tooth of this conveying tooth reel with accommodate the sprocket hole engagement of offering with predetermined distance with going up, this is accommodated band and rotates freely the ground mounting repeat output successively under state on the supply spool on the described carrying platform being wound on; And cover tape mechanism for stripping, be used for by peeling off the driving of motor, before parts sorption extracting position, draw back and peel off cover tape from the mounting band, peel off cover tape by the cover tape mechanism for stripping, provide successively to parts sorption extracting position thereby will be seated in the electronic unit that is formed in the resettlement section on the mounting band with each predetermined distance, thereby can take out by suction nozzle from leading section as holding member.
And described installation head can be in the horizontal direction, move on vertical direction and the direction of rotation, on this installation head a plurality of suction nozzles can be set up or down.
And, the control computer (being designated hereinafter simply as " microcomputer ") 2 of the unified control action relevant with the parts installation action of installation electronic unit on printed base plate etc. is set on each electronic component mounting apparatus 1, on this microcomputer 2, is connected with display unit 3 such as monitor and for example is presented at the input unit that touch-screen switch constituted 4 on the described monitor via LAN circuit 6.And, on aforementioned each microcomputer 2, connect communication interface 5 respectively, can send reception by communication interface 5 and LAN circuit 6 between each microcomputer 2.
Among the RAM of each microcomputer 2 of each electronic component mounting apparatus 1, for each machine of printed base plate, storage is used to make the model program data of electronic component mounting apparatus rotation.These model program data are made of following data: by the directions X of printed base plate, size, the thickness of Y direction, the information substrate data that have or not substrate identification etc. to constitute; Each erection sequence is represented installation data, the kinds of information of each electronic unit corresponding with the configuration number of each parts feed unit, i.e. component configuration data to the installation coordinate of each electronic unit of printed base plate; And at configuration data of the suction nozzle of the suction nozzle of which kind of which position configuration of installation head etc.
And, also store as part library (library) data of the feature of electronic unit and line register device table data etc.As shown in Figure 2, line register device table data is made of the device of electronic component mounting apparatus No. 1, device name, device model (machine).
And, in aforementioned RAM, to each machine storage of printed base plate: the transmission bandwidth degrees of data of the Handling device of the suction nozzle data that each installation head is used, carrying printed base plate, the production machine data that constitute by the production logarithmic data of this printed base plate.These suction nozzles, Handling device etc. are and the relevant implement of operation that electronic unit is installed on printed base plate P.
And, the production machine data of each machine of this printed base plate and model program data, never illustrated off-line is transferred to each electronic component mounting apparatus 1, is stored in the microcomputer 2 of each electronic component mounting apparatus 1.
Here, constitute substrate assembling packaging line newly being provided as the electronic component mounting apparatus 1 of apparatus for work, when perhaps having carried out the arrangement switching of a certain electronic component mounting apparatus 1, job management person assembles under the situation of the position in the packaging line at the substrate of wanting to confirm certain electronic component mounting apparatus 1, carries out following such processing.
At first, though constituting which electronic component mounting apparatus 1 of substrate assembling packaging line can, but illustrate and for example beginning the 3rd (in Fig. 1 from the near upstream side of job management person self, because printed base plate begins from a left side to flow to the right, so be to begin the 3rd from a left side) the electronic component mounting apparatus 1, in the picture shown in Figure 3 that shows in display unit 3, input device 4 carries out the location confirmation action of certain electronic component mounting apparatus 1.
Be in halted state and (under state not, be the state that stops beginning the 3rd electronic component mounting apparatus 1 from a left side upstream side requested printing substrate.Below identical) in, default switch portion 4A on the picture of the display unit 3 of this electronic component mounting apparatus 1 of job management person's pressing operation, thereby make display unit 3 show picture shown in Figure 3, then, platform is set in the pressing operation line counts switch portion 4B, the numerical key that pressing operation is not shown, thereby in input area (field) 4C, input " 4 " when for example the platform number of the device that can manage of the control of the running of the installation in substrate assembling packaging line is 4.
Then, to the number of each device, promptly assemble the input unit name that puts in order of the device in packaging line for each substrate.That is, pressurization operation device number switch portion 4D uses the finger-impu system name in the input area 4E of correspondence.Then, after this input,, for example cursor is moved to the row of device number " 2 " in order to select to confirm the device number of the arrangement position in the substrate assembling packaging line, the pressing operation arrangement position is confirmed switch portion 4F, and then the pressing operation data transmit button 4G of portion.Like this, according to the flow chart of Fig. 4, the arrangement position of finishing in the electronic component mounting apparatus 1 with transmitting terminal is confirmed relevant processing.
At first, as previously mentioned, send action owing to finished, be used to indicate the arrangement position of lighting the tower lamp 7 and the buzzer 8 of ringing to confirm instruction (step S01) so the 2nd should be in 2 pairs of substrates assemblings of microcomputer packaging line of a left side the 3rd electronic component mounting apparatus 1 designated electronic component mounting apparatus 1 sends.At this moment, the microcomputer 2 of the 3rd electronic component mounting apparatus 1 sends arrangement position and confirms instruction and device name, be judged as with the device of the same device name of the device name that is sent out in other electronic component mounting apparatus 1 and this device has been sent arrangement position confirm instruction, and receive this arrangement position and confirm instruction.
Then, whether the microcomputer 2 by the 3rd electronic component mounting apparatus 1 is judged from this left side the 2nd electronic component mounting apparatus 1 and has been returned response (step S02) for aforementioned transmission, repeat this judgement, till timer (not shown) then (step S03).
This then before, returned situation from a left side the 2nd electronic component mounting apparatus 1 for the response of aforementioned transmission under, judge and finish.But, then and not returning under the situation of response at timer (not shown), the microcomputer 2 of the 3rd electronic component mounting apparatus 1 is controlled, and makes the display unit 2 display abnormality contents (step S04) of this electronic component mounting apparatus 1.At this moment, job management person can know the 2nd electronic component mounting apparatus 1 from a left side of not response for unusual, the processing operation after can carrying out.
More than be to confirm relevant processing action with the arrangement position of the electronic component mounting apparatus 1 of transmitter side.
Then, the arrangement position in the electronic component mounting apparatus 1 key diagram 5 and receiver side is confirmed the relevant flow chart of command reception.
At first, play the 2nd electronic component mounting apparatus 1 the 3rd electronic component mounting apparatus 1 receives arrangement position when confirming instruction from a left side on a left side, this left side is played the microcomputer 2 of the 2nd electronic component mounting apparatus 1 and is controlled, tower lamp 7 is opened and lighted, and buzzer 8 is opened and ring (step S11).Thus, job management person can confirm whether the electronic component mounting apparatus 1 of appointment is identical with the electronic component mounting apparatus 1 that in fact tower lamp 7 is lighted and buzzer 8 is rung.
Promptly, though what specified is that the 2nd electronic component mounting apparatus 1 is played on a left side, but under the situation that a left side plays that the tower lamp 7 of the 4th electronic component mounting apparatus 1 is lighted etc., job management person knows that the allocation position of the electronic component mounting apparatus 1 in the substrate assembling packaging line makes mistakes, and can be configured as correct position.
Then, the intention (step S12) that a left side the 3rd electronic component mounting apparatus 1 response of 1 pair of transmitter side of the 2nd electronic component mounting apparatus has received from a left side.That is, 1 transmission of the 3rd electronic component mounting apparatus is played on the left side of transmitter side and play the device name of the 2nd electronic component mounting apparatus 1 and the device in the source of transmission, the intention that the response transmission has been obtained as a left side that sends the destination.Then, when 3 seconds situation (step S13) has been passed through in not shown timer timing, the aforementioned microcomputer 2 that should a left side plays the 2nd electronic component mounting apparatus 1 is controlled, and makes tower lamp 7 close (OFF) and extinguish, and buzzer 8 cuts out and stop to ring (step S14).
More than, a left side is played the electronic component mounting apparatus 1 of the 3rd electronic component mounting apparatus 1 as transmitter side, and the 2nd electronic component mounting apparatus is played on a left side to be illustrated for example as the electronic component mounting apparatus 1 of designated receiver side, but be not limited thereto, can specify any apparatus for work and send arrangement position affirmation instruction from any apparatus for work that constitutes substrate assembling packaging line.
And, both can only specify other apparatus for work that constitutes the device group that to carry out identical aforementioned management and send arrangement position affirmation instruction from specific apparatus for work, can also not to constituting the apparatus for work of substrate assembling packaging line, but send arrangement positions and confirm instruction not constituting whole apparatus for work substrate assembling packaging line, that can carry out identical aforementioned management by supervisory computer.
In either event, job management person can confirm apparatus for work has been set at which position in the substrate assembling packaging line, can prevent that allocation position from makeing mistakes.
Embodiments of the present invention more than have been described, but according to the above description, those skilled in the art it is contemplated that various alternative, revises or is out of shape, and the present invention comprises aforesaid various alternative, correction or distortion in the scope that does not exceed its intention.
Claims (3)
1. the management method of substrate assembling packaging line is installed electronic unit on substrate and assembling substrates is characterized in that,
Only other designated apparatus for work is sent the affirmation instruction of the arrangement position the described substrate assembling packaging line from the operations specific device that constitutes described substrate assembling packaging line,
The appointed intention of apparatus for work notice that receives.
2. the management method of substrate assembling packaging line is installed electronic unit on substrate and assembling substrates is characterized in that,
From any apparatus for work that constitutes described substrate assembling packaging line the affirmation that other appointed apparatus for work sends the arrangement position the described substrate assembling packaging line is instructed,
The appointed intention of apparatus for work notice that receives.
3. the management method of substrate assembling packaging line is installed electronic unit on substrate and assembling substrates is characterized in that,
Supervisory computer sends the affirmation instruction of the arrangement position in the described substrate assembling packaging line to the designated apparatus for work in each apparatus for work that constitutes described substrate assembling packaging line,
The appointed intention of apparatus for work notice that receives.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP235797/09 | 2009-10-09 | ||
| JP2009235797A JP5192472B2 (en) | 2009-10-09 | 2009-10-09 | Management method of board assembly / mounting line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102045996A true CN102045996A (en) | 2011-05-04 |
Family
ID=43911575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010510367XA Pending CN102045996A (en) | 2009-10-09 | 2010-10-08 | Management method of substrate mounting packaging line |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5192472B2 (en) |
| CN (1) | CN102045996A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05177473A (en) * | 1991-12-27 | 1993-07-20 | Matsushita Electric Ind Co Ltd | Setup changing method and parts mounter |
| JPH10326997A (en) * | 1997-05-26 | 1998-12-08 | Nec Corp | Electronic component mounting device and method of correcting position by electronic component mounting device |
| JPH1174698A (en) * | 1997-09-01 | 1999-03-16 | Toho Syst Kk | Component mounting equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04274554A (en) * | 1991-02-28 | 1992-09-30 | Sanyo Electric Co Ltd | Mounting process management system |
| JP3596295B2 (en) * | 1998-07-30 | 2004-12-02 | 松下電器産業株式会社 | Electronic component mounting apparatus and mounting method |
| JP4694715B2 (en) * | 2001-05-09 | 2011-06-08 | 富士機械製造株式会社 | Electrical component mounting line |
| JP4900181B2 (en) * | 2007-10-12 | 2012-03-21 | パナソニック株式会社 | Bottleneck notification system for component mounting lines |
| JP4900191B2 (en) * | 2007-10-22 | 2012-03-21 | パナソニック株式会社 | Electronic component mounting system and facility arrangement information generation method |
-
2009
- 2009-10-09 JP JP2009235797A patent/JP5192472B2/en active Active
-
2010
- 2010-10-08 CN CN201010510367XA patent/CN102045996A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05177473A (en) * | 1991-12-27 | 1993-07-20 | Matsushita Electric Ind Co Ltd | Setup changing method and parts mounter |
| JPH10326997A (en) * | 1997-05-26 | 1998-12-08 | Nec Corp | Electronic component mounting device and method of correcting position by electronic component mounting device |
| JPH1174698A (en) * | 1997-09-01 | 1999-03-16 | Toho Syst Kk | Component mounting equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5192472B2 (en) | 2013-05-08 |
| JP2011082465A (en) | 2011-04-21 |
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Application publication date: 20110504 |