CN103687466B - Component mounting method and apparatus for mounting component - Google Patents

Abstract

The present invention provides a kind of component mounting method and apparatus for mounting component.The printing side-play amount of solder(ing) paste, correcting part installation site can be measured in parts installation procedure by the structure of existing apparatus for mounting component.Apparatus for mounting component uses the unit identifying substrate, the predetermined region installing above-mentioned parts on shooting substrate, determine in above-mentioned predetermined region should the position of installing component and printed the position of solder(ing) paste, difference between the above-mentioned position that should install and the above-mentioned position having printed solder(ing) paste determined by calculating, the difference of above-mentioned position determined by use, revise the above-mentioned position that should install, be installed to above-mentioned parts revised position, thus improve the positional precision that parts are installed.

Description

Component mounting method and apparatus for mounting component

Technical field

The present invention relates to a kind of technology being installed on printed base plate by parts, particularly to one, electronic unit is installed Component mounting method on substrate, apparatus for mounting component.

Background technology

Such as, in the middle printed base plates used such as electric product, it is necessary to many small-sized parts are installed, generally utilize machine Parts are installed to the apparatus for mounting component (chip mounter) of printed base plate etc. by tool ground.Thereby, it is possible to high-throughput efficiently The installation operation of parts is implemented on ground.On the other hand, in recent years, along with the requirement of the miniaturization to electronic equipment etc., to circuit Answering of the complication of structure is reciprocity, and printed base plate, the miniaturization of electronic unit mounted thereto, the multi itemsization of parts also exist Progress.Such as, it is claimed as well, in units of hundreds of, multiple small electronic parts is installed to the printed base plate that several centimeters is square On.

In the apparatus for mounting component of such installation small electronic parts, general arrangement components places it in and exists in advance On electrode position on printed base plate on the solder(ing) paste of printing.Use following method that configured parts are installed: by adopting Scolding tin is made to melt installing component with the reflux of reflux type.

At this moment, the printing of solder(ing) paste offsets relative to the electrode position on printed base plate sometimes.In this condition by parts In the case of being placed on electrode position, become the state that parts are not placed on solder(ing) paste equably.At this moment, right in installation In the case of the parts of elephant e.g. have the small of 2 terminals and the parts of light weight, backflow time, it is possible to create due to The surface tension parts of solder(ing) paste of skew are pulled greatly to a terminals side or inclination etc., each terminal the most correctly with electricity Situation about installing is carried out under the state that pole engages.

It is thus known that following technology, use the inspection head in apparatus for mounting component, solder printing inspection machine etc. the most in advance Measure the printing side-play amount of solder(ing) paste, when installing component, installation site is modified so that parts are not placed in electrode Position and be located in the position of solder(ing) paste of skew, the self-correcting produced from there through the surface tension of solder(ing) paste during backflow Quasi-effect, installs when each terminal is correctly with electrode engagement.

As technology associated therewith, such as in Japanese Unexamined Patent Publication 2010-3824 publication (patent documentation 1), record Following technology, i.e. " it is a kind of circuit fabrication method, by mask to print, solder(ing) paste is printed on circuit substrate, according to Placement location data, are placed on circuit block on circuit substrate, and circuit block is positioned at by the solder(ing) paste from there through printing On circuit substrate, then make solder(ing) paste melt and circuit block is welded on the pad of circuit substrate, this circuit manufacturer In method, between mask reference mark and the substrate fiducials labelling being arranged on circuit substrate that detection is arranged on mask to print Position relatively, according to the relative position detected, the solder(ing) paste that presumption is printed on circuit substrate is to the printing position of circuit substrate Put, revise placement location data according to the printing position of this presumption, circuit block is placed on circuit substrate ".

It addition, such as in No. 2010/0152877 description of U.S. Patent Application Publication No. (patent documentation 2), describe Following technology, i.e. " is a kind of component mounting method mounted the component on substrate, comprises the following steps: to predetermined base Plate repeats the installation step of the assembling of parts；Whether the parts that judgement should be assembled are the determination steps of predetermined parts, In the case of being judged as that in above-mentioned determination step the above-mentioned parts that should assemble are above-mentioned predetermined parts, (i) is above-mentioned pre- After the installation of fixed parts terminates, checking the installment state of above-mentioned predetermined parts, (ii) installs above-mentioned predetermined portion starting Period before part, check the installed surface state relevant with above-mentioned predetermined parts ".

In apparatus for mounting component, along with the further miniaturization of the parts installed, it is necessary to maintain production efficiency, While throughput etc., improve assembly precision further.To this, such as in the technology described in above-mentioned patent documentation 1, in reality During the build-up member of border, it is necessary in advance by checking that device etc. checks printed base plate, measure the printing side-play amount of solder(ing) paste.It addition, Must be by apparatus for mounting component from checking that device etc. obtains the information of the position offset measured in advance.Thus, there is print The problem that the rhythm of production of brush substrate extends.

For this point, in technology such described in above-mentioned patent documentation 2, interval printed base plate is at part mounting head Opposite possesses inspection head, carries out at part mounting head the period of parts absorption, conveying, checks that head carries out parts concurrently and installs pre- The inspection of the printing side-play amount of the solder(ing) paste that location is put and mensuration.

But, in such a configuration, it is necessary to the inspection head different from part mounting head is set in apparatus for mounting component. That is, the apparatus for mounting component at the many heads generally used (is such as spaced printed base plate and is respectively arranged with a part mounting head in both sides Device etc.) in, a part mounting head is replaced with inspection head, correspondingly production efficiency reduces.

On the other hand, it is also possible to consider to take to check that in existing apparatus for mounting component head is combined with part mounting head Structure.But, inspection head such as checks multiple inspection projects such as the inspection after solder printing, backflow, it usually needs large-scale Illuminator.Therefore, if merely part mounting head and inspection head combined, the structure of part mounting head became the most sometimes Greatly action is counteracted.It addition, in order to avoid illumination, it is necessary to make the parts of part mounting head part mouth be installed and check head Leaving a certain degree of distance between the photographing unit of part, the parts being sometimes difficult to simultaneously carry out part mounting head are installed and check The inspection (shooting of photographing unit) of head.

Patent documentation 1: Japanese Unexamined Patent Publication 2010-3824 publication

Patent documentation 2: No. 2010/0152877 description of U.S. Patent Application Publication No.

Summary of the invention

Therefore, it is an object of the invention to, it is provided that a kind of apparatus for mounting component, component mounting method and parts install system System, be not provided with in addition to apparatus for mounting component check device or as do not arrange in apparatus for mounting component inspection first-class Do not add new structure like that, it is possible to by the structure of existing apparatus for mounting component, be installed on printed base plate by parts Operation in measure solder(ing) paste for the printing side-play amount of printed base plate, according to this offset correction apparatus for mounting component.

Record according to this specification and accompanying drawing, it will be appreciated that above-mentioned and other purposes, the new feature of the present invention.

If the summary of the representational invention briefly described in invention disclosed in the present application, the most as described below.

The present invention is a kind of component mounting method, has part mounting head, and this part mounting head is equipped with and identifies substrate Unit, uses above-mentioned part mounting head to be arranged on substrate by electronic unit, it is characterized by include: use above-mentioned identification substrate Unit, the predetermined region of installing component on shooting aforesaid substrate, determine in above-mentioned predetermined region should installing component Position and printed the step of position of solder(ing) paste；The above-mentioned position that should install determined by calculating and printed above-mentioned weldering The step of the difference between the position of tin cream；The difference of above-mentioned position determined by use, revises the above-mentioned position that should install, Xiang Xiu The step of above-mentioned parts is installed in position after just.

The present invention is a kind of apparatus for mounting component, its part feeder mould that will constitute from more than one part feeder The multiple electronic unit of block supply is arranged on substrate, it is characterized by possess: more than one part mounting head, and it can be at bag Top containing an above-mentioned part feeder module and the region of aforesaid substrate is moved, and has multiple parts installation component and energy Enough substrate identification photographing units carrying out shooting on aforesaid substrate；Storage device, it preserves the design for preserving aforesaid substrate The substrate design data of information, preserve with above-mentioned each part mounting head at the step of aforesaid substrate upper mounting component and mobile route The routing information of relevant information, preserve and the parts should being installed on aforesaid substrate need correcting part installation site The correction object side sublist of the relevant information in the position revising object Part and terminal thereof；Control portion, its be controlled with Just above-mentioned each part mounting head is repeated by the above-mentioned parts installation component above-mentioned portion in above-mentioned part feeder module Part feeder keeps and takes out the parts holding circulation of predetermined parts and the portion taken out in the holding circulation of above-mentioned parts The parts of the predetermined parts mount position that part is respectively installed on aforesaid substrate install circulation, and above-mentioned control portion is always according in advance Fixed timing, by the photographed data of the predetermined region gained of aforesaid substrate identification photographing unit shooting aforesaid substrate, measures upper State the scolding tin revised at the above-mentioned correction object Part comprised in object side sublist parts mount position on aforesaid substrate Cream is relative to the printing side-play amount of each electrode terminal, according to above-mentioned printing side-play amount, calculates and is installed by above-mentioned correction object Part Installation site correction time on aforesaid substrate, logs in above-mentioned correction object Part accordingly by this installation site correction In above-mentioned correction object side sublist, in above-mentioned parts install circulation, to be mounted for above-mentioned each part mounting head Mounting object parts, have logged in this mounting object parts in above-mentioned correction object side sublist, and have logged in the upper of correspondence In the case of stating the information of installation site correction, according to this installation site correction, revising these mounting object parts upper Installing after stating the parts mount position on substrate, above-mentioned control portion shoots aforesaid substrate by aforesaid substrate identification photographing unit Predetermined region time above-mentioned predetermined timing be following timing: in order to detect the substrate identification labelling on aforesaid substrate And when making above-mentioned part mounting head move to the position of aforesaid substrate identification labelling, above-mentioned parts install loop ends, in order to Perform next parts sorption cycle and make above-mentioned part mounting head when part feeder module moves and install at parts When circulation making above-mentioned part mounting head move to the parts mount position of object at least in any one, at above-mentioned correction object The above-mentioned correction object Part logged in terminal list enters in the visual field of the aforesaid substrate identification photographing unit on mobile route Timing.

It addition, the present invention can also apply to apparatus for mounting component as described above component mounting method, have above-mentioned The component installation system of such apparatus for mounting component.

In accordance with the invention it is possible to improve the precision that parts are installed.

Accompanying drawing explanation

Fig. 1 is the top view of the summary of the structure example of the apparatus for mounting component representing embodiments of the present invention 1.

Fig. 2 is the upward view of the summary of the structure example of the part mounting head representing embodiments of the present invention 1.

Fig. 3 is the structure example of the component installation system representing the apparatus for mounting component with embodiments of the present invention 1 The figure of summary.

Fig. 4 is the figure of the summary of the structure example in the control portion of the apparatus for mounting component representing embodiments of the present invention 1.

Fig. 5 is the example of the flow process of the parts installation process of the parts installation procedure representing embodiments of the present invention 1 The flow chart of summary.

When Fig. 6 is to represent multiple part mounting head concurrent activity in the parts installation process of embodiments of the present invention 1 The figure of example of handling process.

Fig. 7 is the figure that summary is carried out simplifying by the example of the printed base plate for embodiments of the present invention 1.

Fig. 8 is the figure of the summary of the example of the concurrent activity of the multiple part mounting heads representing embodiments of the present invention 1.

Fig. 9 is general relative to the printing side-play amount of printed base plate electrode of the solder(ing) paste that embodiments of the present invention 1 are described The figure wanted.

After Figure 10 is the value renewal of the correction of the parts mount position by each parts representing embodiments of the present invention 1 The figure of summary of the example revising object side sublist.

Figure 11 is the summary of the example of the concurrent activity of the multiple part mounting heads representing embodiments of the present invention 1 Figure.

Figure 12 is the summary of the example of the concurrent activity of the multiple part mounting heads representing embodiments of the present invention 1 Figure.

Figure 13 is the general of the example of the method for the mounting coordinate correction of the presumption parts that embodiments of the present invention 1 are described The figure wanted.

Figure 14 is the summary of the example of the concurrent activity of the multiple part mounting heads representing embodiments of the present invention 1 Figure.

Figure 15 is the example in part mounting head moving process during shooting printed base plate representing embodiments of the present invention 2 The figure of the summary of son.

Figure 16 is the example of the flow process of the parts installation process of the parts installation procedure representing embodiments of the present invention 2 The flow chart of summary.

Figure 17 is the shooting parts mount position in the moving process of part mounting head representing embodiments of the present invention 2 The flow chart of summary of example of flow process of process.

Detailed description of the invention

Hereinafter, embodiments of the present invention are described with reference to the accompanying drawings in detail.It addition, for the whole attached of embodiment is described In figure, in principle same section is added identical symbol, omit its explanation repeated.

Apparatus for mounting component (chip mounter) as an embodiment of the present invention e.g. can be by the multiple ministry of electronics industry Multiple parts such as part are installed to the device on the objects such as printed base plate.At this moment, it is contemplated that solder(ing) paste is relative to printed base plate Printing skew, the installation site of correcting part on the printing position of solder(ing) paste, thus improve assembly precision.It addition, in order to logical Cross and parts are installed on the solder(ing) paste of printing obtain the effect that assembly precision improves, it is desirable to be melted when being to obtain backflow The parts (the light weight small parts of such as 2 terminals) of self calibration effect of solder(ing) paste.

In order to parts are installed to the position of the solder(ing) paste being printed on printed base plate, as described above, need to check, survey Determine the printing side-play amount of the solder(ing) paste of the installed position of object Part.In the present embodiment, not apparatus for mounting component it It is separately provided outward inspection device etc., inspection head is not set on apparatus for mounting component, does not add or change will check head and parts The structure that mounting head combines, measures printing side-play amount.In order to realize the above object, in existing apparatus for mounting component The substrate position identification photographing unit installed on part mounting head and illumination are for measuring the printing side-play amount of solder(ing) paste.

That is, from general inspection device, check first-class different, by check, measure object and purpose be used for solder(ing) paste The mensuration of printing side-play amount, it is possible to alternatively use the substrate identification photograph that can carry out shooting on printed base plate Machine.Thus, the distance that the parts of part mounting head are installed between mouth and substrate identification photographing unit is kept as closely, therefore, it is possible to The inspection that parts are installed and substrate identification photographing unit is carried out that part mounting head is carried out is carried out from the time remaining to install of parts Look into.It addition, thus, in part mounting head etc., need not check, measure the action required for printing side-play amount, energy in principle Enough mensuration concurrently in the action of common parts installation procedure prints side-play amount.Therefore, it is possible to maintaining production efficiency Improve the practical set precision that parts are installed simultaneously.

<embodiment 1>

Fig. 1 is the top view of the summary of the structure example of the apparatus for mounting component representing embodiments of the present invention 1.At Fig. 1 In, illustrate the structure example of the part relevant with the mechanism carrying out parts installation action in apparatus for mounting component 100, by figure Horizontal direction is set to X-direction, and vertical direction is set to Y direction, represents the shape seen above from apparatus for mounting component 100 State.

It (is part feeder mould in the example in fig 1 that apparatus for mounting component 100 such as possesses part feeder module 110 Block A (110a) and B (100b) these 2), Y beam 120, X beam 130 (be in the example in fig 1 X beam A (130a) and B (130b) this 2 Individual), parts recognition camera 140 (being parts recognition camera A (140a) and B (140b) these 2 in the example in fig 1), portion Part mounting head 150 (being part mounting head A (150a) and B (150b) these 2 in the example in fig 1), substrate identification photographing unit 160 (being substrate identification photographing unit A (160a) and B (160b) these 2 in the example in fig 1), printed base plate transport path 170 etc. are each Portion.

It addition, on printed base plate transport path 170, fixed configurations has the printed base plate becoming the object that parts are installed 180.It addition, printed base plate if flexible base plate etc. can be able to be then by the substrate of apparatus for mounting component installing component Arbitrary substrate.It addition, on printed base plate 180, be respectively provided with multiple substrate identification labelling 181, printed base plate electrode 182, Respectively solder(ing) paste 183 is printed onto on each printed base plate electrode 182 beforehand through printing equipment etc..

In the example in fig 1, for carrying printed base plate 180 in the X-axis direction, it is fixed on the printed base plate in precalculated position Transport path 170, is respectively provided with a part feeder mould to part mounting head 150 supply part in the both sides of Y direction Block 110.It addition, each part feeder module 110 has the multiple of multiple parts of holding predetermined kind the most in the X-axis direction Part feeder 111, it is possible to supply multiple parts to part mounting head 150.

And then, in the both sides of the X-direction of each part feeder module 110, it is configured with 1 group of Y beam 120 along Y direction. It addition, be configured with more than 1 (being 2 in the example in fig 1) X beam 130 with Y beam 120 vertically along X-direction.Y beam and X Beam angulation is vertical but it also may comprise machine error.It addition, be separately installed with a parts peace on each X beam 130 Dress 150.Shine it addition, be each configured with parts identification between printed base plate transport path 170 and part feeder module 110 Camera 140.

Printed base plate transport path 170, according to the control in control portion described later, carries printed base plate 180 in the X-axis direction And it is fixed, in order to printed base plate 180 is arranged between 1 group of Y beam 120.Each X beam 130 and part mounting head 150 points The most corresponding with each part feeder module 110, each X beam 130 has the control according to control portion, it is possible at the parts comprising correspondence In the upper area of feeder module 110 and printed base plate 180, the stroke moved in the Y-axis direction along Y beam 120.It addition, Each part mounting head 150 has the control according to control portion, it is possible to the region between 1 group of Y beam 120 along X beam 130 in X-axis The stroke that side moves up.

By the stroke of the Y direction of this X beam 130 and the combination of the stroke of the X-direction of part mounting head 150, such as Can make to move on the part mounting head A (150a) predetermined part feeder 111 in part feeder modules A (110a), After taking out parts by absorption etc. so that it is installing component is carried out in the predetermined position moved on printed base plate 180.For parts Mounting head B (150b) can make to move on its predetermined part feeder 111 in part feeder module B (110b) too Dynamic, after taking out parts so that it is the predetermined position moved on printed base plate 180 is installed.

Fig. 2 is the upward view of the summary of the configuration example representing part mounting head 150.Part mounting head 150 supplies from parts Take out the parts of multiple (kind) to the more than one part feeder 111 in device module 110, each parts taken out are installed Predetermined position on printed base plate 180, such as, have multiple (being 12 in the example in figure 2) parts and install mouth 151, base Plate identification photographing unit 160 and ring illumination 162.

Part mounting head 150 is installed on X beam 130, and having the driving by X beam 130 can move in the X-axis direction Stroke.Move it addition, make the parts of object install mouth 151, in order to multiple parts are installed the taking-up in mouth 151 and installation portion The mouth of part is arranged in predetermined operable position.In the example in figure 2, parts are installed mouth 151 and is configured to circle, therefore make it Rotate on X/Y plane, the parts of object are installed mouth 151 and sequentially move to predetermined operable position.It addition, parts peace The dress configuration structure of mouth 151, quantity are not limited to the example of Fig. 2.Such as can not also be configured to circle, and be configured to many column-shaped Deng.

Taking out and installing component it addition, part mounting head 150 installs mouth 151 by the parts of object, therefore having can Make to comprise part or all of stroke moved in the vertical direction of the part mounting head 150 that parts install mouth 151.That is, logical Crossing these to move, parts are taken out by the front end installing mouth 151 at parts by (such as utilizing air pressure etc.) such as absorption, adjust The posture of whole kept parts, discharges in the precalculated position of printed base plate 180, it is possible to installing component.These parts are installed Mouth 151 can the most suitably change the mouth of different qualities with the kind of parts of absorption.

It addition, in the present embodiment, in part mounting head 150, as taking out, keep and the component of installing component (parts installation component), the parts employing absorption holding member install mouth 151, but parts installation component is not limited to this, Such as take out and the parts installation unit of chuck etc. of holding member even with clamping parts, it is also possible to holding member. It addition, part mounting head 150, parts are installed mouth 151 (and other drive mechanisms in apparatus for mounting component 100) and are driven Dynamic mode is not particularly limited, such as in addition to rack and pinion mechanism etc., additionally it is possible to suitably with piezo-activator, The known various technology such as linear motor.

It addition, be provided with substrate identification photographing unit 160 on part mounting head 150.It addition, as being shone by substrate identification Light source when camera 160 shoots has ring illumination 162.These structures are known for shooting the substrate on printed base plate 180 Other labelling 181, by the position of image procossing identification printed base plate 180.Therefore, there is no need to check device or check first-class in The large-scale structures such as the high performance photographing unit used, large-scale illumination, it is possible to make miniaturized structure.As a result, it is possible to be arranged in Parts are installed near mouth 151, it is possible to being installed by parts on printed base plate 180 near the position of mouth 151 installing component Region as the visual field.

In the present embodiment, as described above, the reference object of substrate identification photographing unit 160 is not limited only to substrate identification Labelling 181, in order to measure the solder(ing) paste 183 printing side-play amount relative to printed base plate electrode 182, also to printed base plate electrode 182 and solder(ing) paste 183 shoot.Therefore, in the present embodiment, for the performance etc. of substrate identification photographing unit 160, permissible It is degree required in order to achieve the above object, additionally for light source, it is also possible to be suitably used the structures such as ring illumination 162 Simple light source.

Fig. 3 is the summary of the structure example of the component installation system of the apparatus for mounting component 100 representing and having present embodiment Figure.Component installation system 1 has above-mentioned apparatus for mounting component 100 and set-mounted for generating the parts of control information Server 300, this control information carries out installation process for apparatus for mounting component 100.Apparatus for mounting component 100 except Fig. 1, Beyond structure shown in Fig. 2, also having control portion 200 described later, it is to each structure involved by the installation process of parts Action is controlled.

In apparatus for mounting component 100, substantial amounts of small electronic parts are installed on printed base plate 180.Accordingly, it would be desirable to The control information of which position that the parts of which kind are installed to printed base plate 180 is provided to apparatus for mounting component 100.This Time, especially in the apparatus for mounting component 100 as the present embodiment with multiple part mounting head 150, for many heads Action, need most optimally to control the erection sequence of the path of motion of head, parts, in order to non-interference, and efficiently Carry out parts installation.

In the present embodiment, it is assumed that in the optimal path exploration portion 310 of the set-mounted server of parts 300, will be logical Cross substrate design data 401 grade of the substrate design system 400 design generations such as CAD (computer-aided design) system as defeated Enter, carry out the optimization of the path of motion of each part mounting head 150, export as optimal path information 311.In addition, it is assumed that In substrate design data 401, such as each model to printed base plate 180, comprises the size of printed base plate 180, printed base plate The zero position of 180, substrate identification labelling 181 additional on printed base plate 180 relative to initial point coordinate, be installed to The model of the parts on printed base plate 180, kind, shape, body width, principal length, body height, number of terminals, each terminal Shape, position, termination width, terminal length, terminal height, mounting coordinate, the information such as angle.

For carrying out the optimized technology of the path of motion of each part mounting head 150, various technology are studied And exploitation, in the present embodiment, use these existing technology, algorithms etc. can be properly selected.Optimum road output The substrate design data 401 that footpath information 311 and substrate design system 400 generate export to the control of apparatus for mounting component 100 Portion 200.

And then, in the present embodiment, in the correction object side sublist generating unit of the set-mounted server of parts 300 In 320, generate the printing offset correction become according to solder(ing) paste 183 in the whole parts installed on printed base plate 180 The list of the parts of the object of parts mount position, exports as revising object side sublist 321.As described above, mainly The parts of the small-size light-weight with multiple terminal easily produce bad owing to the printing of solder(ing) paste 183 offsets when parts are installed Situation.Therefore, in the present embodiment, it is assumed that according to substrate design data 401, extract the portion becoming printing position correction object out Part (such as little than predetermined size/weight two-terminal parts), generates correction object side sublist 321 described later and exports. It addition, the optimal path exploration portion 310 comprised in the set-mounted server of parts 300, correction object side sublist generating unit 320 Each portion such as can realize as software program.

Fig. 4 is the figure of the summary of the structure example in the control portion 200 representing apparatus for mounting component 100.Control portion 200 such as has There are interface 201, MPU (microprocessor unit) 202, RAM (random access memory) 203, ROM (read only memory) 204, outside Storage device 205, LCD (liquid crystal display) touch screen 206, bar code reader 207, substrate identification image processing circuit 208, weldering Stannum printing image processing circuit 209, part identification image process circuit 210, part feeder drive circuit 211, parts installation Head drive circuit 213, substrate transport path drive circuit 215 etc..

When connecting the power supply in control portion 200, performed the startup program being stored in ROM204 by MPU202.Starting In process, initializing each device being connected with interface 201, circuit etc., then, (part feeder drives to make each drive division Dynamic portion 212, part mounting head drive division 214, substrate transport path drive division 216 etc.) action, make each part feeder 111, portion Each mechanism part such as part mounting head 150 stop at predetermined position of readiness.Then, MPU202 perform at external memory 205 The parts installation procedure of middle preservation.

Parts installation procedure becomes the parts supply information for accepting barcode reader 207 grade (such as by which kind of portion It is medium that part is maintained at which part feeder 111) input, the printed base plate to be produced that carried out by LCD touch screen 206 The model of 180, number, the waiting state starting the inputs such as instruction of production.When receiving production via LCD touch screen 206 etc. Start instruction, according to following handling process, start to be installed to parts the process of printed base plate 180.

Fig. 5 is the flow process of the summary of the example of the flow process representing the parts installation process carried out by parts installation procedure Figure.Here, the example of the flow process of process when parts are installed to a printed base plate 180 by explanation.Therefore, in order to continuously will Parts are installed on multiple printed base plate 180, repeat a succession of process shown in the handling process of Fig. 5.

First, before starting parts installation process, as initial treatment, accept the behaviour from apparatus for mounting component 100 Make the input of the various set informations of director (hereinafter sometimes referred to simply as " user "), be saved in external memory 205 (S01).Such as, the size of the parts comprising each number of element types, spendable parts are installed the kind of mouth 151, passed through portion X-axis during part mounting head 150 handling article and the speed of Y direction, acceleration, parts are made to install when mouth 151 moves up and down The component information of the information such as height when speed, acceleration, decline is saved in external memory 205.Equally, base is also preserved Plate identification photographing unit 160, the image pickup method of parts recognition camera 140, substrate identification image processing circuit 208, solder printing Image processing circuit 209, part identification image process the information such as the image-recognizing method of circuit 210 and are also carried out preserving.

It addition, in advance will be for the parts on each model (kind) holding printed base plate 180 to be installed to by user Part feeder 111 is configured to part feeder module 110.Further, user reads parts manufacture by barcode reader 207 The number of element types information of the stickup on part feeder 111 that business provides, or carry out input etc. via LCD touch screen 206, by This obtains the letter of which position that the parts (part feeder 111) of which model are arranged in part feeder module 110 Breath.According to this information and above-mentioned component information, to each number of element types, the parts precalculating part mounting head 150 install mouth 151 part feeders 111 in part feeder module 110 take out stopping coordinate during parts, and are saved in outside storage In device 205.

It addition, as shown in Figure 3, for the substrate design data 401 generated by substrate design system 400 grade, The optimal path information 311 that generated by the optimal path exploration portion 310 of the set-mounted server of parts 300, by revising object side The information revising object side sublist 321 that sublist combining unit 320 generates, is also saved in external memory 205.And And, it is also possible to the size of printed base plate 180 accordingly, it is set in fixing printing substrate 180 on printed base plate transport path 170 Position, or accept the input of this information from user, such as, be included in substrate design data 401 and be saved in outside storage In device 205.

As described later, by until the parts of needs are all installed on printed base plate 180, repeat by Parts sorption cycle and parts install the parts assembling circulation that circulation is constituted, and realize the parts installation to printed base plate 180.? In parts sorption cycle, make part mounting head 150 move in part feeder module 110, by the parts specified, mouth is installed 151 adsorb, from part feeder 111, the multiple parts specified.In parts install circulation, measuring each parts adsorbed After posture, make part mounting head 150 move on printed base plate 180, each parts of absorption are installed to the finger of printed base plate 180 Fixed position.

Here, in the assembling circulation of each parts, predetermine according to substrate design data 401, optimal path information 311 etc. In each parts sorption cycle, what kind of step to make part mounting head 150 adsorption element according to and at each parts, circulation is installed In what kind of step to make the information of part mounting head 150 installing component etc. according to, using these information as parts assembling circulation letter Breath is saved in external memory 205.

In this information, such as, it is included in each parts sorption cycle, makes part mounting head 150 move to part feeder Which position in module 110, uses which parts to install mouth 151 adsorbs which part feeder 111 according to which order The information of parts etc., the shooting condition of parts recognition camera 140 of posture of parts after measuring absorption, recognition methods Deng.Install in circulation it addition, be also included in each parts, make which position part mounting head 150 moves to, will according to which order Adsorb the letter which parts to install which position etc. that the parts on mouth 151 to which direction are installed on printed base plate 180 at Breath.

When various set informations are saved in external memory 205, when by user via LCD touch screen 206 have input the information such as model is used as determining the information of printed base plate 180 to be produced, and when indicating production to start, starts Parts are installed to printed base plate 180 carry out producing (S02).If starting to produce, first reading in and being pre-stored in outside Parts assembling cyclical information in storage device 205 and the relevant substrate design data 401 of the printed base plate 180 specified, revise Object side sublist 321 etc., save it in (S03) in RAM203.Then, according in the substrate design data 401 etc. read in The information of the fixed position of the printed base plate 180 of middle setting, carries printed base plate 180 on printed base plate transport path 170, will Printed base plate 180 is fixed on (S04) on the fixed position specified.

If the process after this is the situation as shown in Figure 1 at apparatus for mounting component 100 with multiple part mounting head 150 Under, all parts mounting head 150 individually action concurrently in principle, according to parts based on contents such as optimal path information 311 Assembling cyclical information, be controlled so as between part mounting head 150 non-interference.It addition, will be described in detail later Concurrent activity between multiple part mounting heads 150.

First, according to substrate design data 401, optimal path information 311, revise object side sublist 321 etc., generate peace During in the parts of holding position correction object, to state printed base plate 180 after recognition substrate identification labelling 181, install at parts The list of the parts (terminal) that each mobile destination of 150 can measure the printing side-play amount of solder(ing) paste 183 i.e. shoots end Sublist (S05).That is, at the substrate identification photographing unit 160 being arranged on part mounting head 150 by process described later in order to slap Hold the position of printed base plate 180, during shooting substrate identification labelling 181, extract the parts (terminal) comprised in photographed data out and (i.e. exist The parts (terminal) comprised in the visual field of substrate identification photographing unit 160) in be included in the portion revised in object side sublist 321 Part, as shooting terminal list during identification printed base plate 180.

Then, before parts assembling circulation starts, as required, by being arranged on predetermined part mounting head 150 Substrate identification photographing unit 160, shooting printed base plate 180 predetermined substrate identification labelling 181, grasp be fixed on printed base plate The position of the printed base plate 180 on transport path 170.It addition, as above-mentioned, this process has multiple part mounting head 150 In the case of, it is possible to identify the most different substrate identification labellings 181 the most concurrently.Such as, part mounting head 150 In the case of number is more than the number of substrate identification labelling 181, do not performed by part mounting head 150.

During the position grasping printed base plate 180, first according in the printing defined in substrate design data 401 The coordinate information of the substrate identification labelling 181 of substrate 180, makes the part mounting head 150 specified move to be printed with and become object Substrate identification labelling 181 position near (substrate identification labelling 181 enters into the base being arranged on this part mounting head 150 The position in the visual field of plate identification photographing unit 160) (S06).Then, shot by substrate identification photographing unit 160, pass through substrate Identify that the image procossing of image processing circuit 208 detects the position of substrate identification labelling 181 from photographed data, its coordinate is believed Breath is saved in RAM203 (S07).Thus, grasp for the origin position of the coordinate system of arrangement components on printed base plate 180.

It addition, at this moment, simultaneously from the data shot by substrate identification photographing unit 160, at solder printing image The image procossing of reason circuit 209, as described later, measures the parts comprised in the shooting terminal list generated in step S205 Printing side-play amount between printed base plate electrode 182 and solder(ing) paste 183 that (terminal) is relevant, calculates the installation relevant with these parts The correction (S07) of position.Such as add to sign in by the information of the correction calculated and revise the right of object side sublist 321 In the entry of the parts (terminal) of elephant.It addition, detected multiple substrate identification labelling 181 at needs by a part mounting head 150 In the case of, repeat above-mentioned step S06, the process of S07.

Then, the circular treatment (S08) of parts assembling circulation is started.First, process as preparation, make parts as required Mounting head 150 moves to the predetermined position (S09) in the part feeder module 110 of correspondence.Open at apparatus for mounting component 100 The original state etc. such as after Dong, in part mounting head 150 Already in part feeder module 110 in the case of, it is not necessary to should Process.

Then, according to the parts assembling cyclical information read in step S03, it is first begin to the circulation of parts sorption cycle Process (S10).In parts sorption cycle, first pass through the driving in the Y-axis direction of X beam 130 that Y beam 120 carries out and X beam The part mounting head 150 that 130 are carried out driving in the X-axis direction, makes part mounting head 150 move to part feeder module On the part feeder 111 specified in 110 (S11).Then, supply for the parts specified in part feeder module 110 To device 111, part mounting head 150 driver part installs mouth 151 makes it decline, and installs mouth 151 by parts and adsorbs and take out and refer to Fixed parts (S12).

Here, the absorption of whole parts to be mounted does not complete (to still suffer from inhaling in a parts assembling circulation Attached parts install mouth 151 but without the parts of the state of absorption) in the case of, until the absorption of whole parts completes, Repeat the circular treatment (S13, S10) of above-mentioned parts sorption cycle.In the case of the absorption of whole parts completes, knot The circular treatment (S13) of bundle parts sorption cycle, measures the absorption posture (S14) of the parts being installed mouth 151 absorption by parts. Here, make part mounting head 150 move on parts recognition camera 140, adsorbed by parts recognition camera 140 shooting Each parts.As the photographed data obtained, process the image procossing in circuit 210, calculating unit by part identification image The posture of adsorption site position etc., result is saved in RAM203.

Then, in the same manner as above-mentioned step S05, according to substrate design data 401, optimal path information 311, revise right As terminal list 321 etc., generate in the parts of installation site correction object, in parts described later install circulation installing component Time can measure solder(ing) paste 183 in each mobile destination of part mounting head 150 the parts (terminal) of printing side-play amount constitute Shooting terminal list (S15).That is, when parts described later are installed, shine in the substrate identification being arranged on part mounting head 150 Camera 160, when printed base plate 180 photographs, is extracted the parts (terminal) comprised in photographed data out and (is i.e. shone in substrate identification The parts (terminal) comprised in the visual field of camera 160) in be included in correction object side sublist 321 in and also uninstalled Parts (terminal), shooting terminal list when installing as parts.It addition, when identifying above-mentioned printed base plate 180, due to all Parts are not all installed, so need not determine whether not install.

Then, according to the parts assembling cyclical information read in step S03, start parts and the circular treatment of circulation is installed (S16).In parts install circulation, first pass through the driving in the Y-axis direction of X beam 130 that Y beam 120 carries out, X beam 130 is carried out Part mounting head 150 driving in the X-axis direction, make part mounting head 150 move to the position specified on printed base plate 180 Put (S17).At this moment, in the case of the parts (terminal) of mounting object are included in correction object side sublist 321, from correction Object side sublist 321 obtains the correction of the installation site relevant with these parts, the shifting of correcting part mounting head 150 accordingly Dynamic position.It addition, install the position of the parts that mouth 151 is adsorbing for parts, also with reference to the portion measured in step S14 The pose information such as the adsorption site position of part position on the basis of being modified afterwards.

Then, for the solder(ing) paste 183 of printing in the installation site of the object Part (terminal) on printed base plate 180, Part mounting head 150 driver part installs mouth 151 makes it decline, and installs the parts (S18) adsorbed.It addition, at this moment, lead to simultaneously Cross substrate identification photographing unit 160 to shoot on printed base plate 180.According to the photographed data obtained, with the process of step S07 Similarly, by the image procossing of solder printing image processing circuit 209, as described later, generation in step S15 is measured Shoot the printing skew between printed base plate electrode 182 and the solder(ing) paste 183 that the parts (terminal) comprised in terminal list are relevant Amount, calculates the correction (S18) of the installation site relevant with these parts.The information of the correction calculated such as is added and logs in In the entry of the object Part (terminal) revising object side sublist 321.

Here, the installation of whole parts to be mounted does not complete (to there is also absorption in a parts assembling circulation The parts of the state of parts install mouth 151) in the case of, until the installation of whole parts, repeat above-mentioned Parts install the circular treatment (S19, S16) of circulation.In the case of the installation of whole parts, terminate parts and circulation is installed Circular treatment (S19).At this moment, in the case of whole parts assembling circulations does not complete, until whole parts assemblings Till circulation completes, repeat the process (S20, S08) of above-mentioned parts assembling circulation.When whole parts assemblings has circulated Cheng Shi, terminates the circular treatment (S20) of parts assembling circulation, thus, completes the parts installation process of a printed base plate 180.

The example of handling process when Fig. 6 is to represent multiple part mounting head 150 concurrent activity in parts installation process Figure.Here, for the later process of step S05 in the handling process of above-mentioned Fig. 5, pacify with the parts in the example of Fig. 1 Illustrate in case of 2 concurrent activities of dress head A (150a) and part mounting head B (150b).

Fig. 7 is the example of the printed base plate 180 for the object becoming installing component in the example in the handling process of Fig. 6 Represent the figure of summary briefly.In printed base plate 180, in order to make apparatus for mounting component 100 identify printed base plate 180 Position when being fixed on printed base plate transport path 170, addition of multiple substrate identification labelling 181 beforehand through printing etc. 3 of substrate identification labelling 1～3 (181～183) (in the example of fig. 7, be).Substrate identification labelling 181 is mainly attached to print The end of brush substrate 180, in the present embodiment, in order to improve the location recognition precision of printed base plate 180, it is assumed that additional 3 Above substrate identification labelling 181.It addition, for the whole parts installed on printed base plate 180, definition component installation site 184.Each parts mount position 184 as illustrated, is made up of printed base plate electrode 182 and the solder(ing) paste 183 printed thereon.

In figure 6, in concurrent activity, first part mounting head A (150a) and part mounting head B (150b) generates base Shooting terminal list (S31, S51) during plate identification.Here, in the present embodiment, it is located at the printed base plate 180 shown in Fig. 7 Identification in, part mounting head A (150a) shooting substrate identification labelling 1 (181-1) and substrate identification labelling 2 (181-2) these 2 Being identified, part mounting head B (150b) shooting substrate identification labelling 3 (181-3) is identified.

Therefore, in step S31, in the parts (terminal) comprised in object side sublist 321, by being arranged on by revising Substrate identification photographing unit 160A (160a) on part mounting head A (150a) is in order to identify substrate identification labelling 1 (181-1) and base Plate identification labelling 2 (181-2) and shoot they nearby time the visual field in the parts (terminal) that comprise as shooting terminal list Export.It addition, in step s 51, in the parts (terminal) that will comprise in revising object side sublist 321, by pacifying Substrate identification photographing unit 160B (160b) being contained on part mounting head B (150b) is in order to identify substrate identification labelling 3 (181-3) And the parts (terminal) comprised in visual field when shooting near it, export as shooting terminal list.

Then, as shown in Figure 8, the place of substrate identification labelling 1 (181-1) it is identified by part mounting head A (150a) Reason, concurrently, is identified the process of substrate identification labelling 3 (181-3) by part mounting head B (150b).

For part mounting head A (150a) so that it is from position (the such as part feeder modules A (110a) of original state On predetermined position) moving to can be by substrate identification photographing unit A (160a) shooting substrate identification labelling 1 (181-1) Position (S32).In this position, by substrate identification photographing unit A (160a) shooting substrate identification labelling 1 (181-1) (S33), root Measured the position (S34) of substrate identification labelling 1 (181-1) by substrate identification image processing circuit 208 according to photographed data.

Further, for the parts (terminal) comprised in photographed data, i.e. wrap in substrate identification photographing unit A visual field 161a Parts (terminal) in the parts (terminal) contained, that be included in shooting terminal list, by solder printing image processing circuit 209 printing positions measuring solder(ing) paste 183, measure the solder(ing) paste 183 printing side-play amount relative to printed base plate electrode 182 accordingly (S35).And then, according to the repairing of installation site of the parts (parts mount position 184) of the printing side-play amount calculating object measured Positive quantity, updates the entry (S36) of the object Part revising object side sublist 321.

Fig. 9 is figure solder(ing) paste 183 being described relative to the summary of the printing side-play amount of printed base plate electrode 182.For dividing Printed base plate electrode 182-1 and 182-2 the most corresponding with the 2 of parts 185 terminals (meshings of the parts 185 in figure), Illustrate the state that solder(ing) paste 183-1 and 183-2 of correspondence prints with being shifted by.Here, such as by printed base plate electrode 182 And between solder(ing) paste 183, the x-axis direction of center position coordinates of each terminal and the skew in y-axis direction represent printing skew Amount.It addition, in the example of figure 9, the shape of printed base plate electrode 182 and solder(ing) paste 183 is set to rectangle, correspondingly Represent center position coordinates, but in the case of other shapes, the most suitably set center position coordinates.

Figure 10 be represent the value of the correction at the parts mount position to each parts be updated after correction object side The figure of the summary of the example of sublist 321.Revise object side sublist 321 as described above, be to preserve to need to revise installation site Parts and the table of information of correction, by the correction object side sublist generating unit 320 of the set-mounted server of parts 300 Generate, be imported in the control portion 200 of apparatus for mounting component 100.

Revise object side sublist 321 and such as there is unit number, terminal numbering, terminal centre coordinate, printing center seat The projects such as mark, mounting coordinate correction.The project of unit number preserves the ID of parts, the sequence uniquely determining on printed base plate 180 The information such as row number.It addition, what each terminal was set by the project preservation of terminal numbering in order to determine each terminal of object Part The information of numbering.In the example of Figure 10, represent that the parts of correction object have the situation of 2 terminals.

The project of terminal centre coordinate and printing centre coordinate preserves the printing base obtained from substrate design data 401 respectively The center of the terminal of plate electrode 182, pass through image for the photographed data obtained according to the shooting of substrate identification photographing unit 160 The x of center that processes the terminal part of solder(ing) paste 183 identified and calculate, the information of y-coordinate.Mounting coordinate correction The project of amount preserves the information of the correction of installation site calculated according to printing side-play amount, above-mentioned printing side-play amount according to Terminal centre coordinate and the project of printing centre coordinate that object Part is relevant obtain.It addition, at the correction object of original state In terminal list 321, only it is set with the value of the project of above-mentioned unit number, terminal numbering and terminal centre coordinate, later Sundry item is empty.

In the example of Figure 10, illustrate each parts for unit number " 1 " and " 3 ", by substrate identification photographing unit 160 shooting parts mount position, calculate the terminal of printed base plate electrode 182 and the centre coordinate of the terminal part of solder(ing) paste 183, The state of mounting coordinate correction is calculated according to these values.In the present embodiment, it is assumed that such as by with in all parts The anglec of rotation i.e. d θ on x-axis direction that heart position coordinates is corresponding and correction i.e. dx, the dy in y-axis direction and x/y plane carrys out table Show mounting coordinate correction.Such as the parts of unit number " 1 ", according to the center of each terminal of printed base plate electrode 182 Coordinate ((x11, y11) and (x12, y12)), corresponding solder(ing) paste 183 centre coordinate ((sx11, sy11) and (sx12, Sy12)), below equation is passed through, it is possible to obtain correction dx1, dy1, d θ 1.

Formula 1

$dx1=\frac{(sx11-x11)+(sx12-x12)}{2}=\frac{sx11+sx12}{2}-\frac{x11+x12}{2}$

$dy1=\frac{(sy11-y11)+(sy12-y12)}{2}=\frac{sy11+sy12}{2}-\frac{x11+x12}{2}$

$d\mathrm{\&theta;}1={\tan }^{-1}\left(\frac{sy12-sy11}{sx12-sx11}\right)-{\tan }^{-1}\left(\frac{y12-y11}{x12-x11}\right)$

On the other hand, in figure 6, its position (example from original state is made similarly for part mounting head B (150b) Precalculated position as in part feeder module B (110b)) move to shoot base by substrate identification photographing unit B (160b) The position (S52) of plate identification labelling 3 (181-3).In this position, shoot substrate identification by substrate identification photographing unit B (160b) Labelling 3 (181-3) (S53), measures substrate identification labelling 3 according to photographed data by substrate identification image processing circuit 208 (181-3) position (S54).

Further, for the parts (terminal) comprised in photographed data, i.e. wrap in substrate identification photographing unit B visual field 161b The parts (terminal) being included in shooting terminal list in the parts (terminal) contained, by solder printing image processing circuit 209 printing positions measuring solder(ing) paste 183, measure the solder(ing) paste 183 printing side-play amount relative to printed base plate electrode 182 accordingly (S55).And then, the mounting coordinate correction of the parts (parts mount position 184) of object is calculated according to the printing side-play amount measured Amount, updates the entry (S56) of the object Part revising object side sublist 321.

Then, as shown in figure 11, by part mounting head A (150a), it is identified substrate identification labelling 2 (181-2) Process, concurrently, perform adsorb from part feeder module B (110b) and take out portion by part mounting head B (150b) The parts sorption cycle of part.

For part mounting head A (150a), as described above so that it is from identifying substrate identification labelling 1 (181-1) Position moves to can be by the position (S37) of substrate identification photographing unit A (160a) shooting substrate identification labelling 2 (181-2).? This position, by substrate identification photographing unit A (160a) shooting substrate identification labelling 2 (181-2) (S38), leads to according to photographed data Cross substrate identification image processing circuit 208 and measure the position (S39) of substrate identification labelling 2 (181-2).

And then, for the parts (terminal) comprised in photographed data, i.e. wrap in substrate identification photographing unit A visual field 161a The parts (terminal) being included in shooting terminal list in the parts (terminal) contained, by solder printing image processing circuit 209 printing positions measuring solder(ing) paste 183, measure the solder(ing) paste 183 printing side-play amount relative to printed base plate electrode 182 accordingly (S40).And then, the mounting coordinate correction of the parts (parts mount position 184) of object is calculated according to the printing side-play amount measured Amount, updates the entry (S41) of the object Part revising object side sublist 321.

On the other hand, for part mounting head B (150b), execution unit sorption cycle, thus make it from identifying substrate Identify that the position of labelling 3 (181-3) moves to part feeder module B (110b) above (S57), from more than one predetermined portion Part feeder 111 adsorbs and takes out parts (S58).Then, part mounting head B (150b) is made to move to parts recognition camera B (140b) upper (S59), each parts adsorbed, the adsorption site of components of assays is shot by parts recognition camera B (140b) The postures such as position (S60).In parts sorption cycle, do not stop, therefore at printed base plate 180 upper-part mounting head B (150b) Do not carry out substrate identification photographing unit B (160b) shooting to parts mount position.

Then, as shown in Figure 12, by part mounting head A (150a), perform from part feeder modules A (110a) Adsorb and take out the parts sorption cycle of parts.Process (step S42 in Fig. 6～S45) herein is installed with above-mentioned parts The parts sorption cycle (step S57～S60) of head B (150b) is identical, therefore omits the description.It addition, with part mounting head A (150a) parts sorption cycle concurrently, performs to be installed on printed base plate 180 parts by part mounting head B (150b) Predetermined parts mount position parts install circulation.

For part mounting head B (150b), firstly generate shooting terminal list (S61) when parts are installed.Here, in portion Part installs the predetermined parts mount position 184 of installing component in circulation, will be in substrate identification photographing unit B (160b) shooting printing That comprise in visual field during substrate 180 and uninstalled parts (terminal) export as shooting terminal list.

Then, for execution unit, circulation is installed so that it is from the position at parts recognition camera B (140b) photographs parts Put and move to assemble the predetermined parts mount position (S62) on the printed base plate 180 that cyclical information is specified according to parts.This Time, in the case of the parts (terminal) of mounting object are included in correction object side sublist 321, obtain the peace in this entry The value (dx, dy, d θ) of dress coordinate modification amount, the shift position of correcting part mounting head B (150b) accordingly.

At this moment, the parts (terminal) of mounting object are included in correction object side sublist 321, install it is likely that produce The value of coordinate modification amount is not logged in the situation in this entry.The situation of very short time after parts installation process starts especially Under, determine the parts mount position 184 of mounting coordinate correction less by the shooting of substrate identification photographing unit 160, because of This easily produces the situation of undetermined mounting coordinate correction.

In the present embodiment, the presumption of the amount of being modified, in order to the most as far as possible can install The correction of position.Figure 13 is the figure illustrating to estimate the summary of the example of the method for the mounting coordinate correction of parts.Here, according to Become multiple parts (terminal) measured existing near the undeterminate parts (terminal) of the presumption object of installation site Correction, estimate the correction of undeterminate parts (terminal).

In the example of Figure 13, illustrate for be respectively provided with terminal 1 (x1, y1), terminal 2 (x2, y2) parts Determine mounting coordinate correction, but for having the most undeterminate state of parts of terminal 3 (x3, y3).Will be in this state In the case of the lower installation kit parts containing terminal 3, because being not logged on mounting coordinate correction in revising object side sublist 321 Amount, therefore cannot be carried out the correction of installation site.Therefore, in the present embodiment, if according to terminal 3 from closely to remote suitable Sequence, selects the parts (in the example of Figure 13, be respectively provided with terminal 1 and the parts of terminal 2) measured more than at 2, for Position relationship (distance) between their correction, and each parts (terminal) accordingly, carries out interpolation or extrapolation pushes away Fixed.

Such as, for correction dx in x-axis direction, as illustrated, in the correction corresponding with the x coordinate x1 of terminal 1 In between dx1 and correction dx2 corresponding with the x coordinate x2 of terminal 2, the x coordinate x3 of insertion terminal 3, obtains correction dx3.With Sample, for correction dy in y-axis direction, as illustrated, for correction dy2 corresponding with the y-coordinate y2 of terminal 2 and end The y-coordinate y3 of the outer insertion terminal 3 of correction dy1 corresponding for y-coordinate y1 of son 1, obtains correction dy3.The anglec of rotation is repaiied Positive quantity d θ also is able to obtain correction by same method.It addition, the method for above-mentioned presumption is an example, however it is not limited to This.It addition, the correction obtained by presumption can be signed in in correction object side sublist 321, become miscellaneous part (end Son) presumption time benchmark, it is also possible to by without logging into and only the actual photographed by substrate identification photographing unit 160 is measured Correction as benchmark.

Then, with reference to the information of the postures such as the adsorption site position of the parts of mensuration in step S60, correcting part is installed Parts are installed to (S64) on solder(ing) paste 183 by the position (S63) of the parts of mouth 151 absorption in this position.Then, substrate is passed through Identify the region (S65) near this parts mount position 184 on photographing unit B (160b) shooting printed base plate 180.

Then, for the parts (terminal) comprised in photographed data, i.e. wrap in substrate identification photographing unit B visual field 161b The parts (terminal) being included in shooting terminal list when parts are installed in the parts (terminal) contained, by solder printing figure Measure the printing position of solder(ing) paste 183 as processing circuit 209, measure solder(ing) paste 183 accordingly relative to printed base plate electrode 182 Printing side-play amount (S66).And then, the parts (parts mount position 184) of object are calculated according to the printing side-play amount being measured to Mounting coordinate correction, updates the entry (S67) of the object Part (terminal) revising object side sublist 321.

Then, as shown in Figure 14, by part mounting head A (150a) execution unit, circulation (S46～) is installed, therewith Concurrently, by part mounting head B (150b) execution unit sorption cycle (S68～).After, in principle until whole parts Installation till, alternately repeat above-mentioned parts sorption cycle and parts and circulation be installed.

In such a series of process, use in apparatus for mounting component 100 with part mounting head 150 one or The substrate identification photographing unit 160 that form mounted thereto is generally of, do not carry out as far as possible unnecessary process, Machinery Ministry dynamic Make, it becomes possible to measure the printing side-play amount of solder(ing) paste 183, obtain mounting coordinate correction when parts are installed, improve parts peace The precision of dress.

It addition, in the example of fig. 6, after parts install (such as step S64), substrate identification photographing unit 160 is carried out right The shooting (such as step S65) of parts mount position 184, but if the state that stops of part mounting head 150, then can also be Parts are carried out before installing.In this case, can be following sequential in theory, i.e. before parts are installed, carry out with right As the calculating (such as step S66, S67) of the relevant mounting coordinate correction of parts, the position of correcting part mounting head 150 immediately Put, in this case, it is not necessary to the presumption of mounting coordinate correction as described above processes.But, indeed according to machinery structure The relation etc. of the speed of action in making, is difficult in reality be entered by the part mounting head 150 of general apparatus for mounting component 100 Row reply.

In the present embodiment, as described above, in parts install circulation, shot by substrate identification photographing unit 160 The parts mount position 184 of object, calculates mounting coordinate correction for the parts (terminal) comprised in photographed data, also The next parts comprising miscellaneous part mounting head 150 use this information after installing circulation.Thus, will not be to part mounting head The movement of 150 and installation process produce unnecessary impact, it is possible to carry out the calculating of mounting coordinate correction and use it for The correction of installation site.

It addition, in the present embodiment, as shown in the example of fig. 1, at printed base plate transport path 170 and printing base The lateral symmetry of the Y direction of plate 180 respectively configures a part feeder module 110, becomes and has the most corresponding parts peace 2 header structures of dress 150.Thus, the degree of parallelism that raising processes, improves and produces throughput, and seek the small-sized of apparatus structure Change, but the number of part mounting head 150 is not limited to this.Both further the number of part mounting head 150 can be expanded to 4 Individual, 6 etc. and raising processes further degree of parallelism, it is also possible to by part mounting head 150 (with part feeder module 110) Number is set to 1 and makes the further miniaturization of apparatus structure.

In the case of the number of part mounting head 150 is 1, it is impossible to carry out concurrent activity as described above, i.e. cannot It is alternately carried out parts sorption cycle by multiple part mounting heads 150 and parts install circulation.I.e., it is impossible at follow-up another The parts of individual part mounting head 150 install what reference in circulation measured in the parts installation circulation of a part mounting head 150 The information of mounting coordinate correction.But, in the case of the number of part mounting head 150 is 1, can install at these parts Next time of 150, later parts were installed in circulation to come with reference to the mounting coordinate correction being measured in installing circulation at certain parts Revising installation site, at that point, method does not has difference.Therefore, in the case of the number of part mounting head 150 is 1, also The method that can apply present embodiment, improves the precision that parts are installed with not reducing process performance.

<embodiment 2>

In the apparatus for mounting component 100 of above-mentioned embodiment 1, when detecting substrate identification labelling 181 and logical When crossing each part mounting head 150 installing component, according to the photographed data of the printed base plate 180 that substrate identification photographing unit 160 obtains Mensuration is in the printing side-play amount of the solder(ing) paste 183 of parts mount position 184, the mounting coordinate correction of calculating unit.But, as Fruit can measure the number of the parts (terminal) of mounting coordinate correction the most sometimes in circulation once or process Few, easily produce the peace that undetermined is relevant with object Part (terminal) in revising object side sublist 321 when installing component The situation of dress coordinate modification amount.In this case, as described above, can be according to parts (terminal) the most after measured nearby Mounting coordinate correction speculates, but as precision it is believed that poorer than the practical measurement printing correction that obtains of side-play amount.

Accordingly, as embodiments of the present invention 2 apparatus for mounting component 100 not only the such timing of embodiment 1, I.e. when part mounting head 150 stops, as shown in Figure 15, also clap during part mounting head 150 moves Take the photograph printed base plate 180, according to the mounting coordinate correction of the photographed data calculating unit obtained.Weldering is measured thereby, it is possible to increase The measuring point of the printing side-play amount of tin cream 183, i.e. increase calculate the parts (terminal) of mounting coordinate correction, increase and pacify at parts Can improve, according to the situation of this correction correction installation site, the precision that parts are installed further during dress.

It addition, as shown in figure 15, in order to clap on printed base plate 180 in the moving process of part mounting head 150 Take the photograph, make when shooting the ring illumination 162 being arranged on substrate identification photographing unit 160 glisten (making its short time luminescence).Thus, Even if during part mounting head 150 and substrate identification photographing unit 160 move, it is also possible to thering is no flating close Shoot under the state of rest image.It addition, also certainly be able to repeatedly clap on the mobile route of part mounting head 150 Take the photograph.

In the present embodiment, apparatus for mounting component 100, the configuration example of component installation system 1 and the figure of embodiment 1 Structure shown in the example of 1～Fig. 4 is identical, therefore omits the description.

Figure 16 is the flow chart of the summary of the example of the flow process of the parts installation process representing parts installation procedure.This enforcement The flow process of the parts installation process of mode is substantially identical with the flow process shown in the example of Fig. 5 of embodiment 1, but following Difference on point, the most as described above, is also carried out shooting, measures at base when part mounting head 150 moves on printed base plate 180 The printing side-play amount of the solder(ing) paste 183 at parts mount position comprised in the visual field (photographed data) of plate identification photographing unit 160, Calculate mounting coordinate correction.

Specifically, when making the part mounting head 150 position to substrate identification labelling 181 move (step S06), parts Circulation (step S16～S19) is installed terminate, makes parts to perform next parts sorption cycle (step S10～S13) Mounting head 150 is when part feeder module 110 moves (S09), and makes part mounting head 150 move in parts install circulation When moving the parts mount position of object, the timing in part mounting head 150 moving process such as (S17), is taken a picture by substrate identification Machine 160 shoots on printed base plate 180, measures the printing side-play amount of solder(ing) paste 183.It addition, be not required to all this A little timings shoot, as long as shooting in any more than one timing, it becomes possible to obtain the precision raising that parts are installed Effect.

Shoot in these timings, therefore when generating shooting terminal list (step S05, S15), be not only parts peace The parts (terminal) that dress 150 is included in the visual field of substrate identification photographing unit 160 when stopping, being also directed to be included in parts and install Parts (terminal) in the mobile route in 150 (visuals field of substrate identification photographing unit 160) generate shooting terminal list.

Figure 17 is to represent that shooting parts by substrate identification photographing unit 160 in the moving process of part mounting head 150 pacifies The flow chart of the summary of the example of the flow process of the process of holding position.If proceeding by process, first make part mounting head 150 Mobile (S101) to target location (such as substrate identification labelling 181, parts mount position, part feeder module 110 etc.).? In moving process, it is determined that whether the parts (terminal) comprised in shooting terminal list enter into and be arranged on part mounting head 150 On the visual field (S102) of substrate identification photographing unit 160.In the case of not entering into, proceed to step S106.

The parts (terminal) comprised in shooting terminal list in step s 102 enter into substrate identification photographing unit 160 In the case of the visual field, make ring illumination 162 glisten, shot on printed base plate 180 by substrate identification photographing unit 160, Obtain photographed data (S103).And then, for the parts (terminal) comprised in photographed data, i.e. at substrate identification photographing unit Parts (terminal) in the parts (terminal) comprised in the visual field of 160, that be included in shooting terminal list, pass through solder printing Image processing circuit 209 measures the printing position of solder(ing) paste 183, measures solder(ing) paste 183 accordingly relative to printed base plate electrode 182 Printing side-play amount (S104).And then, calculate the mounting coordinate correction of object Part according to the printing side-play amount being measured to, more The entry (S105) of the new object Part (terminal) revising object side sublist 321.

Then, step S106 is proceeded to, it is determined that whether part mounting head 150 arrives destination locations (S106).Do not arrive In the case of reaching destination locations, returning to step S101, part mounting head 150 continues to move to destination locations.Arrive purpose In the case of position, stop component mounting head 150 and terminate mobile.

It addition, in the moving process of part mounting head 150, it is by substrate identification photographing unit 160 determining whether During the timing shot, it is also possible to do not use decision method as above-mentioned steps S102, but such as generating shooting terminal column The coordinate information etc. of the stop position of part mounting head 150 for reference object parts (terminal) is precomputed during table.

So, in the apparatus for mounting component 100 of present embodiment, more than part mounting head as embodiment 1 150 timings stopped, also being able to shoot on printed base plate 180, according to obtaining in part mounting head 150 moving process The mounting coordinate correction of photographed data calculating unit.Thereby, it is possible to increase the parts (end calculating mounting coordinate correction Son), increase and can improve, according to the situation of this correction correction installation site, the essence that parts are installed further when parts are installed Degree.

Above, specifically illustrate the invention proposed by the present inventor according to embodiment, but the present invention is not limited to above-mentioned Embodiment, without departing from certainly carrying out various change in the range of its main contents.Such as, above-described embodiment be in order to Illustrate that the present invention describes in detail, however it is not limited to necessarily possess illustrated entire infrastructure easy to understandly.Furthermore it is possible to will A part for the structure of certain embodiment is replaced into the structure of other embodiments, additionally can also increase it to the structure of certain embodiment The structure of his embodiment.It addition, a part for the structure of each embodiment can be carried out the adding of other structures, delete, replace.

It addition, such as by being designed in integrated circuits, and above-mentioned each structure, merit can also be realized with hardware Part or all of energy, process portion, processing unit etc..Alternatively, it is also possible to be used for realizing respectively by being explained by processor, performing The program of individual function, realizes above-mentioned each structure, function etc. with software.Can will realize the letter of the program of each function, table, file etc. Breath is positioned in the recording equipments such as memorizer, hard disk, SSD (solid-state drive) or in the record medium such as IC-card, DVD.

It addition, in above-mentioned each figure, control line, information wire represent to be considered as the needs in explanation, however it is not limited to certain Represent the whole control lines in realization, information wire.Actually it is also contemplated that substantially the entirety of structure is connected with each other.

Symbol description

1: apparatus for mounting component；100: apparatus for mounting component；110 (110a, b): part feeder module (part feeder Modules A, B)；111: part feeder；120:Y beam；130 (130a, b): X beam (X beam A, B)；140 (140a, b): parts identification Photographing unit (parts recognition camera A, B)；150 (150a, b): part mounting head (part mounting head A, B)；160 (160a, b): Substrate identification photographing unit (substrate identification photographing unit A, B)；161 (161a, b): substrate identification camera view (take a picture by substrate identification The machine A visual field, the substrate identification photographing unit B visual field)；170: printed base plate transport path；180: printed base plate；181 (181-1～3): Substrate identification labelling (substrate identification labelling 1～3)；182 (182-1,2): printed base plate electrode；183 (183-1,2): solder(ing) paste； 184: parts mount position；185: parts；200: control portion；201: interface；202:MPU；203:RAM；204:ROM；205: outer Portion's storage device；206:LCD touch screen；207: barcode reader；208: substrate identification image processing circuit；209: scolding tin prints Brush image processing circuit；210: part identification image processes circuit；211: part feeder drive circuit；212: part feeder Drive division；213: part mounting head drive circuit；214: part mounting head drive division；215: substrate transport path drive circuit； 216: substrate transport path drive division；300: the set-mounted server of parts；310: optimal path exploration portion；311: optimal path Information；320: revise object side sublist generating unit；321: revise object side sublist；400: substrate design system；401: base Plate design data.

Claims (3)

1. an apparatus for mounting component, it is by many for the part feeder module supply constituted from more than one part feeder Plant electronic unit to be arranged on substrate, it is characterised in that possess:

More than one part mounting head, it can be in the region comprising an above-mentioned part feeder module and aforesaid substrate Top is mobile, has multiple parts installation component and can carry out the substrate identification photographing unit shot on aforesaid substrate；

Storage device, it preserves the substrate design data of design information, preservation and above-mentioned each parts for preserving aforesaid substrate Mounting head the step of the aforesaid substrate upper mounting component information relevant with mobile route routing information, preserve and should install It is correlated with in the position revising object Part and terminal thereof needing correcting part installation site in parts on aforesaid substrate The correction object side sublist of information；

Control portion, it is controlled to repeat above-mentioned each part mounting head by above-mentioned parts installation component from above-mentioned portion Above-mentioned part feeder in part feeder module keeps and takes out the parts holding circulation of predetermined parts and above-mentioned Parts keep the parts installation of the predetermined parts mount position that the parts of taking-up are respectively installed on aforesaid substrate in circulation to follow Ring,

Above-mentioned control portion shoots the predetermined district of aforesaid substrate always according in predetermined timing by aforesaid substrate identification photographing unit The photographed data of territory gained, measures the above-mentioned correction object Part comprised in above-mentioned correction object side sublist at aforesaid substrate On parts mount position at solder(ing) paste relative to the printing side-play amount of each electrode terminal, according to above-mentioned printing side-play amount, meter Calculate installation site correction when being installed on aforesaid substrate by above-mentioned correction object Part, by this installation site correction with upper State correction object Part and sign in in above-mentioned correction object side sublist accordingly,

In above-mentioned parts install circulation, for above-mentioned each part mounting head mounting object to be mounted parts, repair above-mentioned Positive object side sublist logs in this mounting object parts, and has logged in the information of the above-mentioned installation site correction of correspondence In the case of, according to this installation site correction, revising this mounting object parts parts mount position on aforesaid substrate After install,

Above-mentioned control portion is by above-mentioned predetermined the determining during the predetermined region of aforesaid substrate identification photographing unit shooting aforesaid substrate Time be following timing: make above-mentioned part mounting head to aforesaid substrate at the substrate identification labelling in order to detect on aforesaid substrate When the position of identification labelling is moved, in the installation loop ends of above-mentioned parts, make to perform next parts sorption cycle Stating part mounting head makes above-mentioned part mounting head move to when part feeder module moves and in parts install circulation During the parts mount position of object at least in any one, the above-mentioned correction object logged in above-mentioned correction object side sublist Parts enter into the timing in the visual field of the aforesaid substrate identification photographing unit on mobile route.

Apparatus for mounting component the most according to claim 1, it is characterised in that

Above-mentioned control portion is in above-mentioned parts install circulation, for above-mentioned mounting object parts, at above-mentioned correction object terminal List logs in this mounting object parts, and has been not logged on the situation of the information of the above-mentioned installation site correction of correspondence Under, according to according to apart from above-mentioned mounting object parts from closely having logged in above-mentioned installation site correction to what remote order selected Position relationship between multiple parts and the content of the above-mentioned installation site correction of above-mentioned multiple parts, estimate above-mentioned installation The value of the above-mentioned installation site correction of object Part.

Apparatus for mounting component the most according to claim 1, it is characterised in that

The above-mentioned correction object Part logged in above-mentioned correction object side sublist is to have multiple terminal, by backflow side There are when formula is welded the parts of self calibration effect.