JP2016100379A - Component mounting device, component mounting method and component mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device, a component mounting method and a component mounting system that can secure quality and enhance productivity even when targeted light emission components have variations in the positional displacement state thereof from a light emission component reference position.SOLUTION: A component mounting method for mounting, onto a board 23, a light emission component picked up from a light emission component mounting body 18 for mounting plural light emission components belonging to the same rank out of light emission components which are classified into plural ranks according to the positional displacement states thereof from a light emission reference position of the light emission components, reads out information on the rank of a mounted light emission component from an information recording carrier equipped to the light emission component mounting body 18, specifies a correction value used when the light emission component is mounted on the basis of the read-out information, registers the correction value into a controller 35 of a component mounting device 20, and positions a light emission unit of the light emission component at a predetermined position of the board 23 by using the registered correction value when the light emission component is mounted by a mounting head 31.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a component mounting apparatus, a component mounting method, and a component mounting system in which a light emitting component is taken out from a light emitting component storage body that stores a plurality of light emitting components and mounted on a substrate.

  In recent years, illumination boards using light emitting components such as LEDs as light sources have been widely used as illumination devices. It is a quality requirement that a plurality of light emitting components are mounted in a predetermined arrangement on the illumination substrate, and that the light emission components are arranged with high positional accuracy in the finished illumination substrate. In particular, when the appearance is important, such as an illumination board for in-vehicle use, it is required to accurately arrange the light emission center of the light emitting component at a specified position in the manufacturing process of the illumination board.

  In the manufacturing process of light-emitting components, the positional relationship between the light-emitting center of the light-emitting part, which is the functional position of the part, and the outer shape is not kept constant. There is variation in the positional relationship with the light emitting unit reference position to be positioned. Therefore, in order to manufacture an illumination board that satisfies the above-described quality requirements by mounting light emitting components, the light emitting unit reference position defined by the outer shape or the like cannot be used as it is as a positioning reference at the time of mounting. As part of the technology for mounting components on the board with the correct alignment of the functional positions, the components are recognized optically in the mounting process. A method of aligning based on the result is known (see, for example, Patent Document 1).

  In the prior art shown in this patent document example, in mounting a component in which a plurality of image sensor chips are linearly arranged on a long circuit board, first, the chip positioned on the intermediate stage is imaged with a camera as a functional position. Recognize the position of the recognition mark. Next, on the mounting stage where the chip is mounted, the position of the recognition mark of the already mounted chip is recognized, and the newly mounted chip and the already mounted chip are determined based on the recognition result regardless of the difference in external dimensions. Mounting is performed at predetermined position intervals.

Japanese Patent Laid-Open No. 7-74191

  However, in the prior art including the above-described prior art and aligning the components based on the recognition result obtained by optically recognizing the components in the mounting process, there are the following problems. That is, in the prior art, components to be mounted are supplied in a state where components in various variations are mixed regardless of the above-described variations. Then, in the mounting apparatus that performs the component mounting operation, the component is mounted on the substrate after performing the position correction processing for correcting the variation based on the result of the recognition processing for imaging and recognizing the component. For this reason, it takes time for imaging and recognition processing of parts, resulting in a decrease in productivity.

  In addition, even when position correction based on the recognition result is performed, there is a possibility that a new position shift may occur when a component is removed by suction, and it is difficult to ensure reliable position accuracy. As described above, in the related art, it is difficult to improve the productivity while securing the quality when the target is a component having a variation in the positional deviation state between the light emitting unit reference position and the light emitting unit. was there.

  Therefore, the present invention provides a component mounting apparatus and a component that can improve productivity while ensuring quality even when a light emitting component having a variation in the positional deviation state of the light emitting unit with respect to the light emitting unit reference position is targeted. An object is to provide a mounting method and a component mounting system.

  The component mounting apparatus of the present invention is a component mounting apparatus that takes out the light emitting component by a mounting head from a light emitting component storage body that is arranged in a component supply unit and stores a plurality of light emitting components, and mounts the light emitting component on a substrate. The body contains a plurality of light emitting components belonging to the same rank among the light emitting components classified into a plurality of ranks according to the positional deviation state of the light emitting unit with respect to the light emitting unit reference position of the light emitting component, A storage unit for storing a correction value corresponding to the rank of the light emitting component housed in the light emitting component housing, and detecting the position of the light emitting component by recognizing the light emitting component taken out by the mounting head A component position recognizing unit that moves the mounting head using the correction value stored in the storage unit and the position of the light emitting component detected by the component position recognition By controlling the mounting head moving mechanism for, and a mounting control unit for mounting the light emitting component and the light emitting portion are aligned in a predetermined position of the substrate.

  The component mounting method of the present invention is a component mounting method in which the light emitting component is taken out by a mounting head from a light emitting component storage body that is arranged in a component supply unit and stores a plurality of light emitting components, and is mounted on a substrate. The body stores a plurality of light emitting components belonging to the same rank among the light emitting components classified into a plurality of ranks according to a positional deviation state of the light emitting unit with respect to a light emitting unit reference position of the light emitting component. A storage step of storing a correction value corresponding to the rank of the light emitting component stored in the light emitting component storage body in a storage unit, and a component taking out step of taking out the light emitting component from the light emitting component storage body by the mounting head And a component position recognition step for detecting the position of the light emitting component by recognizing the light emitting component taken out by the mounting head; and The light emitting unit is positioned at a predetermined position of the substrate by controlling a mounting head moving mechanism that moves the mounting head using the stored correction value and the position of the light emitting component detected by the component position recognition. And a light emitting component mounting step for mounting the light emitting component together.

  The component mounting system of the present invention is a component mounting system in which the light emitting component is taken out by a mounting head from a light emitting component housing that is arranged in a component supply unit and stores a plurality of light emitting components, and is mounted on a substrate. The body stores a plurality of light emitting components belonging to the same rank among the light emitting components classified into a plurality of ranks according to a positional deviation state of the light emitting unit with respect to a light emitting unit reference position of the light emitting component, and the rank An information record carrier on which information for identifying the information is recorded, reading means for reading the information for identifying the rank from the information record carrier of the light-emitting component housing, and for correcting the rank and the positional deviation state Stores rank information that defines a correspondence relationship with a correction value, and mounts the light emitting component based on information that identifies the rank read by the reading means. A correction value to be used at the time of detection, a correction value registration means for registering the specified correction value in the component mounting device, and a light emitting component is taken out from the light emitting component storage body by a mounting head, and the light emission component is placed at a predetermined position on a substrate. A component mounting device for aligning and mounting the light emitting part of the component, the component mounting apparatus being registered by the correction value registering means when aligning the light emitting part of the light emitting component at a predetermined position by the mounting head; The correction value is used.

  The component mounting system of the present invention is a component mounting system in which the light emitting component is taken out by a mounting head from a light emitting component housing that is arranged in a component supply unit and stores a plurality of light emitting components, and is mounted on a substrate. The body stores a plurality of light emitting components belonging to the same rank among the light emitting components classified into a plurality of ranks according to a positional deviation state of the light emitting unit with respect to a light emitting unit reference position of the light emitting component, and the position An information record carrier on which a correction value for correcting a shift state is recorded; a reading unit that reads the correction value from the information record carrier of the light emitting component housing; and the correction value read by the reading unit. A light emitting component is taken out from the light emitting component storage body with a correction value registering means to be registered in the component mounting device and the mounting head, and the light emitting component is placed at a predetermined position on the board A component mounting apparatus for aligning and mounting an optical part, and the component mounting apparatus registers the correction value registered by the correction value registration means when aligning the light emitting part of the light emitting component at a predetermined position by the mounting head. Use the value.

  According to the present invention, it is possible to improve productivity while ensuring quality even when a light emitting component having a variation in the positional deviation between the light emitting unit reference position and the light emitting unit is targeted.

Structure explanatory drawing of the light emitting component in one embodiment of this invention Explanatory drawing of the rank information which shows the position shift state of the light-emitting body with respect to the light emission part reference position of the light-emitting component in one embodiment of this invention. FIG. 1 is an overall flowchart showing a method for manufacturing a light emitting component housing according to an embodiment of the present invention. Process explanatory drawing of the manufacturing method of the light emitting component storage body of one embodiment of this invention Structure explanatory drawing of the light emitting component storage body in one embodiment of the present invention Configuration explanatory diagram of a component mounting apparatus and a component mounting system according to an embodiment of the present invention The flowchart which shows the component supply work assistance process (Embodiment 1) in the component mounting system of one embodiment of this invention The flowchart which shows the process sequence in the component mounting method of one embodiment of this invention The flowchart which shows the component supply work assistance process (Embodiment 2) in the component mounting system of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, with reference to FIG. 1, the structure of a light emitting component housed in the light emitting component housing shown in the present embodiment and to be mounted by the component mounting apparatus will be described. As shown in FIG. 1A, the light-emitting component 1 is mainly composed of a main body 2 having a pocket 2a on the upper surface, and the upper surface of the LED, which is a light source, is covered with a phosphor in the pocket 2a. The light emitting part 3 is formed. Connection terminals 4 extend from both ends of the main body 2. By connecting the terminal 4 to a power source, the light emitting unit 3 emits light and irradiates light upward.

  In FIG. 1B showing the upper surface of the light emitting component 1, the midpoint of the straight line connecting the two edge midpoints 4a, which are the midpoints of the edges of the terminals 4 at both ends, is the light emitting portion reference position 3C * in the light emitting component 1. The position of the light emission center of the light emitting unit 3 (shown by a broken line) in an ideal part that is manufactured with high accuracy according to the design instruction and has no dimensional error in each part is shown. However, in the actual light emitting component 1, the position management of the light emitting unit 3 with respect to the main body 2 is not necessarily strict, and the light emission center 3C of the light emitting unit 3 (shown by a solid line) in the actual component is usually the light emitting unit reference position 3C *. Are not matched and are in a misaligned state.

  This misalignment state varies from individual part to individual part, and in the X direction, which is the direction connecting the terminals 4, and the Y direction orthogonal to the X direction, the positions of the positive and negative directions and the misalignment magnitudes differ by ΔX and ΔY, respectively. It is shifted. That is, in the present embodiment, the component mounting operation is performed for the light emitting component 1 having a variation in the positional relationship of the light emitting unit 3 with respect to the light emitting unit reference position 3C *. As shown in the present embodiment as the light emitting unit reference position, instead of using the light emission center of the light emitting unit 3 in the ideal component, a part that can be defined as the reference position may be appropriately selected and used.

  Such a variation in the positional relationship of the light emitting unit 3 is a factor that, when used in an illumination board configured by mounting a plurality of light emitting components 1, the position of the light emitting unit 3 is shifted for each light emitting component 1 and the appearance quality is impaired. Become. In order to prevent such quality defects, if a method of detecting and correcting misalignment in the component mounting process is adopted, image recognition processing is required to detect misalignment for each individual component, and productivity is impaired. It will be. In order to avoid such inconvenience, in the present embodiment, as described below, the above-described variation state is ranked according to the variation tendency, and the light emitting components 1 belonging to the same rank are collectively handled, It is intended to prevent quality and productivity from being reduced due to variations.

  FIG. 2 shows the above-described ranking mode. First, FIG. 2A is a ranking map for ranking a plurality of light emitting components 1 of the same component type based on ΔX and ΔY shown in FIG. Here, a plane region defined by orthogonal coordinates having ΔX and ΔY as the horizontal axis and the vertical axis, respectively, is specified with coordinate values of ± x1, ± x2 in the horizontal axis direction and ± y1, ± y2 in the vertical axis direction. The rank of the misalignment state is defined by a grid-like section defined by dividing with a lane marking.

  Here, the rank R0 is a rank in which the light emitting center 3C shown in FIG. 1B corresponds to the light emitting component 1 in which ΔX is within the range of ± x1 and ΔY is ± y1, and the light emitting center 3C of the actual component is The light-emitting component 1 that is closest to the light-emitting unit reference position 3C * and has the best accuracy is classified into the rank R0. The rank R1 is a rank corresponding to the light emitting component 1 in which the light emission center 3C is within the range of ΔX from x1 to x2 and ΔY from y1 to y2, and the positional deviation of the light emission center 3C from the light emitting unit reference position 3C * is detected. , ΔX, and ΔY, the light emitting component 1 that is large in the positive direction is classified into the rank R1. The rank R2 is a rank corresponding to the light emitting component 1 in which the light emission center 3C is within the range of ΔX of x1 to x2 and ΔY of ± y1, and the positional deviation of the light emission center 3C from the light emitting unit reference position 3C * is The light emitting component 1 that is small in ΔY but large in the positive direction with respect to ΔX is classified into the rank R2.

  The rank R3 is a rank corresponding to the light emitting component 1 in which the light emission center 3C is within the range of ΔX of x1 to x2 and ΔY of −y1 to −y2, and the position of the light emission center 3C from the light emitting unit reference position 3C *. The light emitting component 1 having a large deviation in the positive direction with respect to ΔX and the negative direction with respect to ΔY is classified into rank R3. The rank R4 is a rank corresponding to the light emitting component 1 in which the light emission center 3C is within the range of ΔX of ± x1 and ΔY of −y1 to −y2, and the light emission center 3C is displaced from the light emitting portion reference position 3C *. However, the light emitting component 1 that is small for ΔX but large in the negative direction for ΔY is classified into the rank R4. The rank R5 is a rank corresponding to the light emitting component 1 in which the light emission center 3C is within the range of ΔX in the range of −x1 to −x2 and ΔY in the range of −y1 to −y2, and from the light emitting portion reference position 3C * of the light emission center 3C. The light emitting component 1 having a large negative displacement in both ΔX and ΔY is classified into rank R5.

  The rank R6 is a rank corresponding to the light emitting component 1 in which the light emission center 3C is within the range of ΔX of −x1 to −x2 and ΔY of ± y1, and the light emission center 3C is displaced from the light emitting portion reference position 3C *. However, the light emitting component 1 that is small for ΔY but large in the negative direction for ΔX is classified into rank R6. Rank R7 is a rank corresponding to the light emitting component 1 in which the light emission center 3C is within the range of ΔX in the range of −x1 to −x2 and ΔY in the range of y1 to y2, and the position of the light emission center 3C from the light emitting unit reference position 3C *. The light emitting component 1 having a large deviation in the negative direction with respect to ΔX and the positive direction with respect to ΔY is classified into rank R7. The rank R8 is a rank corresponding to the light emitting component 1 in which the light emission center 3C is within the range of ΔX of ± x1 and ΔY of y1 to y2, and the positional deviation of the light emission center 3C from the light emitting unit reference position 3C * is the rank. , .DELTA.X is small, but .DELTA.Y is large in the positive direction, and the light emitting component 1 is classified into rank R8.

  X1, x2, y1, and y2 that define the size of the sections in the above-described ranking map mean an allowable range and a limit range of a positional deviation with respect to the light emitting portion reference position 3C * of the light emitting center 3C. That is, if ΔX and ΔY indicating misalignment are light emitting components 1 belonging to rank R0 within the range of ± x1 and ± y1, the light emission center 3C matches the light emitting portion reference position 3C * when the components are mounted. This indicates that it can be installed. When the positional deviation exceeds the allowable range but is within the limit range, specifically, ΔX is ± x1 to ± x2 (compound order), and ΔY is ± y1 to ± y2 (compound order) For the light emitting components 1 belonging to any of the ranks R1 to R8 corresponding to any one of the above, misalignment correction is performed at the time of component mounting for misalignment exceeding the allowable range. Note that the light-emitting component 1 in which ΔX and ΔY both exceed the ranges of ± x2 and ± y2 and does not correspond to any of the ranks R0 to R8 is excluded as a defective component.

  The rank information 5 shown in FIG. 2B is information that the supplier of the light emitting component 1 provides for the light emitting component 1 to the user of the component mounting apparatus with respect to the above rank. That is, in the rank information 5, the correspondence between the component name 6 (here, Paaa) as identification information for identifying the type of the light emitting component 1 and the rank 7 applied to the light emitting component indicated by the identification information and the rank correction value. Contains tables that define relationships. The table includes a rank 7 indicating a rank division and a rank correction value 8 that defines a correction value for misalignment correction required for component mounting for each rank. The rank correction value 8 defines a correction value to be applied to the rank to be corrected for each correction direction at the time of component mounting, that is, for each of the X direction and the Y direction. In the example shown in FIG. 2, by applying the positional deviation correction using the correction value defined by the rank correction value 8, the light emission center 3C is set as the target on the substrate in a state where the light emitting component 1 is mounted on the substrate. The amount of positional deviation from the power position can be within the range of ± x1 and ± y1.

  That is, for rank R0, since the accuracy of the light emitting component 1 itself is good, the rank correction value 8 is set to 0 in both the X direction and the Y direction. For the rank R1, the positional deviation is large in the positive direction for both ΔX and ΔY, so the rank correction value 8 is set to the negative correction values −x1 and −y1 in both the X direction and the Y direction. Yes. For rank R2, the positional deviation is small for ΔY, but ΔX is large in the positive direction. Therefore, the rank correction value 8 is set to the negative correction value −x1 for the X direction and 0 for the Y direction. Yes.

  For rank R3, since the positional deviation is large in the positive direction for ΔX and in the negative direction for ΔY, the rank correction value 8 is a negative correction value for the X direction -x1, positive for the Y direction. A correction value + y1 is set. For rank R4, the positional deviation is small for ΔX but large for ΔY in the negative direction. Therefore, the rank correction value 8 is set to 0 for the X direction and the positive correction value + y1 for the Y direction. Yes. For the rank R5, the positional deviation is large in the negative direction for both ΔX and ΔY, and therefore the rank correction value 8 is set to the positive correction values x1 and y1 for both the X direction and the Y direction.

  For the rank R6, the positional deviation is small for ΔY, but ΔX is large in the negative direction. Therefore, the rank correction value 8 is set to the positive correction value x1 for the X direction and 0 for the Y direction. . For rank R7, the positional deviation is large in the negative direction for ΔX and positive in the positive direction for ΔY. Therefore, the rank correction value 8 is the correction value x1 for the positive direction in the X direction and the correction value in the negative direction for the Y direction. -Y1 is set. For rank R8, the positional deviation is small for ΔX but large for ΔY in the positive direction. Therefore, the rank correction value 8 is set to 0 for the X direction and the negative correction value −y1 for the Y direction. Has been.

  The rank correction value for each rank described above is the reciprocal of the center coordinates of the squares that define each rank. However, the rank correction value may be set based on the average value of the misalignment of the center of the light emitting part of the actual component in each rank. Good.

  Next, with reference to FIG. 3, FIG. 4, FIG. 5, the manufacturing method of the light emitting component storage body which accommodated the several light emitting component 1 is demonstrated. Here, a plurality of light emitting components 1 are classified according to the rank classification shown in FIG. FIG. 3 shows an overall flow of the method for manufacturing the light emitting component housing.

  The light emitting component 1 to be stored is first subjected to a light emission characteristic inspection (ST1). That is, the light-emitting component 1 is sent to the light-emission characteristic inspection device, and as shown in FIG. 4A, the power supply device 11 is connected to the terminal 4 and power for operation is supplied. As a result, the light emitting unit 3 emits light, and the irradiation light 3 a irradiated upward is received by the light receiving unit 10. Thereby, predetermined items that define the quality characteristics of the light-emitting component 1, such as the light-emitting characteristics of the light-emitting component 1, that is, the color tone and diffusion characteristics of the irradiation light 3a are inspected.

  Next, the light emitting part position inspection is executed for the light emitting component 1 after the light emission characteristic inspection (ST2). That is, the light-emitting component 1 is sent to the light-emitting portion position inspection device and is placed on the transparent stage 12 as shown in FIG. Below the transparent stage 12, a lower camera 13 for detecting the position of the component is disposed in a posture with the imaging surface facing upward. Above the transparent stage 12, an upper camera 14 for detecting the position of the light emitting unit is disposed in a posture with the imaging surface facing downward.

  By imaging the light emitting component 1 from below through the transparent stage 12 by the lower camera 13, the outer shape of the light emitting component 1 shown in FIG. 1B is recognized. Thereby, the position of the light emitting unit reference position 3C * defined as the midpoint of the edge midpoint 4a of the two terminals 4 can be obtained. Further, the light emitting part 1 is imaged from above by the upper camera 14 to recognize the light emission center 3 </ b> C that is the center of the light emitting unit 3. Thereby, ΔX and ΔY shown in FIG. 1B are obtained, and in the light emitting component 1, it is possible to inspect the misalignment state indicating the misalignment state of the light emitting unit 3 with respect to the light emitting unit reference position 3C * (light emitting part value). Inspection process).

  Next, classification and storage are performed for the light-emitting component 1 after the light-emitting portion position inspection (ST3). That is, according to ΔX and ΔY indicating the misalignment state acquired by the light emitting part value inspection, each light emitting component 1 has a plurality of ranks (rank R0 to rank R8) shown in the ranking map shown in FIG. It classifies which belongs to. Then, as shown in FIG. 4C, the classified light emitting components 1 are stored in the component storage tape 15 for each rank.

  Here, reels 16 (1) to 16 (8) are prepared corresponding to ranks R0 to R8 shown in FIG. 3B, and a plurality of light emitting components 1 belonging to the same rank are arranged. Then, it is stored in the same component storage tape 15 wound around the corresponding reel 16 (classification / storage process). The reel 16 on which the component storage tape 15 is wound and stored constitutes a light emitting component storage body 18 that stores a plurality of light emitting components 1. That is, the light emitting component 1 shown in the present embodiment is classified into a plurality of ranks according to the misalignment state of the light emitting unit 3 with respect to the light emitting unit reference position 3C * of the light emitting component 1, and one light emitting component housing 18 is provided. Contains a plurality of light emitting components 1 belonging to the same rank.

  FIG. 5 shows the component storage tape 15 and the reel 16 used for classification and storage shown in FIG. The component storage tape 15 includes a base tape 15a and a cover film 15b, and a storage pocket 15c for storing the light emitting component 1 is provided in the base tape 15a. A cover film 15b is attached to the upper surface of the base tape 15a after the light emitting component 1 is stored so as to cover the storage pocket 15c. The light-emitting component 1 is stored in the storage pocket 15c, and the component storage tape 15 to which the cover film 15b is attached is wound and stored on the reel 16. That is, the light-emitting component storage body 18 includes a component storage tape 15 provided with a storage pocket 15c for storing the light-emitting component 1 and a reel 16 for winding and storing the component storage tape 15. In the above-described classification / storage process, the light emitting component 1 is stored in the component storage tape 15 provided with the storage pocket 15c for storing the light emitting component 1.

  The reel 16 has a two-dimensional barcode 17 as an information recording carrier on which information on the light emitting component 1 stored in the component storage tape 15 is recorded. In the two-dimensional barcode 17, at least rank information 5 shown in FIG. 2B, rank 7 to which the light-emitting component 1 stored in the component storage tape 15 together with the component name 6 of the light-emitting component 1 belongs, that is, the light emission. Information indicating which rank of the component 1 belongs to ranks R0 to R8 is included, and the light-emitting component storage body 18 includes a two-dimensional barcode 17 that records information for specifying the rank.

  Here, the information for specifying the rank means information for specifying which rank the light-emitting component 1 belongs to, and in the case of a label, a character symbol such as R0, R1,. Codes and two-dimensional barcodes are used. When the light-emitting component storage body 18 is set and used on the component mounting apparatus 20 shown in FIG. 6, the operator reads the two-dimensional barcode 17 by a reading means such as a barcode reader. Thereby, it is possible to specify which rank the light emitting component 1 belongs to.

  Affixing of the two-dimensional barcode 17 to the reel 16 is performed after the above-described classification / storage process. As a result, the information recording carrier on which the information for specifying the rank shown in FIG. 2 is recorded is provided in the light emitting component storage body 18 (component information providing step). Here, the information recorded in the two-dimensional barcode 17 includes only the rank type that identifies the component name 6 and the rank 7 of the light-emitting component 1, but corresponds to the rank type together with the rank type. A two-dimensional barcode 17A (see FIG. 9A) in which the rank correction value 8 to be recorded is recorded may be attached to the reel 16. That is, in this case, in the component information providing step, the two-dimensional barcode 17A, which is an information recording carrier on which correction values corresponding to rank 7 are recorded, is provided in the light emitting component storage body 18.

  Next, referring to FIG. 6, the component mounting apparatus 20 that takes out the light emitting component 1 by the mounting head 31 from the light emitting component storage body 18 that is arranged in the component supply unit 24 and stores the plurality of light emitting components 1 and mounts it on the substrate 23. Will be described. Here, the light-emitting component housing 18 shown in FIG. 5 is used, and the light-emitting component housing 18 has a plurality of ranks according to the positional deviation state of the light-emitting unit 3 with respect to the light-emitting unit reference position 3C * of the light-emitting component 1. Among the light emitting components 1 classified into the above, a plurality of light emitting components 1 belonging to the same rank are accommodated.

  In FIG. 6, a substrate transport mechanism 22 is disposed on the upper surface of the base 21 in the X direction (substrate transport direction). The substrate transport mechanism 22 receives the substrate 23 on which the light emitting component 1 is mounted from the upstream device, and positions and holds the substrate 23 at a work position by a component mounting mechanism described below. A component supply unit 24 is disposed on the side of the substrate transport mechanism 22, and a plurality of component supply units 25 and an adhesive application unit 26 are mounted on the component supply unit 24.

  A component supply carriage 27 is set in the component supply section 24, and the carriage 27 holds a plurality of reels 16 constituting the light emitting component storage body 18. The component supply unit 25 supplies the light emitting component 1 to the component take-out position by the component mounting mechanism by pitch-feeding the component storage tape 15 fed from the reel 16. The adhesive application unit 26 supplies an adhesive for temporary fixing applied to the lower surface of the light emitting component 1 taken out from the component supply unit 25.

  A pair of Y-axis mechanisms 30Y are disposed on the upper surface of the frame portion 28 erected at both ends in the X direction of the base 21. The Y-axis mechanism 30Y includes the X-axis mechanism 30X in the Y direction. It is connected movably. On the X-axis mechanism 30X, a mounting head 31 having a component suction nozzle 32 at the lower end is mounted so as to be movable in the X direction. The X-axis mechanism 30 </ b> X and the Y-axis mechanism 30 </ b> Y constitute a mounting head moving mechanism 30, and the mounting head 31 is driven between the component supply unit 24 and the substrate 23 held by the substrate transport mechanism 22 by driving the mounting head moving mechanism 30. To move.

  Accordingly, the mounting head 31 takes out the light emitting component 1 from the component supply unit 25 of the component supply unit 24 and mounts it on the substrate 23. At this time, the mounting head 31 holding the light emitting component 1 by the nozzle 32 accesses the adhesive application unit 26, whereby the adhesive discharged from the adhesive application unit 26 is applied to the lower surface of the light emitting component 1. The mounting head moving mechanism 30 and the mounting head 31 constitute a component mounting mechanism for mounting the light emitting component 1 taken out from the light emitting component storage body 18 on the substrate 23.

  A component imaging camera 33 is disposed on the moving path of the mounting head 31 between the component supply unit 24 and the substrate transport mechanism 22 with the imaging surface facing upward. When the mounting head 31 holding the light emitting component 1 moves above the component imaging camera 33, the component imaging camera 33 images the light emitting component 1 from below. Further, the mounting head 31 includes a board imaging camera 34 that moves integrally. When the mounting head 31 moves above the board 23, the board imaging camera 34 takes an image of a recognition mark or component mounting position on the board 23.

  The component mounting apparatus 20 includes a control unit 35 having a storage unit 38 (see FIG. 7A) that stores the data used for these processes while performing the above-described control processing of each unit. As shown in FIG. 7A, the storage unit 38 stores production data 39 and a rank correction value 40. The production data 39 is data that defines data necessary for production such as component mounting positions and component data on the substrate 23 to be worked for each type of the substrate 23. The rank correction value 40 is the same data as the rank correction value 8 defined for each rank 7 in the rank information 5 shown in FIG. That is, the storage unit 38 stores a correction value (rank correction value 40) corresponding to rank 7 of the light emitting component 1 housed in the light emitting component housing 18. In the present embodiment, the rank correction value in the rank information 5 supplied from the supplier shown in FIG. 2B is labeled as the rank correction value 8 and production is executed in the storage unit 38 of the component mounting device 20. The rank correction value registered for use is marked with a rank correction value 40 to distinguish the two.

  The control unit 35 controls the substrate transport mechanism 22, the mounting head moving mechanism 30, and the mounting head 31 based on the production data 39, so that the component mounting for mounting the light emitting component 1 taken out from the light emitting component storage body 18 on the substrate 23 is performed. The action is executed. At this time, the rank correction value 40 corresponding to the rank of the light emitting component 1 to be worked is read from the storage unit 38, and the control unit 35 performs position correction based on the rank correction value 40 to place the light emitting component 1 on the substrate 23. To be installed.

  Further, the image pickup results obtained by the component imaging camera 33 and the board imaging camera 34 are recognized by the image recognition function provided in the control unit 35, thereby detecting the positional deviation of the light emitting component 1 in the state held by the mounting head 31. In addition, the component mounting position on the board 23 is recognized. Therefore, the component imaging camera 33 and the control unit 35 are a component position recognition unit that detects the position of the light emitting component 1 by recognizing the light emitting component 1 taken out by the mounting head 31.

  Further, in the component mounting operation, the control unit 35 performs a control process for correcting the component mounting position by the mounting head 31 based on the detection result of these positional deviations. That is, the control unit 35 controls the mounting head moving mechanism 30 that moves the mounting head 31 using the rank correction value 40 stored in the storage unit 38 and the position of the light emitting component 1 detected by the above-described component position recognition. As a result, the light emitting unit 3 is aligned with a predetermined position of the substrate 23 to function as a mounting control unit for mounting the light emitting component 1.

  The control unit 35 is connected to the host system 36. Prior to the start of production, the control unit 35 receives data including the production data 39 and the rank correction value 40 for the board type to be produced from the host system 36, and stores the data. Stored in the unit 38. In the above configuration, the component mounting apparatus 20 and the host system 36 take out the light emitting component 1 from the light emitting component storage body 18 that is arranged in the component supply unit 24 and stores the plurality of light emitting components 1 by the mounting head 31 and mounts it on the substrate 23. The component mounting system 37 to be configured is configured.

  The light emitting component housing 18 targeted by the component mounting system 37 is the same among the light emitting components 1 classified into a plurality of ranks according to the positional deviation state of the light emitting unit 3 with respect to the light emitting unit reference position 3C * of the light emitting component 1. And a two-dimensional barcode 17 as an information recording carrier on which information for specifying the rank is recorded.

  The component mounting system 37 includes a reading unit such as a barcode reader or a memory reader operated by an operator to read information for specifying a rank from the two-dimensional barcode 17 of the light emitting component storage body 18, and a host system 36. The component mounting device 20 is provided. Here, the host system stores rank information 5 that defines the correspondence between rank 7 shown in FIG. 2 and rank correction value 8 for correcting the misalignment state, and information that identifies rank 7 read by the reading means. The rank correction value 8 used when the light emitting component 1 is mounted is specified, and the specified rank correction value 8 functions as a correction value registration means for registering the specified rank correction value 8 in the component mounting apparatus 20 as the rank correction value 40 for production execution. .

  The component mounting apparatus 20 has a function of taking out the light emitting component 1 from the light emitting component housing 18 with the mounting head 31, aligning and mounting the light emitting part 3 of the light emitting component 1 at a predetermined position on the substrate 23, and mounting head When the light emitting unit 3 of the light emitting component 1 is aligned at a predetermined position by 31, the rank correction value 40 for production execution registered in the storage unit 38 of the control unit 35 by the host system 36 as the correction value registering unit is used. To do.

  Next, referring to FIG. 7B, a component supply work support process (implementation process) executed when the component mounting system 37 supplies the light emitting component 1 by setting the light emitting component storage body 18 in the component mounting apparatus 20. Mode 1) will be described. In this component supply work support process, the rank correction value 40 for each of the light emitting component storage bodies 18 used prior to the start of production is registered in the storage unit 38 of the component mounting apparatus 20 so that it can be used for the component mounting work. This is performed using the processing function of the host system 36. When the component supply work support process (first embodiment) shown here is applied, the rank information 5 shown in FIG. 2B is stored in advance in the host system 36 constituting the component mounting system 37.

  First, the component supply unit 25 to be worked is notified (ST11). That is, among the plurality of component supply units 25 mounted on the component supply unit 24 of the component mounting device 20, the notification lamp of the component supply unit 25 that is the target of the component supply operation is turned on to notify the operator. Next, an operator who has received this notification sets the component storage tape 15 in the component supply unit 25 and reads the two-dimensional barcode 17 of the reel 16 to which the component storage tape 15 is connected as a reading means. Detection is performed using a code reader (ST12). As a result, the component name 6 and rank 7 (FIG. 2B) of the light-emitting component 1 housed in the light-emitting component housing 18 are read, and the read result is transmitted to the host system 36.

  Next, it is determined whether or not the part names match (ST13). In other words, the host system 36 compares the read part name with the part name defined in advance in the production data 39 corresponding to the mounting address of the part supply unit 25, and determines the match / mismatch. Here, when it is determined that there is a mismatch, for example, by attaching an incorrect component storage tape to the component supply unit 25, the fact is notified by a notification means such as a notification lamp or a display panel of the component mounting device 20 (ST14). ).

  If it is determined in (ST13) that the values match, the rank correction value is read (ST15). That is, the host system 36 reads the rank correction value 8 stored in advance as rank information 5 for the light emitting component 1. Next, rank correction value registration is performed (ST16). That is, the read rank correction value 8 is registered in the storage unit 38 of the control unit 35 as the rank correction value 40 used when the light emitting component 1 is mounted. In the component mounting of the light emitting component 1 executed thereafter, the control unit 35 uses the rank correction value 40 stored in the storage unit 38 to control the component mounting.

  Next, referring to FIG. 8, the light-emitting component 1 is taken out by the mounting head 31 from the light-emitting component storage body 18 arranged in the component supply unit 24 and storing the plurality of light-emitting components 1 in the component mounting apparatus 20 and mounted on the substrate 23. A component mounting method will be described. Here, the light emitting component housing 18 houses a plurality of light emitting components 1 belonging to the same rank as described above. At the start of production, a storage step of storing the rank correction value 8 corresponding to rank 7 of the light emitting component 1 stored in the light emitting component storage body 18 in the storage unit 38 is performed. The rank correction value 40 for the light emitting component housing 18 is registered.

  When production is started, substrate loading and holding are first performed (ST21). That is, the substrate 23 carried into the substrate transport mechanism 22 from the upstream side is transported to the mounting work position and positioned and held. Next, substrate recognition is performed (ST22). That is, the board imaging camera 34 is moved above the board 23 together with the mounting head 31 to take an image of the component mounting position on the board 23. Next, the imaging result is recognized by the recognition function of the control unit 35, and a mounting coordinate correction value for each mounting position is calculated (ST23).

  Thereafter, component pickup is performed (ST24). That is, the mounting head 31 is moved to the component supply unit 24, and the light emitting component 1 is sucked and held by the nozzle 32 via the component supply unit 25 from the light emitting component storage body 18 (component extracting step). Then, the mounting head 31 holding the light emitting component 1 by the nozzle 32 is moved above the component imaging camera 33 to perform component recognition (ST25). That is, the position of the light emitting component 1 is detected by recognizing the light emitting component 1 taken out by the mounting head 31 (component position recognition step). Thereby, the component position shift which shows the position shift of the light emitting component 1 in the state hold | maintained at each nozzle 32 is acquired (ST26).

  Next, nozzle target position calculation is performed (ST27). That is, the target position for moving the mounting head 31 holding the light-emitting component 1 with the nozzle 32 for component mounting is set to the mounting coordinate correction value obtained in (ST23) and the component position shift acquired in (ST26). Calculate based on At this time, the rank correction value 40 registered in advance in the storage unit 38 in (ST16) of FIG. 7B is applied, and correction for aligning the light emitting unit 3 of the light emitting component 1 at a predetermined position is also performed. Done.

  Next, an adhesive is applied (ST28). That is, the mounting head 31 holding the light emitting component 1 by the nozzle 32 is accessed to the adhesive application unit 26, and the temporary fixing adhesive is applied to the application position on the lower surface of the light emitting component 1. This adhesive application is required only when the light emitting component 1 is soldered to the substrate 23. That is, in solder joining, the light-emitting component 1 may move from the mounting position by a self-alignment action during reflow, and is temporarily fixed with an adhesive in advance in order to prevent displacement due to this. Instead of applying the adhesive to the light emitting component 1, the adhesive may be applied in advance to the mounting position of the substrate 23. In addition, when a conductive adhesive other than solder is used, it is not necessary to apply an adhesive for temporary fixing.

  Next, component mounting is executed (ST29). That is, by using the rank correction value 40 stored in the storage unit 38 and the position of the light emitting component 1 detected in the component position recognition step, the mounting head moving mechanism 30 that moves the mounting head 31 is controlled to emit light. The light emitting component 1 is mounted by aligning the portion 3 with a predetermined position on the substrate 23 (light emitting component mounting step). Here, position control of the mounting head 31 is performed based on the nozzle target position calculated in (ST27), and thereby the light emitting part 3 of the light emitting component 1 is aligned with a predetermined position in each mounting position of the substrate 23. The

  Next, it is confirmed whether or not the component mounting work for the board 23 is completed (ST30). If it is not completed, the process returns to (ST24) and the subsequent work is repeatedly executed. If the completion of the component mounting operation is confirmed in (ST30), the substrate holding release & unloading is performed (ST31). That is, the holding of the substrate 23 in the substrate transfer mechanism 22 is released, and the substrate 23 after the component mounting operation is completed is carried out to the downstream side by the substrate transfer mechanism 22. Thereby, the component mounting work for one substrate 23 is completed.

  Here, an example is shown in which the rank correction value 40 registered by the component supply work support process (Embodiment 1) shown in FIG. 7B is used. That is, the rank read from the rank information 5 that defines the correspondence between the rank 7 and the rank correction value 8 shown in FIG. 2B and the two-dimensional barcode 17 included in the light emitting component storage body 18 shown in FIG. 5 is specified. From the information, the rank correction value 40 used in the light emitting component mounting process is specified, and the specified rank correction value 40 is stored in the storage unit 38 in the storage process.

  Note that component mounting may be performed using the rank correction value 40 registered by the component supply work support process (second embodiment) shown in FIG. FIG. 9A shows a light-emitting component housing 18A used in this case, and a two-dimensional barcode 17A as an information recording medium is affixed to the light-emitting component housing 18A. In the two-dimensional barcode 17A, the part name 6 and the rank correction value 8 shown in FIG. 2B are recorded together, and the rank to be registered in the storage unit 38 by reading the two-dimensional barcode 17A. The correction value 40 can be read directly. In this case, it is not necessary to previously store the rank information 5 shown in FIG.

  With reference to FIG. 9B, the component supply work support processing (Embodiment 2) will be described. Similarly to the first embodiment, this component supply work support processing also stores the rank correction value 40 for production execution in the storage unit of the component supply unit 25 for each of the light emitting component storage bodies 18A used prior to the start of production. 38, and can be used for component mounting work, and is performed using the processing function of the host system 36.

  First, the component supply unit 25 to be worked is notified (ST41). That is, among the plurality of component supply units 25 mounted on the component supply unit 24 of the component mounting device 20, the notification lamp of the component supply unit 25 that is the target of the component supply operation is turned on to notify the operator. Next, the worker who has received this notification sets the component storage tape 15 in the component supply unit 25 and also reads the two-dimensional barcode 17A of the reel 16 to which the component storage tape 15 is connected as a reading means. Detection is performed using a code reader (ST42). As a result, the component name 6 and the rank correction value 8 (FIG. 2B) of the light emitting component 1 housed in the light emitting component housing 18A are read, and the read result is transmitted to the host system 36.

  Next, it is determined whether or not the part names match (ST43). In other words, the host system 36 compares the read part name with the part name defined in advance in the production data 39 corresponding to the mounting address of the part supply unit 25, and determines the match / mismatch. If it is determined that there is a mismatch, this is notified by a notification means such as a notification lamp or a display panel of the component mounting apparatus 20 (ST44).

  If it is determined that the data match in (ST43), rank correction value registration is performed (ST45). That is, the host system 36 registers the read rank correction value 8 in the storage unit 38 of the control unit 35 as the rank correction value 40 used when mounting the light emitting component 1 in the same manner as in the first embodiment. As described above, in (Embodiment 2), the rank correction value 8 is read from the two-dimensional barcode 17A as the information recording carrier provided in the light emitting component storage body 18A, and is read in the storage step of storing in the component mounting device 20. The rank correction value 8 is registered in the storage unit 38 as the rank correction value 40. The subsequent steps are the same as in (Embodiment 1), and in component mounting, the control unit 35 controls component mounting using the rank correction value 40 registered in the storage unit 38.

  In the component mounting system 37 to which the component supply work support process (Embodiment 2) shown in FIG. 9B is applied, the light emitting component storage body 18A has the light emitting unit 3 with respect to the light emitting unit reference position 3C * of the light emitting component 1. Among the light emitting components 1 classified into a plurality of ranks 7 according to the position deviation state, a plurality of light emitting components 1 belonging to the same rank 7 are stored, and a rank correction value 8 for correcting the position deviation state is set. A two-dimensional barcode 17A as a recorded information record carrier is provided.

  The component mounting system 37 includes a reading unit such as a barcode reader or a memory reader that reads the rank correction value 8 from the two-dimensional barcode 17A of the light emitting component storage body 18A, and the rank correction value 8 read by the reading unit. The light emitting component 1 is taken out from the light emitting component housing 18 </ b> A by the upper system 36 as correction value registering means that is stored in the storage unit 20 of 20 and registered as the rank correction value 40 for production execution, and the mounting head 31. The component mounting device 20 is provided to align and mount the light emitting unit 3 of the light emitting component 1 at a predetermined position. The component mounting device 20 aligns the light emitting unit 3 of the light emitting component 1 at a predetermined position by the mounting head 31. At this time, the rank correction value 40 registered in the storage unit 38 by the host system 36 is used.

  As described above, in the light-emitting component storage body 18 and the method for manufacturing the light-emitting component storage body 18 shown in the present embodiment, the component storage tape 15 storing the plurality of light-emitting components 1 is wound and stored on the reel 16. In the manufacturing of the light emitting component housing 18 to be performed, after the light emitting characteristics of the light emitting component 1 are inspected, the light emitting component 1 placed on the transparent stage 12 is imaged and recognized from above and below, thereby recognizing the light emitting component 1. The misalignment state of the light emitting unit 3 with respect to the light emitting unit reference position is inspected, the light emitting component 1 is classified into a plurality of ranks according to the misalignment state, and the plurality of light emitting components 1 belonging to the same rank are stored in the same light emitting component. It is stored in the body 18.

  Accordingly, even when the light emitting component 1 having a variation in the positional deviation state of the light emitting unit 3 with respect to the light emitting unit reference position 3C * is targeted, it is classified into a plurality of ranks according to the positional deviation state of the light emitting unit 3. Thus, the light emitting component 1 can be supplied, and in the prior art, it is possible to prevent inconvenience caused by supplying components in various variations regardless of the above-described variations. Yes.

  Further, in the component mounting apparatus, the component mounting method, and the component mounting system shown in the present embodiment, the light emission classified into a plurality of ranks according to the positional deviation state of the light emitting unit 3 with respect to the light emitting unit reference position 3C * of the light emitting component 1. Among the components 1, when mounting a light-emitting component taken out from the light-emitting component storage body 18 that stores a plurality of light-emitting components 1 belonging to the same rank, on the substrate 23, from the information record carrier provided in the light-emitting component storage body 18 The information regarding the rank of the light-emitting component housed is read, a correction value used when mounting the light-emitting component 1 is specified based on the read information, is registered in the control unit 35 of the component mounting apparatus 20, and is mounted by the mounting head 31. When the light emitting component is mounted, the light emitting part of the light emitting component is aligned with a predetermined position of the substrate 23 using the registered correction value.

  This eliminates the inconvenience that occurred in the component mounting work due to the fact that the components to be mounted were supplied in a mixed state of components with various variations regardless of the aforementioned variations. Is possible. That is, it is not necessary to detect the misalignment state of the light emitting unit based on the result of the recognition process in which the light emitting component is imaged and recognized in the component mounting apparatus. Therefore, even when the light emitting component 1 having a variation in the positional deviation state of the light emitting unit 3 with respect to the light emitting unit reference position 3C * is targeted, the imaging and recognition processing of the light emitting component for detecting the positional deviation state is performed. Therefore, productivity can be improved while ensuring quality.

  The component mounting apparatus, the component mounting method, and the component mounting system according to the present invention can improve productivity while ensuring quality even when a light emitting component having a variation in the positional relationship between the light emitting unit reference position and the outer shape is targeted. It has the effect that it can be improved, and is useful in the field of manufacturing a lighting substrate by mounting a plurality of light emitting components.

DESCRIPTION OF SYMBOLS 1 Light-emitting component 3 Light-emitting part 3C Light emission center 3C * Light-emitting part reference position 15 Component storage tape 15c Storage pocket 16 Reel 17, 17A Two-dimensional barcode 18, 18A Light-emitting component storage body 20 Component mounting apparatus 23 Board | substrate 24 Component supply part 25 Component Supply unit 30 Mounted head moving mechanism 31 Mounted head 33 Component imaging camera 35 Control unit 36 Host system 37 Component mounted system R0 to R8 Rank

Claims (6)

A component mounting apparatus that takes out the light emitting component by a mounting head from a light emitting component storage body that is arranged in a component supply unit and stores a plurality of light emitting components, and mounts the light emitting component on a substrate.
The light-emitting component storage body stores a plurality of light-emitting components belonging to the same rank among the light-emitting components classified into a plurality of ranks according to the positional deviation state of the light-emitting portion with respect to the light-emitting portion reference position of the light-emitting component. Has been
A storage unit for storing a correction value corresponding to the rank of the light emitting component housed in the light emitting component housing;
A component position recognition unit for detecting the position of the light emitting component by recognizing the light emitting component taken out by the mounting head;
By controlling a mounting head moving mechanism that moves the mounting head using the correction value stored in the storage unit and the position of the light emitting component detected by the component position recognition, the light emitting unit is moved to the substrate. A component mounting apparatus comprising: a mounting control unit that mounts the light emitting component in alignment with a predetermined position. A component mounting method in which the light emitting component is taken out by a mounting head from a light emitting component storage body that is arranged in a component supply unit and stores a plurality of light emitting components, and is mounted on a substrate.
The light emitting component housing includes a plurality of light emitting components belonging to the same rank among the light emitting components classified into a plurality of ranks according to a positional deviation state of the light emitting unit with respect to a light emitting unit reference position of the light emitting component. Is stored,
A storage step of storing a correction value corresponding to the rank of the light emitting component stored in the light emitting component storage body in a storage unit;
Removing the light emitting component from the light emitting component housing by the mounting head;
A component position recognition step of detecting the position of the light emitting component by recognizing the light emitting component taken out by the mounting head;
By controlling a mounting head moving mechanism that moves the mounting head using the correction value stored in the storage unit and the position of the light emitting component detected by the component position recognition, the light emitting unit is moved to the substrate. And a light-emitting component mounting step of mounting the light-emitting component in alignment with a predetermined position.   The correction value used in the light emitting component mounting step is specified from rank information that defines the correspondence between the rank and the correction value, and information that specifies the rank read from an information record carrier provided in the light emitting component storage body. The component mounting method according to claim 2, wherein the correction value specified in the storing step is stored in the storage unit.   4. The component mounting method according to claim 3, wherein the correction value is read from an information record carrier provided in the light emitting component storage body, and the correction value read in the storage step is stored in the storage unit. A component mounting system in which the light emitting component is taken out by a mounting head from a light emitting component storage body that is arranged in a component supply unit and stores a plurality of light emitting components, and is mounted on a substrate.
The light-emitting component storage unit stores a plurality of light-emitting components belonging to the same rank among the light-emitting components classified into a plurality of ranks according to a positional deviation state of the light-emitting portion with respect to a light-emitting portion reference position of the light-emitting component. And an information record carrier on which information specifying the rank is recorded,
Reading means for reading the information specifying the rank from the information record carrier of the light emitting component housing;
Rank information that defines a correspondence relationship between the rank and a correction value for correcting the misalignment state is stored, and is used when the light emitting component is mounted based on information that identifies the rank read by the reading unit. Correction value registration means for specifying a correction value and registering the specified correction value in the component mounting device;
A component mounting device that takes out the light emitting component from the light emitting component storage body with a mounting head and aligns and mounts the light emitting part of the light emitting component at a predetermined position of the substrate,
The component mounting apparatus uses the correction value registered by the correction value registration means when the light emitting part of the light emitting component is aligned at a predetermined position by the mounting head. A component mounting system in which the light emitting component is taken out by a mounting head from a light emitting component storage body that is arranged in a component supply unit and stores a plurality of light emitting components, and is mounted on a substrate.
The light-emitting component storage unit stores a plurality of light-emitting components belonging to the same rank among the light-emitting components classified into a plurality of ranks according to a positional deviation state of the light-emitting portion with respect to a light-emitting portion reference position of the light-emitting component. And an information record carrier that records a correction value for correcting the misalignment state,
Reading means for reading the correction value from the information record carrier of the light emitting component housing;
Correction value registration means for registering the correction value read by the reading means in a component mounting device;
A component mounting device that takes out the light emitting component from the light emitting component storage body with a mounting head and aligns and mounts the light emitting part of the light emitting component at a predetermined position of the substrate,
The component mounting apparatus uses the correction value registered by the correction value registration means when the light emitting part of the light emitting component is aligned at a predetermined position by the mounting head.

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