TWI400020B - Picking-up and placing method with integrated pcb information - Google Patents

Description

Method for integrating board information

The invention relates to a method for placing components, in particular to a method for integrating information of circuit boards.

The conventional circuit board is a large-area motherboard, such as a motherboard in a computer system, but as electronic devices such as PDAs, cell phones, or digital cameras become smaller and smaller, the size of the circuit substrate also shrinks. In order to consider the efficiency of production, the industry combines most small circuit boards (also known as daughter boards) into a large circuit board (also known as multi-board) to facilitate the subsequent mass production process. However, since the small-sized circuit boards may not conform to the specifications due to variations in the production of the boards during the production process, the sub-boards listed as defective products are marked with the bad mark. On the sub-board or the corresponding position of the board edge, so that the subsequent pick-up process can be based on the detection to obtain relevant information, avoiding the above-mentioned bad daughter board to avoid the component (resistance capacitor IC flip chip. ..) installed on the bad sub-boards.

Traditionally, the opportunity is first loaded into the multi-plate, and the position of the fiducial mark is first performed by the mobile camera, and then the camera is used for the analysis and detection of the defective product or the target (local fiducial). Mark) identification test operation. In other words, the traditional pick-and-place machine uses the same camera with the XY stage to analyze and detect the target and the bad sub-board mark, and the camera must rely on the hardware action of the XY stage to move. To find out whether there are bad marks on each of the sub-boards, and to check the information of the bad sub-boards, and then start the subsequent setting steps according to the above-mentioned detection information, in other words, the traditional detection It is related to the parting operation, and the parting operation must wait for the completion of the inspection operation before it can be placed according to the detection result.

Therefore, the conventional pick-and-place machine uses the hardware movement method to perform the above-mentioned program operation for detecting the defective sub-board. When the number of the joint boards is increased, the production time of the set machine is inevitably increased.

In the current pick-and-place machine, the image capture time of the camera for a single daughter board is about 0.3 seconds, so the overall time of detection of a multi-plate with 100 MICRO-SD can be estimated to be 30 seconds ( Including the camera's movement time, etc.), plus the filming, filming, target detection time is 4 seconds, plus the set time is 40 seconds (assuming a board is placed 4 components, each component is placed The release time is 0.1 second, so when the 100-piece sub-boards are good, the calculation of the placement time is 100 pieces × 4 elements × 0.1 sec / piece = 40 seconds), so the take-up machine is wasted due to detection of defective sub-boards. The percentage of working hours is: 30/(4+30+40)=40.5%, which greatly reduces the production efficiency of the production line.

On the other hand, the Republic of China Patent Publication No. 201015062 proposes a method for detecting the marking of the multi-plate, which can detect the defective product mark on the circuit board by using an independent detecting device, but due to the type of the device. There are many, so there may be multiple tandem pick-up machines on the production line. Because of the possibility of taking out the continuous production board due to special factors during the production process, it may cause the pick-up machine to obtain the incorrect mark of the defective product. Knowing the information, causing the pick-up machine to perform the wrong setting operation.

One of the objects of the present invention is to provide a method for integrating board information, so as to reduce or even prevent placement errors.

Embodiments of the present invention provide a method for integrating information on a circuit board, including the following steps:

(1) providing a plurality of circuit boards, each of which is a multi-layer board composed of a plurality of sub-boards, wherein each of the circuit boards has a data storage medium for storing initial information of the circuit board;

(2) feeding the circuit boards to a detecting unit, the detecting unit having at least one reading device for reading the data storage medium and a function for detecting each of the circuit boards Whether there is a detecting device for the defective sub-board mark on the sub-board, wherein the detecting device acquires a bad sub-board information, and the detecting unit reads the initial information of the circuit board read by the reading device and the detecting device The detected bad sub-board information is integrated into a board device information corresponding to each of the boards, and the board device information is output;

(3) providing at least one component mounting machine, and feeding the detected circuit boards into the component mounting machine, the component mounting machine is based on the circuit board component information, and is in the good product A set of steps is performed on the board.

The invention has the following beneficial effects: the invention mainly integrates the obtained bad sub-board information with the initial information such as the circuit board production number recorded on the circuit board, so that the bad sub-board information and the initial information of the circuit board have mutual correspondence. The effect is that when the device is placed, the component dressing machine can capture the corresponding bad daughter board information according to the ID number of each circuit board, thereby greatly reducing the risk of the wrong component.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

The invention provides a method for integrating the information of the circuit board, wherein the material ID, the number, the manufacturer's data, and the like are recorded in the manner of the data storage medium, and the bad sub-board information obtained by the detection is integrated with the foregoing data. Together, the subsequent placement operations can capture the correct bad sub-board information based on the material such as the sheet ID to reduce the chance of incorrect placement.

Please refer to FIG. 2, which is a schematic diagram of a circuit board 30, which is a multi-layer board composed of a plurality of sub-boards 301, which are differentiated into good products after a certain discriminating step. The defective board, and the sub-board 301 belonging to the defective product is marked by the bad mark mark 31; in addition, the circuit board 30 further has a data storage medium 32 for storing the initial information of the circuit board, such as A recording medium such as a bar code, which contains sheet ID data, serial number, manufacturer's resume data, and the like.

Referring to FIG. 1 , the detecting device 11 of the detecting unit 10 of the present invention can quickly detect the bad sub-board mark 31 to obtain bad sub-board information; on the other hand, the detecting unit 10 can further be provided with reading. Taking device 12, such as a two-dimensional barcode scanner or the like, to read the initial board information of each circuit board 30; the detecting unit 10 can integrate the bad sub-board information and the initial information of the circuit board into a circuit board component. The information enables the subsequent component dressing machine 20 to capture the corresponding circuit board component information according to the initial board information of each circuit board 30, so that the component board 301 belonging to the good product can be placed, that is, the component dressing machine The table 20 can be placed according to the correct board device information without placing the components on the defective daughter board 301, thereby achieving material saving effect. Therefore, the present invention can effectively determine which is the defective sub-board 301, which is the good sub-board 301, and transmit the information to the rear component mounting machine 20, saving the traditional pick-up machine using hard The body mechanism moves to detect the time wasted by the bad daughter board, and the component dressing machine 20 can use the initial information of the board to capture the correct board information to avoid using the wrong bad board information.

Referring to FIG. 1, in the specific embodiment, the detecting device 11 can be an image capturing device having a predetermined resolution and a predetermined magnification and operating at a predetermined working distance (WD). Take the image of the board 30. In this embodiment, the image capturing device of the larger field of view is used to capture the full image or part of the image of the circuit board 30 according to the condition of the corresponding predetermined working distance. Specifically, the image resolution of the image capturing device of the present invention can be 1.6k×1.2k pixels, and the spatial resolution formed by the lens can be 0.1 to 0.3 mm/pixel (mm/pixel), and the working distance WD can be 200 to 700 mm (mm); for example, the image capturing device can also be a large linear scanner with a working distance of 20 The image of the circuit board 30 is taken up to 300 mm (mm). Moreover, in the specific embodiment, the detecting unit 10 further includes a plurality of light emitting devices to provide optimal illumination of the image capturing device, and the light emitting devices may be light emitting diodes or fluorescent tubes. The image captured by the detecting device 11 can be used for image analysis (such as image analysis and recognition software application) by the computing and storage device 13 of the detecting unit 10 to identify whether there is a bad daughter board mark on the daughter board 301. 31.

Please refer to FIG. 3, which shows a first embodiment of a method for assembling integrated circuit board information according to the present invention, wherein the detecting unit 10 is matched with a single component mounting machine 20:

Step S101: A plurality of circuit boards 30 are provided. As shown in FIG. 2, the circuit board 30 can be a multi-layer board composed of eight sub-boards 301, wherein the sub-board 301 belonging to the defective product among the eight sub-boards 301 is provided with a bad one. Bad mark 31. In addition, before step one, a marking step is further included, and the defective sub-board mark 31 is disposed on a specific position corresponding to the sub-board 301 or the board edge of the defective product by using a laser ink printing or attaching method. The subsequent process is performed, wherein the defective sub-board mark 31 has a predetermined size, for example, 1×1 (mm ² ) or 4×4 (mm ² ), and the main features of the bad sub-board mark 31 need to have a height. Color contrast, in order to facilitate the accuracy of image analysis; on the other hand, the marking step can also be made on the data storage medium 32 (this embodiment is described by a two-dimensional barcode) on the circuit board 30 to record each circuit board. 30 sheet ID data, serial number, manufacturer's resume data, etc. It should be noted that the present invention does not limit the source of the data storage medium 32. For example, the production end of the circuit board can directly load the board ID or the like into the data storage medium 32 after the production is completed, or the board can be self-made by the factory. The ID, serial number, etc. are loaded into the data storage medium 32, in other words, the various storage media used on the circuit board 30, the loaded data, the source of loading, and the like are all within the scope of the present invention.

Steps S103 to S105: The circuit board 30 is sequentially or arbitrarily fed into the above-described detecting unit 10, as described above, the detecting unit 10 has the detecting device 11 and the reading device 12, and the reading device 12 is for reading. The circuit board initial information of each circuit board 30 (S103), the detecting device 11 is configured to detect the bad sub-board mark 31 on the sub-board 301 to obtain bad sub-board information; and the detecting unit 10 can read the reading device 12 The read board initial information and the bad board information detected by the detecting device 11 are integrated into a board device information corresponding to each board 30, and the board board information is output (S105). Since the image analysis is mainly performed by using the image analysis software or the like in this step, the time taken for the detection step is very small, such as one second or less, and the data integration is also processed by the arithmetic and storage device 13, so The overall steps take a relatively short time.

The sub-boards 301 may be soft boards. Due to the shrinkage of the soft board material and the smaller and smaller size of the soft board, the offset of the soft board must be considered. Therefore, each sub-board 301 is further provided. A local fiducial mark is determined based on the position of the target to determine the amount of offset compensation required. In other words, the detecting unit 10 can analyze the offset of each sub-board 301 by using the position of the positioning target and store it in the board information, and the component mounting machine 20 can be placed according to the circuit board. The record in the piece of information first compensates for the offset of the sub-board, and then performs the step of component placement, which can greatly eliminate the traditional image processing of the two positioning targets on each sub-board 301 by the camera. Invalid production hours.

In another embodiment, in a specific embodiment, the output of the circuit board component information is directly stored in the computing and storage device 13 of the detecting unit 10, so as to facilitate data capture by the component mounting machine 20 of the subsequent operation (eg, Figure 1). In another embodiment, the output board information is stored in an external data storage unit 40, such as a remote database, a cloud server, or an optical storage medium such as a CD (see FIG. 1A). ) or through the company's Shop-flow and other information systems to access the data.

Steps S107 to S109: a component mounting machine 20 is provided, and the detected circuit board 30 is sequentially or arbitrarily fed into the component mounting machine 20, and the component mounting machine 20 is grasped corresponding to the circuit board 30. The circuit board device information (S107), and according to the circuit board device information, a component step (S109) is performed on the sub-board 301 which is a good product; and the component mounting machine 20 can be used for the SMD process. Or a wafer handler or a crystal wire bonder in a packaging process, such as a die bonder or wire bonder, or other device or device that can be used for wafer fetching or wire bonding (for example, in a BGA package process, can be produced) MICRO-SD, DDRII, III and other products). Furthermore, the component mounting machine 20 can further have an auxiliary reading device 21 for reading the initial board information of the circuit board 30 before the circuit board 30 is fed into the component mounting machine 20. This part will be in the latter embodiment. Detailed description.

In addition, this step will have the following differences according to the different embodiments described above:

As shown in FIG. 1, when the board device information is stored in the detecting unit 10, the component mounting machine 20 is connected to the detecting unit 10 to capture the board information stored in the detecting unit 10. The described placement steps are performed.

As shown in FIG. 1A, the circuit board component information is stored in the external data storage unit 40, and the component mounting machine 20 is connected to the external data storage unit 40, such as any wired transmission, wireless transmission, or optical disk loading. The step of placing is performed by grabbing board layout information stored in the external data storage unit 40.

Referring to FIG. 4, a second embodiment of a method for assembling integrated circuit board information according to the present invention is shown, wherein the detecting unit 10 is equipped with two component mounting machines 20 for two-stage placing operations. And each component dressing machine 20 can further have an auxiliary reading device 21, and the steps of the second embodiment are as follows:

Step S201: A plurality of circuit boards 30 are provided. This step is the same as the foregoing S101, and therefore will not be described again.

Steps S203 to S207: The circuit board 30 is sequentially or arbitrarily fed into the detecting unit 10, and the detecting unit 10 can read the board initial information (S203) read by the reading device 12 and the detecting device 11 The detected bad daughter board information (S205) is integrated into the board member information corresponding to each board 30, and is output (S207). Similarly, the board device information can be directly stored in the computing and storage device 13 of the detecting unit 10, or stored in an external data storage unit 40 such as a database or an optical storage medium; and S201 to S207 can be summarized as a detection. step.

The next step is to provide a plurality of component mounting machines 20, and the detected circuit boards 30 are sequentially or randomly fed into the component mounting machines 20, and the component mounting machines 20 are arranged according to the circuit boards. Piece information, and a placement step is performed on the sub-board 301 that is a good product. In the present embodiment, the two components are mounted on the machine 20 for explanation, but not limited thereto; the first component dressing machine 20 is responsible for the first stage of the placement operation (S209 to S213), and is checked. When one of the circuit boards 30 is fed into the first component mounting machine 20, the data storage medium of the circuit board 30 is read by the auxiliary reading device 21 to obtain the initial circuit board of the circuit board 30. Information (S209), and the first component mounting machine 20 can capture the corresponding circuit board component information (S211) from the detecting unit 10 or the external data storage unit 40 according to the initial information of the circuit board, so that the first station The component dressing machine 20 can perform the first-stage placing operation according to the bad sub-board information in the correct circuit board piece information (S213); and when the circuit board 30 passing through the first-stage setting is fed into the second component When the machine 20 is installed, the data storage medium of the circuit board 30 is first read by the auxiliary reading device 21 to obtain the initial board information of the circuit board 30 (S215), and the second component is mounted on the machine 20 according to the circuit. The board initial information is detected by the detecting unit 10 or the external data storage unit The corresponding component board information (S217) is captured in 40, so that the second component dressing machine 20 can perform the second stage setting operation according to the bad sub-board information in the correct circuit board information (S219); In this embodiment, and S209 to S219 can be summarized as a one-step process.

Therefore, before the component dressing machine 20 performs the mounting, the board first obtains the initial information of the circuit board 30 so that the component mounting machine 20 can be placed according to the correct board mounting information. Taking the above embodiment as an example, it is assumed that three circuit boards 30 numbered A, B, and C sequentially enter the detecting unit 10 for detection, and then generate circuit boards corresponding to the three circuit boards 30 of A, B, and C. The piece of information, and then through the first component dressing machine 20 to complete the first stage of the placement operation, if the operator removes the circuit board 30 of the number B from the production line due to manufacturing problems or equipment machine, The mounting operation of the second component mounting machine 20 is not continued, and the circuit boards 30 of the numbers A and C continue to pass the mounting of the second component mounting machine 20. When the circuit board 30 of the number C enters the second component mounting machine 20, the auxiliary reading device 21 of the second component mounting machine 20 can read the data storage medium 32 of the circuit board 30 of the number C, and according to The circuit board initial information of the circuit board 30 of the number C obtains the circuit board component information corresponding to the circuit board 30 of the number C, without mistaking the circuit board component information corresponding to the circuit board 30 of the number B, in other words, by Integrating the initial information of the board and the bad sub-board information into the information of the circuit board components corresponding to each circuit board 30 can prevent the component dressing machine 20 from grasping the incorrect bad sub-board information, so that the component dressing machine 20 has a comparative Good placement efficiency. In addition, the three circuit boards 30 numbered A, B, and C can also be arbitrarily transmitted to the detecting unit 10 for detection, and the circuit board components corresponding to the three circuit boards 30 of A, B, and C are generated. The information is passed through the first component dressing machine 20 and the second component dressing machine 20 sequentially or arbitrarily, and the first component dressing machine 20 and the second component dressing machine 20 can utilize each The board board information of the circuit board 30 captures the correct bad board information.

From the actual data analysis, the present invention can effectively improve the performance of the production line. For example, in the case of the FPC module, the circuit board 30 has 35 regions, and a total of 420 positions are required, and the capacity can be 55440. The film/day is increased to 69,300 pieces/day, which increases the production capacity by about 25%. For the SD card, for example, there are 210 areas on the circuit board 30, and a total of 840 positions are required. The capacity can be 304204 pieces. / Day increased to 431,970 pieces / day, an increase of about 42% of production capacity.

On the other hand, the present invention can also be applied to a package production line. For example, after the component mounting machine 20 performs the component mounting, the operator performs an inspection and marks the sub-board 301 that is not in the process specification, and the circuit board is marked. 30 can return to the detecting unit 10 for image analysis, and record the position of the sub-board 301 that is not in accordance with the process specification in the board information, and repeat the steps of multiple times of placing → detecting → placing... The information in the board contains the information of whether each sub-board 301 is correct in different parts, and is encoded in each sub-board 301 by using techniques such as printing according to different process errors, for example, according to color, so as to cut After that, the user can use different colors to classify the products produced.

In summary, the present invention has at least the following advantages:

1. The invention utilizes the independently operated detecting unit and the component dressing machine to respectively perform the checking operation and the mounting work of the circuit board, so in the application, the detecting work and the mounting work do not interfere with each other (that is, both can be At the same time, it is necessary to solve the problem that the traditional component dressing machine must first perform the defective product inspection and then leave the device for too long idle time.

2. The invention integrates the initial information such as the bad sub-board information and the circuit board production number, so that the bad sub-board information and the initial information of the circuit board have a one-to-one effect, so when manufacturing and manufacturing, the component dressing machine can be based on The ID number of each board captures the corresponding bad daughter board information, which greatly reduces the error of the placement. Therefore, in the application, the daughter board can be sent to the detecting unit or the component dressing machine arbitrarily, sequentially or according to different requirements, and the flexibility of the production line can be improved.

3. The invention can also be applied to a packaging production line. After each packaging process, the circuit board can be returned to the detecting unit for detection and analysis, and the production defects after each process are recorded in the circuit board information. Therefore, when the product is completed, the system can effectively count the yield of each process; in addition, according to the data recorded in the board information, the defective products appearing in different processes can be marked with color and the like, so that the operator The cut products can be effectively classified.

4. The production line is merged to reduce the number of machines.

5, reduce manpower: process simplification makes the nature naturally reduced.

6. Reduce the effect of indirect costs such as electricity and maintenance costs.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalents of the present invention are intended to be included within the scope of the present invention.

10. . . Detection unit

11. . . Detection device

12. . . Reading device

13. . . Computing and storage device

20. . . Component dressing machine

twenty one. . . Gas flow unit

30. . . Circuit board

301. . . Daughter board

31. . . Bad daughter board mark

32. . . Data storage medium

40. . . External data storage unit

S101～S109. . . Process step

S201～S219. . . Process step

Fig. 1 is a schematic view showing the direct connection of the detecting unit of the present invention to the component dressing machine.

Fig. 1A is a schematic view showing the connection between the detecting unit of the present invention and the component dressing machine through an external data storage unit.

Figure 2 is a schematic view showing a circuit board of the present invention.

Figure 3 is a flow chart showing a first embodiment of the method of carrying out the present invention.

Figure 4 is a flow chart showing a second embodiment of the method of carrying out the present invention.

S101～S109. . . Process step

Claims (10)

A method for integrating board information includes the following steps: providing a plurality of circuit boards, each of which is a multi-layer board composed of a plurality of sub-boards, wherein each of the circuit boards has one for storing a data storage medium for initial information of the circuit board; the circuit boards are sent to a detecting unit, the detecting unit has at least one reading device for reading the data storage medium, and a detecting device for detecting each of the circuits Whether there is a detection device for the defective sub-board mark on each of the sub-boards on the board, wherein the detecting device acquires a bad sub-board information, and the detecting unit reads the initial information of the circuit board read by the reading device Integrating the bad sub-board information detected by the detecting device into a board device information corresponding to each of the circuit boards, and outputting the board device information; and providing at least one component mounting machine, and detecting The known circuit boards are fed into the component dressing machine, and the component dressing machine performs a placing step on the sub-board which is good according to the board device information. The method for assembling integrated circuit board information according to claim 1, wherein in the step of feeding the circuit boards into a detecting unit, the detecting unit further comprises an operation and storage device, the circuit The board information is stored in the detection unit. The method for assembling integrated circuit board information according to claim 2, wherein in the step of providing at least one component mounting machine, the component mounting machine is connected to the detecting unit to capture and store The board placement step is performed by the board device information of the detecting unit. The method for assembling integrated circuit board information according to claim 2, wherein in the step of providing at least one component dressing machine, the component dressing machine further has an auxiliary reading device, when detected When one of the circuit boards is fed into the component mounting machine, the auxiliary reading device first reads the initial information of the circuit board stored in the data storage medium, and then connects to the detecting unit to capture and store The board mounting information in the detecting unit and corresponding to the initial information of the board causes the component dressing machine to perform the placing step according to the board setting information. The method for assembling integrated circuit board information according to claim 1, wherein in the step of feeding the circuit boards into a detecting unit, the detecting unit stores the circuit board component information in the An external data storage unit. The method for assembling integrated circuit board information as described in claim 5, wherein the external data storage unit is a database or an optical storage medium. The method for assembling integrated circuit board information according to claim 5, wherein in the step of providing at least one component dressing machine, the component dressing machine is connected to the external data storage unit to capture and store The placing step is performed on the board device information of the external data storage unit. The method for assembling integrated circuit board information according to claim 5, wherein in the step of providing at least one component dressing machine, the component dressing machine further has an auxiliary reading device, when detected When one of the circuit boards is fed into the component mounting machine, the auxiliary reading device first reads the initial information of the circuit board stored in the data storage medium, and then connects to the external data storage unit to capture The board placement information stored in the external data storage unit and corresponding to the initial information of the board, causes the component dressing machine to perform the placing step according to the board device information. The method for assembling integrated circuit board information as described in claim 1, wherein after the step of placing the component, the circuit board that is completed is sent to the detecting unit to detect that the daughter boards are in the Whether the described step is normal. The method for assembling integrated circuit board information according to claim 1, wherein in the step of feeding the circuit boards into a detecting unit, the detecting unit further detects each of the circuit boards. Positioning the target on the daughter board to analyze the offset of each of the daughter boards of the board and record the offset in the board device information.