TWI452284B - The method of detecting the mark of the multi-board, the method of detecting the device and the multi-board - Google Patents

Description

Method for detecting marking of multi-plate, detecting device and method for mounting multi-plate

The invention relates to a method for detecting a mark of a multi-joint plate, in particular to a defect image of a sub-board that is completely captured and then analyzed, or a positioning target of the multi-plate. The device method is detected and the information of the detection result is transmitted to the production machine at the rear.

The conventional circuit board is a large-area motherboard, such as a motherboard in a computer system, but as electronic devices such as PDAs, cell phones, or digital cameras become smaller and smaller, the size of the circuit substrate also shrinks. In order to consider the efficiency of production, the industry combines most small circuit boards (also known as daughter boards) into a large circuit board (also known as multi-board) to facilitate the subsequent mass production process. However, since the small-sized circuit boards may be inconsistent with the electrical continuity (ie, circuit characteristics such as open circuit and short circuit) due to variations in the process during the manufacturing process, the small circuit boards listed as defective products will be Manually setting a bad mark on the small circuit boards, so that subsequent acquisition processes can obtain the relevant information according to the detection, and avoid the bad circuit board to avoid component loading. Set on the bad sub-boards. Another consideration is that there must be a fixed spacing between the two sub-boards on the multi-plate, in order to meet the precision requirements of the subsequent surface-adhesive component placement, but there is a difference between manufacturing and material shrinkage between the two sub-boards. Distance error, the accumulated error after the multi-plate combination will cause the placement accuracy of the surface-adhesive component, so the subsequent production machine (such as the acquisition) Machine, die bonder, etc.) need to additionally visually identify the local fiducial mark of each sub-board to correct the above error value, but this additional visual recognition processing time will greatly reduce the production line The rate of utilization (about 10%-30%).

On the other hand, the traditional pick-up opportunity is loaded into the multi-plate, and a mobile camera is used to first perform the positioning of the fiducial mark, and then the camera is used to perform the analysis and detection of the defective product or the positioning target. Identification test of the target (local fiducial mark). In other words, the traditional pick-and-place machine uses the same camera with the XY stage to analyze and detect the target and the bad sub-board mark, and the camera must rely on the hardware action of the XY stage to move. To find out whether there is a bad mark on each small circuit board in the large circuit board, and to check the information of the bad board, and then start the subsequent setting step according to the above-mentioned detection information to complete all the settings. After the piece is finished, the action of loading the multi-plate is finally performed.

Therefore, the conventional pick-and-place machine uses the hardware movement method to perform the above-mentioned program operation for detecting the defective sub-board. When the number of the joint boards is increased, the production time of the set machine is inevitably increased.

Please refer to the ninth figure. In the current device, the image capture time of the camera on a single small circuit board is about 0.3 seconds. Therefore, consider the detection of a multi-plate with 100 MICRO-SD. The time can be estimated to be 30 seconds (including the camera's movement time, etc.), plus the filming, filming, target detection time is 4 seconds, plus the set time is 40 seconds (assuming a daughter board is placed 4 The components and each component are placed for 0.1 second. Therefore, when 100 pieces of sub-boards are good, the calculation of the placement time is 100 pieces × 4 elements × 0.1 sec / piece = 40 seconds), so that the total time of the placement machine is 74 seconds, and the SMT production line The working time of the printing machine is 25 seconds, and the working time of the reflowing machine is 25 seconds, so the cycle time of the whole production line is 74 seconds, that is, the operation of the pick-up machine will become the production bottleneck of the entire production line. The production capacity of the production line is limited.

The reason is that the inventors have felt that the above-mentioned deficiency can be improved, and proposes a present invention which is rational in design and effective in improving the above-mentioned deficiency.

The main object of the present invention is to provide a method for detecting the marking of a multi-plate, which uses a separate detecting device to perform a complete image of the multi-plate in a relatively short time (about less than one second). Capture and perform image analysis to determine whether a defective product mark appears on the daughter board on the multi-panel board, and then transmit the detection information of the sub-boards to the pick-up machine, and the pick-up machine can utilize the detection The information is used for the placement operation, so that the production speed of the production line is greatly increased. Therefore, the detecting device is applied before the placing step to solve the problem that the conventional use of the pick-up machine for detecting the defective sub-board leads to a relatively long idle time.

In order to achieve the above object, the present invention provides a method for placing a multi-plate, comprising the steps of: (a) performing a step of detecting a mark of a multi-plate, and providing detection of a mark of an independent multi-plate The device captures a full image of a multi-plate, and detects whether there is a defective product mark on each sub-board of the multi-panel, and then outputs a detection data; and (b) provides a pick-up machine. The pick-up machine performs a placing step on the sub-board that belongs to the good according to the detection data.

The invention provides a method and device for detecting the marking of the multi-plate in front of the conventional pick-up machine, comprising the following steps: (a) providing a multi-plate comprising a plurality of sub-boards, wherein the sub-boards are not a bad mark is provided on the sub-board of the good product; (b) a detecting device for providing a mark of the independent multi-plate, the detecting device of the marking of the multi-board includes an image capturing unit and a An operation unit, wherein the image capturing unit captures a full image of the plurality of boards; and (c) sequentially using the computing unit to detect images of the plurality of boards of the plurality of boards to determine each daughter board Whether there is a mark of the defective product on the top, and the detection information is transmitted to the rear pick-and-place machine.

The invention has the following beneficial effects: the detecting device and the method thereof provided by the present invention mainly utilize a large field of view (FOV) image capturing unit to perform full image capturing of the multi-plate, so The complete image of the multi-panel can be captured to replace the mobile image capturing unit in the device for image capture of a single daughter board, and the multi-layer board is further operated by a high-speed operation unit by using an arithmetic unit. The complete image is image analyzed, so that the detection result of the defective product mark on the daughter board can be quickly known, and the detection result is transmitted to the subsequent pick-up machine, so that the pick-up machine does not take time to detect the bad sub-board. Therefore, the cycle time of the pick-up machine can be shortened. For example, the multi-plate of 100 MICRO-SD mentioned in the prior art originally takes 74 seconds, and only 44 seconds is used after the invention is used. Further improve the output efficiency of the entire production line.

In order to further understand the features and technical contents of the present invention, please refer to The following detailed description of the invention and the annexed drawings

The present invention is a detecting device 1 for providing a multi-plate mark in front of a pick-up machine for quickly and independently detecting a bad mark on a plurality of sub-boards of the multi-panel or It is a local fiducial mark and is transmitted to the rear access machine, so that the subsequent placing step can be placed on the sub-board belonging to the good product according to the detection data obtained by the detecting device 1 of the mark. The standby time of the pick-up machine (including the filming, filming, target detection time and the detection time of the defective product mark) is greatly shortened, and the inspection operation is not performed on the set machine, thereby improving the overall production line. Capacity. Please refer to the second figure, which is a schematic diagram of a multi-plate 30 embodiment, which includes a plurality of sub-boards 301 which are classified into good products and defective products after a certain discriminating step, and belong to The defective sub-board 301 is marked by a bad mark 31, and the detecting device 1 of the mark can quickly detect the defective product mark 31, so that the pick-up machine 40 can be based on The detection data obtained by the marking detecting device 1 is placed on the sub-board 301 which is a good product, that is, the taking-in machine does not set the component on the defective sub-board 301, thereby achieving material saving effect. However, the present invention can efficiently determine which is the defective sub-board 301, which is the good sub-board 301, and transmit the information to the rear access machine, thereby saving the traditional pick-up machine from using the hardware mechanism to move The time wasted to detect bad sub-boards.

Please refer to the first figure, which is a schematic diagram of the detecting device 1 for marking the multi-plate of the present invention, wherein the detecting device 1 for marking the multi-board includes an image capturing unit 10 and an arithmetic unit 20, The image capturing unit 10 has a predetermined resolution and a predetermined magnification and captures an image of the multi-plate 30 at a predetermined working distance WD. The invention mainly uses the image capturing unit 10 of a larger field of view to cooperate with the corresponding predetermined working distance WD to perform the full image capturing operation of the multi-plate 30. The image capturing unit 10 of the larger field of view cooperates with the predetermined working distance WD, so that the image capturing unit 10 can capture the complete image of the multi-plate 30 at one time, so as to solve the problem that the image must be moved hard. The idle time consumption caused by the image capture of the single sub-board 301 is performed individually and separately. For example, the image resolution of the image capturing unit 10 proposed by the present invention may be 768×576 pixels, and the spatial resolution formed by the lens may be 0.25 to 0.5 mm/ The pixels (mm/pixel) and the working distance WD can be 200 to 700 mm (mm). For example, the image capturing unit 10 can also be a large linear scanner, and the working distance WD can capture the full image of the multi-plate 30 under the condition of 20 to 300 mm. In addition, in the embodiment, the image capturing unit 10 further includes a plurality of light emitting units 101 to provide optimal illumination of the image capturing unit 10, and the light emitting units 101 may be light emitting diodes. Or fluorescent tubes, etc.

The computing unit 20 of the detecting device 1 of the multi-plate is used to receive the image of the multi-board 30 and use the image analysis software to sequentially The image of the sub-board 301 on the multi-plate 30 is examined. Please refer to the third figure, the computing unit 20 mainly has a plurality of modules, including a main module 201; a switch module 202 connected to the main module 201; a control module 203 connected to the main module 201; An auxiliary module 204 connected to the main module 201; a parameter setting module 205 connected to the main module 201; and a system module 206 connected to the main module 201, for example, the main module The group 201 further includes a control means such as a main menu and a work setting to allow the computing unit 20 to receive and analyze the complete image of the multi-board 30; and if the parameter setting module 205 includes a multi-board parameter setting means, detecting The parameter means, etc., the means for setting the multi-plate parameter can set the size specification of the multi-plate 30 to be detected, and the means for detecting the parameter can set different detection conditions, such as the size of the light source, etc., so that the operation unit 20 The image capturing unit 10 can be feedback controlled to perform optimal image capturing. The other modules of the computing unit 20 are functions such as product selection or system adjustment, and are not described here.

In addition, the detecting device 1 of the multi-plate label can be matched with a pick-up machine 40. In fact, the pick-up machine 40 can be a wafer pick-up machine or a wire-punching machine, such as a die bonder or the like, which can be used for wafer pick-up. Or a line-connected machine or device (for example, a packaging process of the BGA, which can produce products such as MICRO-SD, DDR II, etc.), and the access machine 40 can obtain the detection data through the operation unit 20, the detection The data can record the advantages and disadvantages of the daughter board on the multi-board, and the pick-up machine 40 can perform the work of the set according to the detection data. In other words, the marking device 1 of the multi-plate can be applied to the SMD process or the wire bonding process of a general component factory.

Please refer to the fourth figure, which is a method for detecting the marking of the multi-plate according to the present invention, which includes the following steps: Step (a): providing a multi-plate 30 comprising a plurality of sub-boards 301, wherein A sub-board 301 belonging to the defective product in the sub-board 301 is provided with a bad mark 31. Further, before the step (a), a marking step is further included, and the defective product mark 31 is disposed on the sub-board 301 belonging to the defective product by a laser or attaching method to facilitate the subsequent process, wherein the defective product The mark 31 has a predetermined size, for example, a size of 3 × 3 (mm 2 ) or 4 × 4 (mm 2 ), and the main feature of the defective product mark 31 is required to have a high contrast to facilitate the accuracy of image analysis.

The sub-board 301 may be a soft board. Due to the shrinkage of the soft board material and the smaller and smaller size of the soft board, the offset of the soft board must be considered. Therefore, each sub-board 301 is further provided. A local fiducial mark is determined based on the position of the target to determine the amount of offset compensation required.

Step (b): a detecting device 1 for providing a mark of a separate multi-plate, the detecting device 1 for marking the multi-board includes an image capturing unit 10 and an arithmetic unit 20, wherein the image capturing unit is used The unit 10 captures the full image of the multi-plate 30. As described above, the image capturing unit 10 has a predetermined resolution and a predetermined magnification and captures the same under a predetermined working distance WD. The complete image of the board 30.

Step (c) sequentially detecting the multi-plate 3 by using the operation unit 20 The image of the sub-boards 301 of 0 determines whether or not the defective product mark 31 is present on each of the sub-boards 301. Before the step, the user can set the size of the daughter board 301 by using the parameter setting module 205 in the computing unit 20, that is, perform a step of setting the size of the daughter board 301, so that the computing unit 20 can be The sub-board size sequentially detects images of the sub-boards 301 of the multi-board 30.

In addition, the computing unit 20 first defines a range of interesting ROI (please refer to FIG. 5A), and moves the detected area ROI to a position corresponding to the image of the daughter board 301 to be analyzed. Thereby, the arithmetic unit 20 can analyze whether the defective product mark 31 appears in the detection area ROI to determine whether the defective product mark 31 is present on the one sub-board 301; and then obtain a detection result. Next, the operation unit 20 determines whether to continue the analysis work of the next sub-board 301 until the last sub-board 301 in the image of the captured multi-plate 30 is analyzed, and the above-mentioned detection result is integrated. Output a detection data. Since the analysis is mainly performed using image analysis software or the like in this step, the time taken for this analysis step is very small, such as one second or less.

Please refer to the fifth to fifth B drawings, which show the detection process of the multi-plate 30 of another aspect (BGA package, such as the physical photos shown in Annexes 2 to 6), which is more in this embodiment. The sub-board 30 includes ten sub-boards 301, and the multi-plate 30 has a size of about 245 mm. The sub-boards 301 have only the leftmost end of the upper and lower sub-boards 301 with defective marks 31. When the detecting step starts, the image capturing unit 10 is used to capture the complete image of the multi-plate 30; then the operation list is The element 20 first defines a sub-board 301 corresponding to the leftmost end of the detection area ROI (as shown in FIG. 5A). In this embodiment, the detection area ROI is defined in the lower left corner of the sub-board 301 to correspond to The position of the defective product mark 31 (the position of the detection area ROI can also be set by the arithmetic unit 20), and the arithmetic unit 20 can determine that the defective product mark 31 is provided on the lowermost lower sub-board 301, that is, The leftmost lower sub-board 301 is a defective product. Next, the computing unit 20 sequentially moves the detection area ROI to the other sub-board 301 image (as shown in FIG. 5B) to determine whether there is a defective product mark 31 on the other sub-board 301, and finally outputs one. The detection data is sent to the pick-up machine 40 of the back end, and the pick-up machine 40 can apply the detection data to perform the back-end creation process of each sub-board 301.

Please refer to the sixth figure, which shows the detection process of the multi-plate 30 of another aspect (MICRO-SD, such as the physical photo shown in Annex I). In the embodiment, the multi-plate 30 includes seventy children. The plate 301 has a size of about 330 mm, and the sub-board 301 has only the sub-boards 301 of the numbers 8, 9, 15, 42 and 66 with defective marks 31. When the detecting step starts, the image capturing unit 10 is used to capture a complete image of the multi-plate 30 under the lens group, the sensing component and other suitable conditions; then the computing unit 20 first defines a check. It is known that the sub-board 301 of the number 1 corresponds to the sub-board 301 of the number 1, and the arithmetic unit 20 can determine whether or not the defective product mark 31 is provided on the sub-board 301 of the number 1, that is, whether the sub-board 301 of the number 1 is defective. . Then, the operation unit 20 sequentially moves the detection area ROI to other daughter boards. On the 301 image up to the sub-board 301 of the number 70, it is determined whether or not the defective product mark 31 is present on the other sub-board 301, and finally, a detection data is output to the pick-up machine 40 at the rear end, and the first display is shown in Table 1. For the detection data, the pick-up machine 40 can apply the detection data to perform the setting procedure of each sub-board 301. For example, the pick-up machine 40 does not follow the sub-board 301 classified as a defective product. The placement of the work to achieve the purpose of saving material costs.

In Table 1, "-" indicates that there is no defective product mark 31 at the position of the sub-board 301, so the sub-board 301 is a good product; and "NG" indicates that the defective product mark 31 appears at the position of the sub-board 301. Therefore, the sub-board 301 is a defective product. It can be seen from the comparison between Table 1 and FIG. 6 that the detecting device 1 and the detecting method of the multi-plate label proposed by the present invention can effectively discriminate the defective product mark 31. The sub-board 301; in addition, the detecting device 1 of the multi-plate label of the present invention can obtain the results of Table 1 in only 1-2 seconds, and the same as the conventional detection in the same manner. 301 compared to the time required (such as the MICRO-SD multi-board inspection Knowing that the overall time can be estimated to be 30 seconds), the present invention can greatly improve the efficiency of detection, thereby improving production efficiency. For example, in the case of 100 daughter boards, the detection time can be shortened to less than one second.

As described in the step (a), when the sub-boards 301 are soft boards, the detecting device 1 of the multi-boards can also analyze each sub-position using the position of the local fiducial mark. The offset of the board 301 is stored in the detection data, and the pick-up machine 40 can perform the offset of the offset according to the record in the detection data, and then perform the component placement step. In general, the number of positioning targets on the flexible board is greater than the number of defective products. Therefore, in this case, the improvement of the production capacity of the production line of the present invention can be highlighted.

Please refer to the seventh figure, which is another embodiment of the present invention, which is the case where the marking device of the multi-plate is applied to a plurality of production lines, and the seventh drawing only depicts the first production line (Line-1). , the production line above the seventh figure) and the second production line (Line-2, the production line below the seventh figure), but not limited to the above, the first production line includes two take-up machines 40, the second production line is also The two pick-up machines 40 are included, but the pick-up machine 40 can be configured according to actual needs. For example, the pick-up machine 40 can be a wafer pick-up machine, a wire machine, or the like. The multi-plate 30 detected by the detecting device 1 marked by the multi-plate can be respectively entered into the first production line or the second production line for related processes, and the fetching machine 40 of each production line can be connected. Go to the database unit 50 to know the position of the defective product board 301 on the multi-plate 30 to be operated, so as to correctly perform the back-end process, and the operation of each of the pick-up machines 40 can also be uploaded to the data. Library order Element 50 allows the user to know which machine position on which line the multi-plate 30 is located, and the production pass through which the sub-board 301 on the multi-plate 30 passes.

It should be noted that, since the image capturing unit 10 of the present invention can capture the full image of the complete multi-plate 30, the above-mentioned multi-plate marking detecting device 1 is disposed in the taking machine. The outside of the stage 40, that is, the multi-plate 30 is detected by the detecting device 1 which has been marked by the multi-plate, and then sent to the pick-up table 40 by a conveyor or the like for the process. However, the detecting device 1 for marking the multi-plate of the present invention can also be built and installed in the pick-up machine 40, and only the space structure inside the pick-up machine 40 needs to be related to the planning, for example, the pick-up machine 40 must be The image capturing unit 10 has a predetermined working distance WD, and the positioning machine 40 must also have a certain lateral length to prevent the mechanical component or the like from obstructing the illumination light of the light emitting unit 101. The quality of the image.

Referring to the eighth figure, the present invention further provides a method for placing a multi-plate, which uses the foregoing steps to first capture the full image of the multi-plate 30, and then uses image analysis technology to obtain the multi-shot in a short period of time. Whether each of the sub-boards 301 on the sub-board 30 is a defective product; the detection data is transmitted to the pick-up machine 40, and the pick-up machine 40 can perform the setting according to the inspection data. The method of placing the multi-plate further includes a printing step before the detecting step, and a reflow step after the placing step.

The invention can effectively shorten the detection time of the defective product mark in the idle time of the pick-up machine 40, so that the production efficiency of the production line can be improved. still However, in the case of a 100-piece MICRO-SD part production line, the working time of the printing machine using the multi-plate mounting method of the present invention is still 25 seconds, and the working time of the reflow furnace is also 25 seconds. In the detection device 1 of the multi-plate of the present invention, the time for capturing the image, detecting the defective product mark (including the positioning target) is 1 second, and the working time of the wafer pick-up machine is feeding and unloading. The target detection time and the time of the placement time are 44 seconds, so the cycle time of the entire production line is 44 seconds; therefore, the production cycle time (from 74 seconds to 44 seconds) described in the prior art can be greatly improved. Increase the production capacity by 40%, and increase the production capacity to calculate the amount of output increase in one year. It will operate for 12 months a year, 25 days a month, 20 hours a day, if the work efficiency is 80%, each For example, if the component placement time is 0.1 second and the yield per chip is 0.1 yuan, the following calculation formula can be used: 12 (month) × 25 (days) × 20 (hours) × 3600 (seconds) × 80% ÷ 0.1 (pieces per second) ) × 0.1 (yuan) × 40% = 6912,000 (yuan), that is, the annual output value can be increased by nearly seven million yuan. If there are two pick-up machines on one production line, the working time of the printing machine of the traditional production line is still 25 seconds, the working time of the reflowing furnace is also 25 seconds, and the working time of the pick-up machine is 4 seconds. Film, target detection time) + (30 / 2) seconds (defective product detection time) + (40 / 2) seconds (set time) = 39 seconds, so the cycle time of the entire production line is 39 seconds; On the other hand, with the method of the present invention, the working time of the printing machine is still 25 seconds, and the working time of the reflowing furnace is also 25 seconds, and the image of the detecting device 1 marked by the multi-plate is used to detect the defective product. The time of the mark (including the positioning target) is 1 second, and the working time of the pick-up machine is 4 seconds (incoming film, unloading, target detection time) + (40/2) seconds (set time) = 24 seconds , Therefore, the cycle time of the entire production line is 25 seconds, which is a 37% increase in production efficiency.

In summary, the present invention has the following advantages: 1. It has better detection efficiency, and the image capturing unit has a larger field of view, so that it can capture a complete image of the multi-plate, and then The complete image is used to analyze each sub-board image; that is, the present invention captures a complete full image at a time, and then uses the high-speed computing capability and image analysis technology of the computing unit to determine whether there is a defective product mark on each sub-board. Thereby, the detection data of the bad sub-board on the multi-plate can be output, so that the fetching machine can perform the setting according to the detection data, so as to solve the problem that the traditional fetching machine must first perform the defective product inspection. The problem of idle time caused by the placement is too long.

2. On the other hand, the present invention utilizes a more efficient detection method to quickly interpret the pros and cons of the sub-board, so that the subsequent fetching machine can directly receive the detection data obtained by the defective product detecting device, thereby It can increase the production capacity of the production line, for example, the production time per piece can be greatly shortened.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, the equivalents of the present invention and the equivalents of the drawings are all included in the present invention. Within the scope of protection, it is given to Chen Ming.

1‧‧‧Multi-plate marking detection device

10‧‧‧Image capture unit

101‧‧‧Lighting unit

20‧‧‧ arithmetic unit

201‧‧‧Main module

202‧‧‧Switch Module

203‧‧‧Control Module

204‧‧‧Auxiliary module

205‧‧‧ parameter setting module

206‧‧‧System Module

30‧‧‧Multiple boards

301‧‧‧ daughter board

31‧‧‧Don't mark

40‧‧‧Receiving machine

50‧‧‧Database unit

WD‧‧‧Working distance

ROI‧‧‧Detection area

The first figure is a schematic view of the detecting device of the marking of the multi-plate of the present invention.

The second figure is a schematic diagram of the multi-plate of the first aspect.

The third figure is a functional block diagram of the arithmetic unit of the detecting device of the marking of the multi-plate of the present invention.

The fourth figure is a flow chart of the method for detecting the marking of the multi-plate of the present invention.

The fifth drawing is a schematic view of a multi-plate of the second aspect of the present invention.

5A to 5B are schematic diagrams of the present invention for sequentially detecting a sub-board using an ROI.

The sixth drawing is a schematic view of a multi-plate of the third aspect of the present invention.

The seventh drawing is a schematic diagram of the detecting device of the marking of the multi-plate of the present invention applied to a multi-production line.

The eighth figure is a flow chart of the method for placing the multi-plate of the present invention.

The ninth figure is a flow chart of a conventional method for placing a multi-plate.

Attachment 1 is a physical photo of the MICRO-SD board.

Attachment 2 to Annex 6 are physical photographs of the boards of the BGA package.

1‧‧‧Multi-plate marking detection device

10‧‧‧Image capture unit

101‧‧‧Lighting unit

20‧‧‧ arithmetic unit

30‧‧‧Multiple boards

40‧‧‧Receiving machine

WD‧‧‧Working distance

Claims (12)

A detecting device for marking a multi-plate, which is used for detecting a bad mark on a plurality of sub-boards of the multi-plate, the sub-board further including a positioning target (local fiducial Mark), the number of the positioning target is greater than the number of the defective product mark, the mark detecting device comprises: an image capturing unit having a predetermined resolution and capturing the one time at a predetermined working distance a complete image of the joint plate, the predetermined working distance is 200 to 700 mm (mm); and an arithmetic unit that receives the image of the multi-plate and sequentially views the image of the sub-board on the multi-panel, and according to Positioning the target, measuring and analyzing the offset of each sub-board, wherein the sub-boards are respectively a soft board, the computing unit includes a main module; and a switching module connected to the main module a control module connected to the main module; an auxiliary module connected to the main module; a parameter setting module connected to the main module; and a system module connected to the main module group. The detecting device of the marking of the multi-plate according to claim 1, wherein the image capturing unit is a low-resolution camera or a linear scanner. The detecting device of the marking of the multi-plate as described in claim 2, wherein the image capturing unit further comprises a plurality of lighting units. A method for detecting a mark of a multi-panel includes the following steps: (a) providing a multi-plate comprising a plurality of sub-boards, wherein a sub-board belonging to the defective product is provided with a bad mark, wherein the sub-board further includes a positioning mark a local fiducial mark, the number of the positioning target is greater than the number of the defective product mark; (b) a detecting device for providing a mark of the multi-plate, the detecting device of the marking of the multi-plate includes an image Taking a unit and an operation unit, wherein the image capturing unit captures the full image of the multi-plate in one time, and the image capturing unit is taken at a predetermined working distance of 200 to 700 mm (mm) And (c) setting the size of the sub-board through the computing unit, so that the computing unit sequentially detects images of the sub-boards of the multi-board according to the sub-board size, and utilizes The operation unit analyzes the image of the multi-plate to detect whether there is a defective product mark on each sub-board and measures the offset of each sub-board according to the positions of the positioning targets, wherein the The sub-boards are each a soft board. The method for detecting a mark of a multi-plate as described in claim 4, wherein a step of marking is included before step (a), and the defective mark is set to be not by laser or attached method. Good product on the board. The method for detecting a mark of a multi-plate as described in claim 5, wherein the defective mark has a predetermined size and is a high contrast mark. The method for detecting a mark of a multi-plate as described in claim 5, wherein in step (b), the image capture unit captures a complete image of the multi-plate at a predetermined working distance. The method for detecting a mark of a multi-board as described in claim 7 , wherein in the step (c), the operation unit defines a range of interesting (ROI) corresponding to the image of the daughter board. To determine whether there is a defective product mark in the detection area on each daughter board. The method for detecting the marking of the multi-plate according to claim 8 of the patent application, wherein the step of detecting the data is further included after the step (c). A method for placing a multi-plate, comprising the steps of: (a) performing a step of detecting a mark of a multi-plate, providing a detecting device for marking a multi-plate, and detecting the mark of the multi-plate An image capturing unit and an arithmetic unit are used to capture a full image of a multi-plate by using the image capturing unit at a predetermined working distance of 200 to 700 mm (mm) Taking a complete image of the multi-board, the sub-board size is set by the computing unit, so that the computing unit sequentially detects the images of the sub-boards of the multi-board according to the sub-board size, and uses the The operation unit analyzes the image of the multi-plate, and detects whether there is a defective product mark on each sub-board of the multi-plate, and then outputs a detection data, and the detecting device of the multi-plate is further detected. Positioning target on each daughter board of a multi-board (local fiducial Mark), and analyzing an offset of each sub-board of the multi-plate to record the offset in the detection data, wherein the number of the positioning targets is greater than the number of the defective products, the sub- The boards are respectively a soft board; and (b) providing a pick-up machine, the pick-up machine first performs offset compensation for each sub-board of the multi-board according to the detection data, and then according to the detection data Perform a placement step on the sub-board that belongs to the good product. The method of placing a multi-plate according to claim 10, wherein a printing step is further included between the steps (a). The method of placing a multi-plate according to claim 10, wherein a step of re-welding is further included after the step (b).