CN102856214A - Circuit board mounting method - Google Patents
Circuit board mounting method Download PDFInfo
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- CN102856214A CN102856214A CN2011101745234A CN201110174523A CN102856214A CN 102856214 A CN102856214 A CN 102856214A CN 2011101745234 A CN2011101745234 A CN 2011101745234A CN 201110174523 A CN201110174523 A CN 201110174523A CN 102856214 A CN102856214 A CN 102856214A
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Abstract
The invention relates to a circuit board mounting method mainly applied to a packing process of flip chip substrates. The circuit board mounting method includes: providing at least one printed circuit board provided with a recognizable unit, a plurality of positioning targets and a plurality of daughter boards which include flawless daughter boards, flawed daughter boards and positioning targets; detecting marks of the flawed daughter boards on the printed circuit board, and recording addresses and positional information of each daughter board so as to generate a first inspection message and a second inspection message; storing the two inspection messages, corresponding to the recognizable unit of the printed circuit board, in a data base; reading the recognizable unit on the printed circuit board, acquiring the corresponding two inspection messages from the data base, and performing mounting subsequent to accurate position-combing of crystal grain according to the two inspection messages. Therefore, a mounter can acquire the inspection messages quickly without detecting the addresses of the flawed daughter boards and the positional information of the daughter boards.
Description
Technical field
The relevant a kind of circuit board of the present invention is put the part method, refers to that especially the circuit board that stores the positional information of flaw daughter board address and each daughter board in a kind of direct reading out data data bank puts the part method.
Background technology
Known circuit board is a kind of large-area mainboard, but along with the volume of electronic installation such as PDA, mobile phone or digital camera is more and more less, the volume of circuit substrate also and then dwindles.And for the considering of production efficiency, the dealer is merged into a slice large scale circuit plate (but also being called multi-joint plate) with the carrying out of convenient follow-up volume production processing procedure with most minitype circuit boards (be called not only daughter board).
Because these minitype circuit boards may cause owing to the variation on the processing procedure specification that does not meet electrically conduct (i.e. the circuit features such as open circuit, short circuit) in the process of producing, therefore the above-mentioned minitype circuit board of classifying defective products as will be arranged at a defective products mark (bad mark) on those minitype circuit boards in artificial mode, so that follow-up getting put processing procedure can according to detect obtain relevant information after, avoid above-mentioned bad circuit board, assembly is installed on those bad daughter boards avoiding.
Other considers need have a constant spacing between the daughter board on this multi-joint plate in twos, put the accuracy requirement of part in order to follow-up surface sticking assembly, but having between daughter board in twos, this makes the range errors that produce different from the Material shrinkage rate, what the error of accumulating after multi-joint plate merges will cause surface sticking assembly puts the part precision problem, therefore follow-up production board is (such as pick and place machine, crystal grain jointing machine [die bonder]) all needs extra location target (local fiducial mark) for every daughter board to carry out the vision identification and process, satisfy the demand of high accuracy (± 10 μ m) to proofread and correct above-mentioned error amount.
At present the whole multi-joint plate production process of putting part is completed multi-joint plate by multi-joint plate manufacturer first, and make the defective products mark at multi-joint plate, the pick and place machine of delivering again by encapsulation manufacturer detects for defective products mark and daughter board location target, and the high accuracy that the beginning can be carried out crystal grain after detection is finished is put the part encapsulation.Yet, traditional pick and place machine is after loading this multi-joint plate, utilize the location of an advanced rower target of portable video camera (fiducial mark), recycle that analysis that above-mentioned video camera carries out the defective products mark detects operation or the identification of location target (local fiducial mark) detects operation, can guarantee that so follow-up crystal grain high accuracy puts the packaging operation of part.
In other words, pick and place machine is not directly to carry out packaging operation after obtaining multi-joint plate, and must carry out flaw and position analysis to the multi-joint plate of every a slice first, this extra identification processing time will increase multi-joint plate and enter making the time of pick and place machine, therefore traditional pick and place machine utilization detects the procedure operation of bad daughter board, in the increasing situation of yoke plate number, will certainly cause the production time of putting the part board significantly to increase, cause the mobility of production line to reduce in a large number (approximately 10%-30% does not wait).
Summary of the invention
Main purpose of the present invention, aim to provide a kind of circuit board and put the part method, before printed circuit board (PCB) is put the part program, adopt checkout gear independently to detect flaw daughter board address and the daughter board interval error positional information of printed circuit board (PCB), and will detect information storage in data bank, allow the follow-up part processing procedure of putting can be according to printed circuit board (PCB) sequence number reading out data data bank, process after directly obtaining corresponding detection information, and then reduce must be before tradition be put the part program etc. to be detected expending time in, promote the mobility of integral manufacturing production capacity.
For reaching described purpose, circuit board of the present invention is put the part method and is comprised following steps: at least one printed circuit board (PCB) (A) is provided, above-mentioned printed circuit board (PCB) has one can be by identification unit, a plurality of daughter board and a plurality of location target, wherein, above-mentioned daughter board includes the indefectible daughter board that belongs to non-defective unit, the flaw daughter board that belongs to defective products and location target, and above-mentioned flaw daughter board is provided with a defective products mark; (B) provide a vision-based detection analytical equipment, detect the flaw daughter board address that has the defective products mark on the above-mentioned printed circuit board (PCB), and the address of flaw daughter board formed one first inspect information, and above-mentioned first inspect the corresponding above-mentioned printed circuit board (PCB) of information can be stored in a data bank by identification unit; (C) detect the location target of analyzing above-mentioned printed circuit board (PCB) and each daughter board by above-mentioned vision-based detection analytical equipment, form one second with the positional information of analyzing each daughter board and inspect information, and above-mentioned second inspect the corresponding above-mentioned printed circuit board (PCB) of information can be stored in above-mentioned data bank by identification unit; And (D) provide the one scan device to cooperate the follow-up part machine assembling of putting, by above-mentioned scanning means read printed circuit board (PCB) can be by identification unit, and obtain corresponding first in above-mentioned data bank and inspect information and second and inspect information by putting the part machine, and inspect information and second and inspect information according to obtaining first, with a plurality of crystal grain accurately positioning combination to each indefectible daughter board of corresponding printed circuit board (PCB).
Wherein, above-mentioned printed circuit board (PCB) and a plurality of daughter board have respectively one group of two clinodiagonal location target, and obtain point coordinates between two clinodiagonal location targets, the middle point coordinates by printed circuit board (PCB) and a plurality of daughter boards compares mutually again, to form the positional information of each daughter board.
Step (A) further comprises a markers step before, can be utilized wherein a kind of mode of laser, attaching or printing to be arranged at above-mentioned printed circuit board (PCB) one side by identification unit with above-mentioned, wherein, above-mentioned wherein a kind of identification mark that can be made as by identification unit one-dimensional bar code or two-dimensional bar; Above-mentioned markers step more is included in a defective products mark is set on the flaw daughter board that belongs to defective products.
Step (B) more comprises to sweep to take a fancy to before states the sequence number that can be obtained by identification unit above-mentioned printed circuit board (PCB).
In the first preferred embodiment, step (B) and step (C) are to see through a vision-based detection analytical equipment to produce above-mentioned first and inspect information and second and inspect information.
In a possible embodiments, above-mentioned vision-based detection analytical equipment comprises an image inspection unit and a control algorithm unit, above-mentioned image inspection unit in order to the flaw daughter board that captures above-mentioned printed circuit board surface image and the location target on the daughter board and above-mentioned control algorithm unit in order to process on the pick-up image flaw daughter board address and to analyze the positional information that each location target is obtained each daughter board.
Wherein, the total image of above-mentioned image inspection unit acquisition printed circuit board (PCB), and by the color contrast of defective products mark and other indefectible daughter board on the flaw daughter board in the above-mentioned control algorithm element analysis image, form above-mentioned first with the flaw daughter board address of judging above-mentioned printed circuit board (PCB) and inspect information.
Above-mentioned image inspection unit captures the scope image of above-mentioned printed circuit board (PCB) and a plurality of daughter boards with a preset range, above-mentioned scope image comprises the location target of a printed circuit board (PCB) and at least one daughter board, detect the location target in the above-mentioned scope image, inspect information with the positional information of analyzing each daughter board on the above-mentioned printed circuit board (PCB) to form above-mentioned second; Above-mentioned scope image can be the total image of acquisition printed circuit board (PCB) in addition again, detects location targets all in the above-mentioned total image, forms above-mentioned second with the positional information of analyzing each daughter board on the above-mentioned printed circuit board (PCB) and inspects information.
In another possible embodiments, above-mentioned vision-based detection analytical equipment comprises a rectilinear scanner, an image inspection unit and a control algorithm unit, above-mentioned rectilinear scanner is in order to the flaw daughter board of the surface image that captures above-mentioned printed circuit board (PCB), above-mentioned image inspection unit is in order to capturing the location target on the above-mentioned printed circuit board surface image, and above-mentioned control algorithm unit is in order to process on the pick-up image flaw daughter board address and to analyze the positional information that each location target is obtained each daughter board.
Wherein, the total image of above-mentioned rectilinear scanner acquisition printed circuit board (PCB), and by the color contrast of defective products mark and other indefectible daughter board on the flaw daughter board in the above-mentioned control algorithm element analysis image, form above-mentioned first with the flaw daughter board position of judging above-mentioned printed circuit board (PCB) and inspect information.
Above-mentioned image inspection unit captures the scope image of above-mentioned printed circuit board (PCB) and a plurality of daughter boards with a preset range, above-mentioned scope image comprises the location target of a printed circuit board (PCB) and at least one daughter board, detect the location target in the above-mentioned scope image, form above-mentioned second with the positional information of analyzing each daughter board on the above-mentioned printed circuit board (PCB) and inspect information; Above-mentioned scope image can be the total image of acquisition printed circuit board (PCB) in addition again, detects location targets all in the above-mentioned total image, forms above-mentioned second with the positional information of analyzing each daughter board on the above-mentioned printed circuit board (PCB) and inspects information.
In aforementioned two feasible embodiment, above-mentioned image inspection unit adopts photosensitive coupling component (Charge Coupled Device, CCD) or CMOS (Complementary Metal Oxide Semiconductor) (Complementary Metal-Oxide Semiconductor, CMOS) image sensor.
In a possible embodiments, above-mentioned image inspection unit captures the scope image of above-mentioned printed circuit board (PCB) and a plurality of daughter boards with a preset range, above-mentioned scope image comprises the location target of a printed circuit board (PCB) and at least one daughter board, detect the location target in the above-mentioned scope image, form above-mentioned second with the positional information of analyzing each daughter board on the above-mentioned printed circuit board (PCB) and inspect information.
In another possible embodiments, above-mentioned scope image can be the total image of acquisition printed circuit board (PCB) in addition, detects location targets all in the above-mentioned total image, forms above-mentioned second with the positional information of analyzing each daughter board on the above-mentioned printed circuit board (PCB) and inspects information.
In this preferred embodiment, above-mentioned image inspection unit can adopt photosensitive coupling component (Charge Coupled Device equally, CCD) or CMOS (Complementary Metal Oxide Semiconductor) (Complementary Metal-Oxide Semiconductor, CMOS) image sensor.
In addition, in aforementioned first and second preferred embodiment, step (C) is to produce above-mentioned second through a vision-based detection analytical equipment to inspect information, and step (D) is to see through one to put the part machine and obtain corresponding first and inspect information and second and inspect information, and with a plurality of crystal grain accurately positioning combination to corresponding printed circuit board (PCB).
In a possible embodiments, above-mentioned data bank is made as an autonomous system, see through respectively an Internet Transmission above-mentioned first and inspect information, second and inspect information and can be by identification unit with above-mentioned vision-based detection analytical equipment and the above-mentioned part machine of putting, this network comprises a LAN and a Wide Area Network at least.
In another possible embodiments, above-mentioned data bank is installed in the above-mentioned part machine inside of putting, see through an Internet Transmission above-mentioned first with above-mentioned vision-based detection analytical equipment and inspect information, second and inspect information and can be by identification unit, this network comprises a LAN and a Wide Area Network at least.
In a possible embodiments again, above-mentioned data bank is installed in above-mentioned vision-based detection analytical equipment, see through an Internet Transmission above-mentioned first and inspect information, second and inspect information and can be by identification unit with the above-mentioned part machine of putting, this network comprises a LAN and a Wide Area Network at least.
The present invention sees through and detects in advance operation and will detect information storage in data bank, and cooperate one to be assembled in the follow-up device for identifying of putting the part board, read sequence number on the printed circuit board (PCB) by device for identifying, again by data bank transmit the processing of corresponding printed circuit board (PCB) must information to putting the part board, allow put that the part board can directly carry out follow-up precision put part processing, so can reduce conventional package factory and put to be detected the expending time in such as the front need of part program, promote the mobility of integral manufacturing production capacity.
Description of drawings
Fig. 1 is the schematic flow sheet that the present invention puts part;
Fig. 2 is defective products labeled analysis schematic diagram of the present invention;
Fig. 2 A is that positional information of the present invention is analyzed schematic diagram;
Fig. 3 is data bank one preferred embodiment schematic diagram of the present invention;
Fig. 3 A is another preferred embodiment schematic diagram of data bank of the present invention; And
Fig. 3 B is an again preferred embodiment schematic diagram of data bank of the present invention.
[primary clustering symbol description]
Embodiment
For ease of further structure of the present invention, use and feature thereof being had the clear and definite full and accurate understanding of darker one deck and understanding, now enumerate preferred embodiment, cooperate accompanying drawing to be described in detail as follows:
At first, please refer to shown in Figure 1ly, in a most preferred embodiment, circuit board of the present invention is put the part method and is mainly comprised following steps:
Step (A): at least one printed circuit board (PCB) 11 is provided, above-mentioned printed circuit board (PCB) 11 is provided with one can be by identification unit 13, a plurality of daughter board 12 and circuit board location target I11a, circuit board location target II11b, daughter board location target I12a, daughter board location target II12b, wherein, above-mentioned daughter board 12 includes the indefectible daughter board 122 that belongs to non-defective unit, the flaw daughter board 121 that belongs to defective products and daughter board location target I12a, daughter board location target II12b;
Step (B): detect the defective products mark 123 that belongs to flaw daughter board 121 on the above-mentioned printed circuit board (PCB) 11, the address of flaw daughter board 121 is formed one first inspects information, and above-mentioned first inspect the corresponding above-mentioned printed circuit board (PCB) 11 of information can be stored in a data bank 16 by identification unit 13;
Step (C): detect circuit board location target I11a, the circuit board location target II11b of above-mentioned printed circuit board (PCB) 11 and daughter board location target I12a, the daughter board location target II12b of each daughter board 12, the positional information Y that analyzes each daughter board 12 inspects information to form one second, and above-mentioned second inspect the corresponding above-mentioned printed circuit board (PCB) 11 of information can be stored in above-mentioned data bank 16 by identification unit 13; And
Step (D): provide the one scan device to cooperate the follow-up part machine assembling of putting, by above-mentioned scanning means read printed circuit board (PCB) 11 can be by identification unit 13, obtain corresponding first in above-mentioned data bank 16 and inspect information and second and inspect information by putting the part machine, and inspect information and second and inspect information according to obtaining first, with a plurality of crystal grain accurately positioning combination to each indefectible daughter board 122 of corresponding printed circuit board (PCB) 11.
At first, see also printed circuit board (PCB) shown in Figure 2 11 schematic diagrames about step (A), has the spaced daughter board 12 of a plurality of matrix linescan methods on the above-mentioned printed circuit board (PCB) 11, and in a lateral location be provided with one have a sequence number can be by identification unit 13, make each printed circuit board (PCB) 11 have respectively an exclusive sequence number, and be respectively equipped with to confirm the circuit board location target I11a of position on above-mentioned printed circuit board (PCB) 11 and each daughter board 12, circuit board location target II11b, daughter board location target I12a, daughter board location target II12b, in addition because the yield problem of making has the indefectible daughter board 122 that belongs to non-defective unit and the flaw daughter board 121 that belongs to defective products; Wherein, above-mentioned can be that wherein a kind of method with laser, printing or attaching is arranged on the daughter board 12 by identification unit 13, and sequence number can be via above-mentioned can being obtained by identification unit 13 of scanning, and above-mentionedly can also be made as one-dimensional bar code by identification unit 13 or wherein a kind of identification mark of two-dimensional bar.
In order to make things convenient for the detection of subsequent step, printed circuit board (PCB) that step (A) provides 11 can comprise a defective products mark 123 that is arranged at above-mentioned flaw daughter board 121 in addition, and wherein, above-mentioned defective products mark 123 has a preliminary dimension, for example 1 * 1 (mm
2) or 4 * 4 (mm
2) size but do not limit any shape, and above-mentioned defective products mark 123 mainly is to adopt the height contrast, in order to the accuracy of image analysing computer.
The mode of above-mentioned defective products mark 123 at first is through a plurality of daughter boards 12 on the electrical detection device differentiation printed circuit board (PCB) 11, just daughter board 12 can be divided into flaw daughter board 121 and indefectible daughter board 122 according to testing result afterwards, and above-mentioned flaw daughter board 121 will utilize wherein a kind of method of laser, printing or attaching that defective products mark 123 is arranged on the flaw daughter board 121; Thereby obtain flaw daughter board 121 so that detection machine 10 (as shown in Figure 3) can detect above-mentioned defective products mark 123 fast, make the follow-up part machine of putting to put part processing according to the data that detects that records for indefectible daughter board 122.
Because this flaw daughter board 121 is the random digit life of buying property, therefore flaw daughter board 121 positions on each printed circuit board (PCB) 11 are all difference, therefore, as must before putting the part procedure, detect the address of flaw daughter board 121 on the printed circuit board (PCB) 11 as described in the prior art in advance, so, about belonging to flaw daughter board 121 address of defective products on the above-mentioned printed circuit board (PCB) 11 of the detection of step (B), whether defective products mark 123 is arranged on will the daughter board 12 according to printed circuit board (PCB) 11 and divide into two kinds of different detection modes.
See also shown in Figure 3, if daughter board 12 has defective products mark 123, then step (B) is to detect flaw daughter board 121 address that belong to defective products with a vision-based detection analytical equipment 15, in the first preferred embodiment, above-mentioned vision-based detection analytical equipment 15 comprises an image inspection unit 151, with the flaw daughter board 121 of the surface image that captures above-mentioned printed circuit board (PCB) 11; And a control algorithm unit 152, process the defective products mark 123 on the pick-up image and form first and inspect information.
In a preferred embodiment, above-mentioned image inspection unit 151 is photosensitive coupling component (Charge Coupled Device, CCD) or CMOS (Complementary Metal Oxide Semiconductor) (Complementary Metal-Oxide Semiconductor, CMOS) wherein a kind of image sensor, this image inspection unit 151 have a predetermined resolution and a predetermined enlargement ratio and capture the image of this printed circuit board (PCB) 11 under certain predetermined work distance (working distance) WD.
For instance: the image resolution of the image inspection unit 151 that the present invention carries (Image Resolution) can be 768 * 576 picture elements (pixel), the collocation formed spatial resolution of camera lens (Spatial Resolution) can be 0.25 to 0.5 millimeter/picture element (mm/pixel), and operating distance WD can be 200 to 700 millimeters (mm); Yet this only with for conveniently illustrating, is not in a limitative way the structure of image sensor.
See also shown in Figure 2, the present invention mainly utilizes more wide-field vision-based detection analytical equipment 15 to cooperate the condition of corresponding predetermined work distance W D to carry out the acquisition work of printed circuit board (PCB) 11 images, allow the complete total image that image inspection unit 151 can disposable crawl printed circuit board (PCB) 11, and see through above-mentioned control algorithm unit 152 the ranks address that the complete total image that captures carries out flaw daughter board 121 is judged.
The present invention is in control algorithm unit 152, in advance the total image of printed circuit board (PCB) 11 is set as the ranks block 111 of 3 * 5 formed objects, and by the defective products mark 123 that whether has the height contrast on each ranks block 111 in the control algorithm unit 152 analysis images, and the ranks address of these defective products mark 123 height contrasts is follow-up flaw daughter board 121 address on the part machine judgement printed circuit board (PCB) 11 of putting.
Again flaw daughter board 121 address are formed first and inspect information, and this first is inspected the corresponding printed circuit board (PCB) 11 of information and can be reached data bank 16 by the sequence number of identification unit 13 and store, in order to the follow-up part function of putting to data bank 16 crawl flaw daughter boards 121 address.
For instance, the present invention can sequentially be defined as a, b, c, d from left to right with the X direction of ranks block 11 ... and y direction from bottom to top is defined as 1,2,3,4 ... among the embodiment as shown in the figure, b2 on the printed circuit board (PCB) 11, c3, d1 have the height contrast of defective products mark 123, therefore, control algorithm unit 152 can be defined as the block of skipping processing with this raw column data b2, the ranks address such as c3, d1, make the follow-up part of putting that the part function is avoided flaw daughter board 121 of putting, and then reduce the generation of waste product.Yet above-mentioned 3 * 5 ranks blocks 111 are not in a limitative way only with the usefulness for conveniently illustrating, that is above-mentioned ranks block 111 can be established the block of a plurality of formed objects.
In the second preferred embodiment, above-mentioned vision-based detection analytical equipment 15 comprises a rectilinear scanner, captures the surface image of above-mentioned printed circuit board (PCB) 11; An and control algorithm unit 152, flaw daughter board 121 address of processing on the surface image that rectilinear scanner captures are inspected information to form first, and this first is inspected the corresponding printed circuit board (PCB) 11 of information and can be reached data bank 16 by the sequence number of identification unit 13 and store.Yet the flaw daughter board 121 address routine analyzers of this embodiment are identical with aforementioned preferred embodiment, therefore again do not give unnecessary details.
In a preferred embodiment, its operating distance of above-mentioned rectilinear scanner WD can capture the image of printed circuit board (PCB) 11 under the condition of 5 to 30 millimeters (mm), and the image analysing computer of rectilinear scanner action is identical with aforementioned image inspection unit 151, is not giving unnecessary details at this.
In addition the step (B) of aforementioned each different embodiment more comprises before and scans the above-mentioned sequence number that can be obtained by identification unit 13 above-mentioned printed circuit board (PCB) 11, make the sequence number that subsequent detection the first information of inspecting can corresponding printed circuit board (PCB) 11 deposit data bank 16 in, directly obtain the information of inspecting in order to the follow-up part processing machine of putting, reduce tradition and before putting part, begin to detect consuming time that the product line that causes waits for.
Please refer to shown in Fig. 2 A, other considers contraction and the more and more less situation of size of printed circuit board (PCB) 11 and daughter board 12 materials, and how the live width line between the circuit board has also arrived the rice grade, reach the accuracy of putting part for asking, the error that printed circuit board (PCB) 11 and daughter board 12 produce distance just must take in, therefore each location target (local fiducial mark) is in order to allow the fast position of foundation location target of detection machine 10, to determine each daughter board 12 needed positional information Y, make and put the part machine and can put part according to this positional information Y, namely putting the part machine can factor plate 12 range error, and assembly is put part on the daughter board 12 of inaccurate position.For this reason, above-mentioned printed circuit board (PCB) 11 arranges respectively one group of location target in two diagonally opposing corners, and each daughter board 12 also has respectively one group of two clinodiagonal location target, and by obtaining this point coordinates in one between the above-mentioned two clinodiagonal location targets, see through printed circuit board (PCB) 11 first in point coordinates X
1With each daughter board 12 second in point coordinates X
2Mutually relatively, to form the positional information Y of each daughter board.
Therefore, the present invention detects above-mentioned printed circuit board (PCB) 11 each location target 11a, 11b, 12a, 12b with a vision-based detection analytical equipment 15 about step (C), to analyze the positional information Y of each daughter board 12, above-mentioned vision-based detection analytical equipment 15 comprises an image inspection unit 151, to capture a plurality of location target 11a, 11b, 12a, 12b on the above-mentioned printed circuit board (PCB) 11; And a control algorithm unit 152, location target 12a, 12b and the analysis of processing each daughter board 12 on the pick-up image obtain positional information Y.
In a preferred embodiment, above-mentioned image inspection unit 151 is with the scope image of preset range acquisition printed circuit board (PCB) 11 and a plurality of daughter board 12, above-mentioned scope image comprises the daughter board location target I12a of a printed circuit board (PCB) 11 and at least one group of daughter board 12, daughter board location target II12b, detect the daughter board location target I12a in the above-mentioned scope image, daughter board location target II12b, form second with the positional information Y that analyzes each position daughter board 12 on the above-mentioned printed circuit board (PCB) 11 and inspect information, and above-mentioned second inspect the corresponding above-mentioned printed circuit board (PCB) 11 of information can be stored in above-mentioned data bank 16 by the sequence number of identification unit 13.
The present invention at first sees through the image of above-mentioned image inspection unit 151 acquisition printed circuit board (PCB)s 11 set of circuits plates location target I11a, circuit board location target II11b, and by the image that 152 processing of above-mentioned control algorithm unit capture, obtain 11 liang of clinodiagonal circuit boards location target I11a of printed circuit board (PCB), common the first tilt angle theta that consists of of circuit boards location target II11b
1, obtain again point coordinates X among first between two dot circuit plates location target I11a, the circuit board location target II11b
1, and then once see through one group of daughter board location target I12a of image inspection unit 151 acquisition upper left corner daughter boards 12, the scope image of daughter board location target II12b, obtain the second tilt angle theta of daughter board location target I12a, daughter board location target II12b
2And point coordinates X in second
2, and via point coordinates X in the 152 processing calculating first of above-mentioned control algorithm unit
1And point coordinates X in second
2To form positional information Y, follow above-mentioned control algorithm unit 152 and can proceed the image of next preset range acquisition daughter board 12, until analyzed the positional information Y of all daughter boards 12 on the printed circuit board (PCB) 11, again with positional information Y and other information (θ of each daughter board 12 gained
1, θ
2, X
1, X
2...) system is shaped to second and inspects information.
Last again it second inspected the corresponding printed circuit board (PCB) 11 of information and can be reached data bank 16 by the sequence number of identification unit 13 and store, in order to follow-up put the part function to data bank 16 directly this positional information of crawl Y put part, make the follow-up part function of putting accurately assembly be put part on daughter board 12, and then reach the effect of accurately putting part.Yet the scope image of a daughter board 12 of preset range acquisition is not in a limitative way only with the usefulness for conveniently illustrating, that is, the scope image of a plurality of daughter boards 12 of above-mentioned preset range fechtable.
In another preferred embodiment, above-mentioned scope image can be the total image of acquisition printed circuit board (PCB) 11 in addition, detect circuit board location target I11a, circuit board location target II11b, daughter board location target I12a, the daughter board location target II12b of all printed circuit board (PCB)s 11 in the above-mentioned total image and daughter board 12, form second with the positional information Y that analyzes each position daughter board 12 on the above-mentioned printed circuit board (PCB) 11 and inspect information, and above-mentioned second inspect the corresponding above-mentioned printed circuit board (PCB) 11 of information can be stored in above-mentioned data bank 16 by the sequence number of identification unit 13.In the present embodiment, the transducer of image inspection unit 151 high image resolutions and the operating distance WD that arranges in pairs or groups, total image that can disposable acquisition printed circuit board (PCB) 11, and see through control algorithm unit 152 and analyze the daughter board location target I12a of all daughter boards 12 on the total image, the positional information Y of daughter board location target II12b, the positional information Y system of each daughter board 12 after analyzing is shaped to above-mentioned second inspects information, and inspect the above-mentioned printed circuit board (PCB) 11 of information correspondence to above-mentioned second and can be stored in above-mentioned data bank 16 by the sequence number of identification unit 13.Yet the positional information Y routine analyzer of this embodiment is identical with aforementioned preferred embodiment, therefore again do not give unnecessary details at this.
Moreover, please refer to shown in Figure 3, what abovementioned steps (B) and step (C) obtained first inspects information and the second information of inspecting is the data bank 16 that is stored in an autonomous system, above-mentioned data bank 16 is between above-mentioned vision-based detection analytical equipment 15 and put between the part machine, and sees through a network and receive and transmit above-mentioned first and inspect information, second and inspect information and can be by the sequence number of identification unit 13.
See also another preferred embodiment shown in Fig. 3 A, what abovementioned steps (B) and step (C) obtained first inspects information and the second information of inspecting is to be stored in one to be positioned at above-mentioned data bank 16 of putting part machine inside, and above-mentioned data bank 16 sees through a network and receives first by vision-based detection analytical equipment 15 and inspect information, second and inspect information and can be by the sequence number of identification unit 13.
See also an again preferred embodiment shown in Fig. 3 B, state that step (B) and step (C) obtain first to inspect information and the second information of inspecting be to be stored in a data bank 16 that is positioned at above-mentioned vision-based detection analytical equipment 15, above-mentioned data bank 16 sees through an Internet Transmission first and inspects information, second and inspect information and can be by the sequence number of identification unit 13 to the above-mentioned part machine of putting.
In aforementioned three embodiment, above-mentioned network comprises a LAN and a Wide Area Network at least, and above-mentioned data bank 16 also can be adopted network connection and put the following process machine that part is finished.
About step (D), the invention provides the one scan device and cooperate the follow-up part machine assembling of putting, by above-mentioned scanning means read printed circuit board (PCB) 11 can be by identification unit 13, to obtain the sequence number of these printed circuit board (PCB) 11 correspondences, by put the part machine according to this sequence number to corresponding first the inspecting information and second and inspect information of data bank 16 crawl, and provided by data bank 16 and to put part machine first and inspect information and second and inspect information, then put the part machine and will avoid flaw daughter board 121 address and Working position corresponding to fine setting according to first and second information of inspecting that provides, make accurately a plurality of crystal grain difference positioning combination to each indefectible daughter board 122 of corresponding printed circuit board (PCB) 11.
In sum, the present invention sees through and detects in advance operation and will detect information storage in data bank, and cooperate one to be assembled in the follow-up device for identifying of putting the part board, read sequence number on the printed circuit board (PCB) by device for identifying, again by data bank transmit the processing of corresponding printed circuit board (PCB) must information to putting the part board, allow put that the part board can directly carry out follow-up precision put part processing, so can reduce conventional package factory and put to be detected the expending time in such as the front need of part program, promote the mobility of integral manufacturing production capacity.
Above illustrated embodiment only is not in a limitative way with the present invention for convenience of description, not from the present invention's spirit category, is familiar with various Simple transformeds and modification that industry technical staff can do, all must include in the scope of patent protection of the present invention.
Claims (9)
1. a circuit board is put the part method, be mainly used in the encapsulation process of crystal covered carrier-board, it is characterized in that: at least one printed circuit board (PCB) (A) is provided, above-mentioned printed circuit board (PCB) has one can be by identification unit, a plurality of daughter board and a plurality of location target, wherein, above-mentioned daughter board includes the indefectible daughter board that belongs to non-defective unit, the flaw daughter board that belongs to defective products and above-mentioned location target, and above-mentioned flaw daughter board is provided with a defective products mark; (B) provide a vision-based detection analytical equipment, detect the flaw daughter board address that has the defective products mark on the above-mentioned printed circuit board (PCB), and the address of flaw daughter board formed one first inspect information, and above-mentioned first inspect the corresponding above-mentioned printed circuit board (PCB) of information can be stored in a data bank by identification unit; (C) detect the location target of analyzing above-mentioned printed circuit board (PCB) and each daughter board by above-mentioned vision-based detection analytical equipment, analyze the positional information of each daughter board and inspect information to form one second, and above-mentioned second inspect the corresponding above-mentioned printed circuit board (PCB) of information can be stored in above-mentioned data bank by identification unit; And (D) provide the one scan device to cooperate the follow-up part machine assembling of putting, by above-mentioned scanning means read printed circuit board (PCB) can be by identification unit, and obtain corresponding first in above-mentioned data bank and inspect information and second and inspect information by putting the part machine, and inspect information and second and inspect information according to obtaining first, with a plurality of crystal grain accurately positioning combination to each indefectible daughter board of corresponding printed circuit board (PCB).
2. circuit board according to claim 1 is put the part method, it is characterized in that: above-mentioned printed circuit board (PCB) and a plurality of daughter board have respectively one group of two clinodiagonal location target, and between two clinodiagonal location targets, obtain point coordinates in, middle point coordinates by printed circuit board (PCB) and a plurality of daughter boards compares mutually again, to form the positional information of each daughter board.
3. circuit board according to claim 1 is put the part method, it is characterized in that: step (A) more comprises a markers step before, utilize wherein a kind of mode of laser, attaching or printing, can be arranged at above-mentioned printed circuit board (PCB) one side by identification unit with above-mentioned, and above-mentioned defective products mark is arranged on the daughter board that belongs to defective products.
4. circuit board according to claim 1 is put the part method, it is characterized in that: above-mentioned vision-based detection analytical equipment comprises an image inspection unit, with the flaw daughter board that captures above-mentioned printed circuit board surface image and the location target on the daughter board; And a control algorithm unit, process on the pick-up image flaw daughter board address and analyze the positional information that each location target is obtained each daughter board.
5. circuit board according to claim 4 is put the part method, it is characterized in that: the total image of above-mentioned image inspection unit acquisition printed circuit board (PCB), and by the color contrast of defective products mark and other indefectible daughter board on the flaw daughter board in the above-mentioned control algorithm element analysis image, form above-mentioned first with the flaw daughter board address of judging above-mentioned printed circuit board (PCB) and inspect information.
6. circuit board according to claim 4 is put the part method, it is characterized in that: above-mentioned image inspection unit captures the scope image of above-mentioned printed circuit board (PCB) and a plurality of daughter boards with a preset range, above-mentioned scope image comprises the location target of a printed circuit board (PCB) and at least one daughter board, detect the location target in the above-mentioned scope image, inspect information with the positional information of analyzing each daughter board on the above-mentioned printed circuit board (PCB) to form above-mentioned second.
7. circuit board according to claim 1 is put the part method, it is characterized in that: above-mentioned vision-based detection analytical equipment utilizes a rectilinear scanner to capture the surface image of above-mentioned printed circuit board (PCB), by the defective products mark on the control algorithm cell processing pick-up image, capture in addition the surface image of above-mentioned printed circuit board (PCB) with an image inspection unit, and by the location target of a printed circuit board (PCB) and a plurality of daughter boards on the above-mentioned control algorithm cell processing pick-up image.
8. circuit board according to claim 7 is put the part method, it is characterized in that: the total image of above-mentioned rectilinear scanner acquisition printed circuit board (PCB), and by the color contrast of defective products mark and other indefectible daughter board on the flaw daughter board in the above-mentioned control algorithm element analysis image, form above-mentioned first with the flaw daughter board address of judging above-mentioned printed circuit board (PCB) and inspect information.
9. circuit board according to claim 7 is put the part method, it is characterized in that: above-mentioned image inspection unit captures the scope image of above-mentioned printed circuit board (PCB) and a plurality of daughter boards with a preset range, above-mentioned scope image comprises the location target of a printed circuit board (PCB) and at least one daughter board, detect the location target in the above-mentioned scope image, inspect information with the positional information of analyzing each daughter board on the above-mentioned printed circuit board (PCB) to form above-mentioned second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101745234A CN102856214A (en) | 2011-06-27 | 2011-06-27 | Circuit board mounting method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101745234A CN102856214A (en) | 2011-06-27 | 2011-06-27 | Circuit board mounting method |
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| CN102856214A true CN102856214A (en) | 2013-01-02 |
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| CN2011101745234A Pending CN102856214A (en) | 2011-06-27 | 2011-06-27 | Circuit board mounting method |
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| CN112702905A (en) * | 2019-10-22 | 2021-04-23 | 联策科技股份有限公司 | Method and system for tracing yield and error rate of printed circuit board |
| CN117923096A (en) * | 2024-03-21 | 2024-04-26 | 凯多智能科技(上海)有限公司 | Battery tray detection method, device, conveying system, medium and program product |
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