TWI745131B - Printed circuit board yield rate and production equipment error rate backtracking method and system thereof - Google Patents
Printed circuit board yield rate and production equipment error rate backtracking method and system thereof Download PDFInfo
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一種印刷電路板良率和生產設備錯誤率之回溯方法及其系統,尤指印刷電路板之資訊圖碼包含有電路主板之代碼以及印刷電路板位於電路主板之區域代碼,而可於印刷電路板生產缺陷時,可即時得知其製造過程及回溯該電路主板所產生之印刷電路板之方法及其系統。 A method and system for tracing back the yield rate of printed circuit boards and the error rate of production equipment, especially the information graphics code of the printed circuit board includes the code of the circuit board and the area code of the printed circuit board located on the circuit board, and can be used on the printed circuit board In the event of a production defect, the manufacturing process can be immediately known and the method and system for tracing back the printed circuit board produced by the circuit main board.
按,目前印刷電路板是依照所需尺寸由電路主板經過多個製程後再裁切成特定尺寸的印刷電路板,為了提高產品品質以及良率,印刷電路板再製成後,都會經過各種檢驗,為了能夠防止繼續生產出不良品,或是減少產出不良品的機率,一般會將生產的參數或過程,以條碼方式標示於印刷電路板上,一旦檢驗出不良品或是印刷電路板於客戶端發生問題時,可藉由該標示所紀錄之參數與過程,來了解缺陷產生原因,進而可提高後續生產產品的品質與良率。然而,印 刷電路板是由電路主板經多個製程完成後再裁切形成,因此,印刷電路板在主板上的位置,對於缺陷的「回溯分析」以及「缺陷產生原因分析」相當重要,但現今印刷電路板的標示,又無法得知其於電路主板的位置,無法有效且準確的判斷缺陷發生原因,對於良率與品質的提升幫助有限。 According to the current printed circuit board, the printed circuit board is cut into a specific size printed circuit board according to the required size by the circuit board after multiple processes. In order to improve product quality and yield, the printed circuit board will undergo various inspections after it is manufactured. In order to prevent the continuous production of defective products or reduce the probability of producing defective products, the production parameters or processes are generally marked on the printed circuit board by bar code. Once the defective product is detected or the printed circuit board is When a problem occurs on the client side, the parameters and processes recorded in the label can be used to understand the cause of the defect, which can improve the quality and yield of subsequent products. However, printing The printed circuit board is formed by cutting the circuit board after multiple manufacturing processes. Therefore, the position of the printed circuit board on the motherboard is very important for the "retrospective analysis" of defects and the "defect cause analysis", but nowadays printed circuits The label of the board cannot know its position on the circuit main board, and it is impossible to effectively and accurately determine the cause of the defect, and it is of limited help to the improvement of yield and quality.
鑑於上述欲解決之問題及其原因,具體而言,本發明提供一種印刷電路板良率和生產設備錯誤率之回溯方法及其裝置,利用印刷電路板上的資訊圖碼包含電路主板之主板代碼以及印刷電路板於電路主板上之製造區域的區域代碼,俾使印刷電路板發生缺陷時,除了能由印刷電路板本身發生缺陷的位置進行判斷外,更可以對電路主板在印刷電路板的製程進行判斷,可以大幅提升後續印刷電路板的生產良率與降低生產設備的錯誤率。 In view of the above-mentioned problems to be solved and their reasons, in particular, the present invention provides a method and device for tracing back the yield rate of printed circuit boards and the error rate of production equipment, using the information pattern on the printed circuit board to include the motherboard code of the circuit board And the area code of the manufacturing area of the printed circuit board on the circuit board, so that when the printed circuit board is defective, in addition to judging the position of the printed circuit board itself, it can also determine the manufacturing process of the circuit board on the printed circuit board. Making judgments can greatly improve the production yield of subsequent printed circuit boards and reduce the error rate of production equipment.
本發明為一種印刷電路板良率和生產設備錯誤率之回溯方法,包括將具有複數個印刷電路板之一電路主板賦予一主板代碼,將該電路主板依該等印刷電路板區隔出複數個製造區域,並賦予每一該製造區域對應之一區域代碼,其中該區域代碼之資訊包括該主板代碼以及該區域代碼之位置資訊,對該電路主板所生產之每一該印刷電路板標示一資訊圖碼,其中該資訊圖碼之資訊包含該主板代碼以及該區域代碼之資訊,辨識每一該印刷電路板之外觀,並據以檢測該印刷電路板,若不符合一產品標準則產生一瑕疵特徵,用以記錄該印 刷電路板良率及該生產設備錯誤率,顯示該印刷電路板之該資訊圖碼之資訊以及該瑕疵特徵於一顯示介面上。 The present invention is a method for tracing back the yield rate of printed circuit boards and the error rate of production equipment. The method includes assigning a circuit motherboard with a plurality of printed circuit boards to a motherboard code, and partitioning the circuit motherboard into a plurality of printed circuit boards according to the printed circuit boards. Manufacturing area, and assigning an area code corresponding to each manufacturing area, wherein the information of the area code includes the motherboard code and the location information of the area code, and each printed circuit board produced by the circuit board is marked with an information Graphic code, where the information of the information graphic code includes the motherboard code and the information of the region code, to identify the appearance of each printed circuit board, and to detect the printed circuit board accordingly. If it does not meet a product standard, a defect will be generated Feature to record the print By scanning the yield rate of the circuit board and the error rate of the production equipment, the information of the information pattern of the printed circuit board and the characteristic of the defect are displayed on a display interface.
根據本發明之另一實施例,上述方法更包括根據該資訊圖碼取得所對應之該製造區域,招回該製造區域所生產之該些印刷電路板。 According to another embodiment of the present invention, the above method further includes obtaining the corresponding manufacturing area according to the information pattern code, and recalling the printed circuit boards produced in the manufacturing area.
根據本發明之另一實施例,上述方法更包括維修或調整該資訊圖碼取得所對應之該電路主板。 According to another embodiment of the present invention, the above method further includes repairing or adjusting the information pattern to obtain the corresponding circuit board.
根據本發明之另一實施例,上述資訊圖碼之內容進一步包含生產資訊。 According to another embodiment of the present invention, the content of the aforementioned information pattern further includes production information.
根據本發明之另一實施例,上述資訊圖碼為一維碼或二維碼。 According to another embodiment of the present invention, the aforementioned information graphic code is a one-dimensional code or a two-dimensional code.
本發明為一種印刷電路板良率和生產設備錯誤率之回溯系統,包括電路主板、外觀檢測模組、圖碼辨識模組以及顯示模組。上述電路主板,用以生產複數個印刷電路板,其包括主板代碼以及複數個製造區域。上述製造區域係由該電路主板依該等印刷電路板區隔出,每一該製造區域具有對應之一區域代碼,其中該區域代碼之資訊包括該主板代碼以及該區域代碼之位置資訊。其中每一該印刷電路板具有一資訊圖碼,該資訊圖碼之資訊包含該印刷電路板以及該區域代碼之資訊。上述外觀檢測模組,辨識每一該印刷電路板之外觀,並據以檢測該印刷電路板,若不符合一產品標準則產生一瑕疵特徵,用以記錄該印刷電路板良率及該生產設備錯誤率。上述圖碼辨識模組,用 以辨識該印刷電路板之該資訊圖碼。上述顯示模組,用以顯示該資訊圖碼之資訊以及該瑕疵特徵。 The invention is a backtracking system for printed circuit board yield and production equipment error rate, which includes a circuit main board, an appearance detection module, a pattern recognition module, and a display module. The above-mentioned circuit main board is used to produce a plurality of printed circuit boards, which includes main board codes and a plurality of manufacturing areas. The manufacturing area is separated by the circuit board and the printed circuit board areas, and each manufacturing area has a corresponding area code, wherein the information of the area code includes the main board code and the location information of the area code. Each of the printed circuit boards has an information pattern, and the information of the information pattern includes information of the printed circuit board and the area code. The above-mentioned appearance inspection module recognizes the appearance of each printed circuit board and detects the printed circuit board accordingly. If it does not meet a product standard, a defect feature is generated to record the printed circuit board yield rate and the production equipment Error rate. The above image code recognition module, use To identify the information graphic code of the printed circuit board. The above-mentioned display module is used to display the information of the information image code and the characteristic of the defect.
根據本發明之另一實施例,上述系統更包括一回溯模組,用以根據該資訊圖碼取得所對應之該製造區域,招回該製造區域所生產之該些印刷電路板。 According to another embodiment of the present invention, the above-mentioned system further includes a traceback module for obtaining the corresponding manufacturing area according to the information pattern, and recalling the printed circuit boards produced in the manufacturing area.
根據本發明之另一實施例,上述系統更包括一維修模組,用以維修或調整該資訊圖碼取得所對應之該電路主板。 According to another embodiment of the present invention, the above-mentioned system further includes a repair module for repairing or adjusting the information pattern to obtain the corresponding circuit board.
根據本發明之另一實施例,上述系統之資訊圖碼之內容進一步包含生產資訊。 According to another embodiment of the present invention, the content of the information pattern of the above-mentioned system further includes production information.
根據本發明之另一實施例,上述系統之資訊圖碼為一維碼或二維碼。 According to another embodiment of the present invention, the information graphic code of the above system is a one-dimensional code or a two-dimensional code.
綜上所述,本發明提供之一種印刷電路板良率和生產設備錯誤率之回溯方法及其系統,為一種可根據印刷電路板之資訊圖碼即時找到有瑕疵特徵之生產設備,以及即時回溯由該生產設備所生產之印刷電路板,自動提出調整對策,縮短產生不良印刷電路板的時間,大幅節省材料與其相關成本,大幅提升後續印刷電路板的生產良率與降低生產設備的錯誤率。 To sum up, the present invention provides a method and system for tracing back the yield rate of printed circuit boards and the error rate of production equipment, which is a production equipment that can find defective features in real time according to the information pattern of the printed circuit board, as well as real-time backtracking. The printed circuit board produced by this production equipment automatically proposes adjustment countermeasures, shortens the time to produce defective printed circuit boards, greatly saves materials and related costs, greatly improves the production yield of subsequent printed circuit boards and reduces the error rate of production equipment.
100:印刷電路板良率和生產設備錯誤率之回溯系統 100: Backtracking system for printed circuit board yield and production equipment error rate
110:電路主板 110: Circuit board
112:主板代碼 112: Motherboard code
114:製造區域 114: Manufacturing area
115:區域代碼 115: area code
116:印刷電路板 116: printed circuit board
117:資訊圖碼 117: Information Graphic Code
120:外觀檢測模組 120: Appearance inspection module
130:圖碼辨識模組 130: Image code recognition module
140:顯示模組 140: display module
150:回溯模組 150: Retrospective Module
160:維修模組 160: repair module
201-206:步驟 201-206: Step
為了讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附附圖之說明如下: 圖1係繪示依據本發明之一實施例之一種印刷電路板良率和生產設備錯誤率之回溯系統中各裝置、模組的關係架構圖。 In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the description of the attached drawings is as follows: FIG. 1 is a diagram showing the relationship structure of each device and module in a backtracking system for printed circuit board yield and production equipment error rate according to an embodiment of the present invention.
圖2係繪示依據本發明之一實施例之一種印刷電路板良率和生產設備錯誤率之回溯方法的流程示意圖。 FIG. 2 is a schematic flowchart of a method for tracing back the yield rate of printed circuit boards and the error rate of production equipment according to an embodiment of the present invention.
圖3係繪示依據本發明之一實施例之印刷電路板形成於電路主板之示意圖。 FIG. 3 is a schematic diagram of a printed circuit board formed on a circuit main board according to an embodiment of the present invention.
為利瞭解本發明之特徵、內容與優點,茲將本發明配合圖式,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本發明實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的申請專利範圍。 In order to understand the features, content and advantages of the present invention, the present invention is combined with the drawings and described in detail in the form of an embodiment as follows. The drawings used therein are for illustrative purposes only and as an aid to the description. It is not necessarily the true ratio and precise configuration after the implementation of the present invention, so the ratio and configuration relationship of the attached drawings should not be interpreted to limit the scope of the patent application for the actual implementation of the present invention.
請參閱圖1及圖3,圖1係繪示依據本發明之一實施例之一種印刷電路板良率和生產設備錯誤率之回溯系統中各裝置、模組的關係架構圖,圖3係繪示依據本發明之一實施例之印刷電路板形成於電路主板之示意圖。圖1的印刷電路板良率和生產設備錯誤率之回溯系統100包括電路主板110、外觀檢測模組120、圖碼辨識模組130以及顯示模組140。
Please refer to FIGS. 1 and 3. FIG. 1 is a diagram showing the relationship structure of each device and module in a backtracking system for printed circuit board yield and production equipment error rate according to an embodiment of the present invention. FIG. 3 is a drawing A schematic diagram of a printed circuit board formed on a circuit main board according to an embodiment of the present invention is shown. The
上述電路主板110,用以生產複數個印刷電路板116(示於圖3),其包括主板代碼112以及複數個製造區域114。根據本發明之
另一實施例,上述主板代碼112例如可為任意形式之數字或圖碼,可根據上述任意形式之數字或圖碼回推該主板代碼112之生產資訊。
The above-mentioned circuit
上述製造區域114係由該電路主板110依該等印刷電路板區隔出,每一該製造區域114具有對應之一區域代碼115,其中該區域代碼115之資訊包括該主板代碼112以及該區域代碼115之位置資訊。根據本發明之另一實施例,上述區域代碼115例如可為任意形式之數字或圖碼,可根據上述任意形式之數字或圖碼回推該製造區域114之座標位置。
The above-mentioned
上述每一該印刷電路板116具有一資訊圖碼117,該資訊圖碼117之資訊包含該印刷電路板116以及該區域代碼115之資訊。根據本發明之另一實施例,上述資訊圖碼117之內容進一步包含生產資訊。上述生產資訊例如可為生產時間、產品批號、檢驗參數、是否為良品等資料。上述資訊圖碼117為一維碼或二維碼。
Each of the above-mentioned
上述外觀檢測模組120,辨識每一該印刷電路板116之外觀,並據以檢測該印刷電路板116,若不符合一產品標準則產生一瑕疵特徵,用以記錄該印刷電路板良率及該生產設備錯誤率。上述外觀檢測模組120為具有影像辨識功能之任意裝置。
The above-mentioned
上述圖碼辨識模組130,用以辨識該印刷電路板116之該資訊圖碼117。根據本發明之另一實施例,上述圖碼辨識模組130更包括辨識上述主板代碼112及區域代碼115。上述圖碼辨識模組130為具有圖碼辨識功能之任意裝置。
The above-mentioned image
上述顯示模組140,用以顯示該資訊圖碼117之資訊以及該瑕疵特徵。根據本發明之另一實施例,上述顯示模組140透過程式設定預設的排版方式,可將對應的電路主板110和製造區域114之板號合併在同一個畫面呈現,並顯示出其缺點特徵分類與座標位置。
The above-mentioned
根據本發明之另一實施例,上述印刷電路板良率和生產設備錯誤率之回溯系統100更包括一回溯模組150,用以根據該資訊圖碼117取得所對應之該製造區域,招回該製造區域114所生產之該些印刷電路板116。
According to another embodiment of the present invention, the above-mentioned
根據本發明之另一實施例,上述印刷電路板良率和生產設備錯誤率之回溯系統100更包括一維修模組160,用以維修或調整該資訊圖碼117取得所對應之該電路主板110。
According to another embodiment of the present invention, the above-mentioned
請參閱圖2,圖2係繪示依據本發明之一實施例之一種印刷電路板良率和生產設備錯誤率之回溯方法的流程示意圖。並請同時參閱圖1-圖3。在步驟201中,將具有複數個印刷電路板116之一電路主板110賦予一主板代碼112。
Please refer to FIG. 2. FIG. 2 is a schematic flowchart of a method for tracing back the yield rate of printed circuit boards and the error rate of production equipment according to an embodiment of the present invention. Please also refer to Figure 1 to Figure 3. In
在步驟202中,將該電路主板110依該等印刷電路板116區隔出複數個製造區域114,並賦予每一該製造區域114對應之一區域代碼115,其中該區域代碼115之資訊包括該主板代碼112以及該區域代碼115之位置資訊。
In
在步驟203中,對該電路主板110所生產之每一該印刷電路板116標示一資訊圖碼117,其中該資訊圖碼117之資訊包含該主板代碼112以及該區域代碼115之資訊。根據本發明之另一實施例,上述資
訊圖碼117之內容進一步包含生產資訊。上述資訊圖碼117為一維碼或二維碼。
In
在步驟204中,辨識每一該印刷電路板116之外觀,並據以檢測該印刷電路板116。
In
在步驟205中,若檢測出不符合一產品標準則產生一瑕疵特徵,用以記錄該印刷電路板良率及該生產設備錯誤率。
In
在步驟206中,顯示該印刷電路板116之該資訊圖碼117之資訊以及該瑕疵特徵於一顯示介面上。因此,可清楚了解該印刷電路板116是由何片電路主板110,以及位於該電路主板110之何處位置。透過此追朔技術,可將原本只有分析區域板上的缺點,變成可回朔至未裁切前是電路主板110的製程上,讓產品生產履歷更完整。
In
根據本發明之另一實施例,上述方法更包括根據該資訊圖碼117取得所對應之該製造區域114,招回該製造區域114所生產之該些印刷電路板116。如圖3所示,本案之印刷電路板116上的資訊圖碼117,也會有包含有製造區域114之區域代碼115,讓後續的數據收集以及分析可更加明確。
According to another embodiment of the present invention, the above method further includes obtaining the corresponding
根據本發明之另一實施例,上述方法更包括維修或調整該資訊圖碼117取得所對應之該電路主板110。藉由此方式可將多片印刷電路板116還原成主電路板110,並可經由大數據統計,推斷出該電路主板110在生產過程中哪個製造區域114容易發生缺陷,該發生缺陷之製造區域114是否與生產設備、治具有關,藉此,可提供生產者更可靠之數據來做預防或提升後續生產品質。同時,若後續出貨到客戶端,
日後遇到產品瑕疵招回,透過此追朔系統可精準判斷,需招回的產品範圍與數量,減少損失。
According to another embodiment of the present invention, the above method further includes repairing or adjusting the
綜上所述,藉由本發明提供之一種印刷電路板良率和生產設備錯誤率之回溯方法及其系統,可以即時根據印刷電路板之資訊圖碼即時找到有瑕疵特徵之生產設備及製造區域,並可即時回溯由該生產設備所生產之印刷電路板,自動提出調整對策,縮短產生不良印刷電路板的時間,大幅節省材料與其相關成本,大幅提升後續印刷電路板的生產良率與降低生產設備的錯誤率。 In summary, with the method and system for backtracking printed circuit board yield and production equipment error rate provided by the present invention, the production equipment and manufacturing area with defective characteristics can be found in real time according to the information pattern of the printed circuit board. The printed circuit boards produced by the production equipment can be traced back in real time, and adjustment countermeasures can be automatically proposed to shorten the time for producing defective printed circuit boards, greatly save materials and related costs, greatly increase the production yield of subsequent printed circuit boards and reduce production equipment The error rate.
雖然本發明已實施方式揭露如上,然其並非用以限定本發明,凡熟悉該項技藝之人士其所依本發明之精神,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後之申請專利範圍所界定者為準。 Although the embodiments of the present invention have been disclosed as above, they are not intended to limit the present invention. Anyone familiar with the art can make various changes without departing from the spirit and scope of the present invention according to the spirit of the present invention. Therefore, the scope of protection of the present invention shall be subject to those defined by the scope of patent application.
110:電路主板 110: Circuit board
112:主板代碼 112: Motherboard code
114:製造區域 114: Manufacturing area
115:區域代碼 115: area code
116:印刷電路板 116: printed circuit board
117:資訊圖碼 117: Information Graphic Code
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TW479917U (en) * | 2000-10-21 | 2002-03-11 | Utechzone Co Ltd | Quality maintenance and feedback system for printed circuit board process |
CN101431855A (en) * | 2007-11-08 | 2009-05-13 | 英业达股份有限公司 | Circuit board with identification code and its production method |
TW201039703A (en) * | 2009-04-16 | 2010-11-01 | Unimicron Technology Corp | Quality control and inspection process flow for printed circuit board manufacturing |
TW201240541A (en) * | 2011-03-21 | 2012-10-01 | D Tek Technology Co Ltd | Picking-up and placing method with integrated PCB information |
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TW479917U (en) * | 2000-10-21 | 2002-03-11 | Utechzone Co Ltd | Quality maintenance and feedback system for printed circuit board process |
CN101431855A (en) * | 2007-11-08 | 2009-05-13 | 英业达股份有限公司 | Circuit board with identification code and its production method |
TW201039703A (en) * | 2009-04-16 | 2010-11-01 | Unimicron Technology Corp | Quality control and inspection process flow for printed circuit board manufacturing |
TW201240541A (en) * | 2011-03-21 | 2012-10-01 | D Tek Technology Co Ltd | Picking-up and placing method with integrated PCB information |
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