TWI745131B - Printed circuit board yield rate and production equipment error rate backtracking method and system thereof - Google Patents

Printed circuit board yield rate and production equipment error rate backtracking method and system thereof Download PDF

Info

Publication number
TWI745131B
TWI745131B TW109136592A TW109136592A TWI745131B TW I745131 B TWI745131 B TW I745131B TW 109136592 A TW109136592 A TW 109136592A TW 109136592 A TW109136592 A TW 109136592A TW I745131 B TWI745131 B TW I745131B
Authority
TW
Taiwan
Prior art keywords
printed circuit
circuit board
information
code
production equipment
Prior art date
Application number
TW109136592A
Other languages
Chinese (zh)
Other versions
TW202218495A (en
Inventor
林文彬
陳文生
Original Assignee
聯策科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 聯策科技股份有限公司 filed Critical 聯策科技股份有限公司
Priority to TW109136592A priority Critical patent/TWI745131B/en
Application granted granted Critical
Publication of TWI745131B publication Critical patent/TWI745131B/en
Publication of TW202218495A publication Critical patent/TW202218495A/en

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • General Factory Administration (AREA)

Abstract

A method for tracing back a yield rate of printed circuit board (PCB) and a error rate of production equipment is to assign a motherboard code to a circuit board, divide the circuit board into multiple manufacturing areas based on the PCB, and assign an area code to each manufacturing area. Each PCB produced by the circuit board is marked with an information pattern code. According to which the PCB is detected, if it does not meet the product standard, a defect feature is generated to record the PCB yield rate and production equipment error rate. When the PCB is defective, in addition to judging the location of the defect in the PCB itself, it can also judge the manufacturing process of the circuit board in the PCB, which can greatly improve the production yield of subsequent PCB and reduce the error rate of production equipment.

Description

印刷電路板良率和生產設備錯誤率之回溯方法及其系 統 Backtracking method and system of printed circuit board yield and production equipment error rate Unify

一種印刷電路板良率和生產設備錯誤率之回溯方法及其系統,尤指印刷電路板之資訊圖碼包含有電路主板之代碼以及印刷電路板位於電路主板之區域代碼,而可於印刷電路板生產缺陷時,可即時得知其製造過程及回溯該電路主板所產生之印刷電路板之方法及其系統。 A method and system for tracing back the yield rate of printed circuit boards and the error rate of production equipment, especially the information graphics code of the printed circuit board includes the code of the circuit board and the area code of the printed circuit board located on the circuit board, and can be used on the printed circuit board In the event of a production defect, the manufacturing process can be immediately known and the method and system for tracing back the printed circuit board produced by the circuit main board.

按,目前印刷電路板是依照所需尺寸由電路主板經過多個製程後再裁切成特定尺寸的印刷電路板,為了提高產品品質以及良率,印刷電路板再製成後,都會經過各種檢驗,為了能夠防止繼續生產出不良品,或是減少產出不良品的機率,一般會將生產的參數或過程,以條碼方式標示於印刷電路板上,一旦檢驗出不良品或是印刷電路板於客戶端發生問題時,可藉由該標示所紀錄之參數與過程,來了解缺陷產生原因,進而可提高後續生產產品的品質與良率。然而,印 刷電路板是由電路主板經多個製程完成後再裁切形成,因此,印刷電路板在主板上的位置,對於缺陷的「回溯分析」以及「缺陷產生原因分析」相當重要,但現今印刷電路板的標示,又無法得知其於電路主板的位置,無法有效且準確的判斷缺陷發生原因,對於良率與品質的提升幫助有限。 According to the current printed circuit board, the printed circuit board is cut into a specific size printed circuit board according to the required size by the circuit board after multiple processes. In order to improve product quality and yield, the printed circuit board will undergo various inspections after it is manufactured. In order to prevent the continuous production of defective products or reduce the probability of producing defective products, the production parameters or processes are generally marked on the printed circuit board by bar code. Once the defective product is detected or the printed circuit board is When a problem occurs on the client side, the parameters and processes recorded in the label can be used to understand the cause of the defect, which can improve the quality and yield of subsequent products. However, printing The printed circuit board is formed by cutting the circuit board after multiple manufacturing processes. Therefore, the position of the printed circuit board on the motherboard is very important for the "retrospective analysis" of defects and the "defect cause analysis", but nowadays printed circuits The label of the board cannot know its position on the circuit main board, and it is impossible to effectively and accurately determine the cause of the defect, and it is of limited help to the improvement of yield and quality.

鑑於上述欲解決之問題及其原因,具體而言,本發明提供一種印刷電路板良率和生產設備錯誤率之回溯方法及其裝置,利用印刷電路板上的資訊圖碼包含電路主板之主板代碼以及印刷電路板於電路主板上之製造區域的區域代碼,俾使印刷電路板發生缺陷時,除了能由印刷電路板本身發生缺陷的位置進行判斷外,更可以對電路主板在印刷電路板的製程進行判斷,可以大幅提升後續印刷電路板的生產良率與降低生產設備的錯誤率。 In view of the above-mentioned problems to be solved and their reasons, in particular, the present invention provides a method and device for tracing back the yield rate of printed circuit boards and the error rate of production equipment, using the information pattern on the printed circuit board to include the motherboard code of the circuit board And the area code of the manufacturing area of the printed circuit board on the circuit board, so that when the printed circuit board is defective, in addition to judging the position of the printed circuit board itself, it can also determine the manufacturing process of the circuit board on the printed circuit board. Making judgments can greatly improve the production yield of subsequent printed circuit boards and reduce the error rate of production equipment.

本發明為一種印刷電路板良率和生產設備錯誤率之回溯方法,包括將具有複數個印刷電路板之一電路主板賦予一主板代碼,將該電路主板依該等印刷電路板區隔出複數個製造區域,並賦予每一該製造區域對應之一區域代碼,其中該區域代碼之資訊包括該主板代碼以及該區域代碼之位置資訊,對該電路主板所生產之每一該印刷電路板標示一資訊圖碼,其中該資訊圖碼之資訊包含該主板代碼以及該區域代碼之資訊,辨識每一該印刷電路板之外觀,並據以檢測該印刷電路板,若不符合一產品標準則產生一瑕疵特徵,用以記錄該印 刷電路板良率及該生產設備錯誤率,顯示該印刷電路板之該資訊圖碼之資訊以及該瑕疵特徵於一顯示介面上。 The present invention is a method for tracing back the yield rate of printed circuit boards and the error rate of production equipment. The method includes assigning a circuit motherboard with a plurality of printed circuit boards to a motherboard code, and partitioning the circuit motherboard into a plurality of printed circuit boards according to the printed circuit boards. Manufacturing area, and assigning an area code corresponding to each manufacturing area, wherein the information of the area code includes the motherboard code and the location information of the area code, and each printed circuit board produced by the circuit board is marked with an information Graphic code, where the information of the information graphic code includes the motherboard code and the information of the region code, to identify the appearance of each printed circuit board, and to detect the printed circuit board accordingly. If it does not meet a product standard, a defect will be generated Feature to record the print By scanning the yield rate of the circuit board and the error rate of the production equipment, the information of the information pattern of the printed circuit board and the characteristic of the defect are displayed on a display interface.

根據本發明之另一實施例,上述方法更包括根據該資訊圖碼取得所對應之該製造區域,招回該製造區域所生產之該些印刷電路板。 According to another embodiment of the present invention, the above method further includes obtaining the corresponding manufacturing area according to the information pattern code, and recalling the printed circuit boards produced in the manufacturing area.

根據本發明之另一實施例,上述方法更包括維修或調整該資訊圖碼取得所對應之該電路主板。 According to another embodiment of the present invention, the above method further includes repairing or adjusting the information pattern to obtain the corresponding circuit board.

根據本發明之另一實施例,上述資訊圖碼之內容進一步包含生產資訊。 According to another embodiment of the present invention, the content of the aforementioned information pattern further includes production information.

根據本發明之另一實施例,上述資訊圖碼為一維碼或二維碼。 According to another embodiment of the present invention, the aforementioned information graphic code is a one-dimensional code or a two-dimensional code.

本發明為一種印刷電路板良率和生產設備錯誤率之回溯系統,包括電路主板、外觀檢測模組、圖碼辨識模組以及顯示模組。上述電路主板,用以生產複數個印刷電路板,其包括主板代碼以及複數個製造區域。上述製造區域係由該電路主板依該等印刷電路板區隔出,每一該製造區域具有對應之一區域代碼,其中該區域代碼之資訊包括該主板代碼以及該區域代碼之位置資訊。其中每一該印刷電路板具有一資訊圖碼,該資訊圖碼之資訊包含該印刷電路板以及該區域代碼之資訊。上述外觀檢測模組,辨識每一該印刷電路板之外觀,並據以檢測該印刷電路板,若不符合一產品標準則產生一瑕疵特徵,用以記錄該印刷電路板良率及該生產設備錯誤率。上述圖碼辨識模組,用 以辨識該印刷電路板之該資訊圖碼。上述顯示模組,用以顯示該資訊圖碼之資訊以及該瑕疵特徵。 The invention is a backtracking system for printed circuit board yield and production equipment error rate, which includes a circuit main board, an appearance detection module, a pattern recognition module, and a display module. The above-mentioned circuit main board is used to produce a plurality of printed circuit boards, which includes main board codes and a plurality of manufacturing areas. The manufacturing area is separated by the circuit board and the printed circuit board areas, and each manufacturing area has a corresponding area code, wherein the information of the area code includes the main board code and the location information of the area code. Each of the printed circuit boards has an information pattern, and the information of the information pattern includes information of the printed circuit board and the area code. The above-mentioned appearance inspection module recognizes the appearance of each printed circuit board and detects the printed circuit board accordingly. If it does not meet a product standard, a defect feature is generated to record the printed circuit board yield rate and the production equipment Error rate. The above image code recognition module, use To identify the information graphic code of the printed circuit board. The above-mentioned display module is used to display the information of the information image code and the characteristic of the defect.

根據本發明之另一實施例,上述系統更包括一回溯模組,用以根據該資訊圖碼取得所對應之該製造區域,招回該製造區域所生產之該些印刷電路板。 According to another embodiment of the present invention, the above-mentioned system further includes a traceback module for obtaining the corresponding manufacturing area according to the information pattern, and recalling the printed circuit boards produced in the manufacturing area.

根據本發明之另一實施例,上述系統更包括一維修模組,用以維修或調整該資訊圖碼取得所對應之該電路主板。 According to another embodiment of the present invention, the above-mentioned system further includes a repair module for repairing or adjusting the information pattern to obtain the corresponding circuit board.

根據本發明之另一實施例,上述系統之資訊圖碼之內容進一步包含生產資訊。 According to another embodiment of the present invention, the content of the information pattern of the above-mentioned system further includes production information.

根據本發明之另一實施例,上述系統之資訊圖碼為一維碼或二維碼。 According to another embodiment of the present invention, the information graphic code of the above system is a one-dimensional code or a two-dimensional code.

綜上所述,本發明提供之一種印刷電路板良率和生產設備錯誤率之回溯方法及其系統,為一種可根據印刷電路板之資訊圖碼即時找到有瑕疵特徵之生產設備,以及即時回溯由該生產設備所生產之印刷電路板,自動提出調整對策,縮短產生不良印刷電路板的時間,大幅節省材料與其相關成本,大幅提升後續印刷電路板的生產良率與降低生產設備的錯誤率。 To sum up, the present invention provides a method and system for tracing back the yield rate of printed circuit boards and the error rate of production equipment, which is a production equipment that can find defective features in real time according to the information pattern of the printed circuit board, as well as real-time backtracking. The printed circuit board produced by this production equipment automatically proposes adjustment countermeasures, shortens the time to produce defective printed circuit boards, greatly saves materials and related costs, greatly improves the production yield of subsequent printed circuit boards and reduces the error rate of production equipment.

100:印刷電路板良率和生產設備錯誤率之回溯系統 100: Backtracking system for printed circuit board yield and production equipment error rate

110:電路主板 110: Circuit board

112:主板代碼 112: Motherboard code

114:製造區域 114: Manufacturing area

115:區域代碼 115: area code

116:印刷電路板 116: printed circuit board

117:資訊圖碼 117: Information Graphic Code

120:外觀檢測模組 120: Appearance inspection module

130:圖碼辨識模組 130: Image code recognition module

140:顯示模組 140: display module

150:回溯模組 150: Retrospective Module

160:維修模組 160: repair module

201-206:步驟 201-206: Step

為了讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附附圖之說明如下: 圖1係繪示依據本發明之一實施例之一種印刷電路板良率和生產設備錯誤率之回溯系統中各裝置、模組的關係架構圖。 In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the description of the attached drawings is as follows: FIG. 1 is a diagram showing the relationship structure of each device and module in a backtracking system for printed circuit board yield and production equipment error rate according to an embodiment of the present invention.

圖2係繪示依據本發明之一實施例之一種印刷電路板良率和生產設備錯誤率之回溯方法的流程示意圖。 FIG. 2 is a schematic flowchart of a method for tracing back the yield rate of printed circuit boards and the error rate of production equipment according to an embodiment of the present invention.

圖3係繪示依據本發明之一實施例之印刷電路板形成於電路主板之示意圖。 FIG. 3 is a schematic diagram of a printed circuit board formed on a circuit main board according to an embodiment of the present invention.

為利瞭解本發明之特徵、內容與優點,茲將本發明配合圖式,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本發明實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的申請專利範圍。 In order to understand the features, content and advantages of the present invention, the present invention is combined with the drawings and described in detail in the form of an embodiment as follows. The drawings used therein are for illustrative purposes only and as an aid to the description. It is not necessarily the true ratio and precise configuration after the implementation of the present invention, so the ratio and configuration relationship of the attached drawings should not be interpreted to limit the scope of the patent application for the actual implementation of the present invention.

請參閱圖1及圖3,圖1係繪示依據本發明之一實施例之一種印刷電路板良率和生產設備錯誤率之回溯系統中各裝置、模組的關係架構圖,圖3係繪示依據本發明之一實施例之印刷電路板形成於電路主板之示意圖。圖1的印刷電路板良率和生產設備錯誤率之回溯系統100包括電路主板110、外觀檢測模組120、圖碼辨識模組130以及顯示模組140。 Please refer to FIGS. 1 and 3. FIG. 1 is a diagram showing the relationship structure of each device and module in a backtracking system for printed circuit board yield and production equipment error rate according to an embodiment of the present invention. FIG. 3 is a drawing A schematic diagram of a printed circuit board formed on a circuit main board according to an embodiment of the present invention is shown. The backtracking system 100 of printed circuit board yield and production equipment error rate of FIG. 1 includes a circuit main board 110, an appearance inspection module 120, a pattern recognition module 130 and a display module 140.

上述電路主板110,用以生產複數個印刷電路板116(示於圖3),其包括主板代碼112以及複數個製造區域114。根據本發明之 另一實施例,上述主板代碼112例如可為任意形式之數字或圖碼,可根據上述任意形式之數字或圖碼回推該主板代碼112之生產資訊。 The above-mentioned circuit main board 110 is used to produce a plurality of printed circuit boards 116 (shown in FIG. 3 ), which includes a main board code 112 and a plurality of manufacturing areas 114. According to the present invention In another embodiment, the above-mentioned motherboard code 112 can be, for example, any form of numbers or graphics codes, and the production information of the motherboard code 112 can be pushed back based on the above-mentioned arbitrary forms of numbers or graphics codes.

上述製造區域114係由該電路主板110依該等印刷電路板區隔出,每一該製造區域114具有對應之一區域代碼115,其中該區域代碼115之資訊包括該主板代碼112以及該區域代碼115之位置資訊。根據本發明之另一實施例,上述區域代碼115例如可為任意形式之數字或圖碼,可根據上述任意形式之數字或圖碼回推該製造區域114之座標位置。 The above-mentioned manufacturing area 114 is separated by the circuit board 110 according to the printed circuit board areas, and each of the manufacturing areas 114 has a corresponding area code 115, wherein the information of the area code 115 includes the main board code 112 and the area code 115 location information. According to another embodiment of the present invention, the above-mentioned area code 115 can be, for example, any form of number or image code, and the coordinate position of the manufacturing area 114 can be pushed back based on the above-mentioned arbitrary form of number or image code.

上述每一該印刷電路板116具有一資訊圖碼117,該資訊圖碼117之資訊包含該印刷電路板116以及該區域代碼115之資訊。根據本發明之另一實施例,上述資訊圖碼117之內容進一步包含生產資訊。上述生產資訊例如可為生產時間、產品批號、檢驗參數、是否為良品等資料。上述資訊圖碼117為一維碼或二維碼。 Each of the above-mentioned printed circuit boards 116 has an information pattern 117, and the information of the information pattern 117 includes the information of the printed circuit board 116 and the area code 115. According to another embodiment of the present invention, the content of the aforementioned information pattern 117 further includes production information. The above-mentioned production information may be, for example, production time, product batch number, inspection parameters, whether it is a good product, and other data. The aforementioned information graphic code 117 is a one-dimensional code or a two-dimensional code.

上述外觀檢測模組120,辨識每一該印刷電路板116之外觀,並據以檢測該印刷電路板116,若不符合一產品標準則產生一瑕疵特徵,用以記錄該印刷電路板良率及該生產設備錯誤率。上述外觀檢測模組120為具有影像辨識功能之任意裝置。 The above-mentioned appearance inspection module 120 recognizes the appearance of each printed circuit board 116 and detects the printed circuit board 116 accordingly. If it does not meet a product standard, a defect feature is generated to record the printed circuit board yield and The error rate of the production equipment. The above-mentioned appearance detection module 120 is any device with an image recognition function.

上述圖碼辨識模組130,用以辨識該印刷電路板116之該資訊圖碼117。根據本發明之另一實施例,上述圖碼辨識模組130更包括辨識上述主板代碼112及區域代碼115。上述圖碼辨識模組130為具有圖碼辨識功能之任意裝置。 The above-mentioned image code recognition module 130 is used to identify the information image code 117 of the printed circuit board 116. According to another embodiment of the present invention, the above-mentioned image code recognition module 130 further includes the above-mentioned motherboard code 112 and the region code 115 for recognizing the above-mentioned motherboard code. The above-mentioned image code recognition module 130 is any device with an image code recognition function.

上述顯示模組140,用以顯示該資訊圖碼117之資訊以及該瑕疵特徵。根據本發明之另一實施例,上述顯示模組140透過程式設定預設的排版方式,可將對應的電路主板110和製造區域114之板號合併在同一個畫面呈現,並顯示出其缺點特徵分類與座標位置。 The above-mentioned display module 140 is used for displaying the information of the information image code 117 and the feature of the defect. According to another embodiment of the present invention, the above-mentioned display module 140 can combine the board numbers of the corresponding circuit board 110 and the manufacturing area 114 on the same screen to display its shortcomings and characteristics by setting a preset layout method through a program. Classification and coordinate position.

根據本發明之另一實施例,上述印刷電路板良率和生產設備錯誤率之回溯系統100更包括一回溯模組150,用以根據該資訊圖碼117取得所對應之該製造區域,招回該製造區域114所生產之該些印刷電路板116。 According to another embodiment of the present invention, the above-mentioned traceability system 100 for printed circuit board yield and production equipment error rate further includes a traceability module 150 for obtaining the corresponding manufacturing area according to the information pattern 117, and recalling The printed circuit boards 116 produced in the manufacturing area 114.

根據本發明之另一實施例,上述印刷電路板良率和生產設備錯誤率之回溯系統100更包括一維修模組160,用以維修或調整該資訊圖碼117取得所對應之該電路主板110。 According to another embodiment of the present invention, the above-mentioned traceability system 100 for printed circuit board yield and production equipment error rate further includes a maintenance module 160 for repairing or adjusting the information pattern 117 to obtain the corresponding circuit board 110 .

請參閱圖2,圖2係繪示依據本發明之一實施例之一種印刷電路板良率和生產設備錯誤率之回溯方法的流程示意圖。並請同時參閱圖1-圖3。在步驟201中,將具有複數個印刷電路板116之一電路主板110賦予一主板代碼112。 Please refer to FIG. 2. FIG. 2 is a schematic flowchart of a method for tracing back the yield rate of printed circuit boards and the error rate of production equipment according to an embodiment of the present invention. Please also refer to Figure 1 to Figure 3. In step 201, a circuit main board 110 having a plurality of printed circuit boards 116 is assigned a main board code 112.

在步驟202中,將該電路主板110依該等印刷電路板116區隔出複數個製造區域114,並賦予每一該製造區域114對應之一區域代碼115,其中該區域代碼115之資訊包括該主板代碼112以及該區域代碼115之位置資訊。 In step 202, the circuit board 110 is divided into a plurality of manufacturing areas 114 according to the printed circuit boards 116, and each manufacturing area 114 is assigned a corresponding area code 115, wherein the information of the area code 115 includes the The location information of the motherboard code 112 and the area code 115.

在步驟203中,對該電路主板110所生產之每一該印刷電路板116標示一資訊圖碼117,其中該資訊圖碼117之資訊包含該主板代碼112以及該區域代碼115之資訊。根據本發明之另一實施例,上述資 訊圖碼117之內容進一步包含生產資訊。上述資訊圖碼117為一維碼或二維碼。 In step 203, each printed circuit board 116 produced by the circuit main board 110 is marked with an information pattern 117, wherein the information of the information pattern 117 includes the information of the main board code 112 and the area code 115. According to another embodiment of the present invention, the above-mentioned resources The content of the image code 117 further includes production information. The aforementioned information graphic code 117 is a one-dimensional code or a two-dimensional code.

在步驟204中,辨識每一該印刷電路板116之外觀,並據以檢測該印刷電路板116。 In step 204, the appearance of each printed circuit board 116 is identified, and the printed circuit board 116 is inspected accordingly.

在步驟205中,若檢測出不符合一產品標準則產生一瑕疵特徵,用以記錄該印刷電路板良率及該生產設備錯誤率。 In step 205, if it is detected that a product standard is not met, a defect feature is generated to record the yield rate of the printed circuit board and the error rate of the production equipment.

在步驟206中,顯示該印刷電路板116之該資訊圖碼117之資訊以及該瑕疵特徵於一顯示介面上。因此,可清楚了解該印刷電路板116是由何片電路主板110,以及位於該電路主板110之何處位置。透過此追朔技術,可將原本只有分析區域板上的缺點,變成可回朔至未裁切前是電路主板110的製程上,讓產品生產履歷更完整。 In step 206, the information of the information pattern 117 of the printed circuit board 116 and the defect feature are displayed on a display interface. Therefore, it is possible to clearly understand which circuit board 110 the printed circuit board 116 is made of, and where it is located on the circuit board 110. Through this retrospective technology, the defects that were originally only analyzed on the area board can be retrospected to the manufacturing process of the circuit board 110 before cutting, so that the production history of the product is more complete.

根據本發明之另一實施例,上述方法更包括根據該資訊圖碼117取得所對應之該製造區域114,招回該製造區域114所生產之該些印刷電路板116。如圖3所示,本案之印刷電路板116上的資訊圖碼117,也會有包含有製造區域114之區域代碼115,讓後續的數據收集以及分析可更加明確。 According to another embodiment of the present invention, the above method further includes obtaining the corresponding manufacturing area 114 according to the information pattern 117, and recalling the printed circuit boards 116 produced by the manufacturing area 114. As shown in FIG. 3, the information graphic code 117 on the printed circuit board 116 of this case will also have an area code 115 including the manufacturing area 114, so that subsequent data collection and analysis can be more clear.

根據本發明之另一實施例,上述方法更包括維修或調整該資訊圖碼117取得所對應之該電路主板110。藉由此方式可將多片印刷電路板116還原成主電路板110,並可經由大數據統計,推斷出該電路主板110在生產過程中哪個製造區域114容易發生缺陷,該發生缺陷之製造區域114是否與生產設備、治具有關,藉此,可提供生產者更可靠之數據來做預防或提升後續生產品質。同時,若後續出貨到客戶端, 日後遇到產品瑕疵招回,透過此追朔系統可精準判斷,需招回的產品範圍與數量,減少損失。 According to another embodiment of the present invention, the above method further includes repairing or adjusting the information pattern 117 to obtain the corresponding circuit board 110. In this way, multiple printed circuit boards 116 can be restored to the main circuit board 110, and large data statistics can be used to infer which manufacturing area 114 of the circuit board 110 is prone to defects during the production process, and the manufacturing area where the defect occurs Whether 114 is related to production equipment and governance, it can provide producers with more reliable data to prevent or improve the quality of subsequent production. At the same time, if it is subsequently shipped to the client, In the future, product defects are recalled. Through this tracking system, we can accurately determine the scope and quantity of products that need to be recalled to reduce losses.

綜上所述,藉由本發明提供之一種印刷電路板良率和生產設備錯誤率之回溯方法及其系統,可以即時根據印刷電路板之資訊圖碼即時找到有瑕疵特徵之生產設備及製造區域,並可即時回溯由該生產設備所生產之印刷電路板,自動提出調整對策,縮短產生不良印刷電路板的時間,大幅節省材料與其相關成本,大幅提升後續印刷電路板的生產良率與降低生產設備的錯誤率。 In summary, with the method and system for backtracking printed circuit board yield and production equipment error rate provided by the present invention, the production equipment and manufacturing area with defective characteristics can be found in real time according to the information pattern of the printed circuit board. The printed circuit boards produced by the production equipment can be traced back in real time, and adjustment countermeasures can be automatically proposed to shorten the time for producing defective printed circuit boards, greatly save materials and related costs, greatly increase the production yield of subsequent printed circuit boards and reduce production equipment The error rate.

雖然本發明已實施方式揭露如上,然其並非用以限定本發明,凡熟悉該項技藝之人士其所依本發明之精神,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後之申請專利範圍所界定者為準。 Although the embodiments of the present invention have been disclosed as above, they are not intended to limit the present invention. Anyone familiar with the art can make various changes without departing from the spirit and scope of the present invention according to the spirit of the present invention. Therefore, the scope of protection of the present invention shall be subject to those defined by the scope of patent application.

110:電路主板 110: Circuit board

112:主板代碼 112: Motherboard code

114:製造區域 114: Manufacturing area

115:區域代碼 115: area code

116:印刷電路板 116: printed circuit board

117:資訊圖碼 117: Information Graphic Code

Claims (10)

一種印刷電路板良率和生產設備錯誤率之回溯方法,包括:將具有複數個印刷電路板之一電路主板賦予一主板代碼;將該電路主板依該等印刷電路板區隔出複數個製造區域,並賦予每一該製造區域對應之一區域代碼,其中該區域代碼之資訊包括該主板代碼以及該區域代碼之位置資訊;對該電路主板所生產之每一該印刷電路板標示一資訊圖碼,其中該資訊圖碼之資訊包含該主板代碼以及該區域代碼之資訊;辨識每一該印刷電路板之外觀,並據以檢測該印刷電路板,若不符合一產品標準則產生一瑕疵特徵,用以記錄該印刷電路板良率及一生產設備的錯誤率;透過具有該瑕疵特徵之該印刷電路板之資訊圖碼,即時找到對應該瑕疵特徵之該生產設備及該製造區域;即時回溯由該生產設備所生產之該印刷電路板,自動提出調整對策;以及顯示該印刷電路板之該資訊圖碼之資訊以及該瑕疵特徵於一顯示介面上。 A method for tracing back the yield rate of printed circuit boards and the error rate of production equipment includes: assigning a circuit main board with a plurality of printed circuit boards to a main board code; dividing the circuit main board into a plurality of manufacturing areas based on the printed circuit boards , And assign an area code corresponding to each manufacturing area, where the information of the area code includes the motherboard code and the location information of the area code; each printed circuit board produced by the circuit motherboard is marked with an information pattern , Where the information of the information graphic code includes the information of the motherboard code and the area code; identify the appearance of each printed circuit board, and detect the printed circuit board accordingly, and produce a defect feature if it does not meet a product standard, It is used to record the yield rate of the printed circuit board and the error rate of a production equipment; through the information pattern of the printed circuit board with the defect feature, the production equipment and the manufacturing area corresponding to the defect feature can be found in real time; The printed circuit board produced by the production equipment automatically proposes adjustment measures; and displays the information of the information pattern of the printed circuit board and the defect feature on a display interface. 如請求項1所述之印刷電路板良率和生產設備錯誤率之回溯方法,更包括根據該資訊圖碼取得所對應之該製造區域,招回該製造區域所生產之該些印刷電路板。 The method for tracing back the yield rate of printed circuit boards and the error rate of production equipment as described in claim 1, further includes obtaining the corresponding manufacturing area according to the information pattern, and recalling the printed circuit boards produced in the manufacturing area. 如請求項1所述之印刷電路板良率和生產設備錯誤率之回溯方法,更包括維修或調整該資訊圖碼取得所對應之該電路主板。 The retrospective method of printed circuit board yield and production equipment error rate as described in claim 1, further includes repairing or adjusting the information pattern to obtain the corresponding circuit board. 如請求項1所述之印刷電路板良率和生產設備錯誤率之回溯方法,其中該資訊圖碼之內容進一步包含生產資訊。 The backtracking method of printed circuit board yield and production equipment error rate as described in claim 1, wherein the content of the information pattern further includes production information. 如請求項1所述之印刷電路板良率和生產設備錯誤率之回溯方法,其中該資訊圖碼為一維碼或二維碼。 The backtracking method of printed circuit board yield and production equipment error rate as described in claim 1, wherein the information graphic code is a one-dimensional code or a two-dimensional code. 一種使用請求項1-5任一項所述之方法執行印刷電路板良率和生產設備錯誤率之回溯系統,包括:一電路主板,用以生產複數個印刷電路板,其包括:一主板代碼;以及複數個製造區域,係由該電路主板依該等印刷電路板區隔出,每一該製造區域具有對應之一區域代碼,其中該區域代碼之資訊包括該主板代碼以及該區域代碼之位置資訊;其中每一該印刷電路板具有一資訊圖碼,該資訊圖碼之資訊包含該印刷電路板以及該區域代碼之資訊;一外觀檢測模組,辨識每一該印刷電路板之外觀,並據以檢測該印刷電路板,若不符合一產品標準則產生一瑕疵特徵,用以記錄該印刷電路板良率及一生產設備的錯誤率;一圖碼辨識模組,用以辨識該印刷電路板之該資訊圖碼;以及一顯示模組,用以顯示該資訊圖碼之資訊以及該瑕疵特徵。 A retrospective system for performing printed circuit board yield and production equipment error rate using the method described in any one of claim items 1-5, including: a circuit main board for producing a plurality of printed circuit boards, including: a main board code ; And a plurality of manufacturing areas are separated by the circuit board according to the printed circuit board areas, each of the manufacturing areas has a corresponding area code, wherein the information of the area code includes the motherboard code and the location of the area code Information; each of the printed circuit boards has an information pattern, and the information of the information pattern includes information about the printed circuit board and the area code; an appearance detection module that identifies the appearance of each printed circuit board, and According to the detection of the printed circuit board, if it does not meet a product standard, a defect feature is generated to record the yield rate of the printed circuit board and the error rate of a production equipment; a pattern recognition module is used to identify the printed circuit The information pattern of the board; and a display module for displaying the information of the information pattern and the defect characteristics. 如請求項6所述之印刷電路板良率和生產設備錯誤率之回溯系統,更包括一回溯模組,用以根據該資訊圖碼取得所對應之該製造區域,招回該製造區域所生產之該些印刷電路板。 The backtracking system for printed circuit board yield and production equipment error rate as described in claim 6, further includes a backtracking module for obtaining the corresponding manufacturing area based on the information pattern, and recalling the production in the manufacturing area These printed circuit boards. 如請求項6所述之印刷電路板良率和生產設備錯誤率之回溯系統,更包括一維修模組,用以維修或調整該資訊圖碼取得所對應之該電路主板。 The backtracking system of printed circuit board yield and production equipment error rate as described in claim 6, further includes a maintenance module for repairing or adjusting the information pattern to obtain the corresponding circuit board. 如請求項6所述之印刷電路板良率和生產設備錯誤率之回溯系統,其中該資訊圖碼之內容進一步包含生產資訊。 The backtracking system of printed circuit board yield and production equipment error rate as described in claim 6, wherein the content of the information pattern further includes production information. 如請求項6所述之印刷電路板良率和生產設備錯誤率之回溯系統,其中該資訊圖碼為一維碼或二維碼。 The backtracking system for printed circuit board yield and production equipment error rate as described in claim 6, wherein the information graphic code is a one-dimensional code or a two-dimensional code.
TW109136592A 2020-10-22 2020-10-22 Printed circuit board yield rate and production equipment error rate backtracking method and system thereof TWI745131B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW109136592A TWI745131B (en) 2020-10-22 2020-10-22 Printed circuit board yield rate and production equipment error rate backtracking method and system thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109136592A TWI745131B (en) 2020-10-22 2020-10-22 Printed circuit board yield rate and production equipment error rate backtracking method and system thereof

Publications (2)

Publication Number Publication Date
TWI745131B true TWI745131B (en) 2021-11-01
TW202218495A TW202218495A (en) 2022-05-01

Family

ID=79907929

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109136592A TWI745131B (en) 2020-10-22 2020-10-22 Printed circuit board yield rate and production equipment error rate backtracking method and system thereof

Country Status (1)

Country Link
TW (1) TWI745131B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW479917U (en) * 2000-10-21 2002-03-11 Utechzone Co Ltd Quality maintenance and feedback system for printed circuit board process
CN101431855A (en) * 2007-11-08 2009-05-13 英业达股份有限公司 Circuit board with identification code and its production method
TW201039703A (en) * 2009-04-16 2010-11-01 Unimicron Technology Corp Quality control and inspection process flow for printed circuit board manufacturing
TW201240541A (en) * 2011-03-21 2012-10-01 D Tek Technology Co Ltd Picking-up and placing method with integrated PCB information

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW479917U (en) * 2000-10-21 2002-03-11 Utechzone Co Ltd Quality maintenance and feedback system for printed circuit board process
CN101431855A (en) * 2007-11-08 2009-05-13 英业达股份有限公司 Circuit board with identification code and its production method
TW201039703A (en) * 2009-04-16 2010-11-01 Unimicron Technology Corp Quality control and inspection process flow for printed circuit board manufacturing
TW201240541A (en) * 2011-03-21 2012-10-01 D Tek Technology Co Ltd Picking-up and placing method with integrated PCB information

Also Published As

Publication number Publication date
TW202218495A (en) 2022-05-01

Similar Documents

Publication Publication Date Title
US11132786B2 (en) Board defect filtering method based on defect list and circuit layout image and device thereof and computer-readable recording medium
Deng et al. Building an automatic defect verification system using deep neural network for pcb defect classification
JP4155496B2 (en) Classification support device, classification device, and program
CN111080622A (en) Neural network training method, workpiece surface defect classification and detection method and device
CN112053318A (en) Two-dimensional PCB defect real-time automatic detection and classification device based on deep learning
CN110264445A (en) The screen printing of battery quality determining method of piecemeal template matching combining form processing
TWI618940B (en) Device and method for detecting blind hole of printed circuit board
CN116337868B (en) Surface defect detection method and detection system
CN108694265B (en) Intelligent pre-diagnosis system and method for failure risk of design layout
CN116993744B (en) Weld defect detection method based on threshold segmentation
JP2023122140A (en) Teacher data generation device, teacher data generation method, and program
CN113111903A (en) Intelligent production line monitoring system and monitoring method
Chang et al. An implementation of health prediction in SMT solder joint via machine learning
JP2002031606A (en) Apparatus and method for evaluating quality, apparatus and method for displaying quality, and quality evaluation system
CN110967851A (en) Circuit extraction method and system for array image of liquid crystal panel
TWI745131B (en) Printed circuit board yield rate and production equipment error rate backtracking method and system thereof
CN112702905B (en) Method and system for tracing yield and error rate of printed circuit board
CN116310424B (en) Equipment quality assessment method, device, terminal and medium based on image recognition
TWM607663U (en) Printed circuit board yield rate and production equipment error rate backtracking system
CN116958052A (en) Printed circuit board defect detection method based on YOLO and attention mechanism
CN112964723B (en) Visual detection method and system for double-sided multi-target equidistant array
TWM619409U (en) Intelligent processing system
JP5672918B2 (en) Continuous part inspection method, continuous part inspection program, and continuous part inspection apparatus
JP2002031605A (en) Defect-confirming apparatus and automatic visual inspection apparatus
KR100472776B1 (en) Reviewing method of wafer defect