TW201240541A - Picking-up and placing method with integrated PCB information - Google Patents

Picking-up and placing method with integrated PCB information Download PDF

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TW201240541A
TW201240541A TW100109601A TW100109601A TW201240541A TW 201240541 A TW201240541 A TW 201240541A TW 100109601 A TW100109601 A TW 100109601A TW 100109601 A TW100109601 A TW 100109601A TW 201240541 A TW201240541 A TW 201240541A
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Taiwan
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board
information
circuit board
boards
sub
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TW100109601A
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Chinese (zh)
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TWI400020B (en
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Yao-Chi Fei
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D Tek Technology Co Ltd
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Abstract

A picking-up and placing method with integrated PCB information includes the following steps: Step 1 is providing PCBs. Each PCB has printed bar code thereon for storing PCB ID. Step 2 is providing an inspecting apparatus having a bar code reader and an image capture device. The image capture device is used for detecting the bad mark on the sub-boards and then outputting sub-board information. The inspecting apparatus can be used to integrate and then output the sub-board information and the PCB ID as integrated PCB information. Step 3: a pick-up and place apparatus is used to pick-up and place the device on the PCBs according to the integrated PCB information.

Description

201240541 六、發明說明: 置件方法,尤指一種整合電路板 【發明所屬之技術領域】 本發明係有關於一 資訊之置件方法。 【先前技術】 •4知的電路板係為一種201240541 VI. Description of the invention: A method of placing a component, in particular, an integrated circuit board. [Technical Field of the Invention] The present invention relates to a method of placing information. [Prior Art] • 4 known circuit boards are a kind

统中6積的板,例如電腦系 冼中的主機板’但隨著電子裝置如pD 機的體積越來越小,電Μ“钱次數位相 〇 电路餘的體積也跟著縮小。而為 產的效率的考量,業者將多數個小型電路板(又稱 為子板)合併成—片大型電路板(又稱為多聯^) 3 = 賣量產製程的進行。但由於生產的過程中該等小型 =可能會由於電路板生產上的變異而造成不符合規 :bd j上述列為不良品的子板就會將不良品標記 ㈤贿k)標註於該些子板上或板邊相對應的特定位 ’以使後_取置製程能依據檢知以取得 後,避開上述不良的子妬,丨v、拽Λ wThe 6-segment board of the system, such as the motherboard in the computer system, but with the smaller and smaller size of electronic devices such as pD machines, the volume of the power circuit is reduced. For efficiency considerations, the industry combines most small boards (also known as daughter boards) into large-scale boards (also known as multiple boards). 3 = Selling mass production processes. But due to the production process, Small = may cause non-compliance due to variations in board production: bd j The above-mentioned sub-boards listed as defective products will mark the defective product (5) bribes on the sub-boards or the corresponding sides of the boards. The specific bit 'so that the post-taking process can be obtained according to the detection, avoiding the above-mentioned bad sub-妒, 丨v, 拽Λ w

舜曰、壯, 板以避免將元件(電阻電容1C 伋日日...)1设於該些不良子板上。 料m 板’亚利用移動式攝影 ::進―(flduclalmark)的定位,再利用上述該攝 ^機進行不良品標記的分析檢知作t或是定位標乾 1⑽丨fiducia丨耐k)的辨識檢測作業。換句話說,傳 、、=取置機是利用同-具攝影機搭配χγ滑台(χγ 進行標靶與不良子板標記的分# S ; Λ ‘ 〕刀析及檢知,且該攝影機必 、依罪ΧΥ載口的硬祖動作以進行移動來逐一擷取多聯 4/20 201240541 板中的每一子板上晏 的資訊,接著才開 ::“己唬’進行檢知不良子板 件步驟,換言之,傳;述的檢知資訊進行後續的置 置件作業必須等待檢知作 牛作業:相互關連的, 進行置件。 μ 爰方施依據檢知結果 故,傳統取置機利用硬體 不良子板的程序作聿,對於牌把:f式進仃上述之檢知 勢必合子;聯板數越來越多的情況下, 曰1置件機台的生產時間大幅增加。 以目m的取置機來說,該攝影 像擷取的時間大約_ 〇3秒、 子板的影 μ取⑽的多聯板之檢知整體^T I含有_個 含攝影機的移動1為扣秒(包 了間為4秒,再加上置件時間為40秒(二、=知 放4個元件、每-元件置放時間為。丨::二片子板置 子板均為良品時,置件時間的計算為_ “】⑽片 X0.1秒/個=40秒),是故取置機因檢 X4個心牛 的工時百分比為:30/(4+3〇 = 子板不良所浪費 生產效率大大的降低。 .,而使得產線的 一括^方面,中華民國專利公開號:她丨咖括山 一種夕聯板之標記的檢知方 柃出 置先進行電路板上之不良品桿纪的二利用獨立的檢知裝 種類眾多,故生產線上串:=置件的 有可能因特別因素有人為取 的電路板m造絲置錄得不 ,、生產中 的檢知資訊,導致取置機進行錯誤的置件作:標記 5/20 201240541 【發明内容】 本發明之目的之_, 置件方法,以達到減少^ ;糾—㈣合電路板資訊之 本發明實ί二甚/於種?八發生置件錯誤的目的。 法,包含以下步驟:〃正&電路板資訊之置件方 (!)提供多個電路板,該此 子板所組成之多聯板,其中每一種由多個 存電路板初始資訊之資料儲存媒體;板上/、有-用於儲 少路板送進-檢知單元,該檢知單元至 胃取該貧_存媒體之讀«置及-用於 才欢知母一該電路板上的每一' 兮己之产^ ^ °亥子板上疋否有不良子板標 。己之k知裝置’其中該檢知裝置係獲取—不良 該檢知單元將該讀取裳置 、。 檢電路板减資訊與該 、置斤k知的不良子板資訊整合為一對應每一該 路板之電路板置件資訊’並輸出該電路板置件資气 (3)提供至少—元件著錢卜並將檢知後的該此 電路板送進該元件著裝機台’該元件著裝機台係根據該電 路板置件資訊,而在屬於良品的該子板上進行—置件步 驟。 本發明具有以下有益的效果:本發明主要將檢知所得 的不良子板資訊與電路板上所記載的電路板生產編號等 初始資訊加以整合,使不良子板資訊與電路板初始資訊具 有相互對應的效果,故當進行置件時,元件著裝機台可依 據每一電路板的ID編號抓取對應的不良子板資訊,大幅 6/20 201240541 降低錯置件的風險。 為使能更進-步瞭解本發明之特徵 閱以下有關本發明之詳細說明内a巧茶 供參考鱼 兄心、附《,然而所附圖式僅提 …兄明用亚非用來對本發明加以限制者。 【實施方式】 本發明提出一種整合電路板 用資料儲存媒體的方式將板絲ίη之置件方法’其係利 ^ # , 材iD、編號、製造廠商資料笪 故=知所得之不良子板資訊與前述資料整 取正確:不置件作業可依據板材ID等資料抓 請先參考圖錯誤置件的機率。 2 =數個子板3〇1所組成之多聯板,; ”而,—定的判別步驟後便會被區分為良:及二 口口,而屬於不良品的子板3 〇1就會以 二 的方式標示之;另外,電路板更呈Ϊ 一用 (*-㈣存=體仏如二維條碼 製造礙商履歷資料等等内容。中載有板材1〇"、編號、 請配合圖1,本發明之檢 即能快速的檢知上述的1 ◦編波置1 1 板資訊;另-方面,檢知:二己31以獲得不良子 2,例如% ¥早;°1 0更可設有讀取裝置1 電路板初始資訊;該檢二每二路板3 ◦的 路板初始資訊整合為—電^可知不良子板資訊與電 板置件資訊,使後續的元件著 7/20 201240541 製機台2 〇可以根據每—電路 + 抓取相對應的電路板置件資訊,即可針對】::初始資訊 3 0丄進行置件’即元件著裝機台 攄^的子板 板置件資訊進行置件,而不會將 電路 〇 1上,進而達成節省材心“置於不良的子板3 到有效率的_何者為不良二板=本Γ:即:達 :的:板3〇1,並將資訊傳遞給後方了 0 ’卽省了傳統取置機利用硬體機構進行移動 子板所浪費的時間’且元件著裝機台20更可: 不良子板資訊。板置件貧訊,以避免使用錯誤的 凊復茶考圖1,在本具體實施例中,檢知裳置1 1可 f 一影㈣取裝置’其具有—财解析度及-預定放# 率且在-預定工作距離(WGrking⑽⑽,wd)下_ 該電路板30之影像。本實施例主要係利用較大視野的影 像擷取裝置配合相對應的預定卫作距離的條件進行電路 板3 0全影像或部分影像之操取工作。具體而言,本發明 所提出之影像擷取裝置之影像解析度(image以㈤此⑽) 可為1.6k 1.2k晝素(pixel),搭配鏡頭所形成的空間解析 度(Spatial Resolution)可為〇」至〇 3公厘/晝素 (mm/piXe1)’而工作距離WD可為200至700公厘(二)、; s 又例如該影像擷取裝置也可為大型的線性掃目苗器,其工作 距離可在20S 300公厘(職)的條件下操取電路板3 〇 的影像。再者,在本具體實施例中,檢知單元i 〇更進— 步包括複數個發光裝置,以提供影像操取裝置最佳的照明 8/20 201240541 =檢為發"體或是曰光燈管等。而 谨曾》处x 11所擷取之影像可利用檢知單元;[〇的 體:運用料置13進行影像分析(如影像分析、辨識軟 ;:用),以辨識出子板3〇1上是否有不良子板標記 .之置顯示本發明所提出的整合電路板資訊 .的元例,其中檢知單…係搭配單- . j驟Sl0丨:提供多個電路板3〇,如圖2所示,電路 可為8個子板3 〇丄所組成 個:r01中屬於不良品的子板二設= :(badmark) 31。而在步驟-之前,包括一二 射細貼附的方法將該不良子板標: 定位f F : 的子板3 〇 1或板邊相對應的特 1呈有—二=續製程之進行’其中該不良子板標記3 1/、有-預疋尺寸’例如〗xl(mm2)或4x4(mm: 良子板標記31的主要特徵需具有高度的。 差二以利衫像分析的準確度;另—方面,該標 .(本實施例係以二維條碼進行說明) .以記錄每片電路板3〇的板材山 '"+、,扁號、衣xe廠商履歷資料等等。值得說 ^ 發明並不限定資賴存媒體3 2的提供來源,例如疋^ 板生產端可在生產完成後直接將上述板二 : 儲存媒賴’或是由工廠端自行將板材 = 資料儲存媒體32,換言之,電路板3〇上所使 9/20 201240541 儲存媒體、所載入的資料、載入來源等均屬於本發明之範 疇。 步驟S103 SIU5·將電路板3 ϋ依序地或者任 ,一 W , 一 I丄 /¾. >·〇 進前述之檢知單元1 ◦,如同前述,檢知單元1 〇具有檢 知裝置1 1及讀取裝置1 2,讀取裝置丄2於以讀取每一 電路板3 0的電路板初始資訊(S103),檢知裝置丄工用 於檢知子板3 0 1上的不良子板標記3 i以獲得不良子 板資訊;且檢知單元1〇可將讀取裝置12所讀取之電路 板初始資,與檢知裝置11所檢知的不良子板資訊整合 為-對應每-電路板3 〇之電路板置件資訊,並輸出該電 資訊(S1〇5)。而由於本步驟中主要使用影像分 析幸人肢寺進行影像分析,故此一檢知步驟所花費的時間甚 秒f小於一秒,且資料的整合亦由運算及儲存裝 進仃貝料處理,故整體步驟的花費時間相當短。 :該些子板3 〇 i更可以是軟板,由於 更’軟板的偏移量就必須 —叫根據定位標把的位置=位定 板置件資訊中,而二並將其整合錯存於電路 置件資訊衣*'D 2 〇則可以根據電路板 置件的步驟,其可大先大 具體實施财,所―之電路板置件 10/20 201240541 資訊係直接儲存於檢知單元^ 3,以利後續作業的^件著裝機^運#及儲存裝置1 圖1所示)。而在另-具體實施;;中〇 =資料抓取(如 件資訊係儲存於一外部資料饽浐dd 斤輛出之電路板置 庫、雲端伺服器或是載入於光碟〇,如遠端資料 或透過公司Shop-flow等資1么 本么者存媒體(如圖]A ) 步驟Sm〜si09:提供。二進,以抓取資料。 知後的電路板3 〇依序地或任音^者凌機台2 〇,並將檢 0,元件著裝機台2 〇係抓取對件著裝機台2 置件資訊(S丨07),並根擄該 '、兒*反3 0之電路板 良品的子板3 0 i上進行—置:牛板且件資訊,而在屬於 裝機台2 0可為S叫程中,“力驟(_);而元件著 片取置機或晶線打線機,如die::’或封裝製程中之晶 其他可用以進行晶片取置或線路^",或_ b〇ndei·等 應用在BGA的封也妾的機台或設備(例如 料產品)= =2,MicR0-SD、DDRI1、 取裝置2 1,以P “ ^台2 〇更可具有一輔助讀 取= = =送進元件著裝機台2◦前讀 詳細說明甩路板初始貧訊,此部分將於後-實施例 .異:另外’此步驟會根據前述不同的實施例而有以下差 〇中如圖^不,當電路板置件資訊係儲存於檢知單元1 儲裝機台2 0係連接於檢知單元1 0 ’以抓取 件步驟Γ、口早兀10之電路板置件資訊而進行所述的置 11/20 ^U1240541 啤所示,雷夂 儲存單元4 〇中,-从板置件負訊係儲存於外部資料 存早704 0,例如任何有線傕於 4接於外部資料儲 方法,以抓取儲存γΛ _專輸、無線傳輸或光碟載入等 貧訊而進行所述的置件步驟。子早…之電路板置件 含耷 之置件;法本發明所提出的整合電路板資訊 的元件著裝機台2 Γ二::中:t單元1 〇係搭配二台 元件著裝機” π 、仃兩階段的置件作業,且每一 施例的步IS更可具有-輔助讀取裝置2 1,第二實 乂 “ S201 :提供多個電 S]〇l,故不再贅述。 板3 〇。此步驟同於前述 ^咖〜·•將電路板3〇 刖述之檢知單元2 〇,拾 次任思地迗進 讀取之電路板初始資訊(s二檢匕: 不良子板資訊(S205)整合為對 :f 11所仏知的 板置件資訊,並加以輸出(_二==;電路 貧訊可直接儲存於檢知單元 私反置件 3,或是儲存於資料庫、絲健存媒的及健存裝置1 ^ _ 存媒肢·寺外部資料儲存單 凡40 〜⑽可概括為-檢知步驟。 下一步驟係為提供多個元件著褒機台2 〇,並將檢知 後的電路板3 0依序地或任意地送進該些元件著裝機台 2 0 ’ το件者裝機台2 〇係根據該電路板置件資訊,而舜曰, Zhuang, board to avoid setting the component (resistance capacitor 1C 汲 day...) 1 on these bad daughter boards. Material m board 'Asia uses mobile photography::Follow- (flduclalmark) positioning, and then use the above-mentioned camera to analyze the defect mark for t or locate the target 1(10)丨fiducia丨k) Test the job. In other words, the transmission, the = pick-up machine is the same camera with the χ 滑 sliding table (χ γ for the target and the bad sub-board mark # S ; Λ ' ] knife analysis and detection, and the camera must According to the sinful ancestor's hard ancestor action to move one by one to capture the information on each of the 4/20 201240541 boards, and then open: "" 唬" to detect bad sub-boards Steps, in other words, transmission; the description of the information for subsequent placement operations must wait for the detection of the cattle operation: related to each other, to carry out the placement. μ 爰 施 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据 依据The procedure of the bad sub-board is ambiguous. For the card: f-type, the above-mentioned detection is bound to be zygomatic; in the case of more and more boards, the production time of the 曰1 set-up machine is greatly increased. In the case of the pick-up machine, the time taken by the photographing image is about _ 〇 3 seconds, and the detection of the multi-plate of the sub-board is taken (10). The whole ^TI contains _ a movement containing the camera 1 as a deduction. The interval is 4 seconds, plus the set time is 40 seconds (two, = know to put 4 components, each - component set The time is. 丨:: When the two-piece sub-boards are good, the calculation of the placement time is _ "] (10) X0.1 seconds / one = 40 seconds), so the machine is checked for X4 cattle. The percentage of working hours is: 30/(4+3〇=The production efficiency of the sub-board is greatly reduced.), and the production line is included in the aspect of the product, the Republic of China Patent Publication No.: The detection of the mark of the board is first used to carry out the defective product on the circuit board. The use of the independent inspection equipment is numerous, so the series of the production line: = the part of the circuit that may be taken by special factors The board m is not recorded, and the detection information in the production leads to the wrong setting of the pick-up machine: mark 5/20 201240541 [Summary of the Invention] The object of the present invention, the method of setting, to achieve Reduce the ^; correct - (four) the board information of the present invention ί 甚 于 于 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八 八a plurality of circuit boards, the plurality of boards of the sub-boards, each of which is composed of a plurality of memory boards Information storage medium of the initial information; on-board/,--for the storage of the road board to feed-detection unit, the detection unit to the stomach to take the poor_storage media reading «set and - used to know the mother There is a defective sub-board on each of the board's production boards. The k-knowledge device 'where the detection device is acquired—the bad detection unit reads the reading Slip, check the board to reduce the information and the bad sub-board information of the squad, and integrate it into a circuit board information of each of the boards' and output the board's equipment (3) At least - the component is loaded with the chip and the detected circuit board is fed into the component dressing machine. The component dressing machine performs the setting on the sub-board which belongs to the good according to the circuit board component information. Steps. The invention has the following beneficial effects: the invention mainly integrates the obtained bad sub-board information with the initial information such as the circuit board production number recorded on the circuit board, so that the bad sub-board information and the initial information of the circuit board have mutual correspondence. The effect, so when the device is placed, the component dressing machine can capture the corresponding bad sub-board information according to the ID number of each circuit board, and greatly reduce the risk of misplaced parts by 6/20 201240541. In order to enable a more advanced understanding of the features of the present invention, reference is made to the detailed description of the present invention in the following description of the present invention, which is incorporated herein by reference. Limit the person. [Embodiment] The present invention provides a method for integrating a data storage medium for a circuit board, and a method for placing a wire ί ' 其 其 ^ , , , , , , , , , , , , , , , = = = = = = The above information is correct and correct: the operation of the non-piece can be based on the information such as the plate ID, please refer to the probability of incorrectly placing the piece. 2 = multiple boards of several sub-boards 3〇1;; and, - the discriminating step will be divided into good: and two mouths, and the sub-board 3 〇1 belonging to the defective product will In addition, the circuit board is more Ϊ ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 1. The inspection of the present invention can quickly detect the above 1 ◦ 波 置 1 1 1 板 information; another aspect, detect: two hex 31 to obtain a bad child 2, such as % ¥ early; °1 0 can The initial information of the circuit board of the reading device 1 is provided; the initial information of the road board of the 2nd board of the second board is integrated into the information of the bad board and the information of the board, so that the subsequent components are 7/20. 201240541 Machine 2 can pick up the corresponding board information according to each circuit +, and can be used for the ":: initial information 3 0 置", that is, the component board 摅 ^ Piece of information is placed on the device, and the circuit is not smashed, so as to achieve material savings "putting the bad daughter board 3 to the efficient _ For the bad two boards = this Γ: that is: up: the board 3 〇 1, and pass the information to the rear 0 ' 卽 save the time that the traditional pick-up machine uses the hardware mechanism to move the daughter board is wasted' and the components The dressing machine 20 can also: bad board information. The board is poor, to avoid the use of the wrong tea. Figure 1, in this embodiment, the detection of the skirt 1 1 can f a shadow (four) take the device 'It has a financial resolution and a predetermined release rate and at a predetermined working distance (WGrking (10) (10), wd) _ the image of the circuit board 30. This embodiment mainly uses a larger field of view image capturing device to cooperate with the corresponding image The condition of the predetermined guard distance is to perform the operation of the full or partial image of the circuit board. Specifically, the image resolution of the image capturing device proposed by the present invention (image (5) (10) can be 1.6k 1.2k pixel (pixel), the spatial resolution formed by the lens can be 〇" to 公3 mm/昼(mm/piXe1)' and the working distance WD can be 200 to 700 mm ( 2), s, for example, the image capturing device can also be a large linear sweeping device The working distance can be an image of the circuit board 3 20 under the condition of 20S 300 mm. Further, in the specific embodiment, the detecting unit i further includes a plurality of illuminating devices to Provides the best illumination for the image manipulation device 8/20 201240541 = check for "body" or twilight tube, etc. and the image captured by x11" can use the detection unit; : Use the material 13 to perform image analysis (such as image analysis, identification soft;: use) to identify whether there is a bad sub-board mark on the sub-board 3〇1. The display shows the integrated circuit board information proposed by the present invention. The meta-example, in which the check list is ... with the single-. j step Sl0丨: provide multiple boards 3〇, as shown in Figure 2, the circuit can be composed of 8 sub-boards 3 :: r01 is a defective product The subboard 2 is set to = :(badmark) 31. Before the step--, including a two-shot fine attach method, the bad sub-board is marked: the sub-board 3 〇1 of the positioning f F : or the corresponding 1 of the board edge is present - two = continuous process progress' Wherein the bad sub-board mark 3 1 /, the -pre-size [e.g.] xl (mm2) or 4x4 (mm: the main features of the good board mark 31 need to have a height. The difference is the accuracy of the shirt image analysis; On the other hand, the standard. (This embodiment is described by a two-dimensional bar code). It is necessary to record the history of the plate mountain '"+, squad, and xe of each board. ^ The invention does not limit the source of the supply of the media 3, for example, the production side of the board can directly put the above board 2: the storage medium or the factory side to the board = data storage medium 32, In other words, the 9/20 201240541 storage medium, the loaded data, the loading source, etc. on the circuit board 3 are all within the scope of the present invention. Step S103 SIU5·Sequencing the board 3 or sequentially, one W , I丄/3⁄4. >·Into the aforementioned detection unit 1 ◦, as described above, the detection unit 1 The detecting device 1 1 and the reading device 1 2 are configured to read the board initial information of each circuit board 30 (S103), and the detecting device is completed for detecting the daughter board 30. The bad sub-board mark 3 i on 1 obtains bad sub-board information; and the detecting unit 1 〇 can scan the initial board of the board read by the reading device 12 and the bad sub-board information detected by the detecting device 11 Integrated into - corresponding to the board information of each board 3, and output the electrical information (S1 〇 5). Since this step mainly uses image analysis, the image analysis of the sacred temple, so the detection step The time spent is very small, f is less than one second, and the integration of the data is also processed and stored in the processing of the bait material, so the overall steps take a relatively short time. The sub-boards 3 〇i can be soft boards, due to More 'soft plate offset' must be called - according to the position of the positioning target = bit plate setting information, and the second and its integration is stored in the circuit device information clothing * 'D 2 〇 can be based on the circuit The step of board-setting, which can be implemented in a large amount 10/20 201240541 Information is stored directly in the detection unit ^ 3, in order to facilitate the subsequent operation of the equipment loading machine ^ transport # and storage device 1 shown in Figure 1). In the other-specific implementation;; in the middle = data capture (such as information is stored in an external data 饽浐 dd kg out of the board storage, cloud server or loaded on the CD, such as the remote Information or through the company's Shop-flow and other resources to save the media (as shown in Figure A) Step Sm ~ si09: provide. Second, to grab the data. Know the circuit board 3 〇 sequentially or any tone ^者凌机台2 〇, and will check 0, component loading machine 2 抓 抓 grab the corresponding dressing machine 2 set information (S丨07), and root the circuit of the ', children * anti 3 0 The board of the board is carried out on the board 3 0 i - set: the board and the piece of information, and in the case of the installed machine 20 can be called S, "force (_); and the component takes the film or crystal line Wire-punching machines, such as die::' or other crystals in the packaging process, can be used for wafer fetching or wiring ^", or _ b〇ndei· applications such as granules or equipment (such as material products) ) = = 2, MicR0-SD, DDRI1, take device 2 1, to P "^ station 2 〇 can have an auxiliary reading = = = into the component dressing machine 2 ◦ read before the detailed description of the initial poor board News, this The part will be post-example. Different: In addition, this step will have the following differences according to the different embodiments described above. When the board information is stored in the detection unit 1 storage machine 2 0 Connected to the detecting unit 10' to perform the above-mentioned setting 11/20 ^U1240541 with the information of the board member of the grabbing step Γ and the mouth 兀 10, the Thunder storage unit 4 ,, - The slave device is stored in the external data store 704 0, for example, any cable is connected to the external data storage method to capture the γ Λ _ dedicated transmission, wireless transmission or CD loading and other information. The step of the description of the device. The circuit board of the child is equipped with a device; the device for integrating the information of the board proposed by the present invention is 2: 2:: medium: t unit 1 The component mounting machine has two stages of π and 置, and the step IS of each embodiment can have an auxiliary reading device 2 1, and the second embodiment "S201: providing a plurality of electric S] 〇l, No more details. Board 3 〇. This step is the same as the above-mentioned ^ca~·• The detection unit 2 described in the circuit board 3, The second time I thought about the initial information of the board reading (s2 check: bad board information (S205) integrated into the information of the board information that is known to f: 11 and output (_二==; Circuit poor information can be stored directly in the detection unit private counter 3, or stored in the database, silk storage media and health device 1 ^ _ memory media limbs external data storage list 40 ~ (10) can be summarized The step is to detect the step. The next step is to provide a plurality of components to the machine 2 〇, and the detected circuit board 30 is sequentially or arbitrarily fed into the component mounting machines 2 0 ' το. The installer 2 is based on the board's device information, and

S 屬於良品的子板301上進行一置件步驟。在本具體實施 例中,係以兩台元件著裝機台2◦進行說明但不以此為 12/20 201240541 限,弟^ —台元件者裝機a 9 (Ί > a t & , (S2()9〜s71” 。2 ο係貝責弟一階段的置件作業 、,、 _ 〇虽檢知後的該些電路板3 〇的其中之一 7進苐一台元件著裝機台2 〇時’先利用輔助讀取裝置2 1讀取電路板30之眘蚪伴左甜粞 、 乙 榻存媒體,以取得電路板3 〇的 可招攄: 件著裝機台20即 :根板初始賢訊由檢知單元10或外部資料儲存 ,疋4 ◦/取對應的電路板置件資訊(S211),使第一 。π件者裝機台2 0可依據正確的電路 :良子板資訊進行第-階段置件作業⑸η),:二: :一階段置件的電路板3〇送進第二台元件細;:; 〇時,同樣先利用輔助讀取梦 者衣板σ 2 Μ健六财μ Ρ'取衣置2 1讀取電路板3 0之資 料错存媒肢,以取得雷&彳 、 (s)m,而笛ζ/ 的電路板初始資訊 (-))而弟二台元件著裝機台 始資訊由檢知單元i ◦或外部資料儲存單== 對應的電路板置件資訊(S2H),使第二^ , 2 0可依據正確的電路祐 1 — σ凡件著裝機台 行第二階段置件作業(S2 良子板貝讯進 S219 A班、 ,在此貫施例中,而S209〜 >219可概括為—置件步驟。 因此,本發明利用元件著裝機台2 先取得電路板3 〇的雷路也^進仃置件之則, 2 0可根據正確刀σ貝矾,以使元件著裝機台 u m據正確的電路板置件資訊 例為例,假設有編號為A、B、c 件。以上逃貫施 入檢知單元i —塊电路板3 0依序進 早几丄U進仃檢知後產生相對應於 電路板3 0之電路;^ € | -h ‘〜、、B、C二塊 裝機台20完^件貧訊,再依序通過第一台元件著 4弟—階段置件«,若此時操作者因生產 13/20 201240541 製造問題或設備機台原因將編號電路板3 〇由 上取下,使其不繼續進行第二台元件著裝機台2〇的= 作業’而編號A、C之電路板3 〇則持續通過第二二 著裝機台2 〇的置件作業。當編號c之電路板3 〇 = -口兀件著裝機台2 0時’第二台元件著裝機 2m:可讀取編號C之電路板30的資料儲: 二:3=亚根據編號c之電路板3 ◦的電路板初始資訊 ^相對應於編號C之電路板3 (^路板置件資訊 會誤取對應於編號6之電路板3 0電路板置件資訊,換丄 :電:始資訊與不良子板資訊整合為對應; 〇抓取不正確的不良子板資訊,使元;= =件效率。另外,前述編號為A、B、c2電: ^3 0亦可任意地被傳送進人檢知單^㈣行檢知 產生=:A、B、C三塊電路板3〇之電路板置件資 ^再依序地或任意地通過第—台元件著 第 台2〇,而第-台元件著她2 = ;==^2()可彻每1路板3()之電路板 罝件貝汛抓取正確的不良子板資訊。 =實際的數據分析,本發明可有效提高 模組為例,電路板30上具有則固』 420 5 55440A placement step is performed on the daughter board 301 which is a good product. In the present embodiment, the two components are mounted on the machine 2 但, but this is not limited to 12/20 201240541, and the device is installed a 9 (Ί > at & , (S2( ) 9~s71". 2 ο 贝 责 责 责 责 责 一 一 一 一 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责 责'Before using the auxiliary reading device 2 1 to read the circuit board 30, please contact the left sweet and the rest of the media to obtain the circuit board 3 可: The dressing machine 20: the root board initial intelligence The detection unit 10 or the external data storage, 疋4 ◦ / take the corresponding circuit board device information (S211), so that the first π-piece installed machine 20 can be based on the correct circuit: good child board information for the first stage Placement operation (5) η), : 2: : The board of the first stage is sent to the second component; 3; When 〇, the same is used to read the dreamer's board σ 2 Μ健六财μ Ρ 'Take clothes 2 1 read the circuit board 30 data misplaced media to obtain Ray & 彳, (s) m, and the flute / board initial information (-)) and the two components Installed The information from the detection unit i or the external data storage list == corresponding board information (S2H), so that the second ^, 2 0 can be based on the correct circuit 1 - σ 凡 凡 装The stage placement operation (S2 良子板贝进进S219A班, in this embodiment, and S209~>219 can be summarized as a - placing step. Therefore, the present invention utilizes the component dressing machine 2 to obtain the circuit first. The slab of the slab 3 is also inserted into the 仃 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , B, c. The above escaping into the detection unit i - the block circuit board 3 0 in the order of a few 丄 U into the 仃 detection to generate a circuit corresponding to the circuit board 30; ^ € | -h '~ , B, C two sets of machine 20 finished ^ poor news, and then through the first component of the 4th brother - stage parts «, if the operator at this time due to the production of 13/20 201240541 manufacturing problems or equipment machine The reason is to remove the numbered circuit board 3 〇 from the top so that it does not continue the second component dressing machine 2 〇 = operation ' and the number A, C electric The plate 3 持续 continues to pass the second two dressing machine 2 置. When the circuit board number 3 〇 = - 兀 着 着 着 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 No. C of the circuit board 30 data storage: Two: 3 = ya according to the number c of the circuit board 3 ◦ the board initial information ^ corresponding to the number C of the circuit board 3 (^ road board information will be mistakenly corresponding to No. 6 circuit board 3 0 circuit board parts information, change: electricity: the initial information and bad sub-board information integrated into the corresponding; 〇 grab the incorrect bad sub-board information, make the yuan; = = piece efficiency. In addition, the foregoing numbers are A, B, and c2: ^3 0 can also be arbitrarily transmitted into the human inspection unit ^ (4) line detection to generate =: A, B, C three circuit boards 3 〇 circuit board components The ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ Bessie grabs the correct bad daughter board information. = Actual data analysis, the present invention can effectively improve the module as an example, and the circuit board 30 has a solid state 420 5 55440

S 〇〇片/天,提升約25%的產能;而以SD卡 為列,電路板3Q上具有21G個區域(amy),丘需進行 置的置件,產能可由304204片/天提升至4胸 14/20 201240541 片/天,提升約42%的產能。 另方面’本發明亦可用 裝機台20進行元件的置件後;例如在元件著 不合於製程規格的子板3 〇 w 查,並在 可重新回到檢知單元i ^^己而该電路板30 製程規格的子板3 0 1位置:二:板麟:述不合於 多次置件〜檢知AA以、电路板貧訊中,而重複 有各個子板3 不.、步驟之後,電路板資訊中即載 息,並依二==置件過程中是否正確的訊 即可利二:ΓΓ色進行辨別,故於切割後,使用者 J用不问顏色來分類所製作的產品。 綜上所述,本發明至少具有以下優點. 分別L、行立運作的檢知單元與元件著裝機台 知作業與置件作業’故在應用上,檢 僂 ^不相互干涉(亦即兩者可同時作業), 置件=著裝機台必須先進行不良品檢知再進行 置件所造成的閒置時間過長的問題。 《丁 性 如次兮本^明更將不良子板資訊與電路板生產編號等初 —二二加以整合’使不良子板資訊與電路板初始資訊具有 一带的放果,故當製造生產時,元件著裝機台可依據每 :路板的ID編號抓取對應的不良子板資訊,大幅降低 的錯誤。故在應用上,子板可任意、依序或依照不同 Ά進榀知單元或元件著裝機台,更可提高產線的彈 本电明亦可應用於封裝產線,電路板經過每一道 15/20 201240541 » * 封裝製程後,可重新回到檢知 一道萝裎徭的4吝丁Λ 早進订知知分析,並將每 迢衣耘後的生產不良情況 于母 品完成日夺,系統即可有效的統叶每^反制貝財,故在產 外,亦可依據雷踗祐次^ I 逼衣程的良率;另 7Γ J依據电路板資訊中所記錄 現的不良品以顏色等編碼—,使 切割後的產品進行分類。 使紅作貝可有效地將 4、產線合併,減少機台數量。 減/人力.製程簡化使人工自铁減少。 6、減少電費、維修費等間接成本之效果。 本發明之專二明之較佳可行實施例,非因此飼限 所:之SI 舉凡運用本發明說明書及圖示内容 為之寺效技術變化,均包含於本發明之範圍内。 【圖式簡單說明】 ^係顯示本發明檢知單元與元件著裝機台直接連接的示 二儲存本1明檢知單元與元件著裝機台透過外部資 ^早兀進仃連接的示意圖。 顯示本發明之電路板的示意圖。 圖。顯示進行本發明之置件方法的第-實施例的流程 圖。員不進行本發明之置件方法的第二實施例的流程 【主要S 〇〇 / / day, increase the production capacity by about 25%; and with SD card as the column, the circuit board 3Q has 21G area (amy), the hills need to be placed, the capacity can be increased from 304204 pieces / day to 4 Chest 14/20 201240541 pieces / day, an increase of about 42% of production capacity. In another aspect, the present invention can also use the mounting machine 20 to perform component mounting; for example, the component is not in accordance with the process specification of the daughter board 3 〇w, and can be returned to the detecting unit i ^ ^ and the circuit board 30 process specification sub-board 3 0 1 position: two: board Lin: said not to multiple times ~ detect AA, circuit board poor news, and repeat each sub-board 3 no., after the step, the board In the information, the information is carried, and according to the second == whether the correct message in the process of the process can be used to distinguish the two: the color is identified, so after the cutting, the user J does not ask the color to classify the manufactured product. In summary, the present invention has at least the following advantages: L, the operation of the detection unit and the component dressing machine to understand the operation and the placement operation, so in the application, the inspection does not interfere with each other (ie, both It can work at the same time), the setting = the problem that the dressing machine must first check the defective product and then leave the device for too long. "Ding sex such as 兮 ^ ^ ^ Ming will be bad sub-board information and circuit board production number and other initial - two two integration" so that the bad sub-board information and board initial information has a set of results, so when manufacturing production, components The installed machine can capture the corresponding bad sub-board information according to the ID number of each: the board, and greatly reduce the error. Therefore, in the application, the daughter board can be arbitrarily, sequentially or according to different types of components or components, and the machine can also be used to improve the production line. The board can also be applied to the packaging line. /20 201240541 » * After the packaging process, you can go back to the 4 吝 检 检 检 Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ Λ It can be effective to control the leaves of each leaf, so in the production, it can also be based on the rate of the thundering machine ^ I to force the clothing process; another 7 Γ J according to the circuit board information recorded in the current defective products in color, etc. Encoding—Classifies the cut product. Make red can effectively combine 4, production line, reduce the number of machines. Reduction / manpower. Process simplification reduces artificial iron. 6. Reduce the effect of indirect costs such as electricity and maintenance costs. The preferred embodiments of the present invention are not intended to be limited to the scope of the present invention, and the use of the specification and the illustrated contents of the present invention is included in the scope of the present invention. [Simple description of the drawing] ^ shows a schematic diagram in which the detecting unit of the present invention and the component mounting machine are directly connected. The storage unit 1 and the component mounting machine are connected to each other through an external device. A schematic diagram of a circuit board of the present invention is shown. Figure. A flow chart showing the first embodiment of the method for carrying out the present invention. The flow of the second embodiment of the method of the present invention is not carried out.

S 元件符號說明 16/20 201240541 1〇 檢知單元 11 檢知裝置 12 讀取裝置 13 運算及儲存裝置 2 0 元件著裝機台 2 1 氣體流量單元 3 0 電路板 3 3 1 不良子板標記 3 2 資料儲存媒體 4 0 外部資料儲存單元 S101 〜S109 製程步驟 S201 〜S219 製程步驟S Symbol description 16/20 201240541 1〇Detection unit 11 Detection device 12 Reading device 13 Calculation and storage device 2 Component mounting machine 2 1 Gas flow unit 3 0 Circuit board 3 3 1 Bad daughter board mark 3 2 Data storage medium 4 0 External data storage unit S101 to S109 Process steps S201 to S219 Process steps

Claims (1)

201240541 七、申請專利範圍: 1、二種整合電路板資訊之置件方法,包含以下步驟. 提供多個電路板,該些電路板均為-種由多個子板所 組成之多聯板’其中每-該電路板上具有 存電路板初始資訊之資料健存媒體; 、 將送進一檢知單元,該檢知單元至少且有 用於5胃取”料儲存媒體之讀取裝置及 :知,厂該電路板上的每—該子板上是否有不良 ::::檢知裝置’其中該檢知裝置係獲取一; ^板該檢知單元將該讀取裝置所讀取之電 』板初始I訊與該檢知裝置所檢知的不良子板 :整合為一對應每一該電路板之電路板置件資 汛,亚輸出該電路板置件資訊;以及 ' 提供至少一元件著裝機台, :該元件著裝機台,該元件著 =件資訊,在屬於良品的該子板上:= 2 :申清專利範目帛!項所述之整 :法二=些電路板送進-檢知二步: 板置件t 有一運算及儲存裝置,該電路 置件—貝讯係儲存於該檢知單元。 、如申請專利範圍第2 方::其中在提供至少一元件著;= 連接於該檢知單元,以抓取儲存… 早70之錢路板置件資訊而進行所述的置件步 18/20 3 201240541 驟。 4、=請範圍第2項所述之整合電路板資 元件-在提供至少—元件著裳機△的牛驟中 几件著裝機台更具 广的步驟中’該 些電路板的其中之―、共 項衣1,當檢知後的該 讀取裝置Μ讀取^時’該辅助 初始資訊,再連接於兮'、枓儲存媒體之電路板 知單元中且對應該電路==’^抓取儲存於該檢 資訊,使該元件著裝機 之邊電路板置件 _行所述的置件步驟。。根據她板置件資訊而進 〕、如申請專利範圍第p 方法’其令在_雷路二爾貧訊之置件 中,該檢知單元她二t:檢知單元的步驟 資料儲存單元。 —貝。孔儲存於一外部 "如申請專利範圍第5項 方法,其中該外部資料錯存星?二路板貧讯之置件 學儲存媒體。、存早兀係為-資料庫或一光 7 、如申請專利範圍第5項 方法,其中在提#H、_ 電路板貢訊之置件 元件著f機_、奎、 兀件著裝機台的步驟中,該 牛者錢口係連接於該外 储存於該外部資料释 _ 百仔早7L以抓取 進行所述的置件步驟。⑦7°之§亥電路板置件資訊而 、如申請專利範圍第5項 方法,其中在提供至少路板資訊之置件 元件著裝機JL* 70件者衣機台的步驟中,該 °更”有—辅助讀取裝當檢知後的該 19/20 201240541 i電路板的其中之—送進該元件著裝機台時,該輔助 項取裝置係先讀取料於該資㈣存媒體之電路板 =始貧訊,再連接於該外部資料儲存單元,以抓取儲 存於該外部資料儲存單元中且對㈣電路板初始資 路柄=路板置件貝訊’使該^件著裝機台根據該電 路板置件賁訊而進行所述的置件步驟。 ^專利视圍第丨項所述之整合電路板資訊之置件 逆” i中在置件步驟之後,更將置件完成之電路板 中是ϊ為Hr,以檢知該些子板在所述的置件步驟 0件::請::範圍第1項所述之整合電路板資訊之置 中,扑r。。在將該些電路板送進一檢知單元的步驟 上的元更進一步檢測該電路板的每一該子板 旦、,膝 以分析該電路板的每—該子板的偏_ 里亚將該偏移量記錄於該電路板置 矛夕 £ 20/20201240541 VII. Patent application scope: 1. Two methods for integrating board information, including the following steps. Provide multiple circuit boards, which are all kinds of multi-boards composed of multiple sub-boards. Each of the circuit boards has a data storage medium for storing initial information of the circuit board; and is sent to a detecting unit, the detecting unit has at least a reading device for the 5 gastric material storage medium and: Whether there is a defect in each of the sub-boards on the circuit board:::: detecting device 'where the detecting device acquires one; ^ board the detecting unit reads the electric plate read by the reading device The initial I signal and the bad sub-board detected by the detecting device are integrated into a circuit board component corresponding to each of the circuit boards, sub-output the board device information; and 'providing at least one component loader Taiwan, the component is equipped with a machine, the component is with the information, on the sub-board that belongs to the good product: = 2: Shen Qing patent paradigm! The whole of the item: Method 2 = some boards are fed - Two steps of detection: the board set t has an arithmetic and storage device, the circuit is set - Beixun is stored in the detection unit. For example, the second party of the patent application scope:: at least one component is provided; = connected to the detection unit to capture the storage... The information is carried out as described in step 18/20 3 201240541. 4. Please select the integrated circuit board component described in item 2 of the scope - in the provision of at least one of the components of the machine △ In a more extensive step, 'these boards are the ones, the common item 1, when the reading device after the detection Μ reads ^, the auxiliary initial information, and then connected to 兮', 枓 storage The circuit board of the media knows the unit and corresponds to the circuit == '^ grabs the information stored in the inspection information, so that the component is mounted on the side of the circuit board. And, as in the patent application scope p method 'in the _Lei Lu Er Erzhi, the detection unit she two t: the detection unit step data storage unit. - Bay. Hole is stored in An external " as in the fifth method of applying for patent scope, wherein the external data is missing the star The second board is the storage medium of the information store. The deposit is as follows - the database or the light 7 , as in the fifth method of patent application, in which the components of the #H, _ circuit board In the step of f machine_, 奎, and 着 着 着 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , § hai circuit board information, as in the patent application scope 5 method, in the step of providing at least the board information of the component component dressing machine JL * 70 pieces of clothing machine, the ° more "has - When the auxiliary reading device is inspected, the one of the 19/20 201240541 i circuit boards is fed to the component dressing machine, and the auxiliary item picking device first reads the circuit board of the medium (4) storage medium= The initial poor news, and then connected to the external data storage unit, to capture and store in the external data storage unit and to (4) the initial circuit handle of the circuit board = road board set Beixun 'to make the piece of equipment based on the The board step is performed by the board device. ^In the case of the integrated circuit board information described in the third paragraph of the Patent Scope, after the placing step, the board in the completed board is Hr, to detect that the sub-boards are in the The description of the setting procedure 0:: Please:: The integration of the board information described in the first item of the range, the r.. on the steps of the board into a detection unit further Detecting each of the sub-boards of the circuit board, and analyzing the offset of each of the sub-boards of the circuit board to record the offset on the circuit board.
TW100109601A 2011-03-21 2011-03-21 Picking-up and placing method with integrated pcb information TWI400020B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109587952A (en) * 2018-12-07 2019-04-05 景旺电子科技(龙川)有限公司 A kind of method and system for preventing from mixing plate in PCB production process
TWI745131B (en) * 2020-10-22 2021-11-01 聯策科技股份有限公司 Printed circuit board yield rate and production equipment error rate backtracking method and system thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200906242A (en) * 2007-07-25 2009-02-01 D Tek Semicon Technology Co Ltd Automatic plate embedding device and method therof
TWM351350U (en) * 2007-11-14 2009-02-21 D Tek Technology Co Ltd Classifying embedding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109587952A (en) * 2018-12-07 2019-04-05 景旺电子科技(龙川)有限公司 A kind of method and system for preventing from mixing plate in PCB production process
TWI745131B (en) * 2020-10-22 2021-11-01 聯策科技股份有限公司 Printed circuit board yield rate and production equipment error rate backtracking method and system thereof

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