TWI670217B - Electronic component conveying device and electronic component inspection device - Google Patents

Electronic component conveying device and electronic component inspection device Download PDF

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Publication number
TWI670217B
TWI670217B TW106132927A TW106132927A TWI670217B TW I670217 B TWI670217 B TW I670217B TW 106132927 A TW106132927 A TW 106132927A TW 106132927 A TW106132927 A TW 106132927A TW I670217 B TWI670217 B TW I670217B
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electronic component
inspection
electronic
section
individual identification
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TW106132927A
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Chinese (zh)
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TW201813904A (en
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荻原武彥
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精工愛普生股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10544Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum
    • G06K7/10712Fixed beam scanning
    • G06K7/10722Photodetector array or CCD scanning
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/10Image acquisition
    • G06V10/12Details of acquisition arrangements; Constructional details thereof

Abstract

本發明之課題在於提供一種可確立電子零件之可追蹤性,而管理各個電子零件之品質之電子零件搬送裝置及電子零件檢查裝置。 本發明之電子零件搬送裝置具有:個體識別資訊讀取部17,其可讀取記載於電子零件10之電子零件10之個體識別資訊;電子零件資訊產生發送部,其可產生包含個體識別資訊、且對檢查電子零件10之檢查部1a發送之電子零件資訊,且可將電子零件資訊發送至檢查部1a;電子零件檢查載置部配置部,其可配置能夠檢查電子零件10之電子零件檢查載置部34;及電子零件搬送部36、41,其可載置電子零件10,且向電子零件檢查載置部配置部搬送電子零件10;且檢查部1a可將檢查電子零件10之結果與個體識別資訊一併記憶。An object of the present invention is to provide an electronic component transfer device and an electronic component inspection device that can establish the traceability of electronic components and manage the quality of each electronic component. The electronic component transporting device of the present invention includes: an individual identification information reading section 17 that can read the individual identification information recorded in the electronic component 10 of the electronic component 10; and an electronic component information generation and transmission section that can generate the information including the individual identification information, The electronic part information sent by the inspection part 1a that inspects the electronic part 10 can be sent to the inspection part 1a; the electronic part inspection placement part configuration part can be configured with an electronic part inspection carrier capable of inspecting the electronic part 10. The placement unit 34; and the electronic parts transfer units 36 and 41, which can mount the electronic parts 10, and transfer the electronic parts 10 to the electronic parts inspection placement unit placement unit; and the inspection unit 1a can combine the results of the inspection of the electronic parts 10 with the individual Identifies information.

Description

電子零件搬送裝置及電子零件檢查裝置Electronic component transfer device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置者。The present invention relates to an electronic component transfer device and an electronic component inspection device.

先前以來,於IC(Integrated Circuit:積體電路)(半導體積體電路裝置)等電子零件之電性特性檢查中,有根據良品、不良品之檢查結果而將電子零件分類、收納之IC檢查用處理機。 以IC檢查用處理機實施檢查之電子零件以實施檢查之個數單位管理良品、不良品。又,附加價值高之電子零件係有獨立地管理個體品質之傾向。 例如,揭示有攝像電子零件而辨識電子零件之種類,並將檢查電子零件之檢查程式發送至測試器(檢查部)之情況(例如,參照專利文獻1)。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開平9-178807號公報Previously, in the inspection of electrical characteristics of electronic components such as ICs (Integrated Circuits) (semiconductor integrated circuit devices), there have been IC inspections that classify and store electronic components based on the inspection results of good and defective products. Processor. The electronic parts that are inspected by the IC inspection processor are used to manage the good and defective products in units of inspection. Moreover, electronic components with high added value tend to manage individual quality independently. For example, a case where an electronic component is imaged to identify the type of the electronic component and an inspection program for inspecting the electronic component is transmitted to a tester (inspection unit) is disclosed (for example, refer to Patent Document 1). [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 9-178807

[發明所欲解決之問題] 然而,於專利文獻1中未揭示於實施檢查後,將各電子零件、與測試器所檢查之記錄建立關聯並確認之方法。 [解決問題之技術手段] 本發明係為了解決上述課題之至少一部分而完成者,可作為以下之形態或應用例而實現。 [應用例1]本應用例之電子零件搬送裝置之特徵在於,具有:個體識別資訊讀取部,其可讀取記載於電子零件之上述電子零件之個體識別資訊;電子零件資訊產生發送部,其可產生包含上述個體識別資訊、且對檢查上述電子零件之檢查部發送之電子零件資訊,且可將上述電子零件資訊發送至上述檢查部;電子零件檢查載置部配置部,其可配置能檢查上述電子零件之電子零件檢查載置部;及電子零件搬送部,其可載置上述電子零件,且向上述電子零件檢查載置部配置部搬送上述電子零件;且上述檢查部可將檢查上述電子零件之結果與上述個體識別資訊一併記憶。 根據本應用例,由於附加個體識別資訊讀取部,以個體識別資訊讀取部讀取電子零件所記述之個體識別資訊,並將以個體識別資訊讀取部讀取之個體識別資訊於檢查時發送至檢查部,故可將電子零件之個體識別資訊與檢查結果一併(建立關聯)記錄。藉此,可於之後確認電子零件個體與以檢查部檢查之記錄,以電子零件搬送裝置亦可進行實施檢查之電子零件之個體管理。其結果,可確立電子零件之可追蹤性,而管理(分析)搬送路徑中各個電子零件之品質差異。 [應用例2]於上述應用例所記載之電子零件搬送裝置中,較佳為具有:固持部,其固持上述電子零件;且上述個體識別資訊讀取部讀取被載置於上述電子零件搬送部之上述電子零件、及由上述固持部固持之上述電子零件中之至少一者之上述個體識別資訊。 根據本應用例,因於將電子零件載置於電子零件檢查載置部之電子零件檢查載置部配置部中,係吸附電子零件之上表面並搬送,故難以由個體識別資訊讀取部讀取個體識別資訊,但可於將電子零件搬送至電子零件檢查載置部配置部之前讀取個體識別資訊。藉此,可與載置於電子零件檢查載置部之電子零件分開將個體識別資訊發送至檢查部。 [應用例3]於上述應用例所記載之電子零件搬送裝置中,較佳為上述個體識別資訊讀取部係讀碼器及攝像裝置中之至少一者。 根據本應用例,可於個體識別資訊包含文字串、條碼、及2D(2維)碼等時亦容易地自個體識別資訊讀取成為個體識別之資訊。 [應用例4]於上述應用例所記載之電子零件搬送裝置中,較佳為上述電子零件資訊產生發送部係基於來自上述檢查部之信號,將上述電子零件資訊發送至上述檢查部。 根據本應用例,可於實施檢查前將電子零件之個體識別資訊發送至檢查部。 [應用例5]於上述應用例所記載之電子零件搬送裝置中,較佳為上述個體識別資訊讀取部無法讀取上述電子零件之上述個體識別資訊時,上述檢查部不檢查上述電子零件,且上述電子零件搬送部將上述電子零件載置於特定之載置部。 根據本應用例,於讀取個體識別資訊但無法辨識個體識別資訊之情形時,於將該電子零件搬送至電子零件檢查載置部後,不對檢查部發送個體識別資訊。藉此,檢查部可判斷將電子零件分類為不良、或再檢查。例如,於檢查前檢驗電子零件並判斷為不良之情形時,可不檢查而予以撤離。 [應用例6]於上述應用例所記載之電子零件搬送裝置中,較佳為具有可設定及確認上述個體識別資訊讀取部之讀取位置的操作部,且上述操作部具有可進行用以設定上述讀取位置之輸入、及用以確認上述讀取位置之顯示的觸控面板。 根據本應用例,可容易地設定與確認個體識別資訊讀取部之讀取位置。 [應用例7]於上述應用例所記載之電子零件搬送裝置中,較佳為具有可設定及確認上述個體識別資訊讀取部之讀取位置的操作部,且上述操作部具有:輸入部,其可進行用以設定上述讀取位置之輸入;及顯示部,其可進行用以確認上述讀取位置之顯示。 根據本應用例,可容易地設定與確認個體識別資訊讀取部之讀取位置。 [應用例8]於上述應用例所記載之電子零件搬送裝置中,較佳為於上述電子零件資訊中,除上述個體識別資訊外,並包含上述電子零件搬送裝置中之上述電子零件之搬送路徑之資訊。 根據本應用例,可自電子零件資訊作成電子零件之搬送路徑圖,並基於檢查結果確立可追蹤性。又,可管理(分析)搬送路徑之各電子零件之品質差異。 [應用例9]本應用例之電子零件檢查裝置之特徵在於,具有:個體識別資訊讀取部,其可讀取記載於電子零件之上述電子零件之個體識別資訊;檢查部,其檢查上述電子零件;電子零件資訊產生發送部,其可產生包含上述個體識別資訊、且對上述檢查部發送之電子零件資訊,且可將上述電子零件資訊發送至上述檢查部;電子零件檢查載置部,其可檢查上述電子零件;及電子零件搬送部,其可載置上述電子零件,且向上述電子零件檢查載置部搬送上述電子零件;且上述檢查部可將檢查上述電子零件之結果與上述個體識別資訊一併記憶。 根據本應用例,由於附加個體識別資訊讀取部,以個體識別資訊讀取部讀取電子零件所記述之個體識別資訊,並將以個體識別資訊讀取部讀取之個體識別資訊於檢查時發送至檢查部,故可將電子零件之個體識別資訊與檢查結果一併(建立關聯)記錄。藉此,可於之後確認電子零件個體與以檢查部檢查之記錄,以電子零件檢查裝置亦可進行實施檢查之電子零件之個體管理。其結果,可確立電子零件之可追蹤性,而管理(分析)搬送路徑中各電子零件之品質差異。[Problems to be Solved by the Invention] However, Patent Document 1 does not disclose a method for associating and confirming each electronic component with a record inspected by a tester after an inspection is performed. [Technical means for solving the problem] The present invention has been completed in order to solve at least a part of the problems described above, and can be implemented as the following forms or application examples. [Application Example 1] The electronic component transfer device of this application example is characterized by having an individual identification information reading section that can read the individual identification information of the electronic components described in the electronic component; an electronic component information generating and transmitting section, It can generate electronic part information including the above-mentioned individual identification information and sent to the inspection part that inspects the electronic part, and can send the electronic part information to the inspection part; the electronic part inspection placement part configuration part, which can be configured to An electronic parts inspection mounting section that inspects the electronic parts; and an electronic parts transfer section that can mount the electronic parts and transport the electronic parts to the electronic parts inspection placement section placement section; and the inspection section can inspect the above The result of the electronic part is memorized with the above-mentioned individual identification information. According to this application example, since the personal identification information reading unit is added, the personal identification information described in the electronic part is read by the personal identification information reading unit, and the personal identification information read by the personal identification information reading unit is checked at the time of inspection. It is sent to the inspection department, so the individual identification information of electronic parts and the inspection results can be recorded together (associated). With this, the individual electronic parts and the records inspected by the inspection department can be confirmed later, and the individual management of the electronic parts that are inspected can also be performed by the electronic part transfer device. As a result, it is possible to establish traceability of electronic parts, and to manage (analyze) the quality difference of each electronic part in the conveyance path. [Application Example 2] In the electronic component transfer device described in the above application example, it is preferable that the electronic component transfer device includes: a holding portion that holds the electronic component; and the individual identification information reading portion reads and is placed on the electronic component transfer. The individual identification information of at least one of the electronic parts described above and the electronic parts held by the holding part. According to this application example, since the electronic component is placed in the electronic component inspection placement portion placement portion of the electronic component inspection placement portion, the upper surface of the electronic component is adsorbed and transported, so it is difficult to read by the individual identification information reading portion. The individual identification information is obtained, but the individual identification information can be read before the electronic component is transported to the electronic component inspection placement section disposition section. Thereby, individual identification information can be sent to the inspection section separately from the electronic parts placed on the electronic parts inspection placement section. [Application Example 3] In the electronic component transfer device described in the above application example, the individual identification information reading unit is preferably at least one of a code reader and an image pickup device. According to this application example, when the individual identification information includes a text string, a bar code, and a 2D (2-dimensional) code, etc., the individual identification information can be easily read as the individual identification information. [Application Example 4] In the electronic component transfer device described in the above application example, it is preferable that the electronic component information generating and transmitting section sends the electronic component information to the inspection section based on a signal from the inspection section. According to this application example, the individual identification information of the electronic parts can be sent to the inspection section before the inspection is performed. [Application Example 5] In the electronic component transfer device described in the above application example, preferably, when the individual identification information reading unit cannot read the individual identification information of the electronic component, the inspection unit does not inspect the electronic component, In addition, the electronic component transporting section mounts the electronic component on a specific mounting section. According to this application example, when the individual identification information is read but the individual identification information cannot be identified, after the electronic component is transported to the electronic component inspection placement section, the individual identification information is not sent to the inspection section. With this, the inspection unit can determine whether the electronic component is classified as defective or re-inspected. For example, if the electronic parts are inspected before inspection and judged to be defective, they can be evacuated without inspection. [Application Example 6] In the electronic component transporting device described in the above application example, it is preferable that the operation section has an operation section capable of setting and confirming the reading position of the individual identification information reading section, and the operation section has A touch panel for inputting the reading position and setting a display for confirming the reading position. According to this application example, the reading position of the individual identification information reading section can be easily set and confirmed. [Application Example 7] In the electronic component conveying device described in the above application example, it is preferable that the operation section has an operation section capable of setting and confirming the reading position of the individual identification information reading section, and the operation section includes an input section, It can perform an input for setting the above-mentioned reading position; and a display section that can perform a display for confirming the above-mentioned reading position. According to this application example, the reading position of the individual identification information reading section can be easily set and confirmed. [Application Example 8] In the electronic component transfer device described in the above application example, it is preferable that the electronic component information includes the individual component identification information and includes the electronic component transfer path in the electronic component transfer device. Information. According to this application example, it is possible to create a transportation path diagram of electronic parts from the electronic part information, and establish traceability based on the inspection results. In addition, it is possible to manage (analyze) the quality difference of each electronic component in the conveyance path. [Application Example 9] The electronic component inspection device of this application example is characterized by having an individual identification information reading section that can read the individual identification information of the electronic component described in the electronic component, and an inspection section that checks the electronic component. Parts; electronic part information generating and transmitting section, which can generate electronic part information including the above-mentioned individual identification information and send to the inspecting section, and can transmit the electronic part information to the inspecting section; and an electronic part inspection placing section, which The above-mentioned electronic parts can be inspected; and an electronic-parts transporting unit that can mount the electronic parts and transport the electronic parts to the electronic-parts inspection placing unit; and the inspection unit can identify the results of the inspection of the electronic parts with the individual identification Information is memorized. According to this application example, since the personal identification information reading unit is added, the personal identification information described in the electronic part is read by the personal identification information reading unit, and the personal identification information read by the personal identification information reading unit is checked at the time of inspection. It is sent to the inspection department, so the individual identification information of electronic parts and the inspection results can be recorded together (associated). Thereby, the individual electronic parts and the records inspected by the inspection department can be confirmed later, and the electronic parts inspection device can also perform the individual management of the electronic parts that are inspected. As a result, it is possible to establish traceability of electronic parts, and to manage (analyze) the quality difference of each electronic part in the conveyance path.

於本實施形態中,對具備電子零件搬送裝置之電子零件檢查裝置、及該電子零件搬送裝置搬送電子零件之方法之特徵例進行說明。以下,按照圖式對實施形態進行說明。另,由於各圖式之各構件設為可於各圖式上辨識程度之大小,故對各構件使比例尺不同而圖示。 (第1實施形態) 對本實施形態相關之電子零件檢查裝置按照圖1~圖8進行說明。 (電子零件檢查裝置) 圖1係顯示電子零件檢查裝置之構造之模式俯視圖,即為卸除罩體後之圖。圖2係顯示電子零件檢查裝置之構造之概略立體圖。 如圖1所示,電子零件檢查裝置1係具備長方形板狀之基台2。將俯視基台2時基台2正交之2條邊所延伸之方向設為X方向及Y方向,且將鉛直方向之下方向設為-Z方向。電子零件檢查裝置1主要由檢查電子零件10之檢查部1a、及作為將電子零件10搬送至檢查部1a之電子零件搬送裝置之搬送部1b構成。搬送部1b具備可配置能檢查電子零件10之檢查用插口34之電子零件檢查載置部配置部。電子零件檢查載置部配置部可配置能檢查電子零件10之檢查用插口34。電子零件檢查載置部配置部係例如檢查電子零件10之檢查用插口34(檢查部1a)。 於基台2上之X方向側,設置有於X方向較長而延伸之6個帶式輸送機。帶式輸送機自-Y方向側依序為第1輸送機3、第2輸送機4、第3輸送機5、第4輸送機6、第5輸送機7、及第6輸送機8。第1輸送機3係供材用之帶式輸送機,於第1輸送機3上載置有托盤9。托盤9係由隔板以5列5行之矩陣狀被劃分,且於各劃分區域載置有電子零件10。因此,托盤9可排列於正交之2個方向並載置電子零件10。 第1輸送機3於內部具備馬達、減速機、及滑輪,馬達以藉由減速機減速之轉速使滑輪旋動(未圖示)。且,皮帶與滑輪之外周接觸地設置,藉由馬達使滑輪旋動而使皮帶移動。且,載置於第1輸送機3上之托盤9與皮帶一同於X方向往復移動。將第1輸送機3移動托盤9之X方向設為第1方向3c。第2輸送機4~第6輸送機8為與第1輸送機3相同之構造,可與第1輸送機3同樣地使托盤9於X方向往復移動。 第2輸送機4及第3輸送機5成為放置空托盤9之場所,第4輸送機6成為放置對判定為不良之電子零件10加以存放之托盤9之場所。且,第5輸送機7及第6輸送機8成為放置對判定為良品之電子零件10加以存放之托盤9之場所。 電子零件10之形態未特別限定,但於本實施形態中,例如電子零件10可適應扁平封裝等各種封裝形態之IC(Integrated Circuit)、CIS(Contact Image Sensor:接觸式影像感測器)、液晶面板、液晶模組、及電子模組等。且,電子零件檢查裝置1為檢查電子零件10之電性特性並區分良品與不良品之裝置。作為IC之例,列舉LSI(Large Scale Integration:大型積體電路)、將複數個IC模組封裝化之模組IC、CMOS(Complementary Metal Oxide Semiconductor:互補金屬氧化物半導體)、CCD(Charge Coupled Device:電荷耦合器件)、水晶器件、壓力感測器、氣壓感測器、慣性(加速度)感測器、旋轉(角速度)感測器、指紋感測器、照度感測器、顏色感測器、溫度感測器、紫外線感測器、光感測器等。 於與第1輸送機3~第6輸送機8對向之場所,設置有托盤搬送部11。托盤搬送部11具備跨越第1輸送機3~第6輸送機8而設置之門型之托盤搬送支持部12。托盤搬送支持部12係於Y方向較長之形狀,於托盤搬送支持部12之-X方向側設置有於Y方向延伸之導軌13。 於導軌13之-X方向側,設置有沿著導軌13移動之托盤移動載台14。將托盤移動載台14移動之Y方向設為第2方向14a。第2方向14a係與第1方向3c正交之方向,第1方向3c及第2方向14a成為將電子零件10排列於托盤9之方向。於托盤搬送支持部12之內部,設置有使托盤移動載台14移動之直動機構。該直動機構之種類無特別限定,可使用線性馬達、馬達與滾珠螺桿之組合、齒條、小齒輪、及馬達之組合等各種形態。於本實施形態中例如採用伺服馬達與滾珠螺桿之組合。 於托盤移動載台14之-X方向側之面介隔托盤固持支持部15而設置有托盤固持部16。托盤固持部16具備升降裝置與真空夾具。真空夾具係具備吸盤,且吸盤藉由配管而與真空泵連接。且,升降裝置具備使真空夾具升降之功能。升降裝置使真空夾具下降並使真空夾具之吸盤與托盤9接觸。且,藉由將吸盤與托盤9之間設為真空而使真空夾具固持托盤9。其後,可藉由升降裝置使托盤9上升,而使托盤9自第1輸送機3離開,並使托盤移動載台14於Y方向上移動托盤9。托盤搬送部11由托盤搬送支持部12、導軌13、托盤移動載台14、托盤固持支持部15、及托盤固持部16等構成。 於第1輸送機3~第6輸送機8之-X方向側設置有電子零件除供材部20。於基台2上之-Y方向側設置有電子零件供材部29。電子零件供材部29具備第1支持部25。第1支持部25係於X方向較長之形狀,於第1支持部25之Z方向側設置有於X方向延伸之導軌18。 於導軌18之Z方向側設置有沿著導軌18移動之供材X載台23。於第1支持部25內置直動機構,該直動機構使供材X載台23於X方向往復移動。另,第1支持部25之直動機構可使用與驅動托盤移動載台14之直動機構同樣之機構。 供材X載台23具備第1支持樑22。第1支持樑22係於Y方向較長之形狀,於第1支持樑22之Z方向側設置有於Y方向延伸之導軌19。 於導軌19之Z方向側設置有沿著導軌19移動之供材Y載台27。於第1支持樑22內置直動機構,該直動機構使供材Y載台27於Y方向往復移動。另,第1支持樑22之直動機構可使用與驅動托盤移動載台14之直動機構同樣之機構。 於供材Y載台27之-Z方向側之面設置有供材電子零件固持部(固持部)28。供材電子零件固持部28固持電子零件10。供材電子零件固持部28具備升降裝置與真空夾具。該升降裝置及真空夾具係省略與托盤固持部16具備之升降裝置及真空夾具同樣之構造之說明。由第1支持樑22、供材X載台23、第1支持部25、供材Y載台27、及供材電子零件固持部28等構成電子零件供材部29。 於供材電子零件固持部28中,升降裝置使真空夾具下降而使真空夾具之吸盤與電子零件10接觸。且,藉由將吸盤與電子零件10之間設為真空而使真空夾具固持電子零件10。其後,可藉由升降裝置使電子零件10上升,而使供材X載台23及供材Y載台27於X方向及Y方向上移動電子零件10。 同樣地,於基台2上之Y方向側設置有電子零件除材部33。電子零件除材部33具備第2支持部30。第2支持部30係於X方向較長之形狀,於第2支持部30之Z方向側設置有於X方向延伸之導軌21。 於導軌21之Z方向側設置有沿著導軌21移動之除材X載台24。於第2支持部30內置直動機構,該直動機構使除材X載台24於X方向往復移動。另,第2支持部30之直動機構可使用與驅動托盤移動載台14之直動機構同樣之機構。 除材X載台24具備第2支持樑26。第2支持樑26係於Y方向較長之形狀,於第2支持樑26之Z方向側設置有於Y方向延伸之導軌39。 於導軌39之Z方向側設置有沿著導軌39移動之除材Y載台31。於第2支持樑26內置直動機構,該直動機構使除材Y載台31於Y方向往復移動。另,第2支持樑26之直動機構可使用與驅動托盤移動載台14之直動機構同樣之機構。 於除材X載台24之-Z方向側之面設置有除材電子零件固持部32。除材電子零件固持部32具備升降裝置與真空夾具。該升降裝置及真空夾具係省略與托盤固持部16具備之升降裝置及真空夾具同樣之構造之說明。由第2支持樑26、除材X載台24、第2支持部30、除材Y載台31、及除材電子零件固持部32等構成電子零件除材部33。 於除材電子零件固持部32中,升降裝置使真空夾具下降而使真空夾具之吸盤與電子零件10接觸。且,藉由將吸盤與電子零件10之間設為真空而使真空夾具固持電子零件10。其後,可藉由升降裝置使電子零件10上升,而使除材X載台24及除材Y載台31於X方向及Y方向上移動電子零件10。 於托盤搬送支持部12之-X方向,於基台2上設置有作為電子零件檢查載置部之檢查用插口34。檢查用插口34為檢查電子零件10之場所。於檢查用插口34形成與電子零件10之外形形狀大體相同形狀之凹部,可於該凹部設置電子零件10。且,於凹部設置有可與電子零件10之端子電性接觸之探針。於檢查用插口34設置4個凹部,可同時檢查4個電子零件10。 於檢查用插口34之X方向,於檢查用插口34與托盤搬送支持部12之間設置有一對導軌35。導軌35於Y方向延伸而設置,於導軌35上設置有沿著導軌35移動之作為電子零件搬送部之第1梭載台36。第1梭載台36可載置電子零件10,並將電子零件10向檢查用插口34(檢查部1a)搬送。於基台2,直動機構內置於一對導軌35之間,該直動機構使第1梭載台36於Y方向往復移動。另,導軌35之間之直動機構可使用與驅動托盤移動載台14之直動機構同樣之機構。 於第1梭載台36之朝向Z方向之面,設置有8個用以設置電子零件10之凹部37。其中4個凹部37配置於第1梭載台36之-Y方向側,且將該凹部37設為供材用凹部37a。剩餘之4個凹部37配置於第1梭載台36之Y方向側,將該凹部37設為除材用凹部37b。於除材用凹部37b位於檢查用插口34附近時,於俯視基台2時,供材用凹部37a係位於電子零件供材部29之供材電子零件固持部28可移動之場所。同樣,於供材用凹部37a位於檢查用插口34附近時,於俯視基台2時,除材用凹部37b位於電子零件除材部33之除材電子零件固持部32可移動之場所。 於檢查用插口34之-X方向,於檢查用插口34與基台2之端之間設置有一對導軌40。導軌40於Y方向延伸而設置,於導軌40上設置有沿著導軌40移動之作為電子零件搬送部之第2梭載台41。第2梭載台41可載置電子零件10,並將電子零件10向檢查用插口34(檢查部1a)搬送。於基台2直動機構內置於一對導軌40之間,該直動機構使第2梭載台41於Y方向往復移動。另,導軌40之間之直動機構可使用與驅動托盤移動載台14之直動機構同樣之機構。 於第2梭載台41之朝向Z方向之面,設置有8個用以設置電子零件10之凹部42。其中4個凹部42配置於第2梭載台41之-Y方向側,將該凹部42設為供材用凹部42a。剩餘之4個凹部42配置於第2梭載台41之Y方向側,將該凹部42設為除材用凹部42b。於除材用凹部42b位於檢查用插口34附近時,於俯視基台2時,供材用凹部42a位於電子零件供材部29之供材電子零件固持部28可移動之場所。同樣,於供材用凹部42a位於檢查用插口34附近時,於俯視基台2時,除材用凹部42b位於電子零件除材部33之除材電子零件固持部32可移動之場所。 於第1及第2梭載台36、41上之Z方向側設置有作為個體識別資訊讀取部之讀碼器17。讀碼器17較佳讀取被載置於第1及第2梭載台36、41之電子零件10、及由供材電子零件固持部28固持之電子零件10中之至少一者之個體識別2D碼10e。藉此,藉由可選擇對個體識別2D碼10e加以讀取之讀碼器17之設置位置,而可選擇成本或速度之優先。 讀碼器17設置於出入檢查部1a之第1及第2梭載台36、41之上部。讀碼器17設置有4個。讀碼器17係於供材用凹部37a通過之上部沿X方向排列設置有2台。讀碼器17係於供材用凹部42a通過之上部沿X方向排列設置有2台。於凹部37、42(排列於與第1及第2梭載台36、41之移動方向正交之方向)之Z方向上方配置有各讀碼器17。於本實施形態中,讀碼器17介隔安裝金屬件63且藉由螺絲(未圖示)等安裝於按壓支持部44。若讀碼器17可固定於讀取被載置於第1及第2梭載台36、41之電子零件10之個體識別2D碼10e的位置,則不論安裝部位如何。例如,讀碼器17亦可安裝於導軌45或隔板55等。藉此,藉由設置複數台讀碼器17,可提高搬送速度。另,亦可於高溫時對讀碼器17追加溫度維持用空氣系統。又可於低溫時進行低溫維持。 讀碼器17可讀取被載置於第1及第2梭載台36、41之電子零件10之作為個體識別資訊之個體識別2D碼10e。據此,可讀取電子零件10之條碼及2D碼等中之至少一者。又,據此,因於將電子零件10載置於檢查用插口34之檢查部1a中吸附電子零件10之上表面並搬送,故以讀碼器17讀取個體識別2D碼10e較為困難,但可於將電子零件10搬送至檢查用插口34之前讀取個體識別2D碼10e。藉此,可與載置於檢查用插口34之電子零件10分開將個體識別2D碼(電子零件資訊)10e發送至檢查部1a。 讀碼器17可讀取記載於各個電子零件10之電子零件10之品種2D碼10d。讀碼器17係將2維碼轉換為文字資料之裝置。讀碼器17可對品種2D碼10d及個體識別2D碼10e射出光線17a並掃描(參照圖3)。且,讀碼器17可接收反射光,將反射光之光強度信號轉換成品種2D碼10d及個體識別2D碼10e所示之文字資訊。另,亦可藉由以相機(攝像裝置)等拍攝而進行圖像處理,而識別品種2D碼10d及個體識別2D碼10e所示之文字資訊。 讀碼器17可讀取矩陣型之2維碼。矩陣型之2維碼係QR(Quick Response:快速應答)碼(註冊商標)、DataMatrix、VeriCode等。讀碼器17可讀取堆疊型之2維碼。堆疊型之2維碼係PDF(Portable Data File:便攜式資料檔案)417、CODE49等。讀碼器17可讀取條碼。條碼係JAN(Japanese Article Number:日本製品編碼)等。據此,於個體識別2D碼10e包含文字串、條碼、及2D碼等時,亦可容易地自個體識別2D碼10e讀取個體識別之資訊。 圖3係讀碼器17及第1梭載台36之側視圖。 讀碼器17相對於個體識別2D碼10e傾斜安裝。這是為了不使強光源之反射光入射至圖像(個體識別2D碼10e)之受光透鏡。具體而言,雷射式讀碼器對2D碼標籤自傾斜方向照射雷射光,而接收其漫反射光,藉此可讀取2D碼標籤。例如,必須傾斜15度左右而設置。若以雷射光與2D碼標籤成直角之方式設置(正反射安裝),則會自2D碼標籤面局部地返回極強之反射光(正反射光或直接反射光)。「於帶有角度而安裝」之情形時,由於所有之反射光皆為漫反射,故可正常地自類比波形轉換為數位波形,但於「正反射安裝」之情形時,由於接收了正反射光,故類比波形之一部分與漫反射相比變為極高之位準,而無法正常地轉換為數位波形。因此,於採取正反射安裝之情形時無法讀取。 於與第1梭載台36及第2梭載台41對向之場所設置有電子零件按壓裝置43。電子零件按壓裝置43具備跨越第1梭載台36及第2梭載台41而設置之門型之按壓支持部44。按壓支持部44係於X方向較長之形狀,於按壓支持部44之Y方向側設置有於X方向延伸之導軌45。 於導軌45之Y方向側設置有沿著導軌45移動之測定X載台46。於按壓支持部44之內部設置有使測定X載台46移動之直動機構。另,測定X載台46之直動機構可使用與驅動托盤移動載台14之直動機構同樣之機構。 於測定X載台46之Y方向側設置檢查電子零件固持部47,檢查電子零件固持部47具備升降裝置及真空夾具。該升降裝置及真空夾具省略了與托盤固持部16具備之升降裝置及真空夾具同樣之構造之說明。檢查電子零件固持部47之真空夾具具備4個吸盤,可1次固持4個電子零件10。 於檢查電子零件固持部47中,升降裝置使真空夾具下降並使真空夾具之吸盤與電子零件10接觸。且,藉由將吸盤與電子零件10之間設為真空而使真空夾具固持電子零件10。其後,可藉由升降裝置使電子零件10上升,而使測定X載台46於X方向上往復移動電子零件10。 接著,電子零件按壓裝置43固持被載置於第1梭載台36之供材用凹部37a之電子零件10並向檢查用插口34移動。且,電子零件按壓裝置43將電子零件10按壓至檢查用插口34。此時,由於將電子零件10之端子按壓於探針,故端子與探針確實地電性連接。維持該狀態並進行電子零件10之電性特性檢查。接著,於電子零件10之電性特性檢查結束後,電子零件按壓裝置43係將電子零件10移動至第1梭載台36之除材用凹部37b。以同樣之程序,檢查電子零件固持部47將載置於第2梭載台41之電子零件10移動至檢查用插口34,並將電子零件10按壓至檢查用插口34,藉此輔助電性特性檢查。 電子零件供材部29、第1梭載台36、第2梭載台41、及電子零件按壓裝置43係向實施特定處置之位置搬送。該特定處置係為了將電子零件10送入檢查用插口34而改變電子零件10之方向、將電子零件10插入檢查用插口34、對電子零件10接入檢查電流而檢查等之處置。 於基台2之-X方向側設置有電特檢查裝置50。電特檢查裝置50係與設置於檢查用插口34之探針連接。且,電特檢查裝置50係與電子零件10進行電性信號之通信,而進行電子零件10之電性特性之良否判定之裝置。於基台2之X方向側設置有控制部51。控制部51係控制電子零件檢查裝置1之動作之裝置。於控制部51,設置有作為操作部之顯示部(資訊輸出部、資訊顯示部、及警報輸出部)之資訊顯示裝置51a及作為操作部之輸入部(資訊輸入部)之資訊輸入裝置51b。再者,於位於第3輸送機5之Z方向之場所,如圖2所示,設置有資訊顯示裝置48。資訊顯示裝置48及資訊顯示裝置51a係液晶顯示裝置等顯示裝置,即顯示報知操作者之資訊之裝置。資訊輸入裝置51b係鍵盤或滑鼠等裝置,即用以輸入操作者指示控制部51之內容之裝置。再者,資訊輸入裝置51b具備與外部機器通信並輸入資料之功能。 資訊顯示裝置51a係顯示用以確認讀碼器17之讀取位置之資訊之裝置。資訊輸入裝置51b具備輸入用以設定讀碼器17之讀取位置之資訊之功能。據此,可容易地設定與確認讀碼器17之讀取位置。 另,資訊輸入裝置51b亦可為輸入用以設定讀碼器17之讀取位置之資訊、及顯示用以確認讀碼器17之讀取位置之資訊之裝置。資訊輸入裝置51b亦可為能夠進行用以設定讀取位置之輸入、及用以確認讀取位置之顯示的觸控面板。據此,可容易地設定與確認讀碼器17之讀取位置。 於基台2之X方向側且Y方向側之角設置有警告燈52。警告燈52係於混入了未預定檢查之電子零件10時亮滅而促使操作者注意之裝置。電子零件檢查裝置1係於Z方向側設置罩體53,資訊顯示裝置48係固定於罩體53。罩體53由透光之樹脂形成,可通過罩體53觀察內部。且,罩體53防止灰塵或塵埃侵入至電子零件檢查裝置1。 於罩體53之Z方向側設置有空氣供給部54。空氣供給部54具備防止灰塵或塵埃通過之過濾器與風扇。且,空氣供給部54將去除灰塵或塵埃之空氣供給至電子零件檢查裝置1。空氣自空氣供給部54流入至罩體53之內部,並自基台2及基台2與罩體53之間流出。藉此,灰塵或塵埃不會侵入至電子零件檢查裝置1。 檢查用插口34具備加熱器,可將電子零件10加熱。藉此,可以特定溫度檢查電子零件10。且,包圍檢查用插口34及電子零件按壓裝置43而設置有隔板55。隔板55抑制熱自檢查用插口34之周圍散逸。藉此,將電子零件10加熱之熱被保留於檢查用插口34之周圍。 電子零件檢查裝置1中之檢查用插口34及電特檢查裝置50構成檢查部1a。且,電子零件檢查裝置1中之將電子零件10於托盤9與檢查用插口34之間搬送之各載台及輸送機構成搬送部1b。 圖4係用以說明電子零件之模式俯視圖。 如圖4所示,於電子零件10印刷有顯示製造者名稱10a、品種顯示名稱10b、及個體識別編碼10c之文字串。再者,於電子零件10,印刷有以2維碼顯示品種顯示名稱10b之品種2D碼10d、以2維碼顯示個體識別編碼10c之個體識別2D碼10e。 藉由將編碼體系由1維設為2維,可增加能顯示之文字數。因此,可增多顯示於電子零件10之資訊量。另,個體識別資訊係指標記於電子零件10之商標或標識等圖形、製造者名稱等文字資訊、電子零件之型號或序列號、批號等數字資訊之可識別該電子零件與其他電子零件的資訊。文字之內容或配置等屬性未特別限定,可設定於每個電子零件10。 圖5係電子零件檢查裝置1之電性控制方塊圖。 於圖5中,電子零件檢查裝置1具備控制電子零件檢查裝置1之動作之控制部51。且,控制部51具備:CPU(Central Processing Unit:中央運算處理單元)58,其作為處理器進行各種運算處理;及記憶體59,其記憶各種資訊。再者,載台驅動裝置60、輸送機驅動裝置61、固持部驅動裝置62、讀碼器17、資訊輸入裝置51b、資訊顯示裝置48、資訊顯示裝置51a、資訊輸出裝置65、及電特檢查裝置50係經由輸入輸出介面66及資料匯流排67而與CPU58連接。 另,電特檢查裝置50與控制部51之通信亦可使用包含GP-IB(General Purpose Interface Bus:通用介面匯流排)、RS-232C(Recommended Standard-232C:建議標準-232C)、DIO(Digital In And Out:數位輸入輸出)(數位I/O)之通信。檢查部1a與搬送部1b之通信亦可使用GP-IB通信。又,讀碼器17與控制部51之通信亦可使用RS-232C、USB(Universal Serial Bus:通用串列匯流排)、LAN(Local Area Network:區域網路)通信。 載台驅動裝置60驅動托盤移動載台14及設置於托盤固持部16之托盤升降載台68。各載台具備檢測位置之裝置。且,載台驅動裝置60係可藉由移動載台直至到達移動目的之場所而使托盤固持部16移動至期望之場所並停止。 再者,載台驅動裝置60驅動供材Y載台27、供材X載台23、及設置於供材電子零件固持部28之供材Z載台69。再者,載台驅動裝置60係驅動除材Y載台31、除材X載台24、及設置於除材電子零件固持部32之除材Z載台70。且,載台驅動裝置60係可藉由移動載台直至到達移動目的之場所,而使供材電子零件固持部28及除材電子零件固持部32移動至期望之場所並停止。 再者,載台驅動裝置60驅動第1梭載台36、第2梭載台41、測定X載台46、及設置於檢查電子零件固持部47之測定Z載台71。且,載台驅動裝置60係可藉由驅動各載台而於第1梭載台36、第2梭載台41、及檢查用插口34間移動電子零件10。 輸送機驅動裝置61驅動第1輸送機3~第6輸送機8。輸送機驅動裝置61係可藉由驅動各輸送機,使輸送機移動直至托盤9到達移動目的之場所,而使托盤9移動至期望之場所並停止。 固持部驅動裝置62係驅動托盤固持部16、供材電子零件固持部28、除材電子零件固持部32、及檢查電子零件固持部47。固持部驅動裝置62係驅動與各固持部連接之真空泵。且,驅動被設置於各固持部與真空泵之間之閥而使閥開閉。藉此,固持部驅動裝置62係可使電子零件10固持於各固持部後予以釋放。資訊輸出裝置65係與外部機器連接,具有將資訊設為電性信號而輸出至外部機器之介面功能之裝置。 記憶體59係包含RAM(Ramdom Access Memory:隨機存取記憶體)、ROM(Read Only Memory:唯讀記憶體)等之半導體記憶體、或硬碟、DVD-ROM(Digital Video Disc-Read Only Memory:數位影音光碟-唯讀記憶體)之外部記憶裝置之概念。於功能上設定有對電子零件檢查裝置1之動作之控制程序所記述之程式軟體72加以記憶的記憶區域。此外,設定有對檢測出設置於電子零件10之個體識別編碼10c之資料即個體識別資料75加以記憶的記憶區域。此外,設定有作為供CPU58使用之工作區域或臨時檔案等而發揮功能之記憶區域或其他各種記憶區域。 CPU58係根據記憶於記憶體59內之程式軟體72而進行檢查電子零件10之控制者。具有載台控制部76作為具體之功能實現部。載台控制部76係與載台驅動裝置60進行通信並取得各載台之位置資訊。接著,以使各載台移動至載台控制部76期望之場所並停止之方式將指令信號輸出至載台驅動裝置60。再者,載台控制部76係與輸送機驅動裝置61進行通信並取得第1輸送機3~第6輸送機8之位置資訊。接著,以使各輸送機移動至載台控制部76期望之場所並停止之方式將指令信號輸出至輸送機驅動裝置61。 此外,CPU58具有固持控制部77。固持控制部77係以固持部驅動裝置62驅動托盤固持部16、供材電子零件固持部28、除材電子零件固持部32、及檢查電子零件固持部47。接著,進行使電子零件10吸附於各固持部之動作與釋放之動作之控制。接著,載台控制部76與固持控制部77協同搬送電子零件10。 此外,CPU58具有資訊顯示控制部81。資訊顯示控制部81係於資訊顯示裝置48及資訊顯示裝置51a顯示算出之個體識別資料75。 此外,CPU58具有電子零件資訊產生發送部82。電子零件資訊產生發送部82係經由資訊輸出裝置65而將個體識別資料75輸出至外部機器。 電子零件資訊產生發送部82可產生電子零件資訊。電子零件資訊產生發送部82可將電子零件資訊發送至檢查電子零件10之檢查部1a。電子零件資訊包含個體識別2D碼10e。電子零件資訊除個體識別2D碼10e外包含有部位資訊。部位資訊係指例如以檢查部1a檢查電子零件10時之檢查用插口34之凹部之編碼。 另,於電子零件資訊中,除個體識別資訊外亦可包含有搬送部1b之電子零件10之搬送路徑之資訊。據此,可根據電子零件資訊作成電子零件10之搬送路徑圖。且,可基於檢查結果確立可追蹤性。電子零件10之搬送路徑資訊係指供給時托盤9之編碼及其排列、回收時托盤9之編碼及其排列、檢查用插口34之凹部編碼、檢查順序、及檢查之種類等。另,搬送路徑資訊亦可記錄於該電子零件10。 電子零件資訊產生發送部可基於來自檢查部1a之信號,將個體識別2D碼(電子零件資訊)10e發送至檢查部1a。檢查部1a可將檢查電子零件10之結果與個體識別2D碼10e一併(建立關聯)記憶。據此,可於實施檢查前將電子零件10之個體識別資訊發送至檢查部1a。 另,於本實施形態中,雖使用CPU58以程式軟體實現上述各功能,但於不使用CPU58而藉由單獨之電子電路(硬體)可實現上述各功能之情形時,亦可使用此種電子電路。 圖6係顯示讀碼器17之設定畫面之一例之圖。 基於圖6說明讀碼器17之設定方法。 於圖6所示之「2D碼設定(2D Code Setup)」畫面G1,例如,包含有「存在2D碼使用(2D Code Use existence)」選擇區域RA1、「讀取錯誤之處理(Processing of reading error)」選擇區域RA2、「梭1設定(Shuttle 1 setup)」選擇區域RA3。 於圖6所示之例中,於選擇區域RA1,包含有「有效(Valid)」之文字串、與該文字串建立對應之選項按鈕RB1、「無效(Invalid)」之文字串、及與該文字串建立對應之選項按鈕RB2。 操作者輕觸(點擊)被顯示於選擇區域RA1之2個選項按鈕(選項按鈕RB1及選項按鈕RB2)中之1個,藉此選擇有無使用2D碼。於選項按鈕RB2被設定之情形時為普通運轉,不進行個體識別2D碼10e之讀取。 於選擇區域RA2,包含有「即時停止錯誤(Instant error stop)」之文字串、與該文字串建立對應之選項按鈕RB3、「繼續讀取錯誤(Continuation reading error)」之文字串、與該文字串建立對應之選項按鈕RB4、用以受理錯誤類別之輸入框N1、及用以受理連續錯誤次數之輸入框N2。 操作者輕觸(點擊)顯示於選擇區域RA2之2個選項按鈕(選項按鈕RB3及選項按鈕RB4)中之1個,藉此設定產生讀取錯誤時之處理。操作者將任意之數值輸入被顯示於選擇區域RA2之2個輸入框(輸入框N1及輸入框N2),藉此設定產生讀取錯誤時之處理。操作者係於選擇區域RA2設定個體識別2D碼10e之讀取失敗時之處理。 於選項按鈕RB3被設定之情形時,一旦產生讀取錯誤,馬上停止錯誤。於選項按鈕RB4被設定之情形時,於連續產生輸入框N2中設定之次數之情形時停止錯誤。輸入框N1中設定之值係寫入至讀取出差錯之凹部37、42之錯誤類別編碼。寫入有錯誤類別之電子零件10之檢查係不實施。另,於讀碼器17搭載有自動重試功能。 於選擇區域RA3,包含有「讀取位置(Reading position)」之文字串、與該文字串建立對應之輸入框N3、「移動(Move)」按鈕BT1、及「Reg.(登錄)」按鈕BT2、「等待時間(Wait Time)」之文字串、與該文字串建立對應之輸入框N4、「梭1列A(Shuttle 1 rowA)」選擇區域RA4、及「梭1列B(Shuttle 1 rowB)」選擇區域RA5。 於「梭1列A(Shuttle 1 rowA)」選擇區域RA4包含有「讀取(Read)」按鈕BT3、及與該按鈕建立對應之輸出框S1及輸出框S2。 操作者係指定讀取被載置於供材用凹部37a、42a之-Y側之電子零件10之個體識別2D碼10e時之位置(第1及第2梭載台36、41之位置)。藉由點擊按鈕BT2可登錄當前之第1及第2梭載台36、41之位置。 操作者於第1及第2梭載台36、41移動至讀取位置後,等待指定時間後執行讀取。 操作者點擊按鈕BT1。第1及第2梭載台36、41移動至讀取位置。 操作者點擊按鈕BT2。以當前之第1及第2梭載台36、41之位置更新輸入框N3之值。 操作者點擊按鈕BT3。成為讀碼器17反復執行讀取之狀態。若成功讀取個體識別2D碼10e,則將讀取之個體識別2D碼10e顯示於按鈕BT3右側之輸出框S1,並將讀取所花費之時間顯示於其下方之輸出框S2。讀取時間越短,讀取條件越佳(內部重試較少之故)。若讀取失敗,則於輸出框S1顯示為「讀取錯誤」。 於「梭1列B(Shuttle 1 rowB)」選擇區域RA5包含有「讀取(Read)」按鈕BT4、及與該按鈕建立對應之輸出框S3及輸出框S4。另,由於選擇區域RA5係與選擇區域RA4同樣之功能,故省略說明。 又,由於「梭2設定(Shuttle 2 setup)」選擇區域RA6係與選擇區域RA3同樣之功能,故省略說明。 於「日誌檔案保存(Log File Save)」選擇區域RA7,包含有「啟用(Enable)」之文字串、與該文字串建立對應之選項按鈕RB5、「禁用(Disable)」之文字串、及與該文字串建立對應之選項按鈕RB6。 操作者輕觸(點擊)被顯示於選擇區域RA7之2個選項按鈕(選項按鈕RB5及選項按鈕RB6)中之1個,藉此設定日誌檔案保存之有效、無效。 搬送部1b係特定期間將個體識別2D碼10e資訊與檢查結果作為控制部51內之日誌資料而保存。例如,保存為“Barcodexx1, Site1, Bin1, Barcodexx2, Site2, Bin3”“Barcodexx3, Site3, Bin1, Barcodexx4, Site4, Bin6”。 接著,說明讀取位置之登錄。 讀取位置調整係按畫面G1之選擇區域RA3之「讀取位置(Reading position)」、「等待時間(Wait Time)」實施。 首先,將檢查對象即電子零件10插入第1梭載台36之供材用凹部37a之-Y側。若按下按鈕BT1,則將第1梭載台36移動至供材用凹部37a之-Y側。 接著,藉由於輸入框N4任意設定等待時間並按下按鈕BT3,而使對應之讀碼器17之1者以設定之間隔開始連續讀取。以輸入之方式設定值時,反復將「讀取位置(Reading position)」之值輸入至輸入框N3,並按下按鈕BT1,而調整至讀取位置。 以手移動而設定第1梭載台36時,向可讀取之位置移動第1梭載台36,並以按鈕BT2登錄位置。 具體而言,首先,點擊按鈕BT3開始讀取。接著,以手使第1梭載台36移動而尋找讀取位置。接著,一面確認被顯示於輸出框S1之個體識別2D碼10e與被顯示於輸出框S2之處理時間,一面找出最佳位置。接著,以按鈕BT2登錄位置。接著,更行輸入框N3之值。接著,以按鈕BT1再次確認。接著,亦同樣地登錄第2梭載台41側之位置。 確認實際流入電子零件10時是否可進行個體識別2D碼10e之讀取。於讀取失敗時,調整輸入框N3或輸入框N4之值而尋找最佳之設定。 電子零件10所進入之第1及第2梭載台36、41係以步驟動作每次移動1行。藉由讀碼器17,而於第1及第2梭載台36、41上讀取檢查前之電子零件10之個體識別2D碼10e。個體識別2D碼10e係經由GP-IB而於檢查開始後對檢查部1a發送。另,個體識別2D碼10e之讀取亦可於檢查後進行。 搬送部1b係將個體識別2D碼10e與部位資訊傳送至檢查部1a。搬送部1b係基於檢查部1a之檢查結果而將電子零件10分層。 檢查結果例如以“Site1, Bin1, Site2, Bin3, Site3, Bin1, Site4, Bin6”之格式發送。 (電子零件之檢查方法) 接著,對使用上述電子零件檢查裝置檢查電子零件之方法,使用圖7及圖8進行說明。 圖7係顯示電子零件之檢查方法之流程圖。圖8係顯示搬送部1b與檢查部1a之通信序列之圖。 首先,如圖7所示,步驟S10相當於托盤設置步驟。該步驟係操作者將托盤9設置於第1輸送機3之步驟。 接著移至步驟S20。步驟S20相當於標識攝像步驟。該步驟係讀碼器17讀取電子零件10之個體識別2D碼10e之步驟。 接著移至步驟S30。步驟S30相當於檢查步驟。該步驟中,搬送部1b將電子零件10搬送至檢查用插口34,檢查部1a檢查電子零件10之電性特性,且,搬送部1b將已檢查之電子零件10收納於托盤9之步驟。 接著移至步驟S40。步驟S40相當於空托盤移動步驟。該步驟係托盤搬送部11於第1輸送機3~第6輸送機8之間移動空托盤9之步驟。 接著移至步驟S50。步驟S50相當於托盤去除步驟。該步驟係操作者自第4輸送機6~第6輸送機8去除收納有已檢查之電子零件10之托盤9之步驟。藉由以上之步驟,檢查電子零件10之步驟結束。 接著,與圖7所示之步驟對應,詳細地說明電子零件10之檢查方法。 步驟S10係托盤設置步驟。操作者將電子零件10排列設置於托盤9。該電子零件10係預定之後要進行電性特性檢查者。接著,操作者將設置有電子零件10之托盤9載置於第1輸送機3。 步驟S20係標識拍攝步驟。於步驟S20中,載台控制部76係以輸送機驅動裝置61驅動第1輸送機3而使托盤9接近電子零件除供材部20。接著,載台控制部76係以載台驅動裝置60移動第1梭載台36。接著,使供材用凹部37a於供材電子零件固持部28之移動範圍內移動。 接著,載台控制部76及固持控制部77係以載台驅動裝置60及固持部驅動裝置62驅動電子零件供材部29,而使托盤9上之4個電子零件10移動至供材用凹部37a。 接著,載台控制部76係以載台驅動裝置60移動第1梭載台36。讀碼器17對品種2D碼10d及個體識別2D碼10e射出光線17a並掃描(參照圖3)。且,讀碼器17接收反射光,將反射光之光強度信號轉換為條碼顯示之文字資訊。該文字資訊係個體識別資料75。CPU58自讀碼器17輸入文字資訊而記憶於記憶體59。 即便產生堵塞使得搬送部停止、因而電子零件滯留於搬送區域,個體識別2D碼已被拍攝之電子零件亦因搬送部之控制部保存有個體識別2D碼而可繼續動作。 於讀碼器無法讀取電子零件之個體識別2D碼時,檢查部1a不檢查電子零件10,搬送部1b將電子零件10存放在載置於作為特定載置部之第4輸送機6之托盤9。或,存放之場所亦可為任意設定之場所。於本實施形態中,雖將判定為不良之電子零件10存放在載置於第4輸送機6之托盤9,但亦可新設置再檢查用之托盤9而存放於該處。據此,於讀取個體識別2D碼10e但無法辨識個體識別2D碼10e之情形時,於將該電子零件10搬送至檢查用插口34後,不向檢查部1a發送個體識別2D碼10e。藉此,檢查部1a可判斷將電子零件10分類為不良、或再檢查。例如,於檢查前檢驗電子零件10並判斷為不良之情形時,可不檢查而予以撤離。 步驟S30係檢查步驟。於步驟S30中載台控制部76係以載台驅動裝置60移動第1梭載台36,而使供材用凹部37a移動至檢查用插口34旁。 接著,載台控制部76及固持控制部77係以載台驅動裝置60及固持部驅動裝置62驅動電子零件按壓裝置43。接著,固持控制部77係以檢查電子零件固持部47固持電子零件10。接著,載台控制部76係使測定X載台46及測定Z載台71移動,而使電子零件10自供材用凹部37a移動至檢查用插口34。 接著,載台控制部76以電子零件按壓裝置43將電子零件10按壓至檢查用插口34。藉此,檢查用插口34之探針與電子零件10之端子導通。 接著,基於圖8說明搬送部1b與檢查部1a之通信序列。 首先,如圖8所示,於步驟S100中,搬送部1b係於檢查用插口34配設電子零件10後,對檢查部1a發送檢查開始。 接著,於步驟S110中,檢查部1a對搬送部1b發送個體識別2D碼10e之請求。檢查部1a向搬送部1b詢問配設有電子零件10之檢查用插口34之編碼。 讀取所有配設於檢查用插口34之電子零件10之個體識別2D碼10e。例如,根據GP-IB通信規格將“BARCODE?”之文字串自檢查部1a對搬送部1b發送。 讀取指定之檢查用插口34之電子零件10之個體識別2D碼10e。例如,發送“BARCODE:S#?”作為指令。另,於S#之部分配設檢查用插口34之編碼。 接著,於步驟S120中,搬送部1b將保存於控制部51之個體識別2D碼(電子零件資訊)10e發送至檢查部1a。搬送部1b對檢查部1a通知配設有電子零件10之檢查用插口34之編碼。 發送所有配設於檢查用插口34之電子零件10之個體識別2D碼10e。例如,發送“BARCODE:S#_xxxxx,S#_xxxxx,…;”作為指令。具體而言,發送“BARCODE:S1_1234567890, S2_, S3_1000234585, S4_1100345478;”。 發送指定之檢查用插口34之電子零件10之個體識別2D碼10e。例如,發送“BARCODE:S#_xxxxx;”作為指令。具體而言,發送“BARCODE:S1_1234567890;”。於S#之部分配設檢查用插口34之編碼並根據GP-IB通信規格將搬送部1b之控制部51中保存之個體識別2D碼10e發送至檢查部1a。 接著,於步驟S130中,由於檢查部1a確認自搬送部1b接收之個體識別2D碼10e是否正確,故將自搬送部1b接收之個體識別2D碼10e回覆至搬送部1b。 檢查部1a將自搬送部1b接收之個體識別2D碼10e發送至搬送部1b。例如,發送“ECHO S#_xxxxx,S#_xxxxx,…;”作為指令。具體而言,發送“ECHO S1_1234567890;”。 接著,於步驟S140中,搬送部1b係比較發送至檢查部1a之個體識別2D碼10e與自檢查部1a接收之個體識別2D碼10e並回應檢查部1a是否已正確地發送至檢查部1a。 確認搬送部1b發送之個體識別2D碼10e與檢查部1a接收之個體識別2D碼10e是否相等。 例如,於相等之情形時發送“ECHOOK”,於不等之情形時發送“ECHONG”,具體而言,判斷ECHO指令與BARCODE指令之資料是否匹配,若匹配則返回“ECHOOK”,若不匹配則返回“ECHONG”。 接著,電特檢查裝置50與電子零件10通信而檢查電子零件10之電性特性。檢查部1a檢查電子零件10。 接著,於步驟S150中,檢查部1a將電子零件10之檢查結果通知搬送部1b。 接著,於步驟S160中,搬送部1b為了確認自檢查部1a接收之檢查結果資料是否正確,而將檢查結果發送至檢查部1a。 接著,於步驟S170中,檢查部1a比較發送至搬送部1b之檢查結果與自搬送部1b接收之檢查結果並回應搬送部1b是否已正確地發送至搬送部1b。 於電特檢查裝置50檢查電子零件10之電性特性之期間,載台控制部76使第1梭載台36移動並使除材用凹部37b移動至檢查用插口34旁。接著,載台控制部76使第2梭載台41移動。接著,使供材用凹部42a移動至供材電子零件固持部28之移動範圍內。接著,載台控制部76及固持控制部77以載台驅動裝置60及固持部驅動裝置62驅動電子零件供材部29,而使托盤9上之4個電子零件10移動至第2梭載台41之供材用凹部42a。接著,載台控制部76以載台驅動裝置60移動第2梭載台41,而使供材用凹部42a移動至檢查用插口34旁。接著,搬送部1b待機直至電子零件10之檢查結束。 於電子零件10之檢查結束後,載台控制部76以載台驅動裝置60移動測定X載台46及測定Z載台71,而使電子零件10自檢查用插口34移動至第1梭載台36之除材用凹部37b。 檢查部1a將檢查電子零件10之結果與個體識別2D碼10e一併(建立關聯)記憶。 接著,載台控制部76及固持控制部77以載台驅動裝置60及固持部驅動裝置62驅動電子零件按壓裝置43。接著。固持控制部77以檢查電子零件固持部47固持位於供材用凹部42a之電子零件10。接著,載台控制部76以載台驅動裝置60移動測定X載台46及測定Z載台71,而使電子零件10自供材用凹部42a移動至檢查用插口34。 接著,載台控制部76以檢查電子零件固持部47將電子零件10按壓至檢查用插口34。此時,檢查用插口34之探針與電子零件10之端子導通。接著,電特檢查裝置50與電子零件10通信而檢查電子零件10之電性特性。 於電特檢查裝置50檢查電子零件10之電性特性之期間,載台控制部76以載台驅動裝置60移動第2梭載台41。接著,載台驅動裝置60使除材用凹部42b移動至檢查用插口34旁。接著,載台控制部76以載台驅動裝置60移動第1梭載台36。接著,載台驅動裝置60使除材用凹部37b移動至除材電子零件固持部32之移動範圍內。接著,載台控制部76及固持控制部77以除材電子零件固持部32固持電子零件10。 電性特性檢查之結果係檢查之電子零件10為良品時,載台控制部76以電子零件除材部33使電子零件10載置於第5輸送機7或第6輸送機8上之托盤9。電性特性檢查之結果係電子零件10為不良品時,載台控制部76以電子零件除材部33使電子零件10載置於第4輸送機6上之托盤9。 另,亦可於1個托盤9配設有複數個配置區域,且搬送部1b根據分級程度而配置電子零件10。 接著,載台控制部76以載台驅動裝置60驅動第1梭載台36而使供材用凹部37a移動至供材電子零件固持部28之移動範圍內。如此,電子零件供材部29、第1梭載台36、第2梭載台41、及電子零件按壓裝置43將電子零件10自第1輸送機3上之托盤9移動至檢查用插口34。接著,檢查用插口34及電特檢查裝置50檢查電子零件10之電性特性。接著,電子零件按壓裝置43將電子零件10自檢查用插口34移動至第1梭載台36或第2梭載台41。 接著,電子零件除材部33將電子零件10自第1梭載台36或第2梭載台41移動至第4輸送機6~第6輸送機8上之托盤9。依序反覆該動作進行電子零件10之電性特性檢查。另,各電子零件10之電性特性檢查之判定結果記憶於記憶體59,並顯示於資訊顯示裝置48及資訊顯示裝置51a。又,電性特性檢查之判定結果可藉由資訊輸出裝置65自記憶體59輸出至外部機器。 接著,返回圖7,步驟S40係空托盤移動步驟。於步驟S40中,載台控制部76以載台驅動裝置60移動托盤移動載台14,且以輸送機驅動裝置61驅動第1輸送機3。接著,載台控制部76以移動電子零件10而變空之托盤9與托盤固持部16對向之方式使托盤9與托盤固持部16移動。 接著,載台控制部76以載台驅動裝置60驅動被設置於托盤固持部16之托盤升降載台68而使托盤固持部16下降。接著,載台控制部76將指令信號輸出至固持部驅動裝置62而以托盤固持部16固持托盤9。接著,載台控制部76將指令信號輸出至載台驅動裝置60及固持部驅動裝置62而使托盤9移動至第2輸送機4或第3輸送機5上。 於第4輸送機6~第6輸送機8上之托盤9無載置電子零件10之場所,而有設置托盤9之場所時,載台控制部76將指令信號輸出至載台驅動裝置60、輸送機驅動裝置61、及固持部驅動裝置62。接著,載台控制部76使托盤9自第2輸送機4及第3輸送機5移動至第4輸送機6~第6輸送機8上。 接著,步驟S50係托盤去除步驟。於步驟S50中,載台控制部76將指令信號輸出至輸送機驅動裝置61。接著,載台控制部76以輸送機驅動裝置61驅動第4輸送機6~第6輸送機8,而將載置有電子零件10之托盤9移動至罩體53之外側。接著,操作者將載置有電子零件10之托盤9自電子零件檢查裝置1去除並向下個步驟之作業場所搬送。藉由以上之步驟而結束檢查電子零件10之步驟。 根據本實施形態,附加讀碼器17,以讀碼器17讀取電子零件10之所記述之個體識別2D碼10e,並將以讀碼器17讀取之個體識別2D碼10e於檢查時發送至檢查部1a,因此可將電子零件10之個體識別2D碼10e與檢查結果一併(建立關聯)記錄。藉此,可於之後確認電子零件10個體與以檢查部1a檢查之記錄,搬送部1b亦可進行實施檢查之電子零件10之個體管理。其結果,可確立電子零件10之可追蹤性,而管理各電子零件10之品質。 於根據檢查部1a實施檢查之結果而將資訊寫入至電子零件10之情形時,可於之後確認寫入至每個電子零件10個體之資料。 (第2實施形態) 本實施形態與第1實施形態不同之處在於讀碼器17之設置部位。另,對與第1實施形態相同之點省略說明。 圖9係顯示第2及第3實施形態相關之電子零件檢查裝置之構造之模式俯視圖。 本實施形態之讀碼器38設置於第1支持樑22(供材電子零件固持部28)之下部。讀碼器38介隔安裝金屬件(未圖示)且藉由螺絲(未圖示)等安裝於第1支持樑22之下部。 讀碼器38可讀取被載置於第1及第2梭載台36、41之電子零件10之個體識別2D碼10e。 讀碼器38可藉由第1支持樑22之移動而讀取搬送至第1及第2梭載台36、41之電子零件10之個體識別2D碼10e。藉此,因藉由1台讀碼器38讀取個體識別2D碼10e,故可抑制成本。 又,若將讀碼器38設置於電子零件供材部29之供材Y載台27,則因供材Y載台27變重而使移動速度降低。因此,於該構造中,電子零件供材部29移動電子零件10所花費之時間延長。與該構造相比,於本實施形態中,由於將讀碼器38設置於第1支持樑22,故可生產性較佳地使電子零件10移動。 (第3實施形態) 本實施形態與第1實施形態不同之處在於讀碼器17之設置部位。另,對與第1實施形態相同之點省略說明。 本實施形態之讀碼器49如圖9所示設置於搬送部1b之頂板(基台2)。讀碼器49介隔安裝金屬件(未圖示)且藉由螺絲(未圖示)等而安裝於基台2。 讀碼器49可讀取由供材電子零件固持部28固持之電子零件10之個體識別2D碼10e。藉此,於個體識別2D碼10e被記述於電子零件10之背面之情形時有效。此外,亦可與第1及第2實施形態之至少一者之讀碼器17、38組合。 另,本實施形態並非限定於上述實施形態者,於本發明之技術思想內,亦可由於該領域中具有通常之知識者實施各種變更或改良。變化例係如下所述。 (變化例1) 圖10係用以說明本變化例相關之電子零件之模式俯視圖。 於上述實施形態中,電子零件10之個體識別資訊未限定於個體識別2D碼,例如,亦可為圖10所示之記述。對個體識別資訊所顯示之電子零件85之一變化例使用圖10進行說明。於上述1~3實施形態中,將2維之個體識別2D碼10e印刷於電子零件10。編碼未限定於2維,亦可設為1維之條碼。 於本變化例中,如圖10所示,將顯示製造者名稱85a、品種顯示名稱85b、及個體識別編碼85c之文字串印刷於電子零件85。再者,於電子零件85,印刷有以條碼顯示品種顯示名稱85b之品種條碼85d、與以條碼顯示個體識別編碼85c之個體識別條碼85e。另,文字或條碼之內容或配置等屬性並未特別限定,設定於每個電子零件85。 讀碼器17對品種條碼85d及個體識別條碼85e射出光線17a並掃描。 (變化例2) 圖11係用以說明本變化例相關之電子零件之模式俯視圖。 於上述變化例1中,將1維之個體識別條碼85e印刷於電子零件85。如圖11所示,於電子零件88,印刷有顯示製造者名稱88a、品種顯示名稱88b、及作為個體識別資訊之個體識別編碼88c之文字串。 個體識別資訊讀取部係未圖示之攝像裝置。據此,可讀取文字、條碼、及2D碼等之至少一者作為電子零件10之個體識別資訊。 攝像裝置係於內部組裝有對物透鏡、自動聚焦裝置、同軸落射照明裝置與CCD(Charge Coupled Device:電荷耦合器件)攝像元件者。攝像裝置係朝向電子零件88設置對物透鏡。首先,自同軸落射照明裝置射出之光係照射電子零件88。攝像裝置係通過對物透鏡輸入以電子零件88反射之光。接著,自動聚焦裝置於CCD攝像元件成像。藉由CCD攝像元件將圖像轉換為電性信號,攝像裝置可攝像電子零件88。製造者名稱88a、品種顯示名稱88b、及個體識別編碼88c之文字串較佳為可以攝像裝置攝影之色調。於本變化例中,例如背景為白色,文字顏色為黑色。另,自攝像裝置攝像之圖像算出個體識別資料75之方法可使用周知之方法。 (變化例3) 於上述變化例2中,攝像裝置係於內部組裝有CCD攝像元件。將圖像轉換為電性信號之裝置未限定於CCD攝像元件。可使用攝像管或CMOS(互補金屬氧化物半導體)影像感測器。此外,亦可使用紅外線影像感測器。亦可配合攝影之環境或電子零件88之印刷狀況而加以選擇。In this embodiment, a characteristic example of an electronic component inspection device including an electronic component transfer device and a method of transferring an electronic component by the electronic component transfer device will be described. Hereinafter, embodiments will be described with reference to the drawings. In addition, since each component of each drawing is set to a size that can be recognized on each drawing, the scale is different for each component and illustrated. (First Embodiment) An electronic component inspection apparatus according to this embodiment will be described with reference to Figs. 1 to 8. (Electronic component inspection device) FIG. 1 is a top plan view showing the structure of the electronic component inspection device, that is, the figure after the cover is removed. Fig. 2 is a schematic perspective view showing the structure of an electronic component inspection device. As shown in FIG. 1, the electronic component inspection apparatus 1 includes a rectangular plate-shaped base 2. The directions in which the two sides orthogonal to the base 2 extend when viewed from the base 2 in plan view are set to the X direction and the Y direction, and the direction below the vertical direction is set to the -Z direction. The electronic component inspection apparatus 1 is mainly composed of an inspection section 1a that inspects the electronic component 10, and a transfer section 1b that is an electronic component transfer device that transports the electronic component 10 to the inspection section 1a. The conveyance section 1 b includes an electronic component inspection placement section arranging section in which an inspection socket 34 capable of inspecting the electronic component 10 can be disposed. The electronic component inspection mounting portion arranging section may be provided with an inspection socket 34 capable of inspecting the electronic component 10. The electronic component inspection mounting portion arranging portion is, for example, an inspection socket 34 (inspection portion 1 a) for inspecting the electronic component 10. Six belt conveyors which are long in the X direction and are extended on the X direction side on the base 2 are provided. The belt conveyor is in the order from the -Y direction to the first conveyor 3, the second conveyor 4, the third conveyor 5, the fourth conveyor 6, the fifth conveyor 7, and the sixth conveyor 8. The first conveyor 3 is a belt conveyor for supplying materials, and a tray 9 is placed on the first conveyor 3. The tray 9 is divided by a partition into a matrix of 5 columns and 5 rows, and electronic parts 10 are placed in each divided area. Therefore, the tray 9 can be arranged in two orthogonal directions and the electronic component 10 can be placed thereon. The first conveyor 3 includes a motor, a reducer, and a pulley inside, and the motor rotates the pulley at a rotation speed that is reduced by the reducer (not shown). The belt is provided in contact with the outer periphery of the pulley, and the pulley is rotated by a motor to move the belt. The tray 9 placed on the first conveyor 3 moves back and forth in the X direction together with the belt. The X direction of the moving tray 9 of the first conveyor 3 is set to the first direction 3c. The second conveyor 4 to the sixth conveyor 8 have the same structure as the first conveyor 3 and can reciprocate the tray 9 in the X direction in the same manner as the first conveyor 3. The second conveyor 4 and the third conveyor 5 are places where the empty tray 9 is placed, and the fourth conveyor 6 is a place where the tray 9 storing the electronic components 10 which are determined to be defective is placed. In addition, the fifth conveyor 7 and the sixth conveyor 8 are places where the tray 9 storing the electronic components 10 determined to be good products is placed. The form of the electronic component 10 is not particularly limited, but in this embodiment, for example, the electronic component 10 can be adapted to various package forms such as an IC (Integrated Circuit), a CIS (Contact Image Sensor), and a liquid crystal. Panel, LCD module, and electronic module. In addition, the electronic component inspection device 1 is a device that inspects the electrical characteristics of the electronic component 10 and distinguishes between good and defective products. Examples of ICs include LSI (Large Scale Integration), module ICs that package multiple IC modules, CMOS (Complementary Metal Oxide Semiconductor), and CCD (Charge Coupled Device) : Charge-coupled device), crystal device, pressure sensor, barometric sensor, inertial (acceleration) sensor, rotation (angular velocity) sensor, fingerprint sensor, illuminance sensor, color sensor, Temperature sensor, ultraviolet sensor, light sensor, etc. A pallet conveying unit 11 is provided at a place facing the first conveyor 3 to the sixth conveyor 8. The tray transfer unit 11 includes a door-type tray transfer support unit 12 provided across the first conveyor 3 to the sixth conveyor 8. The tray carrying support portion 12 has a long shape in the Y direction, and a rail 13 extending in the Y direction is provided on the -X direction side of the tray carrying support portion 12. A tray moving stage 14 is provided on the -X direction side of the guide rail 13 and moves along the guide rail 13. The Y direction in which the tray moving stage 14 moves is set to the second direction 14a. The second direction 14a is a direction orthogonal to the first direction 3c, and the first direction 3c and the second direction 14a are directions in which the electronic components 10 are arranged on the tray 9. A linear motion mechanism for moving the tray moving stage 14 is provided inside the tray carrying support section 12. The type of the linear motion mechanism is not particularly limited, and various forms such as a linear motor, a combination of a motor and a ball screw, a rack, a pinion, and a motor can be used. In this embodiment, for example, a combination of a servo motor and a ball screw is used. A tray holding portion 16 is provided on a surface on the -X direction side of the tray moving stage 14 through the tray holding support portion 15. The tray holding section 16 includes a lifting device and a vacuum jig. The vacuum jig is provided with a suction cup, and the suction cup is connected to a vacuum pump through a pipe. In addition, the lifting device has a function of lifting the vacuum jig. The lifting device lowers the vacuum clamp and brings the sucker of the vacuum clamp into contact with the tray 9. Then, a vacuum is used to hold the tray 9 between the chuck and the tray 9. Thereafter, the tray 9 can be raised by the lifting device, the tray 9 can be separated from the first conveyor 3, and the tray moving stage 14 can be moved in the Y direction. The tray transporting unit 11 includes a tray transporting support unit 12, a guide rail 13, a tray moving stage 14, a tray holding support unit 15, a tray holding unit 16, and the like. An electronic parts removal and supply unit 20 is provided on the -X direction side of the first conveyor 3 to the sixth conveyor 8. An electronic component material supply portion 29 is provided on the base 2 in the -Y direction side. The electronic-component material supply section 29 includes a first support section 25. The first support portion 25 has a long shape in the X direction, and a rail 18 extending in the X direction is provided on the Z direction side of the first support portion 25. A feed X stage 23 is provided on the Z-direction side of the guide rail 18 and moves along the guide rail 18. A linear motion mechanism is built in the first support portion 25, and the linear motion mechanism reciprocates the material feeding X stage 23 in the X direction. As the linear motion mechanism of the first support portion 25, the same mechanism as the linear motion mechanism that drives the tray moving stage 14 can be used. The material X stage 23 includes a first support beam 22. The first support beam 22 is long in the Y direction, and a rail 19 extending in the Y direction is provided on the Z direction side of the first support beam 22. A feed Y stage 27 is provided on the Z-direction side of the guide rail 19 and moves along the guide rail 19. A linear motion mechanism is built in the first support beam 22, and the linear motion mechanism reciprocates the Y-stage 27 for supplying material in the Y direction. In addition, as the linear motion mechanism of the first support beam 22, the same mechanism as the linear motion mechanism that drives the tray moving stage 14 can be used. A material supply electronic component holding portion (holding portion) 28 is provided on a surface of the material Y stage 27 on the −Z direction side. The supplied electronic component holding portion 28 holds the electronic component 10. The material supply electronic component holding portion 28 includes a lifting device and a vacuum jig. The description of the same structure as the lifting device and the vacuum jig provided in the tray holding portion 16 is omitted in the lifting device and the vacuum jig. The electronic component material supply unit 29 is constituted by a first support beam 22, a material supply X stage 23, a first support portion 25, a material supply Y stage 27, and a material supply electronic component holding portion 28. In the material-supply electronic component holding portion 28, the lifting device lowers the vacuum jig and brings the suction cup of the vacuum jig into contact with the electronic component 10. Then, the vacuum component is used to hold the electronic component 10 by setting a vacuum between the chuck and the electronic component 10. Thereafter, the electronic component 10 can be raised by the elevating device to move the material supplying X stage 23 and the material supplying Y stage 27 in the X direction and the Y direction. Similarly, an electronic component removing portion 33 is provided on the Y-direction side of the base 2. The electronic component removing section 33 includes a second support section 30. The second support portion 30 has a long shape in the X direction, and a rail 21 extending in the X direction is provided on the Z direction side of the second support portion 30. On the Z-direction side of the guide rail 21, a removal X stage 24 moving along the guide rail 21 is provided. A linear motion mechanism is built into the second support portion 30, and the linear motion mechanism reciprocates the X-removing stage 24 in the X direction. As the linear motion mechanism of the second support portion 30, the same mechanism as the linear motion mechanism that drives the tray moving stage 14 can be used. The removed material X stage 24 includes a second support beam 26. The second support beam 26 is long in the Y direction, and a guide rail 39 extending in the Y direction is provided on the Z direction side of the second support beam 26. On the Z-direction side of the guide rail 39, a removal material Y stage 31 that moves along the guide rail 39 is provided. A linear motion mechanism is built in the second support beam 26, and the linear motion mechanism reciprocates the Y-removing stage 31 in the Y direction. As the linear motion mechanism of the second support beam 26, the same mechanism as the linear motion mechanism that drives the tray moving stage 14 can be used. A removal electronic component holding portion 32 is provided on the surface of the removal X stage 24 on the -Z direction side. The removed electronic component holding portion 32 includes a lifting device and a vacuum jig. The description of the same structure as the lifting device and the vacuum jig provided in the tray holding portion 16 is omitted in the lifting device and the vacuum jig. The second support beam 26, the removal X stage 24, the second support 30, the removal Y stage 31, and the removal electronic component holding portion 32 constitute the electronic component removal portion 33. In the removed electronic component holding portion 32, the lifting device lowers the vacuum jig and brings the suction cup of the vacuum jig into contact with the electronic component 10. Then, the vacuum component is used to hold the electronic component 10 by setting a vacuum between the chuck and the electronic component 10. Thereafter, the electronic component 10 can be raised by the lifting device to move the removed X stage 24 and the removed Y stage 31 in the X direction and the Y direction. An inspection socket 34 serving as an electronic component inspection mounting portion is provided on the base 2 in the -X direction of the tray transfer support portion 12. The inspection socket 34 is a place for inspecting the electronic component 10. A recessed portion having substantially the same shape as the external shape of the electronic component 10 is formed in the inspection socket 34, and the electronic component 10 may be provided in the recessed portion. In addition, a probe is provided in the recess portion so as to be in electrical contact with the terminal of the electronic component 10. Four inspections are provided in the inspection socket 34, and four electronic components 10 can be inspected simultaneously. A pair of guide rails 35 are provided in the X direction of the inspection socket 34 between the inspection socket 34 and the tray transfer support portion 12. The guide rail 35 extends in the Y direction and is provided on the guide rail 35. A first shuttle carrier 36 serving as an electronic component transfer unit that moves along the guide rail 35 is provided. The first shuttle stage 36 can mount the electronic component 10 and transport the electronic component 10 to the inspection socket 34 (inspection unit 1a). A linear motion mechanism is built in the base 2 between a pair of guide rails 35, and the linear motion mechanism reciprocates the first shuttle carrier 36 in the Y direction. As the linear motion mechanism between the guide rails 35, the same mechanism as the linear motion mechanism that drives the tray moving stage 14 can be used. On the surface of the first shuttle stage 36 facing the Z direction, eight recessed portions 37 for installing the electronic component 10 are provided. Among them, four recessed portions 37 are arranged on the -Y direction side of the first shuttle stage 36, and the recessed portion 37 is set as a material-receiving recessed portion 37a. The remaining four recessed portions 37 are arranged on the Y-direction side of the first shuttle stage 36, and this recessed portion 37 is defined as a recessed portion 37b for removal. When the recessed portion 37b for removal is located near the inspection socket 34, the recessed portion 37a for supply is located where the feeding electronic component holding portion 28 of the electronic component feeding portion 29 is movable when the base 2 is viewed in plan. Similarly, when the material-receiving recess 37a is located near the inspection socket 34, and when the base 2 is viewed from the top, the material-removing recess 37b is located at a place where the material-removing electronic component holding portion 32 of the electronic-component removing material 33 can move. A pair of guide rails 40 are provided between the inspection socket 34 and the end of the base 2 in the -X direction of the inspection socket 34. The guide rail 40 extends in the Y direction and is provided on the guide rail 40. A second shuttle stage 41 serving as an electronic component transfer unit that moves along the guide rail 40 is provided. The second shuttle stage 41 can mount the electronic component 10 and transport the electronic component 10 to the inspection socket 34 (inspection unit 1a). A linear motion mechanism on the base 2 is built in between a pair of guide rails 40. This linear motion mechanism reciprocates the second shuttle carrier 41 in the Y direction. As the linear motion mechanism between the guide rails 40, the same mechanism as the linear motion mechanism that drives the tray moving stage 14 can be used. On the surface of the second shuttle stage 41 facing the Z direction, eight recessed portions 42 for installing the electronic component 10 are provided. Among them, four recessed portions 42 are arranged on the -Y direction side of the second shuttle stage 41, and this recessed portion 42 is set as a material-receiving recessed portion 42a. The remaining four recessed portions 42 are arranged on the Y-direction side of the second shuttle stage 41, and this recessed portion 42 is a recessed portion 42b for removal. When the recessed portion 42b for removal is located near the inspection socket 34, the recessed portion 42a for supply is located where the feeding electronic component holding portion 28 of the electronic component feeding portion 29 is movable when the base 2 is viewed in plan. Similarly, when the material-receiving recess 42a is located near the inspection socket 34, and when the base 2 is viewed from the top, the material-removing recess 42b is located at a place where the material-removing electronic part holding part 32 of the electronic-component removing part 33 can move. A barcode reader 17 is provided on the first and second shuttle stages 36 and 41 on the Z direction side as an individual identification information reading unit. The code reader 17 preferably reads the individual identification of at least one of the electronic parts 10 placed on the first and second shuttle stages 36 and 41 and the electronic parts 10 held by the supply electronic part holding part 28. 2D code 10e. Thereby, by selecting the setting position of the code reader 17 for reading the individual identification 2D code 10e, priority can be given to cost or speed. The code reader 17 is provided above the first and second shuttle stages 36 and 41 of the access inspection section 1a. There are four code readers 17 provided. Two barcode readers 17 are arranged in the X direction through the upper portion of the supply recess 37a. Two barcode readers 17 are arranged in the X direction through the upper portion of the supply recess 42a. Each of the code readers 17 is arranged above the Z direction of the recesses 37 and 42 (arranged in a direction orthogonal to the moving directions of the first and second shuttle stages 36 and 41). In this embodiment, the code reader 17 is mounted on the pressing support portion 44 with a metal member 63 interposed therebetween, such as a screw (not shown). If the code reader 17 can be fixed at a position for reading the individual identification 2D code 10e of the electronic component 10 placed on the first and second shuttle carriers 36 and 41, it does not matter what the installation site is. For example, the code reader 17 may be mounted on a guide rail 45 or a partition 55. Accordingly, by providing a plurality of code readers 17, the conveying speed can be increased. It is also possible to add a temperature maintaining air system to the code reader 17 at high temperatures. It can also be maintained at low temperatures. The code reader 17 can read the personal identification 2D code 10e as the personal identification information of the electronic components 10 placed on the first and second shuttle stages 36 and 41. Accordingly, at least one of a bar code and a 2D code of the electronic component 10 can be read. According to this, since the electronic component 10 is placed on the inspection portion 1a of the inspection socket 34, the upper surface of the electronic component 10 is suctioned and transported, so it is difficult to read the individual identification 2D code 10e with the code reader 17, but The individual identification 2D code 10e can be read before the electronic component 10 is transferred to the inspection socket 34. Thereby, the individual identification 2D code (electronic component information) 10e can be transmitted to the inspection unit 1a separately from the electronic component 10 placed in the inspection socket 34. The code reader 17 can read the 2D code 10d of the type of the electronic component 10 described in each electronic component 10. The code reader 17 is a device for converting a two-dimensional code into text data. The code reader 17 can emit light 17a and scan the variety 2D code 10d and the individual identification 2D code 10e (see FIG. 3). In addition, the code reader 17 can receive the reflected light and convert the light intensity signal of the reflected light into text information shown by the variety 2D code 10d and the individual identification 2D code 10e. In addition, the text information indicated by the product 2D code 10d and the individual identification 2D code 10e can be recognized by performing image processing by shooting with a camera (imaging device) or the like. The code reader 17 can read a two-dimensional code of a matrix type. The two-dimensional code of the matrix type is a QR (Quick Response) code (registered trademark), DataMatrix, VeriCode, and the like. The code reader 17 can read a stacked two-dimensional code. Stacked 2D codes are PDF (Portable Data File) 417, CODE49, etc. The code reader 17 can read a bar code. The bar code is JAN (Japanese Article Number). Accordingly, when the personal identification 2D code 10e includes a text string, a bar code, and a 2D code, the personal identification information can also be easily read from the personal identification 2D code 10e. FIG. 3 is a side view of the code reader 17 and the first shuttle carrier 36. The code reader 17 is installed obliquely with respect to the individual identification 2D code 10e. This is to prevent the light reflected from the strong light source from entering the light receiving lens of the image (individual identification 2D code 10e). Specifically, the laser-type code reader irradiates the laser light from the oblique direction of the 2D code tag, and receives the diffuse reflection light, thereby reading the 2D code tag. For example, it must be installed at an angle of about 15 degrees. If the laser light is set at a right angle with the 2D code label (orthogonal reflection installation), extremely strong reflected light (specular reflection light or direct reflection light) will be partially returned from the 2D code label surface. In the case of "installation with an angle", since all the reflected light is diffuse reflection, the analog waveform can be converted into a digital waveform normally. However, in the case of "orthogonal installation", the regular reflection is received. Light, so a part of the analog waveform becomes extremely high compared to diffuse reflection, and cannot be converted into a digital waveform normally. Therefore, it cannot be read when the specular installation is adopted. An electronic component pressing device 43 is provided at a place facing the first shuttle carrier 36 and the second shuttle carrier 41. The electronic component pressing device 43 includes a gate-shaped pressing support portion 44 provided across the first shuttle stage 36 and the second shuttle stage 41. The pressing support portion 44 has a long shape in the X direction, and a guide rail 45 extending in the X direction is provided on the Y direction side of the pressing support portion 44. A measurement X stage 46 that moves along the guide rail 45 is provided on the Y-direction side of the guide rail 45. A linear motion mechanism for moving the measurement X stage 46 is provided inside the pressing support section 44. As the linear movement mechanism for measuring the X stage 46, the same mechanism as the linear movement mechanism for driving the tray movement stage 14 can be used. An inspection electronic component holding portion 47 is provided on the Y-direction side of the measurement X stage 46. The inspection electronic component holding portion 47 includes a lifting device and a vacuum jig. The lifting device and the vacuum jig are omitted from the description of the same structure as the lifting device and the vacuum jig provided in the tray holding portion 16. The vacuum jig for inspecting the electronic component holding portion 47 is provided with four suction cups and can hold four electronic components 10 at a time. In the inspection electronic component holding portion 47, the lifting device lowers the vacuum jig and brings the suction cup of the vacuum jig into contact with the electronic component 10. Then, the vacuum component is used to hold the electronic component 10 by setting a vacuum between the chuck and the electronic component 10. Thereafter, the electronic component 10 can be raised by the lifting device, and the measurement X stage 46 can be moved back and forth in the X direction. Next, the electronic component pressing device 43 holds the electronic component 10 placed on the material-receiving recess 37 a of the first shuttle stage 36 and moves the electronic component 10 toward the inspection socket 34. The electronic component pressing device 43 presses the electronic component 10 against the inspection socket 34. At this time, since the terminal of the electronic component 10 is pressed against the probe, the terminal and the probe are reliably electrically connected. In this state, the electrical characteristics of the electronic component 10 are checked. Next, after the inspection of the electrical characteristics of the electronic component 10 is completed, the electronic component pressing device 43 moves the electronic component 10 to the material-removing recess 37 b of the first shuttle stage 36. In the same procedure, the inspection electronic component holding unit 47 moves the electronic component 10 placed on the second shuttle stage 41 to the inspection socket 34 and presses the electronic component 10 onto the inspection socket 34 to assist the electrical characteristics. an examination. The electronic component supply unit 29, the first shuttle stage 36, the second shuttle stage 41, and the electronic component pressing device 43 are transported to a position where a specific treatment is performed. The specific treatment is a treatment for changing the direction of the electronic component 10 in order to feed the electronic component 10 into the inspection socket 34, inserting the electronic component 10 into the inspection socket 34, and connecting an inspection current to the electronic component 10 for inspection and the like. An electric special inspection device 50 is provided on the -X direction side of the base 2. The electric inspection device 50 is connected to a probe provided in the inspection socket 34. In addition, the electric special inspection device 50 is a device that performs electrical signal communication with the electronic component 10 and determines whether the electrical characteristics of the electronic component 10 are good or not. A control unit 51 is provided on the X-direction side of the base 2. The control unit 51 is a device that controls the operation of the electronic component inspection device 1. The control section 51 is provided with an information display device 51a as a display section (information output section, information display section, and alarm output section) as an operation section and an information input device 51b as an input section (information input section) as an operation section. Further, as shown in FIG. 2, an information display device 48 is provided at a place located in the Z direction of the third conveyor 5. The information display device 48 and the information display device 51a are display devices such as a liquid crystal display device, that is, a device that displays information notified to an operator. The information input device 51b is a device such as a keyboard or a mouse, that is, a device for inputting the contents of the control section 51 instructed by the operator. Furthermore, the information input device 51b has a function of communicating with an external device and inputting data. The information display device 51a is a device that displays information for confirming the reading position of the code reader 17. The information input device 51b has a function of inputting information for setting a reading position of the code reader 17. Accordingly, the reading position of the code reader 17 can be easily set and confirmed. In addition, the information input device 51b may be a device for inputting information for setting the reading position of the code reader 17, and displaying information for confirming the reading position of the code reader 17. The information input device 51b may be a touch panel capable of input for setting a reading position and display for confirming the reading position. Accordingly, the reading position of the code reader 17 can be easily set and confirmed. A warning lamp 52 is provided at a corner of the X direction side and the Y direction side of the base 2. The warning lamp 52 is a device that is turned on and off to attract the operator's attention when electronic components 10 that are not scheduled for inspection are mixed. The electronic component inspection device 1 is provided with a cover 53 on the Z-direction side, and the information display device 48 is fixed to the cover 53. The cover 53 is formed of a light-transmitting resin, and the inside can be observed through the cover 53. The cover 53 prevents dust or dust from entering the electronic component inspection device 1. An air supply unit 54 is provided on the Z-direction side of the cover 53. The air supply unit 54 includes a filter and a fan that prevent dust or dust from passing therethrough. The air supply unit 54 supplies air from which dust or dust has been removed to the electronic component inspection device 1. The air flows into the cover 53 from the air supply part 54 and flows out from the base 2 and between the base 2 and the cover 53. This prevents dust or dust from entering the electronic component inspection device 1. The inspection socket 34 includes a heater and can heat the electronic component 10. Thereby, the electronic component 10 can be inspected at a specific temperature. A partition plate 55 is provided to surround the inspection socket 34 and the electronic component pressing device 43. The partition plate 55 suppresses the heat from escaping around the socket 34 for inspection. Thereby, heat for heating the electronic component 10 is retained around the inspection socket 34. The inspection socket 34 and the electric special inspection device 50 in the electronic component inspection apparatus 1 constitute an inspection section 1a. The stages and conveyors that transport the electronic component 10 between the tray 9 and the inspection socket 34 in the electronic component inspection apparatus 1 constitute a transfer unit 1 b. FIG. 4 is a schematic plan view for explaining electronic parts. As shown in FIG. 4, the electronic component 10 is printed with a character string displaying a manufacturer name 10 a, a product display name 10 b, and an individual identification code 10 c. Furthermore, the electronic component 10 is printed with an individual identification 2D code 10e displaying a variety display name 10b in a two-dimensional code and an individual identification 2D code 10e displaying an individual identification code 10c in a two-dimensional code. By setting the coding system from 1-dimensional to 2-dimensional, the number of characters that can be displayed can be increased. Therefore, the amount of information displayed on the electronic component 10 can be increased. In addition, the personal identification information refers to information such as a trademark or logo marked on the electronic component 10, text information such as a manufacturer's name, digital information such as a model or serial number, and a batch number of the electronic component, which can identify the electronic component and other electronic components . The attributes such as the content or arrangement of the text are not particularly limited, and can be set for each electronic component 10. FIG. 5 is a block diagram of electrical control of the electronic component inspection device 1. In FIG. 5, the electronic component inspection device 1 includes a control unit 51 that controls the operation of the electronic component inspection device 1. In addition, the control unit 51 includes a CPU (Central Processing Unit) 58 that performs various arithmetic processes as a processor, and a memory 59 that stores various information. Furthermore, the stage driving device 60, the conveyor driving device 61, the holding portion driving device 62, the code reader 17, the information input device 51b, the information display device 48, the information display device 51a, the information output device 65, and the electrical inspection The device 50 is connected to the CPU 58 via an input-output interface 66 and a data bus 67. In addition, the communication between the electrical inspection device 50 and the control unit 51 may include GP-IB (General Purpose Interface Bus), RS-232C (Recommended Standard-232C), DIO (Digital In And Out: digital input and output (digital I / O) communication. The communication between the inspection unit 1a and the transport unit 1b may be performed using GP-IB communication. The communication between the code reader 17 and the control unit 51 may also be performed using RS-232C, USB (Universal Serial Bus), or LAN (Local Area Network). The stage driving device 60 drives the tray moving stage 14 and a tray lifting stage 68 provided on the tray holding portion 16. Each stage is provided with a device for detecting the position. In addition, the stage driving device 60 can move the stage to a desired place by moving the stage until the tray holding portion 16 is stopped and stopped. In addition, the stage driving device 60 drives the material Y stage 27, the material X stage 23, and the material Z stage 69 provided in the material electronic component holding portion 28. Further, the stage driving device 60 drives the removal Y stage 31, the removal X stage 24, and the removal Z stage 70 provided in the removal electronic component holding portion 32. In addition, the stage driving device 60 can move the carrier until the place where the object is moved to move the supply electronic component holding portion 28 and the removed electronic component holding portion 32 to a desired location and stop. The stage driving device 60 drives the first shuttle stage 36, the second shuttle stage 41, the measurement X stage 46, and the measurement Z stage 71 provided in the inspection electronic component holding unit 47. The stage driving device 60 is capable of moving the electronic components 10 between the first shuttle stage 36, the second shuttle stage 41, and the inspection socket 34 by driving the stages. The conveyor driving device 61 drives the first to sixth conveyors 3 to 8. The conveyor driving device 61 can drive each conveyor to move the conveyor until the tray 9 reaches the moving destination, and move the tray 9 to a desired place and stop. The holding part driving device 62 drives the tray holding part 16, the supplied electronic part holding part 28, the removed electronic part holding part 32, and the inspection electronic part holding part 47. The holding part driving device 62 drives a vacuum pump connected to each holding part. Then, a valve provided between each holding portion and the vacuum pump is driven to open and close the valve. Thereby, the holding part driving device 62 can release the electronic component 10 after being held in each holding part. The information output device 65 is a device which is connected to an external device and has an interface function of outputting information as an electrical signal to the external device. The memory 59 is a semiconductor memory including a RAM (Ramdom Access Memory), a ROM (Read Only Memory), or a hard disk, or a DVD-ROM (Digital Video Disc-Read Only Memory) : Digital Video Disc-Read Only Memory) concept of external memory device. A memory area in which program software 72 described in a control program of the operation of the electronic component inspection device 1 is stored is set functionally. In addition, a memory area is provided in which the individual identification data 75 that is the data of the individual identification code 10c provided in the electronic component 10 is detected. In addition, a memory area or other various memory areas that function as a work area, a temporary file, or the like for use by the CPU 58 are set. The CPU 58 is a controller that checks the electronic component 10 based on the program software 72 stored in the memory 59. The stage control unit 76 is provided as a specific function realization unit. The stage control unit 76 communicates with the stage driving device 60 and obtains position information of each stage. Next, a command signal is output to the stage driving device 60 so that each stage moves to a place desired by the stage control section 76 and stops. The stage control unit 76 communicates with the conveyor driving device 61 and obtains position information of the first conveyor 3 to the sixth conveyor 8. Then, each conveyor is moved to a place desired by the stage control unit 76 and stopped to output a command signal to the conveyor driving device 61. The CPU 58 includes a holding control unit 77. The holding control section 77 drives the tray holding section 16, the supplied electronic component holding section 28, the removed electronic component holding section 32, and the inspection electronic component holding section 47 with the holding section driving device 62. Next, control is performed on the operation of causing the electronic component 10 to be adsorbed on each holding portion and the operation of releasing. Next, the stage control section 76 and the holding control section 77 cooperate to transport the electronic component 10. The CPU 58 includes an information display control unit 81. The information display control unit 81 displays the calculated individual identification data 75 on the information display device 48 and the information display device 51a. In addition, the CPU 58 includes an electronic component information generation and transmission unit 82. The electronic component information generation and transmission unit 82 outputs the individual identification data 75 to an external device via the information output device 65. The electronic component information generating and transmitting unit 82 can generate electronic component information. The electronic component information generating and transmitting section 82 may send the electronic component information to the inspection section 1 a that inspects the electronic component 10. The electronic part information includes an individual identification 2D code 10e. Electronic part information contains location information in addition to the individual identification 2D code 10e. The part information is, for example, a code of a recessed part of the inspection socket 34 when the electronic part 10 is inspected by the inspection part 1a. In addition, the electronic component information may include, in addition to the individual identification information, information on a transfer path of the electronic component 10 of the transfer unit 1b. According to this, the transportation path map of the electronic component 10 can be created based on the electronic component information. Furthermore, traceability can be established based on the inspection results. The conveyance path information of the electronic component 10 refers to the encoding and arrangement of the tray 9 at the time of supply, the encoding and arrangement of the tray 9 at the time of recycling, the encoding of the recess of the inspection socket 34, the inspection order, and the type of inspection. In addition, the transportation route information may be recorded in the electronic component 10. The electronic component information generation and transmission unit may send an individual identification 2D code (electronic component information) 10e to the inspection unit 1a based on a signal from the inspection unit 1a. The inspection unit 1a may memorize (associate) the result of inspecting the electronic component 10 with the individual identification 2D code 10e. Accordingly, the individual identification information of the electronic component 10 can be transmitted to the inspection unit 1a before the inspection is performed. In addition, in this embodiment, although the above-mentioned functions are realized by the program software using the CPU 58, when the above-mentioned functions can be realized by a separate electronic circuit (hardware) without using the CPU 58, such electronics can also be used. Circuit. FIG. 6 is a diagram showing an example of a setting screen of the code reader 17. A setting method of the code reader 17 will be described based on FIG. 6. In the "2D Code Setup" screen G1 shown in Fig. 6, for example, it includes a "2D Code Use existence" selection area RA1, "Processing of reading error" ) "Selection area RA2," Shuttle 1 setup "selection area RA3. In the example shown in FIG. 6, the selection area RA1 includes a text string of "Valid", an option button RB1 corresponding to the text string, and a text string of "Invalid", and The text string creates the corresponding option button RB2. The operator taps (clicks) one of the two option buttons (option button RB1 and option button RB2) displayed in the selection area RA1, thereby selecting whether or not to use the 2D code. When the option button RB2 is set, it is a normal operation, and reading of the personal identification 2D code 10e is not performed. In the selection area RA2, a text string containing "Instant error stop", an option button RB3 corresponding to the text string, a text string containing "Continuation reading error", and the text are included. Create a corresponding option button RB4, an input box N1 for receiving error types, and an input box N2 for receiving consecutive errors. The operator touches (clicks) one of the two option buttons (the option button RB3 and the option button RB4) displayed in the selection area RA2 to set the processing when a read error occurs. The operator inputs arbitrary numerical values to be displayed in two input boxes (input box N1 and input box N2) in the selection area RA2, thereby setting processing when a reading error occurs. The operator performs processing when the reading of the personal identification 2D code 10e in the selection area RA2 fails. When the option button RB3 is set, once a reading error occurs, the error will be stopped immediately. When the option button RB4 is set, the error is stopped when the number of times set in the input box N2 is continuously generated. The value set in the input box N1 is an error type code written in the recesses 37 and 42 where the error was read. The inspection of the electronic component 10 written with the wrong type is not performed. The code reader 17 is equipped with an automatic retry function. In the selection area RA3, a text string of "Reading position", an input box N3 corresponding to the text string, a "Move" button BT1, and a "Reg." Button BT2 are included. , "Wait Time" text string, input box N4 corresponding to the text string, "Shuttle 1 row A" selection area RA4, and "Shuttle 1 row B" "Select area RA5. The "Shuttle 1 row A" selection area RA4 includes a "Read" button BT3, and an output box S1 and an output box S2 corresponding to the button. The operator designates the position at which the individual identification 2D code 10e of the electronic component 10 placed on the -Y side of the supply recesses 37a, 42a is read (the positions of the first and second shuttle stages 36, 41). By clicking the button BT2, the current positions of the first and second shuttle carriers 36, 41 can be registered. After the first and second shuttle carriers 36 and 41 have moved to the reading position, the operator waits for a specified time and executes reading. The operator clicks the button BT1. The first and second shuttle stages 36 and 41 move to the reading position. The operator clicks the button BT2. The value of the input box N3 is updated with the current positions of the first and second shuttle carriers 36, 41. The operator clicks the button BT3. The code reader 17 is in a state where reading is repeatedly performed. If the personal identification 2D code 10e is successfully read, the read personal identification 2D code 10e is displayed in the output box S1 on the right side of the button BT3, and the time taken for reading is displayed in the output box S2 below it. The shorter the read time, the better the read conditions (less internal retries). If the reading fails, it is displayed as "reading error" in the output box S1. The "Shuttle 1 row B" selection area RA5 includes a "Read" button BT4, and an output box S3 and an output box S4 corresponding to the button. Since the selection area RA5 has the same function as the selection area RA4, description thereof is omitted. The "Shuttle 2 setup" selection area RA6 has the same function as the selection area RA3, so the description is omitted. In the "Log File Save" selection area RA7, it contains the text string of "Enable", the option button RB5 corresponding to the text string, the text string of "Disable", and the The text string establishes a corresponding option button RB6. The operator taps (clicks) one of the two option buttons (option button RB5 and option button RB6) displayed in the selection area RA7, thereby setting whether the log file is saved or not. The transfer unit 1b stores the information of the individual identification 2D code 10e and the inspection result as log data in the control unit 51 during a specific period. For example, save as "Barcodexx1, Site1, Bin1, Barcodexx2, Site2, Bin3" "Barcodexx3, Site3, Bin1, Barcodexx4, Site4, Bin6". Next, registration of the reading position will be described. The reading position is adjusted according to the "Reading position" and "Wait Time" of the selection area RA3 of the screen G1. First, the electronic component 10 which is an inspection target is inserted into the -Y side of the material-receiving recess 37 a of the first shuttle stage 36. When the button BT1 is pressed, the first shuttle stage 36 is moved to the -Y side of the supply recess 37a. Next, by setting the waiting time arbitrarily in the input box N4 and pressing the button BT3, one of the corresponding readers 17 starts continuous reading at a set interval. When setting the value by inputting, repeatedly input the value of "Reading position" into the input box N3, and press the button BT1 to adjust to the reading position. When the first shuttle carrier 36 is set by hand movement, the first shuttle carrier 36 is moved to a readable position, and the position is registered with the button BT2. Specifically, first, the button BT3 is clicked to start reading. Next, the first shuttle stage 36 is moved by hand to find a reading position. Next, while confirming the individual identification 2D code 10e displayed on the output box S1 and the processing time displayed on the output box S2, find the optimal position. Next, register the position with the button BT2. Next, change the value of input box N3. Next, confirm again with the button BT1. Next, the position on the second shuttle stage 41 side is also registered in the same manner. Check whether the individual identification 2D code 10e can be read when actually flowing into the electronic component 10. When reading fails, adjust the value of input box N3 or input box N4 to find the best setting. The first and second shuttle carriers 36 and 41 that the electronic component 10 enters move in one step at a time in a step operation. With the code reader 17, the individual identification 2D code 10e of the electronic component 10 before inspection is read on the first and second shuttle stages 36, 41. The individual identification 2D code 10e is transmitted to the inspection unit 1a after the inspection is started via the GP-IB. In addition, the reading of the individual identification 2D code 10e may be performed after the inspection. The transfer unit 1b transmits the individual identification 2D code 10e and the part information to the inspection unit 1a. The conveyance unit 1b layers the electronic components 10 based on the inspection result of the inspection unit 1a. The inspection results are sent, for example, in the format of "Site1, Bin1, Site2, Bin3, Site3, Bin1, Site4, Bin6". (Inspection method of electronic components) Next, a method of inspecting electronic components using the above-mentioned electronic component inspection device will be described with reference to FIGS. 7 and 8. FIG. 7 is a flowchart showing a method for inspecting electronic parts. FIG. 8 is a diagram showing a communication sequence between the conveyance section 1b and the inspection section 1a. First, as shown in FIG. 7, step S10 corresponds to a tray setting step. This step is a step in which the operator sets the tray 9 on the first conveyor 3. Then, the process proceeds to step S20. Step S20 is equivalent to a marker imaging step. This step is a step in which the code reader 17 reads the individual identification 2D code 10e of the electronic component 10. Then, the process proceeds to step S30. Step S30 corresponds to an inspection step. In this step, the transfer unit 1b transfers the electronic component 10 to the inspection socket 34, the inspection unit 1a checks the electrical characteristics of the electronic component 10, and the transfer unit 1b stores the inspected electronic component 10 in the tray 9. Then, the process proceeds to step S40. Step S40 corresponds to the empty tray moving step. This step is a step in which the tray conveyance unit 11 moves the empty tray 9 between the first conveyor 3 to the sixth conveyor 8. Then, the process proceeds to step S50. Step S50 is equivalent to a tray removal step. This step is a step in which the operator removes the tray 9 containing the inspected electronic parts 10 from the fourth conveyor 6 to the sixth conveyor 8. With the above steps, the step of inspecting the electronic component 10 ends. Next, a method of inspecting the electronic component 10 will be described in detail corresponding to the steps shown in FIG. 7. Step S10 is a tray setting step. The operator arranges the electronic components 10 on the tray 9. After the electronic component 10 is scheduled, an electrical property checker is to be performed. Next, the operator places the tray 9 on which the electronic components 10 are installed on the first conveyor 3. Step S20 is the identification photographing step. In step S20, the stage control unit 76 drives the first conveyor 3 with the conveyor driving device 61 and brings the tray 9 close to the electronic parts removal and supply unit 20. Next, the stage control unit 76 moves the first shuttle stage 36 by the stage driving device 60. Next, the material supply recessed portion 37 a is moved within the movement range of the material supply electronic component holding portion 28. Next, the stage control section 76 and the holding control section 77 drive the electronic component supply section 29 with the stage driving device 60 and the holding section driving device 62 to move the four electronic components 10 on the tray 9 to the supply recesses 37a. Next, the stage control unit 76 moves the first shuttle stage 36 by the stage driving device 60. The code reader 17 emits and scans light 17a on the product 2D code 10d and the individual identification 2D code 10e (see FIG. 3). In addition, the code reader 17 receives the reflected light and converts the light intensity signal of the reflected light into text information displayed by the barcode. The text information is the personal identification data 75. The CPU 58 reads text information from the code reader 17 and stores the text information in the memory 59. Even if the transportation unit is stopped due to a blockage, and the electronic parts are stuck in the transportation area, the electronic parts whose individual identification 2D code has been photographed can continue to operate because the control unit of the transportation unit stores the individual identification 2D code. When the barcode reader cannot read the personal identification 2D code of the electronic part, the inspection part 1a does not inspect the electronic part 10, and the transport part 1b stores the electronic part 10 on a tray placed on the fourth conveyor 6 as a specific placement part 9. Alternatively, the storage place may be a arbitrarily set place. In this embodiment, although the electronic component 10 judged to be defective is stored in the tray 9 placed on the fourth conveyor 6, a tray 9 for re-inspection may be newly installed and stored there. Accordingly, when the personal identification 2D code 10e is read but the personal identification 2D code 10e cannot be recognized, after the electronic component 10 is transported to the inspection socket 34, the personal identification 2D code 10e is not sent to the inspection unit 1a. With this, the inspection unit 1 a can determine whether the electronic component 10 is classified as defective or re-inspected. For example, when the electronic component 10 is inspected before the inspection and it is judged that it is defective, it may be evacuated without inspection. Step S30 is an inspection step. In step S30, the stage control unit 76 moves the first shuttle stage 36 with the stage driving device 60, and moves the supply recess 37a to the inspection socket 34. Next, the stage control section 76 and the holding control section 77 drive the electronic component pressing device 43 with the stage driving device 60 and the holding section driving device 62. Next, the holding control unit 77 holds the electronic component 10 by the inspection electronic component holding unit 47. Next, the stage control unit 76 moves the measurement X stage 46 and the measurement Z stage 71 to move the electronic component 10 from the material-receiving recess 37 a to the inspection socket 34. Next, the stage control unit 76 presses the electronic component 10 against the inspection socket 34 with the electronic component pressing device 43. Thereby, the probe of the inspection socket 34 and the terminal of the electronic component 10 are conducted. Next, a communication sequence between the transfer unit 1b and the inspection unit 1a will be described based on FIG. First, as shown in FIG. 8, in step S100, the transfer unit 1 b arranges the electronic component 10 at the inspection socket 34, and then sends the inspection to the inspection unit 1 a to start inspection. Next, in step S110, the inspection unit 1a sends a request for the individual identification 2D code 10e to the transport unit 1b. The inspection unit 1a inquires the transfer unit 1b of the code of the inspection socket 34 provided with the electronic component 10. The individual identification 2D codes 10e of all the electronic components 10 provided in the inspection socket 34 are read. For example, a character string of "BARCODE?" Is transmitted from the inspection unit 1a to the transport unit 1b according to the GP-IB communication standard. The individual identification 2D code 10e of the electronic component 10 of the designated inspection socket 34 is read. For example, send "BARCODE: S #?" As an instruction. The code of the inspection socket 34 is assigned to the S # portion. Next, in step S120, the transfer unit 1b sends the individual identification 2D code (electronic component information) 10e stored in the control unit 51 to the inspection unit 1a. The transport unit 1b notifies the inspection unit 1a of the code of the inspection socket 34 provided with the electronic component 10. The individual identification 2D codes 10e of all the electronic components 10 provided in the inspection socket 34 are transmitted. For example, send "BARCODE: S # _xxxxx, S # _xxxxx, ...;" as an instruction. Specifically, "BARCODE: S1_1234567890, S2_, S3_1000234585, S4_1100345478;" is sent. The individual identification 2D code 10e of the electronic component 10 of the designated inspection socket 34 is transmitted. For example, send "BARCODE: S # _xxxxx;" as an instruction. Specifically, "BARCODE: S1_1234567890;" is transmitted. The code of the inspection socket 34 is assigned to the S # section, and the individual identification 2D code 10e stored in the control section 51 of the transport section 1b is transmitted to the inspection section 1a according to the GP-IB communication standard. Next, in step S130, the inspection unit 1a confirms whether the individual identification 2D code 10e received from the transfer unit 1b is correct, and therefore returns the individual identification 2D code 10e received from the transfer unit 1b to the transfer unit 1b. The inspection unit 1a transmits the individual identification 2D code 10e received from the transport unit 1b to the transport unit 1b. For example, send "ECHO S # _xxxxx, S # _xxxxx, ...;" as an instruction. Specifically, "ECHO S1_1234567890;" is transmitted. Next, in step S140, the transfer unit 1b compares the individual identification 2D code 10e sent to the inspection unit 1a with the individual identification 2D code 10e received from the inspection unit 1a, and responds to whether the inspection unit 1a has been correctly transmitted to the inspection unit 1a. It is confirmed whether the individual identification 2D code 10e sent by the transporting section 1b is equal to the individual identification 2D code 10e received by the inspection section 1a. For example, "ECHOOK" is sent when the situation is equal, and "ECHONG" is sent when the situation is not the same. Specifically, it is judged whether the data of the ECHO instruction and the BARCODE instruction match. If it matches, it returns "ECHOOK". Returns "ECHONG". Next, the electrical inspection device 50 communicates with the electronic component 10 to inspect the electrical characteristics of the electronic component 10. The inspection unit 1 a inspects the electronic component 10. Next, in step S150, the inspection unit 1a notifies the transport unit 1b of the inspection result of the electronic component 10. Next, in step S160, the transport unit 1b sends the inspection result to the inspection unit 1a to confirm whether the inspection result data received from the inspection unit 1a is correct. Next, in step S170, the inspection unit 1a compares the inspection result sent to the transport unit 1b with the inspection result received from the transport unit 1b and responds to whether the transport unit 1b has been correctly transmitted to the transport unit 1b. While the electrical inspection device 50 inspects the electrical characteristics of the electronic component 10, the stage control unit 76 moves the first shuttle stage 36 and moves the recessed portion 37 b for removal to the inspection socket 34. Next, the stage control unit 76 moves the second shuttle stage 41. Next, the supply recess 42 a is moved to the moving range of the supply electronic component holding portion 28. Next, the stage control section 76 and the holding control section 77 drive the electronic component supply section 29 with the stage driving device 60 and the holding section driving device 62 to move the four electronic components 10 on the tray 9 to the second shuttle platform. 41 的 Supply recess 42a. Next, the stage control unit 76 moves the second shuttle stage 41 by the stage driving device 60 to move the supply recess 42 a to the inspection socket 34. Next, the transfer unit 1b stands by until the inspection of the electronic component 10 is completed. After the inspection of the electronic component 10 is completed, the stage control unit 76 moves the measurement X stage 46 and the measurement Z stage 71 with the stage driving device 60 to move the electronic component 10 from the inspection socket 34 to the first shuttle stage. The material removal recess 37b of 36. The inspection unit 1a memorizes (associates) the results of the inspection of the electronic component 10 with the individual identification 2D code 10e. Next, the stage control section 76 and the holding control section 77 drive the electronic component pressing device 43 with the stage driving device 60 and the holding section driving device 62. then. The holding control portion 77 holds the electronic component 10 located in the material-receiving recess portion 42 a by the inspection electronic component holding portion 47. Next, the stage control unit 76 moves the measurement X stage 46 and the measurement Z stage 71 by the stage driving device 60 to move the electronic component 10 from the material recess 42 a to the inspection socket 34. Next, the stage control section 76 presses the electronic component 10 against the inspection socket 34 with the inspection electronic component holding section 47. At this time, the probe of the inspection socket 34 is electrically connected to the terminal of the electronic component 10. Next, the electrical inspection device 50 communicates with the electronic component 10 to inspect the electrical characteristics of the electronic component 10. While the electrical inspection device 50 checks the electrical characteristics of the electronic component 10, the stage control unit 76 moves the second shuttle stage 41 with the stage driving device 60. Next, the stage driving device 60 moves the material-removing recessed portion 42 b to the inspection socket 34. Next, the stage control unit 76 moves the first shuttle stage 36 by the stage driving device 60. Next, the stage driving device 60 moves the material-removing recessed portion 37 b to the moving range of the material-removing electronic component holding portion 32. Next, the stage control section 76 and the holding control section 77 hold the electronic component 10 in the removed electronic component holding section 32. As a result of the electrical property inspection, when the electronic component 10 being inspected is a good product, the stage control section 76 uses the electronic component removing section 33 to place the electronic component 10 on the tray 9 on the fifth conveyor 7 or the sixth conveyor 8. . As a result of the inspection of the electrical characteristics, when the electronic component 10 is a defective product, the stage control section 76 uses the electronic component removing section 33 to place the electronic component 10 on the tray 9 on the fourth conveyor 6. In addition, a plurality of arrangement areas may be arranged on one tray 9, and the conveyance unit 1 b may arrange the electronic components 10 according to the degree of classification. Next, the stage control unit 76 drives the first shuttle stage 36 by the stage driving device 60 to move the supply recess 37 a to the movement range of the supply electronic component holding portion 28. In this way, the electronic component supply unit 29, the first shuttle stage 36, the second shuttle stage 41, and the electronic component pressing device 43 move the electronic component 10 from the tray 9 on the first conveyor 3 to the inspection socket 34. Next, the inspection socket 34 and the electric inspection device 50 inspect the electrical characteristics of the electronic component 10. Next, the electronic component pressing device 43 moves the electronic component 10 from the inspection socket 34 to the first shuttle stage 36 or the second shuttle stage 41. Next, the electronic component removing section 33 moves the electronic component 10 from the first shuttle stage 36 or the second shuttle stage 41 to the tray 9 on the fourth conveyor 6 to the sixth conveyor 8. This operation is sequentially repeated to check the electrical characteristics of the electronic component 10. In addition, the determination result of the electrical property inspection of each electronic component 10 is stored in the memory 59 and displayed on the information display device 48 and the information display device 51a. In addition, the determination result of the electrical property inspection can be output from the memory 59 to an external device through the information output device 65. Next, returning to FIG. 7, step S40 is an empty tray moving step. In step S40, the stage control unit 76 moves the tray to move the stage 14 by the stage driving device 60, and drives the first conveyor 3 by the conveyor driving device 61. Next, the stage control section 76 moves the tray 9 and the tray holding section 16 so that the empty tray 9 and the tray holding section 16 face each other by moving the electronic component 10. Next, the stage control unit 76 drives the tray raising and lowering stage 68 provided on the tray holding unit 16 by the stage driving device 60 to lower the tray holding unit 16. Next, the stage control section 76 outputs a command signal to the holding section driving device 62 to hold the tray 9 by the tray holding section 16. Next, the stage control section 76 outputs a command signal to the stage driving device 60 and the holding section driving device 62 to move the tray 9 to the second conveyor 4 or the third conveyor 5. When the tray 9 on the fourth conveyor 6 to the sixth conveyor 8 has no place for placing the electronic components 10 and there is a place where the tray 9 is installed, the stage control unit 76 outputs a command signal to the stage driving device 60, The conveyor driving device 61 and the holding portion driving device 62. Next, the stage control unit 76 moves the tray 9 from the second conveyor 4 and the third conveyor 5 to the fourth conveyor 6 to the sixth conveyor 8. Next, step S50 is a tray removal step. In step S50, the stage control section 76 outputs a command signal to the conveyor driving device 61. Next, the stage control unit 76 drives the fourth conveyor 6 to the sixth conveyor 8 with the conveyor driving device 61, and moves the tray 9 on which the electronic components 10 are placed to the outside of the cover 53. Next, the operator removes the tray 9 on which the electronic components 10 are placed from the electronic component inspection apparatus 1 and transports them to the work place in the next step. With the above steps, the step of inspecting the electronic component 10 ends. According to this embodiment, a code reader 17 is added, and the individual identification 2D code 10e described in the electronic component 10 is read by the code reader 17, and the individual identification 2D code 10e read by the code reader 17 is sent during inspection. It goes to the inspection section 1a, so the individual identification 2D code 10e of the electronic component 10 can be recorded (associated) with the inspection result. Thereby, the individual of the electronic component 10 and the records inspected by the inspection section 1a can be confirmed later, and the transporting section 1b can also perform the individual management of the electronic component 10 that performs the inspection. As a result, the traceability of the electronic component 10 can be established, and the quality of each electronic component 10 can be managed. When information is written to the electronic component 10 based on the results of the inspection performed by the inspection unit 1a, the data written to each individual electronic component 10 can be confirmed later. (Second Embodiment) This embodiment is different from the first embodiment in the installation portion of the code reader 17. The description of the same points as the first embodiment is omitted. FIG. 9 is a schematic plan view showing the structure of an electronic component inspection device according to the second and third embodiments. The code reader 38 in this embodiment is provided below the first support beam 22 (the material-supply electronic component holding portion 28). The code reader 38 is mounted on a lower portion of the first support beam 22 via a metal member (not shown) and is screwed (not shown). The code reader 38 can read the individual identification 2D code 10e of the electronic component 10 placed on the first and second shuttle stages 36 and 41. The code reader 38 can read the individual identification 2D code 10e of the electronic component 10 transferred to the first and second shuttle carriers 36 and 41 by the movement of the first support beam 22. Thereby, since the individual identification 2D code 10e is read by one code reader 38, the cost can be suppressed. In addition, if the code reader 38 is installed on the material supply Y stage 27 of the electronic component material supply unit 29, the material supply Y stage 27 becomes heavy and the moving speed is reduced. Therefore, in this structure, the time taken for the electronic component supply unit 29 to move the electronic component 10 is extended. Compared with this structure, in the present embodiment, since the code reader 38 is provided on the first support beam 22, the electronic component 10 can be moved with better productivity. (Third Embodiment) The difference between this embodiment and the first embodiment is the installation location of the code reader 17. The description of the same points as the first embodiment is omitted. The code reader 49 of this embodiment is provided on the top plate (base 2) of the conveying section 1b as shown in FIG. The code reader 49 is mounted on the base 2 via a metal member (not shown) and is screwed (not shown). The code reader 49 can read the individual identification 2D code 10e of the electronic component 10 held by the supplied electronic component holding portion 28. This is effective when the individual identification 2D code 10e is described on the back surface of the electronic component 10. In addition, it may be combined with the code readers 17, 38 of at least one of the first and second embodiments. In addition, this embodiment is not limited to those described above, and within the technical idea of the present invention, various changes or improvements can be implemented by those having ordinary knowledge in the field. The modification is as follows. (Modification 1) FIG. 10 is a schematic plan view for explaining electronic parts related to this modification. In the above embodiment, the individual identification information of the electronic component 10 is not limited to the individual identification 2D code, and may be, for example, the description shown in FIG. 10. An example of a modification of the electronic component 85 displayed on the individual identification information will be described with reference to FIG. 10. In the first to third embodiments, the two-dimensional individual identification 2D code 10e is printed on the electronic component 10. The coding is not limited to two dimensions, and it can also be set to a one-dimensional barcode. In this modification, as shown in FIG. 10, a character string displaying a manufacturer name 85 a, a variety display name 85 b, and an individual identification code 85 c is printed on the electronic component 85. Furthermore, the electronic component 85 is printed with a bar code 85d that displays a bar code display name 85b and an individual identification bar code 85e that displays an individual identification code 85c by a bar code. In addition, attributes such as the content or arrangement of characters or barcodes are not particularly limited, and are set to each electronic component 85. The code reader 17 emits light 17a to the variety bar code 85d and the individual identification bar code 85e and scans it. (Modification 2) FIG. 11 is a schematic plan view for explaining electronic parts related to this modification. In the above modification 1, the one-dimensional individual identification code 85e is printed on the electronic component 85. As shown in FIG. 11, on the electronic component 88, a character string displaying a manufacturer name 88a, a variety display name 88b, and an individual identification code 88c as individual identification information is printed. The personal identification information reading unit is an imaging device (not shown). Accordingly, at least one of a character, a bar code, and a 2D code can be read as the individual identification information of the electronic component 10. The imaging device is a device in which an objective lens, an autofocus device, a coaxial epi-illumination device, and a CCD (Charge Coupled Device) imaging element are assembled. The imaging device is provided with an objective lens toward the electronic component 88. First, the light emitted from the coaxial epi-illumination device irradiates the electronic component 88. The imaging device inputs light reflected by the electronic component 88 to the objective lens. Next, the autofocus device images the CCD image sensor. The image is converted into an electrical signal by the CCD imaging element, and the imaging device can photograph the electronic component 88. The character string of the manufacturer name 88a, the variety display name 88b, and the individual identification code 88c is preferably a color tone that can be photographed by the imaging device. In this modification, for example, the background is white and the text color is black. A well-known method can be used as a method of calculating the individual identification data 75 from the image captured by the imaging device. (Modification 3) In the above modification 2, the imaging device has a CCD imaging element incorporated therein. The device for converting an image into an electrical signal is not limited to a CCD image sensor. A camera tube or a CMOS (Complementary Metal Oxide Semiconductor) image sensor can be used. Alternatively, an infrared image sensor can be used. It can also be selected according to the photography environment or the printing status of the electronic component 88.

1‧‧‧電子零件檢查裝置1‧‧‧Electronic parts inspection device

1a‧‧‧檢查部1a‧‧‧ Inspection Department

1b‧‧‧搬送部(電子零件搬送裝置)1b‧‧‧Transportation Department (Electronic Parts Transfer Device)

2‧‧‧基台2‧‧‧ abutment

3‧‧‧第1輸送機3‧‧‧The first conveyor

3c‧‧‧第1方向3c‧‧‧1st direction

4‧‧‧第2輸送機4‧‧‧ 2nd conveyor

5‧‧‧第3輸送機5‧‧‧3rd conveyor

6‧‧‧第4輸送機6‧‧‧ 4th conveyor

7‧‧‧第5輸送機7‧‧‧The fifth conveyor

8‧‧‧第6輸送機8‧‧‧ 6th conveyor

9‧‧‧托盤9‧‧‧ tray

10‧‧‧電子零件10‧‧‧Electronic parts

10a‧‧‧製造者名稱10a‧‧‧Maker name

10b‧‧‧品種顯示名稱10b‧‧‧ Variety display name

10c‧‧‧個體識別編碼10c‧‧‧Individual identification code

10d‧‧‧品種2D碼10d‧‧‧ Variety 2D Code

10e‧‧‧個體識別2D碼(個體識別資訊)10e‧‧‧Individual identification 2D code (individual identification information)

11‧‧‧托盤搬送部11‧‧‧Tray Transfer Department

12‧‧‧托盤搬送支持部12‧‧‧Tray Transfer Support Department

13‧‧‧導軌13‧‧‧rail

14‧‧‧托盤移動載台14‧‧‧Pallet moving stage

14a‧‧‧第2方向14a‧‧‧ 2nd direction

15‧‧‧托盤固持支持部15‧‧‧Tray holding support

16‧‧‧托盤固持部16‧‧‧Tray holding section

17‧‧‧讀碼器(個體識別資訊讀取部)17‧‧‧Code Reader (Individual Identification Information Reading Department)

17a‧‧‧光線17a‧‧‧light

18‧‧‧導軌18‧‧‧rail

19‧‧‧導軌19‧‧‧Guide

20‧‧‧電子零件除供材部20‧‧‧Electronic parts except supply department

21‧‧‧導軌21‧‧‧rail

22‧‧‧第1支持樑22‧‧‧ the first support beam

23‧‧‧供材X載台23‧‧‧Supply X carrier

24‧‧‧除材X載台24‧‧‧Except material X carrier

25‧‧‧第1支持部25‧‧‧The first support department

26‧‧‧第2支持樑26‧‧‧ 2nd support beam

27‧‧‧供材Y載台27‧‧‧Supply Y stage

28‧‧‧供材電子零件固持部(固持部)28‧‧‧Supply electronic parts holding part (holding part)

29‧‧‧電子零件供材部29‧‧‧Electronic parts supply department

30‧‧‧第2支持部30‧‧‧ 2nd support department

31‧‧‧除材Y載台31‧‧‧Except material Y stage

32‧‧‧除材電子零件固持部32‧‧‧Excluding electronic parts holding part

33‧‧‧電子零件除材部33‧‧‧Electronic parts removal department

34‧‧‧檢查用插口(電子零件檢查載置部)34‧‧‧ Inspection socket (electronic parts inspection mounting section)

35‧‧‧導軌35‧‧‧rail

36‧‧‧第1梭載台(電子零件搬送部)36‧‧‧The first shuttle carrier (electronic parts transfer department)

37‧‧‧凹部37‧‧‧ recess

37a‧‧‧供材用凹部37a‧‧‧Concave part for material supply

37b‧‧‧除材用凹部37b‧‧‧Recessed recess

38‧‧‧讀碼器(個體識別資訊讀取部)38‧‧‧Code Reader (Individual Identification Information Reading Department)

39‧‧‧導軌39‧‧‧Guide

40‧‧‧導軌40‧‧‧rail

41‧‧‧第2梭載台(電子零件搬送部)41‧‧‧Second shuttle carrier (electronic parts transfer section)

42‧‧‧凹部42‧‧‧ Recess

42a‧‧‧供材用凹部42a‧‧‧ Recess for supply

42b‧‧‧除材用凹部42b‧‧‧Recessed recess

43‧‧‧電子零件按壓裝置43‧‧‧Pressing device for electronic parts

44‧‧‧按壓支持部44‧‧‧Press support

45‧‧‧導軌45‧‧‧rail

46‧‧‧測定X載台46‧‧‧Measurement of X stage

47‧‧‧檢查電子零件固持部47‧‧‧Check the electronic parts holding department

48‧‧‧資訊顯示裝置48‧‧‧ Information Display Device

49‧‧‧讀碼器(個體識別資訊讀取部)49‧‧‧Code Reader (Individual Identification Information Reading Department)

50‧‧‧電特檢查裝置50‧‧‧ Electric special inspection device

51‧‧‧控制部51‧‧‧Control Department

51a‧‧‧資訊顯示裝置51a‧‧‧Information display device

51b‧‧‧資訊輸入裝置51b‧‧‧Information input device

52‧‧‧警告燈52‧‧‧ warning light

53‧‧‧罩體53‧‧‧Cover

54‧‧‧空氣供給部54‧‧‧Air Supply Department

55‧‧‧隔板55‧‧‧ bulkhead

58‧‧‧CPU58‧‧‧CPU

59‧‧‧記憶體59‧‧‧Memory

60‧‧‧載台驅動裝置60‧‧‧stage drive

61‧‧‧輸送機驅動裝置61‧‧‧Conveyor drive

62‧‧‧固持部驅動裝置62‧‧‧holding part driving device

63‧‧‧安裝金屬件63‧‧‧Mounting metal parts

65‧‧‧資訊輸出裝置65‧‧‧ Information output device

66‧‧‧輸入輸出介面66‧‧‧Input and output interface

67‧‧‧資料匯流排67‧‧‧Data Bus

68‧‧‧托盤升降載台68‧‧‧ Pallet lifting platform

69‧‧‧供材Z載台69‧‧‧Supply Z carrier

70‧‧‧除材Z載台70‧‧‧Z material carrier

71‧‧‧測定Z載台71‧‧‧Measurement of Z stage

72‧‧‧程式軟體72‧‧‧Program Software

75‧‧‧個體識別資料75‧‧‧Individual identification information

76‧‧‧載台控制部76‧‧‧ Carrier Control Department

77‧‧‧固持控制部77‧‧‧Fixed Control Department

81‧‧‧資訊顯示控制部81‧‧‧ Information Display Control Department

82‧‧‧電子零件資訊產生發送部82‧‧‧Electronic parts information generation and sending department

85‧‧‧電子零件85‧‧‧Electronic parts

85a‧‧‧製造者名稱85a‧‧‧Name of maker

85b‧‧‧品種顯示名稱85b‧‧‧ breed display name

85c‧‧‧個體識別編碼85c‧‧‧Individual identification code

85d‧‧‧品種條碼85d‧‧‧Barcode

85e‧‧‧個體識別條碼(個體識別資訊)85e‧‧‧Individual identification barcode (individual identification information)

88‧‧‧電子零件88‧‧‧Electronic parts

88a‧‧‧製造者名稱88a ‧ ‧ maker name

88b‧‧‧品種顯示部88b‧‧‧ Variety Display Department

88c‧‧‧個體識別編碼(個體識別資訊)88c‧‧‧ Individual identification number (individual identification information)

BT1‧‧‧按鈕BT1‧‧‧ button

BT2‧‧‧按鈕BT2‧‧‧ button

BT3‧‧‧按鈕BT3‧‧‧ button

BT4‧‧‧按鈕BT4‧‧‧ button

G1‧‧‧畫面G1‧‧‧screen

N1‧‧‧輸入框N1‧‧‧ input box

N2‧‧‧輸入框N2‧‧‧ input box

N3‧‧‧輸入框N3‧‧‧ input box

N4‧‧‧輸入框N4‧‧‧ input box

RA1‧‧‧選擇區域RA1‧‧‧Select Area

RA2‧‧‧選擇區域RA2‧‧‧Select Area

RA3‧‧‧選擇區域RA3‧‧‧Select Area

RA4‧‧‧選擇區域RA4‧‧‧Select Area

RA5‧‧‧選擇區域RA5‧‧‧Select Area

RA6‧‧‧選擇區域RA6‧‧‧Select Area

RA7‧‧‧選擇區域RA7‧‧‧Select Area

RB1‧‧‧選項按鈕RB1‧‧‧Option button

RB2‧‧‧選項按鈕RB2‧‧‧option button

RB3‧‧‧選項按鈕RB3‧‧‧option button

RB4‧‧‧選項按鈕RB4‧‧‧Option button

RB5‧‧‧選項按鈕RB5‧‧‧Option button

RB6‧‧‧選項按鈕RB6‧‧‧option button

S1‧‧‧輸出框S1‧‧‧output box

S2‧‧‧輸出框S2‧‧‧ output box

S3‧‧‧輸出框S3‧‧‧ output box

S4‧‧‧輸出框S4‧‧‧ output box

S10‧‧‧步驟S10‧‧‧step

S20‧‧‧步驟S20‧‧‧step

S30‧‧‧步驟S30‧‧‧step

S40‧‧‧步驟S40‧‧‧step

S50‧‧‧步驟S50‧‧‧step

S100‧‧‧步驟S100‧‧‧step

S110‧‧‧步驟S110‧‧‧step

S120‧‧‧步驟S120‧‧‧step

S130‧‧‧步驟S130‧‧‧step

S140‧‧‧步驟S140‧‧‧step

S150‧‧‧步驟S150‧‧‧step

S160‧‧‧步驟S160‧‧‧step

S170‧‧‧步驟S170‧‧‧step

X‧‧‧方向X‧‧‧ direction

Y‧‧‧方向Y‧‧‧ direction

Z‧‧‧方向Z‧‧‧ direction

圖1係顯示第1實施形態相關之電子零件檢查裝置之構造之模式俯視圖。 圖2係顯示電子零件檢查裝置之構造之概略立體圖。 圖3係讀碼器及第1梭載台之側視圖。 圖4係用以說明電子零件之模式俯視圖。 圖5係電子零件檢查裝置之電性控制方塊圖。 圖6係顯示讀碼器之設定畫面之一例之圖。 圖7係顯示電子零件之檢查方法之流程圖。 圖8係顯示搬送部與檢查部之通信序列之圖。 圖9係顯示第2及第3實施形態相關之電子零件檢查裝置之構造之模式俯視圖。 圖10係用以說明變化例1相關之電子零件之模式俯視圖。 圖11係用以說明變化例2相關之電子零件之模式俯視圖。FIG. 1 is a schematic plan view showing the structure of the electronic component inspection device according to the first embodiment. Fig. 2 is a schematic perspective view showing the structure of an electronic component inspection device. Figure 3 is a side view of the code reader and the first shuttle carrier. FIG. 4 is a schematic plan view for explaining electronic parts. FIG. 5 is a block diagram of the electrical control of the electronic component inspection device. FIG. 6 is a diagram showing an example of a setting screen of a code reader. FIG. 7 is a flowchart showing a method for inspecting electronic parts. FIG. 8 is a diagram showing a communication sequence between the transport section and the inspection section. FIG. 9 is a schematic plan view showing the structure of an electronic component inspection device according to the second and third embodiments. FIG. 10 is a schematic plan view for explaining electronic parts related to Modification 1. FIG. FIG. 11 is a schematic plan view for explaining electronic parts related to Modification 2. FIG.

Claims (9)

一種電子零件搬送裝置,其具有:個體識別資訊讀取部,其可讀取記載於電子零件之上述電子零件之個體識別資訊;檢查部,其檢查上述電子零件;電子零件資訊產生發送部,其可產生包含上述個體識別資訊、且對上述檢查部發送之電子零件資訊,且可將上述電子零件資訊發送至上述檢查部;電子零件檢查載置部配置部,其可配置能夠檢查上述電子零件之電子零件檢查載置部;及電子零件搬送部,其可載置上述電子零件,且向上述電子零件檢查載置部配置部搬送上述電子零件;且上述檢查部可將檢查上述電子零件之結果與上述個體識別資訊一併記憶。An electronic component conveying device includes: an individual identification information reading section that can read the individual identification information of the electronic component described in the electronic component; an inspection section that inspects the electronic component; an electronic component information generation and transmission section that It can generate electronic part information that includes the individual identification information and that is sent to the inspection section, and can send the electronic part information to the inspection section; an electronic parts inspection placement section configuration section that can be configured to inspect the electronic parts. An electronic parts inspection mounting section; and an electronic parts transporting section that can mount the electronic components and transport the electronic components to the electronic parts inspection mounting section arranging section; and the inspection section may compare the results of the inspection of the electronic parts with The individual identification information is memorized together. 如請求項1之電子零件搬送裝置,其中具有:固持部,其固持上述電子零件;且上述個體識別資訊讀取部係讀取被載置於上述電子零件搬送部之上述電子零件、及由上述固持部固持之上述電子零件中至少一者之上述個體識別資訊。For example, the electronic component transfer device of claim 1 includes: a holding portion that holds the electronic component; and the individual identification information reading portion reads the electronic component placed on the electronic component transfer portion, and the electronic component transfer portion The above-mentioned individual identification information of at least one of the above-mentioned electronic parts held by the holding section. 如請求項1或2之電子零件搬送裝置,其中上述個體識別資訊讀取部係讀碼器及攝像裝置中至少一者。For example, the electronic component transfer device according to claim 1 or 2, wherein the individual identification information reading unit is at least one of a code reader and an imaging device. 如請求項1或2之電子零件搬送裝置,其中上述電子零件資訊產生發送部係基於來自上述檢查部之信號,將上述電子零件資訊發送至上述檢查部。For example, the electronic component transfer device of claim 1 or 2, wherein the electronic component information generating and transmitting unit sends the electronic component information to the inspection unit based on a signal from the inspection unit. 如請求項1或2之電子零件搬送裝置,其中於上述個體識別資訊讀取部無法讀取上述電子零件之上述個體識別資訊時,上述檢查部不檢查上述電子零件,且上述電子零件搬送部將上述電子零件載置於特定之載置部。For example, if the electronic component transfer device of item 1 or 2 is requested, when the individual identification information reading unit cannot read the individual identification information of the electronic component, the inspection unit does not inspect the electronic component, and the electronic component transport unit will The above-mentioned electronic component is placed on a specific placement portion. 如請求項1或2之電子零件搬送裝置,其中具有:操作部,其可設定及確認上述個體識別資訊讀取部之讀取位置;且上述操作部具有可進行用以設定上述讀取位置之輸入、及用以確認上述讀取位置之顯示的觸控面板。For example, the electronic component transfer device of claim 1 or 2 includes: an operation section that can set and confirm the reading position of the individual identification information reading section; and the operation section has a function that can be used to set the reading position. Input and touch panel for confirming the display of the reading position. 如請求項1或2之電子零件搬送裝置,其中具有:操作部,其可設定及確認上述個體識別資訊讀取部之讀取位置;且上述操作部具有:輸入部,其可進行用以設定上述讀取位置之輸入;及顯示部,其可進行用以確認上述讀取位置之顯示。For example, the electronic component transfer device of claim 1 or 2 includes: an operation section that can set and confirm the reading position of the individual identification information reading section; and the operation section has: an input section that can be used for setting Input of the above-mentioned reading position; and a display section which can perform a display for confirming the above-mentioned reading position. 如請求項1或2之電子零件搬送裝置,其中於上述電子零件資訊中,除上述個體識別資訊外,並包含上述電子零件搬送裝置中之上述電子零件之搬送路徑的資訊。For example, the electronic component transfer device according to claim 1 or 2, wherein the electronic component information includes, in addition to the individual identification information, information on a transfer path of the electronic component in the electronic component transfer device. 一種電子零件檢查裝置,其具有:個體識別資訊讀取部,其可讀取記載於電子零件之上述電子零件之個體識別資訊;檢查部,其檢查上述電子零件;電子零件資訊產生發送部,其可產生包含上述個體識別資訊、且對上述檢查部發送之電子零件資訊,且可將上述電子零件資訊發送至上述檢查部;電子零件檢查載置部,其可檢查上述電子零件;及電子零件搬送部,其可載置上述電子零件,且向上述電子零件檢查載置部搬送上述電子零件;且上述檢查部可將檢查上述電子零件之結果與上述個體識別資訊一併記憶。An electronic component inspection device includes: an individual identification information reading section that can read the individual identification information of the electronic component described in the electronic component; an inspection section that inspects the electronic component; an electronic component information generation and transmission section that It can generate electronic part information that includes the individual identification information and that is sent to the inspection section, and can send the electronic part information to the inspection section; an electronic parts inspection placement section that can inspect the electronic parts; and electronic part transfer The electronic component can carry the electronic component, and can transfer the electronic component to the electronic component inspection and placing portion; and the inspection unit can memorize the result of the electronic component inspection together with the individual identification information.
TW106132927A 2016-09-29 2017-09-26 Electronic component conveying device and electronic component inspection device TWI670217B (en)

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