JP2010118561A - Component mounting device, program, and abnormality cause investigating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for easily investigating the cause of operation abnormality even when a means of detecting abnormality is not available. <P>SOLUTION: An abnormality cause investigating unit 134 performs a process of replacing a suction nozzle to which suction abnormality occurs with another suction nozzle of the same kind when the abnormality occurs when a component is sucked by the suction nozzle to suck the component to which the abnormality occurs, determining whether abnormality occurs, and determining that the abnormality is caused by the suction nozzle when no abnormality is found, and a process of sucking a component similar to the component to which the suction abnormality occurs with the suction nozzle to which the suction abnormality occurs, determining whether abnormality is caused, and determining that the abnormality is caused by the component when no abnormality is found. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a technology for sucking a component supplied from a component supply unit by a suction nozzle and mounting it on a substrate.

  The suction nozzle provided in the mounting head that moves between the component suction position and the component mounting position sucks the component placed at the component supply position by the component supply unit, and the desired position on the circuit board at the component mounting position. In the component mounting apparatus mounted on the component, there is a case where a suction nozzle holding the component is clogged, a component suction abnormality due to a corner drop or the like, and other various operation abnormalities may occur.

  When such an operation error occurs, circuit board production is interrupted, so the equipment user immediately investigates the cause of the operation error, executes appropriate measures (nozzle cleaning, nozzle replacement, etc.), and resumes production. There is a need to. For this reason, it is very important to shorten the time required for investigating the cause of the abnormal operation and taking countermeasures.

  In this regard, Patent Document 1 describes a technique that includes two transmission sensors and directly measures the presence or absence of a corner drop of the suction nozzle.

JP 2008-78295 A

  In the technique described in Patent Document 1, the presence or absence of a corner of the suction nozzle is directly measured by a transmission sensor. However, a part that does not include such a sensor (for example, a suction nozzle, a component supply unit, or the like) If an abnormality occurs in a device that does not have a sensor, take countermeasures for all candidate parts that are considered to be the cause of operational abnormality (for example, nozzle cleaning, replacement of parts supply unit, etc.), and restore production. Is widely practiced and takes a lot of countermeasures.

  Therefore, an object of the present invention is to provide a technique capable of easily investigating the cause of an operation abnormality even when a means for detecting an abnormality is not provided.

  In order to solve the above problems, the present invention, when an abnormality occurs when a component is sucked by a suction nozzle, replaces the suction nozzle or the component with another one and checks whether there is an abnormality. If there is no error, it is determined that there is a cause of an abnormality in the suction nozzle or component replaced with another one.

  For example, the present invention provides a component mounting device that inspects a component sucked by the suction nozzle and determines whether there is an abnormality when the component supplied from the component supply unit is sucked by the suction nozzle and mounted on the substrate. When it is determined that an abnormality has occurred in the inspection of the first part sucked by the first suction nozzle, at least one of the first suction nozzle and the first part is changed to the first part. If the suction nozzle is replaced with at least one of the second suction nozzle that is different from the suction nozzle and the second part that is different from the first part, and the second part is not abnormal in the inspection, the second part A control unit that performs processing to determine that there is an abnormality in at least one of the first suction nozzle and the first component replaced with at least one of the suction nozzle and the second component It is provided, characterized by.

  As described above, according to the present invention, it is possible to provide a technique capable of easily investigating the cause of an operation abnormality even when a means for detecting an abnormality is not provided.

  FIG. 1 is a schematic view of a component mounting system 100 according to an embodiment of the present invention. As illustrated, the component mounting system 100 includes a component mounting device 110 and a database server 160, and the component mounting device 110 and the database server 160 can transmit and receive information to and from each other via a network 170. Has been.

  FIG. 2 is a schematic diagram of the component mounting apparatus 110. As illustrated, the component mounting apparatus 110 includes a storage unit 120, a control unit 130, an input unit 140, an output unit 141, a communication unit 142, a component mounting unit 143, a pallet 144, and an imaging unit 145. A state detection unit 146.

  The storage unit 120 includes a component mounting information storage region 121, a mounted component information storage region 122, a similarity determination information storage region 123, and an adsorption abnormality status storage region 124.

  In the component mounting information storage area 121, information for specifying the position where the component supply unit is mounted, information for specifying the arrangement of the suction nozzle that sucks the component from the component supply unit, and information for specifying the suction and mounting order of the components Are stored.

  For example, in the present embodiment, a component mounting information table 121a as shown in FIG. 3 (schematic diagram of the component mounting information table 121a) is stored.

  As illustrated, the component mounting information table 121a includes a component supply unit arrangement section 121b, a suction nozzle arrangement section 121e, and a component mounting order section 121i.

  The component supply unit arrangement section 121b stores information for specifying the position where the component supply unit is mounted. For example, the component supply unit arrangement section 124b has a mounting position column 121c and a component type column 121d.

  The mounting position column 121c stores information for specifying a position for mounting a component supply unit that supplies a component specified in a component type column 121d described later. For example, in the present embodiment, predetermined identification information (for example, a position number sequentially assigned from one end of the pallet) is allocated to the position of the pallet on which the component supply unit is mounted, and the identification is performed. Information is stored in the mounting position column 121c.

  The component type column 121d stores information for specifying the type of component to be mounted on the circuit board. Here, in the present embodiment, the part name is stored as information for specifying the type of the part.

  The suction nozzle arrangement section 121e stores information for specifying the position and type of the suction nozzle provided in the mounting head. For example, the suction nozzle arrangement section 121e has a mounting head number column 121f, a nozzle position column 121g, and a nozzle type column 121h.

  The mounting head number column 121f stores information for specifying the mounting head. For example, in this embodiment, an identification number (mounting head number) is allocated to each mounting head of the component mounting apparatus 110, and the allocated identification number is stored in this column.

  The nozzle position column 121g stores information for specifying the position where the suction nozzle of the mounting head specified in the mounting head number column 121f is attached. For example, in this embodiment, in each mounting head, an identification number (nozzle number) is assigned to the position where the suction nozzle is attached, and the assigned identification number is stored in this column.

  The nozzle type column 121h stores information for specifying the type (form) of the suction nozzle attached to the position specified by the nozzle position column 121g of the mounting head specified by the mounting head number column 121f.

  The component mounting order section 121i stores information for specifying the position and order of mounting components supplied from the component supply unit on the circuit board.

  For example, in the present embodiment, the component mounting order section 121i includes the mounting coordinate and angle column 121j, the component supply unit position column 121n, the mounting head number column 121o, the nozzle position column 121p, and the suction / mounting sequence column 121q. And having.

  The mounting coordinate and angle column 121j stores information for specifying the position and angle on the circuit board on which the component supplied from the component supply unit mounted at the position specified in the component supply unit position column 121n described later is mounted. Is done.

  For example, in the present embodiment, the mounting coordinate and angle column 121j includes an x column 121k, a y column 121l, and a θ column 121m, each of which has predetermined coordinates on a circuit board on which a component is mounted. Information for specifying the x-coordinate value, the y-coordinate value, and the angle at which the component is mounted is stored.

  The component supply unit position column 121n stores information for specifying a position on the pallet where a component supply unit that supplies components to be mounted at the position and angle of the board specified by the mounting coordinate and angle column 121j is mounted. . Here, in the present embodiment, information corresponding to the information stored in the mounting position column 121c in the component supply unit arrangement section 121b is stored.

  The mounting head number column 121o stores information for specifying a mounting head that picks up components supplied from the component supply unit mounted at the position specified in the component supply unit position column 121n. For example, in this embodiment, an identification number (mounting head number) assigned to each mounting head of the component mounting apparatus 110 is stored.

  In the nozzle position column 121p, the suction nozzle that sucks the component supplied from the component supply unit mounted at the position specified by the component supply unit position column 121n is attached to the mounting head specified by the mounting head number column 121o. Information for specifying the position is stored.

  The suction / mounting order column 121q stores information for specifying the order in which the suction nozzle sucks the components supplied by the component supply unit mounted at the position specified in the component supply unit position column 121n and mounts them on the circuit board. Is done.

  Returning to FIG. 2, the mounting component information storage area 122 stores mounting component information for specifying the configuration of the component mounted on the circuit board by the component mounting apparatus 110. For example, in the present embodiment, a mounting component information table 122a as shown in FIG. 4 (schematic diagram of the mounting component information table 122a) is stored.

  As illustrated, the mounted component information table 122a includes a component type name column 122b, a component size column 122c, a weight column 122g, and a compatible nozzle column 122h.

  The component type name column 122b stores information for specifying the type of component. Here, in the present embodiment, the part name is stored as information for specifying the type of the part.

  The component size column 122c stores information for specifying the size of the component specified in the component type name column 122b.

  For example, in the present embodiment, the component size column 122c includes an x column 122d, a y column 122e, and an h column 122f, and the width, depth, and height of the component specified in the component type name column 122b. The information for specifying each is stored.

  The weight column 122g stores information for specifying the weight of the component specified in the component type name column 122b.

  In the compatible nozzle column 122h, information for specifying the type (form) of the suction nozzle capable of sucking the component specified in the component type name column 122b is stored.

  Returning to FIG. 2, the similarity determination information storage area 123 stores information for specifying a determination criterion for determining that the target component is similar to the reference component.

  In the present embodiment, a similarity determination criterion table 123a as shown in FIG. 5 (schematic diagram of the similarity determination criterion table 123a) is stored.

  As shown in the figure, in the similarity determination criterion table 123a, as a determination criterion for determining that the target component is similar to the reference component, the record 123b specifying the weight determination criterion, and the size determination And a record 123c specifying the reference.

  The record 123b specifying the weight determination criterion stores information for specifying the range of the weight of the component determined to be similar to the weight of the reference component. For example, in this embodiment, the value of the deviation rate of the weight of the target component with respect to the weight of the reference component (calculated by the following equation (1)) is stored, and the deviation rate is stored. The value (1.0% in this case) or less is used as a determination criterion for determining that the target component is similar to the reference component.

  The record 123c specifying the size determination criterion stores information for specifying the range of the size (volume) of the component that is determined to be similar to the size (volume) of the reference component. For example, in the present embodiment, the value of the deviation rate (calculated by the following equation (2)) of the size (volume) of the target component with respect to the size (volume) of the reference component is stored, and the deviation That the rate is equal to or less than a stored value (here, 5.0%) is a determination criterion for determining that the target component is similar to the reference component.

  Here, in the present embodiment, when the volume of the target component with respect to the reference component satisfies both the weight determination criterion and the size determination criterion, the reference component is used as the reference component. On the other hand, it is determined that the target parts are similar.

  The suction abnormality status storage area 124 stores information for specifying the status of the component suction abnormality when an abnormality occurs when the component is sucked by the suction nozzle.

  Here, in the present embodiment, as the suction abnormality status, information (mounting head number, nozzle position) for identifying the suction nozzle in which the suction abnormality has occurred, and information for identifying the component in which the suction abnormality has occurred (in the component supply unit) The mounting position on the pallet 144 and the component type name) are stored.

  Returning to FIG. 2, the control unit 130 includes an overall control unit 131, a component mounting drive unit 132, an abnormality determination unit 133, and an abnormality cause investigation unit 134.

  The overall control unit 131 controls the storage unit 120, the input unit 140, the output unit 141, the communication unit 142, the component mounting unit 143, the pallet 144, and the imaging unit 145.

  The component mounting drive unit 132 controls the component mounting unit 143 and the pallet 144 according to the component mounting information table 121a and the mounted component information table 122a to mount components on the circuit board.

  The abnormality determination unit 133 determines whether or not the component sucked by the suction nozzle is sucked in a correct posture.

  For example, in this embodiment, the abnormality determination unit 133 acquires imaging data of a component sucked by the suction nozzle from the imaging unit 145, specifies the component sucked by the suction nozzle from the component mounting information table 121a, and specifies If the size of the component is identified from the mounting component information table 122a and the size and angle of the component sucked by the suction nozzle in the imaging data exceed a predetermined threshold, it is determined that the suction abnormality has occurred. judge. Here, with respect to the picked-up component angle, the angle at the time of imaging may be specified in advance from the angle at which the component is supplied from the component supply unit.

  The determination of the suction abnormality is not limited to such a mode. For example, image data of a normally sucked part is stored in the storage unit 120 and is captured by the stored image data and the imaging unit 145. Absorption abnormality may be determined by pattern matching with the image data.

  The abnormality cause investigating unit 134 investigates the cause of an abnormality when a component suction abnormality occurs in the suction nozzle. Here, in the present embodiment, when a suction abnormality of a component occurs in the suction nozzle, the cause of the abnormality is investigated by performing suction while changing either the suction nozzle or the component to another one. .

  For example, in the present embodiment, the abnormality cause investigating unit 134 performs the first process when an abnormality occurs in the suction of the first component by the first suction nozzle provided in the first mounting head. The component mounting portion 143 and the pallet 144 are controlled so that the first component is sucked by the second suction nozzle of the same type (form) as the first suction nozzle provided in the first mounting head. As a result, if the first suction nozzle succeeds in sucking the first component, it can be determined that there is a high possibility that the first suction nozzle is abnormal.

  In addition, as the second process, the abnormality cause investigating unit 134 detects the first suction nozzle when abnormality occurs in the suction of the first component by the first suction nozzle provided in the first mounting head. Thus, the component mounting portion 143 and the pallet 144 are controlled so as to suck a second component similar to the first component. As a result, if the first suction nozzle succeeds in sucking the second component, it can be determined that there is a high possibility that there is an abnormality in the first component or the component supply unit that supplies the first component.

  Then, as a third process, the abnormality cause investigating unit 134, when abnormality occurs in the suction of the first component by the first suction nozzle provided in the first mounting head, the first mounting head The component mounting portion 143 and the pallet 144 are controlled so that the first component is sucked by the third suction nozzle of the same type (form) as the first suction nozzle provided in the second mounting head different from the first mounting head. To do. As a result, if the first suction nozzle succeeds in sucking the first component, it can be determined that there is a high possibility that the first mounting head is abnormal.

  Here, the abnormality cause investigating unit 134 determines that at least in the first process, the second suction nozzle has failed to suck the first component (the first suction nozzle is likely to be abnormal). After that, by performing the third process, it can be determined that there is a high possibility that there is an abnormality in the portion of the first mounting head other than the first suction nozzle.

  For example, as shown in FIG. 6 (schematic diagram showing a parent-child relationship of parts that cause component adsorption abnormality), there is a possibility that component adsorption abnormality may be caused by two parts of the mounting head and the component supply unit. In the case of high, if the abnormal determination of the mounting head is performed at the tip of the suction head which is the child part, when there is a cause of the abnormality in the suction head, the abnormal determination of the mounting head and the abnormal determination of the suction head Abnormality determination must be made and is not efficient.

  Therefore, in the present embodiment, the abnormality determination is performed in order from the part that is a child element of the part that causes the component suction abnormality.

  In addition, when the value obtained from the state detection unit 146, which will be described later, exceeds a predetermined threshold, the abnormality cause investigation unit 134 has an abnormality in the part whose state is monitored by the state detection unit 146. Judge.

  Returning to FIG. 2, the input unit 140 receives input of information.

  The output unit 141 outputs information.

  The communication unit 142 transmits and receives information via the network 170.

  The component mounting unit 143 includes a mounting head including a suction nozzle, an XY robot that moves the mounting head, and a circuit board mounting table on which a circuit board is placed.

  Here, in the present embodiment, as shown in FIG. 7 (schematic diagram of the component mounting portion 143 and the pallet 144), a plurality of mounting heads 143a suck the components from the pallet 144 and place them on the circuit board mounting table 143b. A component adsorbed on the circuit board 180 is mounted.

  Each mounting head 143a is provided with a plurality of suction nozzles 143c as shown in FIG. 8 (schematic diagram of the mounting head 143a).

  The suction nozzle 143c moves in the vertical direction, sucks the component 181 from the component supply unit, and mounts the sucked component on the circuit board.

  As shown in FIG. 7, the pallet 160 mounts a component supply unit 144a, controls the mounted component supply unit 144a, and arranges the component placed on the component supply unit 144a at the suction position of the mounting head 143a. To do.

  For example, the imaging unit 145 is arranged below the suction position where the suction nozzle sucks a component from the component supply unit, images the component sucked by the suction nozzle of the mounting head, and outputs the image to the abnormality determination unit 133.

  The state detection unit 146 detects the states of predetermined parts of the component mounting unit 143 and the pallet 144 and outputs the detected values to the abnormality cause investigation unit 134.

  For example, in the present embodiment, the pressure of the vacuum pump provided in the component mounting unit 143 is measured, and the measured value is output to the abnormality cause investigating unit 134.

  The component mounting apparatus 110 described above includes, for example, an external storage device such as a CPU (Central Processing Unit) 901, a memory 902, and an HDD (Hard Disk Drive) as shown in FIG. 9 (schematic diagram of a computer 900). 903, a reading device 905 for reading / writing information from / to a portable storage medium 904 such as a CD-ROM (Compact Disk Read Only Memory) and a DVD-ROM (Digital Versatile Disk Read Only Memory), a keyboard, a mouse, and the like XY robot, mounting head, and circuit board mounted on a computer 900 having an input device 906, an output device 907 such as a display, and a communication device 908 such as a NIC (Network Interface Card) for connecting to a communication network A component mounting device (not shown) having a table, a pallet device (not shown), and an imaging device such as a camera (shown) Not) and state detection sensor (e.g., by providing a pressure sensor, etc.) attached to a vacuum pump, it can be realized.

  For example, the storage unit 120 can be realized by the CPU 901 using the memory 902 or the external storage device 903, and the control unit 130 loads a predetermined program stored in the external storage device 903 into the memory 902. The input unit 140 can be realized by the CPU 901 using the input device 906, and the output unit 141 can be realized by the CPU 901 using the output device 907. The communication unit 142 can be realized by the CPU 901 using the communication device 908, the component mounting unit 143 can be realized by the CPU 901 using a component mounting device (not shown), and the pallet 144 can be realized by the CPU 901. This can be realized by using a pallet device (not shown). 901 may be realized by utilizing an imaging device (not shown), the state detection unit 146 can be realized by utilizing state detection sensor CPU901 not shown.

  The predetermined program is downloaded from the storage medium 904 via the reading device 905 or from the network via the communication device 908 to the external storage device 903, and then loaded onto the memory 902 and executed by the CPU 901. You may do it. Alternatively, the program may be directly loaded on the memory 902 from the storage medium 904 via the reading device 905 or from the network via the communication device 908 and executed by the CPU 901.

  FIG. 10 is a schematic diagram of the database server 160.

  As illustrated, the database server 160 includes a storage unit 161, a control unit 164, and a communication unit 165.

  The storage unit 161 includes a circuit board master information storage area 162 and a component master information storage area 163.

  The circuit board master information storage area 162 stores, for each circuit board, circuit board master information that identifies a component to be mounted on the circuit board by the component mounting apparatus 110 and a mounting position and an angle of the component.

  The component master information storage area 183 stores component master information for specifying the configuration of the component mounted on the circuit board by the component mounting apparatus 110. For example, in the present embodiment, table information having the same configuration as the mounted component information table 122a as shown in FIG. 4 is stored as component master information.

  The control unit 164 manages information stored in the storage unit 161. In particular, in the present embodiment, in response to a request from the component mounting apparatus 110, circuit board master information stored in the circuit board master information storage area 162 and components stored in the part master information storage area 163 A process of transmitting master information to the component mounting apparatus 110 is controlled.

  The communication unit 165 transmits and receives information via the network 170.

  The database server 160 described above can also be realized by a computer 900 as shown in FIG. 9, for example.

  For example, the storage unit 161 can be realized by the CPU 901 using the memory 902 or the external storage device 903, and the control unit 164 loads a predetermined program stored in the external storage device 903 into the memory 902. The communication unit 165 can be realized by the CPU 901 using the communication device 908.

  The predetermined program is downloaded from the storage medium 904 via the reading device 905 or from the network via the communication device 908 to the external storage device 903, and then loaded onto the memory 902 and executed by the CPU 901. You may do it. Alternatively, the program may be directly loaded on the memory 902 from the storage medium 904 via the reading device 905 or from the network via the communication device 908 and executed by the CPU 901.

  FIG. 11 is a PAD (Problem Analysis Diagram) showing a board production process in the component mounting apparatus 110.

  First, in step S <b> 10, the overall control unit 131 of the component mounting apparatus 110 receives an input of the type of circuit board to be mounted and the number of produced sheets from the user of the component mounting apparatus 110 via the input unit 140.

  Next, in step S <b> 11, the overall control unit 131 accepts an input of a production start instruction via the input unit 140 from the usage manual of the component mounting apparatus 110 via the input unit 140.

  Here, the user of the component mounting apparatus 110 determines the component supply unit necessary for component mounting on the type of circuit board to be mounted according to the information stored in the component supply unit arrangement section 121b of the component mounting information table 121a. The suction nozzle is mounted on the pallet 144, and the suction nozzle is attached to the mounting head according to the information stored in the suction nozzle arrangement section 121e of the component mounting information table 121a, and a production start instruction is input via the input unit 140. .

  Next, in step S12, the component mounting drive unit 132 repeatedly executes the processes in steps S13 to S23 until the component mounting is completed on the production number of circuit boards that have received the input in step S10.

  Next, in step S <b> 13, under the control of the component mounting drive unit 132, the component mounting unit 143 takes in the circuit board on which the component is mounted and places it on the circuit board mounting table.

  Next, in step S14, the component mounting unit 143 and the pallet 144 are controlled by the component mounting drive unit 132 until all components to be mounted on the circuit board captured in step S13 are mounted (component mounting information table 121a). Step S15 to S22 are repeatedly executed.

  Next, in step S <b> 15, the suction nozzle of the component mounting unit 143 sucks the component under the control of the component mounting drive unit 132.

  Next, in step S16, under the control of the component mounting drive unit 132, the imaging unit 145 images the component sucked in step S15.

  Next, in step S17, the abnormality determination unit 133 specifies the parts to be picked up in the order specified in the part mounting order section 121i of the part mounting information table 121a from the part supply unit arrangement section 121b. By specifying the size from the mounting component information table 122a and comparing it with the size and angle of the component specified by the image data captured by the imaging unit 145, the suction nozzle of the mounting head selects the correct component to be suctioned. It is determined whether or not the suction is successful in the posture.

  If true in step S17 (if the component to be sucked is successfully picked up in the correct component posture), the picked-up component is specified in predetermined coordinates (in the component mounting information table 121i) in step S18. Mounted in the mounting coordinates and angle column 121j).

  On the other hand, in the case of false in step S17 (when the component to be sucked is not successfully sucked in the correct component posture), the processing from step S19 to S22 is executed to investigate the cause of the suction abnormality. .

  In step S19, by the control of the component mounting drive unit 132, the component mounting unit 143 determines that the component already sucked by the suction nozzle of the mounting head is sucked in the correct component posture in step S17. Are mounted at predetermined coordinates (specified by the mounting coordinates and angle column 121j of the component mounting information table 121i).

  In step S <b> 20, the abnormality cause investigation unit 134 stores the suction abnormality state in a predetermined area of the storage unit 120. For example, in the present embodiment, as the abnormal suction situation, information for specifying the suction nozzle in which the suction abnormality has occurred (mounting head number, nozzle position), and information for specifying the component in which the suction abnormality has occurred (pallet of the component supply unit) 144, the mounting position and the component type).

  Next, in step S21, under the control of the component mounting drive unit 132, the component mounting unit 143 discards the suction abnormal component (the component that has not been successfully sucked in the correct component posture) by placing it in a predetermined disposal box. To do.

  Next, in step S <b> 22, the abnormality cause investigating unit 134 performs investigation processing for the cause of the occurrence of adsorption abnormality. The process in step S22 will be described in detail with reference to FIG.

  In step S23, under the control of the component mounting drive unit 132, the component mounting unit 143 discharges the circuit board on which the component mounting is completed.

  FIG. 12 is a PAD showing an abnormality cause investigation process.

  First, in step S30, the abnormality cause investigating unit 134 inquires of the state detection unit 146 attached to a part capable of self-diagnosis by performing the processes of steps S31 to S35 described later, and determines whether there is an abnormality. to decide.

  Next, in step S31, the abnormality cause investigating unit 134 performs the processes of steps S32 to S35 described later for all the parts that can be self-diagnosed.

  Next, in step S32, the abnormality cause investigating unit 134 inquires of the state detecting unit 146 installed in a part capable of self-diagnosis and receives a state code (value).

  Next, in step S33, the abnormality cause investigating unit 134 determines from the state code (value) received in step S32 whether there is an abnormality in the part whose state is monitored by the state detecting unit 146.

  In step S33, if true (when it is determined that there is an abnormality), in step S34, the abnormality cause investigating unit 134 specifies in the output unit 141 that the monitored site is the cause of the adsorption abnormality. By outputting the information to be notified, the user of the component mounting apparatus 110 is notified.

  Next, in step S35, the component mounting drive unit 132 stops the processing in the component mounting unit 143 and the pallet 144 according to an instruction from the abnormality cause investigating unit 134, and the user of the component mounting apparatus 110 takes the cause of the suction abnormality. Wait to take action.

  In step S36, the abnormality cause investigating unit 134 performs a diagnosis operation for a part that cannot be self-diagnosis. This diagnostic operation process will be described in detail with reference to FIG.

  FIG. 13 is a PAD showing the diagnostic operation process.

  First, in step S40, the abnormality cause investigating unit 134 checks the suction nozzle for abnormality by executing the processes of steps S41 to S48 described later.

  Next, in step S41, the abnormality cause investigating unit 134 determines whether or not the mounting head including the suction nozzle in which the suction abnormality has occurred includes another suction nozzle of the same type (form) as the suction nozzle in which the suction abnormality has occurred. Is identified from the suction nozzle arrangement section 121e of the component mounting information table 121a.

  Then, in step S41, the abnormality cause investigating unit 134 determines that the result is true (if the mounting head includes another suction nozzle of the same type (form) as the suction nozzle in which the suction abnormality has occurred), step S42. The process of S48 is executed.

  Next, in step S42, the abnormality cause investigating unit 134 uses the other suction nozzle of the same type as the suction nozzle in which the suction abnormality has occurred in the mounting head in which the suction abnormality has occurred. Adsorb parts.

  Next, in step S <b> 43, the picked-up component is imaged by the imaging unit 145, and the captured imaging data is taken into the abnormality determination unit 133.

  Next, in step S44, the abnormality determination unit 133 specifies the size of the component of the component type in which the suction abnormality has occurred from the mounting component information table 122a, and identifies the component specified by the image data captured by the imaging unit 145. By comparing with the size and angle, it is determined whether or not the other suction nozzle described above has succeeded in sucking the component to be sucked in the correct component posture.

  In step S44, if true (when the component to be sucked is successfully sucked in the correct component posture), the abnormality cause investigating unit 134 executes the processes in steps S45 to S47, Investigate the cause of adsorption abnormality.

  On the other hand, if it is false in step S44 (if the component to be sucked is not successfully sucked in the correct component posture), the component mounting unit 143 is controlled by the component mounting drive unit 132 in step S48. Then, the parts determined as abnormal suction are discarded in a predetermined disposal box or the like.

  Next, in step S45, under the control of the component mounting drive unit 132, the component mounting unit 143 mounts the component sucked in step S42 at predetermined coordinates (coordinates scheduled to be mounted when the suction abnormality occurs).

  Next, in step S46, the abnormality cause investigation unit 134 determines that there is a high possibility that the suction nozzle in which the suction abnormality has occurred is the cause of the suction abnormality.

  In step S46, the abnormality cause investigating unit 134 uses the information (mounting head number, nozzle position) specifying the suction nozzle in which the suction abnormality has occurred, stored in the suction abnormality status storage area 124, so that the suction abnormality is detected. Output data for notifying that the generated suction nozzle is likely to cause suction abnormality is generated and output via the output unit 141.

  For example, the abnormality cause investigation unit 134 generates output data 192 as shown in FIG. 14 (schematic diagram of the output data 192 when the suction nozzle is likely to be the cause of the suction abnormality), and outputs it to the output unit 141. Output.

  Here, the output data 192 includes information for identifying the suction nozzle in which the suction abnormality has occurred (mounting head number, nozzle position) and information for identifying the part in which the suction abnormality has occurred (part type). The region 192a for notifying the occurrence of the suction and the other suction nozzle of the mounting head having the suction nozzle in which the suction abnormality has occurred have succeeded in the suction, so the region 192b for notifying that the suction nozzle is abnormal, And an area 192c for notifying a countermeasure in a certain case.

  The abnormality cause investigating unit 134 uses information (a mounting head number and a nozzle position) for identifying the suction nozzle in which the suction abnormality has occurred in a predetermined output data template in the storage unit 120 and the component in which the suction abnormality has occurred. The output data 192 as shown in FIG. 14 may be generated by inserting information (part type) for specifying

  Next, in step S47, the component mounting drive unit 132 stops the processing in the component mounting unit 143 and the pallet 144 according to the instruction of the abnormality cause investigating unit 134, and the user of the component mounting device 110 takes the cause of the suction abnormality. Wait to take action.

  Next, in step S50, the abnormality cause investigating unit 134 checks parts abnormality by executing the processes of steps S51 to S58 described later.

  Next, in step S <b> 51, the abnormality cause investigating unit 134 determines whether another component similar to the component in which the suction abnormality has occurred is present on the pallet 144. Here, the determination of the similar components is performed by determining the difference between the weight specified by the similarity determination table 123a and the volume specified by the component size column 122c of the mounting component information table 122a and the weight specified by the weight column 122g. Judgment is made based on whether or not the deviation rate is smaller than the size, and if there are multiple parts that are less than or equal to these deviation rates, the value of the deviation rate is smaller, or the component is not yet attached to the circuit board, etc. Any similar part is selected according to any selection criteria.

  Then, in step S51, the abnormality cause investigating unit 134 executes the processes of steps S52 to S58 when the result is true (when there is another part similar to the part in which the suction abnormality has occurred in the pallet 144).

  Next, in step S52, the abnormality cause investigating unit 134 sucks the similar part specified in step S51 using the suction nozzle in which the suction abnormality has occurred.

  Next, in step S <b> 53, the picked up similar part is imaged by the imaging unit 145, and the captured imaging data is taken into the abnormality determination unit 133.

  Next, in step S54, the abnormality determination unit 133 specifies the size of the similar component from the mounting component information table 122a and compares it with the size and angle of the similar component specified by the image data captured by the imaging unit 145. Thus, it is determined whether or not the suction nozzle in which the suction abnormality has occurred has succeeded in sucking the similar parts to be sucked in the correct part posture.

  In step S54, if true (successfully sucking a similar part to be sucked in the correct part posture), the abnormality cause investigating unit 134 executes the processes in steps S55 to S57. Investigate the cause of abnormal adsorption.

  On the other hand, if it is false in step S54 (if the component to be sucked is not successfully sucked in the correct component posture), the component mounting unit 143 is controlled by the component mounting drive unit 132 in step S58. Then, the parts determined as abnormal suction are discarded in a predetermined disposal box or the like.

  Next, in step S55, if the similar component is a component that has not yet been attached to the circuit board, the component mounting unit 143 controls the component mounting drive unit 132 to determine the similar component sucked in step S52 as the predetermined component. Attach to the coordinates (coordinates that were planned to be installed when an adsorption abnormality occurred). If similar parts are already attached, the adsorbed similar parts are returned to the parts supply unit or discarded in a disposal box or the like.

  Next, in step S56, the abnormality cause investigating unit 134 determines that there is a high possibility that the component in which the suction abnormality has occurred is the cause of the suction abnormality.

  In step S56, the abnormality cause investigating unit 134 uses the information (the mounting position and the component type on the pallet 144 of the component supply unit) that identifies the component in which the suction abnormality has occurred, which is stored in the suction abnormality state storage area 124. Then, output data for notifying that the suction nozzle in which the suction abnormality has occurred is likely to cause the suction abnormality is generated and output via the output unit 141.

  For example, the abnormality cause investigating unit 134 generates output data 193 as shown in FIG. 15 (schematic diagram of output data 193 when there is a high possibility that the component is causing the suction abnormality), and outputs the output data 193 to the output unit 141. To do.

  Here, the output data 193 includes information for identifying the suction nozzle in which the suction abnormality has occurred (mounting head number, nozzle position) and information for identifying the component in which the suction abnormality has occurred (part type). An area 192a for notifying the occurrence of an abnormality, an area 193b for notifying that there is an abnormality in the component or the component supply unit, and an abnormality in the component or the component supply unit because the suction nozzle in which the suction abnormality has occurred have succeeded in attracting similar parts. And a region 193c for notifying a countermeasure in a certain case.

  The abnormality cause investigating unit 134 uses information (a mounting head number and a nozzle position) for identifying the suction nozzle in which the suction abnormality has occurred in a predetermined output data template in the storage unit 120 and the component in which the suction abnormality has occurred. The output data 193 as shown in FIG. 15 may be generated by inserting the information (the mounting position and the component type on the pallet 144 of the component supply unit).

  Next, in step S57, the component mounting drive unit 132 stops the processing in the component mounting unit 143 and the pallet 144 according to the instruction of the abnormality cause investigating unit 134, and the user of the component mounting device 110 takes the cause of the suction abnormality. Wait to take action.

  Next, in step S60, the abnormality cause investigating unit 134 checks the abnormality of the mounting head by executing the processes of steps S61 to S68 described later.

  Next, in step S61, the abnormality cause investigating unit 134 attaches a suction nozzle of the same type (form) as the suction nozzle in which the suction abnormality has occurred to another mounting head other than the mounting head having the suction nozzle in which the suction abnormality has occurred. It is specified from the suction nozzle arrangement section 121e of the component mounting information table 121a whether or not the other is provided.

  Then, in step S61, the abnormality cause investigation unit 134 is true (when another mounting head includes another suction nozzle of the same type (form) as the suction nozzle in which the suction abnormality has occurred). Steps S62 to S68 are executed.

  Next, in step S62, the abnormality cause investigating unit 134 uses the other suction nozzle of the same type as the suction nozzle in which the suction abnormality has occurred in the other mounting heads to suck the component of the part type in which the suction abnormality has occurred. To do.

  Next, in step S <b> 63, the picked-up component is imaged by the imaging unit 145, and the captured imaging data is taken into the abnormality determination unit 133.

  Next, in step S64, the abnormality determining unit 133 specifies the size of the component of the component type in which the suction abnormality has occurred, from the mounted component information table 122a, and the component specified by the image data captured by the imaging unit 145. By comparing with the size and angle, it is determined whether or not the other suction nozzle described above has succeeded in sucking the component to be sucked in the correct component posture.

  In step S64, if true (when the component to be sucked is successfully sucked in the correct component posture), the abnormality cause investigating unit 134 executes the processes in steps S65 to S67, Investigate the cause of adsorption abnormality.

  On the other hand, if it is false in step S64 (if the component to be sucked is not successfully sucked in the correct component posture), the component mounting unit 143 is controlled by the component mounting drive unit 132 in step S68. Then, the parts determined as abnormal suction are discarded in a predetermined disposal box or the like.

  Next, in step S65, under the control of the component mounting drive unit 132, the component mounting unit 143 mounts the component sucked in step S62 on predetermined coordinates (coordinates scheduled to be mounted when the suction abnormality occurs).

  Next, in step S66, the abnormality cause investigation unit 134 determines that there is a high possibility that the mounting head including the suction nozzle in which the suction abnormality has occurred is the cause of the suction abnormality.

  In step S66, the abnormality cause investigating unit 134 uses the information (mounting head number, nozzle position) that identifies the suction nozzle in which the suction abnormality has occurred, stored in the suction abnormality status storage area 124, so that the suction abnormality is detected. Output data for notifying that the mounting head having the generated suction nozzle is likely to cause suction abnormality is generated and output via the output unit 141.

  For example, the abnormality cause investigation unit 134 generates output data 194 as shown in FIG. 16 (schematic diagram of the output data 194 when the mounting head is likely to be the cause of the suction abnormality), and outputs it to the output unit 141. Output.

  Here, the output data 194 includes information for identifying the suction nozzle in which the suction abnormality has occurred (mounting head number, nozzle position) and information for identifying the part in which the suction abnormality has occurred (part type). Since the suction of the suction nozzle of the other mounting head different from the mounting head having the suction nozzle in which the suction abnormality has occurred and the mounting head having the suction nozzle in which the suction abnormality has occurred (suction abnormality) A region 194b for notifying that there is an abnormality in the portion other than the suction nozzle where the occurrence of the error occurs, and a region 194c for notifying a countermeasure when there is an abnormality in the mounting head.

  The abnormality cause investigating unit 134 uses information (a mounting head number and a nozzle position) for identifying the suction nozzle in which the suction abnormality has occurred in a predetermined output data template in the storage unit 120 and the component in which the suction abnormality has occurred. 16 and the output data 194 as shown in FIG. 16 may be generated by inserting information (part type) for identifying and information (mounting head number) for identifying the mounting head having the suction nozzle in which the suction abnormality has occurred. .

  Next, in step S67, the component mounting drive unit 132 stops processing in the component mounting unit 143 and the pallet 144 according to an instruction from the abnormality cause investigating unit 134, and the user of the component mounting device 110 takes the cause of the suction abnormality. Wait to take action.

  Next, in step S70, the abnormality cause investigating unit 134 determines that an adsorption abnormality has occurred in any of the processes in steps S40 to S68, and the cause of the adsorption abnormality cannot be specified.

  In step S70, the abnormality cause investigating unit 134 specifies the information (mounting head number, nozzle position) for identifying the suction nozzle in which the suction abnormality has occurred and the component in which the suction abnormality has occurred, stored in the suction abnormality status storage area 124. Output data for notifying that the cause of the suction abnormality could not be determined is generated using the information for identifying the component (the mounting position and the component type on the pallet 144 of the component supply unit) and output via the output unit 141 To do.

  For example, the abnormality cause investigating unit 134 generates output data 195 as shown in FIG. 17 (schematic diagram of output data 195 when the cause cannot be investigated) and outputs the output data 195 to the output unit 141.

  Here, the output data 195 includes suction abnormality having information (mounting head number, nozzle position) for specifying the suction nozzle in which the suction abnormality has occurred and information (part type) for specifying the component in which the suction abnormality has occurred. No abnormality was found in the area 195a for notifying the occurrence of suction, the suction nozzle in which the suction abnormality occurred, the component in which the suction abnormality occurred (component supply unit), and the mounting head having the suction nozzle in which the suction abnormality occurred When no abnormality is found in the area 195b for notifying the suction, the suction nozzle in which the suction abnormality has occurred, the component in which the suction abnormality has occurred (component supply unit), and the mounting head having the suction nozzle in which the suction abnormality has occurred And an area 195c for notifying a corresponding plan.

  The abnormality cause investigating unit 134 uses information (a mounting head number and a nozzle position) for identifying the suction nozzle in which the suction abnormality has occurred in a predetermined output data template in the storage unit 120 and the component in which the suction abnormality has occurred. 17 is inserted by inserting information (mounting position and component type on the pallet 144 of the component supply unit) and information (mounting head number) identifying the mounting head having the suction nozzle in which the suction abnormality has occurred. Such output data 195 may be generated.

  Next, in step S71, the component mounting drive unit 132 stops the processing in the component mounting unit 143 and the pallet 144 according to the instruction of the abnormality cause investigating unit 134, and the user of the component mounting device 110 takes the cause of the suction abnormality. Wait to take action.

  As described above, according to the present embodiment, the component mounting device 110 can generate a situation similar to the situation when the abnormal operation occurs, and the cause of the abnormal operation can be narrowed down based on the success or failure of the operation in the situation. The user of the component mounting apparatus 110 can take appropriate measures.

  In the embodiment described above, the state detection unit 146 is provided, and with regard to a part capable of self-diagnosis of the cause of abnormality, the presence or absence of abnormality is determined based on the detection result of the state detection unit 146. However, the present invention is not limited to such an embodiment, and in a component mounting apparatus that does not include the state detection unit 146, it is possible not to perform the processes of steps S30 to S35 in FIG.

  In the embodiment described above, as shown in FIG. 7, an example in which there are a plurality of mounting heads 143a has been shown. However, the present invention is not limited to such an embodiment, and when there is one mounting head 143a. It is also possible not to perform the processing of steps S60 to S68 in FIG.

  Furthermore, the suction nozzle of the same type (form) as the suction nozzle in which the suction abnormality has occurred in the mounting head including the suction nozzle in which the suction abnormality has occurred between Step S68 and Step S70 described in FIG. If a similar part that is similar to the part where the suction abnormality has occurred is sucked and suction is successful, both the suction nozzle where the suction abnormality has occurred and the part (part supply unit) where the suction abnormality has occurred It is also possible to determine that there is a cause.

  Further, between step S68 and step S70 shown in FIG. 13, the same type as the suction nozzle in which the suction abnormality has occurred in another mounting head different from the mounting head having the suction nozzle in which the suction abnormality has occurred ( If a similar part that is similar to the part in which the suction abnormality has occurred is sucked and the suction is successful, the mounting head having the suction nozzle in which the suction abnormality has occurred and the part in which the suction abnormality has occurred It is also possible to determine that there is a cause of the abnormality in both (component supply unit).

  Further, in the embodiment described above, similar parts are specified by the determination criteria stored in the similarity determination information table 123. However, the present invention is not limited to such an aspect. By storing similar part information for specifying similar parts in the storage unit 120, it is possible to specify similar parts not only according to size and weight but also according to part attributes (function, exterior finish, etc.). .

  Furthermore, in the above-described embodiment, the presence / absence of abnormality of a part is determined using a similar part (steps S50 to S58 in FIG. 13). In preparation for the case where there are no parts, at least one test piece for investigating the cause of abnormality may be provided on the pallet 144 or the like (by changing the size, weight, etc.).

  When using such a test piece, it is desirable to return the adsorbed test piece to the original place in step S55 or step S58.

  Further, in the above-described embodiment, the suction abnormality is taken as an example. However, the present invention is not limited to such an aspect. It is also possible to apply the present invention to abnormal operation (for example, abnormal mounting).

  Furthermore, in the embodiment described above, the cause of the abnormality is investigated when the component has not been successfully attracted (when it is determined No in step S17 in FIG. 11). For example, when the user of the component mounting apparatus 110 inputs an instruction for investigating the cause of the abnormality via the input unit 140, the abnormality cause investigation process is performed. Is also possible. In such a case, an input of a combination of a part for investigating the cause of the abnormality and the suction nozzle may be received from the input unit 140, and the cause of the abnormality for the received combination may be investigated. You may make it investigate the cause of abnormality with respect to the components and suction nozzle which are identified by the suction abnormal condition memorize | stored in the memory | storage area | region 124. FIG.

Schematic of a component mounting system. Schematic of a component mounting apparatus. Schematic of a component mounting information table. The schematic diagram of the mounting component information table. Schematic of a similarity determination criteria table. Schematic which shows the parent-child relationship of the site | part which causes adsorption | suction abnormality of components. The schematic of a component mounting part and a pallet. Schematic of a mounting head. Schematic diagram of a computer. Schematic diagram of a database server. PAD showing the board production process in the component mounting device. PAD showing the cause investigation process of abnormality. PAD indicating diagnostic operation processing. Schematic of output data when the suction nozzle is likely to cause suction abnormality. Schematic of output data when there is a high possibility that a component is the cause of suction abnormality. Schematic of output data when there is a high possibility that the mounting head is the cause of the suction abnormality. Schematic of output data when the cause cannot be determined.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Component mounting system 110 Component mounting apparatus 120 Storage part 121 Component mounting information storage area 122 Mounting component information storage area 123 Similar criminal information storage area 124 Absorption abnormal condition storage area 130 Control part 130
131 General control unit 132 Component mounting drive unit 133 Abnormality determination unit 134 Abnormal cause investigation unit 140 Input unit 141 Output unit 142 Communication unit 143 Component mounting unit 144 Palette 145 Imaging unit 146 Status detection unit

Claims (15)

A component mounting device that inspects the component sucked by the suction nozzle and determines whether there is an abnormality when the component supplied from the component supply unit is sucked by the suction nozzle and mounted on the substrate,
When it is determined that there is an abnormality in the inspection of the first component sucked by the first suction nozzle, at least one of the first suction nozzle and the first component is replaced with the first suction nozzle. Is replaced with at least one of a different second suction nozzle and a second part different from the first part, and if it is not judged abnormal in the inspection, the second suction nozzle and A controller that performs a process of determining that at least one of the first suction nozzle replaced with at least one of the second parts and at least one of the first parts has an abnormality;
A component mounting device characterized by The component mounting apparatus according to claim 1,
The controller is
In place of the first suction nozzle, the second suction nozzle performs suction of the first component, and when it is determined to be abnormal in the inspection, the first suction nozzle is provided with the first suction nozzle. When the first component is suctioned by a third suction nozzle provided in a second mounting head different from the mounting head, and it is not judged abnormal in the inspection, the first suction nozzle excluding the first suction nozzle is removed. To determine that there is a cause of abnormality in the mounting head of
A component mounting device characterized by The component mounting apparatus according to claim 1,
The first suction nozzle and the second suction nozzle are the same kind of suction nozzle;
A component mounting device characterized by The component mounting apparatus according to claim 2,
The first suction nozzle and the third suction nozzle are the same kind of suction nozzle;
A component mounting device characterized by The component mounting apparatus according to claim 1,
The controller is
For the first part, performing a process of specifying a part whose weight and size are in a predetermined range as the second part,
A component mounting device characterized by The component mounting apparatus according to claim 5,
The controller is
For the first part, performing a process of specifying a part having a weight and size deviation rate in a predetermined range as the second part,
A component mounting device characterized by The component mounting apparatus according to claim 1,
The second part is a test piece prepared in advance for the first part;
A component mounting device characterized by When a component supplied from a component supply unit is picked up by a suction nozzle and mounted on a substrate, the component picked up by the suction nozzle is inspected and executed by a component mounting apparatus having a control means for judging whether there is an abnormality. A program to be executed,
In the control means,
When it is determined that there is an abnormality in the inspection of the first component sucked by the first suction nozzle, at least one of the first suction nozzle and the first component is replaced with the first suction nozzle. Is replaced with at least one of a different second suction nozzle and a second part different from the first part, and if it is not judged abnormal in the inspection, the second suction nozzle and Performing a process of determining that there is a cause of abnormality in at least one of the first suction nozzle replaced with at least one of the second parts and the first part;
A program characterized by The program according to claim 8, wherein
In the control means,
In place of the first suction nozzle, the second suction nozzle performs suction of the first component, and when it is determined to be abnormal in the inspection, the first suction nozzle is provided with the first suction nozzle. When the first component is suctioned by a third suction nozzle provided in a second mounting head different from the mounting head, and it is not judged abnormal in the inspection, the first suction nozzle excluding the first suction nozzle is removed. To perform a process to determine that there is a cause of abnormality in the mounting head of
A program characterized by The program according to claim 8, wherein
The first suction nozzle and the second suction nozzle are the same kind of suction nozzle;
A program characterized by The program according to claim 9, wherein
The first suction nozzle and the third suction nozzle are the same kind of suction nozzle;
A program characterized by The program according to claim 8, wherein
In the control means,
Causing the first part to perform a process of specifying a part whose weight and size are in a predetermined range as the second part;
A program characterized by A program according to claim 12,
In the control means,
Causing the first component to perform a process of specifying a component having a weight and size deviation rate in a predetermined range as the second component;
A program characterized by The program according to claim 8, wherein
The second part is a test piece prepared in advance for the first part;
A program characterized by Abnormal cause investigation method performed by the component mounting device that inspects the component sucked by the suction nozzle and judges whether there is an abnormality when the component supplied from the component supply unit is sucked by the suction nozzle and mounted on the substrate Because
When the control unit determines that there is an abnormality in the inspection of the first component sucked by the first suction nozzle, the control unit moves at least one of the first suction nozzle and the first component to the first part. If the suction nozzle is replaced with at least one of the second suction nozzle that is different from the suction nozzle and the second part that is different from the first part, and the second part is not abnormal in the inspection, the second part A process of performing a process of determining that at least one of the first suction nozzle and the first part replaced with at least one of the suction nozzle and the second part has a cause of abnormality Preparing,
An abnormal cause investigation method characterized by

Images