JP2020068217A - Component mounting apparatus - Google Patents

Abstract

To provide a component mounting apparatus capable of preventing various losses from being caused by a component dropping from a carrier tape while improving tact by forwarding the carrier tape.SOLUTION: In actuating a tape feeder 13 so that until a mounting head 15 mounts a component BH, which is supplied at a component supply position 13a by the tape feeder 13, on a board KB after picking up the component, the tape feeder 13 supplies a next component BH to the component supply position 13a, a component mounting apparatus makes the mounting head 15 mount a final component (a component BH supplied finally by the tape feeder 13 in producing a mounting board) on the board KB without making the tape feeder 13 perform operation of supplying a next component BH to the component supply position 13a when it is determined that a component BH picked up by the mounting head 15 corresponds to the final component supplied by the tape feeder 13.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a component mounting apparatus that picks up a component supplied by a tape feeder with a mounting head and mounts it on a substrate.

  2. Description of the Related Art Conventionally, there is known a component mounting apparatus that produces a mounting board by repeatedly executing a mounting turn in which a mounting head picks up a component supplied by a component supply unit and mounts it on a board. There are various types of component supply units provided in such a component mounting apparatus, and a tape feeder is frequently used as one of them. The tape feeder has a structure in which a carrier tape accommodating components is pitch-fed to sequentially position the components at a component supply position. The carrier tape has a structure in which parts are housed in each of a plurality of pockets arranged side by side, and the top tape attached to the upper surface prevents the parts from falling out of the pockets. The carrier tape is pitch fed by the tape feeder so as to pass through the component supply position, and is peeled from the carrier tape immediately before the component supply position to expose the component at the component supply position. Then, the exposed component is picked up (adsorbed) by the mounting head.

  Such a tape feeder normally supplies the next component to the component supply position after confirming that the mounting head continues to perform the mounting turn after the component supplied to the component supply position is picked up by the mounting head. However, the carrier tape may be sent immediately after the component is picked up by the mounting head to supply the next component to the component supply position (so-called carrier tape advance. For example, see Patent Document 1 below). ). Such advance feeding of the carrier tape is performed in a case where the feeding speed of the carrier tape has to be slowed because the parts are relatively large and heavy, and the mounting head is fed before the next part is fed to the part feeding position. Is returned to the pickup position and the waiting state of the mounting head occurs. If the carrier tape is advanced in this way, the waiting state of the mounting head does not occur, and the tact can be improved.

JP, 2011-54810, A

  However, when the carrier tape is advanced, if the mounting head stops performing the mounting turn due to the end of production, the component last supplied to the component supply position remains in the pocket that is not covered by the top tape. However, there is a risk that parts will fall off the carrier tape due to some kind of impact. If a part is dropped from the carrier tape, there is a cost loss when the part is lost, and a time loss is required to find the dropped part.

  Therefore, it is an object of the present invention to provide a component mounting apparatus capable of preventing the various losses caused by the component falling off the carrier tape while the carrier tape is advanced and the tact is improved.

  The component mounting apparatus of the present invention is a component mounting apparatus that mounts a component on a board to produce a mounted board, and performs a tape feeding operation of pitch-feeding a carrier tape containing the component to move the component to a component supply position. A tape feeder for sequentially supplying, a mounting head for repeatedly executing a mounting turn for picking up components supplied to the component supply position and mounting them on a substrate, controlling the operation of the mounting head and the operation of the tape feeder, The tape feeder supplies the next component to the component supply position during the period from when the mounting head picks up the component supplied by the tape feeder to the component supply position to when it is mounted on the substrate. An operation control section for operating the operation control section, wherein the operation control section picks up the component supplied to the component supply position by the mounting head. After the tape is loaded, before the tape feeder performs the operation of feeding the next component to the component feeding position, the picked-up component is the final component to be finally fed by the tape feeder in the production of the mounting board. When it is determined that the component picked up by the mounting head corresponds to the final component as a result, an operation of causing the tape feeder to supply the next component to the component supply position is performed. Without causing the mounting head to mount the final component onto the substrate.

  ADVANTAGE OF THE INVENTION According to this invention, while carrying out advance of a carrier tape and aiming at improvement of tact, it can prevent that various loss generate | occur | produces when a component falls off a carrier tape.

Side view of a component mounting apparatus according to an embodiment of the present invention 1 is a perspective view showing a board on which a component is mounted by a component mounting apparatus according to an embodiment of the present invention, together with the component. 1 is a perspective view of a tape feeder included in a component mounting apparatus according to an embodiment of the present invention. 1 is a perspective view of a part of a tape feeder included in a component mounting apparatus according to an embodiment of the present invention. 1 is a side sectional view of a part of a tape feeder included in a component mounting apparatus according to an embodiment of the present invention. 1 is a block diagram showing a control system of a component mounting apparatus according to an embodiment of the present invention. 4 is a flowchart showing the procedure of the tape feeder operation control executed by the component mounting apparatus according to the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In FIG. 1, the component mounting apparatus 1 according to the present exemplary embodiment includes a base 11, a substrate transport unit 12, a tape feeder 13, a head moving mechanism 14, a mounting head 15, and a component camera 16. The component mounting apparatus 1 carries in and positions a board KB sent from a device (for example, a solder printer or another component mounting apparatus) on the upstream process side (not shown), and mounts a plurality of mounting pieces provided on the board KB. After mounting the component BH at each of the positions SI (FIG. 2), a series of operations for carrying out the component to the downstream process side device (for example, another component mounting device, inspection machine, reflow furnace, etc.) is performed to mount the mounting board. It is a device to produce.

  In FIG. 1, the substrate transfer unit 12 has a pair of belt conveyors 12a extending in the left-right direction (X-axis direction) when viewed from the operator OP on the base 11. The substrate transport unit 12 transports the substrate KB in the X-axis direction by simultaneously driving the pair of belt conveyors 12a (arrow A shown in FIG. 2).

  In FIG. 1, a feeder cart 21 that is movable on a floor surface F is coupled to an end portion of the base 11 in the front-rear direction (Y axis direction) viewed from the operator OP. The feeder cart 21 is provided with a feeder base 22 on its upper part, and the tape feeder 13 is detachably attached to the slot 22S of the feeder base 22 (see also FIG. 3). A plurality of tape feeders 13 can be attached to the feeder base 22 side by side in the X-axis direction.

  In FIG. 1, a reel 24 around which a carrier tape 23 is wound is rotatably held on a feeder carriage 21. The component BH is sent to the tape feeder 13 by supplying the carrier tape 23 drawn from the reel 24 to the tape feeder 13. The reel 24 is provided corresponding to each tape feeder 13 attached to the feeder base 22.

  The carrier tape 23 has a configuration in which a plurality of components BH are accommodated in a line. Specifically, as shown in FIG. 4 (enlarged view of the region R shown in FIG. 3), it has a large number of pockets 23P arranged in a row at regular intervals in the longitudinal direction, and each pocket 23P has one pocket 23P. The component BH is housed. A top tape 23T made of a transparent film tape member is attached to the upper surface of the carrier tape 23, and each component BH is sealed in the pocket 23P by the top tape 23T. A plurality of feed holes 23K are provided in a line at a position parallel to the row of pockets 23P of the carrier tape 23.

  In FIG. 3, the tape feeder 13 has a casing 31 having a shape extending in the Y-axis direction as a whole. Inside the casing 31, a sprocket 32 and a sprocket drive motor 33 that drives the sprocket 32 are attached.

  In FIG. 3, a tape passage 34, which is a passage for the carrier tape 23, is provided in the casing 31 so as to extend in the front-rear direction of the casing 31. At the rear end of the casing 31 (the end on the operator OP side), a tape insertion opening 31K connected to the tape passage 34 is provided. A tape pressing member 35 is provided on the upper front portion of the casing 31. At the front end of the casing 31, the space between the upper surface of the casing 31 and the tape pressing member 35 constitutes a part of the tape passage 34.

  In FIG. 3, the sprocket 32 is provided at the leading end of the casing 31 (the end on the side closer to the substrate transport unit 12). A large number of feed pins 32P are provided on the outer circumference of the sprocket 32 so as to extend radially outward.

  Of the feed pins 32P of the sprocket 32, the one that hits the uppermost portion of the sprocket 32 is adapted to be caught in the feed hole 23K of the carrier tape 23 that passes between the upper surface of the casing 31 and the tape pressing member 35 (FIG. 4). Therefore, when the sprocket 32 is driven by the sprocket drive motor 33 to rotate intermittently, the carrier tape 23 is intermittently pushed forward by the sprocket 32 and runs forward in the tape passage 34 at a pitch (in FIG. 3). Arrow B). The portion of the carrier tape 23 that has passed through the sprocket 32 is discharged from the front end of the casing 31 to the outside.

  3, the tape pressing member 35 is provided with an opening 35K that opens upward, and a slit-shaped top tape outlet 35H is provided on the rear side of the opening 35K (see also FIG. 5). . The top tape 23T attached to the upper surface of the carrier tape 23 is pulled out from the top tape pull-out port 35H, and is stretched over a top tape collecting section 36 provided at an intermediate portion in the front-rear direction of the casing 31.

  When the sprocket 32 pitch-feeds the carrier tape 23 forward, the top-tape collecting section 36 pulls the top tape 23T rearward in accordance with this pitch-feed (arrow C shown in FIGS. 3 and 5). Therefore, the top tape 23T is peeled off from the upper surface of the carrier tape 23 immediately before reaching the opening 35K, and each pocket 23P is in a state in which the stored component BH is exposed upward in the opening 35K. In the present embodiment, the tape feeder 13 is configured to supply the component BH to the component supply position 13a at the position immediately after the pocket 23P of the carrier tape 23 reaches the opening 35K as the "component supply position 13a". There is.

  In FIG. 1, the head moving mechanism 14 comprises a Cartesian coordinate robot and moves the mounting head 15 in a horizontal plane. A plurality of nozzles 15a capable of moving in the vertical direction (Z-axis direction) and rotating about the Z-axis are attached to the mounting head 15 in a state of extending downward. The mounting head 15 adsorbs and picks up the component BH by causing the lower end of each nozzle 15a to approach the component BH supplied from the tape feeder 13 to the component supply position 13a from above and suck the component BH. The mounting head 15 manufactures a mounting board by repeatedly executing a mounting turn for picking up the component BH supplied to the component supply position 13a by the tape feeder 13 and mounting it on the board KB.

  In FIG. 1, the component camera 16 is provided on the base 11. The component camera 16 has its imaging field of view directed upward. The mounting head 15 causes the component camera 16 to pick up an image of the picked-up component BH each time the mounting turn is performed, recognizes the component BH, and mounts it on the substrate KB.

  The control device 40 shown in FIG. 1 includes a storage unit 41, an operation control unit 42, an image recognition processing unit 43, a pickup number counter 44, a determination unit 45, and a mounting success / failure determination unit 46 (FIG. 6).

  In FIG. 6, the storage unit 41 stores a mounting program 41a, array data 41b, a component library 41c, board data 41d, and the like. The mounting program 41a is data (program) that defines which component BH is to be mounted in which mounting position SI of the substrate KB carried in by the substrate transport unit 12 and in what order. The array data 41b is data that defines which type of the component BH is supplied from the tape feeder 13 at which position on the feeder base 22. The component library 41c is data in which data such as external dimensions and supply directions of the components BH mounted on the board KB are collected for each type of the component BH. The board data 41d is data in which data such as the outer dimensions of the board KB to be loaded is collected for each type of board KB.

  The operation control unit 42 reads out necessary information from each data stored in the storage unit 41, and controls the operation of each unit such as the substrate transport unit 12, the tape feeder 13, the head moving mechanism 14, the mounting head 15, and the component camera 16. To do. Specifically, the substrate KB is transported and positioned by the substrate transport unit 12, the component BH is supplied by each tape feeder 13, the mounting head 15 is moved by the head moving mechanism 14, and the component BH is picked up by the mounting head 15. Each control of the mounting operation on the board KB is performed. The operation control unit 42 also controls the imaging operation of the component camera 16. The image data of the component BH obtained by the imaging operation of the component camera 16 is sent to the control device 40 and processed by the image recognition processing unit 43.

  In the mounting program 41a stored in the storage unit 41, there are two types of operation modes of the feeding operation of the carrier tape 23 by the tape feeder 13 (that is, the feeding operation of the component BH), that is, “normal feeding mode” and “forward feeding mode”. It is prepared. In each tape feeder 13, either the “normal feed mode” or the “forward feed mode” is set according to the type (here, the size) of the component BH supplied by the tape feeder 13.

  The "normal feed mode" is set when the size of the component BH supplied by the tape feeder 13 is smaller than a predetermined reference size. For the tape feeder 13 in which the “normal feed mode” is set, the operation control unit 42 picks up the component BH supplied by the tape feeder 13 to the component supply position 13a by the mounting head 15 and mounts it on the board KB. Then, after confirming that the mounting head 15 picks up the component BH, the carrier tape 23 is fed so that the next component BH is supplied to the component supply position 13a.

  The "forward feed mode" is set when the size of the component BH supplied by the tape feeder 13 is larger than the reference size. For the tape feeder 13 for which the “forward feed mode” is set, the operation control unit 42 waits until the mounting head 15 picks up the component BH supplied by the tape feeder 13 to the component supply position 13a until the component BH is mounted on the board KB. During the period (specifically, the mounting head 15 picks up the component BH as a trigger), the tape feeder 13 is operated so as to supply the next component BH to the component supply position 13a. That is, in the "forward feed mode", the next component BH is supplied to the component supply position 13a regardless of whether or not the mounting head 15 actually picks up the next component BH.

  In each tape feeder 13, the pickup number counter 44 counts the number of times the sprocket 32 driven by the sprocket drive motor 33 pitch-feeds the carrier tape 23, so that the tape feeder 13 supplies the components supplied to the component supply position 13a. Count the number of BHs (number of parts supplied).

  The determination unit 45 determines, for each tape feeder 13, whether the component BH supplied to the component supply position 13a corresponds to the final component supplied by the tape feeder 13. Here, the "final component" refers to the component BH that the tape feeder 13 supplies last in the production of the mounting board. When a plurality of mounting boards are produced by the mounting board production, the final component BH supplied by the tape feeder 13 to the final production substrate KB corresponds to the final component.

  The determination unit 45 uses the number of components (the number of counted components) counted by the pickup number counter 44 as a reference each time the tape feeder 13 feeds the carrier tape 23 and supplies the next component BH to the component supply position 13a. It is checked whether or not the counted number of parts matches the standard number of supplied parts by comparing with the number of parts. Then, when the number of counted components matches the reference number of components, it is determined whether or not the component BH corresponds to the final component. The "reference number of components" is, for example, the reference number of components that can be read from the mounting program 41a (the number of components BH scheduled to be supplied by the tape feeder 13) to the board KB of the component BH. It is set by the number corrected by the number of parts additionally supplied for the retry (retry) with respect to the mounting error. The result determined by the determination unit 45 (whether the component BH supplied to the component supply position 13a by the tape feeder 13 corresponds to the final component supplied by the tape feeder 13 is the operation control unit). Sent to 42.

  In the component mounting apparatus 1 according to the present embodiment, each of the plurality of nozzles 15a is provided with a plurality of pressure detectors 47 that detect the pressure inside the nozzle 15a (FIG. 6). The plurality of pressure detectors 47 detect the pressure of the corresponding nozzle 15a and output the detection information to the control device 40 (FIG. 6).

  The mounting success / failure determination unit 46 determines whether or not the mounting head 15 has successfully mounted the component BH normally, based on the detection information sent from the pressure detector 47. Specifically, the pressure inside the nozzle 15a is monitored during the component suction maintaining period from when the mounting head 15 picks up the component BH from the tape feeder 13 to when the component BH is mounted on the substrate KB. If the pressure inside the nozzle 15a during the component suction maintaining period is maintained at a negative pressure of an appropriate value, the mounting head 15 determines that the component BH has been successfully mounted normally. On the other hand, when the pressure inside the nozzle 15a during the component suction maintaining period is not kept at an appropriate negative pressure, the mounting head 15 determines that the component BH has not been successfully mounted (failed). .

  Next, a flow of operation control performed by the control device 40 for each tape feeder 13 will be described based on the flowchart shown in FIG. 7. When the production by the component mounting apparatus 1 is started, the control device 40 confirms, for each tape feeder 13, whether the operation mode set in the tape feeder 13 is the “forward feed mode” (in FIG. 6). Step ST1. Operation mode confirmation step). Then, for the tape feeder 13 in which the operation mode is not set to the “advance mode” (set to the normal mode), the control device 40 first feeds one part of the carrier tape 23 to the tape feeder 13. A tape feeding operation is performed (step ST2. Tape feeding step). By this tape feeding operation, the component BH to be mounted on the board KB is supplied to the component supply position 13a.

  The controller 40 moves the mounting head 15 to above the component supply position 13a after making the tape feeder 13 perform the tape feeding operation in step ST2. Then, the component BH supplied to the component supply position 13a in the latest tape feeding step is picked up by the mounting head 15 (step ST3. Pickup step).

  When the mounting head 15 picks up the component BH, the mounting head 15 is moved so that the component BH passes above the component camera 16 and the component camera 16 recognizes the component BH (step ST4, recognition step). When the component camera 16 recognizes the component BH, the mounting head 15 is moved upward on the board KB to mount the component BH at the mounting position SI (step ST5, mounting step).

  After mounting the component BH on the board KB in step ST5, the operation control unit 42 determines whether the mounting head 15 subsequently picks up the component BH from the tape feeder 13 based on the mounting program 41a (step ST6). When the mounting head 15 subsequently picks up the component BH from the tape feeder 13, the process returns to step ST2 so that the tape feeder 13 supplies the next component BH to the component supply position 13a. On the other hand, when the mounting head 15 does not pick up the component BH from the tape feeder 13 as a result of the determination in step ST6, the operation control unit 42 does not perform the tape feeding operation any more and the component by the tape feeder 13 is not performed. The supply of BH is terminated.

  In contrast to such control in the "normal supply mode", the control device 40 first determines in step ST1 that the operation mode set in the tape feeder 13 to be controlled is the "forward feed mode". Then, the tape feeder 13 is caused to perform a tape feeding operation for feeding the carrier tape 23 by one component (step ST7. Tape feeding step). By the feeding operation of the carrier tape 23, the component BH to be mounted on the substrate KB is supplied to the component supply position 13a.

  After causing the tape feeder 13 to perform the tape feeding operation in step ST7, the control device 40 causes the mounting head 15 to pick up the component BH located at the component supply position 13a by the tape feeding operation (step ST8: pickup step). Then, subsequently, the tape feeder 13 is caused to perform a tape feeding operation for feeding one part of the carrier tape 23 (forward feeding operation of the carrier tape 23) so that the next component BH is supplied to the component supply position 13a (step ST9). Tape advance process).

  When the controller 40 causes the tape feeder 13 to advance the carrier tape 23 in step ST9, the mounting head 15 is moved so that the component BH picked up by the mounting head 15 in the latest pickup step passes above the component camera 16. Is moved to cause the component camera 16 to recognize the component BH (step ST10, recognition step). Then, when the component camera 16 recognizes the component BH, the mounting head 15 is moved above the substrate KB to mount the component BH on the substrate KB (step ST11. Mounting process).

  After mounting the component BH on the substrate KB in step ST11, the control device 40 moves the mounting head 15 to above the component supply position 13a. Then, the next component BH supplied to the component supply position 13a in the latest tape advance process is picked up by the mounting head 15 (step ST12, pickup process).

  When the mounting head 15 picks up the component BH, the operation control unit 42 determines, based on the determination information sent from the determination unit 45, that the component BH picked up by the mounting head 15 in the latest pickup step is It is determined whether or not it corresponds to the final component to be supplied (step ST13, final component determination step). When it is determined that the component BH picked up by the mounting head 15 in the most recent pickup step does not correspond to the final component supplied by the tape feeder 13, the next component BH is placed at the component supply position 13a of the tape feeder 13. As supplied, the process returns to step ST9. On the other hand, if it is determined in step ST13 that the component BH picked up by the mounting head 15 in the most recent pickup step corresponds to the final component supplied by the tape feeder 13, further advance operation of the carrier tape 23 is performed. No, the process proceeds to the next step ST14.

  In step ST14, the control device 40 moves the mounting head 15 so that the component BH (final component) picked up in the most recent pickup process passes above the component camera 16, and causes the component camera 16 to recognize the final component ( Recognition process). Then, when the component camera 16 recognizes the final component, the mounting head 15 is moved above the substrate KB to mount the final component on the substrate KB (step ST15, mounting step).

  As described above, in the component mounting apparatus 1 according to the present embodiment, after the mounting head 15 picks up the component BH supplied to the component supply position 13a, the operation control unit 42 mounts the next component BH on the tape feeder 13. Before performing the operation of supplying to the supply position 13a, it is determined whether or not the picked-up component BH corresponds to the component BH (final component) finally supplied by the tape feeder 13 in the production of the mounting board, As a result, when it is determined that the component BH picked up by the mounting head 15 corresponds to the final component, the mounting head 15 does not perform the operation of causing the tape feeder 13 to supply the next component BH to the component supply position 13a. The components are mounted on the board KB.

  When the component BH is mounted on the substrate KB in step ST15, the control device 40 determines whether the component BH (final component) is normally mounted on the substrate KB based on the determination by the mounting success / failure determination unit 46. (Step ST16. Mounting state determination step). Then, when it is determined that the final component is not normally mounted on the board KB (when it is detected that the final component is not normally mounted on the board KB), the carrier is retried to retry the mounting of the component BH. A tape feeding operation for feeding one part of the tape 23 is performed (step ST17, tape feeding step). As a result, the next component BH for retry is supplied to the component supply position 13a.

  After causing the tape feeder 13 to perform the tape feeding operation in step ST17, the control device 40 causes the mounting head 15 to pick up the next component BH for retry located at the component supply position 13a by the tape feeding operation (step ST18). ), And returns to the recognition process of step ST14. Then, in the mounting process of step ST15, the next component BH for retry is mounted on the board KB. On the other hand, when it is determined in step ST16 that the final component has been normally mounted on the board KB (when it is detected that the final component has been normally mounted on the board KB), the operation control unit 42 further determines that tape. The supply of the component BH is completed without causing the feeder 13 to perform the tape feeding operation.

  As described above, in the component mounting apparatus 1 according to the present embodiment, when the operation control unit 42 detects that the final component is not properly mounted on the board KB, the tape feeder 13 determines the next component BH. The tape feeder 13 and the mounting head 15 are controlled so that the final component for retry is supplied to the component supply position 13a, and the mounting head 15 picks up the final component for retry and mounts it on the substrate KB. .

  As described above, in the component mounting apparatus 1 according to the present embodiment, the tape feeder 13 in which the “normal feed mode” is set as the operation mode has the component BH picked up from the carrier tape 23 by the mounting head 15 on the substrate KB. After confirming that the mounting head 15 picks up the component BH, the carrier tape 23 is fed so that the next component BH is supplied to the component supply position 13a. Therefore, the component BH does not remain in the component supply position 13a at the end of the production, so that the component BH does not drop off from the carrier tape 23 after the production ends.

  On the other hand, in the tape feeder 13 in which the "forward feed mode" is set as the operation mode, it is irrelevant whether or not the mounting head 15 picks up the component BH supplied to the component supply position 13a and then the mounting head 15 subsequently picks up the component BH. Since the next component BH is supplied to the component supply position 13a, the component BH may remain at the component supply position 13a at the end of production. However, in the present embodiment, when it is determined that the component BH picked up by the mounting head 15 corresponds to the final component supplied by the tape feeder 13, the tape feeder 13 supplies the next component BH to the component supply position 13a. Since the mounting head 15 mounts the final component on the substrate KB without performing the process, the component BH does not remain at the component supply position 13a at the end of the production as in the normal feed mode. Therefore, even when the operation mode is set to the "forward feed mode", the component BH does not drop off from the carrier tape 23 after the end of production.

  As described above, in the component mounting apparatus 1 according to the present embodiment, the tape feeder 13 supplies the component BH supplied to the component supply position 13a between the time when the mounting head 15 picks it up and the time when the component BH is mounted on the board KB. 13 operates the tape feeder 13 so as to supply the next component BH to the component supply position 13a, the component BH picked up by the mounting head 15 is the final component supplied by the tape feeder 13 (the tape in the production of the mounting board). When it is determined that the feeder B lastly supplies the component BH), the mounting head 15 does not perform the operation of causing the tape feeder 13 to supply the next component BH to the component supply position 13a, and the mounting head 15 supplies the final component to the substrate KB. It is designed to be attached to. For this reason, the component BH does not remain at the component supply position 13a at the end of production. Therefore, according to the component mounting apparatus 1 in the present embodiment, while the carrier tape 23 is advanced, the tact is improved and various losses are prevented from occurring due to the component BH falling off the carrier tape 23. it can.

  Although the embodiments of the present invention have been described so far, the present invention is not limited to the above, and various modifications and the like are possible. For example, in the above-described embodiment, the operation mode of the tape feeder 13 is set to the “normal feed mode” or the “forward feed mode” depending on the size of the component BH supplied by the tape feeder 13. The operation mode of the tape feeder 13 may be set not by the size of the component BH supplied by the tape feeder 13 but by its type. Alternatively, the operator may be able to set it arbitrarily. Further, in the component mounting apparatus 1 of the above-described embodiment, two types of “normal feed mode” and “forward feed mode” are prepared, and it is configured to be used properly according to the type of the component BH. The "mode" is not prepared, and only the "forward mode" may be used.

  (EN) Provided is a component mounting apparatus capable of preventing a loss of various components due to a component falling out of a carrier tape while feeding a carrier tape in advance to improve tact.

1 Component Mounting Device 13 Tape Feeder 13a Component Supply Position 15 Mounting Head 23 Carrier Tape 42 Operation Control Section BH Component KB Board

Claims (2)

A component mounting apparatus that mounts components on a board to produce a mounting board,
A tape feeder that sequentially feeds components to the component feeding position by performing a tape feeding operation that pitch feeds the carrier tape containing the components,
A mounting head that repeatedly executes a mounting turn for picking up a component supplied to the component supply position and mounting it on a board,
The tape feeder controls the operation of the mounting head and the operation of the tape feeder, and the tape feeder moves between the time when the mounting head picks up the component supplied from the tape feeder to the component supply position and the time when the component is mounted on the substrate. An operation control unit for operating the tape feeder so as to supply the component of
The operation control unit,
After the mounting head picks up the component supplied to the component supply position and before the tape feeder performs the operation of supplying the next component to the component supply position, the picked-up component is mounted on the mounting board. In the production, it is determined whether the tape feeder corresponds to the last part to be finally supplied, and as a result, when it is determined that the part picked up by the mounting head corresponds to the last part, the tape feeder is Component mounting apparatus for mounting the final component on the board by the mounting head without performing the operation of supplying the component to the component supply position.   When the operation control unit detects that the final component is not properly mounted on the substrate, the tape feeder supplies the next component to the component supply position as the final component for retry, The component mounting apparatus according to claim 1, wherein the mounting head controls the tape feeder and the mounting head so that the mounting head picks up the final component for the retry and mounts it on the substrate.

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