JP7113310B2 - COMPONENT MOUNTING DEVICE AND COMPONENT SUPPLY METHOD - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus and a component supply method for picking up a component supplied by a tape feeder with a mounting head and mounting it on a substrate.

2. Description of the Related Art Conventionally, there has been known a component mounting apparatus that produces a mounting board by repeatedly performing a mounting turn in which a mounting head picks up a component supplied by a component supply section and mounts it on the board. There are various types of component supply units provided in such component mounting apparatuses, one of which is a tape feeder. The tape feeder pitch-feeds the carrier tape containing the components and sequentially positions the components at the component supply position. The carrier tape has a configuration in which components are stored in each of a plurality of pockets arranged in a row, and a top tape attached to the upper surface prevents the components from falling out of the pockets. The carrier tape is pitch-fed by the tape feeder so as to pass the component supply position, and the component is exposed at the component supply position by being peeled off from the carrier tape at a position immediately before the component supply position. Then, the exposed component is picked up (adsorbed) by the mounting head.

In such a tape feeder, after the component supplied to the component supply position is picked up by the mounting head, the next component is supplied to the component supply position after confirming that the mounting head continues to perform the mounting turn. is common, but in some cases, the carrier tape is fed immediately after the component is picked up by the mounting head to supply the next component to the component supply position (so-called forward feeding of the carrier tape. For example, see Patent Document 1 below. ). Such forward feeding of the carrier tape is effective in cases such as when the carrier tape feeding speed has to be slowed down because the component is relatively large and heavy, and the mounting head is fed before the next component is supplied to the component supply position. is returned to the pick-up position and the waiting state of the mounting head occurs. If the carrier tape is advanced in this manner, the waiting state of the mounting head does not occur, and the takt time can be improved.

JP 2011-54810 A

However, if the carrier tape is advanced, and the mounting head stops performing the mounting turn due to the end of production, the last component supplied to the component supply position remains in the pocket not covered by the top tape. , there is a risk that the components may fall off the carrier tape due to some kind of impact. If a component falls off from the carrier tape, not only does it cost money to lose it, but it also takes time to search for the missing component.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting apparatus and a component supply method that can prevent various losses due to components falling off the carrier tape while improving the takt time by advancing the carrier tape. aim.

A component mounting apparatus according to the present invention is a component mounting apparatus that mounts components on a board to produce a mounted board, and carries out a tape feeding operation of pitch-feeding a carrier tape containing components so that the components are placed at a component supply position. a tape feeder for supplying ; a mounting head for picking up the components supplied to the component feeding position; an operation control unit that operates the tape feeder so that the tape feeder supplies the next component to the component supply position until the After the mounting head picks up, the tape feeder finally supplies the picked up component in the production of the mounting substrate before causing the tape feeder to supply the next component to the component supply position. It is determined whether or not the component corresponds to the final component, and as a result, if it is determined that the component picked up by the mounting head corresponds to the final component, the operation is not performed.
A component supply method according to the present invention is a component supply method for supplying components to a component mounting apparatus that mounts components on a board using a mounting head to produce a mounted board, in which a carrier tape containing components is pitch-fed. After the mounting head picks up the component supplied to the component supply position by the tape feeder that performs the tape feeding operation, before causing the tape feeder to perform the operation of supplying the next component to the component supply position, the pickup is performed. It is determined whether or not the picked component corresponds to the final component to be supplied last by the tape feeder in the production of the mounting board, and if it is determined that the component picked up by the mounting head corresponds to the final component, the When it is determined that the next component is not supplied to the component supply position by the tape feeder and the component picked up by the mounting head does not correspond to the final component, the component is picked up by the mounting head and then the The next component is supplied to the component supply position by the tape feeder until it is mounted on the substrate.

According to the present invention, it is possible to improve the takt time by advancing the carrier tape and prevent various losses due to the components falling off the carrier tape.

1 is a side view of a component mounting apparatus according to one embodiment of the present invention; FIG. FIG. 1 is a perspective view showing a board, together with components, on which components are to be mounted by a component mounting apparatus according to an embodiment of the present invention; 1 is a perspective view of a tape feeder included in a component mounting apparatus according to one embodiment of the present invention; FIG. 1 is a partial perspective view of a tape feeder included in a component mounting apparatus according to one embodiment of the present invention; FIG. 1 is a side cross-sectional view of part of a tape feeder provided in a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a block diagram showing a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. 3 is a flow chart showing a procedure of tape feeder operation control executed by a component mounting apparatus according to an embodiment of the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In FIG. 1, a component mounting apparatus 1 according to the present embodiment includes a base 11, a substrate transport section 12, a tape feeder 13, a head moving mechanism 14, a mounting head 15 and a component camera 16. As shown in FIG. The component mounting apparatus 1 carries in and positions a board KB sent from an apparatus (for example, a solder printing machine or another component mounting apparatus) on the upstream side (not shown), and mounts a plurality of mounts provided on the board KB. After mounting the component BH at each of the positions SI (FIG. 2), a series of operations are carried out to carry out to a device on the downstream side (for example, another component mounting device, an inspection machine, a reflow oven, etc.), and the mounted substrate is mounted. It is a production device.

In FIG. 1, the substrate transport section 12 has a pair of belt conveyors 12a extending in the horizontal direction (X-axis direction) viewed from the operator OP on the base 11. As shown in FIG. The substrate transport unit 12 transports the substrate KB in the X-axis direction by simultaneously driving the pair of belt conveyors 12a (arrow A shown in FIG. 2).

In FIG. 1, a feeder carriage 21 movable on the floor surface F is coupled to the end of the base 11 in the front-rear direction (Y-axis direction) viewed from the operator OP. The feeder carriage 21 has a feeder base 22 on its top, and the tape feeder 13 is detachably attached to a slot 22S of the feeder base 22 (see also FIG. 3). A plurality of tape feeders 13 can be arranged side by side in the X-axis direction and attached to the feeder base 22 .

In FIG. 1, a reel 24 around which a carrier tape 23 is wound is rotatably held on a feeder carriage 21 . By supplying the carrier tape 23 pulled out from the reel 24 to the tape feeder 13 , the component BH is sent to the tape feeder 13 . A reel 24 is provided corresponding to each tape feeder 13 attached to the feeder base 22 .

The carrier tape 23 has a configuration in which a plurality of components BH are arranged in a row. Specifically, as shown in FIG. 4 (enlarged view of region R shown in FIG. 3), it has a large number of pockets 23P arranged in a row at regular intervals in the longitudinal direction, and each pocket 23P has one pocket 23P. It has a configuration in which the component BH is accommodated. A top tape 23T made of a transparent film tape member is attached to the upper surface of the carrier tape 23, and each component BH is sealed in the pocket 23P by the top tape 23T. A plurality of feed holes 23K are arranged in a row at positions parallel to the rows of pockets 23P of the carrier tape 23. As shown in FIG.

In FIG. 3, the tape feeder 13 has a casing 31 extending in the Y-axis direction as a whole. A sprocket 32 and a sprocket drive motor 33 for driving the sprocket 32 are mounted inside the casing 31 .

In FIG. 3 , the casing 31 is provided with a tape passage 34 , which is a passage for the carrier tape 23 , extending in the longitudinal direction of the casing 31 . A tape insertion opening 31K connected to the tape passage 34 is provided at the rear end portion (the end portion on the side of the operator OP) of the casing 31 . A tape pressing member 35 is provided on the front upper portion of the casing 31 . At the front end of the casing 31, the space between the upper surface of the casing 31 and the tape pressing member 35 forms part of the tape passage 34. As shown in FIG.

In FIG. 3, the sprocket 32 is provided at the leading edge of the casing 31 (the edge near the substrate transfer section 12). A large number of feed pins 32P are provided on the outer circumference of the sprocket 32 so as to extend radially outward.

Of the feed pins 32P of the sprocket 32, those that hit the top of the sprocket 32 are caught in the feed holes 23K of the carrier tape 23 passing between the upper surface of the casing 31 and the tape pressing member 35 (FIG. 4). Therefore, when the sprocket 32 is driven by the sprocket drive motor 33 and rotates intermittently, the carrier tape 23 is intermittently pushed forward by the sprocket 32 and pitches forward in the tape path 34 (see FIG. 3). arrow B). A portion of the carrier tape 23 that has passed through the sprocket 32 is discharged from the front end of the casing 31 to the outside.

In FIG. 3, the tape holding member 35 is provided with an opening 35K that opens upward, and a slit-shaped top tape drawer port 35H is provided behind the opening 35K (see also FIG. 5). . The top tape 23T attached to the upper surface of the carrier tape 23 is pulled out from a top tape pull-out port 35H and stretched over a top tape collection section 36 provided in the middle portion of the casing 31 in the front-rear direction.

When the sprocket 32 pitch-feeds the carrier tape 23 forward, the top tape collecting section 36 pulls the top tape 23T rearward in accordance with this pitch feeding (arrow C shown in FIGS. 3 and 5). Therefore, the top tape 23T is stripped from the upper surface of the carrier tape 23 just before reaching the opening 35K, and each pocket 23P exposes the stored component BH in the opening 35K. In the present embodiment, the tape feeder 13 is configured so that the position immediately after the pocket 23P of the carrier tape 23 reaches the opening 35K is defined as the "component supply position 13a", and the component BH is supplied to the component supply position 13a. there is

In FIG. 1, the head moving mechanism 14 consists of an orthogonal coordinate robot, and moves the mounting head 15 within a horizontal plane. A plurality of nozzles 15a capable of moving in the vertical direction (referred to as the Z-axis direction) and rotating around the Z-axis are attached to the mounting head 15 in a downwardly extending state. The mounting head 15 brings the lower end of each nozzle 15a close to the component BH supplied to the component supply position 13a by the tape feeder 13 from above and sucks it, thereby sucking and picking up the component BH. The mounting head 15 manufactures a mounted board by repeatedly performing a mounting turn of picking up the component BH supplied to the component supply position 13a by the tape feeder 13 and mounting it on the board KB.

In FIG. 1, the parts camera 16 is provided on the base 11 . The component camera 16 has an imaging field of view directed upward. The mounting head 15 causes the component camera 16 to take an image of the picked-up component BH each time it performs a mounting turn, recognizes the component BH, and then mounts it on the board KB.

The control device 40 shown in FIG. 1 includes a storage unit 41, an operation control unit 42, an image recognition processing unit 43, a pickup number counter 44, a determination unit 45, and a mounting success/failure determination unit 46 (FIG. 6).

6, the storage unit 41 stores a mounting program 41a, arrangement data 41b, a component library 41c, board data 41d, and the like. The mounting program 41a is data (a program) that defines which components BH are to be mounted at which mounting position SI of the board KB carried in by the board transfer section 12 and in what order. The arrangement data 41b is data that determines which type of component BH is supplied from which position on the feeder base 22 of the tape feeder 13 . The component library 41c is data in which data such as the external dimensions and supply direction of each component BH to be mounted on the board KB are collected for each component BH type. The board data 41d is data in which data such as the external dimensions of the board KB to be carried in are grouped for each type of board KB.

The operation control unit 42 reads out necessary information from each data stored in the storage unit 41, and controls the operation of each unit such as the substrate transport unit 12, the tape feeder 13, the head moving mechanism 14, the mounting head 15, the component camera 16, and the like. do. Specifically, the substrate KB is transported and positioned by the substrate transport unit 12, the component BH supply operation is performed by each tape feeder 13, the mounting head 15 is moved by the head moving mechanism 14, the component BH is picked up by the mounting head 15, and the component BH is picked up by the mounting head 15. Each control of the mounting operation to the board KB is performed. The operation control unit 42 also controls the imaging operation of the component camera 16 . Image data of the component BH obtained by the imaging operation of the component camera 16 is sent to the control device 40 and processed in the image recognition processing section 43 .

In the mounting program 41a stored in the storage unit 41, there are two types of operation modes for the feeding operation of the carrier tape 23 by the tape feeder 13 (that is, the feeding operation of the component BH): a "normal feeding mode" and a "advance feeding mode". prepared. Each tape feeder 13 is set to either a "normal feed mode" or a "advance feed mode" according to the type (here, size) of the component BH supplied by the tape feeder 13. FIG.

The "normal feeding mode" is set when the size of the component BH supplied by the tape feeder 13 is smaller than a predetermined reference size. After the mounting head 15 picks up the component BH that the tape feeder 13 has supplied to the component supply position 13a and mounts it on the board KB, the operation control unit 42 controls the tape feeder 13 for which the "normal feeding mode" is set. Subsequently, after confirming that the mounting head 15 picks up the component BH, the carrier tape 23 is fed so that the next component BH is supplied to the component supply position 13a.

The "advance mode" is set when the size of the component BH supplied by the tape feeder 13 is larger than the reference size. For the tape feeder 13 set to the "advance mode", the operation control unit 42 controls the timing from when the mounting head 15 picks up the component BH supplied to the component supply position 13a by the tape feeder 13 to when the component BH is mounted on the board KB. During this period (more specifically, triggered by the operation of the mounting head 15 picking up the component BH), the tape feeder 13 is operated to supply the next component BH to the component supply position 13a. That is, in the "advance mode", the next component BH is supplied to the component supply position 13a regardless of whether the mounting head 15 actually picks up the next component BH.

A pick-up number counter 44 counts the number of times the sprocket 32 driven by the sprocket drive motor 33 pitch-feeds the carrier tape 23 in each tape feeder 13, thereby determining the number of components supplied by the tape feeder 13 to the component supply position 13a. Count the number of BHs (the number of supplied parts).

For each tape feeder 13, the determination unit 45 determines whether the component BH supplied to the component supply position 13a corresponds to the final component supplied by the tape feeder 13 or not. Here, the "final component" refers to the component BH that is finally supplied by the tape feeder 13 in the production of mounting boards. When a plurality of mounting boards are produced in the production of mounting boards, the last part BH supplied from the tape feeder 13 to the last board KB to be produced corresponds to the final part.

Each time the tape feeder 13 feeds the carrier tape 23 and supplies the next component BH to the component supply position 13a, the determination unit 45 determines the number of components counted by the pickup counter 44 (counted component count). to check if the counted number of parts matches the reference number of supplied parts. Then, when the number of counted parts matches the reference number of parts, it is determined whether or not the part BH corresponds to the final part. The "reference number of components" is, for example, the reference number of components to be supplied (the number of components BH scheduled to be supplied by the tape feeder 13) that can be read from the mounting program 41a. It is set by the number corrected by the number of additionally supplied parts for retrying (retry) for mounting errors. The result of determination by the determination unit 45 (determination result (determination information) as to whether the component BH supplied to the component supply position 13a by the tape feeder 13 corresponds to the final component to be supplied by the tape feeder 13) is sent to 42.

In the component mounting apparatus 1 according to the present embodiment, each of the plurality of nozzles 15a is provided with a plurality of pressure detectors 47 for detecting the pressure inside the nozzles 15a (FIG. 6). These pressure detectors 47 detect the pressure of the corresponding nozzles 15a and output the detection information to the control device 40 (FIG. 6).

The placement success/failure determination unit 46 determines whether or not the placement head 15 has successfully successfully placed the component BH based on the detection information sent from the pressure detector 47 . Specifically, the pressure inside the nozzle 15a is monitored during the component suction maintenance period from when the mounting head 15 performs the operation of picking up the component BH from the tape feeder 13 to when it performs the operation of mounting the component BH on the board KB. When the pressure inside the nozzle 15a is maintained at an appropriate negative pressure during the component suction maintenance period, the mounting head 15 determines that the normal mounting of the component BH has succeeded. On the other hand, if the pressure inside the nozzle 15a is not maintained at an appropriate value of negative pressure during the component suction maintenance period, the mounting head 15 determines that normal mounting of the component BH has not succeeded (failed). .

Next, based on the flowchart shown in FIG. 7, the flow of operation control performed by the control device 40 for each tape feeder 13 will be described. When the component mounting apparatus 1 starts production, the control device 40 confirms whether or not the operation mode set for each tape feeder 13 is the "advance mode" (see FIG. 6). Step ST1: operation mode confirmation step). For the tape feeder 13 whose operation mode is not set to the "advance mode" (it is set to the normal mode), the control device 40 first feeds the carrier tape 23 by one part to the tape feeder 13. A tape feed operation is performed (step ST2, tape feed process). By this tape feeding operation, the component BH to be mounted on the board KB is supplied to the component supply position 13a.

After causing the tape feeder 13 to feed the tape in step ST2, the control device 40 moves the mounting head 15 above the component supply position 13a. Then, the component BH supplied to the component supply position 13a in the last tape feeding process is picked up by the mounting head 15 (step ST3, pickup process).

After the mounting head 15 picks up the component BH, the mounting head 15 is moved so that the component BH passes above the component camera 16, and the component camera 16 recognizes the component BH (step ST4, recognition process). When the component camera 16 recognizes the component BH, the mounting head 15 is moved above the substrate KB to mount the component BH at the mounting position SI (step ST5: mounting process).

After mounting the component BH on the board KB in step ST5, the operation control unit 42 determines whether or not the mounting head 15 continues to pick up the component BH from the tape feeder 13 based on the mounting program 41a (step ST6). When the mounting head 15 subsequently picks up the component BH from the tape feeder 13, the process returns to step ST2 so that the tape feeder 13 supplies the next component BH to the component supply position 13a. On the other hand, if the result of determination in step ST6 is that the mounting head 15 no longer picks up the component BH from the tape feeder 13, the operation control section 42 does not cause the tape feeding operation to proceed any more, and the component is fed by the tape feeder 13. Terminate the BH supply.

When the operation mode set in the tape feeder 13 to be controlled is the "advance feed mode" in step ST1, the control device 40 first controls the "normal supply mode" as described above. , the tape feeder 13 is caused to perform a tape feeding operation for feeding the carrier tape 23 by one component (step ST7, tape feeding step). By this feed operation of the carrier tape 23, the component BH to be mounted on the board KB is supplied to the component supply position 13a.

After causing the tape feeder 13 to perform the tape feeding operation in step ST7, the control device 40 causes the mounting head 15 to pick up the component BH positioned at the component supply position 13a by the tape feeding operation (step ST8, pickup step). Subsequently, the tape feeder 13 is caused to perform a tape feeding operation for feeding the carrier tape 23 by one component (advance feeding operation of the carrier tape 23) so that the next component BH is supplied to the component supply position 13a (step ST9). tape advance process).

After causing the tape feeder 13 to advance the carrier tape 23 in step ST9, the control device 40 moves the mounting head 15 so that the component BH picked up by the mounting head 15 in the most recent pickup process passes above the component camera 16. is moved to cause the component camera 16 to recognize the component BH (step ST10, recognition step). When the component camera 16 recognizes the component BH, the mounting head 15 is moved above the board KB to mount the component BH on the board KB (step ST11: mounting process).

After mounting the component BH on the board KB in step ST11, the controller 40 moves the mounting head 15 above the component supply position 13a. Then, the mounting head 15 is made to pick up the next component BH supplied to the component supply position 13a by the last tape forwarding process (step ST12, picking up process).

After the mounting head 15 picks up the component BH, the operation control unit 42, based on the determination information sent from the determination unit 45, determines whether the component BH picked up by the mounting head 15 in the most recent pickup process is It is determined whether or not it corresponds to the final part to be supplied (step ST13. final part determination step). When it is determined that the component BH picked up by the mounting head 15 in the latest pick-up process does not correspond to the final component to be supplied by the tape feeder 13, the next component BH is placed at the component supply position 13a of the tape feeder 13. It returns to step ST9 so that it may be supplied. On the other hand, if it is determined in step ST13 that the component BH picked up by the mounting head 15 in the latest pick-up process corresponds to the final component to be supplied by the tape feeder 13, the carrier tape 23 is further advanced. Instead, go to the next step ST14.

In step ST14, the control device 40 moves the mounting head 15 so that the component BH (final component) picked up in the most recent pickup process passes above the component camera 16, and causes the component camera 16 to recognize the final component ( recognition process). When the component camera 16 recognizes the final component, the mounting head 15 is moved above the board KB to mount the final component on the board KB (step ST15: mounting process).

As described above, in the component mounting apparatus 1 according to the present embodiment, after the mounting head 15 picks up the component BH supplied to the component supply position 13a, the operation control unit 42 feeds the next component BH to the tape feeder 13. determining whether or not the picked-up part BH corresponds to the part BH (final part) to be lastly supplied by the tape feeder 13 in the production of the mounting board before causing the supply position 13a to supply it; As a result, when it is determined that the component BH picked up by the mounting head 15 corresponds to the final component, the mounting head 15 does not cause the tape feeder 13 to supply the next component BH to the component supply position 13a. Components are mounted on the board KB.

After the component BH is mounted on the board KB in step ST15, the control device 40 determines whether or not the component BH (final component) is normally mounted on the board KB based on the determination by the mounting success/failure determining section 46. (Step ST16. Mounting state determination step). When it is determined that the final component has not been properly mounted on the board KB (when it is detected that the final component has not been normally mounted on the board KB), the carrier is placed in order to retry the mounting of the component BH. A tape feeding operation for feeding the tape 23 by one component is performed (step ST17, tape feeding step). As a result, the next component BH for retry is supplied to the component supply position 13a.

After causing the tape feeder 13 to perform the tape feeding operation in step ST17, the control device 40 causes the mounting head 15 to pick up the next component BH for retry located at the component supply position 13a by the tape feeding operation (step ST18). ), and returns to the recognition process of step ST14. Then, in the mounting process of step ST15, the next component BH for retry is mounted on the board KB. On the other hand, when it is determined in step ST16 that the final component is normally mounted on the board KB (when it is detected that the final component is normally mounted on the board KB), the operation control unit 42 further controls the tape. The supply of the component BH is finished without causing the feeder 13 to perform the tape feeding operation.

As described above, in the component mounting apparatus 1 according to the present embodiment, when the operation control section 42 detects that the final component has not been properly mounted on the board KB, the tape feeder 13 feeds the next component BH. The tape feeder 13 and mounting head 15 are controlled so that the final component for retry is supplied to the component supply position 13a, and the mounting head 15 picks up the final component for retry and mounts it on the board KB. .

As described above, in the component mounting apparatus 1 according to the present embodiment, the tape feeder 13 in which the "normal feeding mode" is set as the operation mode feeds the component BH picked up by the mounting head 15 from the carrier tape 23 onto the substrate KB. After confirming that the mounting head 15 picks up the component BH, the carrier tape 23 is fed so that the next component BH is supplied to the component supply position 13a. Therefore, the component BH will not remain at the component supply position 13a when the production is completed, and therefore the component BH will not fall off the carrier tape 23 after the production is completed.

On the other hand, the tape feeder 13 in which the "advance mode" is set as the operation mode has nothing to do with whether or not the mounting head 15 picks up the component BH supplied to the component supply position 13a after the mounting head 15 picks up the component BH. Since the next component BH is supplied to the component supply position 13a immediately after production, the component BH may remain at the component supply position 13a at the end of production. However, in this embodiment, when it is determined that the component BH picked up by the mounting head 15 corresponds to the final component to be supplied by the tape feeder 13, the tape feeder 13 supplies the next component BH to the component supply position 13a. Since the mounting head 15 mounts the final component on the board KB without any movement, the component BH does not remain at the component supply position 13a at the time of completion of production as in the case of the normal feed mode. Therefore, even when the operation mode is set to the "advance mode", the component BH will not drop off from the carrier tape 23 after production is completed.

As described above, in the component mounting apparatus 1 (component supply method by the component mounting apparatus 1) according to the present embodiment, after the mounting head 15 picks up the component BH supplied to the component supply position 13a by the tape feeder 13, the board is mounted on the board. When the tape feeder 13 is operated so that the next component BH is supplied to the component supply position 13a until it is mounted on the KB, the tape feeder 13 supplies the component BH picked up by the mounting head 15. When it is determined that it corresponds to the final component (the component BH that is finally supplied by the tape feeder 13 in the production of the mounting board), the tape feeder 13 is not caused to supply the next component BH to the component supply position 13a. ( The mounting head 15 is caused to mount the final component on the board KB without causing the mounting head 15 to do so ) . Therefore, the parts BH do not remain at the parts supply position 13a when the production is finished. For this reason, according to the component mounting apparatus 1 of the present embodiment, the carrier tape 23 is advanced to improve the takt time, and various losses due to the components BH coming off the carrier tape 23 are prevented. can.

Although the embodiments of the present invention have been described so far, the present invention is not limited to those described above, and various modifications and the like are possible. For example, in the above-described embodiment, the operation mode of the tape feeder 13 is set to "normal feed mode" or "advance feed mode" depending on the size of the component BH supplied by the tape feeder 13. , the operation mode of the tape feeder 13 may be set according to the type of the component BH supplied by the tape feeder 13 instead of the size thereof. Alternatively, the operator may arbitrarily set it. Further, in the component mounting apparatus 1 of the above-described embodiment, two modes, the "normal feed mode" and the "advance feed mode", are prepared and used according to the type of the component BH. Mode" may not be prepared, and it may operate only in the "advance mode".

To provide a component mounting device and a component supply method capable of preventing the occurrence of various losses due to components dropping off from a carrier tape while advancing the carrier tape to improve takt time.

REFERENCE SIGNS LIST 1 component mounting device 13 tape feeder 13a component supply position 15 mounting head 23 carrier tape 42 motion control section BH component KB board

Claims (4)

A component mounting apparatus that mounts components on a board to produce a mounting board,
a tape feeder that performs a tape feeding operation for pitch-feeding a carrier tape containing components to supply components to a component supply position;
a mounting head that picks up the component supplied to the component supply position ;
The tape feeder supplies the next component to the component supply position after the component supplied to the component supply position by the tape feeder is picked up by the mounting head until the component is mounted on the substrate. and an operation control unit that operates the feeder,
The operation control unit is
After the mounting head picks up the component supplied to the component supply position and before the tape feeder is caused to supply the next component to the component supply position, the picked up component is placed on the mounting board. In production, it is determined whether or not the tape feeder corresponds to the final part to be supplied last, and as a result, if it is determined that the part picked up by the mounting head corresponds to the final part, the operation is not performed. Component mounting equipment. When the operation control unit detects that the final component has not been properly mounted on the board, the tape feeder causes the tape feeder to supply the next component to the component supply position as the final component for retry. 2. The component mounting apparatus according to claim 1, wherein said mounting head picks up the final component for retry and mounts it on said board. A component supply method for supplying components to a component mounting apparatus that mounts components on a board using a mounting head to produce a mounted board,
After the mounting head picks up the component supplied to the component supply position by the tape feeder that performs the tape feeding operation of pitch-feeding the carrier tape containing the component, the tape feeder is caused to supply the next component to the component supply position. determining whether or not the picked-up part corresponds to the last part to be supplied by the tape feeder in the production of the mounting board before performing the operation;
when it is determined that the component picked up by the mounting head corresponds to the final component, the tape feeder does not supply the next component to the component supply position;
When it is determined that the component picked up by the mounting head does not correspond to the final component, the next component is fed by the tape feeder after the component is picked up by the mounting head and before it is mounted on the board. A component supply method for supplying components to the component supply position. 4. The component supply method according to claim 3, wherein when it is detected that said final component is not normally mounted on said board, said next component is supplied to said component supply position as a final component for retry.

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