JPS6024100A - Electronic part mounting device - Google Patents
Electronic part mounting deviceInfo
- Publication number
- JPS6024100A JPS6024100A JP58132414A JP13241483A JPS6024100A JP S6024100 A JPS6024100 A JP S6024100A JP 58132414 A JP58132414 A JP 58132414A JP 13241483 A JP13241483 A JP 13241483A JP S6024100 A JPS6024100 A JP S6024100A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- electronic component
- opening
- cover
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は抵抗、コンデンサー等のチップ型電子部品を、
電子回路基板に安定して装着する電子部品実装装置に関
するものである。[Detailed Description of the Invention] Industrial Application Field The present invention applies to chip-type electronic components such as resistors and capacitors.
The present invention relates to an electronic component mounting device that stably mounts electronic components on an electronic circuit board.
−
従来例の構成とその問題点
従来の電子部品実装装置のテープ送出機構は第１図およ
び第４図にその具体構成を示すように、テープ１を所定
のピッチ送りするラチェット２と連動してカバーテープ
３を巻取り、このカバーテープ３とテープ１を剥ぎ取る
位置と、真空ノズル４で電子部品５を取出す位置の間に
、固定のカッ（−６を設け、電子部品５′の突出を防止
していた。- Conventional structure and its problems The tape feeding mechanism of the conventional electronic component mounting apparatus works in conjunction with a ratchet 2 that feeds the tape 1 at a predetermined pitch, as shown in FIGS. 1 and 4. A fixed cup (-6) is provided between the position where the cover tape 3 is wound up and the cover tape 3 and tape 1 are peeled off, and the position where the electronic component 5 is removed using the vacuum nozzle 4 to prevent the electronic component 5' from protruding. It was being prevented.
しかしながら、このような構成では、第２図に示すよう
にボトムテープにしわがあったような場合、電子部品取
出し位置においてはカバーされていないため、電子部品
５′が飛出するようなことが起９、この点において問題
があった。However, with this configuration, if there is a wrinkle in the bottom tape as shown in Figure 2, the electronic component 5' may fly out because it is not covered at the electronic component extraction position. 9. There was a problem in this respect.
発明の目的
本発明は上記従来の欠点を解消するものであり、電子部
品をカバーしつつ送シ出すという、全く新規な電子部品
実装装置を提供するものである。OBJECTS OF THE INVENTION The present invention solves the above-mentioned conventional drawbacks, and provides a completely new electronic component mounting apparatus that can send out electronic components while covering them.
発明の構成
本発明は、チップ型電子部品を封入したテープを所定ピ
ッチ送るテープ送出手段と、カッ（−テ−プを剥ぎ取る
ためのカバーテープの剥取手段と、テープを上部よシ押
え水平に送るためテープを力／＜ −スるカバ一手段と
、このテープカバ一手段にはさらにテープ送り方向と平
行にスリットがあり、このスリット中をテープ送出手段
と同期して摺動する開口部のシャッタ一手段は、前記電
子部品を押えて送ることができ、部品を安定して部品取
出し手段により取出す位置に送るため装置の稼動率。Structure of the Invention The present invention comprises a tape feeding means for feeding a tape encapsulating a chip-type electronic component at a predetermined pitch, a cover tape peeling means for peeling off the tape, and a tape holding means for holding the tape horizontally from above. This tape cover means further has a slit parallel to the tape feeding direction, and an opening slides through the slit in synchronization with the tape feeding means. The shutter means is capable of holding and feeding the electronic component, and the operation rate of the device is increased in order to stably feed the component to a position where it is taken out by the component taking out means.
品質の安定にきわめて有利である。This is extremely advantageous for stabilizing quality.
実施例の説明
以下に、本発明の一実施例を第３図〜第６図にもとづい
て説明する。第３図は一般的な電子部品実装装置の概略
図であシ、テープ１内に電子部品６が封入されており、
カバーテープ３を巻取りリール８で巻取ることＫよリテ
ープ１より前記カバーテープを剥すようにしている。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 3 to 6. FIG. 3 is a schematic diagram of a general electronic component mounting apparatus, in which an electronic component 6 is enclosed within a tape 1.
By winding up the cover tape 3 with a take-up reel 8, the cover tape is peeled off from the tape 1.
９は電子部品（図示せず）を実装するヘッドであり、フ
ィード１ｏにて、テープ送出手段のラチェット２を駆動
する。Reference numeral 9 denotes a head for mounting electronic components (not shown), and drives the ratchet 2 of the tape feeding means with the feed 1o.
１１はプリント基板であｐ、ｘ−ｙテーブル１２でＸ−
Ｙ軸上に位置決めされる。11 is a printed circuit board p, x-y table 12 is x-
Positioned on the Y axis.
第５図は本実施例の電子部品実装装置の電子部品供給部
を示すものである。テープ１はラチェット１６により所
定ピッチづつ送り出される。FIG. 5 shows the electronic component supply section of the electronic component mounting apparatus of this embodiment. The tape 1 is fed out by a ratchet 16 at predetermined pitches.
１３はテープ１を上方より押えるだめのカバ一手段のテ
ープ押えカバーである。スリット１４はカバーテープ３
をテープ１より剥ぎ・とるために設けられたものである
。スリット１５はラチェットレバー１６ａにたてられた
ピン１７によりラチェット１６の動きに連動するシャッ
タ１８のガイド部である。電子部品５はンヤソタ１８で
押えられつつ取出し部１９に送られる。Reference numeral 13 denotes a tape holding cover which is a cover for holding down the tape 1 from above. Slit 14 is cover tape 3
This is provided for peeling off the tape from the tape 1. The slit 15 is a guide portion of a shutter 18 that is linked to the movement of a ratchet 16 by a pin 17 set on a ratchet lever 16a. The electronic component 5 is sent to the take-out section 19 while being held down by the gripper 18.
以下第６図（ａ）〜（Ｃ）においてその動作を説明する
。The operation will be explained below with reference to FIGS. 6(a) to 6(C).
電子部品５はテープ１に封入されており、テープ押え１
３で規正され、第５図に示すラチェット機構によシ送ら
れる。第６図（ａ）において、テープ押え１３に設けら
れたスリット１４の位置で、カバーテープ３を剥ぎとシ
、テープ１と同期した速度でＸ方向に移動するシャッタ
１８により電子部品５はカバーされながらテープ押え１
３に設けられた取出し位置１９捷で送られる。第６図（
ｂ）において、電子部品６の位置決めが終ると、第６図
においてラチェット１６の戻９動作によりシャッタ１８
のみ−Ｘ方向に移動する。第６図（Ｃ）において、真空
ノズル４が下降し、取出し位置１９より電子部品６を吸
着し取出す。The electronic component 5 is enclosed in the tape 1, and the tape presser 1
3 and is fed by a ratchet mechanism shown in FIG. In FIG. 6(a), the cover tape 3 is peeled off at the position of the slit 14 provided in the tape holder 13, and the electronic component 5 is covered by the shutter 18, which moves in the X direction at a speed synchronized with the tape 1. Tape presser foot 1
It is sent to the take-out position 19 provided at 3. Figure 6 (
In b), when the positioning of the electronic component 6 is completed, the shutter 18 is moved by the return movement of the ratchet 16 in FIG.
Move only in the -X direction. In FIG. 6(C), the vacuum nozzle 4 descends, attracts the electronic component 6 from the take-out position 19, and takes it out.
発明の効果
本発明は、テープ送出手段と同期して部品取出口の開閉
を行うことにより、微小なチップ型電子部品を封入され
たテープ内より取出す際に生じるカバーテープの静電気
による電子部品の飛び出しおよびボトムテープのしわや
送シ動作の衝撃による電子部品の飛出し等の影響を解消
することが可能となり、品質の安定、稼動率の向上に絶
大なる効果を有する。Effects of the Invention The present invention opens and closes the component ejection port in synchronization with the tape feeding means, thereby preventing electronic components from popping out due to static electricity of the cover tape that occurs when microscopic chip-type electronic components are taken out from the encapsulated tape. It also makes it possible to eliminate the effects of wrinkles in the bottom tape and electronic components flying out due to the impact of the feeding operation, which has a tremendous effect on stabilizing quality and improving operating rates.
第１図は従来の電子部品実装装置のテープ送シ機構の説
明図、第２図は第１図の取出し位置における部品飛出し
の１事例を説明する為の部品取出部側面図、第３図は一
般的な電子部品実装装置の概略図、第４図は従来の電子
部品実装装置におけるテープ送り出し機構部の斜視図、
第５図は本発明の一実施例における電子部品実装装置の
部分説明図、第６図ａ、ｂ、ｃは第６図のＹ−Ｙ線にお
ける断面主要部拡大図であシ、テープ送出から部品の受
け取りまでのシャッターの各状態を示すものである。
１・・・・・・テープ、５・・・・・・電子部品、１３
・・・・・・テープ押えカバー、１６・・・・・・ラチ
ェット、１８・・・・・・シャッタ。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名但
１ 図
第２図
第３図
第４図
踪 Ｘ 綜
（−−４
、ｗ ＯFig. 1 is an explanatory diagram of the tape feeding mechanism of a conventional electronic component mounting apparatus, Fig. 2 is a side view of the component ejecting part to explain an example of a component flying out at the ejecting position shown in Fig. 1, and Fig. 3 is a schematic diagram of a general electronic component mounting apparatus, FIG. 4 is a perspective view of a tape feeding mechanism in a conventional electronic component mounting apparatus,
FIG. 5 is a partial explanatory diagram of an electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. It shows each state of the shutter until the parts are received. 1...Tape, 5...Electronic parts, 13
...Tape holder cover, 16...Ratchet, 18...Shutter. Name of agent: Patent attorney Toshio Nakao and one other person
1 Figure 2 Figure 3 Figure 4
Claims (1)
するテープ送出手段と、前記テープの表面カバーテープ
を剥ぎ取る剥取手段と、前記チップ型電子部品を前記テ
ープより取り出すだめの開１」部を有し、前記テープを
カバーするカバ一手段と、前記カバ一手段に設けた摺動
面に、前記送出手段と同期して前記開口部を摺動する同
開口部のシャッタ一手段と、前記開口部が開いた状態の
時、前記チップ型電子部品を前記テープより夕受は取り
前記開口部から取出す部品取出手段とを備えた電子部品
実装装置。tape feeding means for intermittently feeding a tape in which chip-type electronic components are encapsulated at equal intervals; a peeling means for peeling off a surface cover tape of the tape; and an opening 1" portion for taking out the chip-type electronic components from the tape. a cover means for covering the tape; a shutter means for the opening that slides on the opening in synchronization with the sending means on a sliding surface provided on the cover means; An electronic component mounting apparatus comprising: component ejecting means for picking up the chip-type electronic component from the tape and taking it out from the opening when the opening is in an open state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58132414A JPS6024100A (en) | 1983-07-19 | 1983-07-19 | Electronic part mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58132414A JPS6024100A (en) | 1983-07-19 | 1983-07-19 | Electronic part mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6024100A true JPS6024100A (en) | 1985-02-06 |
| JPH0345560B2 JPH0345560B2 (en) | 1991-07-11 |
Family
ID=15080821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58132414A Granted JPS6024100A (en) | 1983-07-19 | 1983-07-19 | Electronic part mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6024100A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60194397U (en) * | 1984-06-01 | 1985-12-24 | 富士機械製造株式会社 | Electronic component carrier tape feeding device |
| JPS61162423A (en) * | 1984-12-29 | 1986-07-23 | Fuji Kikai Seizo Kk | Takimg-out of electronic parts from carrier tape |
| JPS62165994A (en) * | 1986-01-17 | 1987-07-22 | 松下電器産業株式会社 | Electronic parts mounting apparatus |
| JPS639200U (en) * | 1986-07-05 | 1988-01-21 | ||
| JPS63224300A (en) * | 1987-03-13 | 1988-09-19 | 株式会社日立製作所 | Chip parts feeder |
| US4915770A (en) * | 1987-05-09 | 1990-04-10 | Hitachi, Ltd. | Electronic chip supplying apparatus and method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
| JPS579720A (en) * | 1980-06-19 | 1982-01-19 | Takaseen:Kk | Preparation of chinese herbal remedial tea |
| JPS57124497A (en) * | 1981-01-27 | 1982-08-03 | Tenryu Seiki Kk | Automatic electric part inserting device |
| JPS57148875U (en) * | 1981-03-13 | 1982-09-18 |
-
1983
- 1983-07-19 JP JP58132414A patent/JPS6024100A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
| JPS579720A (en) * | 1980-06-19 | 1982-01-19 | Takaseen:Kk | Preparation of chinese herbal remedial tea |
| JPS57124497A (en) * | 1981-01-27 | 1982-08-03 | Tenryu Seiki Kk | Automatic electric part inserting device |
| JPS57148875U (en) * | 1981-03-13 | 1982-09-18 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60194397U (en) * | 1984-06-01 | 1985-12-24 | 富士機械製造株式会社 | Electronic component carrier tape feeding device |
| JPH039353Y2 (en) * | 1984-06-01 | 1991-03-08 | ||
| JPS61162423A (en) * | 1984-12-29 | 1986-07-23 | Fuji Kikai Seizo Kk | Takimg-out of electronic parts from carrier tape |
| JPH039640B2 (en) * | 1984-12-29 | 1991-02-08 | Fuji Machine Mfg | |
| JPS62165994A (en) * | 1986-01-17 | 1987-07-22 | 松下電器産業株式会社 | Electronic parts mounting apparatus |
| JPS639200U (en) * | 1986-07-05 | 1988-01-21 | ||
| JPS63224300A (en) * | 1987-03-13 | 1988-09-19 | 株式会社日立製作所 | Chip parts feeder |
| US4915770A (en) * | 1987-05-09 | 1990-04-10 | Hitachi, Ltd. | Electronic chip supplying apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0345560B2 (en) | 1991-07-11 |
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