JP3849174B2 - Electronic component automatic mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an automatic electronic component mounting apparatus used when various electronic components are automatically mounted on a printed circuit board.
[0002]
[Prior art]
FIG. 15 shows an example of electronic components 1a to 1d (hereinafter referred to as electronic component 1) that can be mounted in this type of automatic electronic component mounting apparatus.
[0003]
FIG. 16 is a perspective view showing a configuration of a mounting head attached to a head portion of an electronic component automatic mounting apparatus to be described later, and is configured such that a plurality of suction nozzles 2 can be selected by a selection mechanism.
[0004]
FIG. 17 shows a state in which an electronic component is sucked by the suction nozzle 2 of the mounting head shown in FIG. 16, and FIG. 17 (a) shows the paper carrier tape 3 wound around the electronic component supply cassette 5. The state in which the thin electronic component 1 stored is sucked, FIG. 2B is the state in which the thin electronic component 1 stored in the embossed carrier tape 4 is sucked, and the same figure (c) is stored in the embossed carrier tape 4a. The thick electronic component 1a is shown in a state of being sucked, and the suction nozzle 2 can be selected according to the type of carrier tape (paper carrier tape 3, embossed carrier tape 4, 4a) and the thickness of the electronic component 1, 1a. The lowering stroke is adjusted to A or B by a stroke adjusting mechanism (not shown) to perform the suction work.
[0005]
Further, as shown in FIG. 18, the electronic components 1 and 1a adsorbed to the adsorption nozzle 2 in this way have a lowering stroke of the adsorption nozzle 2 by a stroke adjusting mechanism (not shown) according to the thickness of the electronic components 1 and 1a. It was configured to be adjusted on C or D and mounted on the printed circuit board 6.
[0006]
[Problems to be solved by the invention]
However, in the above-described conventional configuration, the height of the tip before the lowering of the suction nozzle 2 is matched to the thick electronic component 1a having a thick component thickness both when the component is sucked and when the component is mounted. In the case of the thin electronic component 1, the descending stroke becomes large, and it is difficult to increase the speed of suction and mounting of the electronic component, and there is also a problem that the impact on the electronic component is large during suction and mounting.
[0007]
SUMMARY OF THE INVENTION It is an object of the present invention to provide an automatic electronic component mounting apparatus capable of solving such a conventional problem and increasing the speed of automatic mounting by shortening the mounting tact and reducing the impact on the electronic component. It is.
[0008]
[Means for Solving the Problems]
In order to solve this problem, the electronic component automatic mounting apparatus according to the present invention has the lowest end position of at least one suction nozzle among the plurality of suction nozzles of each mounting head constituting the head unit. The configuration is set lower than the position.
[0009]
According to the present invention, since the lowering stroke of the suction nozzle at the time of suction and mounting of the thin electronic component can be reduced, the mounting tact can be shortened and high-speed automatic mounting can be achieved, and also the impact on the electronic component can be reduced. it can.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, a horizontally movable supply unit in which a plurality of electronic component supply cassettes wound with taping electronic components are arranged adjacent to each other and a printed circuit board on which the electronic components are mounted are positioned and held. -An XY table that can move horizontally in the Y direction and a plurality of mounting heads that can be selected from a plurality of suction nozzles that suck and hold electronic components are arranged on the periphery, allowing intermittent rotation between the supply unit and the XY table. Each of the mounting heads constituting the head unit. The head unit mounts the electronic component sucked on the printed circuit board held on the XY table by individually sucking the electronic components supplied from the supply unit. Of the multiple suction nozzles,
The structure is such that the shaft on which at least one suction nozzle is mounted is lengthened and the lowermost position of the suction nozzle is set lower than the same position of the other suction nozzles, particularly for thin electronic components. Since the tip of the nozzle is located below the tip of the other suction nozzle, the lowering stroke can be small, shortening the mounting tact and enabling high-speed automatic mounting, and electronic components during suction and mounting Therefore, the reliability of the electronic component mounted on the printed circuit board can be improved.
[0013]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a plan view showing an outline of an electronic component automatic mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a side view thereof, and 9 is a Z that is movable in the Z direction of the symbol in the figure. Tables 5, 5 are electronic component supply cassettes mounted adjacent to each other on the Z table 9, 7 is an XY table movable in the XY direction of the symbol in the figure, and 6 is positioned and held on the XY table 7. The printed circuit board 10 includes a component suction unit that sucks and takes out the electronic component 1 from the electronic component supply cassette 5, the component mounting unit 11 that mounts the electronic component 1 on the printed circuit board 6, and the suction nozzle 2. It is a mounting head.
[0014]
FIG. 3 is a perspective view showing the configuration of the mounting head 8. In FIGS. 1 and 2, the mounting head 8 is from the component suction unit 10 to the component mounting unit 11, and from the component mounting unit 11 to the component suction unit 10. The nozzle selection mechanism 8a incorporated in the mounting head 8 causes one suction nozzle 2 selected from a plurality of nozzles to perform another suction at the time of component suction. It is configured to move downward from the nozzle 2a.
[0015]
Next, FIGS. 4 and 5 show the suction nozzle in the component suction section 10 when only one suction nozzle 2a (length L2) is longer than the other suction nozzle 2b (length L1) (L1 <L2). 6 and 7 for comparison, and the length (L1) of all the suction nozzles in FIG. 6 and FIG. When sucking the thin electronic component 1, as shown in FIG. 4, the suction nozzle 2a is arranged (L2-L1) below the other suction nozzles 2b, so that the downward stroke H2 of the suction nozzle 2a is The downward stroke H1 shown in FIG. 6 for comparison is not necessary, and the downward stroke H2 (H2 <H1) is sufficient, so that the tact improvement and the impact at the time of adsorption can be reduced.
[0016]
When the thick electronic component 1a is picked up, as shown in FIG. 5, a downward stroke of H1 similar to the downward stroke H1 shown in FIG. 7 for comparison is required.
[0017]
Next, FIGS. 8 and 9 show the suction nozzles in the component mounting portion 11 when only one suction nozzle 2a (length L2) is longer than the other suction nozzles 2b (length L1) (L1 <L2). 10 and 11 for comparison, and the length (L1) of all the suction nozzles in FIG. 10 and FIG. When the thin electronic component 1 is mounted, as shown in FIG. 8, the suction nozzle 2a is disposed (L2-L1) below the other suction nozzles 2b, so that the lowering stroke T2 of the suction nozzle 2a is Further, the lowering stroke T1 of FIG. 10 shown for comparison is not necessary, and the lowering stroke T2 (T2 <T1) may be used, so that the tact improvement and the impact at the time of mounting can be reduced.
[0018]
When the thick electronic component 1a is mounted, as shown in FIG. 9, a downward stroke of T3 similar to the downward stroke T3 shown in FIG. 11 for comparison is required.
[0019]
Next, the dimensional relationship when only one suction nozzle is made longer than the other suction nozzles will be described with reference to FIGS.
[0020]
12A shows the positional relationship between the original suction nozzle (length L1) and the printed circuit board 6, and FIG. 12B shows the state in which the thick electronic component 1a is mounted on the printed circuit board 6, and then the thin electronic component. 1 shows the positional relationship of the state where the tip of the suction nozzle is placed downward when mounting 1 on the printed circuit board 6, and the amount of movement (L2-L1) for placing the tip of the suction nozzle 2a downward is as follows: The maximum thickness of the thick electronic component 1a already mounted on the printed circuit board 6 is S2, the thickness of the thin electronic component 1 to be mounted is S3, and the gap between the thick electronic component 1a and the thin electronic component 1 is If S4 is S1, and the clearance between the tip of the original suction nozzle 2 (length L1) and the printed circuit board 6 is S1, then L2-L1 = S1-S2-S4-S3.
[0021]
(Embodiment 2)
FIG. 13 is a perspective view showing a mounting head in which only the shaft 18 to which the suction nozzle 2 according to the second embodiment of the present invention is attached is elongated, and FIG. 14 is a front view of the mounting head. In this way, only the shaft 18 is elongated. Thus, the tip of the suction nozzle 2 is disposed below the tip of the other suction nozzle, so that the lowering stroke of the suction nozzle 2 can be reduced, thereby shortening the mounting tact.
[0022]
In the present embodiment, an example of an electronic component automatic mounting apparatus having a configuration in which the tip of the suction nozzle is disposed below the tip of another suction nozzle is shown, but the present invention is not limited to this. Instead, the component supply unit may move upward in the component suction unit to reduce the lowering stroke of the suction nozzle, and the XY table may move upward in the component mounting unit to reduce the lowering stroke of the suction nozzle. Needless to say, the same effect can be obtained.
[0023]
【The invention's effect】
As described above, the electronic component automatic mounting apparatus according to the present invention can be configured without changing the configuration of the conventional apparatus and without adding a special member. Since the lowering stroke of the suction nozzle at the portion can be reduced, the mounting tact can be shortened and high-speed automatic mounting can be realized.
[0024]
Further, since the lowering stroke is small and the acceleration is small, the impact on the electronic component at the time of component adsorption and component mounting can be reduced.
[0025]
In addition, it is possible to increase the speed by arranging the tip of the suction nozzle in an optimum position according to the electronic component to be mounted, and the suction nozzle can be easily replaced, so that a large effect can be obtained with a small investment. Is.
[Brief description of the drawings]
FIG. 1 is a plan view showing an outline of an electronic component automatic mounting apparatus according to a first embodiment of the present invention. FIG. 2 is a side view of the electronic component mounting apparatus. FIG. 5 is a front view of the main part showing the positional relationship between the mounting head and the thin electronic component in FIG. FIG. 7 is a front view of the main part showing the positional relationship between the mounting head and the thin electronic component in the component suction part shown for comparison. FIG. 8 is a front view of the main part showing the positional relationship between the mounting head and the thin electronic component in the component suction part. FIG. 9 is a front view of the main part showing the positional relationship between the mounting head and the thick electronic component in the part suction part. FIG. 10 shows a part mounting portion shown for comparison. FIG. 11 is a front view of the main part showing the positional relationship between the landing head and the thin electronic component. FIG. 11 is a front view of the main part showing the positional relationship between the mounting head and the thick electronic component in the component mounting part shown for comparison. FIG. 13 is a perspective view showing a mounting head according to a second embodiment of the present invention. FIG. 14 is a front view of the main part of the mounting head. FIG. 16 is a perspective view showing a conventional mounting head. FIG. 17 is a front view of a main part showing a component suction part of various electronic components. FIG. 18 is a main part showing a part mounting part of various electronic components. Front view [Explanation of symbols]
1, 1a Electronic component 2, 2a, 2b Suction nozzle 3 Paper carrier tape 4, 4a Embossed carrier tape 5 Electronic component supply cassette 6 Printed circuit board 7 XY table 8 Mounting head 8a Nozzle selection mechanism 9 Z table 10 Component suction unit 11 Component mounting Part 12 Cylindrical cam 18 shaft

Claims (1)

A horizontally movable supply unit in which a plurality of electronic component supply cassettes wound with taping electronic components are arranged adjacent to each other; an XY table that can move horizontally in the XY direction by positioning and holding a printed circuit board on which the electronic components are mounted; Electrons supplied from the supply unit are arranged between the supply unit and the XY table so as to be intermittently rotatable by disposing a plurality of mounting heads provided with a plurality of suction nozzles for selectively holding electronic components. It consists of a head part that mounts electronic components that are individually attracted to the printed circuit board held on the XY table, and at least one of the plurality of suction nozzles of each mounting head constituting the head part. An electronic component automatic mounting apparatus in which a shaft on which a nozzle is mounted is lengthened and a lowermost position of the suction nozzle is set lower than the same position of other suction nozzles.

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