JPS6151899A - Device for mounting electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a component mounting table for mounting electronic components formed in the form of chips (hereinafter referred to as chip components) onto a printed circuit board or the like.

Conventional configuration and its problems Conventionally, as a device for mounting chip components, etc. on a substrate constituting an electronic circuit, the chip components are sent to a co-supply position by a component supply device for each type, and the chip components are placed in a common supply position. A device has been put into practical use that uses a big-and-place unit to attach one step at a time onto a board.

Hereinafter, a conventional example will be explained with reference to FIGS. 1 to 4.

In FIG. 1, 1 is a loader device for automatically supplying substrates 2, and the substrates 2 loaded in this rotor device 1 are completely fed to an XY table 4 by substrate conveying claws 3.
It can be positioned by υL in the X direction and the Y direction perpendicular to the X direction. 5 is a chip component mounting device, and 6 is a chip component supply unit that can reciprocate linearly.

FIG. 2 is a diagram of the chip component mounting device A 5, in which the chip components 8 are sucked from the component supply section by the suction nozzle γ and mounted on the single stack plate 2. Figure 3 is a diagram of the suction nozzle, al,
bl is the dimension of the suction surface, and C is the suction hole. Figure 4 shows the taping of chip parts 2L2. b2 is the dimension of the chip component, a3. b3 is the dimension of the chip component storage cavity of the taping. In the conventional chip component mounting apparatus 5, components are attracted and mounted using the same suction nozzle 7, and interference with already mounted components must be avoided during component mounting, so the size of the nozzle suction surface is λ1. b1 is the chip component size &2. Compared to b2, al more a2゜bl more b2
It had to be.

As chip parts become smaller, A2xB2 becomes 1.5M? t
L
&2.

b3-b2 (a clearance of 0.2 to 0.3 is required for 7-ping production) is a2. Since the ratio becomes larger than b2, the positional accuracy of the chip component within the cavity deteriorates. For taping chip parts in the above state, a 1 <& 2 , t) 1 < b 2 @
When suctioning with a pick-up nozzle, the accuracy of the position of the component within the cavity is poor, so there are drawbacks such as incorrect suction of the chip component or vertical suction of the chip component, which lowers the reliability of the suction of the chip component.

OBJECTS OF THE INVENTION The present invention solves the above-mentioned drawbacks and improves the reliability of component suction by stably suctioning parts.

Composition of the Invention The present invention provides an apparatus for mounting chip-like components onto electronic circuit boards, etc., which is equipped with a positioning part that can rotate 3600 degrees and positions the parts with a 2m long regulating claw, and has suction from the supply part to the positioning part. The component suction nozzle of the suction-dedicated axis has a dedicated axis and a dedicated axis for mounting from the position adjustment part to the mounting part, and the component suction nozzle of the suction-dedicated axis has many small suction holes on the suction surface. This is an electronic component mounting device that can stably pick up components, thereby reducing the number of stoppages and cover-up operations in component mounting operations, thereby improving the equipment operating rate.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 6 shows a component mounting section in one embodiment of the present invention. 20 is the tape on which the parts are taped;
The parts are sent at regular intervals using one parts cassette. Reference numeral 22 denotes a shaft dedicated to component suction, which is supported by a slide guide 23 so as to be slidable in the vertical direction, and has a nozzle 24 dedicated to suction at the tip.
is fixed. Reference numeral 25 denotes a shaft dedicated to component mounting, which is supported by a slide guide 23 so as to be slidable in the vertical direction, and has a mounting nozzle 26 fixed to its tip. 22゜2
The shaft of 5 is hollow and connected to a vacuum source through a tube 27. The component suction shaft 229 and the component mounting shaft 25 are coupled to bobbins 30 and 31 of the movable coil HIJ near motor by arms 28 and 29, respectively, and are driven in the vertical direction. 32 is a swing motor that rotates around the vertical linear motor and picks up parts Il! 111221 Parts mounting shaft 2
5 in the horizontal direction.

Reference numeral 33 denotes a position regulating section for positioning the component by means of a regulating claw 34, which is positioned at an arbitrary angle by a timing belt 35 and a pulse motor 36. 37 is a circuit board, and 38 is a chip-shaped component mounted on the mounting shaft 25.

FIG. 6 is an enlarged view of the suction surface of the suction nozzle 24, which is a multi-hole nozzle having many suction holes 40 smaller than the chip components on the suction surface. FIG. 7 shows a suction nozzle suctioning a taped chip component, and the suction nozzle has a structure in which the suction nozzle, ermi (diameter c1) is larger than the taping cavity size (a3Xb3). Figure 8 shows a mounting nozzle mounting a chip component on a circuit board. In other words, in order to avoid interference with the mounted components and mount the chip components at high density, the suction surface (diameter c2) of the mounting nozzle is attached to the target chip. The structure is smaller than the surface of the part.

Figure 9 is an enlarged view of the suction surface of the suction nozzle 24 used in the second embodiment, and the suction surface has many slits 41 that are narrower than the chip components, and has the same effect as the multi-hole nozzle shown in Figure 6. .

The operation of the component mounting device, which has the following configurations, will be described below.

First, the component suction shaft 22 descends, and the component suction multi-hole nozzle 2
4 covers the entire area of the taping cavity to ensure that the parts are attracted. Next, the suction shaft 22 rises, moves in the horizontal direction, and descends again to position the parts being sucked at the 4th position of the position regulating part 33.
the two regulating claws 34. The position of the component is determined by the four regulating claws 34, and the component is suctioned by the suction nozzle 26 of the descending mounting shaft 26. The mounting shaft 25 rises, moves horizontally, and descends to mount the component held by the suction nozzle 26 onto the circuit board 37. In order to shorten the component mounting time, the component transfer operation from the taping of the suction @ 22 to the position adjustment section and the transfer operation of the mounting shaft 25 from the position adjustment section to the circuit board are completely synchronized.

As described above, the shaft exclusively for suction, which is equipped with a component positioning part and has a multi-hole nozzle from the supply part to the positioning part, and the shaft dedicated to mounting from the positioning part to the part of the device such as a circuit board, can be used to The supply section for taping etc. uses a multi-hole nozzle to reliably pick up components, and after the components are accurately positioned in the component positioning section, the components can be mounted with high density using suction nozzles corresponding to the components. In addition to improving component mounting accuracy and mounting density, the reliability of suction at the supply section is improved, and the number of stoppages and cover operations of component transfer operations is reduced, thereby increasing the operating rate.

Note that although the imitation nozzle 24 is a porous nozzle, it may also be a nozzle-like or porous one with a suction surface.
The suction surface of the filter is the largest area where parts may be positioned like a taping cavity [L'1
It is sufficient if the suction surface has enough area to hold the parts and has suction holes smaller than the parts on the entire suction surface.

Alternatively, a suction nozzle with a plurality of slits narrower in width than the chip component on the suction surface as shown in FIG. Transfer from supply section with nozzle to position regulation section 11
The suction shaft that performs the
By providing a shaft with a suction nozzle that is smaller than the surface area of the chip component to be subjected to 1R, it is possible to receive suction signals from the component supply section without compromising the accuracy of mounting the component onto the 141 and the mounting density. This has the practical effect of improving performance and improving equipment operation rate.

[Brief explanation of drawings]

Fig. 1 is an overall perspective view of a conventional electronic component mounting machine, Fig. 2 is a partial sectional view of a conventional component mounting device, Fig. 3 is an enlarged perspective view of a component suction nozzle, and Fig. 4 is a taping state of components. , FIG. 5 is a perspective view of a component mounting device according to an embodiment of the present invention, FIG. 6 is an enlarged perspective view of a suction nozzle according to an embodiment of the present invention, and FIG. 7 is a suction example of the same fil. FIG. 8 is a perspective view showing a state in which the nozzle attracts a chip on the taping. FIG. 8 is a perspective view showing the device nozzle of the same embodiment in a state where a chip component is mounted/1°C. FIG. FIG. 3 is an enlarged perspective view of the suction nozzle of the embodiment. 20...Taping, 22...Adsorption 1Jql+
, 24... Adsorption porous nozzle, 26... Mounting axis, 26... Mounting nozzle, 32... Rocking motor,
33 - Position regulating section. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 7
Figure 8 Figure 9

Claims (1)

[Claims] A device that mounts electronic components, etc. onto circuit boards, and is equipped with a positioning section for positioning the components.A suction shaft transfers the components from the component supply section to the positioning section, and a mounting shaft moves the components from the positioning section to the circuit board, etc. The suction nozzle at the tip of the suction shaft has a suction area that covers the maximum area where the parts may be positioned in the parts supply section, and the suction nozzle on the suction surface An electronic component mounting device in which a plurality of holes or narrow slits having a diameter smaller than the cross-sectional area of the mounting shaft are provided, and a suction nozzle at the tip of the mounting shaft has a suction area smaller than the area of the upper surface of the target component.