JPS61265221A - Positioning device for electronic parts - Google Patents

Positioning device for electronic parts

Info

Publication number
JPS61265221A
JPS61265221A JP60107524A JP10752485A JPS61265221A JP S61265221 A JPS61265221 A JP S61265221A JP 60107524 A JP60107524 A JP 60107524A JP 10752485 A JP10752485 A JP 10752485A JP S61265221 A JPS61265221 A JP S61265221A
Authority
JP
Japan
Prior art keywords
electronic component
jig
electronic part
positioning
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60107524A
Other languages
Japanese (ja)
Inventor
Wataru Hidese
渡 秀瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60107524A priority Critical patent/JPS61265221A/en
Publication of JPS61265221A publication Critical patent/JPS61265221A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable a device to position an electronic parts, even if it is in very small size and large in height, in a sure attitude, by providing a frame member, for preventing the electronic part from tumbling, in an electronic part positioning means correcting the attitude of the electronic part. CONSTITUTION:A positioning device, providing in a jig 30 a hole 31 for squared type positioning and preventing an electronic part 14 from tumbling, transfers the electronic part 14 to said hole 31 to be positioned by a reference surface 34. While the jig 30 provides a notch 37 for avoiding a burr in the electronic part 14. While a plate 29 provides in its upper part a mesh 35 for regulating a vacuum pressure and small holes 41 for a vacuum in several places. Behind the plate, the device provides a substrate holder 7 holding a printed substrate 8 in a standby state. In an upper part of these in the above, the device provides transfer heads 2a, 2b, transferring the electronic part 14, so as to simultaneously move in a direction D in the drawing.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品をプリント基板へ自動装着する電子
部品自動装着装置の電子部品位置決め装置に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component positioning device for an electronic component automatic mounting device that automatically mounts electronic components onto a printed circuit board.

従来の技術 従来の電子部品位置決め手段には、例えば特開昭157
−147243号公報に示すように、X軸とY軸の四方
向からの爪等により電子部品を挾み位置決めを行なう構
成、又は、第6図に示すようにプレート29上のメツシ
ュ(金鋼)3ら上の電子部品14が移載されL型の位置
決め用治具39がF方向(矢印)に移動を行ない吸着位
置38までに移動することにより、位置決めを行なう構
成となっている。
2. Prior Art Conventional electronic component positioning means include, for example, Japanese Patent Laid-Open No. 157
As shown in Japanese Patent No. 147243, electronic components are sandwiched and positioned by claws from four directions along the The upper electronic component 14 is transferred and the L-shaped positioning jig 39 moves in the F direction (arrow) to the suction position 38 to perform positioning.

発明が解決しようとする問題点 しかし、前記四方向からの位置決め装置は複雑で部品点
数が多くコスト高となる傾向があり、又、第5図の構成
では構造は簡素になっているが、第6図(イ)に示すよ
うにプレート29上とメッ7ュ(金鋼)36上の電子部
品14が前記治具39によりF方向に押され移載ヘッド
の吸着位置38までの移動中に同図(ロ)に示すように
電子部品14が極小で背が高い場合、H2の方向に倒れ
ることがあり、このままプリント基板へ装着する恐れが
あり、不良品を生産してしまう問題が生じていた。
Problems to be Solved by the Invention However, the positioning device from four directions is complicated, has a large number of parts, and tends to be expensive.Also, although the structure shown in FIG. 5 is simple, As shown in Figure 6 (A), the electronic components 14 on the plate 29 and the mesh 7 (metal steel) 36 are pushed in the F direction by the jig 39 and are simultaneously moved to the suction position 38 of the transfer head. If the electronic component 14 is very small and tall as shown in Figure (b), it may fall in the direction of H2, and there is a risk that it will be attached to the printed circuit board as it is, resulting in the production of defective products. .

そこで、本発明は、構造を簡素に構成し、又位置決め速
度を上げ極小又は背が高い電子部品の倒れを防ぎ位置決
めを安定して行なえるようにするものである。
Therefore, the present invention has a simple structure, increases the positioning speed, prevents extremely small or tall electronic components from falling down, and enables stable positioning.

問題点を解決するだめの手段 そして、前記問題点を解決する本発明の技術的手段は前
記位置決めのL型治具に倒れ防止用の枠を設は口型治具
にしたものである。
Means for Solving the Problems And, the technical means of the present invention for solving the above-mentioned problems is that the L-shaped positioning jig is provided with a frame to prevent it from falling over, making it a mouth-shaped jig.

作   用 この技術的手段による作用は次のようになる。For production The effect of this technical means is as follows.

位置決め用治具の端面により位置決めが行なわれ、電子
部品が位置決め用治具によシ移動する際、倒れが生じよ
うとすると基準面の反対側に枠部材が電子部品を保持し
倒れの防止を行なう。
Positioning is performed by the end face of the positioning jig, and when the electronic component is moved by the positioning jig and is about to fall, the frame member holds the electronic component on the opposite side of the reference surface to prevent it from falling. Let's do it.

その結果正常な姿勢で電子部品の中心を移載ヘッドの吸
着位置中心に位置決めを行ないながら移動が出来、又移
動速度も速く出来る。
As a result, the electronic component can be moved in a normal posture while positioning the center of the electronic component at the center of the suction position of the transfer head, and the moving speed can be increased.

実施例 以下、本発明の実施例について説明する。Example Examples of the present invention will be described below.

まず、プリント基板8の流れに沿って説明する。First, the flow of the printed circuit board 8 will be explained.

第1図において、正面より左側にプリント基板8をスト
ックする基板ストック19と、す7ター装置(ローダ)
3と、プリント基板8を押し出し、供給を行なう押し出
し装置5と、搬送コンベア9が設けられ、中央では、X
、Yに移動を行なう基板ホルダー7へプリント基板8が
C方向に搬送され、基板ホルダー7により位置決めされ
たプリント基板8に電子部品14が装着される。装着工
程については後で詳述する。正面より右側には、電子部
品14が装着されたプリント基板8が搬出ガイドレール
12と搬出装置11によりリフター装置(アンローダ)
13に保持された基板ストック4へ挿入される。中央手
前にはX−Yテーブル15上の電子部品供給装置21に
装着された治具2゜がネジ33により固定され治具2o
に電子部品14が装着されており、その下部に電子部品
14を突き上げるビンを作動させる突き上げ装置16(
以下エジェクタと略す)が設けられ、その後方に電子部
品位置決め装置17(以下プリセンターと略す)が設け
られている。ブリセンター17は、ベースプレート28
上にY軸を駆動するモータ24とガイドレール26が設
けられ、その上部にX軸を駆動するモータ23とガイド
レール26が設けられ、その上部にプレート27が設け
られ、更にその上部にブロック261C取シ付けられた
治具3oが、ネジ32に固定されておシ治具30の下部
にプレート29がベースプレート28に固定されている
。治具3oには、口型の位置決めと電子部品14の倒れ
防止の穴31があシ、その穴31に、電子部品14が移
載され基準面34により位置決めがされる。又、治具3
0には電子部品14のパリを避ける為の切り欠き37が
設けである。
In Fig. 1, the board stock 19 for stocking the printed circuit boards 8 on the left side from the front and the loader device (loader)
3, an extrusion device 5 for extruding and supplying printed circuit boards 8, and a conveyor 9.
The printed circuit board 8 is conveyed in the direction C to the circuit board holder 7 which moves in the directions , Y, and the electronic component 14 is mounted on the printed circuit board 8 positioned by the circuit board holder 7 . The mounting process will be described in detail later. On the right side of the front, a printed circuit board 8 on which electronic components 14 are mounted is moved to a lifter device (unloader) by an unloading guide rail 12 and an unloading device 11.
It is inserted into the substrate stock 4 held at 13. In front of the center is a jig 2o mounted on the electronic component supply device 21 on the X-Y table 15, which is fixed with a screw 33.
An electronic component 14 is attached to the bottom of the electronic component 14, and a push-up device 16 (
An electronic component positioning device 17 (hereinafter referred to as precenter) is provided behind the ejector. The center 17 is the base plate 28
A motor 24 for driving the Y axis and a guide rail 26 are provided on the top, a motor 23 and a guide rail 26 for driving the X axis are provided on the top, a plate 27 is provided on the top, and a block 261C is provided on the top. The attached jig 3o is fixed to screws 32, and a plate 29 is fixed to the base plate 28 at the bottom of the jig 30. The jig 3o has a hole 31 for positioning the mouth mold and preventing the electronic component 14 from falling.The electronic component 14 is transferred into the hole 31 and positioned using a reference surface 34. Also, jig 3
0 is provided with a notch 37 to prevent the electronic component 14 from collapsing.

前記プレート29の上部にバキューム圧を調整するメツ
シュ(金鋼)35が設けてあシ、プレート29には、バ
キューム用の小さな穴41が数ケ所設けである。その後
方に前記プリント基板8が待機している基板ホルダー7
が設けである。これらの上部に電子部品14を移載する
移載ヘッド2a。
A mesh (metal steel) 35 for adjusting the vacuum pressure is provided on the top of the plate 29, and the plate 29 is provided with several small holes 41 for vacuum. Board holder 7 with the printed circuit board 8 waiting behind it
is the provision. A transfer head 2a transfers the electronic component 14 onto these upper parts.

2bがD方向に同時に移動するように設けられ。2b are provided so as to move simultaneously in the D direction.

移載ヘッド2a、2bのノズル19a、19bにより電
子部品14を吸着する。
The electronic component 14 is sucked by the nozzles 19a and 19b of the transfer heads 2a and 2b.

次に作用について述べる。電子部品供給装置21により
任意に選別された治具20上の電子部品14をX−Yテ
ーブル15により入方向に移動を行ない吸着位置で待機
する。その上部に移載ヘッド2aがD方向に移動を行な
いE方向にノズル19aが下降し、電子部品14を吸着
し、E方向に上昇を行なうと同時に下部のエジェクター
16のビン(図示されていない)が上昇して電子部品1
4の下部を突き上げる。電子部品14を吸着した移載ヘ
ッド2aはブリセンター17の治具3oの穴31に移載
し、ノズル19はバキューム吸引を止め上昇する。第3
,4図に示すように治具30がプレート29上をF方向
に移動を行なうと、電子部品14はプレート29上のメ
ツシュ(金鋼)35との摩擦抵抗とバキューム圧により
、その場に留まろうとするが治具30がF方向に移動す
ると基準面34の2面に接触し、電子部品14は位置決
めが行なわれ、電子部品14の中心を移載ヘッド2bの
中心、すなわち移載ヘッド2bの吸着位置まで移動する
。この際、電子部品14が極小で背が高い場合、第4図
(ロ)に示すように治具30がF方向に移動するとH1
方向に倒れようとするが、電子部品14を押す治具3o
の基準面34の反対側のガイド4oが倒れを防止し、正
常な姿勢で吸着位置へ位置決めされる。位置決めされた
電子部品14は移載ヘッド2bのノズルi9bがE方向
に下降し吸着を行ない、E方向に上昇し、D方向に後退
し、プリント基板8へ装着が行なわれる。
Next, we will discuss the effect. The electronic components 14 on the jig 20, arbitrarily selected by the electronic component supply device 21, are moved in the incoming direction by the X-Y table 15 and are waited at a suction position. At the top, the transfer head 2a moves in the D direction, the nozzle 19a descends in the E direction, picks up the electronic component 14, and at the same time moves up in the E direction, the ejector 16 at the bottom (not shown) rises and electronic components 1
Push up the bottom of 4. The transfer head 2a that has sucked the electronic component 14 is transferred to the hole 31 of the jig 3o of the pre-center 17, and the nozzle 19 stops vacuum suction and ascends. Third
, 4, when the jig 30 moves on the plate 29 in the F direction, the electronic component 14 remains in place due to the frictional resistance with the mesh (gold steel) 35 on the plate 29 and the vacuum pressure. However, when the jig 30 moves in the F direction, it contacts two surfaces of the reference surface 34, and the electronic component 14 is positioned, and the center of the electronic component 14 is moved to the center of the transfer head 2b, that is, the transfer head 2b. Move to the suction position. At this time, if the electronic component 14 is very small and tall, when the jig 30 moves in the F direction as shown in FIG.
The jig 3o that pushes the electronic component 14 tries to fall in the direction
The guide 4o on the opposite side of the reference surface 34 prevents the guide 4o from falling down and is positioned at the suction position in a normal posture. The nozzle i9b of the transfer head 2b descends in the E direction to suction the positioned electronic component 14, rises in the E direction, retreats in the D direction, and is mounted on the printed circuit board 8.

以上のように第3,4図に示すように治具3゜に口型Q
倒れ防止のガイド4oを取り付けた穴31を設けたこと
により、極小で背が高い電子部品14の倒れを防止する
ことが出来る。
As mentioned above, as shown in Figures 3 and 4, the mouth shape Q is placed on the jig 3°.
By providing the hole 31 to which the guide 4o for preventing falling is provided, it is possible to prevent the extremely small and tall electronic component 14 from falling.

発明の効果 以上のように本発明は、L型治具にガイドを設は口型治
具にしたことにより、極小で背が高い電子部品の倒れ防
止を行ない、確実な姿勢にて位置決めを行なえるため、
不良品の生産を少なくすることができ、又、構造が簡素
でコストパフォーマンスに優れた電子部品位置決め装置
を実現できるものである。
Effects of the Invention As described above, the present invention uses an L-shaped jig with a guide and a mouth-shaped jig to prevent extremely small and tall electronic components from falling over and to position them in a reliable posture. In order to
The production of defective products can be reduced, and an electronic component positioning device with a simple structure and excellent cost performance can be realized.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例における電子部品位置決め装置
を備えた電子部品自動装着装置の斜視図、第2図は同位
置決め装置の斜視図、第3図は同位置決め装置の要部斜
視図、第4図は同位置決め装置の治具の要部断面図、第
5図は従来の位置決め装置の一部斜視図、第6図は同断
面図である。 1・・・・・・電子部品自動装着装置、2・・・・・移
載ヘッド、3・・・・・・リフター装置(ローダ)、4
・・・・・基板ストック、5・・・・・・押し出し装置
、7・・・・・・基板ホルダー、8・・・・・・プリン
ト基板、9・・・・搬送コンベア。 11・・・・・・搬出装置、12・・・・・・搬出ガイ
ドレール、13・・・・・リフター装置(アンローダ)
、14・・・・・電子部品、16・・・・・・XYテー
ブル、16・・・・・突き上げ装置(エジェクター)、
17・・ 位置決め装置、19・・・・・・ノズル、2
0・・・・・・治具、30・・・・・・位置決め治具、
31・・・・・・位置決め用穴、34・・・・・・基準
面、35・・・・・・メツシュ(金鋼)、4o・・・・
・・倒れ防止ガイド枠。
FIG. 1 is a perspective view of an electronic component automatic mounting device equipped with an electronic component positioning device according to an embodiment of the present invention, FIG. 2 is a perspective view of the same positioning device, and FIG. 3 is a perspective view of essential parts of the same positioning device. FIG. 4 is a sectional view of a main part of the jig of the positioning device, FIG. 5 is a partial perspective view of the conventional positioning device, and FIG. 6 is a sectional view of the same. 1... Electronic component automatic mounting device, 2... Transfer head, 3... Lifter device (loader), 4
... Board stock, 5 ... Extrusion device, 7 ... Board holder, 8 ... Printed circuit board, 9 ... Conveyor. 11... Carrying out device, 12... Carrying out guide rail, 13... Lifter device (unloader)
, 14... Electronic parts, 16... XY table, 16... Push-up device (ejector),
17... Positioning device, 19... Nozzle, 2
0... Jig, 30... Positioning jig,
31...Positioning hole, 34...Reference surface, 35...Mesh (gold steel), 4o...
・Guide frame to prevent falling.

Claims (1)

【特許請求の範囲】[Claims]  電子部品を供給する電子部品供給装置と、前記電子部
品を吸着する吸着ノズルを有する移載装置と、前記電子
部品の姿勢を補正する電子部品位置決め手段と、プリン
ト基板を搬送する搬送装置を備え、電子部品位置決め手
段に電子部品の倒れ防止用の枠部材を設けたことを特徴
とする電子部品位置決め装置。
An electronic component supply device that supplies electronic components, a transfer device that has a suction nozzle that sucks the electronic component, an electronic component positioning device that corrects the posture of the electronic component, and a conveyance device that conveys a printed circuit board, An electronic component positioning device characterized in that the electronic component positioning means is provided with a frame member for preventing the electronic component from falling.
JP60107524A 1985-05-20 1985-05-20 Positioning device for electronic parts Pending JPS61265221A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60107524A JPS61265221A (en) 1985-05-20 1985-05-20 Positioning device for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60107524A JPS61265221A (en) 1985-05-20 1985-05-20 Positioning device for electronic parts

Publications (1)

Publication Number Publication Date
JPS61265221A true JPS61265221A (en) 1986-11-25

Family

ID=14461375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60107524A Pending JPS61265221A (en) 1985-05-20 1985-05-20 Positioning device for electronic parts

Country Status (1)

Country Link
JP (1) JPS61265221A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330796A (en) * 1998-05-08 1999-11-30 Matsushita Electric Ind Co Ltd Misalignment correcting device of electronic component and method for correcting misalignment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330796A (en) * 1998-05-08 1999-11-30 Matsushita Electric Ind Co Ltd Misalignment correcting device of electronic component and method for correcting misalignment

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