JPH05152782A - Electronic parts mounting device - Google Patents

Abstract

PURPOSE:To automatically rearrange backup pins with a mounting head at the time of supporting a circuit board on which parts are to be mounted with the backup pin group. CONSTITUTION:The backup pins of a board supporting section 60 support a circuit board 1. A backup pin stocker 70 is provided beside the section 60 and holds backup pins which are not required for the present time. A mounting head 30 picks up parts from parts supplying sections 14 and 15 and mounts the picked-up parts on the circuit board 1. A nozzle 33 is attached to the head 30 in a removable state and a nozzle exchanging section 40 exchanges the nozzle 33 with another nozzle 33. The section 40 also holds a backup pin attracting nozzle and, at the time of rearranging the backup pins, the head 30 performs the mounting work after exchanging the ordinary nozzle 33 with the backup pin attracting nozzle.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus of the type that mounts electronic components on a substrate supported by backup pins.

[0002]

2. Description of the Related Art When mounting electronic components on a substrate, it is already widely practiced to support the substrate with a group of backup pins arranged so as to avoid components on the back surface of the substrate. Japanese Patent Laid-Open No. 3-8
The device described in Japanese Patent No. 2197 also shows an example thereof. In this device, a backup pin mount head is attached in place of a normal component mounting head so that the backup pins can be rearranged.

[0003]

[Patent Document 1] Japanese Patent Application Laid-Open No. 3-82197
In the device of the publication, when rearranging the backup pins,
Since the head itself is replaced, the structure becomes complicated. The present invention aims to achieve the same object with a simpler configuration.

[0004]

In the present invention, the nozzles of the mounting head are exchangeable, and a backup pin suction nozzle is included in the nozzle group held by the nozzle exchange section.

[0005]

The mounting head normally mounts components using nozzles for mounting components. When the board model changes and it becomes necessary to change the arrangement of the backup pins, the mounting head mounts the normal nozzles in the nozzle replacement section and installs the backup pin suction nozzles instead. The backup pin is sucked up by this nozzle and the arrangement is changed.

[0006]

Embodiment An embodiment will be described with reference to the drawings. The component mounting device 10 mounts electronic components on the electronic circuit board 1, has a box-shaped base 11, and has various components arranged in a table portion 12 on the upper surface thereof. That is, 13 is a conveyor section that passes through the center of the table section 12, 14 is a first component supply section arranged on one side of the conveyor section 13, and 15 is a second component supply section arranged on the opposite side of the conveyor 13. .. The conveyor section 13 plays a role of feeding in and out of the electronic circuit board 1.

The first component supply unit 14 is formed by arranging a plurality of component supply devices 16 in a horizontal row. The individual component supply device 16 is of a type that supplies components using a component tape in which the components are accommodated at a constant pitch, but there are many literature examples of this type of supply device (eg, US Pat. No. 4,735). 341
No.) is well known, and therefore detailed description thereof is omitted.

The second component supply section 15 has a cabinet 17 installed beside the base 11 as a main portion, but the base 11
The positioning portion 18 installed above is also a part of the constituent elements. The cabinet 17 is equipped with a Cartesian coordinate type robot 19, which is a multi-reader such as a flat pack IC from a tray (not shown) in the cabinet 17.
The pickup component 2 is picked up and placed on the positioning portion 18. In the positioning section 18, the multiple lead parts 2 are pushed so that the plurality of jaws do not bend the leads, and the positioning is roughly performed. Then, the mounting head described later approaches the positioning portion 18 and picks up the multi-lead component 2.

An XY stage 2 is provided above the table portion 12.
0 is set. The XY stage 20 has a table section 12
The table portion 12 is formed by the columns 21 rising from the four corners.
It is highly supported above. Reference numeral 22 denotes a bridge portion that is a part of the XY stage 20, and connects the upper ends of the two columns 21 to each other in the direction of the short side of the table portion 12. 23
Is a linear slide guide which is also a part of the XY stage 20, and the upper ends of the two columns 21 are connected to each other through the table portion 12.
Are connected in the long side direction. The two linear slide guides 23 support the X movement block 24. X motion block 24
Is a ball screw 25 hung between the two bridge portions 22 and a motor 26 for rotating the ball screw 25.
It moves along the linear slide guide 23. The X motion block 24 has a built-in Y motion unit that supports the mounting head 30 and moves the mounting head 30 in a direction perpendicular to the linear slide guide 23. The movement mechanism of the Y movement unit is also
Like the X-moving block, it is a ball screw and a motor.

The mounting head 30 is supported by the XY stage 20 in a suspended state, and has a spindle 31 shown in FIG. 3 in the cover portion. The spindle 31 is supported so that it can be raised and lowered, and a vacuum passage 32 is formed inside. A nozzle 33 is attached to the lower end of the spindle 31. The nozzle 33 is detachable, and a pair of pinch levers 34 attached to the spindle 31 sandwich the pinch lever 34 with the force of the spring 35 to maintain the connection state with the spindle 31. Numeral 36 indicates a lead sucked by the nozzle 33.
Although this is a jaw for positioning the dress component 3, description of the operating mechanism is omitted.

Reference numeral 40 denotes a nozzle exchanging portion arranged next to the positioning portion 18 of the second component supplying portion 15. The nozzle replacement unit 40 always holds a plurality of types of replacement nozzles 33 and replaces the nozzle 33 at the lower end of the spindle 31 according to the type of component, but the mechanism is not the purpose of the present invention. Is omitted, and JP-A-59-69992 is disclosed.
JP-A-63-16700, JP-A-1-12113
It is only stated that the mechanism as described in Japanese Patent No. 8 is adopted.

The conveyor section 13 has a fixed rail section 51 and a movable rail section 52. “Movable” of the movable rail portion 52 means that the distance between the movable rail portion 52 and the fixed rail portion 52 can be adjusted. Both the fixed rail portion 51 and the movable rail portion 52 have a belt 53 on the inner surface, and the circuit board 1 is transported by this. Positioning means for stopping the circuit board 1 at a fixed position is provided in the middle of the conveyor portion 13, but this is not shown.

A substrate supporting portion 60 is placed between the fixed rail portion 51 and the movable rail portion 52. The board supporting portion 60 supports the circuit board 1 positioned on the conveyor 13 from below, and prevents the circuit board 1 from bending even when pressure is applied by the spindle 31. Similar to the device disclosed in Japanese Patent Laid-Open No. 59-29492, the board supporting portion 60 supports the circuit board 1 by a plurality of backup pins 63 (FIG. 4) planted in the holes 62 of the backup pin base 61.

A backup pin stocker 70 is placed next to the substrate support 60. This is a backup pin base 6
It is much lower than 1, and a backup backup pin 63 is held upright in the hole 71.

For the backup pin 63, a backup pin suction nozzle 80 as shown in FIG. 4 is prepared. The backup pin suction nozzle 80 is held by the nozzle exchanging section 40 like the normal nozzle 33.

The mounting head 30 has a first image pickup section 91 and a second image pickup section 91.
The image pickup section 92 is attached, and the third image pickup section 93 is arranged beside the conveyor section 13. Each of the first image pickup unit 91, the second image pickup unit 92, and the third image pickup unit 93 is mainly composed of an industrial television camera. The first image pickup unit 91 is used for recognizing a reference mark (fiducial mark) printed on the circuit board 1, and the second image pickup unit 92 is also used for the foot pattern (multi lead) printed on the circuit board 1. It is used to recognize the lead of the component 3 and the land pattern for soldering. Third
The image pickup section 93 is installed beside the positioning section 18 so as to look upward, and is used for recognizing the multi-read component 2.

The automatic control system of the electronic component mounting apparatus 10 is as shown in FIG. Reference numeral 100 denotes a main body control unit, which is a central processing unit 101, to which a memory 102, a CRT 103, and a keyboard 104 are attached. The central processing unit 101 includes a lighting controller 106, an XY stage controller 107, a mounting head controller 108, a nozzle exchanging unit controller 109, and a conveyor controller 11 via a bus line 105.
0, the board supporting unit controller 111, and the component supplying unit controller 112 are controlled. The lighting controller 106 controls the lighting unit 113. The lighting unit 113 is a collective name of lighting units (not shown) that are respectively combined with the first imaging unit 91, the second imaging unit 92, and the third imaging unit 93. is there.

A recognition unit 120 is provided separately from the main body control unit 100. This is the central processing unit 121 and the attached memory 12
2, a CRT 123, an A / D conversion unit 125 connected to the central processing unit 121 via a bus line 124, and an image processing unit 126. The A / D conversion unit 125 is connected to the first imaging unit 91, the second imaging unit 92, and the third imaging unit 93. The central processing unit 121 is connected to the central processing unit 101 of the main body control unit 100 by a communication line 130. A communication line 131 with an external device is also connected to the central processing unit 101.

The electronic component mounting apparatus 10 operates as follows. When the conveyor section 13 positions the circuit board 1 on the board supporting section 60, the backup pin base 61 rises to support the circuit board 1 with the backup pins 63. The circuit board 1 is already coated with an adhesive at the place where the component is to be mounted. After that, the mounting head 30 starts to operate, picks up a component from the first component supply unit 14 or the second component supply unit 15, and mounts it on the circuit board 1. The positional deviation of the circuit pattern of the circuit board 1 is checked by the first image pickup section 91 recognizing the reference mark, and is corrected in the movement of the XY stage 20. The leadless component 3 is sandwiched by the jaws 36 and centered with respect to the nozzle 33. However, in the case of the multilead component 2, the leadless components 3 are not sandwiched by the jaws 36, and the nozzle 33 is used by the third imaging unit 93. The position shift of the XY stage 20 and the angle of the spindle 31 are corrected based on the result by checking the position shift of the foot pattern with the second image pickup section 92.

When the type of the circuit board 1 changes and it becomes necessary to change the position of the backup pin 63, the mounting head 30 goes to the nozzle exchanging section 40, and the component mounting nozzle 33 is sucked by the backup pin. Nozzle 80
Change to. Then, the backup pin base 61 is returned to the top, and the backup pin 63 that needs to be moved is adsorbed, pulled up, and inserted into the desired hole 62. The extra backup pins 63 are returned to the backup pin stocker 70, and conversely, if the number of backup pins 63 is insufficient, they are taken out from the backup pin stocker 70. After the rearrangement of the backup pins 63 is completed in this way, the mounting head 30 returns the backup pin suction nozzle 80 to the nozzle exchanging section 40 and replaces it with the nozzle 33 to prepare for the mounting operation.

[0021]

According to the present invention, it is possible to automatically rearrange the backup pins by simply changing the nozzles, the mechanism of the mounting head is not complicated, and the head weight is not increased. Therefore, the mounting head can automatically rearrange the backup pins without sacrificing high speed.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of an electronic component mounting apparatus.

FIG. 2 is a block diagram showing a control system.

FIG. 3 is a cross-sectional view of a spindle unit on which a nozzle is mounted.

FIG. 4 is an explanatory diagram of a backup pin rearrangement work.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 circuit board 2 multi lead parts 3 leadless parts 10 electronic part mounting device 14 first part supply part 15 second part supply part 60 board support part 63 backup pin 70 backup pin stocker 30 mounting head 33 nozzle 40 nozzle replacement Part 80 Backup pin suction nozzle

Claims (1)

[Claims] 1. An electronic component mounting apparatus having the following configuration. a. Parts supply department. b. A board support part that supports the board on which the parts are to be mounted with backup pins. c. A backup pin stocker that holds those of the above-mentioned backup pins that are not needed for the time being. d. A mounting head for mounting a component supplied from the component supply unit onto a substrate on the substrate support unit. e. A nozzle exchanging unit that supplies to the mounting head what is necessary for the mounting operation from among the nozzle group that it holds. f. A backup pin suction nozzle that is included in the nozzle group and is used for rearrangement of backup pins.