JP2010278268A - Electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shape a suction hole of a suction nozzle so that a suction error does not occur as much as possible. <P>SOLUTION: The external shape of a suction surface of the suction nozzle 5 is sized to be a little smaller than the external shape of a suction surface of an electronic component D, such that the whole electronic component D is not covered. The suction hole 11 at the distal end of the suction nozzle 5 is shaped such that a large-diameter circular hole 11A at a center part communicates with small-diameter circular holes 11B (smaller in opening area than the circular hole 11A) on both sides adjacent to the large-diameter circular hole 11A. Further, the hole 11A and the holes 11B communicate with each other in such a state wherein the length L2 between communication parts of the small-diameter circular holes 11B is shorter than the diameter of the circular hole 11B, namely, the large-diameter circular hole 11A and small-diameter circular holes 11B communicate with each other by forming projection parts 11C narrowing down hole widths so that the circular holes 11B are in an arcuate shape of ≥180°. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus that takes out electronic components supplied from a component supply device by a plurality of suction nozzles provided on a mounting head and mounts the electronic components on a printed board.

  The electronic component mounting apparatus is disclosed in, for example, Patent Document 1, but generally includes a plurality of suction nozzles when taking out an electronic component from the electronic component supply apparatus or mounting the electronic component on a printed circuit board. Yes. The shape of the suction hole 51 at the tip of the suction nozzle 50 is, as shown in FIG. 13, a large-diameter circular hole 51A at the center and a small-diameter circular hole 51B on both sides of the large-diameter circular hole 51A. In general, the length L1 between the communicating portions of the small-diameter circular hole 51B is the same as the diameter of the circular hole 51B. That is, the large-diameter circular hole 51A and the small-diameter circular hole 51B have the same length as the diameter of the circular hole 51B and communicate with each other.

  Further, the outer shape of the suction surface of the suction nozzle 50 is slightly larger than the outer shape of the suction surface of the electronic component D, and is a size that can cover the entire electronic component D.

JP 2009-60132 A

However, the shape of the suction holes as described above, in the small electronic components, the corners of the electronic component enters within the suction holes, it would adsorbs the electronic component obliquely as a result, the electronic component If the original adsorption surface cannot be adsorbed and the detection device detects whether or not the adsorbing surface is adsorbed in a normal posture, an adsorption error occurs.

  Therefore, an object of the present invention is to make the shape of the suction hole of the suction nozzle so that a suction error does not occur as much as possible.

For this reason, according to a first aspect of the present invention, there is provided an electronic component mounting apparatus in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a large-diameter circular hole in the center is connected to a small-diameter circular hole on both sides of the large-diameter circular hole, and the small-diameter circular hole is 180 degrees. It is characterized by the above arc shape.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board.
The suction hole of the suction nozzle is composed of a hole in the central part and a hole having an opening area smaller than the hole in the central part formed at intervals on both sides of the hole in the central part. Features.

According to a third aspect of the present invention, there is provided an electronic component mounting apparatus in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board.
The suction hole of the suction nozzle is composed of a large-diameter circular hole at the center and a small-diameter circular hole formed on both sides of the large-diameter circular hole at intervals.

4th invention is the electronic component mounting apparatus which takes out the electronic component supplied from the component supply apparatus with the suction nozzle provided in the mounting head, and mounts it on a printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a central hole in the central portion and a hole having an opening area smaller than the central hole are connected to both sides of the central hole, and a surface facing the communicating portion Each of the protrusions is formed so as to narrow the hole width toward the surface.

According to a fifth aspect of the present invention, there is provided an electronic component mounting apparatus for taking out an electronic component supplied from a component supply device by a suction nozzle provided in a mounting head and mounting the electronic component on a printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a central hole in the central portion and a hole having an opening area smaller than the central hole are connected to both sides of the central hole, and a surface facing the communicating portion Each of the protrusions is formed so as to be opposite in direction so as to narrow the hole width toward the surface.

According to a sixth aspect of the present invention, there is provided an electronic component mounting apparatus in which an electronic component supplied from a component supply device is taken out by a suction nozzle provided in a mounting head and mounted on a printed circuit board.
The shape of the suction holes of the suction nozzle and a horizontally elongated hole shape, the walls that face forming the Horizontal holes, each one projecting portion so as to narrow the pore width on both sides toward the one surface to the other surface And another protrusion is formed in the middle of one protrusion formed on both sides so as to narrow the hole width from the other surface toward the one surface.

The seventh invention is an electronic component mounting apparatus for taking out an electronic component supplied from a component supply device by a suction nozzle provided in a mounting head and mounting the electronic component on a printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a wide vertical hole at the center and a narrow vertical hole narrower than the wide vertical hole are connected to both sides of the wide vertical hole. Features.

The eighth invention is an electronic component mounting apparatus for taking out an electronic component supplied from a component supply device by a suction nozzle provided in a mounting head and mounting the electronic component on a printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a wide vertical hole at the center and a narrow vertical hole narrower than the wide vertical hole are connected to both sides of the wide vertical hole, and The communicating portions are characterized in that the protrusions are formed in opposite directions so as to narrow the hole width toward the facing surface.

  A ninth invention is characterized in that, in the first to eighth inventions, the suction surface outer shape of the suction nozzle is made smaller than the outer shape of the suction surface of the electronic component so that the entire electronic component cannot be covered. .

  According to the present invention, the suction error can be reduced by making the shape of the suction hole of the suction nozzle so that the suction error does not occur as much as possible.

The top view of an electronic component mounting apparatus is shown. It is a front view of a mounting head. It is the perspective view seen from the downward direction of the suction nozzle of the state which is carrying out the suction holding of the electronic component. It is a bottom view of the suction hole of the suction nozzle of the first embodiment. It is a bottom view of the suction hole of the suction nozzle of the second embodiment. It is a bottom view of the suction hole of the suction nozzle of the third embodiment. It is a bottom view of an adsorption hole of an adsorption nozzle of a 4th embodiment. It is a bottom view of the suction hole of the suction nozzle of a 5th embodiment. It is a bottom view of the suction hole of the suction nozzle of a 6th embodiment. It is a bottom view of an adsorption hole of an adsorption nozzle of a 7th embodiment. It is a bottom view of an adsorption hole of an adsorption nozzle of an 8th embodiment. It is a bottom view of the suction hole of the suction nozzle of the ninth embodiment. It is a bottom view of the suction hole of the suction nozzle which shows a prior art example.

  An embodiment of an electronic component mounting apparatus 1 for mounting an electronic component on a printed circuit board P, which is a circuit board provided with a circuit on the substrate, will be described below with reference to FIG. The electronic component mounting device 1 includes a transport device 2 for transporting the printed circuit board P, a component supply device 3 for supplying electronic components disposed on the front side and the back side across the transport device 2, and a drive. A mounting head having a pair of beams 4A, 4B movable in one direction (Y direction) by a source and a plurality of suction nozzles 5, each movable by a drive source in a direction along each of the beams 4A, 4B 6 are provided.

  The transport device 2 is disposed at an intermediate portion of the electronic component mounting device 1 and mounts a substrate supply unit that inherits the printed circuit board P from the upstream device and an electronic component that is sucked and held by the suction nozzle 5 of each mounting head 6. In order to do so, the printed circuit board P is supplied with a printed circuit board P. The printed circuit board P is positioned and fixed, and the printed circuit board P on which the electronic component is mounted is transferred to the downstream device. Is done.

  The component supply device 3 includes a feeder base 3A attached to the main body of the electronic component mounting device 1, and a plurality of electronic components arranged in parallel on the feeder base 3A, one for each component take-out portion (component suction position). It is composed of a group of component supply units 3B that supply each one. The component supply unit 3B is equipped with a storage tape that covers a large number of electronic components with cover tapes that are stored at regular intervals in each storage section formed of a concave portion of the carrier tape. By peeling the cover tape, one electronic component is supplied to the component extraction unit of the component supply unit 3B one by one and is extracted from each storage unit by the suction nozzle 5 of the mounting head 6.

  The pair of front and rear beams 4A and 4B that are long in the X direction are individually moved by sliding sliders fixed to the beams 4A and 4B along a pair of left and right front and rear guides driven by a Y direction linear motor. Move in the Y direction. The Y-direction linear motor includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 7A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. Consists of

  The beams 4A and 4B are respectively provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by an X direction linear motor (not shown). The motor is composed of a pair of front and rear stators fixed to the beams 4A and 4B, and a mover provided on the mounting head 6 between the stators.

  Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the printed circuit board P on the positioning unit of the transfer device 2 and the component extraction position of the component supply unit 3B.

Next, a plurality of, for example, twelve suction nozzles 5 that are attached to the lower surface of the mounting head 6 at predetermined intervals on the circumference will be described in detail. For convenience, as shown in FIG . 2, which is a front view of the mounting head 6 with only one suction nozzle 5 attached , the suction nozzle 13 has a flange 10 at the top and is detachably provided on the mounting head 6. . The suction nozzle 5 has a generally rectangular shape at the bottom, and the short sides facing each other are rounded, and the long sides facing each other are rounded so that the central part in the longitudinal direction protrudes outward. The tip nozzle portion 5A and the tip nozzle portion 5B formed on the top of the most advanced nozzle portion 5A and having a lower end shape similar to the tip nozzle portion 5A when viewed from the bottom but gradually becoming circular as it goes upward A second intermediate nozzle portion 5D having a thick intermediate portion, and a first intermediate nozzle portion 5C having a truncated cone shape having a large diameter upwardly connecting the tip nozzle portion 5B and the second intermediate nozzle portion 5D; The uppermost nozzle portion 5F having the thickest diameter at the uppermost portion and the third intermediate nozzle portion 5E having a truncated cone shape having a large diameter upwardly connecting the second intermediate nozzle portion 5D and the upper end nozzle portion 5F. .

  Next, FIG. 3 is a perspective view of the first embodiment of the suction hole of the suction nozzle 5 as seen from below the suction nozzle 5 in a state where the electronic component D is sucked and held, and a bottom view of the suction nozzle 5 This will be described with reference to FIG. First, the outer shape of the suction surface of the suction nozzle 5 is made slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered.

The shape of the suction hole 11 at the tip of the suction nozzle 5 is a large-diameter circular hole 11A at the center, and a small-diameter circular hole located on both sides of the large-diameter circular hole 11A (opened from the circular hole 11A). The area is small.) The shape communicates with 11B. In addition, the length L2 between the communicating portions of the small-diameter circular hole 11B communicates with a length shorter than the diameter of the circular hole 11B. That is, the large-diameter circular hole 11A and the small-diameter circular hole 11B are circular. The projecting portion 11C is formed and communicated so that the constricted 11D is formed so that the hole 11B has an arc shape of 180 degrees or more.

The tip suction hole 11 is formed in the tip nozzle portion 5A and the tip nozzle portion 5B upward from the lower end of the tip nozzle portion 5A, and vertically extends from the first intermediate nozzle portion 5C to the top end nozzle portion 5F. It communicates with the lower part of the formed circular hole with a large diameter.

In this way, the outer shape of the suction surface of the suction nozzle 5 is made slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered, and the shape of the suction hole 11 is the shape of the central circular hole 11A. Since the projecting portions 11C are formed and communicated with each of the opposing surfaces that form the suction holes 11 so as to narrow the hole width so that the adjacent circular holes 11B have an arc shape of 180 degrees or more, Even if the suction position of the component is deviated from the center of the electronic component (see FIG. 3), the corner of the electronic component D can be supported by the protrusion 11C and can hardly enter the suction hole 11 obliquely.

  Therefore, the occurrence of a suction error when the detection device detects the suction posture of the electronic component sucked and held by the suction nozzle 5 in a normal posture is reduced.

  With the above configuration, when the printed circuit board production operation of the electronic component mounting apparatus 1 is performed on the printed circuit board production line, the printed circuit board P is transported to the substrate positioning unit by the transport device 2 and is positioned and fixed by the positioning mechanism. .

  Next, the mounting head 6 moves according to the suction and mounting order data stored in the storage device, and the electronic components to be mounted by the suction nozzle 5 corresponding to the component type of the electronic component are sequentially sucked from the predetermined component supply unit 5. And take it out. More specifically, the suction nozzle of the mounting head 6 moves so as to be positioned above the component supply unit 3B for storing electronic components to be mounted in accordance with the mounting order. In the Y direction, one beam 4A is driven by the Y-axis drive motor. The X-axis drive motor is driven to move the mounting head 6 in the X direction, and the component supply unit 3B has already been driven by the feed motor and the peeling motor so that the component can be taken out at the component suction and take-out position. Therefore, the vertical axis drive motor lowers and raises the suction nozzle 5, and sequentially picks up electronic components from the component supply unit 3B.

  The suction nozzle 5 moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the substrate positioning unit. While the mounting head 6 is moving, the mounting head 6 moves while moving the component. The electronic component sucked and held by the suction nozzle 5 when passing the upper position of the recognition camera 8 is imaged by the component recognition camera 8 (fly recognition).

  Based on the imaging result of the component recognition camera 8, how much the electronic component is displaced and held with respect to the suction nozzle 5 is recognized by the recognition processing device with respect to the XY direction and the rotation angle, and is sucked and mounted. The Y axis drive motor, the X axis drive motor, and the θ axis drive motor are corrected and controlled by the control device by adding the position recognition processing result of the electronic component to the mounting coordinates of the forward data, and the suction nozzle 5 of each mounting head 6 is controlled. Each electronic component is sequentially mounted at a predetermined position on the printed circuit board P while correcting the displacement.

  When the mounting of all the electronic components to be mounted on the positioned printed board P is completed according to the mounting data, the printed board P is discharged from the board positioning unit to the downstream device via the board discharging unit.

  Next, a second embodiment of the suction hole of the suction nozzle 5 will be described with reference to FIG. The external shape and the external shape of the suction surface of the suction nozzle 5 are the same as those of the first embodiment in the second and subsequent embodiments, and a description thereof will be omitted.

The suction hole at the tip of the suction nozzle 5 has a large-diameter circular hole 12A at the center and a small-diameter circular hole 12B (spacer of the circular hole 12A) formed on both sides of the large-diameter circular hole 12A. The opening area is smaller than the opening area). In other words, the outer shape of the suction surface of the suction nozzle 5 is made slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered, and a large-diameter circular hole 12A and a small-diameter circular hole 12B are provided. Since the bridge portion 12C is formed at a distance from each other, even if the suction position of the electronic component is deviated from the center of the electronic component, the corner portion of the electronic component D is supported by the bridge portion 12C and supported by the suction hole. The large-diameter circular hole 12A can be prevented from entering obliquely.

Next, a third embodiment of the suction hole of the suction nozzle 5 will be described with reference to FIG. The suction hole at the tip of the suction nozzle 5 has a large-diameter circular hole 13A at the center, and a hole 13B formed on both sides of the large-diameter circular hole 13A with an interval (from the opening area of the circular hole 12A). Small opening area). That is, the large-diameter circular hole 13A and the hole 13B are formed apart from each other and have a bridging portion 13C, and this hole 13B has the longest width equal to the diameter of the large-diameter circular hole 13A or a slightly smaller length than the diameter, is the most wide short portion the same length as the diameters of the small-diameter circular hole 12B of the second embodiment.

The inner side of the hole 13B, that is, the side surface on the circular hole 13A side has a curved shape along the side surface of the circular hole 13A, and the outer side surface has a shape along the side surface (curved surface) of the suction nozzle 5. The size of the hole 13B is made as large as possible, and the suction surface outer shape of the suction nozzle 5 is made slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered. Further, since the circular hole 13A and the hole 13B having a larger diameter are formed at a distance from each other and there is a bridging portion 13C, even if the suction position of the electronic component is deviated from the center of the electronic component D, The corner portion is supported by the bridging portion 13C and can be made difficult to enter into the large-diameter circular hole 13A of the adsorption hole.

Next, a fourth embodiment of the suction holes of the suction nozzle 5 will be described with reference to FIG. The shape of the suction hole 14 at the tip of the suction nozzle 5 is a shape in which a large-diameter circular hole 14A in the center and a vertically long hole 14B adjacent to the large-diameter circular hole 14A communicate with each other. In addition, both the vertically long holes 14B are alternately formed in opposite directions, and the communicating portion that communicates with the left vertically long hole 14B of the circular hole 14A is directed from one surface facing the other to the other surface. In order to narrow the hole width (from the top to the bottom of FIG. 7) and to communicate with the vertically long hole 14B on the right side of the circular hole 14A, one of the opposite surfaces forming the hole As shown in FIG. 7, the protrusions 14 </ b> C are formed so as to be opposite to each other so as to form the constriction 14 </ b> D so as to narrow the hole width (from the bottom to the top of FIG. 7). Shape.

Accordingly, the outer shape of the suction surface of the suction nozzle 5 is made slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered, and the left and right vertical holes 14B of the circular hole 14A communicate with each other. Since the projecting portions 14C are formed to communicate with each other so that the width of the hole narrows from the other facing surface forming the hole toward the one surface , the communication part has a suction position of the electronic component. also offset from the center of the part, the corners of the electronic component D can be hardly enter obliquely to the suction hole 14 is supported strike the protrusion 14C. Moreover, the opening area of the suction hole 14 can be increased to increase the amount of air sucked by the suction nozzle 5, and even if the suction position of the electronic component is deviated from the center of the electronic component, the electronic component is sucked more reliably. be able to.

Next, a fifth embodiment of the suction holes of the suction nozzle 5 will be described with reference to FIG. The shape of the suction hole 15 at the tip of the suction nozzle 5 is a shape in which a large-diameter circular hole 15A at the center and a circular hole 15B adjacent to the large-diameter circular hole 15A communicate with each other. In addition, the circular holes 15B are alternately formed in opposite directions, and a hole is formed in an oblique communication portion with respect to one long side of the bottom surface of the suction nozzle 5 that communicates with the left circular hole 15B of the circular hole 15A. The suction nozzle that communicates with the right circular hole 15B of the circular hole 15A so that the hole width is narrowed from one facing surface to the other surface (from the top to the bottom of FIG. 8). 5 The width of the hole is narrowed from the opposite surface forming the hole to the one surface (from the bottom to the top of the paper in FIG. 8) in the communicating portion oblique to the one long side of the bottom surface. Further, the protrusions 15C are formed so as to be in communication with each other so that the constriction 15D is formed .

Accordingly, the outer shape of the suction surface of the suction nozzle 5 is made slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered, and each of the circular holes 15A communicating with the left and right circular holes 15B. Since the projecting portion 15C is formed so as to narrow the hole width from the other surface that forms the hole toward the one surface in the communicating portion, the adsorbing position of the electronic component is an electron. Even if it deviates from the center of the component, the corner portion of the electronic component D can be supported by the projection 15C so that it is difficult to enter the suction hole 15 obliquely.

Next, a sixth embodiment of the suction holes of the suction nozzle 5 will be described with reference to FIG. The shape of the suction hole 16 at the tip of the suction nozzle 5 is a shape in which a large-diameter circular hole 16A at the center and a circular hole 16B adjacent to the large-diameter circular hole 16A communicate with each other. In addition, both circular holes 16B are alternately formed in opposite directions, and holes are formed in a communication portion that is substantially parallel to one long side of the bottom surface of the suction nozzle 5 that communicates with the left circular hole 16B of the circular hole 16A. The suction nozzle 5 communicates with the circular hole 16B on the right side of the circular hole 16A so as to narrow the hole width from one facing surface to the other surface (from the top to the bottom of the sheet of FIG. 9). In the communicating portion substantially parallel to one long side of the bottom surface, the hole width is narrowed from the other surface facing the one side to the other surface (from the bottom to the top of FIG. 9). Projections 16C are formed so as to be opposite to each other so that a constriction 16D is formed .

Accordingly, the outer shape of the suction surface of the suction nozzle 5 is made slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered, and each of the circular holes 16A communicating with the left and right circular holes 16B. Since the communicating portion has a shape in which the protrusions 16C are formed and communicated so as to narrow the hole width from the other surface facing each other to form one hole, the adsorbing position of the electronic component is an electron. Even if it deviates from the center of the component, the corner portion of the electronic component D can be supported by the protrusion 16C and can hardly enter the suction hole 16 obliquely.

Next, a seventh embodiment of the suction holes of the suction nozzle 7 will be described with reference to FIG. The shape of the suction hole 17 at the tip of the suction nozzle 5 is a shape in which the large-diameter circular hole 17A at the center is in communication with the vertically elongated holes 17B adjacent to the large-diameter circular hole 17A. In addition, both the vertically long holes 17B are alternately formed in opposite directions, and the communicating portion that communicates with the left vertically long hole 17B of the circular hole 17A is directed from one surface facing the other to the other surface. In order to narrow the hole width (from the top to the bottom of FIG. 10) and to communicate with the right elongated hole 17B on the right side of the circular hole 17A, one of the opposite surfaces forming the hole Projection 17C having a rounded tip at the opposite end so as to form a constriction 17D so as to narrow the hole width toward the surface (from bottom to top in FIG. 10). the respectively formed and made to communicate shape.

Accordingly, the outer shape of the suction surface of the suction nozzle 5 is made slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered, and the left and right vertical holes 17B of the circular hole 17A communicate with each other. In order to reduce the width of the hole from one of the opposing surfaces that form the hole toward the one surface, the communication portion has a rounded protrusion 17C that is connected to each other. Even if the suction position deviates from the center of the electronic component, the corner portion of the electronic component D can be supported by the protrusion 17C and can hardly enter the suction hole 17 obliquely.

Next, an eighth embodiment of the suction holes of the suction nozzle 5 will be described with reference to FIG. The shape of the suction hole 18 at the tip of the suction nozzle 5 has a substantially continuous M shape, and the length between the opposing walls forming the hole 18C at the left and right end portions of the M shape is the longest. The length between the opposing walls forming the hole (corresponding to the constriction) 18D in the M-shaped oblique portion is formed to be the shortest, and the inner wall in the M-shaped bent portion has an arc of approximately 180 degrees. Forming.

That is, between the opposing walls that form the horizontally long hole 18A, a circular arc of 180 degrees on each of the left and right sides from one surface (the lower surface in FIG. 11) to the other surface (the upper surface in FIG. 11). Protrusion
To form a 18B to form the other surface arcuate projections 18B of 180 degrees in the middle portions of the left and right toward the one side from the (plane of the top in FIG. 11) (the plane of the bottom of FIG. 11).

Therefore, the suction surface outer shape of the suction nozzle 5 is slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered, and the left and right parts are further formed as a continuous, generally M-shaped shape. Since the three protrusions 18B are formed in the middle part, even if the suction position of the electronic component is deviated from the center of the electronic component, the corner of the electronic component D is supported by the protrusion 18B and slanted in the suction hole 18 It can be difficult to enter.

Next, a ninth embodiment of the suction holes of the suction nozzle 5 will be described with reference to FIG. The shape of the suction hole 19 at the tip of the suction nozzle 5 is almost the same as the outer shape of the suction surface, and a wide vertical hole 19A in the center is communicated with a narrow vertical hole 19B on both sides of the vertical hole 19A. Shape. In addition, the two vertically elongated holes 19B are alternately formed in opposite directions, and the communicating portion that communicates with the left vertically elongated hole 19B of the wide vertically elongated hole 19A is formed from one surface facing the other to the other surface. Toward the bottom (from the top to the bottom of the paper in FIG. 12), and in the communicating part that communicates with the right vertical hole 19B of the wide vertical hole 19A, Projections 19C are formed so that the constriction 19D is formed so as to narrow the hole width from one surface to one surface (from the bottom to the top of the paper in FIG. 12) so that the constriction 19D is formed. The shape is made to communicate with each other.

Accordingly, the suction surface outer shape of the suction nozzle 5 is made slightly smaller than the outer shape of the suction surface of the electronic component D so that the entire electronic component D cannot be covered, and the left and right vertical holes 19B of the wider vertical hole 19A communicate with each other. Since each of the communicating portions has a shape in which the protrusions 19C are formed to communicate with each other so as to narrow the hole width from the other facing surface to form one hole, the adsorbing position of the electronic component Even if it is displaced from the center of the electronic component, the corner portion of the electronic component D is supported by the protrusion 19C and can hardly enter the suction hole 19 obliquely. Moreover, the opening area of the suction hole 19 can be increased to increase the amount of air sucked by the suction nozzle 5, and even if the suction position of the electronic component is deviated from the center of the electronic component, the electronic component is sucked more reliably. be able to.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply apparatus 5 Suction nozzle 6 Mounting head 11 Suction hole 11A Large-diameter circular hole 11B Small-diameter circular hole 11C Projection 11D Constriction

Claims (9)

In the electronic component mounting apparatus that takes out the electronic component supplied from the component supply device by the suction nozzle provided in the mounting head and mounts it on the printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a large-diameter circular hole in the center is connected to a small-diameter circular hole on both sides of the large-diameter circular hole, and the small-diameter circular hole is 180 degrees. An electronic component mounting apparatus characterized by having an arc shape as described above. In the electronic component mounting apparatus that takes out the electronic component supplied from the component supply device by the suction nozzle provided in the mounting head and mounts it on the printed circuit board.
The suction hole of the suction nozzle is composed of a hole in the central part and a hole having an opening area smaller than the hole in the central part formed at intervals on both sides of the hole in the central part. An electronic component mounting device. In the electronic component mounting apparatus that takes out the electronic component supplied from the component supply device by the suction nozzle provided in the mounting head and mounts it on the printed circuit board.
The suction hole of the suction nozzle is composed of a large-diameter circular hole at the center and a small-diameter circular hole formed on both sides of the large-diameter circular hole at intervals. apparatus. In the electronic component mounting apparatus that takes out the electronic component supplied from the component supply device by the suction nozzle provided in the mounting head and mounts it on the printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a central hole in the central portion and a hole having an opening area smaller than the central hole are connected to both sides of the central hole, and a surface facing the communicating portion An electronic component mounting apparatus, wherein each protrusion is formed so as to narrow the hole width toward the surface. In the electronic component mounting apparatus that takes out the electronic component supplied from the component supply device by the suction nozzle provided in the mounting head and mounts it on the printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a central hole in the central portion and a hole having an opening area smaller than the central hole are connected to both sides of the central hole, and a surface facing the communicating portion An electronic component mounting apparatus, characterized in that the protrusions are formed so that the directions thereof are opposite to each other so as to narrow the width of the hole. In the electronic component mounting apparatus that takes out the electronic component supplied from the component supply device by the suction nozzle provided in the mounting head and mounts it on the printed circuit board.
The shape of the suction holes of the suction nozzle and a horizontally elongated hole shape, the walls that face forming the Horizontal holes, each one projecting portion so as to narrow the pore width on both sides toward the one surface to the other surface electronic component mounting, characterized in that the formation of the other projections so as to narrow the pore width toward the one side in the middle portion of one protruding portion formed in the both side portions so as to form from the other surface to apparatus. In the electronic component mounting apparatus that takes out the electronic component supplied from the component supply device by the suction nozzle provided in the mounting head and mounts it on the printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a wide vertical hole at the center and a narrow vertical hole narrower than the wide vertical hole are connected to both sides of the wide vertical hole. An electronic component mounting device. In the electronic component mounting apparatus that takes out the electronic component supplied from the component supply device by the suction nozzle provided in the mounting head and mounts it on the printed circuit board.
The shape of the suction hole of the suction nozzle is a shape in which a wide vertical hole at the center and a narrow vertical hole narrower than the wide vertical hole are connected to both sides of the wide vertical hole, and An electronic component mounting apparatus characterized in that the communicating portions are formed so that the protrusions are opposite in direction so as to narrow the hole width toward the facing surface.   The electronic component according to any one of claims 1 to 8, wherein the outer shape of the suction surface of the suction nozzle is made smaller than the outer shape of the suction surface of the electronic component so that the entire electronic component cannot be covered. Mounting device.

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