JP2007005336A - Electronic component mounting device, electronic component mounting method, and holding tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To place electronic components on a circuit board more surely, by increasing the substantive contact area between a holding surface and the electronic components. <P>SOLUTION: A holding tool 331, for holding electronic components in an electronic component placing device, has a substantially cylindrical tool body, and a tool projection section 335 projecting from the lower end of the tool body. The tip surface of the tool projection section 335 becomes a holding surface 3351 for sucking and holding electronic components. Four recesses 3352 are formed inside the outer periphery edge of the holding surface 3351 in the tool projection section 335. Thus, in the holding tool 331, the total area of the contact region 3354, between the holding surface 3351 and the electronic components, can be increased by extending the total length of the edge of an opening 3353 in the holding surface 3351, hence surely mounting the electronic components on the circuit board and improving the quality of jointing the electronic components to the circuit board. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technique for mounting electronic components on a circuit board.

  Conventionally, in an apparatus for mounting an electronic component on a circuit board such as a printed circuit board, various methods for joining the electrode of the electronic component and the electrode of the circuit board have been used, and the electronic component can be compared in a short time. As one of the methods that can be bonded at an extremely low temperature, a bonding method using ultrasonic waves (hereinafter referred to as “ultrasonic bonding”) is known. In ultrasonic bonding, an electronic component pressed against a circuit board by ultrasonic vibration is vibrated, and an electrode of the electronic component (for example, a bump is formed) and an electrode of the circuit board are electrically bonded.

  In such an electronic component mounting apparatus that performs ultrasonic bonding, a technique for improving the bonding quality of an electronic component by devising the shape of the tip of a tool that holds the electronic component has been proposed. For example, in Patent Document 1, in a bonding tool that sucks and holds a flip-chip type semiconductor light emitting element and applies ultrasonic vibration, a rectangular holding ring that surrounds the entire outer periphery of the semiconductor light emitting element is provided at the tip of the bonding tool. There is disclosed a technique for preventing positional displacement and rotation of an electronic component due to ultrasonic vibration by providing and holding a semiconductor light emitting element so as to be fitted to the tip of a bonding tool.

  On the other hand, in Patent Document 2, in a bonding tool for ultrasonically bonding an Al wiring lead tip portion of a film substrate to an electrode pad of an LSI chip, a circular hole is formed in a substantially central portion of the tool tip surface. As a result, the Al wiring lead pressed at the time of joining is deformed and enters the hole at the tip of the tool, so that the Al wiring lead is prevented from being deformed so as to be crushed and spread outward. Further, Patent Document 2 describes that the same effect can be obtained by forming a cross-shaped groove that crosses the tip surface while being orthogonal to the tip surface of the bonding tool.

Even in the bonding tool of Patent Document 3, a cross-shaped groove is formed on the tip surface of the tool, and when the upper part of the connection lead is deformed and enters the groove at the time of bonding, the connection lead and the bonding tool mesh with each other to connect the connection lead Is prevented, and the gripping force of the bonding tool to the connection lead is improved. Also, in Patent Document 4, a small hole is formed in the connection terminal of the semiconductor element, and the ultrasonic vibration transmission tool is provided with a small protrusion to be inserted into the small hole, thereby improving the efficiency of transmitting ultrasonic waves to the connection terminal. Techniques to do this are disclosed.
JP 2000-164636 A Japanese Patent Laid-Open No. 5-29404 Japanese Utility Model Publication No. 6-52145 JP-A-5-235117

  By the way, in the electronic component mounting apparatus, as one of the tools for holding the electronic component, a suction path having a circular cross section perpendicular to the flow path (that is, a columnar shape) is provided inside, and a circular shape is formed at the center of the front end surface. There is used a single suction port, which sucks and holds an electronic component on the front end surface. When an electronic component is ultrasonically bonded with such a tool, an annular area along the edge of the vicinity of the edge of the suction port on the tip surface of the tool is stronger than other areas. Pressed by the part. That is, the annular area along the edge of the suction port is a contact area that substantially contacts the electronic component.

  On the other hand, there is a need for further improvement in the quality of bonding of electronic components to the substrate, and in order to prevent the electronic components from being displaced and more reliably mounted on the circuit board, the tip surface of the tool (hereinafter referred to as “holding”). It is necessary to increase the area of the contact area between the surface and the electronic component. Here, by simply increasing the diameter of the suction path, the length of the contact area around the suction port can be increased, but if the diameter of the suction path is excessively increased, the thickness of the tool will be reduced. In some cases, it may be difficult to appropriately transmit ultrasonic vibration to the electronic component.

  The present invention has been made in view of the above problems, and an object thereof is to more reliably attach an electronic component to a circuit board by increasing a substantial contact area between a holding surface and the electronic component.

  The invention according to claim 1 is an electronic component mounting apparatus for mounting an electronic component on a circuit board, the holding tool holding the electronic component, and pressing the electronic component against the circuit board via the holding tool. And an ultrasonic transducer that applies ultrasonic vibration to the electronic component via the holding tool, and the holding tool has a tip surface that is a holding surface that holds the electronic component by suction. A columnar columnar part is provided, and a plurality of recesses are formed inside the outer peripheral edge of the holding surface of the columnar part.

  The invention according to claim 2 is the electronic component mounting apparatus according to claim 1, wherein the holding surface of the columnar part is a circle centered on a predetermined central axis, and the number of the plurality of recesses is 3 or more, and the plurality of recesses are arranged at regular intervals while rotating the predetermined recesses around the central axis.

  A third aspect of the present invention is the electronic component mounting apparatus according to the first or second aspect, wherein each opening of the plurality of recesses is circular.

  According to a fourth aspect of the invention, there is provided the electronic component mounting apparatus according to any one of the first to third aspects, wherein at least one of the plurality of concave portions is provided in the columnar portion to suck the electronic component. Contact the suction path used for adsorption.

  The invention according to claim 5 is an electronic component mounting apparatus for mounting an electronic component on a circuit board, the holding tool holding the electronic component, and pressing the electronic component against the circuit board via the holding tool. And an ultrasonic transducer that applies ultrasonic vibration to the electronic component via the holding tool, and the holding tool has a tip surface that is a holding surface that holds the electronic component by suction. A recess having a columnar part and having a non-circular opening is formed inside the outer peripheral edge of the holding surface of the columnar part.

  A sixth aspect of the present invention is the electronic component mounting apparatus according to the fifth aspect, wherein the concave portion has a groove shape.

  The invention according to claim 7 is the electronic component mounting apparatus according to claim 6, wherein the concave portion is linear, and the length in the longitudinal direction of the concave portion is in the width direction perpendicular to the longitudinal direction. More than twice the width.

  The invention according to claim 8 is the electronic component mounting apparatus according to claim 6 or 7, wherein another groove-like recess is formed in the holding surface of the columnar part.

  The invention according to claim 9 is the electronic component mounting apparatus according to claim 5, wherein the recess has a shape in which a plurality of grooves intersect on the central axis of the columnar part.

  A tenth aspect of the present invention is the electronic component mounting apparatus according to any one of the fifth to ninth aspects, wherein the recess is provided in the columnar portion and is used for sucking and sucking the electronic component. Contact the road.

  The invention according to claim 11 is the electronic component mounting apparatus according to claim 10, wherein the suction port of the suction path is formed in the bottom surface of the recess.

  The invention according to claim 12 is an electronic component mounting method for mounting an electronic component on a circuit board, wherein a) a step of holding the electronic component with a holding tool, and b) the electronic component via the holding tool. A step of pressing the circuit board while applying ultrasonic vibration to the holding tool, and the holding tool includes a substantially columnar columnar portion whose tip surface is a holding surface for sucking and holding the electronic component, A plurality of recesses are formed inside the outer peripheral edge of the holding surface of the part.

  The invention according to claim 13 is an electronic component mounting method for mounting an electronic component on a circuit board, wherein a) a step of holding the electronic component with a holding tool, and b) the electronic component via the holding tool. A step of pressing the circuit board while applying ultrasonic vibration to the holding tool, and the holding tool includes a substantially columnar columnar portion whose tip surface is a holding surface for sucking and holding the electronic component, A recess having a non-circular opening is formed inside the outer peripheral edge of the holding surface of the part.

  According to a fourteenth aspect of the present invention, there is provided a holding tool for sucking and holding an electronic component in an electronic component mounting apparatus for mounting the electronic component on a circuit board, wherein the tool main body and the tool body protrude from the tool main body and the tip surface is an electronic component. A substantially columnar columnar portion that is a holding surface that holds and holds the plurality of recesses, and a plurality of recesses are formed inside the outer peripheral edge of the holding surface of the columnar portion.

  According to a fifteenth aspect of the present invention, there is provided a holding tool for sucking and holding an electronic component in an electronic component mounting apparatus for mounting the electronic component on a circuit board, the tool main body, and a tip surface projecting from the tool main body and having an end surface thereof A substantially columnar columnar portion that is a holding surface for adsorbing and holding the columnar portion, and a recess having a noncircular opening is formed inside the outer peripheral edge of the holding surface of the columnar portion.

  In the present invention, the electronic component can be more reliably mounted on the circuit board by increasing the contact area between the holding surface and the electronic component.

  According to the second aspect of the present invention, the force due to the ultrasonic vibration can be applied to the electronic component almost in the same manner regardless of the orientation of the columnar portion with the central axis as the center. According to the sixth aspect of the present invention, it is possible to easily form a recess having a long edge of the opening.

  FIG. 1 is a front view showing the configuration of the electronic component mounting apparatus 1 according to the first embodiment of the present invention, and FIG. 2 is a plan view of the electronic component mounting apparatus 1. The electronic component mounting apparatus 1 is a so-called flip chip mounting apparatus that performs mounting of an electronic component on a circuit board 9 such as a printed circuit board and bonding (that is, mounting) of an electrode at the same time after inverting the fine electronic component. It is.

  As shown in FIGS. 1 and 2, the electronic component mounting apparatus 1 includes a board holding unit 2 that holds a circuit board 9, and is held by the board holding unit 2 on the (+ Z) side of the board holding unit 2. A mounting mechanism 3 for mounting electronic components on the circuit board 9 is provided, and a component supply unit 4 for supplying electronic components to the mounting mechanism 3 is provided on the (−X) side of the substrate holding unit 2. In addition, between the board holding unit 2 and the component supply unit 4, an imaging unit 5 that images the electronic component supplied to the mounting mechanism 3 by the component supply unit 4, a component recovery mechanism 61 that collects the electronic component, and 62 is provided, and on the (+ X) side of the circuit board 9, a polishing unit 7 for polishing the tip of the component holding unit 33 (see FIG. 1) of the mounting mechanism 3 that holds the electronic component is provided. In the electronic component mounting apparatus 1, these mechanisms are controlled by the control unit 10, so that the electronic component is mounted on the circuit board 9.

  The substrate holding unit 2 includes a stage 21 that holds the circuit board 9 and a stage moving mechanism 22 that moves the stage 21 in the Y direction in FIG. The polishing unit 7 is attached to the (+ X) side of the stage 21 and moves in the Y direction integrally with the stage 21 by the stage moving mechanism 22. The polishing unit 7 includes a sheet-like polishing member 71 having a flat and horizontal polishing surface 711, and a polishing member holding unit 72 that holds the polishing member 71.

  The mounting mechanism 3 includes a mounting head 31 and a mounting head moving mechanism 32 that moves the mounting head 31 in the X direction. The mounting head 31 includes a component holding unit 33 that holds electronic components by suction. The mounting head 31 is provided with a lifting mechanism 34 (see FIG. 1) that lifts and lowers the component holding portion 33.

  FIG. 3 is an enlarged view showing the vicinity of the component holding portion 33. As shown in FIG. 3, the component holding unit 33 includes a holding tool 331 that sucks and holds an electronic component, and a horn 332 to which the holding tool 331 is attached. The horn 332 is an oscillation unit that applies ultrasonic vibration. An ultrasonic transducer 35 is attached. The horn 332 is attached to the shaft 362 via the block 361, and the component holder 33 moves the circuit board 9 and the polishing surface 711 (see FIG. 1) by moving the shaft 362 in the Z direction by the lifting mechanism 34 (see FIG. 1). ) Is moved up and down relatively. The holding tool 331 is formed of stainless steel having vibration characteristics and vibration transmission characteristics suitable for mounting electronic components, and includes a suction path 333 for vacuum suction used for suction suction of electronic components at the center. The suction path 333 is connected to the suction path 364 formed in the block 361 and the shaft 362 through the tube 363 at the end (ie, the upper end) of the holding tool 331 on the (+ Z) side, Via a vacuum generator.

  FIG. 4 is a view further enlarging and showing the end portion (that is, the lower end portion) on the (−Z) side of the holding tool 331. As shown in FIG. 4, the holding tool 331 is substantially cylindrical and has a tool main body 334 attached to the horn 332 (see FIG. 3), and a substantially cylindrical shape thinner than the tool main body 334 (that is, from the tool main body 334. And a tool protruding portion 335 that protrudes from the lower end portion of the tool main body 334 and has a small outer diameter and a substantially columnar shape in which a part of the suction path 333 is formed. The tip surface on the (−Z) side of the tool protrusion 335 is a holding surface 3351 that holds the electronic component by suction. The tool protrusion 335 is much smaller than the tool main body 334, but is drawn larger than the actual size in FIG. 4 (the same applies to FIG. 3).

  FIG. 5 is a bottom view showing the tool protrusion 335 of the holding tool 331. As shown in FIGS. 4 and 5, in the tool protrusion 335, the holding surface 3351 has a circular shape centering on the central axis 3350 of the tool protrusion 335, and four recesses 3352 inside the outer peripheral edge of the holding surface 3351. Is formed. The four recesses 3352 rotate at predetermined intervals around the central axis 3350 (that is, recesses having the same shape as the recesses 3352 having a circular cross section perpendicular to the Z direction) at equal intervals so as not to overlap each other. The opening 3353 in the holding surface 3351 of each recess 3352 is circular. In other words, the tool protrusions 335 are arranged so as to be arranged at equal intervals (ie, every 90 °) without rotating a predetermined concave portion around the central axis 3350 and sharing a part of each other. The recesses 3352 are evenly arranged around the central axis 3350.

  Each of the four recesses 3352 communicates with a suction path 333 provided inside the tool protrusion 335, and the electronic component is sucked and held on the holding surface 3351 by performing suction from the four openings 3353. That is, the four openings 3353 serve as suction ports for sucking and sucking electronic components. The suction path 333 is also connected to a compressed air supply source, and air can be blown from the opening 3353. The outer diameter of the tool projection 335 of the holding tool 331 is, for example, about 1 mm, and the length of the tool projection 335 in the Z direction is about 0.5 to 1 mm.

  As shown in FIGS. 1 and 2, the component supply unit 4 includes a component placement unit 41 that places electronic components at predetermined positions, a supply head 42 that takes out and holds electronic components from the component placement unit 41, and a supply head 42. A supply head moving mechanism 43 that moves in the X direction and a rotation mechanism 44 that rotates and slightly raises and lowers the supply head 42 are provided. The component placement unit 41 includes a component tray 411 on which a large number of electronic components are placed, a stage 412 that holds the component tray 411, and a tray moving mechanism 413 that moves the component tray 411 together with the stage 412 in the X direction and the Y direction. Prepare.

  The supply head 42 includes a supply collet 421 (see FIG. 1) that supplies the electronic component held by suction to the component holding unit 33 of the mounting head 31. The supply collet 421 is provided with a suction path for vacuum suction at the center, and sucks and holds electronic components by performing suction from a suction port formed at the tip.

  In the component supply unit 4, a large number of electronic components to be mounted on the circuit board 9 are surfaces on the side on which the electrode portions to be bonded to the circuit board 9 are formed (the lower surface in a state after mounting, hereinafter “ It is placed on the component tray 411 with the “joining surface” facing the (+ Z) side (that is, in the direction opposite to the direction of mounting on the circuit board 9). In the present embodiment, the electrode part of the electronic component is a protruding bump formed of gold (Au) on the electrode pattern. However, depending on the mounting method or the electronic component to be mounted, the electrode part may be a plating bump or the like. Or the electrode pattern itself. Further, the bumps may be provided on the electrodes of the circuit board 9 instead of being provided on the electrode pattern of the electronic component.

  The imaging unit 5 is on a movement path of the mounting head 31 (particularly, the component holding unit 33) by the mounting head moving mechanism 32 and does not interfere with the movement of the mounting head 31 (in the present embodiment, directly below the movement path). The electronic component that is provided and held by the component holding unit 33 is imaged from the (−Z) side. The component collection mechanism 61 provided between the substrate holding unit 2 and the imaging unit 5 is also disposed on the moving path of the mounting head 31 (particularly, the component holding unit 33) and at a position that does not interfere with the movement of the mounting head 31. If necessary, the electronic components held by the component holding unit 33 are collected. Also, the component collection mechanism 62 attached to the (+ X) side of the stage 412 is moved in the X direction and the Y direction integrally with the stage 412 by the tray moving mechanism 413, and the electronic component held by the supply collet 421 as necessary. Recover.

  FIG. 6 is a diagram illustrating a flow of mounting an electronic component by the electronic component mounting apparatus 1. When an electronic component is mounted on the circuit board 9 by the electronic component mounting apparatus 1, first, a component tray 411 on which a large number of electronic components are placed with the bonding surface facing the (+ Z) side is previously shown in FIG. Is moved by the tray moving mechanism 413 below the supply head 42 located on the (−X) side, and the joint surface of the electronic component is sucked and held by the supply collet 421 (step S11). Next, the supply head 42 moves in the (+ X) direction by the supply head moving mechanism 43 while being reversed, and is positioned at a delivery position indicated by a two-dot chain line in FIG. 1 (step S12). At this time, the supply collet 421 and the component holding part 33 of the mounting head 31 face each other.

  Subsequently, the component holding unit 33 is slightly lowered by the elevating mechanism 34, the upper surface of the electronic component is sucked and sucked by the component holding unit 33 and suction by the supply collet 421 is stopped, and the component holding unit 33 is moved from the supply collet 421. The electronic component is received and held by suction on the holding surface 3351 (see FIG. 4) of the holding tool 331 (step S13). When the supply of the electronic component is completed, the component holding unit 33 is slightly raised by the lifting mechanism 34, and the supply head 42 is retracted to the original position. In parallel with the retraction of the supply head 42, the mounting head 31 moves right above the imaging unit 5, and the electronic component held by the component holding unit 33 is imaged by the imaging unit 5 (step S14).

  Image data that is an output from the imaging unit 5 is sent to the control unit 10, and the acquired image data of the electronic component is compared with the image data of the electronic component stored in advance, that is, the attitude of the electronic component (that is, The position and orientation of the electronic component) is detected. In the mounting mechanism 3, the mounting head 31 is controlled based on the detected attitude of the electronic component, and the attitude of the electronic component is corrected by rotating the component holding portion 33 about the axis extending in the Z direction (step S15). ). If the control unit 10 determines that the posture of the electronic component cannot be corrected (that is, a suction error has occurred), the mounting operation of the electronic component is stopped and the mounting head 31 is moved. The electronic component moved upward from the component collecting mechanism 61 and separated from the component holding unit 33 by air blow or the like from the component holding unit 33 is collected by the component collecting mechanism 61.

  Subsequently, the mounting head 31 is moved in the (+ X) direction by the mounting head moving mechanism 32 and is positioned above the planned mounting position of the electronic component on the circuit board 9 (hereinafter referred to as “mounting position”). (Step S16). Then, the component holding part 33 descends toward the circuit board 9 and the electrode part formed on the bonding surface comes into contact with the electrode on the circuit board 9, and the electronic component is held by the board holding part 2 by the lifting mechanism 34. The circuit board 9 is pressed against. In this state, ultrasonic vibration is applied to the component holding unit 33 by the ultrasonic vibrator 35, and the ultrasonic vibration is applied to the electronic component held by the holding tool 331 via the holding tool 331. Are electrically joined to the circuit board 9, and electrical joining (that is, mounting) is performed simultaneously with the mounting of the electronic component (step S17). Thereafter, the component holding portion 33 that has stopped sucking is lifted away from the electronic component by the elevating mechanism 34, and the mounting of the electronic component is completed. In the electronic component mounting apparatus 1, the elevating mechanism 34 serves as a pressing mechanism that presses the electronic component against the circuit board 9 via the holding tool 331.

  When the mounting of the electronic component is completed, the mounting head 31 returns to the delivery position, the picked-up electronic component is sucked and held by the holding tool 331 of the component holding unit 33, and ultrasonic vibration is applied after moving to the mounting position. However, the operation (steps S11 to S17) of pressing and mounting the electronic component on the circuit board 9 is repeated. If the holding surface 3351 needs to be polished because the mounting of the electronic component has been repeated many times, the component holding unit 33 moves above the polishing unit 7 and the holding surface 3351 becomes the polishing member 71. The holding surface 3351 is polished by applying vibration by the ultrasonic vibrator 35 while being pressed.

  As shown in FIG. 5, in the electronic component mounting apparatus 1, an annular 4 that is near the edge of the opening 3353 of the recess 3352 on the holding surface 3351 of the holding tool 331 that sucks and holds the electronic component, and that extends along the edge. One region (region surrounded by a concentric circle drawn by a two-dot chain line in FIG. 5) 3354 is stronger than other regions when joining electronic components (that is, when applying ultrasonic vibration to the electronic components). Pressed by the part. That is, the region 3354 can be referred to as a region of the holding surface 3351 that substantially contacts the electronic component, and is hereinafter referred to as a “contact region 3354” (the same applies to the following embodiments).

  In the electronic component mounting apparatus 1, the tool protrusion 335 of the holding tool 331 is formed with openings 3353 of a plurality of recesses 3352 inside the outer peripheral edge of the holding surface 3351 (which is normally formed within a practical range). And holding the entire length of the edge of the opening 3353 in the holding surface 3351 longer than a normal holding tool in which only one circular suction port (that is, an opening) is formed on the holding surface. The total area of the contact region 3354 between the surface 3351 and the electronic component can be increased. As a result, the electronic component can be more reliably mounted on the circuit board with stable bonding strength, and as a result, the quality of bonding of the electronic component to the circuit board can be improved.

  Further, in the holding tool 331, the plurality of concave portions 3352 having the same shape are arranged at equal intervals in the circumferential direction around the central axis 3350, and therefore, regardless of the direction of the tool protrusion 335 around the central axis 3350. That is, regardless of the relative vibration direction of the ultrasonic vibration with respect to the electronic component, the ultrasonic vibration force can be applied to the electronic component in substantially the same manner. As a result, the desired bonding quality can be stably obtained. In addition, since each recess 3352 communicates with the suction path 333, the electronic component can be sucked and held with an axisymmetric force in the circumferential direction around the central axis 3350.

  The number of the plurality of recesses 3352 formed on the holding surface 3351 of the holding tool 331 is not limited to four, and three or more recesses 3352 are formed at equal intervals around the central axis 3350. Regardless of the vibration direction of the ultrasonic vibration, an ultrasonic vibration force can be applied to the electronic component in substantially the same manner. Further, only from the viewpoint of attracting and holding electronic components, at least one of the plurality of recesses 3352 may be in communication with the suction path 333.

  In the holding tool 331, each of the plurality of recesses 3352 has a circular cross section perpendicular to the Z direction (that is, the recesses 3352 are cylindrical), and the opening 3353 of each recess 3352 is circular. Therefore, a plurality of recesses 3352 can be easily formed from the holding surface 3351 side by a tool such as a drill, and the holding tool 331 in which the total length of the edges of the opening 3353 is longer than that of a normal holding tool is easily manufactured. be able to.

  Next, another preferable example of the holding tool provided in the electronic component mounting apparatus will be described. FIG. 7 is a bottom view showing the tool protrusion 335 of another holding tool 331a. As shown in FIG. 7, on the holding surface 3351 of the holding tool 331a, one circular opening 3353a centered on the central axis 3350 is arranged at equal intervals around the central axis 3350 around the opening 3353a. And three circular openings 3353b having the same diameter as the opening 3353a are formed. The opening 3353a is an opening in the holding surface 3351 of a suction path 333 (which can be said to be a recess formed inside the outer peripheral edge of the holding surface 3351) formed inside the tool protrusion 335. The three openings 3353b are openings of three recesses 3352a formed independently of the suction path 333 inside the outer peripheral edge of the holding surface 3351. These recesses 3352a are centered on the central axis 3350. The predetermined concave portions are rotated and arranged at equal intervals so as not to overlap each other. Since the three recesses 3352a are independent from each other and are not in communication with the suction path 333, in the holding tool 331a, only the opening 3353a serves as a suction port for sucking and sucking electronic components.

  In the electronic component mounting apparatus provided with the holding tool 331a, similarly to the electronic component mounting apparatus 1 shown in FIG. 1, the openings of the four recesses (that is, the openings 3353a of the suction path 333 that can be regarded as the recesses, and the three By forming the opening 3353b of the recess 3352a on the inner side of the outer peripheral edge of the holding surface 3351, a circular suction port (for example, the same size as the opening 3353a) that is normally formed within a practical range. Compared with a normal holding tool in which only one suction port is formed on the holding surface, the total length of the edges of the openings on the holding surface 3351 is increased, and the total of the contact area 3354 between the holding surface 3351 and the electronic component is increased. The area can be increased. As a result, the electronic component can be more reliably mounted on the circuit board, and as a result, the quality of bonding of the electronic component to the circuit board can be improved.

  In the holding tool 331a, the opening 3353a of the suction path 333 is formed around the central axis 3350, and the openings 3353b of the three concave portions 3352a having the same shape are equally spaced in the circumferential direction around the central axis 3350. Therefore, regardless of the direction of the tool protrusion 335 about the central axis 3350, the ultrasonic vibration force can be applied to the electronic component in substantially the same manner. As a result, the desired bonding quality can be stably obtained.

  In the example of FIG. 7, the opening 3353a and the opening 3353b have the same shape, but the diameter of the opening 3353a may be larger or smaller than the opening 3353b. In the holding surface 3351, four or more openings 3353 b of recesses 3352 a arranged at equal intervals around the central axis 3350 may be formed around the opening 3353 a of the suction path 333. Conversely, from the viewpoint of mounting the electronic component more securely on the circuit board than when only one opening 3353a is provided, the opening 3353b is positioned symmetrically with respect to the opening 3353a of the suction path 333 (that is, Two concave portions 3352a arranged on opposite sides of the opening 3353a may be formed on the holding surface 3351.

  FIG. 8 is a bottom view showing a tool protrusion 335 of still another preferred holding tool 331b. As shown in FIG. 8, on the holding surface 3351 of the holding tool 331b, the opening 3353a of the suction path 333 and the openings 3353b of three recesses 3352a arranged at equal intervals around the central axis 3350 around the opening 3353a. Is formed. Thereby, similarly to the holding tool 331a shown in FIG. 7, the electronic component can be more reliably mounted on the circuit board, and as a result, the quality of joining of the electronic component to the circuit board can be improved. In addition, regardless of the orientation of the tool protrusion 335 about the central axis 3350, the force of ultrasonic vibration can be applied to the electronic component in substantially the same manner.

  In the holding tool 331 b, three elongated groove-shaped communication paths 3356 that connect each of the three recesses 3352 a and the suction path 333 are formed on the holding surface 3351. Thereby, since not only the opening 3353a but also the three openings 3353b serve as suction ports for sucking and sucking the electronic component, the electronic component can be sucked with a stronger force and held more securely. As a result, the electronic component The quality of bonding to the circuit board can be further improved.

  Only one or two of the three recesses 3352a may be communicated with the suction path 333. In addition, the two recesses 3352a are arranged at symmetrical positions (that is, opposite to each other across the suction path 333) with the suction path 333 as a center, and either one or both of the recesses 3352a are connected to the suction path 333. Also good.

  Next, an electronic component mounting apparatus according to a second embodiment of the present invention will be described. FIG. 9 is a bottom view showing the tool protrusion 335 of the holding tool 331c of the electronic component mounting apparatus according to the second embodiment. As shown in FIG. 9, in the electronic component mounting apparatus according to the second embodiment, the holding surface 3351 of the tool protrusion 335 has one groove-like recess that is different in shape from the four recesses 3352 shown in FIG. 5. 3352b is formed. Other configurations of the electronic component mounting apparatus are the same as those in FIGS. 1 to 5, and are denoted by the same reference numerals in the following description.

  As in the first embodiment, the electronic component mounting apparatus according to the second embodiment holds the electronic component held by the holding tool 331c via the holding tool 331c and the holding tool 331c. An elevating mechanism 34 (see FIG. 1) that is a pressing mechanism that presses against the circuit board 9 and an ultrasonic vibrator 35 (see FIG. 3) that applies ultrasonic vibration to the electronic component via the holding tool 331c are provided. The holding tool 331c includes a substantially cylindrical tool protruding portion 335 whose tip surface is a holding surface 3351 for attracting and holding electronic components.

  As shown in FIG. 9, in the holding tool 331c, a linear recess 3352b extending in the X direction is formed on the inner side of the outer peripheral edge of the holding surface 3351 of the tool protrusion 335, and the longitudinal direction of the recess 3352b (that is, The length in the X direction in FIG. 9 is at least twice the width in the width direction perpendicular to the longitudinal direction (that is, the Y direction). The concave portion 3352b has a non-circular opening (in the case of FIG. 9, a straight long hole shape) 3353c on the holding surface 3351, and is provided in the tool protruding portion 335 to be used for vacuum suction of electronic components. To the suction path 333. At the center of the bottom surface 3355 of the recess 3352b (that is, the (+ Z) side surface forming the recess 3352b), a suction port 3331 of the suction path 333 around the central axis 3350 is formed.

  The mounting operation of the electronic component by the electronic component mounting apparatus according to the second embodiment is the same as that of the first embodiment. First, the electronic component placed on the component tray 411 is supplied to the supply collet 421 (FIG. 1), and is transferred to the component holding unit 33 (FIG. 6: Steps S11 to S13). After the electronic component is imaged and the posture of the electronic component is corrected, the mounting head 31 moves to the mounting position. (Steps S14 to S16). Thereafter, the component holding portion 33 is lowered toward the circuit board 9 and the electronic component is pressed against the circuit board 9. In this state, ultrasonic vibration is applied to the electronic component, whereby the electronic component is moved to the circuit board. At the same time as being attached to the connector, it is electrically joined (ie, mounted) (step S17). The component holding unit 33 that has stopped sucking moves away from the electronic component and completes the mounting of the electronic component.

  As shown in FIG. 9, in the electronic component mounting apparatus according to the second embodiment, an elongated hole-shaped opening 3353c is formed inside the outer peripheral edge of the holding surface 3351 in the tool protrusion 335 of the holding tool 331c. In a normal holding tool in which only one circular suction port of a size normally formed within a practical range (for example, a suction port having the same size as the suction port 3331) is formed on the holding surface. In comparison, the length of the edge of the opening 3353c in the holding surface 3351 can be increased to increase the area of the contact region 3354 between the holding surface 3351 and the electronic component. As a result, the electronic component can be more reliably mounted on the circuit board with stable bonding strength, and as a result, the quality of bonding of the electronic component to the circuit board can be improved.

  In the holding tool 331c, since the concave portion 3352b is formed in a groove shape, the concave portion 3352b having a long edge of the opening 3353c can be easily formed. Further, since the recess 3352b communicates with the suction path 333, a wide area corresponding to the opening 3353c of the recess 3352b on the upper surface of the electronic component is sucked by the holding tool 331c. Thereby, in the holding tool 331c, an electronic component can be adsorbed with a stronger force and held more securely, and as a result, the quality of bonding of the electronic component to the circuit board can be further improved.

  Note that the recess 3352b has a shape other than the straight groove shape (for example, a Z-shaped groove shape in which a straight line is bent at two locations) only from the viewpoint of more securely mounting the electronic component on the circuit board. Or an annular groove surrounding the suction path 333 around the suction path 333, and other non-circular shapes other than the groove shape (for example, an ellipse, a rectangle, a plurality of circles, It may be a shape having an opening formed by overlapping a part of an ellipse or the like. The recess 3352b is not necessarily provided at a position overlapping the suction port 3331 of the suction path 333, and may be provided independently of the suction path 333 (that is, without contacting the suction path 333).

  Next, an electronic component mounting apparatus according to a third embodiment of the present invention will be described. FIG. 10 is a bottom view showing the tool protrusion 335 of the holding tool 331d of the electronic component mounting apparatus according to the third embodiment. As shown in FIG. 10, the holding surface 3351 of the holding tool 331d has a groove-shaped recess 3352b similar to the holding tool 331c shown in FIG. Two groove-like recesses 3352c having a short (direction) length are formed adjacent to both sides in the width direction of the recess 3352b. The electronic component mounting operation by the electronic component mounting apparatus according to the third embodiment is the same as that of the first embodiment.

  In the holding tool 331d, the openings 3353d of the two recesses 3352c are formed inside the outer peripheral edge of the holding surface 3351 in addition to the openings 3353c of the recesses 3352b. ) Can be further increased to increase the total area of the contact area 3354 between the holding surface 3351 and the electronic component. As a result, the electronic component can be more reliably mounted on the circuit board, and as a result, the quality of bonding of the electronic component to the circuit board can be further improved.

  Note that the number of the groove-shaped recesses 3352c may be one, or three or more, which can improve the quality of bonding of the electronic component to the circuit board.

  FIG. 11 is a bottom view showing the tool protrusion 335 of another preferred holding tool 331e. In the holding tool 331e, three groove-shaped recesses 3352d are formed around the suction path 333 with the center axis 3350 as a center, and the three recesses 3352d rotate a predetermined recess around the center axis 3350. They are arranged at equal intervals. Each of the three recesses 3352d communicates with the suction path 333 by an elongated groove-shaped communication path 3356 formed in the holding surface 3351.

  In the holding tool 331e, the opening 3353a of the suction path 333 and the opening 3353e of the three recesses 3352d are formed on the holding surface 3351, thereby increasing the total length of the edges of the openings in the holding surface 3351. It is possible to increase the total area of the contact area between and the electronic component. As a result, the electronic component can be more reliably mounted on the circuit board, and as a result, the quality of bonding of the electronic component to the circuit board can be improved.

  Further, in the holding tool 331e, the opening 3353a and the three openings 3353e serve as a suction port for sucking and sucking the electronic component, so that the electronic component can be sucked with a stronger force and held more securely. The quality of bonding of the component to the circuit board can be further improved.

  In the holding tool 331e, the opening 3353a of the suction path 333 is formed around the central axis 3350, and the openings 3353e of the three concave portions 3352d having the same shape are arranged at equal intervals in the circumferential direction around the central axis 3350. Therefore, regardless of the direction of the tool protrusion 335 about the central axis 3350, the force of ultrasonic vibration can be applied to the electronic component in substantially the same manner. As a result, the desired bonding quality can be stably obtained.

  Next, an electronic component mounting apparatus according to a fourth embodiment of the present invention will be described. FIG. 12 is a bottom view showing the tool protrusion 335 of the holding tool 331f of the electronic component mounting apparatus according to the fourth embodiment. As shown in FIG. 12, in the holding tool 331f, a concave portion 3352e having a shape in which two grooves intersect each other on the central axis 3350 of the tool protruding portion 335 is formed inside the outer peripheral edge of the holding surface 3351. The The recessed portion 3352e has a non-circular (cross shape in the case of FIG. 12) opening 3353f on the holding surface 3351, and is provided in the tool protruding portion 335 to be used for suction suction of electronic components. Contact 333. In the center of the bottom surface 3355 of the recess 3352e, a suction port 3331 of the suction path 333 centering on the central axis 3350 is formed. The mounting operation of the electronic component by the electronic component mounting apparatus according to the fourth embodiment is the same as that of the first embodiment.

  Also in the holding tool 331f, as in the second and third embodiments, the concave portion 3352e having the non-circular opening 3353f is formed in the holding surface 3351, thereby increasing the length of the edge of the opening in the holding surface 3351. Thus, the area of the contact region 3354 between the holding surface 3351 and the electronic component can be increased. As a result, the electronic component can be more reliably mounted on the circuit board, and as a result, the quality of bonding of the electronic component to the circuit board can be improved. Note that the shape of the recess 3352e is not necessarily a shape in which two grooves intersect on the central axis 3350, and may be a shape in which three or more grooves intersect on the central axis 3350. Moreover, the length and width of the intersecting grooves may be different from each other.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment, A various change is possible.

  The shape of the holding tool exemplified in the above embodiment is for mounting a minute electronic component such as a bare chip of a light emitting diode, and when a larger electronic component or another electronic component is mounted. The shape, outer diameter, length, etc. of the tool protrusion 335 are appropriately changed. For example, the tool protrusion 335 may have a substantially octagonal prism shape with a suction path 333 provided therein, and the outer diameter and length of the tool protrusion 335 may be 1 mm or more.

  Further, the horn 332 to which the tool main body 334 is attached is not limited to the shape shown in FIG. 3 and may have various shapes. For example, the horn 332 may have a long block shape in the X direction in FIG. 3, and a substantially rectangular parallelepiped tool body 334 may be attached to the end of the horn 332 on the (−X) side. In this case, the tool protruding portion 335 is provided on the (−X) side of the tool main body 334 so as to protrude from the end surface on the (−Z) side toward the circuit board 9 held by the substrate holding portion 2.

  In the electronic component mounting apparatus according to the above-described embodiment, the holding of the electronic component by the holding tool is not limited to suction suction, and may be held by electrical or magnetic suction. In this case, the suction path is not formed inside the holding tool, and the recess on the holding surface 3351 does not communicate with the suction path.

  The electronic component mounting apparatus is suitable for mounting semiconductor light emitting elements such as light emitting diodes and semiconductor lasers, and various types of electronic components other than semiconductor light emitting elements such as semiconductor bare chip components and SAW (Surface Acoustic Wave): It is also suitable for mounting a (surface acoustic wave) filter or the like.

  The present invention can be used in various techniques for mounting electronic components on a circuit board using ultrasonic waves.

The front view of the electronic component mounting apparatus which concerns on 1st Embodiment Plan view of electronic component mounting device Enlarged view of the vicinity of the component holder Enlarged view of the lower end of the holding tool Bottom view of tool protrusion Diagram showing the flow of mounting electronic components Bottom view of tool protrusion for other preferred holding tools Bottom view of tool protrusion for other preferred holding tools The bottom view of the tool protrusion part of the holding tool which concerns on 2nd Embodiment The bottom view of the tool protrusion part of the holding tool which concerns on 3rd Embodiment Bottom view of tool protrusion for other preferred holding tools The bottom view of the tool protrusion part of the holding tool which concerns on 4th Embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 9 Circuit board 34 Elevating mechanism 35 Ultrasonic vibrator 331,331a-331f Holding tool 333 Suction path 334 Tool main body 335 Tool protrusion part 3331 Suction port 3350 Central axis 3351 Holding surface 3352, 3352a-3352e Recessed part 3353, 3353a-3353f Opening 3355 Bottom S11-S17 Step

Claims (15)

An electronic component mounting apparatus for mounting an electronic component on a circuit board,
A holding tool for holding electronic components;
A pressing mechanism for pressing the electronic component against the circuit board via the holding tool;
An ultrasonic vibrator for applying ultrasonic vibration to the electronic component via the holding tool;
With
The holding tool includes a substantially columnar columnar portion whose tip surface is a holding surface that holds the electronic component by suction, and a plurality of recesses are formed inside the outer peripheral edge of the holding surface of the columnar portion. An electronic component mounting apparatus characterized by that. The electronic component mounting apparatus according to claim 1,
The holding surface of the columnar part is a circle centered on a predetermined central axis, and the number of the plurality of recesses is 3 or more,
The electronic component mounting apparatus, wherein the plurality of recesses are arranged at regular intervals while rotating the predetermined recesses around the central axis. The electronic component mounting apparatus according to claim 1 or 2,
An opening for each of the plurality of recesses is circular. The electronic component mounting apparatus according to any one of claims 1 to 3,
An electronic component mounting apparatus, wherein at least one of the plurality of recesses is provided in the columnar portion and communicates with a suction path used for suction suction of the electronic component. An electronic component mounting apparatus for mounting an electronic component on a circuit board,
A holding tool for holding electronic components;
A pressing mechanism for pressing the electronic component against the circuit board via the holding tool;
An ultrasonic vibrator for applying ultrasonic vibration to the electronic component via the holding tool;
With
The holding tool includes a substantially columnar columnar portion whose front end surface is a holding surface for sucking and holding the electronic component, and a recess having a noncircular opening inside the outer peripheral edge of the holding surface of the columnar portion. An electronic component mounting apparatus characterized by being formed. The electronic component mounting apparatus according to claim 5,
The electronic component mounting apparatus, wherein the concave portion has a groove shape. It is an electronic component mounting apparatus of Claim 6, Comprising:
The electronic component mounting apparatus according to claim 1, wherein the concave portion is linear, and the length of the concave portion in the longitudinal direction is at least twice the width in the width direction perpendicular to the longitudinal direction. The electronic component mounting apparatus according to claim 6 or 7,
An electronic component mounting apparatus, wherein another holding portion having a groove shape is formed on the holding surface of the columnar portion. The electronic component mounting apparatus according to claim 5,
The electronic component mounting apparatus, wherein the concave portion has a shape in which a plurality of grooves intersect on the central axis of the columnar portion. An electronic component mounting apparatus according to any one of claims 5 to 9,
The electronic component mounting apparatus, wherein the concave portion is provided in the columnar portion and communicates with a suction path used for sucking and sucking the electronic component. The electronic component mounting apparatus according to claim 10,
An electronic component mounting apparatus, wherein a suction port of the suction path is formed in a bottom surface of the recess. An electronic component mounting method for mounting an electronic component on a circuit board,
a) holding the electronic component with a holding tool;
b) pressing against the circuit board while applying ultrasonic vibration to the electronic component via the holding tool;
With
The holding tool includes a substantially columnar columnar portion whose tip surface is a holding surface that holds the electronic component by suction, and a plurality of recesses are formed inside the outer peripheral edge of the holding surface of the columnar portion. An electronic component mounting method characterized by the above. An electronic component mounting method for mounting an electronic component on a circuit board,
a) holding the electronic component with a holding tool;
b) pressing against the circuit board while applying ultrasonic vibration to the electronic component via the holding tool;
With
The holding tool includes a substantially columnar columnar portion whose front end surface is a holding surface for sucking and holding the electronic component, and a recess having a noncircular opening inside the outer peripheral edge of the holding surface of the columnar portion. An electronic component mounting method characterized by being formed. A holding tool for sucking and holding electronic components in an electronic component mounting apparatus for mounting electronic components on a circuit board,
The tool body,
A substantially columnar columnar portion protruding from the tool body and having a tip surface as a holding surface for sucking and holding electronic components;
With
A holding tool, wherein a plurality of recesses are formed inside an outer peripheral edge of the holding surface of the columnar part. A holding tool for sucking and holding electronic components in an electronic component mounting apparatus for mounting electronic components on a circuit board,
The tool body,
A substantially columnar columnar portion protruding from the tool body and having a tip surface as a holding surface for sucking and holding electronic components;
With
A holding tool, wherein a recess having a non-circular opening is formed inside an outer peripheral edge of the holding surface of the columnar part.

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