JP2006100800A - Pickup device and packaging apparatus for chip parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pickup device which prevents a chip taken out by an absorption nozzle from shifting with respect to this absorption nozzle. <P>SOLUTION: The pickup device for the chip takes out a chip 4 by absorbing a surface on which a bump 27. There is provided a absorption nozzle 16 in which a suction hole 25 is formed so as to be opened to an end surface. When the absorption nozzle 16 absorbs the surface of the chip 4 on which the bump 27 is formed, a recess 26 engaging with the bump 27 is formed at least on an inside surface of a tip of the suction hole 25. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pickup device that picks up and extracts a chip component such as a chip made of a semiconductor and a mounting device that mounts the chip component taken out by the pickup device on a substrate.

  As a mounting device for mounting a chip component such as a semiconductor chip on a substrate such as a carrier tape or a lead frame, a flip-chip mounting device for mounting from the upper surface of the substrate with the bump formed on the chip component facing downward is used. Are known.

  The flip-chip type mounting apparatus has a component supply unit. In this component supply unit, a semiconductor wafer divided into a large number of chips is attached to a wafer sheet and held on a wafer stage. A plurality of bumps are formed on the upper surface of each chip.

  A push-up pin is provided on the lower surface side of the wafer stage, and a chip at a predetermined position is pushed up by the push-up pin. The chip pushed up by the push-up pin is sucked and taken out by a suction nozzle in which a suction hole of the pickup device is formed.

  The suction nozzle is provided such that the vertical direction can be reversed. Then, after sucking the chip, the suction nozzle is inverted 180 degrees so that the suction surface is directed upward from below, and then is driven to a delivery position where the chip is delivered to the mounting tool and waits.

  The mounting tool is driven to the delivery position where the suction nozzle stands by. The mounting tool receives the chip from the suction nozzle, returns to the mounting position, and is driven in the downward direction to mount the chip on the substrate.

  Recently, with the miniaturization of various digital devices, the miniaturization of chips has progressed, and the smaller ones have been miniaturized to about 0.5 mm square. Therefore, the diameter of the suction nozzle that picks up and picks up the chip has also been reduced.

  When the suction nozzle takes out the chip from the wafer stage, the suction nozzle sucks the surface on which the bumps of the chip are formed. When the chip is miniaturized, it is difficult to reliably secure a flat surface on which the tip surface of the suction nozzle comes into contact with the surface on which the bumps sucked by the suction nozzle of the chip are formed.

  For this reason, the suction nozzle forcibly sucks the chip out of the wafer stage and moves it to the delivery position and delivers it to the mounting tool in a state where the tip surface is in contact with the bump.

  In the state where the tip surface hits the bump and the suction nozzle sucks the chip, there is a gap between the tip surface of the suction nozzle and the top surface of the chip, and the suction force of the suction nozzle does not act reliably on the chip. There is. In addition, since the ridge line formed between the tip surface of the suction nozzle and the inner peripheral edge of the suction hole is in a point contact state with respect to the bump, the chip holding state becomes unstable.

  As a result, the tip rotates at the tip of the suction nozzle, resulting in a positional shift that prevents the tip from being transferred from the suction nozzle to the mounting tool. In some cases, it becomes impossible to precisely position and mount the substrate.

  The present invention relates to a pickup device capable of preventing the chip component from rotating due to the tip surface of the suction nozzle and shifting its position when the chip component is sucked by the suction nozzle, and a mounting device using the pickup device. Is to provide.

This invention is a chip component pickup device for picking up a chip component by adsorbing a surface on which a bump is formed,
There is a suction nozzle formed by opening a suction hole on the tip surface, and the tip of the suction nozzle is attached to the bump when the suction nozzle sucks the surface on which the bump of the chip component is formed. In the pickup device, an engaging portion to be engaged is formed.

  It is preferable that the engaging portion is a concave portion formed on the inner peripheral surface of the suction hole.

  It is preferable that the concave portions are alternately formed with the convex portions on the inner peripheral surface of the suction hole over the entire length in the circumferential direction.

  It is preferable that the engaging portion is a concave portion formed on the outer peripheral surface of the tip portion of the suction nozzle.

  It is preferable that the concave portions are alternately formed with the convex portions over the entire length in the circumferential direction on the outer peripheral surface of the tip portion of the suction nozzle.

  The engaging portion is preferably formed corresponding to the number and position of bumps provided on the chip component.

The present invention is a mounting apparatus for mounting a chip component on a substrate,
A pickup device for adsorbing the chip component provided in the component supply unit;
A mounting tool for receiving a chip component adsorbed by the pickup device and mounting the chip component on the substrate;
The pickup device has a suction nozzle formed with a suction hole opened on a tip surface, and when the suction nozzle sucks a surface on which a bump of the chip component is formed on the tip of the suction nozzle In the mounting apparatus, a recess is formed to engage with the bump.

  According to the present invention, when the surface on which the bump of the chip component is formed is sucked by the suction nozzle, the chip component bump is engaged with the recess formed at the tip of the suction nozzle. It is possible to prevent the position from being shifted due to rotation on the front end surface.

Embodiments of the present invention will be described below with reference to the drawings.
1 and 2 show a first embodiment of the present invention. FIG. 1 is a schematic configuration diagram of a flip-chip type mounting apparatus, which includes a transport apparatus 2 that transports a substrate 1 such as a lead frame along a predetermined direction. The transport device 2 has a pair of guide rails 3 arranged in parallel at a predetermined interval, and the substrate 1 is intermittently pitched along the guide rails 3. Each time the substrate 1 is pitch-fed, it is positioned and held on the guide rail 3 by a clamper (not shown).

  When the substrate 1 is transported to a mounting position by the transport device 2, a chip 4 which is a chip component supplied from a component supply unit 11 described later is mounted at the mounting position. At this mounting position, a stage tool 5 that supports the lower surface of the substrate 1 is provided so as to be driven by the first drive mechanism 6 in the horizontal X and Y directions and the vertical Z direction.

  A mounting tool 7 for mounting the chip 4 on the upper surface of the substrate 1 is provided above the stage tool 5 so as to be driven in the X, Y, and Z directions by the second driving mechanism 8.

  The component supply unit 11 has a wafer stage 12 driven in the X and Y directions by a drive source (not shown). On the wafer stage 12, a semiconductor wafer 13 divided into a large number of chips 4 is held on a wafer sheet 14. The chip 4 is formed with a plurality of bumps 27 (shown in FIG. 2A) electrically connected to leads (not shown) formed on the substrate 1 on one surface thereof. It is held on the wafer sheet 14 with its surface facing up.

  Of the chips 4 held on the wafer sheet 14, the chip 4 at a predetermined position is pushed up by a push-up pin (not shown). The chip 4 pushed up by the push-up pin is sucked by the suction nozzle 16 constituting the pickup device 15. The suction nozzle 16 is attached to a rotary head 18 provided in the reversing unit 17. The rotary head 18 is driven to rotate. Accordingly, the suction nozzle 16 is positioned at a position where the suction surface 16a faces downward and a position where the suction face 16a turns 180 degrees from the position and faces upward.

  The reversing unit 17 is driven along the guide rod 19. The guide rod 19 is installed horizontally from the wafer stage 12 toward the mounting position of the transfer device 2. As a result, the suction nozzle 16 that sucks the chips 4 from the wafer sheet 14 is driven and positioned to the side of the transfer device 2 with the suction surface 16a that sucks the chips 4 upward as shown by the chain line in FIG. The This position is the delivery position.

  When the suction nozzle 16 is positioned at the delivery position, the mounting tool 7 is driven as indicated by a chain line in the drawing to receive the chip 4 sucked on the suction surface 16a of the suction nozzle 16. Next, the mounting tool 7 is positioned at a mounting position above the substrate 1 as indicated by a solid line.

  At the same time, the stage tool 5 is driven in the upward direction to support the lower surface of the substrate 1. When the mounting tool 7 is driven in the downward direction, the chip 4 held by the mounting tool 7 is mounted on the portion of the substrate 1 supported by the stage tool 5.

  The stage tool 5 and the mounting tool 7 are each provided with a heater (not shown). Accordingly, the chip 4 or the portion of the substrate 1 where the chip 4 is mounted is heated, and the chip 4 is thermocompression bonded to the substrate 1.

  A first camera 21 that images the substrate 1 and recognizes the mounting position of the chip 4 is disposed above the mounting position where the chip 4 is mounted on the substrate 1. A second camera 22 for recognizing the position of the chip 4 held by the suction nozzle 16 is disposed above the delivery position where the mounting tool 7 receives the chip 4 from the suction nozzle 16. A third camera 23 for recognizing the position of the chip 4 held by the mounting tool 7 is disposed below the position where the mounting tool 7 that has received the chip 4 passes.

  The imaging signals of the first to third cameras 21 to 23 are input to an image processing unit provided in a control device (not shown). Then, the control device positions the mounting tool 7 with respect to the substrate 1 based on the coordinate signal of the chip 4 and the substrate processed by the image processing unit, and precisely positions and mounts the chip 4 on the substrate 1. It is supposed to let you.

  As shown in FIGS. 2A to 2C, the suction nozzle 16 is formed with a suction hole 25 penetrating in the axial direction. That is, the suction nozzle 16 is cylindrical. The front end of the suction hole 25 opens at the front end surface of the suction nozzle 16, and the rear end is connected to a vacuum pump (both not shown) through a suction tube. As a result, a suction force is generated in the suction hole 25.

  On the inner peripheral surface of the tip of the suction hole 25, a plurality of rectangular recesses 26, in this embodiment, three recesses 26 are opened at 120 ° intervals in the circumferential direction and open to the lower end surface of the suction nozzle 16. Is formed. The number of the recesses 26 and the interval in the circumferential direction are determined by the number and arrangement state of the bumps 27 provided on the surface of the chip 4 taken out from the wafer stage 12 that is sucked by the suction nozzle 16. In this embodiment, the recesses 26 are formed at intervals of 120 degrees in the circumferential direction.

  Therefore, when the suction nozzle 16 is attached to the rotary head 18, the rotational position of the three recesses 26 formed on the inner peripheral surface of the suction hole 25 is matched with the chip 4 held on the wafer stage 12. When the chip 4 is sucked and taken out from the wafer stage 12, the bumps 27 are engaged with the respective recesses 26 as shown in FIG.

  Note that the number and arrangement of bumps 27 provided on the chip 4 are the same when the same product is manufactured, and are in the same direction when held on the wafer stage 12. Moreover, although the recessed part 26 may be formed over the axial direction full length of the suction hole 25, it should just be formed in the front-end | tip part at least.

  According to the mounting apparatus having such a configuration, when the chip 4 is mounted on the substrate 1, the chip 4 is first sucked from the wafer stage 12 by the suction nozzle 16 and taken out. When the suction nozzle 16 sucks the chip 4, the surface of the chip 4 on which the bumps 27 are formed is sucked.

  When the suction nozzle 16 sucks the surface of the chip 4 on which the bumps 27 are formed, most of the bumps 27 enter the suction holes 25 as shown in FIG. The outer peripheral portion corresponding to the outer side in the radial direction enters and engages with the recessed portion 26 opened at the lower end surface of the suction nozzle 16.

  As a result, a gap is formed between the surface of the chip 4 on which the bumps 27 are formed and the lower end surface of the suction nozzle 16 as indicated by g in FIG. This is smaller than the case where the recess 26 is not formed. As a result, the suction force acting on the chip 4 is increased by the amount of the gap g being reduced, and the holding state of the chip 4 is ensured. Is prevented from being displaced in the rotational direction at the lower end surface of the suction nozzle 16.

  As a result, the chip 4 rotates with respect to the suction nozzle 16 and is displaced from the time it is sucked and taken out by the suction nozzle 16 of the pickup device 15 until it is delivered to the mounting tool 7. It is prevented from dropping off from the suction nozzle 16.

  As a result, the chip 4 is surely delivered to the mounting tool 7 based on the position recognition of the second camera 22, so that the mounting tool 7 can be mounted on the substrate 1 with high positioning accuracy. Will be done.

  FIGS. 3A to 3C show second to fourth embodiments of the present invention, respectively, and show modifications of the recesses formed on the inner peripheral surface of the suction hole 25 of the suction nozzle 16. In the second embodiment of FIG. 3A, an arcuate recess 26a is used instead of the rectangular recess 26 shown in the first embodiment, and the third embodiment of FIG. In this embodiment, arc-shaped concave portions 26b and mountain-shaped convex portions 29a formed by arcs of adjacent concave portions 26b are alternately formed.

  In the fourth embodiment shown in FIG. 3C, instead of the arc-shaped concave portion 26a, the mountain-shaped concave portion 26c and the convex portion 29b are alternately formed over the entire inner peripheral surface of the suction hole 25.

  Even if the recess formed in the inner peripheral surface of the suction hole 25 has the shape shown in each embodiment of FIGS. 3A to 3C, the chip 4 is formed by the suction nozzle 16 as in the first embodiment. Can be reliably adsorbed and held without any positional deviation.

  In particular, as shown in FIGS. 3B and 3C, if the concave portions and the convex portions are alternately formed over the entire inner peripheral surface of the suction hole 25, the position where the bumps 27 engage with the concave portions on the inner peripheral surface. If there is, the chip 4 can be sucked and held by the suction nozzle 16A without any restriction on the number and position of the bumps 27 provided on the chip 4 within that range.

4A to 4C show a fifth embodiment of the present invention. In this embodiment, the tip of the suction nozzle 16A is formed in a square columnar suction part 32 having a smaller diameter than other parts via a quadrangular pyramid taper part 31. A suction hole 33 is opened in the distal end surface 32 a of the suction portion 32. Further, arc-shaped concave portions 34 are formed at the four corners of the outer peripheral surface of the suction portion 32, respectively.
As shown in FIG. 4C, bumps 27 are formed on the four corners of one surface of the chip 4A sucked by the suction nozzle 16A.

  According to such a configuration, when a suction force is generated in the suction hole 33 and the surface on which the bump 27 of the chip 4A is formed is sucked by the tip surface 32a of the suction portion 32 of the nozzle 16A, the bump 27 becomes the concave portion. 34 is engaged.

  Therefore, in the case of the fifth embodiment as well, it is possible to prevent the chip 4A sucked and held by the sucking portion 32 from rotating or being displaced, so that it can be reliably transferred to the mounting tool 7.

  FIGS. 5A to 5D show sixth to ninth embodiments showing modifications of the recesses formed on the outer peripheral surface of the suction portion 32. In the sixth embodiment shown in FIG. 5A, the arc-shaped concave portions 34a and the mountain-shaped convex portions 35a are alternately formed by the arcs of the adjacent concave portions 34a over the entire length of the outer peripheral surface of the adsorption portion 32. I made it.

In the seventh embodiment shown in FIG. 5B, the mountain-shaped concave portions 34 b and the mountain-shaped convex portions 35 b are alternately formed over the entire length of the outer peripheral surface of the suction portion 32.
The eighth embodiment shown in FIG. 5C shows the suction part 32A of the nozzle 16A when sucking the chip 4 on which the three bumps 27 are formed as in the first embodiment. The portion 32A has a cylindrical shape, and three U-shaped concave portions 34c are formed on the outer peripheral surface thereof at intervals of 120 degrees in the circumferential direction.

  The ninth embodiment shown in FIG. 5D shows an adsorption portion 32B in the case of adsorbing a chip 4A having four bumps 27 as in the fifth embodiment shown in FIG. 32B has a cylindrical shape, and four U-shaped concave portions 34c are formed on the outer peripheral surface thereof at intervals of 90 degrees in the circumferential direction.

  In any of the embodiments shown in FIGS. 5A to 5D, when the chips 4 and 4A are sucked, the bumps 27 engage with the recesses 34a, 34b, and 34c. The chips 4 and 4A sucked and held by the 32A and 32B can be surely sucked and held without any positional deviation.

  In particular, as shown in FIGS. 5A and 5B, if the concave portions 34a and 34b and the convex portions 35a and 35b are alternately formed over the entire length of the outer peripheral surface of the suction portion 32, the concave portions 34a and 34b on the outer peripheral surface are formed. Since the bumps 27 need only be located at the positions where the bumps 27 are engaged, the chips 4, 4A are positioned on the suction portions 32, 32A, 32B without being limited by the number and positions of the bumps 27 provided on the chips 4, 4A within that range. It is possible to hold by suction without causing a shift.

  In the embodiment shown in FIGS. 5C and 5D, the concave portion is U-shaped, but it may be arc-shaped or mountain-shaped instead of U-shaped.

  The present invention is not limited to the above-described embodiments. For example, the engaging portion formed on the outer peripheral surface of the tip portion of the suction nozzle is not a recess, and the cross-sectional shape of the tip portion of the suction nozzle is a polygonal shape, By engaging with the bump, the chip adsorbed on the tip of the adsorption nozzle may be prevented from being displaced.

1 is a schematic configuration diagram of a flip chip type mounting apparatus showing a first embodiment of the present invention; FIG. (A) is a perspective view which shows the front-end | tip part and chip | tip of an adsorption nozzle, (b) is sectional drawing of the state in which the adsorption nozzle adsorb | sucked the chip | tip, (c) is a top view in the state in which the adsorption nozzle adsorb | sucked the chip | tip. (A)-(c) is a figure which shows the recessed part formed in the internal peripheral surface of the suction hole of the suction nozzle of 2nd thru | or 4th Embodiment of this invention, respectively. FIG. 10 shows a fifth embodiment of the present invention, where (a) is a perspective view of the tip portion of the suction nozzle, (b) is a plan view showing the tip surface of the suction nozzle, and (c) is a chip formed by the suction nozzle indicated by a chain line. Explanatory drawing when adsorb | sucking. (A)-(d) is a figure which shows the recessed part formed in the outer peripheral surface of the front-end | tip part of the suction nozzle of 6th thru | or 9th embodiment of this invention, respectively.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 4 and 4A ... Chip | tip (chip components), 15 ... Pick-up apparatus, 16, 16A ... Adsorption nozzle, 25, 33 ... Suction hole, 26, 26a-26c, 34, 34a, 34b, 34c ... Recessed part.

Claims (7)

A chip component pick-up device that picks up the chip component by sucking the surface on which the bump is formed,
There is a suction nozzle formed by opening a suction hole on the tip surface, and the tip of the suction nozzle is attached to the bump when the suction nozzle sucks the surface on which the bump of the chip component is formed. A pickup device characterized in that an engaging portion to be engaged is formed.   The pickup device according to claim 1, wherein the engaging portion is a recess formed in an inner peripheral surface of the suction hole.   3. The pickup device according to claim 2, wherein the recesses are alternately formed with the projections on the inner peripheral surface of the suction hole over the entire length in the circumferential direction.   The pickup device according to claim 1, wherein the engaging portion is a concave portion formed on an outer peripheral surface of a tip portion of the suction nozzle.   5. The pickup device according to claim 4, wherein the concave portion is formed alternately with the convex portion over the entire length in the circumferential direction on the outer peripheral surface of the tip portion of the suction nozzle.   2. The pickup device according to claim 1, wherein the engaging portion is formed corresponding to the number and position of bumps provided on the chip component. A mounting device for mounting chip components on a substrate,
A pickup device for adsorbing the chip component provided in the component supply unit;
A mounting tool for receiving a chip component adsorbed by the pickup device and mounting the chip component on the substrate;
The pickup device has a suction nozzle formed with a suction hole opened on a tip surface, and when the suction nozzle sucks a surface on which a bump of the chip component is formed on the tip of the suction nozzle And a recess for engaging with the bump.

Images