JP2016039316A - Conveyance method of electronic component, electronic component, manufacturing method of electronic component, and manufacturing method of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a conveyance method for electronic components, capable of precisely moving, for example, compact electronic components to a predetermined place; an electronic component; a manufacturing method for electronic components; and a manufacturing method for electronic devices.SOLUTION: In a conveyance method for electronic components according to the invention of the present application, an electronic component 10 is suck and held in a state where a projecting part 16 formed to the top face of the electronic component 10 is received in a suction hole 20b of a vacuum suction device 20, and the electronic component 10 is conveyed in the state.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component transport method, an electronic component, an electronic component manufacturing method, and an electronic device manufacturing method.

  Patent Document 1 discloses a technique for conveying an IC package by an IC package transfer machine. Specifically, it is disclosed that a positioning projection provided at the center of the surface of the IC package and a depression fitted to the projection are provided in the suction jig.

JP-A-7-22789

  For example, when an electronic component is transported onto a substrate, the terminal of the electronic component and the electrode of the substrate must be brought into contact. Further, when the electronic component is transported onto a probe for measuring electrical characteristics, the terminal of the electronic component and the probe must be brought into contact with each other. In these and other cases, it is important to accurately transport the electronic component to a predetermined location. If the electronic component is transported to a location deviated from a predetermined location, there is a problem that connection failure or erroneous connection occurs.

  In the positional deviation correction method using the IC package (electronic component) transfer machine disclosed in Patent Document 1, it is necessary to provide a depression and a suction hole in the suction jig. For this reason, there is a problem that the size of the suction jig cannot be reduced and a small electronic component cannot be conveyed.

  The present invention has been made to solve the above-described problems. For example, a method for transporting an electronic component, an electronic component, and an electronic component capable of accurately moving a small electronic component to a predetermined location. An object of the present invention is to provide a manufacturing method of the above and a manufacturing method of an electronic device.

  The electronic component transport method according to the invention of the present application is characterized in that the electronic component is sucked and held in a state in which the protrusion of the electronic component is accommodated in the suction hole of the vacuum suction device, and the electronic component is transported.

  An electronic component according to the invention of the present application includes an element, a package that covers the element, and an elliptical protrusion formed on the top surface of the package in plan view.

  Another electronic component according to the invention of the present application includes an element, a package that covers the element, and a protrusion formed on an upper surface of the package, and the package has a groove that is in contact with the protrusion in plan view. Is formed.

  In the method of manufacturing an electronic component according to the invention of the present application, the protrusion is arranged so that the relative position between the protrusion extending upward of the electronic component and the terminal extending on the side surface of the electronic component is a predetermined relative position. It is characterized by forming.

  An electronic device manufacturing method according to the present invention includes a step of manufacturing an electronic component having a package, a terminal exposed outside the package, and a protrusion provided on the package, and a vacuum suction device suction A step of attracting and holding the electronic component in a state in which the protrusion is accommodated in the hole, moving the electronic component, and bringing the terminal into contact with an electrode of the substrate.

  According to the present invention, for example, the electronic component is sucked and held in a state in which the protrusion of the electronic component is accommodated in the suction hole of the vacuum suction device, so that the electronic component can be accurately moved to a predetermined location.

1 is a perspective view of an electronic component according to Embodiment 1. FIG. It is a perspective view of a vacuum suction device and an electronic component. It is a figure which shows having attracted and held the electronic component with the vacuum suction apparatus. It is a figure which showed that the terminal of the electronic component was made to contact the electrode of a board | substrate. 7 is a perspective view of an electronic component according to Embodiment 2. FIG. It is a perspective view of a vacuum suction device and an electronic component. It is a perspective view of an electronic component or the like whose position has been corrected. It is a figure which shows the modification of a taper part. It is a figure which shows another modification of a taper part. It is a perspective view of a vacuum suction device or the like in which the inner wall of the suction hole of the vacuum suction device has a tapered portion. 6 is a perspective view of an electronic component according to Embodiment 3. FIG. It is a top view of the electronic component of FIG. It is a perspective view of a vacuum suction device and an electronic component. FIG. 10 is a perspective view of an electronic component according to a fourth embodiment. FIG. 10 is a perspective view of an electronic component according to a fifth embodiment. It is a perspective view, such as an electronic component, which shows having accommodated the projection part in the suction hole. FIG. 10 is a perspective view of an electronic component or the like showing a method for transporting an electronic component according to a sixth embodiment. FIG. 12 is a plan view of an electronic component manufactured by the electronic component manufacturing method according to Embodiment 7. FIG. 15 is a plan view of another electronic component manufactured by the method for manufacturing an electronic component according to the seventh embodiment.

  An electronic component transport method, an electronic component, an electronic component manufacturing method, and an electronic device manufacturing method according to an embodiment of the present invention will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

Embodiment 1 FIG.
FIG. 1 is a perspective view of an electronic component 10 according to Embodiment 1 of the present invention. The electronic component 10 includes a package 12. The material of the package 12 is not particularly limited, and is, for example, a cured resin, ceramic, or plastic. An element is accommodated in the package 12. A terminal 14 electrically connected to the element is exposed to the outside from the side surface of the package 12. The terminal 14 is formed of, for example, a lead frame, a printed wiring board electrode, or a metal electrode. A protrusion 16 is formed on the upper surface of the package 12. The planar shape of the protrusion 16 is circular. The shapes of the upper surface 16a and the lower surface 16b of the protrusion 16 are the same. For example, the protrusion 16 cuts the upper surface of the package, uses a mold provided with a recess so that the protrusion 16 is formed when the package is formed, or attaches the protrusion 16 to the upper surface of the package by an adhesive or welding. Or can be formed by bonding. The material of the protrusion 16 when the protrusion 16 is formed by cutting or molding the package is the same as the material of the package. The material of the protrusion 16 when the protrusion is formed by adhesion or welding can be a material different from the package (for example, plastic, resin, metal, or ceramic).

  A method for transporting the electronic component 10 will be described. FIG. 2 is a perspective view of the vacuum suction device 20 and the electronic component 10. A vacuum suction device 20 is used to transport the electronic component 10. The lower surface of the vacuum suction device 20 is a flat surface 20a. A suction hole 20b is formed in the flat surface 20a. The suction hole 20b extends in the longitudinal direction of the vacuum suction device 20 and is connected to a vacuum suction source. The cross-sectional shape of the suction hole 20b is a circle having a diameter x1. The diameter x1 is equal to the diameter x2 of the protrusion 16. Therefore, the cross-sectional shape of the suction hole 20b and the planar shape of the protrusion are the same.

  FIG. 3 is a view showing that the electronic component 10 is sucked and held by the vacuum suction device 20. As shown in FIG. 3, the electronic component 10 is sucked and held in a state where the protrusion 16 of the electronic component 10 is accommodated in the suction hole 20 b of the vacuum suction device 20. At this time, the flat surface 20 a of the vacuum suction device 20 contacts the upper surface of the package 12. Further, the side surface of the protrusion 16 is in contact with the inner wall of the suction hole 20b. In this state, the electronic component 10 is conveyed. Specifically, for example, an electronic component placed on a carrier tape or a tray is transported to a printed wiring board or an electrical inspection probe. The conveyance by the vacuum suction device 20 is automatically performed. That is, the vacuum suction device 20 transports the electronic component at a predetermined position to a predetermined location such as a substrate.

  Here, a method for manufacturing the electronic device according to the first embodiment will be described. The electronic device is a board (printed wiring board) on which the electronic component 10 is mounted. First, the electronic component 10 shown in FIG. 1 having the package 12, the terminals 14 exposed to the outside of the package 12, and the protrusions 16 provided on the package 12 is manufactured. Next, the electronic component 10 is sucked and held in a state where the protrusion 16 is accommodated in the suction hole 20b of the vacuum suction device 20, and the electronic component 10 is moved. And the terminal 14 of the electronic component 10 is made to contact the electrode of a board | substrate. FIG. 4 is a diagram showing that the terminal 14 of the electronic component 10 is brought into contact with the electrode 24 of the substrate 22. Then, the terminal 14 and the electrode 24 are fixed with solder etc., and an electronic device is completed. At this time, if the protrusion 16 causes a problem in the function of the electronic device, the protrusion 16 may be removed by cutting or cutting. If there is no problem in the function of the electronic device, the protrusion 16 is left. Also good.

  According to this method for manufacturing an electronic device, since the protrusion 16 is accommodated in the suction hole 20b of the vacuum suction device 20, a predetermined relative position between the vacuum suction device 20 and the electronic component 10 can be realized. That is, the position of the terminal 14 with respect to the vacuum suction device 20 is a predetermined position. Therefore, the terminal 14 can be brought into contact with the electrode 24 of the substrate 22 without deviation.

  Thus, by accommodating the protrusion 16 in the suction hole 20b of the vacuum suction device 20, the electronic component 10 can be accurately moved to a predetermined transport destination. The transport destination of the electronic component is not limited to the substrate 22 and can be various places such as an electrical inspection probe.

  The suction hole 20 b of the vacuum suction device 20 functions as a positioning unit that accommodates the protrusion 16 and also functions as a suction unit that exerts a suction force on the electronic component 10. Therefore, the vacuum suction device can be made smaller as compared with the case where the positioning portion and the suction portion are separately formed in the vacuum suction device. Making the vacuum suction device small makes it possible to transport very small electronic components.

  The shape of the package 12 is not particularly limited as long as the upper surface can be sucked by a vacuum suction device. Therefore, for example, LGA (Land Grid Array), QFP (Quad Flat Package), or QFN (Quad Flat No lead package) can be employed. Further, a terminal may be provided on the back surface of the package. The modifications mentioned in the first embodiment can be applied as appropriate in the following embodiments.

  Since the electronic component transport method, the electronic component, the electronic component manufacturing method, and the electronic device manufacturing method according to the following embodiment have much in common with the first embodiment, the differences from the first embodiment are different. The explanation is centered.

Embodiment 2. FIG.
FIG. 5 is a perspective view of electronic component 30 according to Embodiment 2 of the present invention. The entire protrusion 32 is a tapered portion that becomes narrower toward the tip of the protrusion 32. The side surface of the protrusion 32 is an inclined surface due to the tapered portion. The area of the upper surface 32a of the protrusion 32 is smaller than the area of the lower surface 32b.

  FIG. 6 is a perspective view showing the vacuum suction device 20 and the electronic component 30 before conveyance. It is preferable that the xy coordinate at the center of the suction hole 20b matches the xy coordinate at the center of the protrusion 32. In the state before the conveyance, the xy coordinate at the center of the suction hole 20b is always constant without deviation, but the xy coordinate at the center of the protrusion 32 may deviate from a predetermined location. FIG. 6 shows that the protrusion 32 is displaced by x3 from a predetermined location (directly below the suction hole 20b).

  A method for transporting such an electronic component 30 will be described. In order to accommodate the protrusion 32 in the suction hole 20b, the vacuum suction device 20 is moved in the z negative direction. Thereby, the vacuum suction device 20 approaches the electronic component 30, and the vacuum suction device 20 contacts the taper part (projection part 32). Thereafter, as the distance between the vacuum suction device 20 and the electronic component 30 is further reduced by moving the vacuum suction device 20 in the negative z direction, the position of the electronic component 30 is corrected. Note that when the protrusion 32 is accommodated in the suction hole 20b, the vacuum suction device 20 moves only in the z negative direction and does not move in the x and y directions.

  FIG. 7 is a perspective view showing the electronic component whose position has been corrected. In FIG. 7, the x coordinates of the left end position and the right end position of the package 12 before the contact between the vacuum suction device 20 and the protrusion 32 (tapered portion) are indicated by xa and xb, respectively. The x-coordinates of the left end position and the right end position of the package 12 of the electronic component 30 whose position has been corrected are xc and xd, respectively. As a result of correcting the position of the electronic component 30, the xy coordinate at the center of the suction hole 20 b matches the xy coordinate at the center of the protrusion 32.

  Thus, the position of the electronic component 30 can be corrected to a predetermined location by bringing the vacuum suction device 20 into contact with the tapered portion and reducing the distance between the vacuum suction device 20 and the electronic component 30.

  The shape of the taper portion can be variously modified. FIG. 8 is a diagram illustrating a modified example of the tapered portion. The protrusion 40 has a tapered portion formed in a hemisphere. FIG. 9 is a diagram illustrating another modified example of the tapered portion. The protrusion 50 includes a non-tapered portion 50a and a tapered portion 50b. As described above, the above-described effect can be obtained even when the tapered portion is formed on a part rather than the entire protrusion.

  The taper portion may be provided in the vacuum suction device. FIG. 10 is a perspective view of a vacuum suction device or the like in which the inner wall of the suction hole 20c of the vacuum suction device has a tapered portion. The tapered portion formed on the inner wall of the suction hole 20c is formed so that the width becomes narrower as the distance from the electronic component 10 increases. By forming a tapered portion on the inner wall of the suction hole 20c, the position of the electronic component 10 can be corrected to a predetermined location.

Embodiment 3 FIG.
FIG. 11 is a perspective view of an electronic component 60 according to Embodiment 3 of the present invention. FIG. 12 is a plan view of the electronic component 60. A protrusion 62 is formed on the upper surface of the package 12 covering the element. The protrusion 62 is elliptical in plan view. FIG. 13 is a perspective view of the vacuum suction device 20 and the electronic component 60. The cross-sectional shape of the suction hole 20 d of the vacuum suction device 20 is the same as the planar shape of the protrusion 62.

  When the planar shape of the protrusion is circular, the electronic component may rotate around the z axis before and after attracting the electronic component. However, by making the protrusion 62 elliptical, the electronic component 60 can be prevented from rotating around the z axis. It should be noted that the same effect can be obtained even if the protrusions are formed in a polygonal shape in plan view.

Embodiment 4 FIG.
FIG. 14 is a perspective view of an electronic component 70 according to Embodiment 4 of the present invention. Cuts 72 a and 72 b are formed in the protrusion 72. By providing the cuts 72a and 72b, the surface area of the protrusion 72 can be increased as compared with the case where there is no cut. Therefore, the heat dissipation of the electronic component 70 can be improved.

Embodiment 5 FIG.
FIG. 15 is a perspective view of electronic component 80 according to Embodiment 5 of the present invention. A projecting portion 82 is connected to the package 12. The protrusion 82 is formed with cuts 82a and 82b. In the package 12, grooves 12a and 12b connected to the notches 82a and 82b are formed.

  FIG. 16 is a perspective view of an electronic component or the like showing that the protrusion 82 is accommodated in the suction hole 20d. When the electronic component 80 is transported, the flat surface 20a of the vacuum suction device 20 and the package 12 come into contact with each other. Further, the side surface of the protrusion 82 is in contact with the inner wall of the suction hole 20d. As can be seen from FIG. 16, the grooves 12 a and 12 b are formed to the outside of the contact portion between the vacuum suction device 20 and the package 12. Specifically, the grooves 12 a and 12 b extend to the side surface of the package 12.

  If the suction hole is shielded, it is expected that it will be difficult to separate the vacuum suction device from the electronic component. However, in the fifth embodiment of the present invention, an air passage is secured from the suction hole 20d to the grooves 12a and 12b via the notches 82a and 82b. Therefore, the vacuum suction device can be separated from the electronic component immediately after releasing the vacuum suction.

Embodiment 6 FIG.
FIG. 17 is a diagram showing an electronic component and a method for transporting the electronic component according to the sixth embodiment of the present invention. The protrusion 90 is not cut. The package 12 is formed with grooves 12a and 12b that are in contact with the protrusion 90 in plan view. The grooves 12 a and 12 b are formed outside the contact portion between the vacuum suction device 20 and the package 12. Specifically, the grooves 12 a and 12 b have one end in contact with the protrusion 90 and the other end reaching the side surface of the package 12.

  When the electronic component is transported, the flat surface 20a of the vacuum suction device 20 and the package 12 come into contact with each other. Further, when the electronic component is transported, there is a gap between the inner wall of the suction hole 20d and the side surface of the protrusion 90. Therefore, an air passage from the suction hole 20d to the grooves 12a and 12b via the gap is secured. Therefore, the vacuum suction device can be quickly separated from the electronic component after releasing the vacuum suction.

  Even if the inner wall of the suction hole and the side surface of the projection part are in contact with each other, an air passage can be secured if there is a gap in the “part” between them.

Embodiment 7 FIG.
FIG. 18 is a plan view of electronic component 100 manufactured by the electronic component manufacturing method according to Embodiment 7 of the present invention. The terminal 14 includes first terminals 14a, 14b, 14c, and 14d that extend rightward or leftward of the electronic component 100, and second terminals 14e, 14f, 14g, 14h, and 14i that extend upward or downward of the electronic component 100. , 14j, 14k, 14l. A protrusion 104 is formed on the upper surface of the package 102. The protrusion 104 is formed at the intersection of the center line (CL1) of the first terminal and the center line (CL2) of the second terminal. The center line (CL1) of the first terminal is a line connecting an intermediate position between the first terminal 14a and the first terminal 14b and an intermediate position between the first terminal 14c and the first terminal 14d. The center line (CL2) of the second terminal is a line connecting the center positions of the second terminals 14e, 14f, 14g, 14h and the center positions of the second terminals 14i, 14j, 14k, 14l.

  FIG. 19 is a plan view of an electronic component manufactured with the same design as the electronic component of FIG. The protrusion 108 is formed at the intersection of the center line (CL1) of the first terminal and the center line (CL2) of the second terminal. In FIG. 19, the outline of the package 102 of FIG. 18 is indicated by a broken line. As can be seen from the broken line, the package 106 in FIG. 19 is shifted to the upper right from the package 102 in FIG. This deviation is caused by a manufacturing error.

  The electronic component of FIG. 18 and the electronic component of FIG. 19 are different in the relative positions of the package and the terminals (first terminal and second terminal). When the protrusion is formed at a predetermined location (for example, the center) of the package, the variation in the relative position between the package and the terminal becomes the variation in the relative position between the protrusion and the terminal. If the relative position of the protrusion and the terminal varies, the terminal cannot be reliably brought into contact with the desired position.

  However, according to the method for manufacturing an electronic component according to the seventh embodiment of the present invention, as described above, the protrusions are arranged with reference to the position of the terminal. Therefore, the relative position between the protrusion and the terminal is always uniform, and the terminal (electronic component) can be accurately moved to a predetermined location.

  In the method for manufacturing an electronic component according to the seventh embodiment of the present invention, the protrusion is so formed that the relative position between the protrusion extending upward of the electronic component and the terminal extending on the side surface of the electronic component is a predetermined relative position. The part is formed. Various modifications are possible as long as this characteristic is not lost. Note that the features of the embodiments described so far may be combined as appropriate.

  10 electronic components, 12 packages, 12a, 12b grooves, 14 terminals, 16 protrusions, 20 vacuum suction devices, 20a flat surfaces, 20b, 20c, 20d suction holes, 22 substrates, 24 electrodes, 30 electronic components, 32, 40, 50 protrusions, 60 electronic parts, 62 protrusions, 70 electronic parts, 72 protrusions, 72a, 72b notches, 80 electronic parts, 82 protrusions, 82a, 82b notches, 90 protrusions, 100 electronic parts

Claims (13)

  An electronic component transport method for transporting the electronic component by sucking and holding the electronic component in a state where the projection of the electronic component is accommodated in a suction hole of a vacuum suction device. The protrusion has a tapered portion whose width becomes narrower toward the tip of the protrusion,
When accommodating the protrusion in the suction hole, the vacuum suction device comes into contact with the tapered portion, and the position of the electronic component is corrected as the distance between the vacuum suction device and the electronic component decreases. The method of conveying an electronic component according to claim 1, wherein The protrusion is oval or polygonal in plan view,
The method for transporting an electronic component according to claim 1, wherein a cross-sectional shape of the suction hole is the same as a planar shape of the protrusion.   The method for transporting an electronic component according to claim 1, wherein a notch is formed in the protruding portion. The electronic component has a package to which the protrusion is connected,
The package is formed with a groove leading to the notch,
At the time of transporting the electronic component, the vacuum suction device and the package are in contact with each other,
5. The electronic component transport method according to claim 4, wherein the groove is formed to the outside of a contact portion between the vacuum suction device and the package.   The method for transporting an electronic component according to claim 1, wherein a side surface of the protruding portion is in contact with an inner wall of the suction hole. The electronic component has a package to which the protrusion is connected,
The package is formed with a groove in contact with the protrusion in a plan view.
At the time of transporting the electronic component, the vacuum suction device and the package are in contact with each other,
At the time of transporting the electronic component, there is a gap in a part between the inner wall of the suction hole and the side surface of the protrusion,
The said groove | channel was formed to the outer side rather than the contact part of the said vacuum suction apparatus and the said package, The conveyance method of the electronic component of any one of Claims 1-3 characterized by the above-mentioned. Elements,
A package covering the element;
An electronic component comprising: an oval protrusion formed on an upper surface of the package in plan view. Elements,
A package covering the element;
A protrusion formed on the upper surface of the package,
An electronic component, wherein the package is formed with a groove in contact with the protrusion in a plan view.   The electronic component according to claim 9, wherein the protrusion is formed with a notch connected to the groove.   A method of manufacturing an electronic component, wherein the protrusion is formed so that a relative position between a protrusion extending above the electronic component and a terminal extending on a side surface of the electronic component is a predetermined relative position. . The terminal is
A first terminal extending in a right direction or a left direction of the electronic component;
A second terminal extending upward or downward of the electronic component, and
12. The method of manufacturing an electronic component according to claim 11, wherein the protrusion is formed at an intersection of a center line of the first terminal and a center line of the second terminal. Manufacturing an electronic component having a package, a terminal exposed outside the package, and a protrusion provided on the package;
A step of sucking and holding the electronic component in a state where the protrusion is accommodated in a suction hole of a vacuum suction device, moving the electronic component, and bringing the terminal into contact with an electrode of a substrate. A method for manufacturing an electronic device.

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