JP3508649B2 - Electronic component holding jig, holding method, and electronic component manufacturing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holding jig for holding an electronic component when manufacturing the electronic component such as a semiconductor integrated circuit, a holding method, and a method for manufacturing the electronic component by the holding jig.

[0002]

2. Description of the Related Art Generally, a method of handling an electronic component or its constituents in a manufacturing process of an electronic component includes a method of treating a plurality of components in an integrated manner and a method of treating each component in a separated state. There is. When manufacturing electronic components by the latter method, conventionally, in order to collectively handle individual components, a holding jig as shown in FIG. 7 for holding electronic components and their components has been used. In FIG. 7, 11 is a metal tray, and a cavity 12 for arranging a plurality of parts is formed in advance by press molding or the like. When wire-bonding a semiconductor chip or the like using such a holding jig, a substrate is placed on the tray 11, the semiconductor chip is die-bonded on each substrate, and further wire-bonded. Since it is necessary to fix the substrate 3 to the tray 11 in the process, holes 14 provided on the upper surface of the tray 11 corresponding to the arrangement position of the substrate.
Further, the pressing jig 13 having the pressing claws 15 for fixing the individual substrates is covered.

[0003]

However, when the substrate is placed in the concave-shaped cavity formed in the tray, there is a clearance between the cavity and the substrate in consideration of easiness of loading and unloading the substrate and dimensional intersection. Will be needed. Therefore, the position of the substrate inside the cavity varies, and the substrate is displaced when the tray is moved between the processes, so that the coordinate position of the substrate inside the cavity is different for each process. As a result, a position recognition error is likely to occur during automation in each process, and a new process for error correction or the like is required.

Further, when the substrate is pressed by the pressing claw 15 as shown in FIG. 7, a pressing margin is required on the substrate. Therefore, an extra space for the pressing amount is required, which makes it difficult to downsize the electronic component.
In particular, if the pressing claw is downsized more than necessary, the substrate cannot be pressed securely, so that the smaller the substrate size, the higher the area ratio of the pressing allowance to the substrate size and the smaller size is hindered.

Further, since the above-mentioned cavities are determined by the size of the board and the layout pattern of a plurality of boards, a dedicated tray is required for one type of electronic component, which lacks versatility. Therefore, costs such as processing cost, material cost, and mold cost for making the tray become very high.

[0006] Therefore, the applicant of the present invention is Japanese Patent Publication No. 7-9324.
No. 7 has filed an application for a jig for holding small parts and a method for holding the jig, which can solve the above-mentioned various problems.

The holding jig is made of a rubber elastic material having an adhesive property at least on its surface, and holds small parts in close contact with the surface thereof.

According to such a holding jig and holding method, excellent effects such as position fixing ability of parts, versatility, and miniaturization can be achieved.

However, as a characteristic of a general rubber material,
Since it has a very high volume resistivity and exhibits an insulating property, it has a property that static electricity is easily generated and static electricity is easily charged in the process of attaching / detaching an electronic component or its components, conveying and manufacturing processes. Therefore, the following problems are a concern.

If it is applied as it is to an electronic component having a low electrostatic breakdown voltage, the electronic component may be electrostatically destroyed during manufacturing.

When a small, thin, and lightweight electronic component or its component parts are handled, if electrostatic attraction force or repulsive force is generated, holding failure is likely to occur, and damage or loss of the electronic component and damage of the holding jig are caused. May be caused.

Even when applied to an electronic component not corresponding to the above or the above, unless static electricity is removed before or during use of the holding jig, the electronic component may be damaged by static electricity. Therefore, it is necessary to provide a dedicated facility for removing static electricity.

An object of the present invention is to solve the above-mentioned problems, to improve productivity and reliability of electronic parts, and to reduce manufacturing cost, an electronic part holding jig, a holding method, and an electronic part. It is to provide a manufacturing method of.

[0014]

According to the present invention, at least a surface portion is provided with an elastic material having adhesiveness and conductivity, and an electronic component or a component of the electronic component is held by the adhesive force of the surface of the elastic material. This prevents static electricity from being generated by the elastic material and quickly discharges static electricity from others, so that high voltage is not applied to the electronic component or its constituents or electricity is not applied during discharge.

According to the present invention, a conductive material is added to the elastic material so that the surface of the elastic material has conductivity. As a result, the elastic material as a whole has a certain conductivity, and electrical continuity with the elastic material is ensured even in the case of an extremely minute chip-shaped component.

Further, according to the present invention, the surface of the elastic material is provided with wiring made of a conductive material so that the surface portion of the elastic material has conductivity. This facilitates imparting conductivity to the surface of the elastic material.

Further, according to the present invention, a wiring made of a conductive material exposed on the surface of the elastic material is provided inside the elastic material so that the surface portion of the elastic material has conductivity. Thereby, the conductivity is further increased and the current path length is shortened.

Further, according to the present invention, at least the surface portion of the holding jig having an elastic material exhibiting adhesiveness and conductivity,
While the substrate is held by the adhesive force of the surface, the element is mounted on the substrate and electrically connected. As a result, the element is mounted on the substrate without electrostatic breakdown.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION A holding jig for an electronic component according to a first embodiment will be described with reference to FIG. FIG. 1 is a perspective view of a holding jig that holds an electronic component to be manufactured or its component parts. In FIG. 1, 1 is a hard metal plate and 2 is an elastic material laminated on the upper surface of the plate 1. This elastic material preferably has a rubber hardness of 30 degrees or more in the type A durometer hardness test specified in JIS K 6253 "Vulcanized Rubber Hardness Test Method". It should be noted that, depending on the thickness of the elastic material 2, it is influenced by the plate 1 as the base, but the substantial rubber hardness is set to 30 degrees or more. For example, a highly heat resistant rubber containing a silicone resin as a main material is used.

In FIG. 1, the elastic material 2 is made to have conductivity as a whole by adding and dispersing conductive particles such as carbon powder to a silicon-based resin as a main material.

When a rubber material having a low elastic modulus, such as silicone rubber, is used as the elastic material 2, the impact resilience becomes low and at the same time viscosity is provided. This viscosity causes the substrate 3 to adhere to the surface of the elastic material. For example, in the case of soft silicone rubber,
The adhesive strength is about 1 to 10 g / mm ² . Since this adhesive force changes depending on the particle size and dispersion concentration of the conductive particles, the manufacturing conditions of the elastic material are determined so that the adhesive force and the electric conductivity fall within the respective predetermined ranges.

By making the elastic material conductive in this way, the electronic parts and the components thereof held on the surface of the elastic material are not electrostatically destroyed, and adsorption or repulsion due to static electricity occurs. No need for a process or equipment for removing static electricity.

Next, the structure of the holding jig according to the second embodiment will be described with reference to FIG. In FIG. 2, 1 is a hard metal plate, and 2 is an elastic material laminated on the upper surface of the plate 1. A pattern of the conductor film 9 is formed on the surface of the elastic material 2, and the end portion of the pattern is formed by the plate 1.
It is conducted to. The conductor film 9 is patterned so that each of the parts is in electrical contact with a part of the conductor film while a plurality of electronic parts or their components are held on the elastic material surface. . In this example, the grid pattern is formed so that the vertical and horizontal pitches are narrower than the width of the component to be held. Such a pattern is not limited to a grid pattern, for example, a concentric pattern and a radial pattern may be combined,
It is optional. However, the sheet resistance is reduced by arranging a plurality of energization paths from the periphery (end surface) of the elastic material 2 to the outside such as the plate 1, and even if a part of the wiring is broken, another path It is desirable to have a pattern in which continuity is secured by the above.

The conductor film is formed by printing a resin material (conductive paste) to which a conductive material is added, forming a film by plating, forming a film by a dry process such as vacuum deposition or sputtering, and It is formed by a method of sticking a metal wire or a metal foil.

Next, the structure of the holding jig according to the third embodiment will be described with reference to FIG. In FIG. 3, reference numeral 1 is a hard metal plate, and 2 is an elastic material laminated on the upper surface of the plate 1. In this example, the conductor 1 is placed inside the elastic member 2.
0 wiring is provided so that the upper portion is exposed on the surface of the elastic material 2 and the lower portion is electrically connected to the plate 1. The wiring by the conductor 10 is arranged by a method of simultaneously molding the elastic material 2 or a method of embedding the conductor 10 after molding the elastic material 2.

Next, a method for holding electronic components and a method for manufacturing electronic components will be described with reference to FIGS. 4 is a perspective view showing the structure of a holding jig for holding the substrate.
Shows a procedure for manufacturing an electronic component in which an element is mounted on a substrate by die bonding and wire bonding.

In FIG. 4, 1 is a hard metal plate and 2 is an elastic material laminated on the upper surface of the plate 1. This elastic material has conductivity due to the structure shown in the second embodiment. As will be described later, in the substrate mounting process,
On the surface of the elastic material 2, a plurality of substrates 3 each of which is a component of an electronic component are arranged. As the substrate 3, for example, an arbitrary substrate such as a glass epoxy resin substrate, a ceramic substrate such as alumina, or a laminate thereof can be used. Further, an arbitrary electronic component such as a passive element may be mounted in advance at a predetermined position on the substrate 3.

As shown in FIG. 5A, in the substrate mounting step, a plurality of substrates 3 are arranged at predetermined positions on the surface of the elastic material 2 using a mounter. This mounter is a general-purpose machine having a function of adsorbing a work such as a substrate at a predetermined position, moving it, rotating it as needed, and placing it at a predetermined position. Reference numeral 5 in the drawing denotes a vacuum suction nozzle of the mounter. That is, the mounter repeatedly vacuum-adsorbs substrates one by one from a cartridge containing a plurality of substrates and places the substrates on a predetermined position of the elastic material 2.
Thereby, as shown in FIG. 4, a plurality of substrates 3 are arranged on the surface of the elastic material 2. Since the surface of the elastic material 2 has adhesiveness, a plurality of substrates can be fixedly arranged only by the mounter sequentially mounting the substrates on the surface of the elastic material 2.

In the subsequent die bonding step, as shown in FIG. 5B, the element 4 such as a semiconductor chip is die bonded onto the substrate 3. Reference numeral 17 in the drawing denotes a mounter nozzle for picking up the element 4 from a predetermined position and mounting it on the substrate. In this die-bonding process, the device 4 is mounted on the substrate 3
And a heating step for curing the adhesive that adheres to the predetermined position.

In the subsequent wire bonding step, as shown in (c), the bonding pad exposed on the upper surface of the element 4 and the electrode formed on the substrate 3 are connected by the bonding wire 5. Reference numeral 18 in the drawing denotes a capillary of the wire bonder.

The element 4 is, for example, a semiconductor element, a piezoelectric element,
It is a dielectric element, a glass element, or the like, and can be applied to any element as long as it is an element that is mounted on a substrate and electrically connected.

Further, as the wire bonding method, various wire bonding methods such as a ball bonding method and a wedge bonding method can be applied. These wire bonding processes include a process of applying ultrasonic waves to the wire joints.

FIG. 6 shows a procedure of a method of manufacturing an electronic component in which an element is mounted on a substrate by bump connection. First, in the substrate mounting step, as shown in FIG. 6A, a plurality of substrates 3 are arranged at predetermined positions on the surface of the elastic material 2 using a mounter. Reference numeral 4 in the figure denotes a vacuum suction nozzle of the mounter.

Then, as shown in FIG.
The element 4 provided with is bump-bonded to a predetermined position on the substrate 3. That is, flip chip bonding is performed. Reference numeral 19 in the drawing is a collet for positioning the element 4 and applying ultrasonic waves.

The types of bump electrodes are Au bumps,
Any one such as a solder bump or a resin bump can be used.

In addition to die bonding and wire bonding, the above manufacturing process can also be applied to a process of mounting bumps on a semiconductor chip, or a mounting process of bonding a cap to an electronic component. Further, it can be applied to various processes such as a characteristic measuring process of a semi-finished product or a finished product, an adjusting process such as trimming, and a simple storing process and a transporting process.

As described above, since the substrate 3 is held by the adhesive force of the surface of the elastic material 2, the positional variation of the substrate 3 and the movement between the processes are prevented, and the mounter is used especially in the substrate mounting process. By
The alignment property (stability of pitch interval, rotational position, etc.) is improved, and recognition errors in automation of each process are suppressed. Moreover, since the elastic material 2 has conductivity, the elastic material 2
Also, the substrate 3 is not charged by static electricity, and static electricity discharge current does not flow in the element mounted on the substrate.

Further, since a pressing margin for pressing the substrate 3 with a pressing claw or the like is not required, a useless space is eliminated and the electronic component can be easily downsized.

Further, even if the size and the layout pattern of the substrate 3 are different, since the common holding jig can be used, the manufacturing cost can be reduced.

In the embodiment, the hard plate 1 is arranged on the lower surface of the elastic member 2, but it is not always necessary to provide this plate.

[0041]

According to the first and fifth aspects of the present invention, since the static electricity is not generated by the elastic material and the static electricity from the other is promptly discharged, a high voltage is applied to the electronic component or its components. Electricity does not occur during discharge. Therefore, the productivity and the reliability of the electronic component are improved, and the manufacturing cost can be reduced.

According to the second aspect of the present invention, it is possible to secure the electrical continuity with the elastic material even for a very small chip-shaped component.

According to the third aspect of the invention, it becomes easy to impart conductivity to the surface of the elastic material.

According to the fourth aspect of the present invention, the conductivity of the elastic material is increased and the current path length is also shortened, so that the reliability against static electricity is further improved.

According to the sixth aspect of the invention, the element can be mounted on the substrate without electrostatic breakdown, and a highly reliable electronic component can be manufactured.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a holding jig used in a method for manufacturing an electronic component according to a first embodiment.

FIG. 2 is a perspective view showing a configuration of a holding jig used in a method of manufacturing an electronic component according to a second embodiment.

FIG. 3 is a perspective view showing a configuration of a holding jig used in a method of manufacturing an electronic component according to a third embodiment.

FIG. 4 is a diagram showing a method of holding electronic components.

FIG. 5 is a diagram showing a state of each step in a method of manufacturing an electronic component.

FIG. 6 is a diagram showing a state of each step in another electronic component manufacturing method.

FIG. 7 is a perspective view showing a configuration of a holding jig used in a conventional method of manufacturing an electronic component.

[Explanation of symbols]

1-plate 2- Elastic material 3-substrate 4-element 5-wire 6-bump 9-conductor film 10-conductor 11-tray 12-Cavity 13-Holding jig 14-hole 15-holding claw 16,17-nozzle 18-capillary 19-Colette

Continuation of front page (56) Reference JP-A-61-74345 (JP, A) JP-A-6-69268 (JP, A) JP-A-7-283599 (JP, A) JP-A-8-186145 (JP , A) Actual development Sho 61-100136 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 21/68

Claims (6)

(57) [Claims] 1. A holding jig which has an elastic material having adhesiveness and conductivity at least on the surface thereof and holds an electronic component or a component of the electronic component by the adhesive force of the surface of the elastic material. 2. The holding jig according to claim 1, wherein a conductive material is added to the elastic material so as to have the conductivity. 3. The holding jig according to claim 1, wherein wiring is provided on the surface of the elastic material by a conductive material so as to have the conductivity. 4. The holding jig according to claim 1, wherein wiring made of a conductive material exposed on the surface of the elastic material is provided inside the elastic material so as to have the conductivity. 5. A holding jig having an elastic material having adhesiveness and conductivity at least on its surface is used to hold an electronic component or a component of the electronic component on the surface of the elastic material by the adhesive force of the surface. How to hold the holding jig. 6. A method of manufacturing an electronic component, including a mounting step of mounting an element on a substrate and electrically connecting the element, wherein a holding jig having an elastic material at least a surface portion of which is adhesive and conductive is used, A method of manufacturing an electronic component, wherein the mounting step is performed on the surface of the elastic material while the substrate is held by the adhesive force of the surface.